CN101734849A - Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same - Google Patents
Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same Download PDFInfo
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- CN101734849A CN101734849A CN200910210611A CN200910210611A CN101734849A CN 101734849 A CN101734849 A CN 101734849A CN 200910210611 A CN200910210611 A CN 200910210611A CN 200910210611 A CN200910210611 A CN 200910210611A CN 101734849 A CN101734849 A CN 101734849A
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- substrate assembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The present invention provides a transferring unit for a cutting device used for cutting mother board for flat display panel, a cutting device with the transferring unit, and a cutting method with the cutting device. The transferring unit for cutting device according to the invention is provided with an absorbing part which vacuum absorbs a cutting object and a pressurizing part that exerts pressure to a cutting object in a direction opposite with the absorbing direction of the absorbing part. The pressurizing part exerts a pressure for a fragment part for cutting the object therefore the part to be received by the absorbing part and the fragment part are cut off from each other. As the transferring unit simultaneously performs a switching off step in receiving the part which is cut from the cutting object, the cutting-off efficiency and productivity can be increased.
Description
Technical field
The present invention relates to the shut-off device that in making panel display board, uses, more particularly, relate to be used to cut off panel display board with the shut-off device of mother substrate with delivery unit, have the shut-off device of this delivery unit and utilize the cutting-off method of this shut-off device.
Background technology
In general, the panel display board that is used for display image as display panels is that to utilize large-scale panel be mother substrate, makes polylith each time.Specifically, panel display board has mutual opposed upper substrate and lower basal plate.Upper substrate and lower basal plate form by other mother substrate (upper substrate mother substrate, lower basal plate mother substrate) respectively.Respectively be divided into a plurality of unit areas with mother substrate and lower basal plate on mother substrate in upper substrate.With forming the upper unit lattice in the constituent parts zone of mother substrate, described upper unit lattice are made of the thin film layer that is used to form upper substrate in upper substrate.With forming the lower unit lattice in the constituent parts zone of mother substrate, described lower unit lattice are made of the thin film layer that is used to form lower basal plate in lower basal plate.
The upper substrate that is formed with thin film layer respectively with the mutual opposed combination of mother substrate, makes upper substrate overlap with the unit area of mother substrate and the lower basal plate unit area with mother substrate with mother substrate and lower basal plate.Mutual opposed lower unit lattice become elementary cell lattice with the upper unit lattice, an elementary cell lattice becomes a panel display board.Two mother substrates that mutually combine are cut off by each elementary cell lattice, can make a plurality of panel display boards thus.
Therefore, make a plurality of panel display boards in order to utilize large-scale mother substrate, being used for two mother substrates of bonded is essential by the crossed process that the elementary cell lattice cut off.Crossed process has laser beam method of cutting off and the method for utilizing tracing wheel (scribe wheel) utilized.The method of utilizing tracing wheel to cut off mother substrate is to move along predetermined cut-out line after making tracing wheel contact mother substrate, forms the line that the groove by prescribed depth constitutes on the surface of mother substrate.The method of utilizing laser beam to cut off mother substrate is at the predetermined cut-out line illuminating laser beam in the upper surface edge of mother substrate, forms line.
After finishing crossed process, it is essential making the isolating disjunction operation of mother substrate along line.In general, the disjunction operation is after the disjunction bar being configured on the mother substrate upper surface that has formed line, and disjunction pole pair mother substrate is exerted pressure, and mother substrate is applied physical impact.Because of this physical impact makes crackle in the line propagation of mother substrate upper edge, thereby mother substrate is separated by the elementary cell lattice.By the substrate after the separation of elementary cell lattice is that unit substrate is sent to the outside.
Therefore, it is that fragment (cullet) part and the part that forms the elementary cell lattice are separated from each other that disjunction operation makes the part that does not form the elementary cell lattice.Because the increase gradually that will improve the utilising efficiency and the dull and stereotyped size of display panels of mother substrate exists the tendency that the interval between the adjacent elementary cell lattice narrows down gradually.Particularly in each elementary cell lattice, have and make two mother substrate bonded sealing plys of configuration up and down.Because the reduced width of the bonding composition of this sealing ply and fragment part, it is bad to produce disjunction, and fragment part and elementary cell lattice are partly cut off mutually.
The open communique of patent documentation 1 Korean Patent 2005-0029970 number
Patent documentation 2 Japanese Patents open communique spy open 2008-0003388 number
Summary of the invention
The purpose of this invention is to provide a kind of shut-off device delivery unit that can improve cutting efficiency.
In addition, the purpose of this invention is to provide a kind of shut-off device that can improve cutting efficiency.
Have again, the purpose of this invention is to provide a kind of cutting-off method that utilizes above-mentioned shut-off device.
To achieve these goals, shut-off device provided by the invention comprises main part and at least two receiving portions with delivery unit.Receiving portion is arranged on the back side of described main part, the cutting object that has formed line is separated along described line, and accept and transmit specific part from described cutting object.Each receiving portion has adsorption section and pressurization part.The upper surface of the described cutting object of adsorption section vacuum suck.Pressurization part and described adsorption section are in abutting connection with setting, when making described cutting object along the isolating disjunction operation of described line, exert pressure in the opposite direction to the absorption side with described adsorption section in the fragment zone of the described cutting object that described adsorption section is not accepted.
In addition, shut-off device provided by the invention comprises line portion and segmenting part.Line portion forms line on the surface of described mother substrate assembly, be used to cut off the mother substrate assembly, makes a plurality of unit panel that form each panel display board.Segmenting part has delivery unit, and described delivery unit cuts off the mother substrate assembly that has formed line along described line, separates and mentions the constituent parts panel and transmit by unit panel.
Specifically, described delivery unit comprises main part and at least two receiving portions.
Receiving portion is arranged on the back side of described main part, has adsorption section and pressurization part.The upper surface of the described mother substrate assembly of adsorption section vacuum suck.Pressurization part and described adsorption section are in abutting connection with setting, when making described mother substrate assembly along the isolating disjunction operation of described line, to the fragment zone of the described mother substrate assembly outside the cell zone that is positioned at the described unit panel of formation, exert pressure in the opposite direction to absorption side with described adsorption section.
In addition, cutting-off method provided by the invention comprises the steps.
At first, on the surface of described mother substrate assembly, form line, be used to cut off the mother substrate assembly, make a plurality of unit panel that form each panel display board.Secondly, the mother substrate assembly that has formed described line is cut off along described line, and accept described unit panel, and send it to the outside from described mother substrate assembly.
According to the present invention, because delivery unit when cutting object is carried out the disjunction operation, is accepted the part that preparation is accepted from cutting object, so can improve disjunction efficient and productivity.
Description of drawings
Fig. 1 is the stereographic map of expression display panels with the mother substrate assembly.
Fig. 2 is the sectional view of expression along the cut-out line I-I ' cut-out of Fig. 1.
Fig. 3 is the stereographic map of expression display panels.
Fig. 4 is the figure that schematically illustrates the substrate cut-out system of one embodiment of the present invention.
Fig. 5 is the side-view that schematically illustrates line portion shown in Figure 4.
Fig. 6 is the side-view that schematically illustrates segmenting part shown in Figure 4.
Fig. 7 is the stereographic map of expression delivery unit shown in Figure 6.
Fig. 8 is the vertical view of expression delivery unit shown in Figure 7.
Fig. 9 is the side-view of expression adsorption section shown in Figure 8 and the relation of the position between the pressurization part.
Figure 10 is that expression utilizes substrate cut-out system shown in Figure 4 to cut off the schema of the process of mother substrate assembly.
Figure 11 schematically illustrates scribing unit shown in Figure 5 carries out scratching process to the mother substrate assembly process picture sheet.
Figure 12 schematically illustrates delivery unit shown in Figure 7 the process picture sheet of elementary cell lattice from the process of mother substrate components apart.
Figure 13 schematically illustrates delivery unit shown in Figure 7 the process picture sheet of elementary cell lattice from the process of mother substrate components apart.
Figure 14 is a vertical view of having laid the mother substrate component states on the expression delivery unit shown in Figure 12.
Figure 15 is the stereographic map of the delivery unit of other embodiments of expression the present invention.
Figure 16 is the stereographic map of expression pressurization part shown in Figure 15.
Figure 17 is the sectional view of expression along the II-II ' cut-out of Figure 16.
Description of reference numerals
100 mother substrate assemblies
200 loading parts
300 line portions
400 segmenting parts
500 substrates cut off system
Embodiment
With reference to the accompanying drawings the preferred embodiment of the present invention is described in detail.Describe as the example that cuts off object with mother substrate with display panels in the present embodiment, but technological thought of the present invention being not limited thereto, also can be the object of other kinds.
Fig. 1 is the stereographic map of expression display panels with the mother substrate assembly, and Fig. 2 is that Fig. 3 is the stereographic map of expression display panels along the sectional view of the cut-out line I-I ' cut-out of Fig. 1.
See figures.1.and.2, comprise first mother substrate 110 and second mother substrate 120 as the mother substrate assembly 100 of cutting object, described first mother substrate 110 and the 120 mutual opposed combinations of second mother substrate form a plurality of elementary cell lattice UC.Each elementary cell lattice UC forms a display panels, and described a plurality of elementary cell lattice UC are configured to matrix form.Each elementary cell lattice UC can be included on described first mother substrate 110 array layer 130, the color filter layers 140 that forms that form on described second mother substrate 120, be clipped in liquid crystal layer 150 between described array layer 130 and the described color filter layers 140, make described liquid crystal layer 150 be filled in sealing ply 160 between described array layer 130 and the described color filter layers 140.Described sealing ply 160 surrounds described liquid crystal layer 150, and described first mother substrate 110 and second mother substrate 120 are mutually combined.
Described mother substrate assembly 100 cuts off by described elementary cell lattice UC, separates by described elementary cell lattice UC and the unit panel that forms from described mother substrate assembly 100, provides with the form of as shown in Figure 3 display panels DP.Wherein, it is littler than lower basal plate DP1 that described display panels DP is cut off into upper substrate DP2, thereby source electrode one side end of described lower basal plate DP1 and grid one side end are exposed on the external.Source electrode one side end at described lower basal plate DP1 connects the source driving part of exporting source signal, connects the grid driving part of output signal at grid one side end.
In the present embodiment, described display panels DP exposes grid one side end and source electrode one side end, but also can only expose source electrode one side end.
With reference to the accompanying drawings, to above-mentioned mother substrate assembly 100 is specifically described by the substrate cut-out system that each elementary cell lattice UC cuts off.
Fig. 4 is the figure that schematically illustrates the substrate cut-out system of one embodiment of the present invention, and Fig. 5 is the side-view that schematically illustrates line portion shown in Figure 4.
With reference to Fig. 1 and Fig. 4, described substrate cuts off system 500 can comprise loading part 200, line portion 300 and segmenting part 400.
The described mother substrate assembly 100 that sends from the outside is placed on the described loading part 200, again the mother substrate assembly 100 that is sent on the described loading part 200 is sent to line portion 300.
With reference to Fig. 4 and Fig. 5, described line portion 300 can comprise first supporting member 310 of laying described mother substrate assembly 100, the scribing unit 320 that forms line on described mother substrate assembly 100.
Described first supporting member 310 can comprise two first rotating rollers 311,312 spaced apart from each other be connected described first rotating roller 311,312 first be with 313.Described first rotating roller 311,312 is configured to parallel to the ground, is that benchmark rotates with the central shaft.Make first to be with 313 to rotate thus.The mother substrate assembly 100 and described first that sends from described loading part 200 is with 313 opposedly to be placed in described first and to be with on 313, and described mother substrate assembly 100 utilizes described first to move in the horizontal direction with 313 rotation.
Described scribing unit 320 is arranged on the top of described first supporting member 310.Described scribing unit 320 can comprise 321, tracing wheel 322 and the wheel shaft 323 that connects described 321 and described tracing wheel 322.Described tracing wheel 322 be contained in described 321 below, exert pressure in vertical direction to described tracing wheel 322 in described 321 limit, the edge horizontal direction is to a side shifting.Described tracing wheel 322 rotates because of described 321 move horizontally.Described tracing wheel 322 is roughly circular plate type.Described tracing wheel 322 rotates with outer circumference surface and described mother substrate assembly 100 state of contact, described mother substrate assembly 100 is etched into the degree of depth of regulation.During described tracing wheel 322 rotated, described 321 to mobile in the opposite direction with the sender of described mother substrate assembly 100.Therefore, the predetermined cut-out line of the described mother substrate assembly 100 in described tracing wheel 322 edges (not expression among the figure) moves, and etching is carried out to the surface of described mother substrate assembly 100 in the limit, forms line SL on described mother substrate assembly 100.
Described tracing wheel 322 is connected with described 321 by described wheel shaft 323, and an end of described wheel shaft 323 is inserted in the connecting hole of central part formation of described tracing wheel 322.When described tracing wheel 322 rotated, described wheel shaft 323 became the rotation axis of described tracing wheel 322.
In the present embodiment, described line portion 300 has the scribing unit 320 that utilizes 322 pairs of described mother substrate assemblies 100 of tracing wheel to rule, but also can have the scribing unit that utilizes laser beam that mother substrate assembly 100 is rule.
Fig. 6 is the side-view that schematically illustrates segmenting part shown in Figure 4.
With reference to Fig. 6, the delivery unit 420 that described segmenting part 400 can comprise second supporting member 410 of laying described mother substrate assembly 100, described mother substrate assembly 100 is cut off and accepts by each elementary cell lattice UC (with reference to Fig. 1).
Specifically, described second supporting member 410 can comprise two second rotating rollers 411,412 spaced apart from each other be connected described second rotating roller 411,412 second be with 413.Described second rotating roller 411,412 is configured to parallel to the ground, is that benchmark rotates with the central shaft.Make second to be with 413 to rotate thus.The mother substrate assembly 100 and described second that sends from described loading part 200 is with 413 opposedly to be placed in described second and to be with on 413, and described mother substrate assembly 100 utilizes described second to move in the horizontal direction with 413 rotation.
Described delivery unit 420 is arranged on the top of described second supporting member 410.Described delivery unit 420 cuts off described mother substrate assembly 100 along line SL, and accepts to be sent to the outside from described mother substrate assembly 100 isolating unit panel (display panels DP).
Structure to described delivery unit 420 is specifically described with reference to the accompanying drawings.
Fig. 7 is the stereographic map of expression delivery unit 420 shown in Figure 6, and Fig. 8 is the vertical view of expression delivery unit 420 shown in Figure 7, and Fig. 9 is the side-view of expression adsorption section shown in Figure 8 and the relation of the position between the pressurization part.
With reference to Fig. 6 and Fig. 7, described delivery unit 420 can comprise main part 421, a plurality of receiving portion 422,423,424,425 and shifting axle 426.
Specifically, 413 arranged opposite are with at the back side of described main part 421 and described second, are roughly square column type.The shape of described main part 421 is not limited thereto, and can carry out multiple variation.
First to fourth patchhole 421a, 421b, 421c, 421d are arranged at the back side of described main part 421.The described first to fourth patchhole 421a of adjacent formation, 421b, 421c, 421d respectively at four angles at described main part 421 back sides are that the central part from the described main part 421 of adjacent angle of each described main part 421 extends and forms.Therefore described each patchhole 421a, 421b, 421c, 421d are slotted hole.
In described first to fourth patchhole 421a, 421b, 421c, 421d, insert described a plurality of receiving portion 422,423,424,425 respectively.In the present embodiment, described delivery unit 420 has four receiving portions 422,423,424,425, increase or reduce but the number of described receiving portion also can and be accepted efficient according to the size of described elementary cell lattice UC (with reference to Fig. 1), described delivery unit 420 has two receiving portions on the diagonal that is configured in main part 421 mutually at least.
In addition, the number of described patchhole 421a, 421b, 421c, 421d also can increase or reduce according to the number of described receiving portion 422,423,424,425, described patchhole 421a, 421b, 421c, 421d the has number identical with described receiving portion 422,423,424,425.
Described a plurality of receiving portion 422,423,424,425 is made of first to fourth receiving portion 422,423,424,425, and described first to fourth receiving portion 422,423,424,425 and described first to fourth patchhole 421a, 421b, 421c, 421d are corresponding one by one.Each receiving portion 422,423,424,425 is inserted among corresponding patchhole 421a, 421b, 421c, the 421d.As an example of the present invention, described first receiving portion 422 is inserted the described first patchhole 421a, described second receiving portion 423 is inserted the described second patchhole 421b, described the 3rd receiving portion 424 is inserted described the 3rd patchhole 421c, and described the 4th receiving portion 425 is inserted described the 4th patchhole 421d.
Described each receiving portion 422,423,424,425 can move along patchhole 421a, the 421b of described correspondence, the length direction of 421c, 421d.Therefore, described delivery unit 420 can be adjusted the position of described first to fourth receiving portion 422,423,424,425 according to the size of described elementary cell lattice UC.
Described first to fourth receiving portion 422,423,424,425 can comprise adsorption section 422a, 423a, 424a, 425a and pressurization part 422b, 423b, 424b, 425b, and described first to fourth receiving portion 422,423,424,425 has identical structure.
In the present embodiment, adsorption section 422a, 423a, 424a, the 425a of described first to fourth receiving portion 422,423,424,425 have identical structure, and described pressurization part 422b, 423b, 424b, 425b also have identical structure.Therefore, when below the structure of described first to fourth receiving portion 422,423,424,425 being specifically described, be that example describes with the adsorption section 422a and the pressurization part 422b of described first receiving portion 422.
With reference to Fig. 7 and Fig. 8, the adsorption section 422a of first receiving portion 422 can comprise vacuum body 41 and vacuum piping 42, the inside of described vacuum body 41 forms vacuum area, when carrying out the disjunction operation, the lower surface of vacuum body 41 is contacted with the surface of described mother substrate assembly 100.Lower surface at described vacuum body 41 forms a plurality of adsorption hole 41a.As an example of the present invention, the doline of described vacuum body 41 for from top to the bottom, broadening gradually substantially.
The upper end of described vacuum body 41 is connected with described vacuum piping 42.The vacuum piping 42 of described first receiving portion 422 inserts among the described first patchhole 421a, is arranged to and can moves along the length direction of the described first patchhole 421a.Described vacuum piping 42 is connected with vacuum pump 430 by vacuum-lines VL.The part of described vacuum-lines VL is inserted the inside of described main part 421, is connected with adsorption section 422a, 423a, 424a, the 425a of each receiving portion 422,423,424,425.Therefore, each adsorption section 422a, 423a, 424a, 425a utilize described vacuum pump 430 to make inside be in vacuum state.When carrying out the disjunction operation, utilize the vacuum pressure that offers described adsorption hole 41a, the upper surface of described mother substrate assembly 100 is adsorbed on the lower surface of described vacuum body 41.
The pressurization part 422b of described first receiving portion 422 is arranged on the outside of the adsorption section 422a of described first receiving portion 422, is configured to the bight of the described main part 421 more corresponding than more close and described first receiving portion 422 of described adsorption section 422a.
The bolster 45 that described pressurization part 422b can be included in first adjacent with the upper surface of described mother substrate assembly 100 when carrying out the disjunction operation push rod 43 and second push rod 44 and insert the described first patchhole 421a.
Described first push rod 43 and second push rod 44 are tabular, are connected between the end.The connection angle θ 1 of described first push rod 43 and second push rod 44 and the rotational angle theta of described elementary cell lattice UC 2 cardinal principles identical (with reference to Fig. 8), the shape of the face that described first push rod 43 and the shape that second push rod 44 is connected to promptly contact with mother substrate assembly 100, be substantially with the identical hook-type of shape at the angle of described elementary cell lattice UC.
Described first push rod 43 is connected with described bolster 45 with second push rod 44.The bolster 45 of described first receiving portion 422 inserts the described first patchhole 421a, is arranged to and can moves along the length direction of the described first patchhole 421a.
With reference to Fig. 7 and Fig. 9, the lower end part of described first push rod 43 and second push rod 44 in than the back side of described adsorption section 422a more by under the position on.Wherein, owing to described pressurization part 422b is made by elastic material, so when carrying out the disjunction operation, described bolster 45 is crooked laterally.Therefore when carrying out the disjunction operation, though described first push rod 43 and second push rod 44 be positioned at than described mother substrate assembly 100 1 sides more by under the position, the upper surface that also can not influence described adsorption section 422a and described mother substrate assembly 100 contacts.
When carrying out the disjunction operation, described adsorption section 422a, 423a, 424a, 425a are configured in zone (the elementary cell lattice zone) UCA of the elementary cell lattice UC that formation will accept from described mother substrate assembly 100.On the other hand, described pressurization part 422b, 423b, 424b, 425b are positioned at the outside in the zone that forms described elementary cell lattice UC, just are positioned at the fragment zone.Described adsorption section 422a, 423a, 424a, 425a adsorb described mother substrate assembly 100 and mention to upside, but described pressurization part 422b, 423b, 424b, 425b push described mother substrate assembly 100 downwards at this moment.
Therefore, because described adsorption section 422a, 423a, 424a, 425a are different mutually with the direction that described pressurization part 422b, 423b, 424b, 425b act on the power on the described mother substrate assembly 100 separately, so cut off the fragment zone and the regional UCA of elementary cell lattice of described mother substrate assembly 100 easily.Therefore, the disjunction that described delivery unit 420 can prevent described mother substrate assembly 100 is bad, improves yield rate.
On the other hand, described shifting axle 426 is connected with the top of described main part 421.Described shifting axle 426 moves described main part 421, and therefore, the unit panel DP that is adsorbed on described first to fourth receiving portion 422,423,424,425 is sent to the outside.
Refer again to Fig. 6, described segmenting part 400 can also comprise broken portion 440, is used for the fragment that produces in the process of cutting off described mother substrate assembly 100 is carried out fragmentation.Described broken portion 440 is arranged on a side of described second supporting member 410.Described broken portion 440 has a plurality of transfer rollers 441 that transmit described fragment, and a plurality of broken bar 442 that is arranged on described transfer roller 441 tops.Each broken bar 442 is positioned on the corresponding position, the space that separates with two adjacent transfer rollers 441, the fragment on the described transfer roller 441 is exerted pressure carry out fragmentation.
Process to the described mother substrate assembly 100 of described substrate cut-out system's 500 cut-outs is specifically described with reference to the accompanying drawings.
Figure 10 is that expression utilizes substrate cut-out system shown in Figure 4 to cut off the schema of the process of mother substrate assembly 100.
With reference to Fig. 4 and Figure 10, at first, the mother substrate assembly 100 that has formed a plurality of elementary cell lattice UC is placed on the described loading part 200 (step S110).
Then, the mother substrate assembly 100 that is sent to described loading part 200 is sent to described line portion 300, described mother substrate assembly 100 is carried out crossed process (step S120).
Figure 11 schematically illustrates to utilize 320 pairs of mother substrate assemblies of scribing unit shown in Figure 5 100 to carry out the process picture sheet of scratching process.
Specify as follows with reference to Figure 11 to described crossed process.At first, described mother substrate assembly 100 is configured on described first supporting member 310, makes described scribing unit 320 be configured in the top of described mother substrate assembly 100.Be configured to described scribing unit 320 and described mother substrate assembly 100 adjacency this moment, and the tracing wheel 322 of described scribing unit 320 is contacted with the upper surface of described mother substrate assembly 100.
Then, the limit makes described tracing wheel 322 exert pressure to described mother substrate assembly 100 1 sides, and the predetermined cut-out line (not expression among the figure) in edge moves in the horizontal direction, the upper surface of described mother substrate assembly 100 is etched into the degree of depth of regulation.Wherein, the outer circumference surface of described tracing wheel 322 is a zig-zag.Described tracing wheel 322 rotates making under zigzag outer circumference surface and described mother substrate assembly 100 state of contact, and described mother substrate assembly 100 is etched into the degree of depth of regulation, forms line SL thus on the surface of described mother substrate assembly 100.
Refer again to Fig. 4 and Figure 10, the mother substrate assembly of finishing behind the described crossed process 100 is sent to described segmenting part 400, described segmenting part 400 is accepted constituent parts panel DP from described mother substrate assembly 100, and makes fragment and described unit panel DP disjunction (step S130).
Then, the unit panel DP that described segmenting part 400 is accepted is sent to the outside, and the fragment that produces in carrying out described disjunction operation process is carried out fragmentation (step S140).
The process that the delivery unit 420 of described segmenting part 400 is accepted unit panel DP and separated fragment from described mother substrate assembly 100 is specifically described with reference to the accompanying drawings.
Figure 12 is to schematically illustrate delivery unit shown in Figure 7 420 to separate the process picture sheet of the process of elementary cell lattice UC from mother substrate assembly 100 with Figure 13, and Figure 14 is the vertical view that has been placed the state of mother substrate assembly 100 on the expression delivery unit 420 shown in Figure 12.Figure 14 has omitted the main part 421 of described delivery unit 420 for the relation of the position between the elementary cell lattice UC of first to fourth receiving portion 422,423,424,425 of more clearly representing delivery unit 420 and described mother substrate assembly 100.
With reference to Figure 12 and Figure 13, the mother substrate assembly 100 of having finished crossed process is placed in second of described second supporting member 410 is with on 413, and described delivery unit 420 is configured in the top of described mother substrate assembly 100.
Then, first to fourth receiving portion 422,423,424,425 of described delivery unit 420 is close on the upper surface of described mother substrate assembly 100.Thus, the upper surface of described mother substrate assembly 100 is adsorbed on adsorption section 422a, 423a, 424a, the 425a of described first to fourth receiving portion 422,423,424,425, described pressurization part 422b, 423b, 424b, 425b are crooked laterally, and the upper surface of described mother substrate assembly 100 is pushed downwards.
As shown in figure 14, when carrying out the disjunction operation, adsorption section 422a, 423a, 424a, the 425a of described first to fourth receiving portion 422,423,424,425 is positioned at the elementary cell lattice zone UCA that forms described elementary cell lattice UC, described pressurization part 422b, 423b, 424b, 425b are the border with described line SL, be positioned at the outside of described elementary cell lattice zone UCA, just be arranged in fragment zone CA.
When carrying out the disjunction operation, described pressurization part 422b, 423b, 424b, 425b are arranged to the face that described mother substrate assembly 100 contacts: be configured on two contacted parts of line SL, overlook the hook-type that is identical substantially with the tie point part of described two line SL.
Described shifting axle 426 is mentioned described main part 421 to upside.Described adsorption section 422a, 423a, 424a, 425a side shifting upwards under the state that is adsorbing described mother substrate assembly 100.On the other hand, described pressurization part 422b, 423b, 424b, 425b only move at described adsorption section 422a, 423a, 424a, 425a described pressurization part 422b, 423b, 424b, 425b and described adsorption section 422a, 423a, 424a, 425a difference of altitude during, continuation is pushed the upper surface of described mother substrate assembly 100 downwards.Thus, elementary cell lattice zone UCA and fragment zone CA that described mother substrate assembly 100 is adsorbed on described adsorption section 422a, 423a, 424a, the 425a are separated from each other, and described unit panel DP is attracted on described adsorption section 422a, 423a, 424a, the 425a and is sent to the outside.
Like this, described delivery unit 420 can carry out the disjunction operation simultaneously and accept unit panel DP, can separate fragment fully with unit panel DP.Therefore it is bad to prevent that described substrate from cutting off system's 500 disjunctions, improves yield rate and production efficiency.
Figure 15 is the stereographic map of the delivery unit of other embodiments of expression the present invention, and Figure 16 is the stereographic map of expression pressurization part shown in Figure 15, and Figure 17 is the sectional view of the cut-out line II-II ' of expression Figure 16.
With reference to Figure 15 and Figure 16, delivery unit 450 can comprise main part 421, a plurality of receiving portion 451,452,453,454 and shifting axle 426.Described main part 421 and described shifting axle 426 are identical with shifting axle 426 with the main part 421 of delivery unit 450 shown in Figure 7, thus adopt identical Reference numeral, and omitted detailed description to it.
Described a plurality of receiving portion 451,452,453,454 is arranged on the back side of described main part 421, and described unit panel DP is separated and transmission from mother substrate assembly 100.In this embodiment, described delivery unit 450 has four receiving portions 451,452,453,454, but the number of described receiving portion 451,452,453,454 also can increase or reduce.Wherein, described delivery unit 450 has two receiving portions that are configured in mutually on the diagonal at least.
Described a plurality of receiving portion 451,452,453,454 is made of first to fourth receiving portion 451,452,453,454, and described first to fourth receiving portion 451,452,453,454 has adsorption section 422a, 423a, 424a, 425a and pressurization part 451a, 452a, 453a, 454a.In this embodiment, because described adsorption section 422a, 423a, 424a, 425a are identical with adsorption section 422a, 423a, 424a, 425a shown in Figure 7, thus the identical Reference numeral of employing, and omitted detailed description to it.
Each receiving portion 451,452,453,454 has adsorption section 422a, a 423a, 424a, 425a and pressurization part 451a, a 452a, 453a, 454a.In this embodiment, because described pressurization part 451a, 452a, 453a, 454a have identical structure, so be that example describes with the pressurization part 451a of described first receiving portion 451.
With reference to Figure 16 and Figure 17, the pressurization part 451a of described first receiving portion 451 comprises described first push rod 51 and second push rod 52, bolster 53 and pressurization adjustment part 54.The shape of described first push rod 51 and second push rod 52 is identical with delivery unit 420 shown in Figure 7 with the annexation of second push rod 52 and described bolster 53 with annexation and described first push rod 51, so omitted the detailed description to them.
An end of described bolster 53 is connected with described pressurization adjustment part 54, and the first patchhole 421a (with reference to Figure 15) of described main part 421 is inserted in described pressurization adjustment part 54.Described pressurization adjustment part 54 is configured to and can moves along the length direction of the described first patchhole 421a.
Described pressurization adjustment part 54 can comprise box 54a and be installed in the interior spring 54b of described box 54a.An end of described bolster 53 is inserted in the described box 54a, is connected with the end of described spring 54b.Another end of described spring 54b is fixed on the inwall of box 54a.
The lower end part of described first push rod 51 and second push rod 52 is in more leaning on the position of below than the back side of described adsorption section 422a, and when carrying out the disjunction operation, the length of described pressurization part 451a can be adjusted with described spring 54b.Therefore, even the lower end part of described first push rod 51 and second push rod 52 more leans on the position of below in the back side than described adsorption section 422a, because the length with described spring 54b can regulate described pressurization part 451a is not close together mutually so can not influence the upper surface of described adsorption section 422a and described mother substrate assembly 100 yet.This is external when carrying out the disjunction operation, and described pressurization part 451a utilizes the elastic force of described spring 54b that the upper surface of described mother substrate assembly 100 is pushed downwards.
Though more than be illustrated according to embodiment, those skilled in the art can carry out various modifications and changes to the present invention in the scope that does not break away from the technology of the present invention thought.In addition, in order more to be expressly understood the present invention, in the accompanying drawings some integral parts have been carried out the expression of exaggeration.
Claims (21)
1. shut-off device delivery unit is characterized in that comprising:
Main part;
At least two receiving portions, they are arranged on the back side of described main part, the cutting object that has formed line is separated along described line, and accept and transmit specific part from described cutting object;
Each receiving portion comprises:
The adsorption section, the upper surface of the described cutting object of vacuum suck;
Pressurization part, with described adsorption section in abutting connection with setting, when making described cutting object along the isolating disjunction operation of described line, exert pressure in the opposite direction to the absorption side with described adsorption section in the fragment zone of the described cutting object that described adsorption section is not accepted.
2. shut-off device delivery unit according to claim 1 is characterized in that at least two receiving portions are configured on the diagonal mutually in the described receiving portion.
3. shut-off device delivery unit according to claim 2, it is characterized in that, when carrying out described disjunction operation, described pressurization part and the face of described cutting object contact are configured on the parts that two line are connected, and overlook the essentially identical shape of tie point part that is with described two line.
4. shut-off device delivery unit according to claim 2 is characterized in that, the face that described pressurization part contacts with described cutting object is a hook-type.
5. shut-off device delivery unit according to claim 1 is characterized in that, the lower end part of described pressurization part in than the back side of the described adsorption section that is close together with described cutting object more by on the position of below.
6. shut-off device delivery unit according to claim 5 is characterized in that described pressurization part is made by elastic material.
7. shut-off device delivery unit according to claim 5 is characterized in that,
Described pressurization part comprises:
Push rod is exerted pressure to described cutting object when carrying out the disjunction operation;
Spring is adjusted the vertical position of described push rod; And
Bolster connects described push rod and described spring.
8. shut-off device delivery unit according to claim 1 is characterized in that also comprising shifting axle, and described shifting axle is connected the top of described main part, is used to change the vertical position and the level attitude of described main part.
9. shut-off device delivery unit is characterized in that comprising:
Main part;
At least two receiving portions, they are arranged on the back side of described main part, and the mother substrate assembly that has formed line is cut off along described line, are separated into a plurality of unit panel that form each panel display board, and mention the constituent parts panel and transmit;
Each receiving portion comprises:
The adsorption section, the upper surface of the described mother substrate assembly of vacuum suck;
Pressurization part, with described adsorption section in abutting connection with setting, when making described mother substrate assembly along the isolating disjunction operation of described line, to the fragment zone of the described mother substrate assembly outside the cell zone that is positioned at the described unit panel of formation, exert pressure in the opposite direction to absorption side with described adsorption section.
10. shut-off device delivery unit according to claim 9 is characterized in that at least two receiving portions are configured on the diagonal mutually in the described receiving portion.
11. shut-off device delivery unit according to claim 10 is characterized in that, when carrying out described disjunction operation, described pressurization part contacts the face of described mother substrate assembly and the angle in described cell zone has essentially identical shape.
12. shut-off device delivery unit according to claim 10 is characterized in that, the face that described pressurization part contacts with described mother substrate assembly is a hook-type.
13. shut-off device delivery unit according to claim 9 is characterized in that, the lower end part of described pressurization part in than the back side of the described adsorption section that is close together with described mother substrate assembly more by on the position of below.
14. shut-off device delivery unit according to claim 13 is characterized in that described pressurization part is made by elastic material.
15. shut-off device delivery unit according to claim 13 is characterized in that,
Described pressurization part comprises:
Push rod is exerted pressure to described mother substrate assembly when carrying out the disjunction operation;
Spring is adjusted the vertical position of described push rod; And
Bolster connects described push rod and described spring.
16. shut-off device delivery unit according to claim 9 is characterized in that also comprising shifting axle, described shifting axle is connected the top of described main part, is used to change the vertical position and the level attitude of described main part.
17. a shut-off device is characterized in that comprising:
Line portion forms line on the surface of described mother substrate assembly, be used to cut off the mother substrate assembly, makes a plurality of unit panel that form each panel display board; And
Segmenting part has delivery unit, and described delivery unit cuts off the mother substrate assembly that forms line along described line, separates and mentions the constituent parts panel and transmit by unit panel;
Described delivery unit comprises:
Main part;
At least two receiving portions, they are arranged on the back side of described main part;
Each receiving portion comprises:
The adsorption section, the upper surface of the described mother substrate assembly of vacuum suck;
Pressurization part, with described adsorption section in abutting connection with setting, when making described mother substrate assembly along the isolating disjunction operation of described line, to the fragment zone of the described mother substrate assembly outside the cell zone that is positioned at the described unit panel of formation, exert pressure in the opposite direction to absorption side with described adsorption section.
18. shut-off device according to claim 17 is characterized in that,
Described segmenting part also comprises:
Supporting member is used to lay described mother substrate assembly; And
Fragmentation portion is positioned at a side of described supporting member, after described mother substrate components apart, remaining fragment is carried out fragmentation in described unit panel;
Described delivery unit is arranged on the top of described supporting member.
19. a cutting-off method is characterized in that, comprises the steps:
On the surface of described mother substrate assembly, form line, be used to cut off the mother substrate assembly, make a plurality of unit panel that form each panel display board;
The mother substrate assembly that has formed described line is cut off along described line, and accept described unit panel and send it to the outside from described mother substrate assembly.
20. cutting-off method according to claim 19 is characterized in that,
Accepting described unit panel may further comprise the steps:
Vacuum suck will form the cell zone of the described mother substrate assembly of described unit panel, and fragment zone to the described mother substrate assembly that is positioned at the described cell zone outside, to exerting pressure in the opposite direction, described cell zone and described fragment zone are cut off mutually with described vacuum suck side;
Described unit panel by vacuum suck is sent to the outside.
21. cutting-off method according to claim 19 is characterized in that, a fragment that produces in the described unit panel of acceptance also comprises the process of cutting off described mother substrate assembly later on carries out a broken step.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2008-0109461 | 2008-11-05 | ||
| KR1020080109461A KR101160166B1 (en) | 2008-11-05 | 2008-11-05 | Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101734849A true CN101734849A (en) | 2010-06-16 |
| CN101734849B CN101734849B (en) | 2013-04-24 |
Family
ID=42276428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102106118A Active CN101734849B (en) | 2008-11-05 | 2009-11-03 | Transferring unit for cutting apparatus, cutting apparatus and method of cutting using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5088637B2 (en) |
| KR (1) | KR101160166B1 (en) |
| CN (1) | CN101734849B (en) |
| TW (1) | TWI388487B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934374A (en) * | 2014-03-21 | 2015-09-23 | 半导体元件工业有限责任公司 | Electronic Die Singulation Method |
| CN107009265A (en) * | 2017-03-28 | 2017-08-04 | 江苏京创先进电子科技有限公司 | Cutting machine vacuum suction disc work bench device and its course of work |
| CN110182640A (en) * | 2019-06-21 | 2019-08-30 | 赵妍 | A kind of printed matter blanking palletizing mechanical and its palletizing method |
| CN112103228A (en) * | 2019-06-17 | 2020-12-18 | 塔工程有限公司 | Substrate transfer head |
| CN112624589A (en) * | 2020-12-18 | 2021-04-09 | 安徽汉鸿文化传媒有限公司 | Cutting equipment is used in processing of computer screen panel |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101435136B1 (en) * | 2012-12-28 | 2014-09-01 | (주)모아텍 | Device for Fixing Substrate or Film |
| KR101558249B1 (en) | 2015-07-31 | 2015-10-12 | 주식회사 톱텍 | separation device of edge scrap for touch panel |
| KR102490923B1 (en) | 2017-09-28 | 2023-01-26 | 삼성디스플레이 주식회사 | Display panel and manufacturing method of the same |
| KR102500677B1 (en) * | 2017-11-24 | 2023-02-16 | 삼성디스플레이 주식회사 | Processing apparatus for display device and processing method for display device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3834099B2 (en) * | 1996-04-05 | 2006-10-18 | 中村留精密工業株式会社 | LCD glass plate cutting device |
| JP3368246B2 (en) * | 2000-02-23 | 2003-01-20 | 株式会社白井▲鉄▼工所 | LCD panel folding device |
| JP4566472B2 (en) * | 2001-07-23 | 2010-10-20 | カワサキプラントシステムズ株式会社 | Sheet glass cleaving mechanism and trimming device |
| KR100563836B1 (en) | 2003-08-30 | 2006-03-28 | 주식회사 에쎌텍 | Brittleness Material Cutting Apparatus and Its Cutting Method |
| CN1890074B (en) * | 2003-12-04 | 2011-03-30 | 三星钻石工业股份有限公司 | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
| KR100663865B1 (en) | 2005-08-31 | 2007-01-03 | 엘지전자 주식회사 | Glass scribing device for flat panel display and method thereof |
| JP5100156B2 (en) * | 2007-03-02 | 2012-12-19 | シャープ株式会社 | Method for recovering glass substrates of waste liquid crystal panels |
| KR100855876B1 (en) | 2007-04-12 | 2008-09-03 | 세메스 주식회사 | A scribing unit and an apparatus scribing a panel with the unit, and a scribing method and a method manufacturing substrates |
-
2008
- 2008-11-05 KR KR1020080109461A patent/KR101160166B1/en not_active IP Right Cessation
-
2009
- 2009-10-22 JP JP2009243365A patent/JP5088637B2/en active Active
- 2009-11-03 CN CN2009102106118A patent/CN101734849B/en active Active
- 2009-11-04 TW TW098137411A patent/TWI388487B/en active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934374A (en) * | 2014-03-21 | 2015-09-23 | 半导体元件工业有限责任公司 | Electronic Die Singulation Method |
| CN104934374B (en) * | 2014-03-21 | 2019-08-06 | 半导体元件工业有限责任公司 | Electronics tube core monomerization approach |
| CN107009265A (en) * | 2017-03-28 | 2017-08-04 | 江苏京创先进电子科技有限公司 | Cutting machine vacuum suction disc work bench device and its course of work |
| CN112103228A (en) * | 2019-06-17 | 2020-12-18 | 塔工程有限公司 | Substrate transfer head |
| CN112103228B (en) * | 2019-06-17 | 2023-12-29 | 塔工程有限公司 | Substrate transfer head |
| CN110182640A (en) * | 2019-06-21 | 2019-08-30 | 赵妍 | A kind of printed matter blanking palletizing mechanical and its palletizing method |
| CN110182640B (en) * | 2019-06-21 | 2020-08-28 | 温州海蓝工业设计有限公司 | Printed matter blanking stacking machine and stacking method thereof |
| CN112624589A (en) * | 2020-12-18 | 2021-04-09 | 安徽汉鸿文化传媒有限公司 | Cutting equipment is used in processing of computer screen panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI388487B (en) | 2013-03-11 |
| KR101160166B1 (en) | 2012-06-28 |
| JP5088637B2 (en) | 2012-12-05 |
| CN101734849B (en) | 2013-04-24 |
| TW201022117A (en) | 2010-06-16 |
| KR20100050254A (en) | 2010-05-13 |
| JP2010113351A (en) | 2010-05-20 |
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