CN105217944A - A kind of cutting splitting device - Google Patents
A kind of cutting splitting device Download PDFInfo
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- CN105217944A CN105217944A CN201510712842.4A CN201510712842A CN105217944A CN 105217944 A CN105217944 A CN 105217944A CN 201510712842 A CN201510712842 A CN 201510712842A CN 105217944 A CN105217944 A CN 105217944A
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- cutting
- glass substrate
- carrying platform
- splitting device
- sound wave
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The embodiment of the present invention provides a kind of cutting splitting device, relates to display panel processing technique field.For solve prior art glass substrate after dicing sliver time sliver efficiency and the lower problem of good article rate and inventing.Cutting splitting device of the present invention, comprises carrying platform, and the upper surface of described carrying platform is used for bearing glass substrate; Sound wave cover, described sound wave cover and described carrying platform form an enclosed space, and described glass substrate is sealed in described enclosed space by described sound wave cover; Ultrasonic generator, described ultrasonic generator is arranged in described enclosed space, and for generation of ultrasonic wave, described ultrasonic wave is split for making the cutting breach on described glass substrate.Cutting splitting device of the present invention can be used for being divided into box glass substrate.
Description
Technical field
The present invention relates to display panel processing technique field, particularly relate to a kind of cutting splitting device.
Background technology
Along with the development of technique of display, LCD (LiquidCrystalDisplay, liquid-crystal display) because of its have that volume is little, lightweight, low power consumption and other advantages and obtaining applies more and more widely, especially TFT-LCD (ThinFilmTransistor-LiquidCrystalDisplay, thin film transistor active matrix liquid-crystal display) except the advantage possessing LCD, also there is the advantage of narrow frame, thus be subject to the favor of users.But, because the frame of TFT-LCD is narrower, interconnector terminal is to the close together at edge, therefore higher to the manufacture process requirement of TFT-LCD, sliver operation especially after dicing, if produce breach damage during sliver, easy destruction terminals of connecting wire, the signal of drive unit normally cannot be inputted, thus create waste product, reduce good article rate.
In order to solve the problem, Chinese patent CN201310186373 discloses a kind of sliver apparatus, as shown in Figure 1, and the ultrasonic generator 02 that sliver apparatus comprises bearing part 01 and is positioned at above bearing part 01.Glass substrate 03 after cutting is being positioned over bearing part 01 upper surface, make after the cutting breach 031 on glass substrate 03 is positioned at below ultrasonic generator 02, open ultrasonic generator 02, and adjustment sends hyperacoustic frequency, make ultrasonic wave resonate to realize sliver with cutting breach.Because ultrasonic wave also can be applied to the different positions of cutting breach equably simultaneously, therefore the reactive force produced by resonance effect can make the glass substrate after cutting along the neat sliver of cutting breach, breach is there will not be to damage, and then damage can not be caused to terminals of connecting wire, improve good article rate.
But, in said apparatus, and in transmitting procedure, there is decay due to ultrasonic wave, therefore ultrasonic wave only can make the cutting breach 031 be positioned at below ultrasonic generator 02 split usually, and owing to glass substrate 03 having usually multiple cutting breach 031, therefore in order to make multiple cutting breach split, ultrasonic generator 02 must be moved to the top of corresponding cutting breach.This process is consuming time longer, and sliver efficiency is lower, and the different positions due to ultrasonic wave cannot be made to act on extremely longer cutting breach equably simultaneously, be therefore difficult to the regularity ensureing sliver, still there will be breach damage, good article rate is still lower.
Summary of the invention
Embodiments of the invention provide a kind of cutting splitting device, can save the sliver time, improve sliver efficiency, and can improve the good article rate of sliver after completing cutting.
For achieving the above object, The embodiment provides a kind of cutting splitting device, comprising carrying platform, the upper surface of described carrying platform is used for bearing glass substrate; Sound wave cover, described sound wave cover and described carrying platform form an enclosed space, and described glass substrate is sealed in described enclosed space by described sound wave cover; Ultrasonic generator, described ultrasonic generator is arranged in described enclosed space, and for generation of ultrasonic wave, described ultrasonic wave is split for making the cutting breach on described glass substrate.
Further, described cutting splitting device also comprises cutting unit, and described cutting unit is arranged at the top of described carrying platform and is positioned at described enclosed space, for cutting described glass substrate to form cutting breach.
Further, described hyperacoustic frequency is equal with the natural frequency of described glass substrate cutting breach.
Alternatively, described sound wave cover is convex spherical shell structure.
Alternatively, described sound wave cover inwall is provided with array of protrusions.
Further, described array of protrusions comprises multiple projection, and described projection is convex spherical, and the protrusion height of described projection is less than 1.7 centimetres.
Further, described ultrasonic generator is multiple, and multiple described ultrasonic generator is evenly arranged at described carrying platform and described sound wave cover junction one week.
Further, described ultrasonic generator is arranged at the both sides of described carrying platform, and the elevation angle of described ultrasonic generator is 30 ° ~ 40 °.
Further, the upper surface of described carrying platform is provided with vacuum absorption holes, and described vacuum absorption holes is communicated with vacuum generator.
Further, described carrying platform is provided with telescoping mechanism, and described telescoping mechanism can drive described glass substrate to move to close or away from described carrying platform direction.
Further, described telescoping mechanism comprises and is supported in a retractor device in the middle part of described glass substrate and even support in multiple retractor devices of described glass substrate edge.
Further, described telescoping mechanism stretches out the length of described carrying platform is 0.5 ~ 1.0cm.
Further, described retractor device is hydro-cylinder.
A kind of cutting splitting device that the embodiment of the present invention provides, after glass substrate after cutting is positioned on carrying platform, open ultrasonic generator, ultrasonic generator is to sending multi beam ultrasonic wave around it, multi beam ultrasonic wave is after sound wave cover inwall and carrying platform upper surface multiple reflections, each position in enclosed space can be full of, thus enable ultrasonic wave simultaneously and all cutting gap positions of stepless action on glass substrate, because ultrasonic wave can make the cutting breach on glass substrate split, therefore under hyperacoustic effect, all cutting breach on glass substrate can disposablely split, avoid the complex operations of the top in prior art, ultrasonic generator being moved to successively multiple cutting breach, thus save the sliver time, improve sliver efficiency.And no matter cut the length of breach, ultrasonic wave all simultaneously and act on each position of cutting breach equably, can ensure that the regularity after cutting breach sliver, effectively prevent breach damage, thus improve good article rate thus.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of sliver apparatus in prior art cutting splitting device;
Fig. 2 is the sectional view of embodiment of the present invention cutting splitting device;
Fig. 3 is the stereographic map of embodiment of the present invention cutting splitting device;
Fig. 4 is the structural representation of sound wave cover inwall array of protrusions in embodiment of the present invention cutting splitting device.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In describing the invention, it will be appreciated that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the present invention for convenience of description and simplified characterization; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.In describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
With reference to the specific embodiment that Fig. 2 and Fig. 3, Fig. 2 and Fig. 3 are embodiment of the present invention cutting splitting device, the cutting splitting device of the present embodiment comprises: carrying platform 1, and the upper surface of described carrying platform 1 is used for bearing glass substrate 2; Sound wave cover 3, described sound wave cover 3 forms an enclosed space 4 with described carrying platform 1, and described glass substrate 2 is sealed in described enclosed space 4 by described sound wave cover 3; Ultrasonic generator 5, described ultrasonic generator 5 is arranged in described enclosed space 4, and for generation of ultrasonic wave, described ultrasonic wave is split for making the cutting breach (not shown) on described glass substrate 2.
A kind of cutting splitting device that the embodiment of the present invention provides, after glass substrate 2 after cutting is positioned on carrying platform 1, open ultrasonic generator 5, ultrasonic generator 5 to its around send multi beam ultrasonic wave, multi beam ultrasonic wave is after sound wave cover 3 inwall and carrying platform 1 upper surface multiple reflections, each position in enclosed space 4 can be full of, thus enable ultrasonic wave simultaneously and all cutting gap positions of stepless action on glass substrate 2, because ultrasonic wave can make the cutting breach on glass substrate 2 split, therefore under hyperacoustic effect, all cutting breach on glass substrate 2 can disposablely split, avoid the complex operations of the top in prior art, ultrasonic generator 02 being moved to successively multiple cutting breach, thus save the sliver time, improve sliver efficiency.And no matter cut the length of breach, ultrasonic wave all simultaneously and act on each position of cutting breach equably, can ensure that the regularity after cutting breach sliver, effectively prevent breach damage, thus improve good article rate thus.
In the above-described embodiments, when the natural frequency that the ultrasonic frequency and the glass substrate 2 that act on cutting indentation, there cut breach is equal, ultrasonic wave can produce with cutting breach and resonate, the reactive force produced during resonance can make the glass substrate 2 after cutting along the neat sliver of cutting breach, there will not be breach to damage, and then damage can not be formed to terminals of connecting wire.And, glass substrate 2 is after dicing by after sliver, the frequency of himself deviate from resonant frequency when there is sliver significantly, therefore hyperacoustic frequency that ultrasonic generator 5 sends can not have influence on the glass substrate 2 after sliver, so the breaking part of glass substrate 2 after sliver is also uniform.Therefore, hyperacoustic frequency of sending of preferred ultrasonic generator 5 is equal with the natural frequency that glass substrate 2 cuts breach.
In order to glass-cutting substrate 2 is to form cutting breach, can manual cut be adopted, cutting machine also can be adopted to cut, do not limit at this.And, when glass substrate 2 adopts manual cut, manual cut can be carried out on sound wave cover 3 certain platform outside, to be cut complete after, then glass substrate 2 is moved on the carrying platform 1 in sound wave cover 3 and carries out sliver; Also can open sound wave cover 3, glass substrate 2 is positioned on carrying platform 1 and carry out manual cut, after having cut, then close sound wave cover 3 and carry out sliver, do not limit at this.In like manner, when glass substrate 2 adopts cutting machine to cut, cutting machine can be arranged at sound wave cover 3 outside, also cutting machine can be arranged in sound wave cover 3, not limit at this.But in order to avoid the danger of manual cut, simultaneously in order to reduce taking up room of cutting splitting device, preferred employing cutting machine being arranged in sound wave cover 3 by cutting machine cuts, cutting unit (not shown) and sliver apparatus is made to concentrate on a service platform, thus reduce taking up room of cutting splitting device, simultaneously owing to adopting cut mechanically, danger during cutting can be reduced.
Wherein, sound wave cover 3 can be cubes shell structure, can also be convex spherical shell structure as shown in Figure 2 or Figure 3.When sound wave cover 3 is cubes shell structure, owing to having corner angle in cubes shell structure, ultrasonic transmission so far will reflect in corner region behind corner angle position many times, final decay so that consumption, can not act on glass substrate 2, thus increase hyperacoustic energy consumption, reduce the hyperacoustic quantity acting on cutting indentation, there, reduce the reactive force that cutting breach is split.In order to avoid the problems referred to above, preferred sound wave cover 3 is convex spherical shell structure, because convex spherical shell inner wall smooth is continuous, without corner angle, therefore the ultrasonic energy consumed is less, the ultrasonic wave quantity acting on cutting indentation, there is more, and energy summation is comparatively large, thus increases the reactive force that cutting breach is split.
In order to improve the homogeneity that ultrasonic wave is transmitted in sound wave cover 3, the roughness of sound wave cover 3 inwall can be increased, the ultrasonic wave that ultrasonic generator 5 is sent by sound wave cover 3 reflect after cover wider, homogeneity is higher.In order to increase the roughness of sound wave cover 3 inwall, sound wave cover 3 inwall can be set to structure as shown in Figure 4, particularly, array of protrusions 31 can be set at sound wave cover 3 inwall, when ultrasonic transmission is to array of protrusions 31, the region that its reflection wave covers is wider, thus improves the homogeneity that sound wave transmits in sound wave cover 3.
In order to reduce the ultrasonic energy that array of protrusions 31 consumes, simultaneously in order to the ultrasonic wave transferring to array of protrusions 31 is reflected near the direction of glass substrate 2, preferably, as shown in Figure 4, array of protrusions 31 comprises multiple projection, projection is protrudent sphere, and the protrusion height of projection is less than 1.7 centimetres, make sound wave cover 3 inner wall smooth continuous, prevent corner angle and consume ultrasonic wave largely, and when multiple ultrasonic transmission that ultrasonic generator 5 sends are to a side of convex hemisphere jut, multiple ultrasonic wave can reflect near the direction of glass substrate 2 by projection, thus increase the hyperacoustic quantity transferring to glass substrate 2, and then increase the ultrasonic energy acting on cutting breach, increase the reactive force of sliver.
In order to improve the homogeneity that ultrasonic wave is transmitted in sound wave cover 3 further, ultrasonic generator 5 is multiple, and multiple ultrasonic generator 5 is evenly arranged at carrying platform 1 and sound wave cover 3 junction one week.Compared to a ultrasonic generator 5, multiple ultrasonic generators 5 add the summation of ultrasonic wave quantity in sound wave cover 3, thus increase the hyperacoustic action density of same cutting indentation, there, and then increase the validity of cutting breach sliver.
Because the cost of ultrasonic generator 5 is higher, therefore under the prerequisite improving the homogeneity that ultrasonic wave is transmitted in sound wave cover 3, in order to save cost, preferably, as shown in Figure 2, ultrasonic generator 5 is two, compared to the cutting splitting device being provided with more than three and three ultrasonic generators 5, the magnitude setting of ultrasonic generator 5 is less, provides cost savings.And, the ultrasonic wave sent to make ultrasonic generator 5 more effectively acts on cutting breach, preferably, the elevation angle of ultrasonic generator 5 is 30 ° ~ 40 °, make ultrasonic generator 5 towards the upper area of glass substrate 2, the ultrasonic wave that ultrasonic generator 5 sends thus can farthest transfer to glass substrate 2 after the reflection of sound wave cover 3 inwall.Wherein, when the elevation angle of ultrasonic generator 5 is ultrasonic generator 5 towards the top of glass substrate 2, send angle between hyperacoustic transmission direction and horizontal plane.
When glass substrate 2 is positioned over after on carrying platform 1, in order to fixing glass substrate 2 offsets position when cutting to prevent glass substrate 2, preferably, as shown in Figure 3, the upper surface of carrying platform 1 is provided with vacuum absorption holes 6, vacuum absorption holes 6 is communicated with vacuum generator (not shown), vacuum generator can air in sucking-off vacuum absorption holes 6, reduce the barometric point of glass substrate 2 lower surface, and barometric point remains unchanged suffered by glass substrate 2 upper surface, therefore the barometric point that is subject to of glass substrate 2 upper and lower surface is inconsistent, produce pressure reduction, make glass substrate 2 under this differential pressure action, be adsorbed on the upper surface of carrying platform 1.On the contrary, when removing fixing, vacuum generator can, to discharged air in vacuum suck sky, to increase the barometric point of glass substrate 2 lower surface, make the barometric point suffered by glass substrate 2 upper and lower surface reach balance, thus relieves the fixing of glass substrate 2.This structure is simple, easy to use.
Further, in order to increase the reactive force that vacuum absorption holes 6 produces, preferably vacuum absorption holes 6 is multiple and is uniformly distributed in the upper surface of carrying platform 1, when the lower surface of glass substrate 2 and multiple vacuum absorption holes 6 fit, the adsorptive power that glass substrate 2 is subject to is n times of the adsorptive power that single adsorption hole produces, n represents the number of the vacuum absorption holes 6 acted on glass substrate 2, thus increases the adsorption suffered by glass substrate 2, makes fixing more firm.
In order to reserve the oscillation space of glass substrate 2, preferably, carrying platform 1 is provided with telescoping mechanism 7, telescoping mechanism 7 can drive glass substrate 2 to move to close or away from carrying platform 1 direction, when glass substrate 2 cuts, in order to make glass substrate 2 and carrying platform 1 adsorb laminating, telescoping mechanism 7 is retracted in carrying platform 1; And when glass substrate 2 sliver, telescoping mechanism 7 stretches out carrying platform 1, glass substrate 2 is ejected to certain altitude, thus reserve the oscillation space of glass substrate 2, make glass substrate 2 can up-down vibration.
When glass substrate 2 vibrates, turn on one's side to prevent glass substrate 2, preferably, as shown in Figure 3, telescoping mechanism 7 comprises the retractor device be supported in the middle part of glass substrate 2 and the multiple retractor devices being supported in glass substrate 2 edge, glass substrate 2 being effectively supported on telescoping mechanism 7 when vibrating, preventing rollover and affecting sliver homogeneity.
Due to when the height that telescoping mechanism 7 stretches out carrying platform 1 is excessive, the impact produced when falling on carrying platform 1 after glass substrate 2 sliver is larger, easy damage glass substrate 2, therefore in order to avoid this problem, the length that preferred telescoping mechanism 7 stretches out carrying platform 1 is 0.5 ~ 1.0cm, within the scope of this, enough oscillation spaces can be reserved, and damage of dropping after glass substrate 2 sliver can be prevented.
Under normal circumstances, the retractor device that carrying platform 1 is arranged is hydro-cylinder, and its structure is simple, easily realizes.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (13)
1. a cutting splitting device, is characterized in that, comprising:
Carrying platform, the upper surface of described carrying platform is used for bearing glass substrate;
Sound wave cover, described sound wave cover and described carrying platform form an enclosed space, and described glass substrate is sealed in described enclosed space by described sound wave cover;
Ultrasonic generator, described ultrasonic generator is arranged in described enclosed space, and for generation of ultrasonic wave, described ultrasonic wave is split for making the cutting breach on described glass substrate.
2. cutting splitting device according to claim 1, is characterized in that, also comprises cutting unit, and described cutting unit is arranged at the top of described carrying platform and is positioned at described enclosed space, for cutting described glass substrate to form cutting breach.
3. cutting splitting device according to claim 1, is characterized in that, described hyperacoustic frequency is equal with the natural frequency of described glass substrate cutting breach.
4. cutting splitting device according to claim 1, is characterized in that, described sound wave cover is convex spherical shell structure.
5. the cutting splitting device according to any one of Claims 1 to 4, is characterized in that, described sound wave cover inwall is provided with array of protrusions.
6. cutting splitting device according to claim 5, is characterized in that, described array of protrusions comprises multiple projection, and described projection is convex spherical, and the protrusion height of described projection is less than 1.7 centimetres.
7. cutting splitting device according to claim 1, is characterized in that, described ultrasonic generator is multiple, and multiple described ultrasonic generator is evenly arranged at described carrying platform and described sound wave cover junction one week.
8. cutting splitting device according to claim 7, is characterized in that, described ultrasonic generator is positioned at the both sides of described carrying platform, and the elevation angle of described ultrasonic generator is 30 ° ~ 40 °.
9. cutting splitting device according to claim 1, is characterized in that, the upper surface of described carrying platform is provided with vacuum absorption holes, and described vacuum absorption holes is communicated with vacuum generator.
10. cutting splitting device according to claim 1, is characterized in that, described carrying platform is provided with telescoping mechanism, and described telescoping mechanism can drive described glass substrate to move to close or away from described carrying platform direction.
11. cutting splitting devices according to claim 10, is characterized in that, described telescoping mechanism comprises and is supported in a retractor device in the middle part of described glass substrate and even support in multiple retractor devices of described glass substrate edge.
12. cutting splitting devices according to claim 10 or 11, it is characterized in that, the length that described telescoping mechanism stretches out described carrying platform is 0.5 ~ 1.0cm.
13. cutting splitting devices according to claim 11, is characterized in that, described retractor device is hydro-cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712842.4A CN105217944B (en) | 2015-10-28 | 2015-10-28 | A kind of cutting splitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712842.4A CN105217944B (en) | 2015-10-28 | 2015-10-28 | A kind of cutting splitting device |
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| CN105217944A true CN105217944A (en) | 2016-01-06 |
| CN105217944B CN105217944B (en) | 2018-06-05 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107892471A (en) * | 2017-11-13 | 2018-04-10 | 武汉先河激光技术有限公司 | A kind of ultrasonic wave sliver apparatus and splinter method shielded comprehensively for mobile phone |
| CZ307547B6 (en) * | 2017-11-01 | 2018-11-21 | VĂšTS, a.s. | A method and a device for dividing a rodlike or tubular object made from a brittle material |
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| JPH02132844A (en) * | 1988-07-19 | 1990-05-22 | Matsushita Electric Ind Co Ltd | Division of compound semiconductor wafer |
| US20010035447A1 (en) * | 2000-05-05 | 2001-11-01 | Andreas Gartner | Methods for laser cut initiation |
| CN101318358A (en) * | 2007-06-07 | 2008-12-10 | 株式会社迪思科 | Cutting blade |
| CN102810469A (en) * | 2012-08-02 | 2012-12-05 | 华灿光电股份有限公司 | Splinter device and method of wafer |
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2015
- 2015-10-28 CN CN201510712842.4A patent/CN105217944B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132844A (en) * | 1988-07-19 | 1990-05-22 | Matsushita Electric Ind Co Ltd | Division of compound semiconductor wafer |
| US20010035447A1 (en) * | 2000-05-05 | 2001-11-01 | Andreas Gartner | Methods for laser cut initiation |
| CN101318358A (en) * | 2007-06-07 | 2008-12-10 | 株式会社迪思科 | Cutting blade |
| CN102810469A (en) * | 2012-08-02 | 2012-12-05 | 华灿光电股份有限公司 | Splinter device and method of wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CZ307547B6 (en) * | 2017-11-01 | 2018-11-21 | VĂšTS, a.s. | A method and a device for dividing a rodlike or tubular object made from a brittle material |
| CN107892471A (en) * | 2017-11-13 | 2018-04-10 | 武汉先河激光技术有限公司 | A kind of ultrasonic wave sliver apparatus and splinter method shielded comprehensively for mobile phone |
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| CN105217944B (en) | 2018-06-05 |
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