CN105217944B - A kind of cutting splitting device - Google Patents
A kind of cutting splitting device Download PDFInfo
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- CN105217944B CN105217944B CN201510712842.4A CN201510712842A CN105217944B CN 105217944 B CN105217944 B CN 105217944B CN 201510712842 A CN201510712842 A CN 201510712842A CN 105217944 B CN105217944 B CN 105217944B
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- cutting
- glass substrate
- splitting device
- carrying platform
- sound wave
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The embodiment of the present invention provides a kind of cutting splitting device, is related to display panel processing technique field.For solve the problems, such as prior art glass substrate after dicing sliver when sliver efficiency and the relatively low invention of yields.Cutting splitting device of the present invention, including carrying platform, the upper surface of the carrying platform is used for bearing glass substrate；Sound wave cover, the sound wave cover form a confined space with the carrying platform, and the glass substrate is sealed in the confined space by the sound wave cover；Supersonic generator, the supersonic generator are arranged in the confined space, and for generating ultrasonic wave, the ultrasonic wave is used to that the cutting notch on the glass substrate to be made to split.Cutting splitting device of the present invention can be used for being divided into box glass substrate.
Description
Technical field
The present invention relates to display panel processing technique field more particularly to a kind of cutting splitting devices.
Background technology
With the development of display technology, LCD (Liquid Crystal Display, liquid crystal display) is because it is with volume
Small, light-weight, low power consumption and other advantages and be more and more widely used, especially TFT-LCD (Thin Film
Transistor-Liquid Crystal Display, thin film transistor active matrix liquid crystal display) except possessing LCD's
Outside advantage, the also advantage with narrow frame, so as to favored by the majority of users.But due to TFT-LCD frame compared with
Narrow, interconnector terminal is therefore more demanding to the manufacturing process of TFT-LCD to the closer to the distance of edge, is especially cutting
Sliver process afterwards if generating notch damage during sliver, is easily destroyed terminals of connecting wire, makes the signal of driving device can not be normally defeated
Enter, so as to generate waste product, reduce yields.
To solve the above-mentioned problems, Chinese patent CN201310186373 discloses a kind of sliver apparatus, as shown in Figure 1,
Sliver apparatus includes load-bearing part 01 and the supersonic generator 02 above load-bearing part 01.Glass substrate 03 after it will cut
01 upper surface of load-bearing part is positioned over, the cutting notch 031 on glass substrate 03 is made to be located at after 02 lower section of supersonic generator, is beaten
Supersonic generator 02 is opened, and adjusts the frequency for sending ultrasonic wave, makes ultrasonic wave with the resonance of cutting notch to realize sliver.Due to
Ultrasonic wave can simultaneously and evenly be applied to the different position of cutting notch, therefore the active force energy generated by resonance effects
It is enough so that the glass substrate after cutting is not in notch damage, into without to line end along the cutting neat sliver of notch
Son causes to damage, and improves yields.
But in above device, and since ultrasonic wave has attenuation in transmission process, ultrasonic wave is usually only capable of making
Cutting notch 031 positioned at 02 lower section of supersonic generator splits, and due to usually having multiple cuttings to lack on glass substrate 03
Mouth 031, therefore in order to which multiple cutting notches is made to split, it is necessary to supersonic generator 02 is moved to the upper of corresponding cutting notch
Side.This process takes longer, and sliver is less efficient, and due to that can not make ultrasonic wave while equably act on to longer cutting notch
Different position, therefore, it is difficult to ensure the regularity of sliver, be still present with notch damage, yields is still relatively low.
The content of the invention
The embodiment of the present invention provides a kind of cutting splitting device, can save the sliver time after completing to cut, improve
Sliver efficiency, and the yields of sliver can be improved.
In order to achieve the above objectives, it is described including carrying platform the embodiment provides a kind of cutting splitting device
The upper surface of carrying platform is used for bearing glass substrate；Sound wave cover, the sound wave cover and carrying platform formation one are closed
The glass substrate is sealed in the confined space by space, the sound wave cover；Supersonic generator, the ultrasonic wave occur
Device is arranged in the confined space, and for generating ultrasonic wave, the ultrasonic wave is used to lack the cutting on the glass substrate
Schistostoma is opened.
Further, the cutting splitting device further includes cutter device, and it is flat that the cutter device is arranged at the carrying
The top of platform and in the confined space, for cutting the glass substrate to form cutting notch.
Further, the frequency of the ultrasonic wave is equal with the intrinsic frequency that notch is cut on the glass substrate.
Optionally, the sound wave cover is convex spherical shell structure.
Optionally, the sound wave cover inner wall is equipped with array of protrusions.
Further, the array of protrusions includes multiple protrusions, and the protrusion is convex spherical shape, and the protrusion of the protrusion is high
Degree is less than 1.7 centimetres.
Further, the supersonic generator is multiple that multiple supersonic generators are uniformly arranged on described hold
Carrying platform and the sound wave cover junction one week.
Further, the supersonic generator is arranged at the both sides of the carrying platform, and the supersonic generator
The elevation angle be 30 °~40 °.
Further, the upper surface of the carrying platform is equipped with vacuum absorption holes, and the vacuum absorption holes are communicated with vacuum
Generator.
Further, the carrying platform be equipped with telescoping mechanism, the telescoping mechanism can drive the glass substrate to
It is moved closer or far from the direction of the carrying platform.
Further, the telescoping mechanism includes being supported in a telescopic device in the middle part of the glass substrate and uniformly
It is supported in multiple telescopic devices of the glass substrate edge.
Further, the length that the telescoping mechanism stretches out the carrying platform is 0.5~1.0cm.
Further, the telescopic device is hydraulic cylinder.
A kind of cutting splitting device provided in an embodiment of the present invention, the glass substrate after cutting is positioned on carrying platform
Afterwards, supersonic generator is opened, supersonic generator sends multi beam ultrasonic wave around it, and multi beam ultrasonic wave is through in sound wave cover
After wall and carrying platform upper surface multiple reflections, it can be full of in each position in confined space, so that ultrasonic wave can
Simultaneously and stepless action is in all cutting gap positions on glass substrate, and the cutting on glass substrate can be made due to ultrasonic wave
Notch splits, therefore under the action of ultrasonic wave, all cutting notches on glass substrate can disposably split, and avoids existing
There are in technology the complex operations for the tops that supersonic generator is moved to multiple cutting notches successively, during so as to save sliver
Between, improve sliver efficiency.Moreover, no matter cutting the length of notch, ultrasonic wave can while and be uniformly applied to cut
Each position of notch thereby ensures that the regularity after cutting notch sliver, notch damage is effectively prevented, so as to improve
Yields.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram of sliver apparatus in prior art cutting splitting device；
Fig. 2 is the sectional view of cutting splitting device of the embodiment of the present invention；
Fig. 3 is the stereogram of cutting splitting device of the embodiment of the present invention；
Fig. 4 is the structure diagram of sound wave cover inner wall array of protrusions in cutting splitting device of the embodiment of the present invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
In the description of the present invention, it is to be understood that term " " center ", " on ", " under ", "front", "rear", " left side ",
The orientation or position relationship of the instructions such as " right side ", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are based on shown in the drawings
Orientation or position relationship, be for only for ease of the description present invention and simplify description rather than instruction or imply signified device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In description of the invention, unless otherwise indicated, " multiple " are meant that two or more.
Reference Fig. 2 and the specific embodiment that Fig. 3, Fig. 2 and Fig. 3 are cutting splitting device of the embodiment of the present invention, this reality
Applying the cutting splitting device of example includes：Carrying platform 1, the upper surface of the carrying platform 1 are used for bearing glass substrate 2；Sound wave
Cover 3, the sound wave cover 3 form a confined space 4 with the carrying platform 1, and the sound wave cover 3 is close by the glass substrate 2
It is encapsulated in the confined space 4；Supersonic generator 5, the supersonic generator 5 are arranged in the confined space 4, are used for
Ultrasonic wave is generated, the ultrasonic wave is used to that the cutting notch (not shown) on the glass substrate 2 to be made to split.
Glass substrate 2 after cutting is positioned over carrying platform 1 by a kind of cutting splitting device provided in an embodiment of the present invention
After upper, supersonic generator 5 is opened, supersonic generator 5 sends multi beam ultrasonic wave around it, and multi beam ultrasonic wave is through sound wave
After covering 1 upper surface multiple reflections of 3 inner walls and carrying platform, it can be full of in each position in confined space 4, so that ultrasonic
Wave energy reaches simultaneously and stepless action is in all cutting gap positions on glass substrate 2, since ultrasonic wave can make glass substrate 2
On cutting notch split, therefore under the action of ultrasonic wave, all cutting notches on glass substrate 2 can disposably be split
It opens, avoids the complex operations for the top that supersonic generator 02 is moved to multiple cutting notches successively in the prior art, from
And the sliver time is saved, improve sliver efficiency.Moreover, no matter cutting the length of notch, ultrasonic wave can be simultaneously and equal
Each position of cutting notch is acted on evenly, is thereby ensured that the regularity after cutting notch sliver, is effectively prevented notch
Damage, so as to improve yields.
In the above-described embodiments, when the ultrasonic frequency for acting on cutting indentation, there cuts consolidating for notch with glass substrate 2
Have frequency it is equal when, ultrasonic wave can generate resonance with cutting notch, and the active force that when resonance generates can make the glass after cutting
Substrate 2 is not in notch damage, is damaged into without being formed to terminals of connecting wire along the cutting neat sliver of notch.Moreover,
For glass substrate 2 after cutting by after sliver, the frequency of its own significantly deviates from resonant frequency when sliver occurs, therefore super
The frequency for the ultrasonic wave that sonic generator 5 is sent does not interfere with the glass substrate 2 after sliver, so the glass substrate after sliver
2 breaking part is also uniform.It is therefore preferable that the frequency for the ultrasonic wave that supersonic generator 5 is sent is cut with glass substrate 2
The intrinsic frequency of necked in operation is equal.
In order to which glass-cutting substrate 2 is to form cutting notch, hand cut may be employed, cutting machine-cut can also be used
It cuts, does not limit herein.Moreover, when glass substrate 2 is using hand cut, can be carried out on 3 certain platform of outside of sound wave cover
Hand cut after the completion of to be cut, then glass substrate 2 is moved on the carrying platform 1 in sound wave cover 3 and carries out sliver；Also may be used
To open sound wave cover 3, glass substrate 2 is positioned on carrying platform 1 and carries out hand cut, after the completion of cutting, turn off sound wave
Cover 3 carries out sliver, does not limit herein.Similarly, when glass substrate 2 is cut using cutting machine, cutting machine can be arranged at
Outside sound wave cover 3, cutting machine can also be arranged in sound wave cover 3, do not limited herein.But in order to avoid hand cut
Danger, while for the occupied space for reducing cutting splitting device, it is preferred to use cutting machine is simultaneously arranged at sound wave by cutting machine
It is cut in cover 3, cutter device (not shown) is made to be concentrated on sliver apparatus on an operating platform, so as to reduce
The occupied space of cutting splitting device simultaneously because using machine cuts, can reduce danger during cutting.
Wherein, sound wave cover 3 can be cube shell structure, can also be convex spherical shell knot as shown in Figure 2 or Figure 3
Structure.When sound wave cover 3 is cube shell structure, due to there is corner angle in cube shell structure, ultrasonic transmission so far corner angle
Will be in the countless secondary reflections of corner region behind position, final attenuation is so that consumption, it is impossible to act on glass substrate 2, so as to increase
The big energy consumption of ultrasonic wave, reduces the quantity for the ultrasonic wave for acting on cutting indentation, there, reducing makes what cutting notch split
Active force.In order to avoid the above problem, preferably sound wave cover 3 is convex spherical shell structure, since convex spherical shell inner wall smooth connects
Continuous, no corner angle, therefore the ultrasonic energy consumed is smaller, it is more to act on the ultrasonic wave quantity of cutting indentation, there, energy summation
It is larger, so as to increase the active force that cutting notch is made to split.
In order to improve the uniformity of ultrasonic wave transmission in sound wave cover 3, the roughness of 3 inner wall of sound wave cover can be increased, made
The scope that the ultrasonic wave that supersonic generator 5 is sent is covered after being reflected by sound wave cover 3 is wider, uniformity higher.In order to increase
3 inner wall of sound wave cover can be arranged to structure as shown in Figure 4 by the roughness of 3 inner wall of sound wave cover, specifically, can be in sound wave cover 3
Wall sets array of protrusions 31, and when ultrasonic transmission to array of protrusions 31, the region that back wave is covered is wider, so as to improve
The uniformity of sound wave transmission in sound wave cover 3.
In order to reduce the ultrasonic energy that array of protrusions 31 is consumed, while for the ultrasound that will be transmitted to array of protrusions 31
Wave direction is reflected close to the direction of glass substrate 2, it is preferable that as shown in figure 4, array of protrusions 31 includes multiple protrusions, protrusion is convex
Ball-type, and the protrusion height of protrusion is less than 1.7 centimetres, makes 3 inner wall smooth of sound wave cover continuous, prevent corner angle and largely
Ground consumes ultrasonic wave, and when a side of multiple ultrasonic transmissions that supersonic generator 5 is sent to convex hemisphere jut, it is convex
To rise can reflect multiple ultrasonic wave direction close to the direction of glass substrate 2, so as to increase the ultrasonic wave for being transmitted to glass substrate 2
Quantity, and then increase the ultrasonic energy for acting on cutting notch, increase the active force of sliver.
In order to further improve the uniformity of ultrasonic wave transmission in the sound wave cover 3, supersonic generator 5 be it is multiple, it is more
A supersonic generator 5 is uniformly arranged on carrying platform 1 and 3 junction of sound wave cover one week.Compared to one supersonic generator
5, multiple supersonic generators 5 add the summation of ultrasonic wave quantity in sound wave cover 3, surpass so as to increase same cutting indentation, there
The action density of sound wave, and then increase the validity of cutting notch sliver.
Since the cost of supersonic generator 5 is higher, ultrasonic wave uniformity of transmission in sound wave cover 3 is being improved
Under the premise of, in order to save cost, it is preferable that as shown in Fig. 2, supersonic generator 5 be two, compared to set there are three and three
The cutting splitting device of more than supersonic generator 5, the setting negligible amounts of supersonic generator 5, saves cost.Moreover,
In order to which the ultrasonic wave that supersonic generator 5 is sent is made more effectively to act on cutting notch, it is preferable that supersonic generator 5
The elevation angle for 30 °~40 °, make supersonic generator 5 towards the upper area of glass substrate 2, thus supersonic generator 5 is sent
Ultrasonic wave through 3 inner wall of sound wave cover reflection after can farthest be transmitted to glass substrate 2.Wherein, supersonic generator 5 is faced upward
Angle for supersonic generator 5 towards glass substrate 2 top when, send the folder between the transmission direction of ultrasonic wave and horizontal plane
Angle.
After glass substrate 2 is positioned on carrying platform 1, in order to fix glass substrate 2 to prevent glass substrate 2 from cutting
Position shifts when cutting, it is preferable that as shown in figure 3, the upper surface of carrying platform 1 is equipped with vacuum absorption holes 6, vacuum absorption holes
6 are communicated with vacuum generator (not shown), and vacuum generator can suction out the air in vacuum absorption holes 6, reduce glass
The atmospheric pressure of 2 lower surface of substrate, and since atmospheric pressure suffered by 2 upper surface of glass substrate remains unchanged, glass substrate 2
The atmospheric pressure that upper and lower surface is subject to is inconsistent, generates pressure difference, glass substrate 2 is made to be adsorbed under this differential pressure action in carrying platform
1 upper surface.On the contrary, when releasing fixed, vacuum generator can discharge air into vacuum suction sky, to increase glass
The atmospheric pressure of 2 lower surface of substrate makes the atmospheric pressure suffered by 2 upper and lower surface of glass substrate reach balance, so as to relieve glass
The fixation of glass substrate 2.This is simple in structure, easy to use.
Further, in order to increase active force caused by vacuum absorption holes 6, preferably vacuum absorption holes 6 to be multiple and
The upper surface of carrying platform 1 is uniformly distributed in, when the lower surface of glass substrate 2 fits with multiple vacuum absorption holes 6, glass
The adsorption capacity that substrate 2 is subject to is n times of adsorption capacity caused by single adsorption hole, and n expressions act on the vacuum on glass substrate 2
The number of adsorption hole 6 so as to increase the adsorption suffered by glass substrate 2, makes fixation more firm.
In order to reserve the oscillation space of glass substrate 2, it is preferable that carrying platform 1 is equipped with telescoping mechanism 7, telescopic machine
Structure 7 can drive glass substrate 2 to be moved to the direction close to or away from carrying platform 1, when glass substrate 2 is cut, in order to make
Glass substrate 2 can be adsorbed with carrying platform 1 and is bonded, in 7 retraction carrying platform 1 of telescoping mechanism；And in 2 sliver of glass substrate
When, telescoping mechanism 7 stretches out carrying platform 1, glass substrate 2 is ejected to certain altitude, so as to reserve the vibration of glass substrate 2
Space makes glass substrate 2 can be with up-down vibration.
When glass substrate 2 vibrates, glass substrate 2 is turned on one's side in order to prevent, it is preferable that as shown in figure 3, telescoping mechanism
7 include a telescopic device for being supported in 2 middle part of glass substrate and the multiple telescopic devices for being supported in 2 edge of glass substrate,
Glass substrate 2 is enable effectively to be supported on telescoping mechanism 7 in vibration, rollover is prevented and influences sliver uniformity.
It is flat that carrying is fallen to when height due to stretching out carrying platform 1 when telescoping mechanism 7 is excessive, after 2 sliver of glass substrate
The impact generated when on platform 1 is larger, is easily damaged glass substrate 2, therefore in order to avoid this problem, preferably telescoping mechanism 7 stretches out
The length of carrying platform 1 is 0.5~1.0cm, within this range, can reserve enough oscillation spaces, and can prevent glass
It drops after 2 sliver of substrate damage.
Under normal conditions, the telescopic device set on carrying platform 1 is hydraulic cylinder, simple in structure, easy to implement.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in change or replacement, should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (13)
1. a kind of cutting splitting device, which is characterized in that including：
Carrying platform, the upper surface of the carrying platform are used for bearing glass substrate；
Sound wave cover, the sound wave cover and the carrying platform form a confined space, and the sound wave cover is by the glass substrate
It is sealed in the confined space；
Supersonic generator, the supersonic generator are arranged in the confined space, for generating ultrasonic wave, the ultrasound
Ripple is used to that the cutting notch on the glass substrate to be made to split, including：The supersonic generator sends multi beam around it and surpasses
Sound wave, the multi beam ultrasonic wave can be full of after the upper surface multiple reflections of the sound wave cover inner wall and the carrying platform
In each position in the confined space, so that ultrasonic wave can simultaneously and stepless action is in the institute on the glass substrate
There is cutting gap position, all cutting notches disposably split.
2. cutting splitting device according to claim 1, which is characterized in that further include cutter device, the cutter device
It is arranged at the top of the carrying platform and in the confined space, is lacked for cutting the glass substrate with forming cutting
Mouthful.
3. cutting splitting device according to claim 1, which is characterized in that the frequency of the ultrasonic wave and the glass base
The intrinsic frequency that notch is cut on plate is equal.
4. cutting splitting device according to claim 1, which is characterized in that the sound wave cover is convex spherical shell structure.
5. cutting splitting device according to any one of claims 1 to 4, which is characterized in that the sound wave cover inner wall is set
There is array of protrusions.
6. cutting splitting device according to claim 5, which is characterized in that the array of protrusions includes multiple protrusions, institute
Protrusion is stated as convex spherical shape, and the protrusion height of the protrusion is less than 1.7 centimetres.
7. cutting splitting device according to claim 1, which is characterized in that the supersonic generator is multiple to be multiple
The supersonic generator is uniformly arranged on the carrying platform and the sound wave cover junction one week.
8. cutting splitting device according to claim 7, which is characterized in that the supersonic generator is located at the carrying
The both sides of platform, and the elevation angle of the supersonic generator is 30 °~40 °.
9. cutting splitting device according to claim 1, which is characterized in that the upper surface of the carrying platform is equipped with vacuum
Adsorption hole, the vacuum absorption holes are communicated with vacuum generator.
10. cutting splitting device according to claim 1, which is characterized in that the carrying platform is equipped with telescoping mechanism,
The telescoping mechanism can drive the glass substrate to the direction movement closer or far from the carrying platform.
11. cutting splitting device according to claim 10, which is characterized in that the telescoping mechanism includes being supported in described
A telescopic device and even support in the middle part of glass substrate is in multiple telescopic devices of the glass substrate edge.
12. the cutting splitting device according to claim 10 or 11, which is characterized in that held described in the telescoping mechanism stretching
The length of carrying platform is 0.5~1.0cm.
13. cutting splitting device according to claim 11, which is characterized in that the telescopic device is hydraulic cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712842.4A CN105217944B (en) | 2015-10-28 | 2015-10-28 | A kind of cutting splitting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712842.4A CN105217944B (en) | 2015-10-28 | 2015-10-28 | A kind of cutting splitting device |
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| Publication Number | Publication Date |
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| CN105217944A CN105217944A (en) | 2016-01-06 |
| CN105217944B true CN105217944B (en) | 2018-06-05 |
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| CN201510712842.4A Active CN105217944B (en) | 2015-10-28 | 2015-10-28 | A kind of cutting splitting device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CZ307547B6 (en) * | 2017-11-01 | 2018-11-21 | VĂšTS, a.s. | A method and a device for dividing a rodlike or tubular object made from a brittle material |
| CN107892471A (en) * | 2017-11-13 | 2018-04-10 | 武汉先河激光技术有限公司 | A kind of ultrasonic wave sliver apparatus and splinter method shielded comprehensively for mobile phone |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318358A (en) * | 2007-06-07 | 2008-12-10 | 株式会社迪思科 | Cutting blade |
| CN102810469A (en) * | 2012-08-02 | 2012-12-05 | 华灿光电股份有限公司 | Splinter device and method of wafer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132844A (en) * | 1988-07-19 | 1990-05-22 | Matsushita Electric Ind Co Ltd | Division of compound semiconductor wafer |
| US20010035447A1 (en) * | 2000-05-05 | 2001-11-01 | Andreas Gartner | Methods for laser cut initiation |
-
2015
- 2015-10-28 CN CN201510712842.4A patent/CN105217944B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318358A (en) * | 2007-06-07 | 2008-12-10 | 株式会社迪思科 | Cutting blade |
| CN102810469A (en) * | 2012-08-02 | 2012-12-05 | 华灿光电股份有限公司 | Splinter device and method of wafer |
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