KR20100050254A - Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same - Google Patents

Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same Download PDF

Info

Publication number
KR20100050254A
KR20100050254A KR1020080109461A KR20080109461A KR20100050254A KR 20100050254 A KR20100050254 A KR 20100050254A KR 1020080109461 A KR1020080109461 A KR 1020080109461A KR 20080109461 A KR20080109461 A KR 20080109461A KR 20100050254 A KR20100050254 A KR 20100050254A
Authority
KR
South Korea
Prior art keywords
unit
mother substrate
substrate assembly
cutting
adsorption
Prior art date
Application number
KR1020080109461A
Other languages
Korean (ko)
Other versions
KR101160166B1 (en
Inventor
김민웅
양진혁
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080109461A priority Critical patent/KR101160166B1/en
Priority to JP2009243365A priority patent/JP5088637B2/en
Priority to CN2009102106118A priority patent/CN101734849B/en
Priority to TW098137411A priority patent/TWI388487B/en
Publication of KR20100050254A publication Critical patent/KR20100050254A/en
Application granted granted Critical
Publication of KR101160166B1 publication Critical patent/KR101160166B1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
    • C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
    • C03B35/20—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by gripping tongs or supporting frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A transfer unit for cutting device is provided to improve breaking efficiency and productivity by receiving an object to be cut and performing breaking process at the same time. CONSTITUTION: A transfer unit(420) for cutting device comprises: unit body(421); at least two receiving units(422,423,424,425) which receives a specific part from the object and transfers. The receiving unit an adsorption unit(422a,423a,424a,425a) for vacuum adsorption and pressurizing unit(422b,423b,424b,425b) which pressurizes in an opposite direction with the adsorption direction.

Description

Conveying unit for cutting device, cutting device having same and cutting method using same {TRASFERRING UNIT FOR SCRIBING APPARATUS, CUTTING APPARATUS HAVING THE SAME AND METHOD OF CUTTING SUBSTRATE USING THE SAME}

The present invention relates to a cutting device used for manufacturing a flat panel display panel, and more particularly, to a transfer unit for a cutting device for cutting a mother substrate for a flat panel display panel, a cutting device having the same and a cutting method using the same.

In general, a plurality of flat panel display panels for displaying an image such as a liquid crystal display panel are manufactured at a time by using a large panel, that is, a mother substrate. In detail, the flat panel display panel includes an upper substrate and a lower substrate facing each other. The upper substrate and the lower substrate are formed through different mother substrates. That is, each of the upper substrate mother substrate and the lower substrate mother substrate is divided into a plurality of unit regions. In each unit region of the upper substrate mother substrate, an upper cell formed of thin layers for forming the upper substrate is formed. In each unit region of the lower substrate mother substrate, a lower cell formed of thin layers for forming the lower substrate is formed.

The upper substrate mother substrate and the lower substrate mother substrate, each of which the thin film layers are formed, are coupled to face each other, and the unit regions of the upper substrate mother substrate and the unit regions of the lower substrate mother substrate coincide with each other. The lower cell and the upper cell facing each other constitute one unit cell, and one unit cell constitutes one flat panel display panel. Two mother substrates coupled to each other are cut for each unit cell, thereby manufacturing a plurality of flat panel display panels.

As described above, in order to manufacture a plurality of flat panel display panels using a large mother substrate, a scribing process for cutting two bonded mother substrates by unit cell is required. The scribe process includes a method of cutting using a laser beam and a method of using a scribe wheel. In a method of cutting a mother substrate using a scribe wheel, the scribe wheel is brought into contact with the mother substrate and then moved along a cutting schedule line to form a scribe line having a groove having a predetermined depth on the surface of the mother substrate. In a method of cutting a mother substrate using a laser beam, a scribe line is formed by irradiating a laser beam along a cutting target line on an upper surface of the mother substrate.

Once the scribing process is complete, a braking process is needed to separate the mother substrate along the scribe line. In general, in the braking process, a braking bar is disposed on an upper surface of a mother substrate on which a scribe line is formed, and then the braking bar is pressed on the mother substrate to apply a physical impact to the mother substrate. The mother substrate propagates the cracks along the scribe line by the physical impact and is separated by unit cells. Substrates separated by unit cells, that is, unit substrates are transferred to the outside.

As such, the braking process separates a portion where the unit cell is not formed, that is, a cullet portion and a portion where the unit cell is formed. However, as the utilization efficiency of the mother substrate and the size of the flat panel display panel gradually increase, the distance between adjacent unit cells is gradually narrowing. In particular, each unit cell is provided with a sealant for coupling two mother substrates disposed up and down. Due to the adhesive component of the sealant and the reduction in the width of the collet part, a breaking failure occurs in which the collet part and the unit cell part are not cut to each other.

An object of the present invention is to provide a conveying unit for a cutting device that can improve the cutting efficiency.

It is also an object of the present invention to provide a cutting device capable of improving cutting efficiency.

It is also an object of the present invention to provide a cutting method using the cutting device described above.

A conveying unit for a cutting device according to one feature for realizing the above object of the present invention comprises a body and at least two receiving portions.

The receiving unit is installed on the rear surface of the body and separates the cutting object having the scribe line formed along the scribe line and receives and transports a specific portion from the cutting object.

Each receiving portion includes an adsorption portion and a pressurizing portion. An adsorption part vacuum-adsorbs the upper surface of the said cutting object. The pressurization part is installed adjacent to the adsorption part, and presses the collet region of the cutting object which is not received by the adsorption part in a braking step of separating the cutting object along the scribe line in a direction opposite to the adsorption direction of the adsorption part. do.

In addition, the cutting device according to one feature for realizing the above object of the present invention comprises a scribing unit and a breaking unit.

The scribing unit forms a scribing line on the surface of the mother substrate assembly to cut the mother substrate assembly to form a plurality of unit panels each forming a flat panel display panel. The braking unit includes a transfer unit which cuts the mother substrate assembly having the scribe line formed along the scribe line, separates each unit panel, and picks up and transfers each unit panel.

In particular, the transfer unit comprises a body and at least two receivers. The receiving part is provided on the back of the body, and has an adsorption part and a pressurizing part. The adsorption unit vacuum-adsorbs the upper surface of the mother substrate assembly. The pressurization unit is installed adjacent to the adsorption unit, and the collet region of the mother substrate assembly positioned outside the cell region forming the unit panel during the braking process of separating the mother substrate assembly along the scribe line. Pressurize in the direction opposite to the adsorption direction.

In addition, the cutting method according to one feature for realizing the above object of the present invention is as follows.

First, a scribe line is formed on the surface of the mother substrate assembly to cut the mother substrate assembly to form a plurality of unit panels each forming a flat panel display panel. The mother substrate assembly in which the scribe line is formed is cut along the scribe line and at the same time, the unit panel is received from the mother substrate assembly and drawn out.

According to the present invention described above, the transfer unit receives the portion to be received from the cutting object while performing the braking step of the cutting object, thereby improving the breaking efficiency and productivity.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, the mother substrate for the liquid crystal display panel is described as an example of the cutting object.

1 is a plan view illustrating a mother substrate assembly for a liquid crystal display panel, FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1, and FIG. 3 is a perspective view of the liquid crystal display panel.

1 and 2, the mother substrate assembly 100 may include first and second mother substrates 110 and 120, and the first and second mother substrates 110 and 120 face each other. Combined to form a plurality of unit cells (UC). Each unit cell UC forms one liquid crystal display panel, and the plurality of unit cells UC are arranged in a matrix form. Each unit cell UC includes an array layer 130 formed on the first mother substrate 110, a color filter layer 140 formed on the second mother substrate 120, the array layer 130, and the color filter layer ( The liquid crystal layer 150 interposed between the liquid crystal layer 150 and the sealant 160 filling the liquid crystal layer 150 between the array layer 130 and the color filter layer 140 may be included. The sealant 160 surrounds the liquid crystal layer 300 and couples the first and second mother substrates 110 and 120 to each other.

The mother substrate assembly 100 is cut by the unit cells 110, and the unit panels formed by separating the unit cells from the mother substrate assembly 100 for each unit cell UC are shown in FIG. 3. It is provided as (DP). Here, the liquid crystal display panel DP is cut smaller in size than the lower substrate DP1 to expose the source and gate ends of the lower substrate DP1 to the outside. A source driver for outputting a source signal is coupled to the source side end of the lower substrate DP1, and a gate driver for outputting a gate signal is coupled to the gate end.

In the present exemplary embodiment, the gate side end and the source end of the liquid crystal display panel DP are exposed, but only the source end thereof may be exposed.

Hereinafter, a substrate cutting system for cutting the mother substrate assembly 100 for each unit cell UC will be described in detail with reference to the accompanying drawings.

4 is a view schematically showing a substrate cutting system according to an embodiment of the present invention, Figure 5 is a side view schematically showing a scribing unit shown in FIG.

1 and 4, the substrate cutting system 500 may include a loading unit 200, a scribing unit 300, and a breaking unit 400.

The mother substrate assembly 100 transferred from the outside is loaded on the loading unit 200, and the mother substrate assembly 200 transferred to the loading unit 200 is transferred to the scribing unit 300.

4 and 5, the scribing unit 300 forms a scribe line on the first support member 310 on which the mother substrate assembly 100 is seated and the mother substrate assembly 100. It may include an ice unit 320.

The first supporting member 310 may include two first rotating rollers 311 and 312 spaced apart from each other, and a first belt 313 connecting the first rotating rollers 311 and 312. The first rotating rollers 311 and 312 are disposed parallel to the ground and rotate about the central axis. As a result, the first belt 313 rotates. The mother substrate assembly 100 transferred from the loading unit 200 is seated on the first belt 313 facing the first belt 313, and the mother substrate assembly 100 is mounted on the first belt 313. The belt 313 is moved in the horizontal direction by the rotation.

The scribing unit 320 is installed on the first support member 310. The scribing unit 320 may include a head 321, a scribe wheel 322, and a wheel shaft 323 connecting the head 321 and the scribe wheel 322. The scribe wheel 322 is provided below the head 321, the head 321 is moved in the horizontal direction in one direction while pressing the scribe wheel 322 in the vertical direction. The scribe wheel 322 is rotated by the horizontal movement of the head 321. The scribe wheel 322 has a generally disc shape. The scribe wheel 322 is rotated while the outer peripheral surface is in contact with the mother substrate assembly 100 to etch the mother substrate assembly 100 to a predetermined depth. The head 321 moves in a direction opposite to the transfer direction of the mother substrate assembly 100 while the scribe wheel 322 is rotated. Accordingly, the scribe wheel 322 moves along the cut line (not shown) of the mother substrate assembly 100 to etch the surface of the mother substrate assembly 100 to scribe the mother substrate assembly 100. Form a line.

The scribe wheel 322 is connected to the head 321 through the wheel shaft 323, the wheel shaft 323 is inserted into the connector formed at the central portion of the scribe wheel 322. When the scribe wheel 322 is rotated, the wheel shaft 323 becomes a rotation axis of the scribe wheel 322.

In this embodiment, the scribing unit 300 includes a scribing unit 300 for scribing the mother substrate assembly 100 using the scribe wheel 322, but using a laser beam. A scribing unit for scribing the mother substrate assembly 100 may be provided.

The mother substrate assembly 100 in which the scribing process is completed in the scribing unit 300 is transferred to the breaking unit 400. The breaking unit 400 cuts the mother substrate assembly 100 for each unit cell UC (see FIG. 1), and separates the mother substrate from the mother substrate assembly 100 for each unit cell UC. That is, the liquid crystal display panels are transferred to the outside.

FIG. 6 is a side view schematically showing the breaking part shown in FIG. 4.

Referring to FIG. 6, the breaking part 400 includes a second support member 410 on which the mother substrate assembly 100 is mounted, and the mother substrate assembly 100 for each unit cell UC (see FIG. 1). It may include a transfer unit 420 for cutting and receiving by).

Specifically, the second support member 410 may include two second rotating rollers 411 and 412 spaced apart from each other, and a second belt 413 connecting the second rotating rollers 411 and 412. Can be. The second rotating rollers 411 and 412 are disposed parallel to the ground and rotate about the central axis. As a result, the second belt 413 rotates. The mother substrate assembly 100 transferred from the loading unit 200 is seated on the first belt 413 to face the first belt 413, and the mother substrate assembly 100 is mounted on the second belt 413. The belt 413 rotates in the horizontal direction.

The transfer unit 420 is installed on the second support member 410. The transfer unit 420 cuts the mother substrate assembly 100 along a scribe line and at the same time receives a unit panel separated from the mother substrate assembly 100 and transfers it to the outside.

Hereinafter, the configuration of the transfer unit 420 will be described in detail with reference to the drawings.

FIG. 7 is a perspective view illustrating the transfer unit illustrated in FIG. 6, FIG. 8 is a plan view illustrating the transfer unit illustrated in FIG. 7, and FIG. 9 is a side view illustrating a positional relationship between the suction unit and the pressurization unit illustrated in FIG. 8. .

6 and 7, the transfer unit 420 may include a body 421, a plurality of receiving parts 422, 423, 424, and 425, and a moving shaft 426.

In detail, the body 421 has a rear surface facing the second belt 413 and has a substantially hexagonal pillar shape. Here, the shape of the body 421 is not limited to this and can be variously changed.

First to fourth insertion holes 421a, 421b, 421c, and 421d are provided on the rear surface of the body 421. The first to fourth insertion holes 421a, 421b, 421c, and 421d are respectively formed adjacent to four corners of the rear surface of the body 421, and each of the body 421 is disposed from adjacent edges of the body 421. It extends long to the center part. Therefore, each of the insertion holes 421a, 421b, 421c, and 421d has a rod shape.

The plurality of receiving parts 422, 423, 424, and 425 are inserted into the first to fourth insertion holes 421a, 421b, 421c, and 421d, respectively. In this embodiment, the transfer unit 420 has four receiving portions 422, 423, 424, 425, but the number of receiving portions is the size and the receiving efficiency of the unit cell UC (see FIG. 1). It may increase or decrease depending on the transfer unit 420 is provided with at least two receiving portions disposed in a diagonal direction to each other.

In addition, the number of the insertion holes 421a, 421b, 421c, and 421d also increases or decreases according to the number of the receiving parts 422, 423, 424, and 425, and the insertion holes 421a, 421b, 421c, and 421d. Is provided in the same number as the receivers 422, 423, 424, 425.

The plurality of receivers 422, 423, 424, and 425 may include first to fourth receivers 422, 423, 424, and 425, and the first to fourth receivers 422, 423, 424, and 425 may correspond one-to-one with the first to fourth insertion holes 421a, 421b, 421c, and 421d. Each receiving portion 422, 423, 424, 425 is inserted into a corresponding insertion hole. In one example of the present invention, the first receiving part 422 is inserted into the first insertion hole 421a, and the second receiving part 423 is inserted into the second insertion hole 421b. The third receiving part 424 is inserted into the third insertion hole 421c, and the fourth receiving part 425 is inserted into the fourth insertion hole 421d.

Each receiving portion 422, 423, 424, 425 is movable along the length of the corresponding insertion hole. Accordingly, the transfer unit 420 may adjust the positions of the first to fourth receivers 422, 423, 424, and 425 according to the size of the unit cell UC.

The first to fourth receiving parts 422, 423, 424, and 425 may include adsorption parts 422a, 423a, 424a, and 425a and pressurizing parts 422b, 423b, 424b, and 425b. The fourth to fourth receiving units 422, 423, 424, and 425 have the same configuration.

In this embodiment, the adsorption parts 422a, 423a, 424a, and 425a of the first to fourth receiving parts 422, 423, 424, and 425 have the same configuration, and the pressing parts 422b, 423b, 424b and 425b also have the same configuration. Therefore, hereinafter, in the detailed description of the respective configurations of the first to fourth receiving parts 422, 423, 424, and 425, the adsorption part 422a and the pressing part 422b of the first receiving part 422. ) As an example.

7 and 8, the adsorption part 422a of the first receiving part 422 may include a vacuum body 41 and a vacuum tube 42. The vacuum body 41 has a vacuum area therein. This is formed, the lower surface is in contact with the surface and the mother substrate assembly 100 during the braking process. A plurality of suction holes 41a are formed on the lower surface of the vacuum body 41. In one example of the invention, the vacuum body generally has a funnel shape that gradually widens from top to bottom.

The upper end of the vacuum body 41 is coupled to the vacuum tube 42. The vacuum tube 42 of the first receiving part 422 is inserted into the first insertion hole 421a and is installed to be movable along the longitudinal direction of the first insertion hole 421a. The vacuum tube 42 is connected to the vacuum pump 430 through the vacuum line (VL). A portion of the vacuum line VL is inserted into the body 421, and is connected to the suction units 422a, 423a, 424a, and 425a of each receiving unit 422, 423, 424, and 425. Accordingly, each of the adsorption parts 422a, 423a, 424a, and 425a is internally vacuumed by the vacuum pump 430. During the braking process, the upper surface of the mother substrate assembly 100 is adsorbed to the lower surface of the vacuum body 41 by the vacuum pressure provided to the suction hole 41a.

The pressing part 422b of the first receiving part 422 is installed outside the suction part 422a of the first receiving part 422, and corresponds to the body 421 corresponding to the first receiving part 422. It is disposed closer to the corner than the adsorption portion 422a.

The pressing part 422b includes first and second pushers 43 and 44 contacting the upper surface of the mother substrate assembly 100 during the braking process, and a support shaft 45 inserted into the first insertion hole 421a. It may include.

The first and second pushers 43 and 44 have a plate shape and are connected to each other. The connection angle θ1 of the first and second pushers 43 and 44 is substantially similar to the corner angle θ2 of the unit cell UC, and the first and second pushers 43 and 44 are connected to each other. The shape is generally the same as the corner shape of the unit cell (UC).

The first and second pushers 43 and 44 are connected to the support shaft 45. The support shaft 45 of the first receiving part 422 is inserted into the first insertion hole 422a and is installed to be movable along the longitudinal direction of the first insertion hole 422a.

Referring to FIGS. 7 and 9, lower ends of the first and second pushers 43 and 44 are lower than the rear surface of the suction part 422a when viewed from the side, and the pressing part 422b is located. It is made of elastic material. As described above, since the pressing part 422b is made of an elastic material, the support shaft 45 is bent to the outside during the braking process. Accordingly, during the braking process, even though the first and second pushers 43 and 44 are further positioned downward toward the mother substrate assembly 100, the upper surface of the adsorption part 422a and the mother substrate assembly 100 are in contact with each other. It does not affect.

In the breaking process, the adsorption parts 422a, 423a, 424a, and 425a are disposed in an area UCA in which the unit cell UC to be received from the mother substrate assembly 100 is formed. On the other hand, the pressing parts 422b, 423b, 424b, and 425b are located outside the region where the unit cell UC is formed, that is, the collet region. In addition, the adsorption parts 422a, 423a, 424a, and 425a adsorb the mother substrate assembly 100 and lift it upwards, and the pressing parts 422b, 423b, 424b, and 425b are the mother substrate assembly 100. Press down.

As described above, the adsorption parts 422a, 423a, 424a, and 425a and the pressing parts 422b, 423b, 424b, and 425b respectively have different directions of forces acting on the mother substrate assembly 100. Cutting of the cullet region and the unit cell region UCA of the plate assembly 100 is easy. Accordingly, the transfer unit 420 may prevent the braking failure of the mother substrate assembly 100 and improve the yield of depilation.

On the other hand, the moving shaft 426 is coupled to the upper portion of the body 421. The moving shaft 426 moves the body 421, whereby the unit panels adsorbed by the first to fourth receiving parts 422, 423, 424, and 425 are transferred to the outside.

Again, referring to FIG. 6, the breaking part 400 may further include a crushing part 440 crushing the cullets generated during the cutting of the mother substrate assembly 100. The shredding part 440 is installed at one side of the second support member 410. The crushing unit 440 includes a plurality of conveying rollers 441 for conveying the cullets and a plurality of crushing bars 422 provided on the conveying rollers 441. Each crushing bar 422 is located in correspondence with a space in which two adjacent conveying rollers are spaced apart from each other, and presses and crushes the cullets on the conveying rollers 411.

Hereinafter, a process of cutting the mother substrate assembly 100 by the substrate cutting system 500 will be described in detail with reference to the accompanying drawings.

FIG. 10 is a flowchart illustrating a process of cutting a mother substrate assembly using the substrate cutting system illustrated in FIG. 4.

4 and 10, first, a mother substrate assembly 100 in which a plurality of unit cells UC is formed is loaded into the loading unit 200 (step S110).

Subsequently, the mother substrate assembly 100 transferred to the loading unit 200 is transferred to the scribing unit 300 to perform a scribing process of the mother substrate assembly 100 (step S120).

FIG. 11 is a process diagram schematically illustrating a process of scribing a scribing unit mother substrate assembly shown in FIG. 5.

Hereinafter, the scribing process will be described in detail with reference to FIG. 11. First, the mother substrate assembly 100 is disposed on the first support member 310, and the scribing unit 320 is disposed on the mother substrate assembly 100. In this case, the scribing unit 320 is adjacent to the mother substrate assembly 100 so that the scribing wheel 322 of the scribing unit 320 contacts the upper surface of the mother substrate assembly 100. Place it.

Subsequently, the upper surface of the mother substrate assembly 100 is etched to a predetermined depth by moving the scribing wheel 322 toward the mother substrate assembly 100 in a horizontal direction along a cutting schedule line (not shown). . Here, the outer circumferential surface of the scribing wheel 322 has a sawtooth shape. The scribe wheel 322 rotates the sawtooth outer peripheral surface in contact with the mother substrate assembly 100 to etch the mother substrate assembly 100 to a predetermined depth, and thus, the mother substrate assembly 100. A scribe line SL is formed on the surface of the scribe line SL.

4 and 10, the mother substrate assembly 100 in which the scribing process is completed is transferred to the breaking part 400, and the breaking part 400 is moved from the mother substrate assembly 100. Receiving each unit panel DP and simultaneously breaking the cullet from the unit panel (step S130).

Subsequently, the breaking unit 400 transfers the received unit panel to the outside, and crushes the cullets generated in the breaking process (step S140).

Hereinafter, a process of separating the cullet while receiving the unit panel DP from the mother substrate assembly 100 by the transfer unit 420 of the breaking unit 400 will be described in detail.

12 and 13 are process diagrams schematically illustrating a process of separating a unit cell from a mother substrate assembly by the transfer unit illustrated in FIG. 7, and FIG. 14 illustrates a state in which the transfer unit illustrated in FIG. 12 is seated on the mother substrate assembly. It is the top view shown. FIG. 14 illustrates the positional relationship between the first to fourth receiving parts 422, 423, 424 and 425 of the transfer unit 420 and the unit cell UC of the mother substrate assembly 100. The body 421 of the transfer unit 420 is omitted.

12 and 13, the mother substrate assembly 100 on which the scribing process is completed is seated on the second belt 413 of the second support member 410, and the transfer unit 300 is mounted on the mosquito. It is placed on top of the plate assembly 100.

Subsequently, the first to fourth receiving parts 422, 423, 424, and 425 of the transfer unit 420 are in close contact with the upper surface of the mother substrate assembly 100. Accordingly, the upper surface of the mother substrate assembly 10 is adsorbed to the adsorption parts 422a, 423a, 424a, 425a of the first to fourth receiving parts 422, 423, 424, and 425, and the pressurizing parts 422b, 423b, 424b, and 425b are bent outwards and press down the top surface of the mother substrate assembly 100.

As illustrated in FIG. 14, the adsorption parts 422a, 423a, 424a, and 425a of the first to fourth receiving parts 422, 423, 424, and 425 during the braking process are formed in the unit cell UC. The pressing units 422b, 423b, 424b, and 425b may be positioned outside the unit cell region, ie, the collet region CA, with the scribe line SL as a boundary.

Subsequently, the moving shaft 426 lifts the body 421 upwards. The adsorption parts 422a, 423a, 424a, and 425a move upward in a state of adsorbing the mother substrate assembly 100. On the other hand, the pressurizing portions 422b, 423b, 424b, and 425b continue to be moved while the adsorption portions 422a, 423a, 424a, and 425a are moved by a step with the suction portions 422a, 423a, 424a, and 425a. Press down the upper surface of the plate assembly (100). Accordingly, in the mother substrate assembly 100, the unit cell area and the collet area adsorbed to the adsorption parts 422a, 423a, 424a, and 425a are separated from each other, and the unit panel DP is connected to the adsorption parts 422a,. 423a, 424a, and 425a are adsorbed and transferred to the outside.

As such, the transfer unit 420 may simultaneously receive the braking process and the unit panel DP, and completely separate the cullet from the unit panel DP. Accordingly, the substrate cutting system 500 may prevent a bad braking and improve the yield and productivity of the product.

FIG. 15 is a perspective view illustrating a transfer unit according to another exemplary embodiment of the present invention, FIG. 16 is a perspective view illustrating a pressing unit illustrated in FIG. 15, and FIG. 17 is a cross-sectional view illustrating a cutting line II-II ′ of FIG. 16.

15 and 16, the transfer unit 450 may include a body 421, a plurality of receivers 451, 452, 453, 454, and a moving shaft 426. Since the body 421 and the moving shaft 426 are the same as the body 421 and the moving shaft 426 of the transfer unit 450 shown in FIG. 7, the reference numerals will be omitted and detailed description thereof will be omitted. .

The plurality of receiving parts 451, 452, 453, and 454 are installed on the rear surface of the body 421 to separate and transfer the unit panel DP from the mother substrate assembly 100. In this embodiment, the transfer unit 450 has four receivers 451, 452, 453, 454, but the number of receivers 451, 452, 453, 454 can increase or decrease. have. In this case, the transfer unit 450 includes at least two receivers disposed diagonally to each other.

The plurality of receivers 451, 452, 453, and 454 may include first to fourth receivers 451, 452, 453, and 454, and the first to fourth receivers 451, 452, 453, and 454. 454 includes suction portions 422a, 423a, 424a, 425a and pressing portions 451a, 452a, 453a, 454a. In this embodiment, the suction parts 422a, 423a, 424a, and 425a are the same as the suction parts 422a, 423a, 424a, and 425a shown in FIG. Omit.

Each receiving portion 451, 452, 453, 454 has one suction portion 422a, 423a, 424a, 425a and one pressing portion 451a, 452a, 453a, 454a. In this embodiment, since the pressing portions 451a, 452a, 453a, and 454a have the same configuration, the pressing portion 451a of the first receiving portion 451 will be described as an example.

Referring to FIGS. 16 and 17, the pressing part 451a of the first receiving part 451 may include the first and second pushers 51 and 52, the support shaft 53, and the pressure adjusting part 54. Include. A shape and a connection relationship of the first and second pushers 51 and 52 and a connection relationship between the first and second pushers 51 and 52 and the support shaft 53 are illustrated in the transfer unit 420 of FIG. 7. ), So a detailed description thereof will be omitted.

One end of the support shaft 53 is coupled to the pressure adjusting part 54, and the pressure adjusting part 54 is inserted into the first insertion hole 421a (see FIG. 15) of the body 421. The pressure control unit 54 is installed to be movable along the longitudinal direction of the first insertion hole 421a.

The pressure adjusting part 54 may include a case 54a and a spring 54b embedded in the case 54a. One end of the support shaft 53 is inserted into the case 54a to be coupled to one end of the spring 54b. The other end of the spring 54b is fixed to the inner wall of the case 54a.

When viewed in a plan view, lower ends of the first and second pushers 51 and 52 are located below the rear surface of the suction part 422a, and during the braking process, the length of the pressing part 451a is determined by the spring ( 54b). Accordingly, even if lower end portions of the first and second pushers 51 and 52 are positioned below the rear surface of the suction portion 422a, the length of the pressing portion 451a is adjusted by the spring 54b. The upper surface of the adsorption part 422a and the mother substrate assembly 100 do not affect each other. In addition, during the braking process, the pressing part 451a presses down the upper surface of the mother substrate assembly 100 using the elastic force of the spring 54b.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be. In addition, the representations of elements in the figures have been exaggerated to emphasize a more clear description.

1 is a perspective view illustrating a mother substrate assembly for a liquid crystal display panel.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

3 is a perspective view illustrating a liquid crystal display panel.

4 is a schematic view of a substrate cutting system according to an embodiment of the present invention.

FIG. 5 is a side view schematically showing the scribing unit shown in FIG. 4.

FIG. 6 is a side view schematically showing the breaking part shown in FIG. 4.

7 is a perspective view of the transfer unit shown in FIG. 6.

8 is a plan view of the transfer unit of FIG. 7.

FIG. 9 is a side view illustrating a positional relationship between the suction unit and the pressing unit illustrated in FIG. 8.

FIG. 10 is a flowchart illustrating a process of cutting a mother substrate assembly using the substrate cutting system illustrated in FIG. 4.

FIG. 11 is a process diagram schematically illustrating a process of scribing a mother substrate assembly by the scribing unit illustrated in FIG. 5.

12 and 13 are process diagrams schematically illustrating a process of separating a unit cell from a mother substrate assembly by the transfer unit shown in FIG. 7.

FIG. 14 is a plan view illustrating a state in which the transfer unit illustrated in FIG. 12 is seated on a mother substrate assembly.

15 is a perspective view showing a transfer unit according to another embodiment of the present invention.

16 is a perspective view illustrating the pressing unit illustrated in FIG. 15.

FIG. 17 is a cross-sectional view illustrating cut line II-II ′ of FIG. 16.

Explanation of symbols on the main parts of the drawings

100: mother substrate assembly 200: loading assembly

300: scribing assembly 400: breaking assembly

500: Substrate Cutting System

Claims (21)

Body; And It is installed on the back of the body, and includes a scribe line at least two receiving portion for separating the cutting object formed along the scribe line and receiving and conveying a specific portion from the cutting object, Each receiving part, An adsorption unit configured to vacuum-adsorb an upper surface of the cutting object; And Pressurized to press the collet region of the cutting object, which is installed adjacent to the adsorption part and is not received by the adsorption part, in a braking step of separating the cutting object along the scribe line in a direction opposite to the adsorption direction of the adsorption part. Transfer unit for a cutting device comprising a portion. The conveying unit of claim 1, wherein the receiving parts comprise at least two receiving parts disposed diagonally to each other. 3. The method of claim 2, wherein the pressing part is disposed at a portion where two scribe lines meet each other in contact with the cutting object during the breaking process, and has the same shape as a contact portion of the two scribe lines when viewed in a plan view. Transfer unit for cutting device characterized in that. The transfer unit for cutting device according to claim 2, wherein the pressing portion has a cramped surface in contact with the cutting object. The transfer unit for cutting apparatus according to claim 1, wherein the lower end of the pressing portion is located further below the rear surface of the suction portion in close contact with the cutting object when viewed from the side. The transfer unit of claim 5, wherein the pressing unit is made of an elastic material. The method of claim 5, wherein the pressing unit, A pusher unit for pressurizing the cutting object during a braking process; A spring member for adjusting the vertical position of the pusher; And And a support shaft connecting the pusher portion and the spring member. The method of claim 1, And a moving shaft coupled to the upper portion of the body to change the vertical position and the horizontal position of the body. Body; And At least two pieces of the mother substrate assembly disposed on the rear surface of the body and having a scribe line formed therein are cut along the scribe line and separated into a plurality of unit panels each forming a flat panel display panel, and picking up and transferring each unit panel. Including wealth, Each receiving part, An adsorption unit configured to vacuum-adsorb an upper surface of the mother substrate assembly; And The adsorption direction of the adsorption unit is arranged adjacent to the adsorption unit, and the collet region of the mother substrate assembly positioned outside the cell region forming the unit panel during the braking process of separating the mother substrate assembly along the scribe line. And a pressurizing portion for pressing in the opposite direction to the cutting device. 10. The transfer unit of claim 9, wherein at least two receivers are disposed diagonally to each other. The transfer unit of claim 10, wherein the pressing portion has a shape in which the surface of the pressing portion contacts the mother substrate assembly has the same shape as an edge of the cell region. The transfer unit of claim 10, wherein the pressing portion has a cramped shape in contact with the mother substrate assembly. 10. The transfer unit of claim 9, wherein the lower end portion of the pressing portion is located below the rear surface of the suction portion in close contact with the mother substrate assembly when viewed from the side. The cutting unit transfer unit of claim 13, wherein the pressing unit is made of an elastic material. The method of claim 13, wherein the pressing unit, A pusher unit for pressurizing the mother substrate assembly during a braking process; A spring member for adjusting the vertical position of the pusher; And And a support shaft connecting the pusher portion and the spring member. 10. The method of claim 9, And a moving shaft coupled to the upper portion of the body to change the vertical position and the horizontal position of the body. A scribing unit to form a scribe line on a surface of the mother substrate assembly to form a plurality of unit panels each of which cuts the mother substrate assembly to form a flat panel display panel; And And a braking unit including a transfer unit configured to cut a mother substrate assembly having a scribe line along the scribe line, to separate the unit panels, and to pick up and transfer each unit panel. The transfer unit, Body; And At least two receiving unit is installed on the back of the body, Each receiving part, An adsorption unit configured to vacuum-adsorb an upper surface of the mother substrate assembly; And The adsorption direction of the adsorption unit is arranged adjacent to the adsorption unit, and the collet region of the mother substrate assembly positioned outside the cell region forming the unit panel during the braking process of separating the mother substrate assembly along the scribe line. Cutting device comprising a pressing portion for pressing in the opposite direction. The method of claim 19, The breaking part, A support member on which the mother substrate assembly is seated; And Located at one side of the support member, and further comprising a crushing unit for crushing the remaining collets after the unit panels are separated from the mother substrate assembly, And said transfer unit is installed on top of said support member. Forming a scribe line on a surface of the mother substrate assembly to cut the mother substrate assembly to form a plurality of unit panels each forming a flat panel display panel; And Cutting the scribe line formed mother substrate assembly along the scribe line and simultaneously receiving the unit panel from the mother substrate assembly and drawing it out. The method of claim 19, wherein receiving the unit panel comprises: At the same time as the vacuum suction of the cell region of the mother substrate assembly forming the unit panel while pressing the collet region of the mother substrate assembly located outside the cell region in a direction opposite to the vacuum adsorption direction to the cell region and the Cutting the cullet regions from each other; And And cutting out the vacuum-adsorbed unit panel to the outside. The method of claim 19, wherein after receiving the unit panel, And cutting the cullets generated during the cutting of the mother substrate assembly.
KR1020080109461A 2008-11-05 2008-11-05 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same KR101160166B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020080109461A KR101160166B1 (en) 2008-11-05 2008-11-05 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same
JP2009243365A JP5088637B2 (en) 2008-11-05 2009-10-22 CUTTING DEVICE TRANSFER UNIT AND CUTTING DEVICE HAVING THE SAME
CN2009102106118A CN101734849B (en) 2008-11-05 2009-11-03 Transferring unit for cutting apparatus, cutting apparatus and method of cutting using the same
TW098137411A TWI388487B (en) 2008-11-05 2009-11-04 A cutting unit for the cutting device, a cutting device having the unit, and a cutting method using the unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080109461A KR101160166B1 (en) 2008-11-05 2008-11-05 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same

Publications (2)

Publication Number Publication Date
KR20100050254A true KR20100050254A (en) 2010-05-13
KR101160166B1 KR101160166B1 (en) 2012-06-28

Family

ID=42276428

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080109461A KR101160166B1 (en) 2008-11-05 2008-11-05 Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same

Country Status (4)

Country Link
JP (1) JP5088637B2 (en)
KR (1) KR101160166B1 (en)
CN (1) CN101734849B (en)
TW (1) TWI388487B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101435136B1 (en) * 2012-12-28 2014-09-01 (주)모아텍 Device for Fixing Substrate or Film
US9418894B2 (en) * 2014-03-21 2016-08-16 Semiconductor Components Industries, Llc Electronic die singulation method
KR101558249B1 (en) 2015-07-31 2015-10-12 주식회사 톱텍 separation device of edge scrap for touch panel
CN107009265A (en) * 2017-03-28 2017-08-04 江苏京创先进电子科技有限公司 Cutting machine vacuum suction disc work bench device and its course of work
KR102490923B1 (en) 2017-09-28 2023-01-26 삼성디스플레이 주식회사 Display panel and manufacturing method of the same
KR102500677B1 (en) * 2017-11-24 2023-02-16 삼성디스플레이 주식회사 Processing apparatus for display device and processing method for display device
KR20200144168A (en) * 2019-06-17 2020-12-29 주식회사 탑 엔지니어링 Substrate transporting head
CN110182640B (en) * 2019-06-21 2020-08-28 温州海蓝工业设计有限公司 Printed matter blanking stacking machine and stacking method thereof
CN112624589B (en) * 2020-12-18 2022-12-20 湖北骏腾拓达光电有限公司 Cutting equipment is used in processing of computer screen panel

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834099B2 (en) * 1996-04-05 2006-10-18 中村留精密工業株式会社 LCD glass plate cutting device
JP3368246B2 (en) * 2000-02-23 2003-01-20 株式会社白井▲鉄▼工所 LCD panel folding device
JP4566472B2 (en) * 2001-07-23 2010-10-20 カワサキプラントシステムズ株式会社 Sheet glass cleaving mechanism and trimming device
KR100563836B1 (en) 2003-08-30 2006-03-28 주식회사 에쎌텍 Brittleness Material Cutting Apparatus and Its Cutting Method
JP4739024B2 (en) * 2003-12-04 2011-08-03 三星ダイヤモンド工業株式会社 Substrate processing method, substrate processing apparatus, substrate transport mechanism, and substrate separation apparatus
KR100663865B1 (en) 2005-08-31 2007-01-03 엘지전자 주식회사 Glass scribing device for flat panel display and method thereof
JP5100156B2 (en) * 2007-03-02 2012-12-19 シャープ株式会社 Method for recovering glass substrates of waste liquid crystal panels
KR100855876B1 (en) 2007-04-12 2008-09-03 세메스 주식회사 A scribing unit and an apparatus scribing a panel with the unit, and a scribing method and a method manufacturing substrates

Also Published As

Publication number Publication date
JP5088637B2 (en) 2012-12-05
JP2010113351A (en) 2010-05-20
CN101734849A (en) 2010-06-16
CN101734849B (en) 2013-04-24
KR101160166B1 (en) 2012-06-28
TW201022117A (en) 2010-06-16
TWI388487B (en) 2013-03-11

Similar Documents

Publication Publication Date Title
KR101160166B1 (en) Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same
TWI424224B (en) Method for processing a mother board
KR101105631B1 (en) Substrate processing system
WO2014002535A1 (en) Semiconductor device manufacturing method
JP6558646B2 (en) Substrate adsorption device, substrate bonding apparatus and method, and electronic device manufacturing method
KR101052817B1 (en) Substrate separation apparatus, substrate cutting system having same and substrate cutting method using same
TWI423938B (en) Method of picking up unit display panel from mother substrate
KR100955375B1 (en) Apparatus for transferring a liquid crystal display panel
KR102400550B1 (en) Breaking system for attached substrate
TW201714721A (en) Substrate dividing device and substrate dividing method
CN100529873C (en) System and method for removing blank glass from panel
TW201718211A (en) Substrate breaking apparatus that can reliably form good cracks and easily remove end material with a wider optimum range of the press-fitting amount when breaking a bonded substrate
TWI822930B (en) Manufacturing method and manufacturing device of glass film and manufacturing method of electronic components including glass film
CN110504296B (en) Preparation method of flexible display screen and flexible display screen
TW201718427A (en) Method for producing glass film, and method for producing electronic device including glass film
KR102572801B1 (en) Apparatus of supporting debonding and method for debonding using the same
KR101308004B1 (en) Apparatus for transferring a liquid crystal display panel and method of separating substrate using thereof
CN102496600A (en) manufacturing method of flexible display panel
KR101313092B1 (en) Work picking apparatus and method using the same
KR102068032B1 (en) Scribe apparatus
JP5133436B2 (en) Manufacturing method of liquid crystal panel
CN106045292A (en) Scribing apparatus
KR20050054336A (en) Apparatus and method of breaking liquid crystal display panel
JP2003133367A (en) Mounting device
CN117500325A (en) Display panel, preparation method, production equipment and display device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee