TWI822930B - Manufacturing method and manufacturing device of glass film and manufacturing method of electronic components including glass film - Google Patents
Manufacturing method and manufacturing device of glass film and manufacturing method of electronic components including glass film Download PDFInfo
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- TWI822930B TWI822930B TW108146773A TW108146773A TWI822930B TW I822930 B TWI822930 B TW I822930B TW 108146773 A TW108146773 A TW 108146773A TW 108146773 A TW108146773 A TW 108146773A TW I822930 B TWI822930 B TW I822930B
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- 239000011521 glass Substances 0.000 title claims abstract description 236
- 238000004519 manufacturing process Methods 0.000 title claims description 60
- 238000001179 sorption measurement Methods 0.000 claims abstract description 135
- 238000000926 separation method Methods 0.000 claims abstract description 21
- 206010040844 Skin exfoliation Diseases 0.000 claims description 193
- 238000000034 method Methods 0.000 claims description 36
- 230000008602 contraction Effects 0.000 claims description 19
- 230000006837 decompression Effects 0.000 claims description 9
- 239000005357 flat glass Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 238000005401 electroluminescence Methods 0.000 description 38
- 239000006059 cover glass Substances 0.000 description 18
- 238000005452 bending Methods 0.000 description 17
- 239000010410 layer Substances 0.000 description 13
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 230000003014 reinforcing effect Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000003513 alkali Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000003280 down draw process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- 238000005096 rolling process Methods 0.000 description 1
- 229920006268 silicone film Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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- Electroluminescent Light Sources (AREA)
- Formation Of Insulating Films (AREA)
- Liquid Crystal (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Laminated Bodies (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
於將支持體1及玻璃膜2中的其中一個工件從另一個工件剝離而將積層體3分離為支持體1及玻璃膜2的分離步驟S3中,使用安裝有伸縮囊14的吸附墊13,藉由減壓利用吸附墊13來吸附其中一個工件,並且使伸縮囊14收縮,對其中一個工件賦予自另一個工件的剝離力F。In the separation step S3 of peeling one of the support 1 and the glass film 2 from the other work and separating the laminated body 3 into the support 1 and the glass film 2, the adsorption pad 13 equipped with the telescopic bag 14 is used. By reducing the pressure, the adsorption pad 13 is used to adsorb one of the workpieces, and the telescopic bag 14 is contracted, thereby imparting a peeling force F to one of the workpieces from the other workpiece.
Description
本發明是有關於一種玻璃膜的製造方法與製造裝置以及包含玻璃膜之電子元件的製造方法,尤其有關於一種用以將玻璃膜從支持體上剝離的技術。 The present invention relates to a manufacturing method and device of a glass film and a manufacturing method of an electronic component containing a glass film. In particular, the present invention relates to a technology for peeling a glass film from a support.
近年來,就省空間化的觀點而言,液晶顯示器(liquid crystal display)、電漿顯示器(plasma display)、有機電致發光(electroluminescence,EL)顯示器、場發射顯示器(field emission display)等平板顯示器正在普及,以代替先前普及的陰極射線管(cathode-ray tube,CRT)型顯示器。而且,對該些平板顯示器要求進一步的薄型化。 In recent years, from the perspective of space saving, flat panel displays such as liquid crystal displays, plasma displays, organic electroluminescence (EL) displays, and field emission displays have It is becoming popular to replace the previously popular cathode-ray tube (CRT) type display. Furthermore, these flat panel displays are required to be further thinned.
尤其對於有機EL顯示器或有機EL照明,可利用其厚度尺寸非常小(薄)的特點,使其具有能夠摺疊、或捲繞的功能。藉此,不僅搬運變得容易,而且除了現有的平面狀態以外,還能以曲面狀態來使用,因此期待於多種用途中的靈活運用。因此,對該些電子元件所使用的玻璃基板或蓋玻璃(cover glass)要求進一步提高可撓性。 Especially for organic EL displays or organic EL lighting, its very small (thin) thickness can be used to enable folding or rolling functions. This not only makes transportation easier, but also allows it to be used in a curved state in addition to the existing flat state, so it is expected to be used flexibly in a variety of uses. Therefore, the flexibility of the glass substrate or cover glass used in these electronic components is required to be further improved.
為了對玻璃基板賦予可撓性,有效的是使玻璃基板變
薄。此處,例如專利文獻1中提出有厚度尺寸為200μm以下的玻璃膜,藉此,可對玻璃基板賦予能以曲面狀態來使用的程度的高可撓性。
In order to impart flexibility to the glass substrate, it is effective to make the glass substrate
Thin. Here, for example,
另一方面,對平板顯示器或太陽電池等電子元件所使用的玻璃基板,實施二次加工或洗淨等各種電子元件製造相關的處理。但,若使該些電子元件所使用的玻璃基板變薄,則由於玻璃為脆性材料,故而產生由於少許應力變化而導致破損的情況,於進行電子元件製造相關處理時,存在操作變得非常困難的問題。除此以外,厚度尺寸為200μm以下的玻璃膜富有可撓性,因此亦有於實施各種製造相關處理時難以進行定位(例如於圖案化時產生偏移)的問題。 On the other hand, glass substrates used in electronic components such as flat panel displays and solar cells are subjected to various processes related to the manufacturing of electronic components, such as secondary processing and cleaning. However, if the glass substrate used in these electronic components is made thinner, since the glass is a brittle material, it may be damaged due to slight stress changes, which may make the operation very difficult during processing related to the manufacture of electronic components. problem. In addition, the glass film with a thickness of 200 μm or less is highly flexible, so it also has the problem of being difficult to position when performing various manufacturing-related processes (for example, deviation occurs during patterning).
關於所述問題,例如專利文獻2中提出有一種積層體,其是將玻璃膜、與作為支持此玻璃膜的支持體的支持玻璃進行積層且相互固定而成。若於如上所述將玻璃膜設為積層體的狀態下,對此積層體實施各種製造相關處理,則即便是在單體狀態下使用缺乏強度或剛性的玻璃膜的情況,支持玻璃亦作為增強材料而發揮作用,因此於各處理時能夠作為積層體而容易進行定位。另外,處理結束後,藉由從支持玻璃上剝離玻璃膜,能夠最終僅取得經實施所需處理的玻璃膜。進一步而言,藉由將包含玻璃膜的積層體的厚度尺寸設為與現有(現存)的玻璃基板的厚度尺寸相同或其以上,能夠期待可將現有的玻璃基板用的生產線作為電子元件用生產線來使用(共用)的優點。
Regarding the above problem, for example,
此處,作為用以從支持玻璃上剝離玻璃膜的方法,先前已知如下方法:藉由將支持玻璃與玻璃膜中的其中一者,向與支持玻璃和玻璃膜的界面正交的方向(法線方向)拉伸,而從支持玻璃上剝離玻璃膜。然而,此方法基本是對玻璃膜等(玻璃膜或支持玻璃)強行施加撓曲變形,因此存在於界面以外的區域產生不需要的彎曲力矩,產生破裂等破損的顧慮。 Here, as a method for peeling off the glass film from the supporting glass, the following method has been previously known: by moving one of the supporting glass and the glass film in a direction orthogonal to the interface between the supporting glass and the glass film ( normal direction) and peel the glass film from the supporting glass. However, this method basically imposes flexural deformation on the glass film or the like (glass film or supporting glass), so there is a concern that unnecessary bending moments may occur in areas other than the interface, leading to damage such as cracking.
為了解決所述問題,例如專利文獻3中提出有如下方法:於將增強板(支持體)的上表面以可撓性板來吸附的狀態下,使以既定的間隔固定於可撓性板的上側的多個可動體依序上升,藉此從增強板上剝離基板(玻璃膜)。另外,此時提出有如下結構:於可動體的基端側連結有球接頭(ball joint),藉此使可動體能追隨可撓性板的撓曲變形而傾動。
In order to solve the above problem, for example,
[現有技術文獻] [Prior art documents]
[專利文獻] [Patent Document]
[專利文獻1]日本專利特開2010-132531號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-132531
[專利文獻2]國際公開2011/048979號公報 [Patent Document 2] International Publication No. 2011/048979
[專利文獻3]日本專利特開2014-141344號公報 [Patent Document 3] Japanese Patent Application Publication No. 2014-141344
如上所述,依據專利文獻3所記載的剝離裝置,能夠使固定於將基板或增強板加以吸附保持的可撓性板上的可動體,追隨可撓性板的撓曲變形而傾動,因此能夠於不會由可動體對可撓性板
施加過度的力的情況下,使可撓性板撓曲變形。因此,對由此可撓性板所吸附保持的基板或增強板所產生的不需要的彎曲力矩(bending moment)加以抑制,實現防止此基板或增強板的破裂。
As described above, according to the peeling device described in
另一方面,若欲儘量排除玻璃膜等所產生的不需要的彎曲力矩,則理想為將吸附構件由多個吸附墊來構成,而不是如專利文獻3所記載的可撓性板。此處,通常,吸附墊是藉由將與吸附對象面(玻璃膜等的表面)之間的空間進行減壓來吸附玻璃膜等,因此對吸附墊,必須連接用以減壓的排氣管。然而,於將專利文獻3所記載的傾動結構應用於吸附墊,對利用球接頭且以可傾動的方式來支持吸附墊的結構進行研究的情況下,球接頭成為阻礙,用以對吸附墊連接排氣管的空間受到限制。因此,難以將專利文獻3所記載的傾動結構應用於多個吸附墊。另外,於應用專利文獻3所記載的傾動結構的情況下,需要多個吸附墊、與吸附墊相同數量的球接頭、以及使該些多個吸附墊及球接頭獨立升降的多個驅動裝置(氣缸(cylinder)等),因此結構複雜化,並且無法避免設備成本的高漲。
On the other hand, if unnecessary bending moments generated by glass films or the like are to be eliminated as much as possible, it is desirable to configure the adsorption member with a plurality of adsorption pads instead of the flexible plate described in
鑒於以上情況,本發明所應解決的技術性課題為,藉由使用簡易結構的裝置,有效地實現抑制玻璃膜等所產生的不需要的彎曲力矩,從而安全地從支持體上剝離玻璃膜。 In view of the above, the technical problem to be solved by the present invention is to effectively suppress the unnecessary bending moment generated by the glass film and the like by using a device with a simple structure, thereby safely peeling the glass film from the support.
所述課題的解決是利用本發明的玻璃膜的製造方法來達成。即,此製造方法包括:準備步驟,準備經實施製造相關處 理的玻璃膜積層於支持玻璃膜的支持體上的狀態的積層體;以及分離步驟,將支持體與玻璃膜中的其中一個工件從另一個工件剝離,將所準備的積層體分離為支持體及玻璃膜,所述玻璃膜的製造方法中,於分離步驟中,使用安裝有伸縮囊的吸附墊,藉由減壓且利用吸附墊來吸附其中一個工件,並且使伸縮囊收縮,對其中一個工件賦予自另一個工件的剝離力。此外,此處所謂的「製造相關處理」中,當然包括對玻璃膜直接實施某些加工的處理,還廣泛包括其他構件的安裝、或玻璃膜表面的洗淨等用以間接地使玻璃膜或者包含玻璃膜的元件接近最終製品(出貨狀態)的處理。 The above-described problem is solved by using the glass film manufacturing method of the present invention. That is, this manufacturing method includes: preparation steps to prepare for implementation of manufacturing-related processes a laminated body in which a prepared glass film is laminated on a support that supports the glass film; and a separation step in which one of the support and the glass film is peeled off from the other, and the prepared laminated body is separated into the support. and a glass film. In the manufacturing method of the glass film, in the separation step, an adsorption pad equipped with a telescopic bag is used, and one of the workpieces is adsorbed by reducing the pressure and using the adsorption pad, and the telescopic bag is contracted, and one of the workpieces is The peeling force imparted by a workpiece from another workpiece. In addition, the so-called "manufacturing-related processing" here includes, of course, processing that directly performs some processing on the glass film, and also widely includes the installation of other components, or the cleaning of the glass film surface to indirectly make the glass film or Processing of components containing glass films close to final products (shipping state).
如上所述,本發明的玻璃膜的製造方法中,使用安裝有伸縮囊的吸附墊,藉由減壓且利用吸附墊來吸附其中一個工件,並且使伸縮囊收縮,對其中一個工件賦予自另一個工件的剝離力,因此可藉由伸縮囊的變形而容易使吸附墊傾動至比較大的角度。因此,可有效地抑制由吸附墊所吸附的玻璃膜等可能產生的不需要的彎曲力矩,防止玻璃膜等的破裂。另外,藉由利用吸附墊來吸附玻璃膜,並且藉由伸縮囊的收縮來對玻璃膜等賦予剝離力,能夠利用例如共通的排氣用驅動部來實行吸附運作及剝離力的賦予運作。當然,若為伸縮囊,則能夠經由其內部空間而將吸附墊連接於排氣用驅動部,因此亦不擔憂受到空間上的限制。根據以上,依據本發明的玻璃膜的製造方法,可使裝置的結構簡化,可於不會導致成本上升的的情況下實施難以產生破裂的剝離。 As described above, in the manufacturing method of the glass film of the present invention, an adsorption pad equipped with a telescopic bag is used, and one of the workpieces is adsorbed by reducing the pressure and using the adsorption pad, and the telescopic bag is contracted, so that one of the workpieces is given a self-propelled function. The peeling force of a workpiece can easily cause the adsorption pad to tilt to a relatively large angle through the deformation of the telescopic bag. Therefore, unnecessary bending moment that may be generated by the glass film or the like adsorbed by the adsorption pad can be effectively suppressed, and breakage of the glass film or the like can be prevented. In addition, the adsorption pad is used to adsorb the glass film, and the contraction of the telescopic bag is used to impart peeling force to the glass film and the like. For example, the adsorption operation and the peeling force imparting operation can be performed using a common exhaust driving unit. Of course, in the case of a telescopic bag, the adsorption pad can be connected to the exhaust driving unit via the internal space, so there is no need to worry about being limited by space. From the above, according to the manufacturing method of the glass film of the present invention, the structure of the device can be simplified, and peeling that is difficult to cause cracks can be performed without causing an increase in cost.
另外,本發明的玻璃膜的製造方法中,亦可沿著剝離發展方向而配置多個吸附墊,利用剝離發展後方側的吸附墊來吸附其中一個工件,使伸縮囊開始收縮後,利用與剝離發展後方側的吸附墊鄰接的剝離發展前方側的吸附墊來吸附其中一個工件,使伸縮囊開始收縮。 In addition, in the manufacturing method of the glass film of the present invention, a plurality of adsorption pads can also be arranged along the peeling development direction, and the adsorption pad on the rear side of the peeling development can be used to adsorb one of the workpieces, so that the telescopic bag starts to shrink, and then the use and peeling Develop the adsorption pad on the rear side to adjoin and peel off the adsorption pad on the front side to adsorb one of the workpieces, causing the telescopic bag to begin to shrink.
藉由如上所述來構成,可於剝離發展至因伸縮囊的收縮而上升的剝離發展後方側的吸附墊正下方,剝離超過正下方而發展的狀態下,對其中一個工件中的下一吸附墊正下方的部分賦予剝離力。因此,能夠順利地將其中一個工件從剝離區域或者接近剝離區域的一側依序剝離,藉此,可更有效地抑制不需要的力矩的發生,實現穩定的剝離發展。 By configuring it as described above, it is possible to adsorb the next piece of one of the workpieces in a state where the peeling has progressed to the point directly below the adsorption pad on the rear side of the peeling that has risen due to the contraction of the bellows, and the peeling has progressed beyond the point directly below. The part directly underneath the pad gives the peeling force. Therefore, one of the workpieces can be smoothly peeled off from the peeling area or the side close to the peeling area, thereby more effectively suppressing the generation of unnecessary moments and achieving stable peeling development.
另外,於如上所述使多個吸附墊依序工作的情況下,本發明的玻璃膜的製造方法中,亦可以藉由安裝於剝離發展後方側的吸附墊上的伸縮囊的收縮,剝離發展區域至少到達剝離發展前方側的吸附墊的正下方為條件,開始利用剝離發展前方側的吸附墊來吸附其中一個工件以及使伸縮囊開始收縮。 In addition, in the case where a plurality of adsorption pads are sequentially operated as described above, in the method of manufacturing a glass film of the present invention, the peeling development area can also be controlled by contraction of the telescopic bag installed on the adsorption pad on the rear side of the peeling development. On the condition that it reaches at least directly under the adsorption pad on the front side of peeling development, the adsorption pad on the front side of peeling development starts to absorb one of the workpieces and the telescopic bag starts to shrink.
以如上所述,剝離區域到達剝離發展前方側的吸附墊的正下方為條件,藉由對其中一個工件中的所述吸附墊的正下方的部分賦予剝離力,可使剝離更順利地發展。另外,由於已成為其中一個工件中的吸附墊正下方的至少一部分從另一個工件剝離的狀態,故而可進而抑制其中一個工件可能產生的不需要的彎曲力矩,可順利地剝離其中一個工件。 As described above, on the condition that the peeling area reaches directly under the adsorption pad on the front side of the peeling development, peeling can be promoted more smoothly by applying a peeling force to the portion directly under the suction pad in one of the workpieces. In addition, since at least a part of the workpiece directly below the suction pad is peeled off from the other workpiece, unnecessary bending moment that may occur in one of the workpieces can be further suppressed, and one of the workpieces can be peeled off smoothly.
另外,本發明的玻璃膜的製造方法中,亦可使用可將吸附墊相對於其中一個工件的高度位置加以變更的高度位置變更裝置,來調整伸縮囊的減壓時的收縮量。 In addition, in the manufacturing method of the glass film of the present invention, a height position changing device that can change the height position of the adsorption pad with respect to one of the workpieces can be used to adjust the shrinkage amount of the telescopic bag during decompression.
如上所述,藉由使用高度位置變更裝置來調整伸縮囊的減壓時的收縮量,能夠將剝離發展時的其中一個工件的提拉量控制為所需範圍。因此,對其中一個工件賦予適度的彎曲變形(撓曲變形),同時可使剝離順利地發展。 As described above, by using the height position changing device to adjust the amount of contraction of the bellows during decompression, the amount of lifting of one of the workpieces when peeling progresses can be controlled to a desired range. Therefore, while imparting moderate bending deformation (flexural deformation) to one of the workpieces, peeling can be smoothly advanced.
另外,於本發明的玻璃膜的製造方法中,其中一個工件呈矩形狀,分離步驟亦可包括:剝離起點部形成步驟,於其中一個工件的角部形成剝離起點部;第一剝離發展步驟,使剝離起點部沿著其中一個工件的第一邊而發展;以及第二剝離發展步驟,使遍及第一邊全域而發展的剝離發展區域,沿著與第一邊正交的其中一個工件的第二邊而發展。 In addition, in the manufacturing method of the glass film of the present invention, one of the workpieces is in a rectangular shape, and the separation step may also include: a peeling starting point forming step, forming a peeling starting point at a corner of one of the workpieces; a first peeling development step, The peeling starting point is developed along the first side of one of the workpieces; and the second peeling development step is such that the peeling development area that develops throughout the first side is along the third side of one of the workpieces that is orthogonal to the first side. Develop on both sides.
本發明的分離步驟中,例如如公知般亦考慮如下方法,首先於其中一個工件的角部形成剝離起點部,其次,沿著呈矩形狀的其中一個工件的對角線而使剝離起點部發展,從而將吸附墊依序提拉。另一方面,如上所述,於其中一個工件的角部形成剝離起點部,且利用本發明的方法來使剝離起點部發展的情況下,已判明較沿著對角線使剝離起點部發展而言,於向沿著呈矩形狀的其中一個工件的邊的方向伸展的情況下,剝離發展形態更穩定。因此,如上所述,沿著其中一個工件的第一邊而使剝離起點部發展,繼而使遍及第一邊全域而發展的剝離區域沿著與第一邊 正交的第二邊而發展,藉此可使剝離更穩定地發展。 In the separation step of the present invention, for example, as is known, the method of first forming a peeling starting point at a corner of one of the workpieces and secondly developing the peeling starting point along the diagonal of one of the rectangular workpieces is also considered. , thereby lifting the adsorption pads in sequence. On the other hand, as described above, when the peeling starting point is formed at the corner of one of the workpieces and the peeling starting point is developed using the method of the present invention, it has been found that the peeling starting point is more effective than if the peeling starting point is developed along the diagonal line. In other words, when extending in the direction along one of the sides of the rectangular workpiece, the peeling development pattern is more stable. Therefore, as described above, the peeling starting point develops along the first side of one of the workpieces, and then the peeling area develops over the entire first side along the first side. It develops along the orthogonal second side, whereby the peeling can develop more stably.
另外,於如上所述沿著各邊而使剝離發展的情況下,本發明的玻璃膜的製造方法中,亦可於第一剝離發展步驟中,使用安裝有相對容易變形的伸縮囊來作為伸縮囊的吸附墊,且於第二剝離發展步驟中,使用安裝有相對難以變形的伸縮囊來作為伸縮囊的吸附墊。 In addition, when peeling proceeds along each side as described above, in the manufacturing method of the glass film of the present invention, in the first peeling development step, a telescopic bag equipped with a relatively easy deformation can also be used as a telescopic bag. The adsorption pad of the bag, and in the second peeling development step, a telescopic bag installed with a relatively difficult deformation is used as the adsorption pad of the telescopic bag.
如上所述,於使形成於其中一個工件的角部的剝離起點部沿著第一邊而發展的情況,以及沿著與第一邊正交的第二邊而使剝離發展區域發展的情況下,藉由將變形的容易度不同的兩種伸縮囊分開使用,可更迅速且穩定地實現剝離發展。 As described above, in the case where the peeling starting point formed at the corner of one of the workpieces is developed along the first side, and in the case where the peeling development area is developed along the second side orthogonal to the first side , by using two types of expansion bladders with different degrees of deformation separately, peeling development can be achieved more quickly and stably.
另外,本發明的玻璃膜的製造方法中,支持體亦可為板狀玻璃。另外,於此情況下,積層體中,板狀玻璃與玻璃膜亦可直接密合。 Moreover, in the manufacturing method of the glass film of this invention, the support may be plate-shaped glass. In addition, in this case, the plate glass and the glass film may be directly adhered to each other in the laminated body.
藉由如上所述將支持體設為板狀玻璃,能夠低成本地製造面精度優異的支持體。另外,藉由如上所述使面精度優異的板狀玻璃與玻璃膜直接密合,可將玻璃膜固定於支持體而不會偏移,而且可藉由本發明而確實且安全地使玻璃膜從作為支持體的板狀玻璃上剝離。 By using the support as plate glass as described above, a support excellent in surface accuracy can be produced at low cost. In addition, by directly bonding the plate glass with excellent surface accuracy to the glass film as described above, the glass film can be fixed to the support without shifting, and the present invention can reliably and safely remove the glass film from the support. Peeling from plate glass as support.
另外,所述課題的解決亦可藉由本發明的玻璃膜的製造裝置來達成。即,此製造裝置包括剝離裝置,所述剝離裝置用以將玻璃膜積層於支持玻璃膜的支持體上的狀態下的積層體的支持體與玻璃膜中的其中一個工件從另一個工件剝離,所述玻璃膜的 製造裝置中,剝離裝置包括吸附其中一個工件的吸附墊,而且於吸附墊上安裝有伸縮囊;並且吸附墊構成為:藉由減壓而吸附其中一個工件,而且使伸縮囊收縮,對其中一個工件賦予自另一個工件的剝離力。 In addition, the above-mentioned problem can also be solved by the glass film manufacturing apparatus of the present invention. That is, this manufacturing apparatus includes a peeling device for peeling one of the workpiece of the support body of the laminate and the glass film from the other workpiece in a state where the glass film is laminated on the support body that supports the glass film, The glass film In the manufacturing device, the peeling device includes an adsorption pad that adsorbs one of the workpieces, and a telescopic bag is installed on the adsorption pad; and the adsorption pad is configured to adsorb one of the workpieces by reducing pressure, and shrink the telescopic bag to compress one of the workpieces. Peeling force imparted from another workpiece.
如上所述,於本發明的玻璃膜的製造裝置中,亦使用安裝有伸縮囊的吸附墊,藉由減壓且利用吸附墊來吸附其中一個工件,並且使伸縮囊收縮,對其中一個工件賦予自另一個工件的剝離力,因此可藉由伸縮囊的變形而容易使吸附墊傾動至比較大的角度。因此,可有效地抑制由吸附墊所吸附的玻璃膜等可能產生的不需要的彎曲力矩,可防止玻璃膜等的破裂。另外,利用吸附墊來吸附玻璃膜,並且藉由伸縮囊的收縮而對玻璃膜等賦予剝離力,藉此,可利用例如共通的排氣用驅動部來實行吸附運作及剝離力的賦予運作。根據以上,依據本發明的製造裝置,可使裝置的結構簡化,可於不導致成本上升的情況下實施難以產生破裂的剝離。 As mentioned above, in the glass film manufacturing device of the present invention, an adsorption pad equipped with a telescopic bag is also used. By reducing the pressure and using the adsorption pad to adsorb one of the workpieces, and shrinking the telescopic bag, one of the workpieces is given The peeling force from another workpiece can easily tilt the adsorption pad to a relatively large angle through the deformation of the telescopic bag. Therefore, unnecessary bending moment that may occur in the glass film or the like adsorbed by the adsorption pad can be effectively suppressed, and breakage of the glass film or the like can be prevented. In addition, the adsorption pad is used to adsorb the glass film, and the contraction of the telescopic bag imparts a peeling force to the glass film, etc. Thereby, for example, a common exhaust driving unit can be used to perform the adsorption operation and the peeling force imparting operation. From the above, according to the manufacturing device of the present invention, the structure of the device can be simplified, and peeling that is less likely to cause cracks can be performed without causing an increase in cost.
另外,所述課題的解決亦可藉由本發明的電子元件的製造方法來達成。即,此製造方法包括:準備步驟,準備帶有支持體的電子元件,其為安裝有電子元件要素的玻璃膜積層於支持玻璃膜的支持體上的狀態下的積層體;以及分離步驟,將支持體與玻璃膜中的其中一個工件從另一個工件剝離,將所準備的帶有支持體的電子元件分離為包含玻璃膜之電子元件及支持體,所述電子元件的製造方法中,於分離步驟中,使用安裝有伸縮囊的吸附 墊,藉由減壓且利用吸附墊來吸附其中一個工件,並且使伸縮囊收縮,對其中一個工件賦予自另一個工件的剝離力。 In addition, the above-mentioned problems can also be solved by the manufacturing method of the electronic component of the present invention. That is, this manufacturing method includes: a preparation step of preparing an electronic component with a support, which is a laminate in a state in which a glass film mounted with electronic component elements is laminated on a support that supports the glass film; and a separation step of preparing an electronic component with a support. One of the workpieces of the support and the glass film is peeled off from the other workpiece, and the prepared electronic component with the support is separated into an electronic component including the glass film and the support. In the method of manufacturing the electronic component, in the separation In this step, use an adsorption device equipped with a telescopic bag The pad absorbs one of the workpieces by reducing the pressure and using the adsorption pad, and contracts the telescopic bag to impart peeling force to one of the workpieces from the other workpiece.
如上所述,於本發明的電子元件的製造方法中,亦使用安裝有伸縮囊的吸附墊,藉由減壓且利用吸附墊來吸附其中一個工件,並且使伸縮囊收縮,對其中一個工件賦予自另一個工件的剝離力,因此可藉由伸縮囊的變形而容易使吸附墊傾動至比較大的角度。因此,可有效地抑制由吸附墊所吸附的玻璃膜等可能產生的不需要的彎曲力矩,可防止玻璃膜等的破裂。另外,不僅利用吸附墊來吸附玻璃膜,而且藉由伸縮囊的收縮來對玻璃膜等賦予剝離力,藉此可藉由例如共通的排氣用驅動部來實行吸附運作及剝離力的賦予運作。根據以上,依據本發明的電子元件的製造方法,可使裝置的結構簡化,可於不導致成本上升的情況下實施難以產生破裂的剝離方法。 As mentioned above, in the manufacturing method of electronic components of the present invention, an adsorption pad equipped with a telescopic bag is also used. By reducing the pressure and using the adsorption pad to adsorb one of the workpieces, and shrinking the telescopic bag, one of the workpieces is given The peeling force from another workpiece can easily tilt the adsorption pad to a relatively large angle through the deformation of the telescopic bag. Therefore, unnecessary bending moment that may occur in the glass film or the like adsorbed by the adsorption pad can be effectively suppressed, and breakage of the glass film or the like can be prevented. In addition, the adsorption pad is not only used to adsorb the glass film, but also the contraction of the telescopic bag is used to impart peeling force to the glass film, etc., whereby the adsorption operation and the peeling force imparting operation can be carried out through, for example, a common exhaust driving unit. . Based on the above, according to the manufacturing method of electronic components of the present invention, the structure of the device can be simplified, and a peeling method that is less likely to cause cracks can be implemented without causing an increase in cost.
如以上所述,依據本發明,藉由使用簡易結構的裝置,有效地實現抑制玻璃膜等所產生的不需要的彎曲力矩,可安全地從支持體上剝離玻璃膜。 As described above, according to the present invention, by using a device with a simple structure, unnecessary bending moments generated by the glass film and the like are effectively suppressed, and the glass film can be safely peeled off from the support.
1:支持體 1:Support
1a、1b、2a、2b:表面 1a, 1b, 2a, 2b: Surface
1c、1d:邊 1c, 1d: side
2:玻璃膜 2: Glass film
3:積層體 3: Laminated body
4:角部 4: Corner
5:有機EL單元 5: Organic EL unit
6:蓋玻璃 6: cover glass
7:有機EL面板 7: Organic EL panel
8:帶有支持體的有機EL面板 8: Organic EL panel with support
9:剝離起點部 9: Peel off the starting point
9':剝離區域 9': peeling area
10:剝離起點部形成構件 10: Peel off the starting point forming member
11:剝離裝置 11: Peeling device
12:保持構件 12: Maintain components
13(13a~13i、13A~13I):吸附墊 13(13a~13i, 13A~13I): adsorption pad
14(14a~14i、14A~14I):伸縮囊 14(14a~14i, 14A~14I): telescopic bag
15:排氣室 15:Exhaust chamber
16:排氣用驅動部 16: Exhaust drive part
17:高度位置變更裝置 17:Height position changing device
18:載置面 18:Placement surface
19:槽 19:Slot
20:抽吸孔 20:Suction hole
21:抽吸裝置 21:Suction device
22:切換閥 22:Switching valve
23:安裝部 23:Installation Department
24:升降驅動部 24:Lifting drive part
25:膜 25:Membrane
31:帶有支持體的液晶面板 31: LCD panel with support
32:液晶面板 32:LCD panel
33:間隔件 33: Spacer
F:剝離力 F: Peeling force
S1:積層體形成步驟 S1: Laminated body formation step
S2:安裝步驟 S2: Installation steps
S3、S3':分離步驟 S3, S3': separation step
S4:剝離起點部形成步驟 S4: peeling starting point forming step
S5:第一剝離發展步驟 S5: First peel development step
S6:第二剝離發展步驟 S6: Second divestiture development step
S7:剝離發展步驟(對角線) S7: Peel Development Steps (Diagonal)
z0:初始收縮量 z0: initial shrinkage
z1:減壓時收縮量 z1: amount of contraction during decompression
D:對角線 D: Diagonal
X、Y:方向 X, Y: direction
圖1是表示本發明的第一實施方式的包含玻璃膜之電子元件的製造方法的順序的流程圖。 FIG. 1 is a flowchart showing the procedure of a method of manufacturing an electronic component including a glass film according to the first embodiment of the present invention.
圖2是表示圖1所示的分離步驟的詳情的的流程圖。 FIG. 2 is a flowchart showing details of the separation step shown in FIG. 1 .
圖3是包含玻璃膜的積層體的剖面圖。 Fig. 3 is a cross-sectional view of a laminated body including a glass film.
圖4是圖3所示的積層體的俯視圖。 FIG. 4 is a plan view of the laminated body shown in FIG. 3 .
圖5是於圖3所示的積層體,安裝作為電子元件要素的有機EL單元而成的帶有支持體的有機EL面板的剖面圖。 FIG. 5 is a cross-sectional view of an organic EL panel with a support in which an organic EL unit as an electronic component element is mounted on the laminate shown in FIG. 3 .
圖6A是用以對圖2所示的剝離起點部形成步驟的一例加以說明的俯視圖。 FIG. 6A is a plan view for explaining an example of the peeling starting point forming step shown in FIG. 2 .
圖6B是用以對圖2所示的剝離起點部形成步驟的一例加以說明的圖6A中的A-A主要部分剖面圖。 FIG. 6B is a cross-sectional view of main parts taken along line A-A in FIG. 6A for explaining an example of the peeling starting point forming step shown in FIG. 2 .
圖7是本發明的第一實施方式的玻璃膜的剝離裝置的俯視圖。 7 is a plan view of the glass film peeling device according to the first embodiment of the present invention.
圖8是圖7所示的剝離裝置的B-B主要部分剖面圖。 FIG. 8 is a cross-sectional view of the main parts of the peeling device shown in FIG. 7 taken along line B-B.
圖9是用以對使用圖7所示的剝離裝置的剝離發展步驟的一例加以說明的B-B主要部分剖面圖。 FIG. 9 is a cross-sectional view of main parts along the line B-B for explaining an example of the peeling development step using the peeling device shown in FIG. 7 .
圖10是用以對使用圖7所示的剝離裝置的剝離發展步驟的一例加以說明的B-B主要部分剖面圖。 FIG. 10 is a B-B main part cross-sectional view for explaining an example of the peeling development step using the peeling device shown in FIG. 7 .
圖11是用以對使用圖7所示的剝離裝置的剝離發展步驟的一例加以說明的俯視圖。 FIG. 11 is a plan view for explaining an example of a peeling development step using the peeling device shown in FIG. 7 .
圖12是用以對本發明的第二實施方式的剝離發展步驟的一例加以說明的俯視圖。 FIG. 12 is a plan view for explaining an example of the peeling development step according to the second embodiment of the present invention.
圖13是製造液晶面板來作為本發明的應用對象即電子元件時的帶有支持體的液晶面板的剖面圖。 13 is a cross-sectional view of a liquid crystal panel with a support when the liquid crystal panel is manufactured as an electronic component to which the present invention is applied.
以下,參照圖1~圖11,對本發明的包含玻璃膜之電子元件的製造方法的第一實施方式進行說明。此外,本實施方式中,以下,列舉如下情況為例來進行說明:於製造作為電子元件的有機EL面板時,藉由玻璃膜與支持體的剝離,將帶有支持體的狀態的有機EL面板分離為有機EL面板及支持體。 Hereinafter, a first embodiment of the method for manufacturing an electronic component including a glass film of the present invention will be described with reference to FIGS. 1 to 11 . In addition, in this embodiment, the following case will be described as an example: when manufacturing an organic EL panel as an electronic component, the organic EL panel with the support is separated by peeling off the glass film and the support. Separated into organic EL panel and support.
如圖1所示,本發明的第一實施方式的電子元件的製造方法包括:積層體形成步驟S1,形成包含玻璃膜的積層體;安裝步驟S2,隨著對玻璃膜的加熱,而於玻璃膜安裝電子元件要素;以及分離步驟S3,將安裝有電子元件要素的積層體分離為包含玻璃膜之電子元件及支持體。其中,積層體形成步驟S1、及安裝步驟S2相當於本發明的準備步驟。 As shown in FIG. 1 , the manufacturing method of electronic components according to the first embodiment of the present invention includes: a laminate forming step S1 to form a laminate including a glass film; and a mounting step S2 to heat the glass film and The film mounts the electronic component elements; and the separation step S3 separates the laminated body on which the electronic component elements are mounted into the electronic component and the support body including the glass film. Among them, the laminated body forming step S1 and the mounting step S2 correspond to the preparation steps of the present invention.
另外,如圖2所示,分離步驟S3包括:於積層體形成剝離起點部的剝離起點部形成步驟S4、第一剝離發展步驟S5、及第二剝離發展步驟S6。以下,對各步驟進行詳細說明。 In addition, as shown in FIG. 2 , the separation step S3 includes a peeling starting point forming step S4 for forming a peeling starting point in the laminated body, a first peeling developing step S5, and a second peeling developing step S6. Each step is explained in detail below.
(S1)積層體形成步驟 (S1) Laminated body formation step
首先,如圖3所示,於支持體1上積層玻璃膜2而形成積層體3。
First, as shown in FIG. 3 , the
此處,玻璃膜2是由例如矽酸鹽玻璃(silicate glass)、二氧化矽玻璃(silica glass)等所形成,較佳為由硼矽酸玻璃(borosilicate glass)形成,更佳為由無鹼玻璃(alkali free glass)形成。若於玻璃膜2中包含鹼成分,則於表面發生陽離子的脫落,可產生所謂的出鹼現象。於此情況下,玻璃膜2產生於結構上變
粗糙的部分,因此,若以彎折的狀態來使用此玻璃膜2,則存在因經年劣化而以變粗糙的部分為起點導致破損的顧慮。由於以上原因,於存在以非平坦狀態來使用玻璃膜2的可能性的情況下,較佳為以無鹼玻璃來形成玻璃膜2。
Here, the
此外,此處所謂的無鹼玻璃,是指實質上不含鹼成分(鹼金屬氧化物)的玻璃,具體而言,是指鹼成分為3000ppm以下的玻璃。當然,就盡量防止或減輕由所述原因引起的經年劣化的觀點而言,較佳為1000ppm以下的玻璃,更佳為500ppm以下的玻璃,尤佳為300ppm以下的玻璃。 In addition, the alkali-free glass here refers to the glass which does not substantially contain an alkali component (alkali metal oxide), specifically, it refers to the glass whose alkali component is 3000 ppm or less. Of course, from the viewpoint of preventing or mitigating the deterioration over time caused by the above reasons as much as possible, the glass is preferably 1000 ppm or less, more preferably 500 ppm or less, and particularly preferably 300 ppm or less.
玻璃膜2的厚度尺寸設定為300μm以下,較佳為設定為200μm以下,更佳為設定為100μm以下。關於厚度尺寸的下限值,可無特別制約地來設定,但若考慮到成形後的操作性(與支持體1的積層時、或者剝離時等)等,則宜設定為1μm以上,較佳為5μm以上。
The thickness dimension of the
支持體1於本實施方式中為板狀玻璃,與玻璃膜2同樣,是由矽酸鹽玻璃、二氧化矽玻璃、硼矽酸玻璃、無鹼玻璃等公知的玻璃來形成。但,於伴隨加熱的電子元件的製造相關處理(本實施方式中為安裝步驟S2)中,就儘可能防止由熱變形的差所引起的玻璃膜2的不需要的變形或破損的觀點而言,宜以30℃~380℃之間的支持體1與玻璃膜2的線膨脹係數的差成為5×10-7/℃以內的方式,來選擇玻璃的種類。於此情況下,較佳為利用同一種類的玻璃來形成支持體1及玻璃膜2。
In this embodiment, the
只要可提高玻璃膜2的操作性,則支持體1的厚度尺寸無特別限制,設定為與玻璃膜2的厚度尺寸同一水準或其以上。具體而言,支持體1的厚度尺寸設定為300μm以上,較佳為設定為500μm以上。對於厚度尺寸的上限值,可無特別制約地來設定,較佳為限制為可耐受後述支持體1的彎曲(彎折)的程度的厚度尺寸。具體而言宜設定為1000μm以下,較佳為設定為700μm以下。
The thickness of the
另外,該些支持體1與玻璃膜2是利用下拉法等公知的成形方法來成形,較佳為利用溢流下拉法來成形。另外,亦可利用浮式法或流孔下引法(slot downdraw method)、碾平法(roll out method)、上引法(up-draw process)等來成形。此外,亦可視需要實施二次加工(藉由再拉(redraw)而將玻璃一次成形體延長),而設定為小於100μm的厚度尺寸。
In addition, the
於構成積層體3的狀態下,支持體1與玻璃膜2相互固定為可剝離的程度。固定方法可採用任意方法,本實施方式中,藉由使作為支持體1的板狀玻璃與玻璃膜2直接密合而不介隔存在接著劑等,從而實現相互固定。
In the state of forming the
此時,玻璃膜2的支持體1側的表面2a(圖3中為下側的表面)、與支持體1的玻璃膜2側的表面1a(圖3中為上側的表面)的表面粗糙度Ra均設定為2.0nm以下。藉由將各表面1a、2a的表面粗糙度Ra設定於所述範圍,可將支持體1與玻璃膜2以相互固定而不偏移的狀態來積層(形成積層體3)。當然,就密
合性提高的觀點而言,較佳為設為1.0nm以下,更佳為設為0.2nm以下。
At this time, the surface roughness of the
另一方面,玻璃膜2的與支持體1相反側的表面2b的表面粗糙度Ra的大小並無特別限定,但於後述安裝步驟S2中,由於成為實施成膜等電子元件相關處理的對象面,故而其表面粗糙度Ra較佳為2.0nm以下,更佳為1.0nm以下,尤佳為0.2nm以下。
On the other hand, the size of the surface roughness Ra of the
另外,就對玻璃膜2的端部加以保護的觀點而言,於將玻璃膜2與支持體1積層的狀態下,支持體1從玻璃膜2露出(參照圖3)。於此情況下,支持體1的從玻璃膜2的露出量例如設定為0.5mm以上且10mm以下,較佳為設定為0.5mm以上且1.0mm以下。藉由如上所述減小支持體1的露出量(最大為10mm左右),能夠全面且高效地支持相對大面積的玻璃膜2。
In addition, from the viewpoint of protecting the edge portion of the
本實施方式中,如圖4所示,支持體1與玻璃膜2均呈矩形狀。另外,於此支持體1上積層玻璃膜2而成的積層體3的全部周緣上,支持體1從玻璃膜2露出,藉此於玻璃膜2的角部4,支持體1從玻璃膜2露出。此外,本實施方式中,已例示出在積層體3的全部四個邊緣,支持體1從玻璃膜2露出的形態,但當然,亦可採用於三個邊緣或一個邊緣,支持體1從玻璃膜2露出的形態。於此情況下,於未露出的一側的邊緣,理想為玻璃膜2的端面與支持體1的端面一致。
In this embodiment, as shown in FIG. 4 , the
此外,於所述積層體3的形成時,亦可於減壓下進行積
層作業。藉此,當將玻璃膜2積層於支持體1上時,可使玻璃膜2與支持體1之間產生(殘存)的氣泡減少或消失。
In addition, when forming the
(S2)安裝步驟 (S2)Installation steps
如上所述形成包含玻璃膜2的積層體3後,對此積層體3進行伴有加熱的電子元件的製造相關處理,具體而言,進行作為電子元件要素的有機EL單元5的安裝。藉此,如圖5所示,於成為積層體3的一部分的玻璃膜2的與支持體1相反側的表面2b上形成有機EL單元5。然後,藉由將蓋玻璃6載置於有機EL單元5上,將蓋玻璃6的周緣固定於玻璃膜2,從而將有機EL單元5密封。藉此,形成了支持體1固定於有機EL面板7的狀態下的帶有支持體的有機EL面板8。
After the
此處,蓋玻璃6的厚度尺寸例如設定為300μm以下,較佳為設定為200μm以下,更佳為設定為100μm以下。藉由如上所述來設定蓋玻璃6的厚度尺寸,可使蓋玻璃6具有適當的可撓性。
Here, the thickness dimension of the
另外,有機EL單元5於玻璃膜2上的安裝形態為任意,例如可藉由在玻璃膜2的與支持體1相反側的表面2b上,利用化學氣相沈積(Chemical Vapor Deposition,CVD)法或濺鍍等公知的成膜方法,依序成膜形成陽極層、電洞傳輸層(hole transport layer)、發光層、電子傳輸層、陰極層等,從而形成有機EL單元5(詳細圖示省略)。另外,蓋玻璃6朝玻璃膜2的固定方法亦為任意,例如亦可使用公知的雷射密封技術,將蓋玻璃6固定於玻
璃膜2。於此情況下,利用CVD法或濺鍍等的成膜處理符合伴有加熱的電子元件的製造相關處理。因此,藉由如上所述,將有機EL單元5形成於玻璃膜2的與支持體1相反側的表面2b上,從而對玻璃膜2加熱。另外,由於此加熱而於玻璃膜2與支持體1之間形成新的結合,與積層時(形成積層體3時)相比,玻璃膜2與支持體1的固定力提高。
In addition, the
此外,圖5所示的形態中,將蓋玻璃6與玻璃膜2直接固定,但亦可適當利用公知的玻璃粉(glass frit)或間隔件(spacer)等(圖示省略),將蓋玻璃6接著固定於玻璃膜2。
In addition, in the form shown in FIG. 5 , the
(S3)分離步驟 (S3) Separation step
如上所述形成(準備)帶有支持體的有機EL面板8後,從構成帶有支持體的有機EL面板8的玻璃膜2上剝離支持體1,藉此可將帶有支持體的有機EL面板8分離為有機EL面板7及支持體1(參照圖1)。此外,於圖6A以後,將帶有支持體的有機EL面板8中所包含的有機EL單元5及蓋玻璃6的圖示省略。
After the
(S4)剝離起點部形成步驟 (S4) Peeling starting point forming step
本實施方式中,首先如圖6A所示,於將支持體1配置於下方,且將玻璃膜2配置於上方的狀態下,將玻璃膜2的角部4從支持體1上剝離,於角部4與支持體1之間形成剝離起點部9。此處,用以形成剝離起點部9的方法為任意,例如藉由將刀等剝離起點部形成構件10插入玻璃膜2的角部4與支持體1之間,而於角部4的正下方形成剝離起點部9(參照圖6B)。
In this embodiment, first, as shown in FIG. 6A , with the
(S5)第一剝離發展步驟 (S5) First peel development step
(S6)第二剝離發展步驟 (S6) Second peel development step
如上所述,於玻璃膜2與支持體1之間形成剝離起點部9後,使剝離起點部9於既定的方向發展。圖7中示出用以進行所述剝離的剝離裝置11的俯視圖。另外,圖8中示出圖7所示的剝離裝置11的主要部分剖面圖,且為以沿著支持體1的第一邊1c(圖7中為於縱方向延伸的邊)的假想剖面來切割時的剖面圖。如圖7及圖8所示,剝離裝置11包括:保持構件12,將包含玻璃膜2的有機EL面板7與支持體1中的任意一個工件加以保持;多個吸附墊13,吸附另一個工件;伸縮囊14,安裝於吸附墊13;排氣室15,與伸縮囊14連結;以及排氣用驅動部16,與排氣室15連接。另外,本實施方式中,剝離裝置11更包括高度位置變更裝置17,所述高度位置變更裝置17將經由伸縮囊14而連接於排氣室15的吸附墊13相對於提拉對象(此處為支持體1)的高度位置加以變更。以下,對各要素的詳情加以說明。
As described above, after the
保持構件12包括平坦的載置面18,因此可將包含積層體3的帶有支持體的有機EL面板8以載置面18來支持。本實施方式中,於使玻璃膜2的與支持體1相反側的表面2b(實際上是蓋玻璃6的表面)抵接於載置面18的狀態下,支持帶有支持體的有機EL面板8。
Since the holding
另外,於保持構件12的載置面18,形成既定形狀的槽19,並且形成有朝此槽19開口的抽吸孔20。此槽19是以沿著載
置於載置面18上的帶有支持體的有機EL面板8的周緣部(實際上是蓋玻璃6的周緣部)的方式形成,於將帶有支持體的有機EL面板8載置於載置面18上的狀態下,槽19的全域成為由蓋玻璃6所覆蓋的狀態(圖7中僅示出玻璃膜2)。因此,藉由對連接於抽吸孔20的抽吸裝置21(參照圖8)進行驅動以對由蓋玻璃6及槽19所包圍的空間進行抽吸(例如抽真空),從而經由蓋玻璃6而將玻璃膜2吸附保持於載置面18。
In addition, a
另外,此時的吸附壓(真空壓)設定為例如可使玻璃膜2於剝離運作的期間不會破損,而確實地持續保持的大小。具體而言,玻璃膜2的吸附壓設定為0.03MPa以上且0.15MPa以下,較佳為設定為0.05MPa以上且0.10MPa以下。
In addition, the adsorption pressure (vacuum pressure) at this time is set to a level such that the
吸附墊13是如圖7所示,以既定的排列來配設於支持體1的上方,構成為可吸附支持體1的與玻璃膜2相反側的表面1b。本實施方式中,吸附墊13沿著支持體1的第一邊1c而配設多個,並且沿著支持體1的第二邊1d而配設多個。若為圖7所示的例子,則五個吸附墊13沿著支持體1的第一邊1c而配設,並且同樣地,五個吸附墊13沿著與支持體1的第一邊1c正交的第二邊1d(圖7中是於橫方向延伸的邊)而配設。因此,於此情況下,以五個為一行的吸附墊13配設五行,共計25個。
The
此處,於吸附墊13的吸附部呈圓形的情況下,其外徑尺寸(最大外徑尺寸)例如設定為20mm以上且80mm以下,較佳為設定為20mm以上且40mm以下。另外,吸附墊13的水平
方向的間隔為任意,例如設定為0mm以上且100mm以下,較佳為設定為1mm以上且50mm以下。另外,吸附墊13對支持體1的吸附壓例如設定為0.1MPa以上且1.0MPa以下,較佳為設定為0.2MPa以上且0.8MPa以下。
Here, when the adsorption portion of the
於各吸附墊13,安裝有可伸縮的伸縮囊14。本實施方式中,兩段的伸縮囊14一體地安裝於吸附墊13的反吸附側(參照圖8)。此處,伸縮囊14可以如下方式收縮:當以吸附墊13來吸附支持體1時,藉由吸附墊13及伸縮囊14內產生的負壓(減壓狀態)而使吸附墊13上升。此外,只要伸縮囊14如上所述可收縮,則其材質、結構為任意,例如可由同一材料來形成吸附墊13及伸縮囊14,亦可由相互不同的材料來形成。另外,如後所述,於欲根據支持體1的提拉部位來改變其響應性(支持體1的提拉速度、提拉量等)的情況下,亦可使對應的吸附墊13與伸縮囊14(尤其是伸縮囊14)的材質、結構等不同。例如,如本實施方式般,於以兩個階段(第一剝離發展步驟S5及第二剝離發展步驟S6)來進行剝離發展的情況下,亦可將第一剝離發展步驟S5中使用的伸縮囊14(圖7的最左側的一行的伸縮囊14a~伸縮囊14e)設為相對容易伸縮的材質、結構,且將第二剝離發展步驟S6中使用的伸縮囊14(從圖7的左側起第二行~第五行的伸縮囊14f、伸縮囊14g......)設為相對難以伸縮的材質、結構。此處,作為相對容易伸縮的材質的一例,可列舉矽橡膠(silicon rubber),作為相對難以伸縮的材質的一例,可列舉腈橡膠(nitrile rubber)。
A
於伸縮囊14連接有排氣室15,並且排氣室15連接於泵等排氣用驅動部16。此處,排氣室15是針對每個伸縮囊14被分隔,使排氣室15分別獨立地排氣,藉此可將吸附墊13及伸縮囊14分別獨立地驅動。本實施方式中,一個排氣用驅動部16與多個排氣室15連接,並且於各排氣室15與排氣用驅動部16之間,設置有將排氣室15與排氣用驅動部16之間切換為連通狀態及遮斷狀態的切換閥22。此處,例如藉由將排氣用驅動部16設為電動泵,將切換閥22設為電磁閥,利用未圖示的控制裝置來電性控制排氣用驅動部16及切換閥22,可獨立地電性控制後述的吸附墊13及伸縮囊14的運作。
The
於本實施方式中,高度位置變更裝置17包括:安裝部23,將全部的吸附墊13及伸縮囊14經由排氣室15而安裝;以及升降驅動部24,對安裝部23進行升降驅動(參照圖8)。因此,於此情況下,藉由利用升降驅動部24使安裝部23沿著高度方向(支持體1的法線方向)移動,可使固定於安裝部23的全部吸附墊13及伸縮囊14與安裝部23一併沿著所述高度方向移動。另外,藉由利用升降驅動部24將安裝部23保持於既定的高度位置,從而使固定於安裝部23的全部吸附墊13及伸縮囊14相對於支持體1的高度位置保持於既定的位置。
In this embodiment, the height
本實施方式中,藉由使安裝部23降下至吸附墊13與支持體1接觸且伸縮囊14僅收縮既定量的位置,來設定伸縮囊14的最大收縮量,換言之為吸附墊13對支持體1的最大提拉量。即,
如圖9所示,根據使吸附墊13接觸支持體1時的伸縮囊14的收縮量(初始收縮量z0),來設定由其後的減壓引起的伸縮囊14的最大收縮量(從圖10所示的減壓時收縮量z1中減去初始收縮量z0而得的值z1-z0)。因此,於剝離發展時,排氣室15的高度位置保持一定的情況下,若伸縮囊14的初始收縮量z0小,則相應地,伸縮囊14的減壓時收縮量z1-z0增大,若初始收縮量z0大,則相應地,伸縮囊14的減壓時收縮量z1-z0減小。作為具體例,伸縮囊14的減壓時收縮量z1-z0,即最大提拉量設定為2mm以上且10mm以下,較佳為設定為2mm以上且5mm以下。
In this embodiment, the maximum contraction amount of the
繼而,主要基於圖7~圖11,將使用所述構成的剝離裝置11的剝離發展運作(第一剝離發展步驟S5及第二剝離發展步驟S6)的一例與本發明的作用效果一併進行說明。
Next, mainly based on FIGS. 7 to 11 , an example of the peeling development operation (first peeling development step S5 and second peeling development step S6 ) using the
首先,將成為剝離對象的帶有支持體的有機EL面板8,於以支持體1為上側的狀態下載置於保持構件12上(參照圖7及圖8)。而且,藉由抽吸裝置21的驅動,於保持構件12的載置面18吸附保持玻璃膜2。另外,藉由高度位置變更裝置17的升降驅動部24,使配置於帶有支持體的有機EL面板8的上方的吸附墊13及伸縮囊14下降,使吸附墊13接觸支持體1的與玻璃膜2相反側的表面1b(參照圖9)。於此時間點,任一吸附墊13均未成為減壓狀態,因此任何吸附力亦均未作用於支持體1。此外,出於防止支持體1與玻璃膜2的再附著的目的,於形成於角部4的剝離起點部9介隔存在有膜25。
First, the
繼而,藉由使排氣用驅動部16驅動,將排氣室15內排氣,而對與排氣室15連通的伸縮囊14及吸附墊13的內部空間進行減壓。此處,將與剝離起點部9最近的吸附墊13a及伸縮囊14a的排氣室15所設置的切換閥22打開,使此吸附墊13a吸附於支持體1。另外,將伸縮囊14a內進行減壓,使其較減壓開始時的狀態(圖9所示的狀態)而言進一步收縮,藉此對由吸附墊13a所吸附的狀態的支持體1賦予自玻璃膜2的剝離力F(參照圖10)。藉此,由安裝有伸縮囊14a的吸附墊13a來吸附的支持體1的角部4向上方提拉,並且位於其正下方的剝離起點部9向鄰接的吸附墊13b正下方的區域(圖7的由箭頭X所表示的方向)發展。
Then, by driving the
此時,支持體1隨著向上方提拉,而產生既定的撓曲變形。另外,吸附墊13a隨著伸縮囊14a的收縮而上升,將吸附狀態的支持體1向上方提拉,結果為與支持體1的撓曲變形相應地從平坦姿勢傾動(參照圖10)。此處,伸縮囊14顯示出小於支持體1及吸附墊13a的變形阻抗,因此與支持體1的撓曲變形相應地,伸縮囊14a容易且優先產生彎曲變形。因此,能夠利用處於吸附狀態的吸附墊13a來儘量防止或抑制支持體1產生不需要的彎曲力矩的事態,一面防止支持體1的破裂一面使剝離安全地發展。另外,若為此結構,則必定於吸附墊13a吸附支持體1後,伸縮囊14a收縮,因此能夠確實地提拉支持體1(對支持體1賦予剝離力F)。
At this time, as the
此外,於此時間點,吸附墊13b未成為減壓狀態,另外,
利用高度位置變更裝置17來保持為既定的高度位置,結果為處於接觸支持體1的狀態。因此,來自吸附墊13b的特別大的力未作用於支持體1。根據以上,依據吸附墊13a對支持體1的提拉程度,如圖10所示,成為剝離起點部9發展至鄰接的吸附墊13b的正下方區域的狀態。藉此,能夠順利且容易地提拉下一吸附墊13b,能夠使剝離更順暢地發展。若詳細說明,則由於下一吸附墊13b包括伸縮囊14b,故而隨著吸附墊13a正下方的支持體1(角部4)的提拉,可於不賦予吸附力的情況下使伸縮囊14b收縮,以使吸附墊13b傾斜的方式舉起。藉此,當將吸附墊13a提拉時,可使剝離起點部9容易地發展至下一吸附墊13b的正下方區域。藉此,可利用處於吸附狀態的吸附墊13a來儘量防止或抑制支持體1產生不需要的彎曲力矩的事態,一面防止支持體1的破裂一面使剝離安全地發展。
In addition, at this point in time, the
如此一來,藉由與剝離起點部9最近的吸附墊13a的上升來提拉支持體1後,以自於沿著第一邊1c的方向上與此吸附墊13a鄰接的吸附墊13b至與第二邊1d最近的吸附墊13e為止的順序,將支持體1一面吸附一面使其上升,藉此使形成於角部4的剝離起點部9遍及且沿著第一邊1c全域而發展(參照圖7)。本實施方式中,藉由將安裝於各排氣室15的切換閥22依序打開,則對應的吸附墊13b(13c......)以及伸縮囊14b(14c......)依序成為減壓狀態,如上所述產生伸縮囊14b(14c......)的收縮及吸附墊13b(13c......)的上升運作。藉此,支持體1沿著第一邊1c被
提拉,剝離遍及支持體1的第一邊1c的全域而發展,藉此,第一邊1c近旁成為與玻璃膜2完全剝離的狀態(圖11中所示的形成有剝離區域9'的狀態)。藉此,第一剝離發展步驟S5結束。
In this way, after the
繼而,開始進行第二剝離發展步驟S6。具體而言,使用與剝離區域9'第二近的一行的吸附墊13f......及伸縮囊14f......,使剝離區域9'向沿著支持體1的第二邊1d的方向Y發展(參照圖11)。於此情況下,藉由將安裝於各排氣室15的切換閥22同時打開,則所對應的多個(此處為各五個)吸附墊13f......以及伸縮囊14f......成為減壓狀態,如上所述產生伸縮囊14f......的收縮以及吸附墊13f......的上升運作。藉此,支持體1中吸附墊13f正下方的區域被提拉,剝離區域9'於沿著第二邊1d的方向Y上伸展。藉由對鄰接的吸附墊13g......(13h......、13i......)以及伸縮囊14g......(14h......、14i......)亦同樣實施以上的運作,則剝離區域9'沿著支持體1的第二邊1d而依序發展。而且,剝離區域9'到達支持體1的第二邊1d的另一端(與剝離起點部9側相反的一側的端部),藉此,成為支持體1與玻璃膜2完全剝離的狀態。或者,於剝離區域9'達到既定大小的時間點結束提拉運作,視需要利用例如作業者的手來將支持體1從玻璃膜2上完全剝離。藉此,第二剝離發展步驟S6結束,成為包含玻璃膜2的有機EL面板7與支持體1分離的狀態。
Then, the second peeling development step S6 is started. Specifically, the adsorption pads 13f... and the telescopic bags 14f... in the row closest to the peeling area 9' are used to move the peeling area 9' toward the second row along the
以上,已對本發明的包含玻璃膜之電子元件的製造方法的第一實施方式加以說明,但此製造方法當然可於本發明的範圍 內採取任意的形態。 The first embodiment of the method for manufacturing an electronic component including a glass film of the present invention has been described above. However, it goes without saying that this manufacturing method can be used within the scope of the present invention. Take any form within.
圖12示出用以對本發明的第二實施方式的分離步驟S3'的概要加以說明的俯視圖。如圖12所示,本實施方式的分離步驟S3'不僅與第一實施方式同樣,包括將剝離起點部9形成於玻璃膜2的角部4的剝離起點部形成步驟S4,而且與第一實施方式的分離步驟S3的不同之處在於,包括使剝離起點部9沿著支持體1的對角線D而發展的剝離發展步驟S7。即,於第一實施方式中,例示出沿著支持體1的各邊1c、1d而依序使剝離發展的情況,但於本實施方式中,使剝離沿著支持體1的對角線D而發展。
FIG. 12 is a plan view for explaining an outline of the separation step S3' according to the second embodiment of the present invention. As shown in FIG. 12 , the separation step S3 ′ of this embodiment not only includes the peeling starting point forming step S4 of forming the peeling
於此情況下,使吸附墊13及伸縮囊14以與第一實施方式不同的順序來工作。具體而言,如圖12所示,將在與支持體1的對角線D正交的方向上排列的一個或多個吸附墊13A、13B、13B、13C......、13I以及多個伸縮囊14A、14B、14B、14C......、14I分別作為一個組群,使該些各組群的吸附墊13A(13B......)及伸縮囊14A(14B......)分別以組群為單位而同步地工作。因此,若為所述情況,首先使於其正下方坐落有剝離起點部9的一個吸附墊13A以及伸縮囊14A,以與第一實施方式相同的方式工作,提拉支持體1。藉此,剝離起點部9於沿著支持體1的對角線D的方向,朝向鄰接的吸附墊13B、吸附墊13B而發展。如此一來,剝離起點部9沿著對角線D而開始發展後,使鄰接的吸附墊13B、吸附墊13B以及伸縮囊14B、伸縮囊14B工作,提拉支持體1。藉此,剝離起點部9超出吸附墊13B、吸附墊13B的正下方,而
朝向與該些吸附墊13B、吸附墊13B鄰接的吸附墊13C、吸附墊13C、吸附墊13C而發展。藉由從對角線D上的剝離起點部9側起向其相反側(剝離發展的最前方側)依序實施以上的運作,而成為支持體1與玻璃膜2完全剝離的狀態。
In this case, the
如上所述,依據本發明的玻璃膜的製造方法(剝離方法)及電子元件的製造方法,不論其剝離方向如何,均可將支持體1與玻璃膜2安全地剝離。
As described above, according to the method of manufacturing a glass film (peeling method) and the method of manufacturing an electronic component of the present invention, the
此外,以上的說明中亦例示出如下情況:於剝離起點部形成步驟S4中,於以玻璃膜2為上側的狀態下,於玻璃膜2的角部4與支持體1之間插入剝離起點部形成構件10,且於各剝離發展步驟S5~S7中,於以支持體1為上側的狀態下,使吸附墊13a~吸附墊13i(13A~13I)吸附於支持體1的表面1b而提拉,但當然亦可採取與其不同的形態。圖示雖省略,但於剝離起點部形成步驟S4中,亦可於以支持體1為上側的狀態下,於支持體1與玻璃膜2之間形成剝離起點部9。或者,於各剝離發展步驟S5~S7中,亦可於以玻璃膜2為上側的狀態下,使吸附墊13a~吸附墊13i(13A~13I)吸附於玻璃膜2的表面2b(蓋玻璃6)而提拉。
In addition, the above description also exemplifies the case where, in the peeling starting point forming step S4, the peeling starting point is inserted between the
另外,第一實施方式中,已例示出利用高度位置變更裝置17將全部的吸附墊13a~吸附墊13i以及伸縮囊14a~伸縮囊14i設定為同一高度位置的情況,但當然亦可採取其以外的形態。例如圖示雖省略,但亦可於第一剝離發展步驟S5所使用的吸附墊13a~吸附墊13e、以及第二剝離發展步驟S6所使用的吸附墊13f
~吸附墊13i中使用不同的高度位置變更裝置,使由伸縮囊14a~伸縮囊14e、伸縮囊14f~伸縮囊14i引起的減壓時收縮量(z1-z0)於第一剝離發展步驟S5及第二剝離發展步驟S6中不同。
In addition, in the first embodiment, the height
另外,關於排氣用驅動部16,亦例如圖示雖省略,但亦可於第一剝離發展步驟S5所使用的吸附墊13a~吸附墊13e、以及第二剝離發展步驟S6所使用的吸附墊13f~吸附墊13i中,使用不同的排氣用驅動部。
In addition, the
另外,所述實施方式中,已例示出在玻璃膜2的角部4形成有剝離起點部9的情況,但當然亦可採取其以外的形態。例如,如圖11所示,於剝離發展步驟S5~剝離發展步驟S7之前,可遍及支持體1的第一邊1c全域而形成作為剝離起點部的剝離區域9',亦可遍及第二邊1d全域而形成作為剝離起點部的剝離區域9'。或者,若藉由例如圖7所示的吸附墊13a及伸縮囊14a的工作,可於玻璃膜2的角部4新形成剝離區域,則亦可省略剝離起點部形成步驟S4。
In addition, in the above-mentioned embodiment, the case where the peeling
另外,所述實施方式中,已例示出採用板狀玻璃作為支持體1,且將此支持體1與玻璃膜2藉由直接密合而相互固定的情況,但當然對於利用其以外的方法將玻璃膜2與支持體1固定而成的積層體3,亦可應用本發明。例如,對於由丙烯酸黏著層、矽酮薄膜層、無機薄膜層(氧化銦錫(Indium Tin Oxide,ITO)、氧化物、金屬、碳)等包含非玻璃材的層及板狀玻璃來構成支持體1,且使非玻璃材層與玻璃膜2密合而成的積層體(圖示省略),亦可
應用本發明。
In addition, in the above-mentioned embodiment, the case where plate-shaped glass is used as the
另外,以上的說明中,已例示出製造有機EL面板7來作為電子元件的情況,但當然對於其以外的電子元件的製造方法,亦可應用本發明。圖13示出其一例的帶有支持體的液晶面板31的剖面圖。此面板31是於作為最終製品的液晶面板32的兩側固定一對支持體1、1而成,例如是以如下方式形成。即,首先分別形成將支持體1與玻璃膜2積層而成的一對積層體3、3(積層體形成步驟S1)。然後,於其中一個積層體3的玻璃膜2的表面2b上形成間隔件33,所述間隔件33劃分形成用以封入未圖示的液晶的空間,且於此間隔件33上固定另一個積層體3的玻璃膜2(安裝步驟S2)。以所述方式來準備帶有支持體的液晶面板31後,利用所述的剝離方法將支持體1逐片剝離,將一片帶有支持體的液晶面板31分離為兩片支持體1、1以及一片液晶面板32(分離步驟S3)。因此,於製造液晶面板32的情況下亦可應用本發明,可於不會使玻璃膜2破損的情況下,安全且容易地使帶有支持體的液晶面板31分離為支持體1及液晶面板32。
In addition, in the above description, the case where the organic EL panel 7 is manufactured as an electronic component has been exemplified, but it goes without saying that the present invention can also be applied to other manufacturing methods of electronic components. FIG. 13 shows a cross-sectional view of an example of the liquid crystal panel 31 with a support. This panel 31 is formed by fixing a pair of
當然,於取得(製造)玻璃膜2自身來作為最終製品的情況下,亦可藉由應用本發明,而於不會使玻璃膜2破損的情況下,安全且容易地使支持體1與玻璃膜2分離。
Of course, when the
1:支持體 1:Support
1a、1b、2a、2b:表面 1a, 1b, 2a, 2b: Surface
2:玻璃膜 2: Glass film
3:積層體 3: Laminated body
4:角部 4: Corner
8:帶有支持體的有機EL面板 8: Organic EL panel with support
9:剝離起點部 9: Peel off the starting point
11:剝離裝置 11: Peeling device
12:保持構件 12: Maintain components
13(13a~13c):吸附墊 13(13a~13c): adsorption pad
14(14a~14c):伸縮囊 14(14a~14c): telescopic bag
15:排氣室 15:Exhaust chamber
16:排氣用驅動部 16: Exhaust drive part
17:高度位置變更裝置 17:Height position changing device
18:載置面 18:Placement surface
19:槽 19:Slot
20:抽吸孔 20:Suction hole
21:抽吸裝置 21:Suction device
22:切換閥 22:Switching valve
23:安裝部 23:Installation Department
24:升降驅動部 24:Lifting drive part
25:膜 25:Membrane
Claims (9)
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TW201437030A (en) * | 2013-03-26 | 2014-10-01 | Dainippon Screen Mfg | Detaching apparatus and detaching method |
TW201514110A (en) * | 2013-09-30 | 2015-04-16 | Nippon Electric Glass Co | Production method of film glass, production method of electronic device and production method of glass film laminate |
TW201604927A (en) * | 2014-05-03 | 2016-02-01 | 半導體能源研究所股份有限公司 | Substrate separation apparatus for stacked body |
TW201718427A (en) * | 2015-07-24 | 2017-06-01 | Nippon Electric Glass Co | Method for producing glass film, and method for producing electronic device including glass film |
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JP2012040657A (en) * | 2010-08-20 | 2012-03-01 | Ihi Corp | Vacuum suction device |
JP6815096B2 (en) * | 2015-05-27 | 2021-01-20 | 株式会社半導体エネルギー研究所 | Peeling device |
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TW201437030A (en) * | 2013-03-26 | 2014-10-01 | Dainippon Screen Mfg | Detaching apparatus and detaching method |
TW201514110A (en) * | 2013-09-30 | 2015-04-16 | Nippon Electric Glass Co | Production method of film glass, production method of electronic device and production method of glass film laminate |
TW201604927A (en) * | 2014-05-03 | 2016-02-01 | 半導體能源研究所股份有限公司 | Substrate separation apparatus for stacked body |
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