TWI822930B - Manufacturing method and manufacturing device of glass film and manufacturing method of electronic components including glass film - Google Patents

Abstract

In the separation step S3 of peeling one of the support 1 and the glass film 2 from the other work and separating the laminated body 3 into the support 1 and the glass film 2, the adsorption pad 13 equipped with the telescopic bag 14 is used. By reducing the pressure, the adsorption pad 13 is used to adsorb one of the workpieces, and the telescopic bag 14 is contracted, thereby imparting a peeling force F to one of the workpieces from the other workpiece.

Description

Manufacturing method and device of glass film and manufacturing method of electronic components including glass film

The present invention relates to a manufacturing method and device of a glass film and a manufacturing method of an electronic component containing a glass film. In particular, the present invention relates to a technology for peeling a glass film from a support.

In recent years, from the perspective of space saving, flat panel displays such as liquid crystal displays, plasma displays, organic electroluminescence (EL) displays, and field emission displays have It is becoming popular to replace the previously popular cathode-ray tube (CRT) type display. Furthermore, these flat panel displays are required to be further thinned.

Especially for organic EL displays or organic EL lighting, its very small (thin) thickness can be used to enable folding or rolling functions. This not only makes transportation easier, but also allows it to be used in a curved state in addition to the existing flat state, so it is expected to be used flexibly in a variety of uses. Therefore, the flexibility of the glass substrate or cover glass used in these electronic components is required to be further improved.

In order to impart flexibility to the glass substrate, it is effective to make the glass substrate Thin. Here, for example, Patent Document 1 proposes a glass film having a thickness dimension of 200 μm or less, whereby a glass substrate can be provided with high flexibility to the extent that it can be used in a curved state.

On the other hand, glass substrates used in electronic components such as flat panel displays and solar cells are subjected to various processes related to the manufacturing of electronic components, such as secondary processing and cleaning. However, if the glass substrate used in these electronic components is made thinner, since the glass is a brittle material, it may be damaged due to slight stress changes, which may make the operation very difficult during processing related to the manufacture of electronic components. problem. In addition, the glass film with a thickness of 200 μm or less is highly flexible, so it also has the problem of being difficult to position when performing various manufacturing-related processes (for example, deviation occurs during patterning).

Regarding the above problem, for example, Patent Document 2 proposes a laminated body in which a glass film and a support glass serving as a support for supporting the glass film are laminated and fixed to each other. If the glass film is used as a laminated body as described above and various manufacturing-related processes are performed on the laminated body, even if a glass film lacking strength or rigidity is used in a single body state, the supporting glass will serve as a reinforcement. The material functions, so it can be easily positioned as a laminated body during each process. In addition, by peeling off the glass film from the supporting glass after the treatment is completed, only the glass film that has been subjected to the required treatment can be finally obtained. Furthermore, by setting the thickness dimension of the laminated body containing the glass film to be the same as or greater than the thickness dimension of the existing (existing) glass substrate, it is expected that the existing production line for glass substrates can be used as a production line for electronic components to use (share) the advantages.

Here, as a method for peeling off the glass film from the supporting glass, the following method has been previously known: by moving one of the supporting glass and the glass film in a direction orthogonal to the interface between the supporting glass and the glass film ( normal direction) and peel the glass film from the supporting glass. However, this method basically imposes flexural deformation on the glass film or the like (glass film or supporting glass), so there is a concern that unnecessary bending moments may occur in areas other than the interface, leading to damage such as cracking.

In order to solve the above problem, for example, Patent Document 3 proposes a method in which the upper surface of the reinforcing plate (support) is adsorbed by the flexible plate and fixed to the flexible plate at predetermined intervals. The plurality of movable bodies on the upper side rise in sequence, thereby peeling off the substrate (glass film) from the reinforcing plate. In addition, at this time, a structure has been proposed in which a ball joint is connected to the base end side of the movable body so that the movable body can tilt following the flexural deformation of the flexible plate.

[Prior art documents]

[Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2010-132531

[Patent Document 2] International Publication No. 2011/048979

[Patent Document 3] Japanese Patent Application Publication No. 2014-141344

As described above, according to the peeling device described in Patent Document 3, the movable body fixed to the flexible plate that adsorbs and holds the substrate or the reinforcing plate can tilt following the flexural deformation of the flexible plate. Therefore, it is possible to Since the flexible board will not be damaged by the movable body When excessive force is applied, the flexible board is bent and deformed. Therefore, unnecessary bending moments (bending moments) generated by the substrate or the reinforcing plate adsorbed and held by the flexible plate are suppressed, thereby preventing the substrate or the reinforcing plate from cracking.

On the other hand, if unnecessary bending moments generated by glass films or the like are to be eliminated as much as possible, it is desirable to configure the adsorption member with a plurality of adsorption pads instead of the flexible plate described in Patent Document 3. Here, the adsorption pad usually adsorbs the glass film, etc. by decompressing the space between the surface to be adsorbed (the surface of the glass film, etc.), so the adsorption pad must be connected to an exhaust pipe for depressurization. . However, when the tilting structure described in Patent Document 3 was applied to an adsorption pad and a structure was studied to support the adsorption pad in a tiltable manner using a ball joint, the ball joint became an obstacle to connecting the adsorption pad. Space for the exhaust pipe is restricted. Therefore, it is difficult to apply the tilting structure described in Patent Document 3 to a plurality of adsorption pads. In addition, when the tilting structure described in Patent Document 3 is applied, a plurality of adsorption pads, the same number of ball joints as the adsorption pads, and a plurality of driving devices for independently raising and lowering the plurality of adsorption pads and ball joints are required ( (cylinder, etc.), so the structure is complicated, and the increase in equipment costs cannot be avoided.

In view of the above, the technical problem to be solved by the present invention is to effectively suppress the unnecessary bending moment generated by the glass film and the like by using a device with a simple structure, thereby safely peeling the glass film from the support.

The above-described problem is solved by using the glass film manufacturing method of the present invention. That is, this manufacturing method includes: preparation steps to prepare for implementation of manufacturing-related processes a laminated body in which a prepared glass film is laminated on a support that supports the glass film; and a separation step in which one of the support and the glass film is peeled off from the other, and the prepared laminated body is separated into the support. and a glass film. In the manufacturing method of the glass film, in the separation step, an adsorption pad equipped with a telescopic bag is used, and one of the workpieces is adsorbed by reducing the pressure and using the adsorption pad, and the telescopic bag is contracted, and one of the workpieces is The peeling force imparted by a workpiece from another workpiece. In addition, the so-called "manufacturing-related processing" here includes, of course, processing that directly performs some processing on the glass film, and also widely includes the installation of other components, or the cleaning of the glass film surface to indirectly make the glass film or Processing of components containing glass films close to final products (shipping state).

As described above, in the manufacturing method of the glass film of the present invention, an adsorption pad equipped with a telescopic bag is used, and one of the workpieces is adsorbed by reducing the pressure and using the adsorption pad, and the telescopic bag is contracted, so that one of the workpieces is given a self-propelled function. The peeling force of a workpiece can easily cause the adsorption pad to tilt to a relatively large angle through the deformation of the telescopic bag. Therefore, unnecessary bending moment that may be generated by the glass film or the like adsorbed by the adsorption pad can be effectively suppressed, and breakage of the glass film or the like can be prevented. In addition, the adsorption pad is used to adsorb the glass film, and the contraction of the telescopic bag is used to impart peeling force to the glass film and the like. For example, the adsorption operation and the peeling force imparting operation can be performed using a common exhaust driving unit. Of course, in the case of a telescopic bag, the adsorption pad can be connected to the exhaust driving unit via the internal space, so there is no need to worry about being limited by space. From the above, according to the manufacturing method of the glass film of the present invention, the structure of the device can be simplified, and peeling that is difficult to cause cracks can be performed without causing an increase in cost.

In addition, in the manufacturing method of the glass film of the present invention, a plurality of adsorption pads can also be arranged along the peeling development direction, and the adsorption pad on the rear side of the peeling development can be used to adsorb one of the workpieces, so that the telescopic bag starts to shrink, and then the use and peeling Develop the adsorption pad on the rear side to adjoin and peel off the adsorption pad on the front side to adsorb one of the workpieces, causing the telescopic bag to begin to shrink.

By configuring it as described above, it is possible to adsorb the next piece of one of the workpieces in a state where the peeling has progressed to the point directly below the adsorption pad on the rear side of the peeling that has risen due to the contraction of the bellows, and the peeling has progressed beyond the point directly below. The part directly underneath the pad gives the peeling force. Therefore, one of the workpieces can be smoothly peeled off from the peeling area or the side close to the peeling area, thereby more effectively suppressing the generation of unnecessary moments and achieving stable peeling development.

In addition, in the case where a plurality of adsorption pads are sequentially operated as described above, in the method of manufacturing a glass film of the present invention, the peeling development area can also be controlled by contraction of the telescopic bag installed on the adsorption pad on the rear side of the peeling development. On the condition that it reaches at least directly under the adsorption pad on the front side of peeling development, the adsorption pad on the front side of peeling development starts to absorb one of the workpieces and the telescopic bag starts to shrink.

As described above, on the condition that the peeling area reaches directly under the adsorption pad on the front side of the peeling development, peeling can be promoted more smoothly by applying a peeling force to the portion directly under the suction pad in one of the workpieces. In addition, since at least a part of the workpiece directly below the suction pad is peeled off from the other workpiece, unnecessary bending moment that may occur in one of the workpieces can be further suppressed, and one of the workpieces can be peeled off smoothly.

In addition, in the manufacturing method of the glass film of the present invention, a height position changing device that can change the height position of the adsorption pad with respect to one of the workpieces can be used to adjust the shrinkage amount of the telescopic bag during decompression.

As described above, by using the height position changing device to adjust the amount of contraction of the bellows during decompression, the amount of lifting of one of the workpieces when peeling progresses can be controlled to a desired range. Therefore, while imparting moderate bending deformation (flexural deformation) to one of the workpieces, peeling can be smoothly advanced.

In addition, in the manufacturing method of the glass film of the present invention, one of the workpieces is in a rectangular shape, and the separation step may also include: a peeling starting point forming step, forming a peeling starting point at a corner of one of the workpieces; a first peeling development step, The peeling starting point is developed along the first side of one of the workpieces; and the second peeling development step is such that the peeling development area that develops throughout the first side is along the third side of one of the workpieces that is orthogonal to the first side. Develop on both sides.

In the separation step of the present invention, for example, as is known, the method of first forming a peeling starting point at a corner of one of the workpieces and secondly developing the peeling starting point along the diagonal of one of the rectangular workpieces is also considered. , thereby lifting the adsorption pads in sequence. On the other hand, as described above, when the peeling starting point is formed at the corner of one of the workpieces and the peeling starting point is developed using the method of the present invention, it has been found that the peeling starting point is more effective than if the peeling starting point is developed along the diagonal line. In other words, when extending in the direction along one of the sides of the rectangular workpiece, the peeling development pattern is more stable. Therefore, as described above, the peeling starting point develops along the first side of one of the workpieces, and then the peeling area develops over the entire first side along the first side. It develops along the orthogonal second side, whereby the peeling can develop more stably.

In addition, when peeling proceeds along each side as described above, in the manufacturing method of the glass film of the present invention, in the first peeling development step, a telescopic bag equipped with a relatively easy deformation can also be used as a telescopic bag. The adsorption pad of the bag, and in the second peeling development step, a telescopic bag installed with a relatively difficult deformation is used as the adsorption pad of the telescopic bag.

As described above, in the case where the peeling starting point formed at the corner of one of the workpieces is developed along the first side, and in the case where the peeling development area is developed along the second side orthogonal to the first side , by using two types of expansion bladders with different degrees of deformation separately, peeling development can be achieved more quickly and stably.

Moreover, in the manufacturing method of the glass film of this invention, the support may be plate-shaped glass. In addition, in this case, the plate glass and the glass film may be directly adhered to each other in the laminated body.

By using the support as plate glass as described above, a support excellent in surface accuracy can be produced at low cost. In addition, by directly bonding the plate glass with excellent surface accuracy to the glass film as described above, the glass film can be fixed to the support without shifting, and the present invention can reliably and safely remove the glass film from the support. Peeling from plate glass as support.

In addition, the above-mentioned problem can also be solved by the glass film manufacturing apparatus of the present invention. That is, this manufacturing apparatus includes a peeling device for peeling one of the workpiece of the support body of the laminate and the glass film from the other workpiece in a state where the glass film is laminated on the support body that supports the glass film, The glass film In the manufacturing device, the peeling device includes an adsorption pad that adsorbs one of the workpieces, and a telescopic bag is installed on the adsorption pad; and the adsorption pad is configured to adsorb one of the workpieces by reducing pressure, and shrink the telescopic bag to compress one of the workpieces. Peeling force imparted from another workpiece.

As mentioned above, in the glass film manufacturing device of the present invention, an adsorption pad equipped with a telescopic bag is also used. By reducing the pressure and using the adsorption pad to adsorb one of the workpieces, and shrinking the telescopic bag, one of the workpieces is given The peeling force from another workpiece can easily tilt the adsorption pad to a relatively large angle through the deformation of the telescopic bag. Therefore, unnecessary bending moment that may occur in the glass film or the like adsorbed by the adsorption pad can be effectively suppressed, and breakage of the glass film or the like can be prevented. In addition, the adsorption pad is used to adsorb the glass film, and the contraction of the telescopic bag imparts a peeling force to the glass film, etc. Thereby, for example, a common exhaust driving unit can be used to perform the adsorption operation and the peeling force imparting operation. From the above, according to the manufacturing device of the present invention, the structure of the device can be simplified, and peeling that is less likely to cause cracks can be performed without causing an increase in cost.

In addition, the above-mentioned problems can also be solved by the manufacturing method of the electronic component of the present invention. That is, this manufacturing method includes: a preparation step of preparing an electronic component with a support, which is a laminate in a state in which a glass film mounted with electronic component elements is laminated on a support that supports the glass film; and a separation step of preparing an electronic component with a support. One of the workpieces of the support and the glass film is peeled off from the other workpiece, and the prepared electronic component with the support is separated into an electronic component including the glass film and the support. In the method of manufacturing the electronic component, in the separation In this step, use an adsorption device equipped with a telescopic bag The pad absorbs one of the workpieces by reducing the pressure and using the adsorption pad, and contracts the telescopic bag to impart peeling force to one of the workpieces from the other workpiece.

As mentioned above, in the manufacturing method of electronic components of the present invention, an adsorption pad equipped with a telescopic bag is also used. By reducing the pressure and using the adsorption pad to adsorb one of the workpieces, and shrinking the telescopic bag, one of the workpieces is given The peeling force from another workpiece can easily tilt the adsorption pad to a relatively large angle through the deformation of the telescopic bag. Therefore, unnecessary bending moment that may occur in the glass film or the like adsorbed by the adsorption pad can be effectively suppressed, and breakage of the glass film or the like can be prevented. In addition, the adsorption pad is not only used to adsorb the glass film, but also the contraction of the telescopic bag is used to impart peeling force to the glass film, etc., whereby the adsorption operation and the peeling force imparting operation can be carried out through, for example, a common exhaust driving unit. . Based on the above, according to the manufacturing method of electronic components of the present invention, the structure of the device can be simplified, and a peeling method that is less likely to cause cracks can be implemented without causing an increase in cost.

As described above, according to the present invention, by using a device with a simple structure, unnecessary bending moments generated by the glass film and the like are effectively suppressed, and the glass film can be safely peeled off from the support.

1:Support

1a, 1b, 2a, 2b: Surface

1c, 1d: side

2: Glass film

3: Laminated body

4: Corner

5: Organic EL unit

6: cover glass

7: Organic EL panel

8: Organic EL panel with support

9: Peel off the starting point

9': peeling area

10: Peel off the starting point forming member

11: Peeling device

12: Maintain components

13(13a~13i, 13A~13I): adsorption pad

14(14a~14i, 14A~14I): telescopic bag

15:Exhaust chamber

16: Exhaust drive part

17:Height position changing device

18:Placement surface

19:Slot

20:Suction hole

21:Suction device

22:Switching valve

23:Installation Department

24:Lifting drive part

25:Membrane

31: LCD panel with support

32:LCD panel

33: Spacer

F: Peeling force

S1: Laminated body formation step

S2: Installation steps

S3, S3': separation step

S4: peeling starting point forming step

S5: First peel development step

S6: Second divestiture development step

S7: Peel Development Steps (Diagonal)

z0: initial shrinkage

z1: amount of contraction during decompression

D: Diagonal

X, Y: direction

FIG. 1 is a flowchart showing the procedure of a method of manufacturing an electronic component including a glass film according to the first embodiment of the present invention.

FIG. 2 is a flowchart showing details of the separation step shown in FIG. 1 .

Fig. 3 is a cross-sectional view of a laminated body including a glass film.

FIG. 4 is a plan view of the laminated body shown in FIG. 3 .

FIG. 5 is a cross-sectional view of an organic EL panel with a support in which an organic EL unit as an electronic component element is mounted on the laminate shown in FIG. 3 .

FIG. 6A is a plan view for explaining an example of the peeling starting point forming step shown in FIG. 2 .

FIG. 6B is a cross-sectional view of main parts taken along line A-A in FIG. 6A for explaining an example of the peeling starting point forming step shown in FIG. 2 .

7 is a plan view of the glass film peeling device according to the first embodiment of the present invention.

FIG. 8 is a cross-sectional view of the main parts of the peeling device shown in FIG. 7 taken along line B-B.

FIG. 9 is a cross-sectional view of main parts along the line B-B for explaining an example of the peeling development step using the peeling device shown in FIG. 7 .

FIG. 10 is a B-B main part cross-sectional view for explaining an example of the peeling development step using the peeling device shown in FIG. 7 .

FIG. 11 is a plan view for explaining an example of a peeling development step using the peeling device shown in FIG. 7 .

FIG. 12 is a plan view for explaining an example of the peeling development step according to the second embodiment of the present invention.

13 is a cross-sectional view of a liquid crystal panel with a support when the liquid crystal panel is manufactured as an electronic component to which the present invention is applied.

Hereinafter, a first embodiment of the method for manufacturing an electronic component including a glass film of the present invention will be described with reference to FIGS. 1 to 11 . In addition, in this embodiment, the following case will be described as an example: when manufacturing an organic EL panel as an electronic component, the organic EL panel with the support is separated by peeling off the glass film and the support. Separated into organic EL panel and support.

As shown in FIG. 1 , the manufacturing method of electronic components according to the first embodiment of the present invention includes: a laminate forming step S1 to form a laminate including a glass film; and a mounting step S2 to heat the glass film and The film mounts the electronic component elements; and the separation step S3 separates the laminated body on which the electronic component elements are mounted into the electronic component and the support body including the glass film. Among them, the laminated body forming step S1 and the mounting step S2 correspond to the preparation steps of the present invention.

In addition, as shown in FIG. 2 , the separation step S3 includes a peeling starting point forming step S4 for forming a peeling starting point in the laminated body, a first peeling developing step S5, and a second peeling developing step S6. Each step is explained in detail below.

(S1) Laminated body formation step

First, as shown in FIG. 3 , the glass film 2 is laminated on the support 1 to form a laminated body 3 .

Here, the glass film 2 is formed of, for example, silicate glass, silica glass, etc., preferably of borosilicate glass, more preferably of alkali-free glass. Glass (alkali free glass) is formed. If an alkali component is contained in the glass film 2, cations will be shed from the surface, which may cause a so-called alkaline phenomenon. In this case, the glass film 2 undergoes structural changes Therefore, if the glass film 2 is used in a bent state, there is a concern that the glass film 2 may be damaged starting from the roughened portion due to age-related deterioration. For the above reasons, when there is a possibility of using the glass film 2 in a non-flat state, it is preferable to form the glass film 2 with alkali-free glass.

In addition, the alkali-free glass here refers to the glass which does not substantially contain an alkali component (alkali metal oxide), specifically, it refers to the glass whose alkali component is 3000 ppm or less. Of course, from the viewpoint of preventing or mitigating the deterioration over time caused by the above reasons as much as possible, the glass is preferably 1000 ppm or less, more preferably 500 ppm or less, and particularly preferably 300 ppm or less.

The thickness dimension of the glass film 2 is set to 300 μm or less, preferably 200 μm or less, more preferably 100 μm or less. The lower limit of the thickness dimension can be set without particular restrictions, but in consideration of the workability after molding (when laminating with the support 1 or when peeling off, etc.), it is preferably set to 1 μm or more, preferably is 5μm or above.

In this embodiment, the support 1 is plate-shaped glass, and like the glass film 2, it is formed of well-known glass such as silicate glass, silica glass, borosilicate glass, and alkali-free glass. However, from the viewpoint of preventing unnecessary deformation or damage of the glass film 2 due to differences in thermal deformation as much as possible in the processing related to the manufacturing of electronic components involving heating (mounting step S2 in this embodiment) , the type of glass should be selected so that the difference in linear expansion coefficient between the support 1 and the glass film 2 becomes within 5×10 ^-7 /°C between 30°C and 380°C. In this case, it is preferable to use the same type of glass to form the support 1 and the glass film 2 .

The thickness of the support 1 is not particularly limited as long as the operability of the glass film 2 can be improved, and it is set to be the same as or greater than the thickness of the glass film 2 . Specifically, the thickness dimension of the support 1 is set to 300 μm or more, preferably 500 μm or more. The upper limit of the thickness dimension can be set without particular restriction, but is preferably limited to a thickness dimension that can withstand bending (bending) of the support 1 described later. Specifically, it is preferably set to 1000 μm or less, and preferably 700 μm or less.

In addition, the support 1 and the glass film 2 are formed by a known forming method such as the down-drawing method, preferably by the overflow down-drawing method. In addition, the float method, slot downdraw method, roll out method, up-draw process, etc. can also be used for forming. In addition, secondary processing (extending the glass primary molded body by redrawing) may be performed if necessary, and the thickness dimension may be set to less than 100 μm.

In the state of forming the laminated body 3, the support 1 and the glass film 2 are fixed to each other to the extent that they can be peeled off. The fixing method may be any method. In this embodiment, the plate glass as the support 1 and the glass film 2 are directly adhered to each other without an adhesive or the like interposed therebetween, thereby achieving mutual fixation.

At this time, the surface roughness of the surface 2 a of the glass film 2 on the support 1 side (the lower surface in FIG. 3 ) and the surface 1 a of the support 1 on the glass film 2 side (the upper surface in FIG. 3 ) Ra is all set to 2.0nm or less. By setting the surface roughness Ra of each surface 1a, 2a within the above range, the support 1 and the glass film 2 can be laminated in a state where they are fixed to each other without shifting (to form the laminated body 3). Of course, just keep it secret From the viewpoint of improving the affinity, the thickness is preferably 1.0 nm or less, and more preferably 0.2 nm or less.

On the other hand, the size of the surface roughness Ra of the surface 2b of the glass film 2 opposite to the support 1 is not particularly limited. However, in the mounting step S2 described later, it becomes a target surface for electronic component-related processing such as film formation. , so the surface roughness Ra is preferably 2.0nm or less, more preferably 1.0nm or less, especially 0.2nm or less.

In addition, from the viewpoint of protecting the edge portion of the glass film 2, in a state where the glass film 2 and the support 1 are laminated, the support 1 is exposed from the glass film 2 (see FIG. 3). In this case, the exposure amount of the support 1 from the glass film 2 is set to, for example, 0.5 mm or more and 10 mm or less, preferably 0.5 mm or more and 1.0 mm or less. By reducing the exposed amount of the support 1 (up to approximately 10 mm) as described above, the glass film 2 having a relatively large area can be fully and efficiently supported.

In this embodiment, as shown in FIG. 4 , the support 1 and the glass film 2 both have a rectangular shape. In addition, the support 1 is exposed from the glass film 2 on the entire periphery of the laminated body 3 in which the glass film 2 is laminated on the support 1, so that the support 1 is exposed from the glass film 2 at the corners 4 of the glass film 2. exposed. In addition, in this embodiment, the support 1 is exposed from the glass film 2 at all four edges of the laminated body 3, but of course, it can also be adopted at three edges or one edge, and the support 1 is exposed from the glass. The membrane 2 is exposed. In this case, it is desirable that the end surface of the glass film 2 coincides with the end surface of the support 1 at the edge of the unexposed side.

In addition, when forming the laminated body 3, the lamination may also be performed under reduced pressure. layer work. Thereby, when the glass film 2 is laminated on the support 1 , bubbles generated (remaining) between the glass film 2 and the support 1 can be reduced or eliminated.

(S2)Installation steps

After the laminated body 3 including the glass film 2 is formed as described above, the laminated body 3 is subjected to processes related to manufacturing electronic components including heating. Specifically, the organic EL unit 5 as an electronic component element is mounted. Thereby, as shown in FIG. 5 , the organic EL unit 5 is formed on the surface 2 b of the glass film 2 that becomes a part of the laminated body 3 on the opposite side to the support 1 . Then, the cover glass 6 is placed on the organic EL unit 5 and the periphery of the cover glass 6 is fixed to the glass film 2 to seal the organic EL unit 5 . Thereby, the organic EL panel 8 with a support in which the support 1 is fixed to the organic EL panel 7 is formed.

Here, the thickness dimension of the cover glass 6 is set to, for example, 300 μm or less, preferably 200 μm or less, and more preferably 100 μm or less. By setting the thickness dimension of the cover glass 6 as described above, the cover glass 6 can have appropriate flexibility.

In addition, the organic EL unit 5 can be mounted on the glass film 2 in any manner. For example, the organic EL unit 5 can be mounted on the surface 2 b of the glass film 2 on the opposite side to the support 1 by using a chemical vapor deposition (CVD) method. Or sputtering and other well-known film-forming methods are used to sequentially form films to form an anode layer, a hole transport layer (hole transport layer), a light-emitting layer, an electron transport layer, a cathode layer, etc., thereby forming the organic EL unit 5 (detailed illustrations are omitted) ). In addition, the method of fixing the cover glass 6 toward the glass film 2 is also arbitrary. For example, the cover glass 6 can also be fixed to the glass film 2 using known laser sealing technology. Glass film 2. In this case, film-forming processing using a CVD method, sputtering, or the like corresponds to processing related to manufacturing electronic components involving heating. Therefore, by forming the organic EL unit 5 on the surface 2 b of the glass film 2 on the opposite side to the support 1 as described above, the glass film 2 is heated. In addition, a new bond is formed between the glass film 2 and the support 1 due to this heating, and the fixing force between the glass film 2 and the support 1 is improved compared to the time of lamination (when the laminated body 3 is formed).

In addition, in the form shown in FIG. 5 , the cover glass 6 and the glass film 2 are directly fixed, but the cover glass may also be fixed using a known glass frit or spacer (not shown) as appropriate. 6 is then fixed on the glass film 2.

(S3) Separation step

After the organic EL panel 8 with a support is formed (prepared) as described above, the support 1 is peeled off from the glass film 2 constituting the organic EL panel 8 with the support, whereby the organic EL panel 8 with the support can be separated. Panel 8 is separated into organic EL panel 7 and support 1 (see FIG. 1 ). In addition, in FIG. 6A and subsequent figures, the organic EL unit 5 and the cover glass 6 included in the organic EL panel 8 with a support are omitted.

(S4) Peeling starting point forming step

In this embodiment, first, as shown in FIG. 6A , with the support 1 placed below and the glass film 2 placed above, the corners 4 of the glass film 2 are peeled off from the support 1 and placed at the corners. A peeling starting point 9 is formed between the portion 4 and the support 1 . Here, the method for forming the peeling starting point 9 is arbitrary. For example, the peeling starting point forming member 10 such as a knife is inserted between the corner 4 of the glass film 2 and the support 1 directly below the corner 4 The peeling starting point 9 is formed (see FIG. 6B ).

(S5) First peel development step

(S6) Second peel development step

As described above, after the peeling starting point 9 is formed between the glass film 2 and the support 1, the peeling starting point 9 is allowed to develop in a predetermined direction. FIG. 7 shows a top view of the peeling device 11 for performing the peeling. In addition, FIG. 8 shows a cross-sectional view of the main parts of the peeling device 11 shown in FIG. 7, and is a virtual cross-section along the first side 1c of the support 1 (the side extending in the longitudinal direction in FIG. 7). Section view during cutting. As shown in FIGS. 7 and 8 , the peeling device 11 includes: a holding member 12 for holding any one of the organic EL panel 7 including the glass film 2 and the support 1 ; and a plurality of adsorption pads 13 for adsorbing the other workpiece. ; The telescopic bag 14 is installed on the adsorption pad 13; the exhaust chamber 15 is connected to the telescopic bag 14; and the exhaust driving part 16 is connected to the exhaust chamber 15. In addition, in the present embodiment, the peeling device 11 further includes a height position changing device 17 that moves the suction pad 13 connected to the exhaust chamber 15 via the telescopic bag 14 relative to the lifting object (here, The height position of the support 1) is changed. The details of each element are explained below.

Since the holding member 12 includes a flat mounting surface 18 , the organic EL panel 8 with a support including the laminate 3 can be supported by the mounting surface 18 . In this embodiment, the organic EL panel with the support is supported in a state where the surface 2b of the glass film 2 opposite to the support 1 (actually the surface of the cover glass 6) is in contact with the mounting surface 18. 8.

In addition, a groove 19 of a predetermined shape is formed on the mounting surface 18 of the holding member 12, and a suction hole 20 opening toward the groove 19 is formed. This groove 19 is arranged along the The organic EL panel 8 with the support is placed on the mounting surface 18 so as to form the peripheral edge portion (actually the peripheral edge portion of the cover glass 6) of the organic EL panel 8 with the support. In the state of being placed on the surface 18, the entire area of the groove 19 is covered by the cover glass 6 (only the glass film 2 is shown in FIG. 7). Therefore, by driving the suction device 21 (see FIG. 8 ) connected to the suction hole 20 to suction (for example, vacuum) the space surrounded by the cover glass 6 and the groove 19 , the space surrounded by the cover glass 6 is The glass film 2 is adsorbed and held on the placement surface 18 .

In addition, the adsorption pressure (vacuum pressure) at this time is set to a level such that the glass film 2 can be reliably maintained without being damaged during the peeling operation. Specifically, the adsorption pressure of the glass film 2 is set to 0.03 MPa or more and 0.15 MPa or less, preferably 0.05 MPa or more and 0.10 MPa or less.

The adsorption pad 13 is arranged above the support 1 in a predetermined arrangement as shown in FIG. 7 , and is configured to adsorb the surface 1 b of the support 1 opposite to the glass film 2 . In this embodiment, a plurality of adsorption pads 13 are arranged along the first side 1 c of the support 1 , and a plurality of adsorption pads 13 are arranged along the second side 1 d of the support 1 . In the example shown in FIG. 7 , five adsorption pads 13 are arranged along the first side 1 c of the support 1 , and similarly, the five adsorption pads 13 are arranged along the first side 1 c of the support 1 . It is arranged on the second side 1d of the intersection (the side extending in the transverse direction in FIG. 7 ). Therefore, in this case, five adsorption pads 13 are arranged in five rows, for a total of 25 pads.

Here, when the adsorption portion of the adsorption pad 13 is circular, its outer diameter (maximum outer diameter) is set to, for example, 20 mm or more and 80 mm or less, preferably 20 mm or more and 40 mm or less. In addition, the level of the adsorption pad 13 The interval in the direction is arbitrary. For example, it is set to 0 mm or more and 100 mm or less, and preferably it is set to 1 mm or more and 50 mm or less. In addition, the adsorption pressure of the adsorption pad 13 on the support 1 is set to, for example, 0.1 MPa or more and 1.0 MPa or less, preferably 0.2 MPa or more and 0.8 MPa or less.

A telescopic bag 14 is installed on each adsorption pad 13 . In this embodiment, the two-stage telescopic bag 14 is integrally installed on the anti-adsorption side of the adsorption pad 13 (see FIG. 8 ). Here, the telescopic bag 14 can be contracted in the following manner: when the suction pad 13 is used to suck the support 1 , the suction pad 13 is raised due to the negative pressure (depressurized state) generated in the suction pad 13 and the telescopic bag 14 . In addition, as long as the telescopic bag 14 is collapsible as described above, its material and structure are arbitrary. For example, the adsorption pad 13 and the telescopic bag 14 may be made of the same material, or may be made of different materials. In addition, as will be described later, when the responsiveness of the support 1 (the pulling speed, the amount of lifting, etc.) of the support 1 is to be changed according to the pulling position, the corresponding adsorption pad 13 can also be made to stretch and contract. The materials and structures of the bags 14 (especially the telescopic bags 14) are different. For example, like this embodiment, when the peeling development is performed in two stages (the first peeling development step S5 and the second peeling development step S6), the expansion bag used in the first peeling development step S5 may also be used. 14 (the telescopic bags 14a to 14e in the leftmost row of Fig. 7) are made of a material and structure that is relatively easy to expand and contract, and the telescopic bags 14 (the telescopic bags 14 from the left side in Fig. 7) used in the second peeling development step S6 are The telescopic bags 14f, 14g...) in the second to fifth rows are made of materials and structures that are relatively difficult to expand and contract. Here, an example of a material that is relatively easy to expand and contract is silicon rubber, and an example of a material that is relatively difficult to expand and contract is nitrile rubber.

The exhaust chamber 15 is connected to the telescopic bag 14 , and the exhaust chamber 15 is connected to an exhaust drive unit 16 such as a pump. Here, the exhaust chamber 15 is divided for each telescopic bag 14, so that the exhaust chamber 15 can be exhausted independently, whereby the suction pad 13 and the telescopic bag 14 can be driven independently. In this embodiment, one exhaust driving part 16 is connected to a plurality of exhaust chambers 15 , and between each exhaust chamber 15 and the exhaust driving part 16 , there is provided a link between the exhaust chamber 15 and the exhaust driving part 16 . The switching valve 22 switches between the connecting state and the blocking state between the parts 16. Here, for example, by using the exhaust driving unit 16 as an electric pump and the switching valve 22 as a solenoid valve, and electrically controlling the exhaust driving unit 16 and the switching valve 22 using a control device not shown, it is possible to independently control the exhaust driving unit 16 and the switching valve 22 independently. The operation of the adsorption pad 13 and the telescopic bag 14 described below is electrically controlled.

In this embodiment, the height position changing device 17 includes: a mounting part 23 that mounts all the suction pads 13 and telescopic bags 14 through the exhaust chamber 15; and a lift driving part 24 that drives the mounting part 23 up and down (see Figure 8). Therefore, in this case, by moving the mounting portion 23 in the height direction (the normal direction of the support 1 ) using the lifting drive portion 24 , all the suction pads 13 and telescopic bags 14 fixed to the mounting portion 23 can be aligned with each other. The mounting portion 23 moves along the height direction together. In addition, by holding the mounting part 23 at a predetermined height position using the lifting drive part 24, the height positions of all the suction pads 13 and telescopic bags 14 fixed to the mounting part 23 are maintained at a predetermined position relative to the support body 1.

In this embodiment, the maximum contraction amount of the telescopic bag 14 is set by lowering the mounting part 23 to a position where the suction pad 13 contacts the support 1 and the telescopic bag 14 only contracts by a predetermined amount. In other words, the adsorption pad 13 is in contact with the support 1 The maximum amount of lifting is 1. Right now, As shown in FIG. 9 , the maximum shrinkage amount of the bellows 14 caused by the subsequent pressure reduction is set based on the shrinkage amount of the bellows 14 when the suction pad 13 is brought into contact with the support 1 (initial shrinkage amount z0 ) (from FIG. 9 ). The value z1-z0 obtained by subtracting the initial contraction amount z0 from the contraction amount z1 during decompression shown in 10). Therefore, when the peeling progresses and the height position of the exhaust chamber 15 is kept constant, if the initial contraction amount z0 of the telescopic bag 14 is small, correspondingly, the contraction amount z1-z0 of the telescopic bag 14 during decompression increases, If the initial contraction amount z0 is large, the contraction amount z1-z0 of the telescopic bag 14 during decompression decreases accordingly. As a specific example, the contraction amount z1-z0 of the telescopic bag 14 during decompression, that is, the maximum lifting amount, is set to 2 mm or more and 10 mm or less, preferably 2 mm or more and 5 mm or less.

Next, mainly based on FIGS. 7 to 11 , an example of the peeling development operation (first peeling development step S5 and second peeling development step S6 ) using the peeling device 11 having the above-described structure will be described together with the functions and effects of the present invention. .

First, the organic EL panel 8 with the support to be peeled is loaded onto the holding member 12 with the support 1 on the upper side (see FIGS. 7 and 8 ). Then, by driving the suction device 21 , the glass film 2 is sucked and held on the placement surface 18 of the holding member 12 . In addition, the lifting and lowering driving part 24 of the height position changing device 17 lowers the suction pad 13 and the telescopic bag 14 arranged above the organic EL panel 8 with the support, so that the suction pad 13 contacts the glass of the support 1 The surface 1b on the opposite side of the film 2 (see Fig. 9). At this point in time, none of the adsorption pads 13 is in a decompressed state, and therefore no adsorption force acts on the support 1 . In addition, for the purpose of preventing the support 1 and the glass film 2 from re-adhering, a film 25 is interposed between the peeling starting point 9 formed in the corner 4 .

Then, by driving the exhaust driving unit 16 , the exhaust chamber 15 is exhausted, and the internal spaces of the telescopic bag 14 and the adsorption pad 13 communicating with the exhaust chamber 15 are decompressed. Here, the switching valve 22 provided in the exhaust chamber 15 of the adsorption pad 13 a closest to the peeling starting point 9 and the telescopic bag 14 a is opened, so that the adsorption pad 13 a is adsorbed to the support 1 . In addition, the pressure inside the telescopic bag 14a is reduced and further contracted compared to the state when the pressure reduction starts (the state shown in FIG. 9), whereby the support 1 in the state adsorbed by the adsorption pad 13a is given self-propagation. Peeling force F of the glass film 2 (see Fig. 10). Thereby, the corner portion 4 of the support 1 that is adsorbed by the adsorption pad 13a to which the telescopic bag 14a is attached is pulled upward, and the peeling starting point 9 located directly below the corner portion 4 is pulled toward the area directly under the adjacent adsorption pad 13b (Fig. 7) development in the direction indicated by arrow X).

At this time, as the support 1 is pulled upward, a predetermined flexural deformation occurs. In addition, the suction pad 13a rises as the telescopic bag 14a contracts and pulls the support 1 in the adsorbed state upward. As a result, the support 1 tilts from a flat posture in accordance with the flexural deformation of the support 1 (see FIG. 10). Here, the telescopic bag 14 shows a deformation resistance smaller than the support body 1 and the adsorption pad 13 a. Therefore, the telescopic bag 14 a easily and preferentially undergoes bending deformation in response to the bending deformation of the support body 1 . Therefore, the adsorption pad 13a in the adsorption state can be used to prevent or suppress the generation of unnecessary bending moment in the support 1 as much as possible, thereby allowing peeling to proceed safely while preventing the support 1 from being cracked. In addition, with this structure, after the suction pad 13a absorbs the support 1, the telescopic bag 14a must be contracted, so the support 1 can be reliably pulled up (the peeling force F is imparted to the support 1).

In addition, at this point in time, the adsorption pad 13b has not entered a decompressed state. In addition, The height position changing device 17 is used to maintain the predetermined height position, resulting in a state of contact with the support 1 . Therefore, a particularly large force from the suction pad 13 b does not act on the support 1 . From the above, depending on the degree of pulling of the support 1 by the suction pad 13a, as shown in FIG. 10, the peeling starting point 9 develops to the area directly below the adjacent suction pad 13b. Thereby, the next suction pad 13b can be pulled up smoothly and easily, and peeling can progress more smoothly. To explain in detail, since the next suction pad 13b includes the telescopic bag 14b, as the support 1 (corner portion 4) directly below the suction pad 13a is pulled up, the telescopic bag 14b can be moved without imparting suction force. Contract and lift the suction pad 13b in an inclined manner. Thereby, when the suction pad 13a is pulled up, the peeling starting point 9 can be easily developed to the area directly below the next suction pad 13b. Thereby, the adsorption pad 13a in the adsorption state can be used to prevent or suppress the generation of unnecessary bending moment in the support 1 as much as possible, thereby preventing the support 1 from being cracked and allowing peeling to proceed safely.

In this way, after the support 1 is lifted up by the adsorption pad 13a closest to the peeling starting point 9, the adsorption pad 13b adjacent to the adsorption pad 13a in the direction along the first side 1c is lifted. The support 1 is raised while being sucked in the order from the suction pad 13e closest to the second side 1d, so that the peeling starting point 9 formed at the corner 4 spreads over and along the entire first side 1c (see Figure 7). In this embodiment, by sequentially opening the switching valves 22 installed in each exhaust chamber 15, the corresponding adsorption pads 13b (13c...) and telescopic bags 14b (14c...) ) sequentially enters a decompressed state, causing the contraction of the telescopic bags 14b (14c...) and the upward operation of the adsorption pads 13b (13c...) as described above. Thereby, the support 1 is moved along the first side 1c The pulling and peeling progresses over the entire first side 1 c of the support 1 , whereby the vicinity of the first side 1 c is completely peeled off from the glass film 2 (the state in which the peeling region 9 ′ is formed as shown in FIG. 11 ). With this, the first peeling development step S5 ends.

Then, the second peeling development step S6 is started. Specifically, the adsorption pads 13f... and the telescopic bags 14f... in the row closest to the peeling area 9' are used to move the peeling area 9' toward the second row along the support 1. The direction Y of side 1d develops (refer FIG. 11). In this case, by simultaneously opening the switching valves 22 installed in each exhaust chamber 15, the corresponding plurality (here, five each) of the adsorption pads 13f... and the telescopic bags 14f. ..... becomes a decompressed state, causing the contraction of the bellows 14f... and the upward operation of the adsorption pad 13f... as described above. Thereby, the area directly below the adsorption pad 13f in the support 1 is pulled up, and the peeling area 9' extends in the direction Y along the second side 1d. By pairing the adjacent adsorption pads 13g... (13h..., 13i...) and the telescopic bags 14g... (14h..., 14i...) also perform the above operation in the same way, then the peeling area 9' develops sequentially along the second side 1d of the support 1. Furthermore, the peeling area 9' reaches the other end of the second side 1d of the support 1 (the end on the side opposite to the peeling starting point 9 side), whereby the support 1 and the glass film 2 are completely peeled off. Alternatively, the pulling operation is terminated when the peeling area 9' reaches a predetermined size, and if necessary, the support 1 is completely peeled off the glass film 2 using, for example, an operator's hands. Thereby, the second peeling development step S6 is completed, and the organic EL panel 7 including the glass film 2 is separated from the support 1 .

The first embodiment of the method for manufacturing an electronic component including a glass film of the present invention has been described above. However, it goes without saying that this manufacturing method can be used within the scope of the present invention. Take any form within.

FIG. 12 is a plan view for explaining an outline of the separation step S3' according to the second embodiment of the present invention. As shown in FIG. 12 , the separation step S3 ′ of this embodiment not only includes the peeling starting point forming step S4 of forming the peeling starting point 9 at the corner 4 of the glass film 2 , but is also different from the first embodiment. The difference between the separation step S3 of this method is that it includes a peeling development step S7 in which the peeling starting point 9 is developed along the diagonal line D of the support 1 . That is, in the first embodiment, the case where the peeling is sequentially advanced along the respective sides 1c and 1d of the support 1 is exemplified. However, in the present embodiment, the peeling is made along the diagonal line D of the support 1 And develop.

In this case, the suction pad 13 and the telescopic bag 14 are operated in a different order from the first embodiment. Specifically, as shown in FIG. 12 , one or more adsorption pads 13A, 13B, 13B, 13C..., 13I are arranged in a direction orthogonal to the diagonal line D of the support 1 and The plurality of telescopic bags 14A, 14B, 14B, 14C..., 14I are respectively regarded as a group, so that the adsorption pads 13A (13B...) and the telescopic bags 14A (14B) of each group are ...) work synchronously in groups. Therefore, if this is the case, first, the suction pad 13A and the telescopic bag 14A with the peeling starting point 9 located directly below are operated in the same manner as in the first embodiment to lift the support 1 . Thereby, the peeling starting point 9 develops toward the adjacent adsorption pad 13B and the adsorption pad 13B in the direction along the diagonal line D of the support 1 . In this way, after the peeling starting point 9 starts to develop along the diagonal line D, the adjacent suction pads 13B, 13B, and telescopic bags 14B and 14B are operated to lift the support 1 . Thereby, the peeling starting point 9 extends beyond the suction pad 13B and directly below the suction pad 13B, and It develops toward the adsorption pad 13C, the adsorption pad 13C, and the adsorption pad 13C adjacent to these adsorption pads 13B and 13B. By sequentially performing the above operations from the peeling starting point 9 side on the diagonal line D to the opposite side (the frontmost side where peeling progresses), the support 1 and the glass film 2 are completely peeled off.

As described above, according to the method of manufacturing a glass film (peeling method) and the method of manufacturing an electronic component of the present invention, the support 1 and the glass film 2 can be safely peeled off regardless of the peeling direction.

In addition, the above description also exemplifies the case where, in the peeling starting point forming step S4, the peeling starting point is inserted between the corner portion 4 of the glass film 2 and the support 1 with the glass film 2 on the upper side. The member 10 is formed, and in each of the peeling development steps S5 to S7, with the support 1 as the upper side, the adsorption pads 13a to 13i (13A to 13I) are adsorbed to the surface 1b of the support 1 and pulled up. , but of course it can also take a different form. Although illustration is omitted, in the peeling starting point forming step S4 , the peeling starting point 9 may be formed between the support 1 and the glass film 2 with the support 1 on the upper side. Alternatively, in each peeling development step S5 to S7, the adsorption pads 13a to 13i (13A to 13I) may be adsorbed to the surface 2b (cover glass 6) of the glass film 2 with the glass film 2 on the upper side. ) and lift.

In addition, in the first embodiment, the height position changing device 17 is used to set all the suction pads 13a to 13i and the telescopic bags 14a to 14i to the same height position, but of course other methods may also be adopted. form. For example, although illustration is omitted, the adsorption pads 13a to 13e used in the first peeling development step S5 and the adsorption pad 13f used in the second peeling development step S6 can also be used. Different height position changing devices are used in the suction pad 13i, so that the shrinkage amount (z1-z0) caused by the telescopic bags 14a to the telescopic bags 14e and the telescopic bags 14f to the telescopic bags 14i during decompression in the first peeling development step S5 and It is different in the second peel development step S6.

In addition, the exhaust driving unit 16 may be, for example, although not shown in the figure, the adsorption pads 13a to 13e used in the first peeling development step S5, and the suction pad used in the second peeling development step S6. Different exhaust driving parts are used in the adsorption pads 13f to 13i.

In addition, in the above-mentioned embodiment, the case where the peeling starting point 9 is formed in the corner part 4 of the glass film 2 has been exemplified, but it goes without saying that other forms may be adopted. For example, as shown in FIG. 11 , before the peeling development step S5 to the peeling development step S7 , the peeling region 9 ′ serving as the peeling starting point may be formed over the entire first side 1 c of the support 1 , or may be formed over the second side 1 d The peeling area 9' serving as the starting point of peeling is formed over the entire area. Alternatively, if a peeling area can be newly formed at the corner 4 of the glass film 2 through the operation of the suction pad 13a and the telescopic bag 14a shown in FIG. 7 , the peeling starting point forming step S4 may be omitted.

In addition, in the above-mentioned embodiment, the case where plate-shaped glass is used as the support 1 and the support 1 and the glass film 2 are fixed to each other by direct close contact is exemplified. The present invention can also be applied to the laminate 3 in which the glass film 2 and the support 1 are fixed. For example, the support is composed of an acrylic adhesive layer, a silicone film layer, an inorganic film layer (Indium Tin Oxide (ITO), oxide, metal, carbon) and other layers containing non-glass materials, and plate glass. 1. A laminated body (not shown) in which the non-glass material layer and the glass film 2 are tightly bonded can also be used Apply the present invention.

In addition, in the above description, the case where the organic EL panel 7 is manufactured as an electronic component has been exemplified, but it goes without saying that the present invention can also be applied to other manufacturing methods of electronic components. FIG. 13 shows a cross-sectional view of an example of the liquid crystal panel 31 with a support. This panel 31 is formed by fixing a pair of supports 1 and 1 on both sides of a liquid crystal panel 32 as a final product, and is formed in the following manner, for example. That is, first, a pair of laminated bodies 3 and 3 in which the support 1 and the glass film 2 are laminated are formed (laminated body forming step S1). Then, a spacer 33 is formed on the surface 2b of the glass film 2 of one of the laminated bodies 3, and the spacer 33 defines a space for sealing the liquid crystal (not shown), and the other laminated layer is fixed on the spacer 33. Glass film 2 of body 3 (installation step S2). After the liquid crystal panel 31 with the support is prepared in the above manner, the support 1 is peeled off piece by piece using the above peeling method, and one liquid crystal panel 31 with the support is separated into two pieces of the support 1, 1 and One liquid crystal panel 32 (separation step S3). Therefore, the present invention can also be applied when manufacturing the liquid crystal panel 32, and the liquid crystal panel 31 with the support can be safely and easily separated into the support 1 and the liquid crystal panel without damaging the glass film 2. 32.

Of course, when the glass film 2 itself is obtained (manufactured) as a final product, by applying the present invention, the support 1 and the glass can be safely and easily combined without damaging the glass film 2. Membrane 2 separates.

1:Support

1a, 1b, 2a, 2b: Surface

2: Glass film

3: Laminated body

4: Corner

8: Organic EL panel with support

9: Peel off the starting point

11: Peeling device

12: Maintain components

13(13a~13c): adsorption pad

14(14a~14c): telescopic bag

15:Exhaust chamber

16: Exhaust drive part

17:Height position changing device

18:Placement surface

19:Slot

20:Suction hole

21:Suction device

22:Switching valve

23:Installation Department

24:Lifting drive part

25:Membrane

Claims (9)

A method for manufacturing a glass film, comprising: a preparation step of preparing a laminate in which a glass film subjected to manufacturing-related processing is laminated on a support supporting the glass film; and a separation step of separating the support and the glass film. One of the workpieces in the glass film is peeled off from the other workpiece, and the prepared laminated body is separated into the support and the glass film. The manufacturing method of the glass film is characterized in that in the separation step , use an adsorption pad equipped with a telescopic bag, use the adsorption pad to adsorb one of the workpieces by reducing the pressure, and shrink the telescopic bag to make the adsorption pad rise, giving one of the workpieces a self-propelled The peeling force of the other workpiece. The method for manufacturing a glass film according to claim 1, wherein a plurality of the adsorption pads are arranged along the peeling development direction, and the adsorption pad on the rear side of the peeling development is used to adsorb one of the workpieces, so that the telescopic bag starts shrink, and then use the adsorption pad on the front side of peeling development adjacent to the adsorption pad on the rear side of peeling development to absorb one of the workpieces, so that the telescopic bag starts to shrink. The manufacturing method of a glass film according to claim 2, wherein by shrinking the telescopic bag installed on the adsorption pad on the rear side of the peeling development, the peeling development area reaches at least the adsorption pad on the front side of the peeling development. is directly below the condition, and the adsorption pad on the front side of the peeling development is used to adsorb one of the workpieces and the telescopic bag begins to shrink. The method for manufacturing a glass film according to any one of claims 1 to 3, wherein a height position changing device capable of changing the height position of the adsorption pad relative to one of the workpieces is used to adjust the expansion and contraction. The amount of contraction of the sac during decompression. The method for manufacturing a glass film according to any one of claims 1 to 3, wherein one of the workpieces is in a rectangular shape, and the separation step includes: a peeling starting point forming step, at a corner of the one workpiece. The first peeling development step is to make the peeling starting point develop along the first side of one of the workpieces; and the second peeling development step is to make the peeling starting point develop along the first side. The peel development area develops along the second side of one of the workpieces that is orthogonal to the first side. The method for manufacturing a glass film according to claim 5, wherein in the first peeling development step, a telescopic bag installed with relatively easy deformation is used as an adsorption pad of the telescopic bag, and in the second peeling step In the development step, a telescopic bag mounted with a relatively difficult deformation is used as an adsorption pad for the telescopic bag. The manufacturing method of glass film according to any one of claims 1 to 3, wherein The support is plate glass, and in the laminated body, the plate glass and the glass film are directly in close contact with each other. A device for manufacturing a glass film, including a peeling device for laminating one of the support and the glass film of the laminate in a state where the glass film is laminated on a support that supports the glass film. Peeling from another workpiece, the glass film manufacturing device is characterized in that the peeling device includes an adsorption pad that adsorbs one of the workpieces, and a telescopic bag is installed on the adsorption pad; the adsorption pad is configured as, The one workpiece is adsorbed by reducing the pressure, and the telescopic bag is contracted to raise the adsorption pad, thereby imparting a peeling force to the one workpiece from the other workpiece. A method of manufacturing an electronic component, including a preparation step of preparing an electronic component with a support, wherein the electronic component with the support is a glass film mounted with electronic component elements laminated on a support that supports the glass film the laminated body in a state; and a separation step of peeling one of the support and the glass film from the other workpiece, and separating the prepared electronic component with the support into one containing the glass The electronic component of the film and the support, the manufacturing method of the electronic component is characterized in that in the separation step, an adsorption pad equipped with a telescopic bag is used, and the pressure is reduced and the adsorption pad is used to adsorb the one of the workpieces, and the telescopic bag is contracted to make the adsorption pad rise, and the one of the workpieces is given a self-contained function from the other The peeling force of the workpiece.

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