TW201605636A - Peeling apparatus and peeling method for laminate body and manufacturing method of electronic device - Google Patents

Peeling apparatus and peeling method for laminate body and manufacturing method of electronic device Download PDF

Info

Publication number
TW201605636A
TW201605636A TW104118005A TW104118005A TW201605636A TW 201605636 A TW201605636 A TW 201605636A TW 104118005 A TW104118005 A TW 104118005A TW 104118005 A TW104118005 A TW 104118005A TW 201605636 A TW201605636 A TW 201605636A
Authority
TW
Taiwan
Prior art keywords
peeling
substrate
liquid
laminated body
casing
Prior art date
Application number
TW104118005A
Other languages
Chinese (zh)
Other versions
TWI663060B (en
Inventor
Yasunori Ito
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201605636A publication Critical patent/TW201605636A/en
Application granted granted Critical
Publication of TWI663060B publication Critical patent/TWI663060B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present invention relates to a peeling apparatus for a laminate body, which is characterized by comprising: an inclination device for enabling a laminate body to be inclined relative to the horizontal direction, wherein the laminate body is formed by a first substrate and a second substrate peelably adhered to each other via an absorbing layer; a liquid supply device for enabling at least one lateral side at the upper end part of the inclined laminate body to be full of liquid; and a peeling device for performing a peeling operation on the interface between the first substrate and the absorbing layer in such a way that the inclined laminate body is peeled from the upper end part toward a lower end part thereof. .

Description

積層體之剝離裝置及剝離方法、以及電子裝置之製造方法 Stripping device and peeling method of laminated body, and manufacturing method of electronic device

本發明係關於一種積層體之剝離裝置及剝離方法、以及電子裝置之製造方法。 The present invention relates to a peeling device and a peeling method for a laminate, and a method for manufacturing the electronic device.

伴隨著顯示面板、太陽電池、薄膜二次電池等電子裝置之薄型化、輕量化,要求用於該等電子裝置之玻璃板、樹脂板、金屬板等基板(第1基板)之薄板化。 In order to reduce the thickness and weight of an electronic device such as a display panel, a solar cell, or a thin film secondary battery, a thin plate of a substrate (first substrate) such as a glass plate, a resin plate, or a metal plate for the electronic device is required.

然而,若基板之厚度變薄,則基板之處理性劣化,因此,難以於基板之表面形成電子裝置用功能層(薄膜電晶體(TFT:Thin Film Transistor)、彩色濾光片層(CF:Color Filter))。 However, when the thickness of the substrate is reduced, the substrate is degraded in a rational manner. Therefore, it is difficult to form a functional layer for an electronic device on the surface of the substrate (Thin Film Transistor (TFT), color filter layer (CF: Color). Filter)).

因此,提出了如下電子裝置之製造方法,即,於基板之背面貼附玻璃製之補強板(第2基板),構成藉由補強板而補強了基板之積層體,以積層體之狀態於基板之表面形成功能層。於該製造方法中,基板之處理性提昇,因此,可於基板之表面良好地形成功能層。而且,補強板於功能層形成後自基板剝離。 Therefore, there has been proposed a method of manufacturing an electronic device in which a reinforcing plate (second substrate) made of glass is attached to the back surface of the substrate, and a laminate of the substrate is reinforced by the reinforcing plate, and the substrate is laminated in a state of being laminated. The surface forms a functional layer. In this manufacturing method, the substrate is rationally improved, and therefore, the functional layer can be favorably formed on the surface of the substrate. Moreover, the reinforcing plate is peeled off from the substrate after the functional layer is formed.

專利文獻1中揭示之補強板之剝離方法係藉由自位於矩形狀之積層體之對角線上之兩個角部之一者朝向另一者使補強板或基板、或者其雙方向使彼此相隔之方向彎曲變形而進行。此時,為了順利地進行剝離,於積層體之其中一個角部製成剝離起始部。剝離起始部係藉由自積層體之端面將剝離刀刺入至基板與補強板之界面特定量而製成。 The peeling method of the reinforcing plate disclosed in Patent Document 1 is such that the reinforcing plate or the substrate or the two directions thereof are separated from each other by one of the two corner portions on the diagonal line of the rectangular laminated body. The direction is bent and deformed. At this time, in order to perform the peeling smoothly, a peeling start portion is formed in one of the corner portions of the laminated body. The peeling start portion is formed by piercing the peeling blade from the end surface of the laminated body to a certain amount of the interface between the substrate and the reinforcing plate.

另一方面,於專利文獻2中揭示有於基板與元件形成層之界面噴 射離子化液體而自基板將元件剝離之剝離方法。 On the other hand, Patent Document 2 discloses an interface spray between a substrate and an element forming layer. A method of stripping the element from the substrate by ionizing the liquid.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]國際公開第2011/024689號 [Patent Document 1] International Publication No. 2011/024689

[專利文獻2]日本專利特開2005-79553號 [Patent Document 2] Japanese Patent Laid-Open No. 2005-79553

於專利文獻2之剝離方法中,存在如下問題:吹送之液體不易遍及剝離前線,無法順利地進行元件形成層之剝離。 In the peeling method of Patent Document 2, there is a problem that the liquid to be blown is not easily spread over the peeling front line, and the peeling of the element forming layer cannot be smoothly performed.

本發明係鑒於此種課題而完成者,其目的在於提供一種係一面對第1基板與第2基板之界面供給液體一面以界面進行剝離者,且可順利且以較短時間進行利用液體之剝離的積層體之剝離裝置及剝離方法、以及電子裝置之製造方法。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a method in which a liquid is supplied to an interface between a first substrate and a second substrate while being peeled off at an interface, and the liquid can be used smoothly and in a short period of time. The peeling device and the peeling method of the peeled laminated body, and the manufacturing method of the electronic device.

本發明之積層體之剝離裝置之一態樣為了達成上述目的,其特徵在於具備:傾斜器件,其使第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體相對於水平方向傾斜;液體供給器件,其使傾斜之上述積層體之至少上端部側之側面充滿液體;及剝離器件,其自傾斜之上述積層體之上端部朝向下端部,於上述第1基板與上述吸附層之界面進行剝離。 In order to achieve the above object, an aspect of the apparatus for peeling a laminated body according to the present invention includes: a tilting device that laminates a first substrate and a second substrate with a pressure-sensitive adhesive layer interposed therebetween; a liquid supply device that fills a side surface of at least the upper end side of the inclined laminated body with a liquid; and a peeling device that is inclined from the upper end portion of the laminated body toward the lower end portion on the first substrate and the above The interface of the adsorption layer is peeled off.

本發明之積層體之剝離裝置之另一態樣為了達成上述目的,係藉由對第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體,使上述第1基板及上述第2基板中之至少一個基板沿著自其一端側朝向另一端側之剝離行進方向彎曲而於上述第1基板與上述吸附層之界面進行剝離者,其特徵在於具備:剝離組裝體,其具備保持上述第1基板之第1保持構件、保持上述第2基板之第2保持構件、及包圍上述積層 體之第1殼體,且將由上述第1保持構件、上述第2保持構件、及上述第1殼體包圍之空間部構成為液槽;傾斜器件,其使上述剝離組裝體相對於水平方向傾斜;液體供給器件,其對上述剝離組裝體之上述液槽供給液體,使上述積層體之側面充滿液體;及剝離器件,其使上述第1保持構件及上述第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之上述剝離行進方向彎曲。 In another aspect of the apparatus for peeling a laminated body of the present invention, in order to achieve the above object, the first substrate and the first substrate and the second substrate are attached to each other via a laminate which is detachably attached to the adsorption layer. At least one of the second substrates is bent along a peeling traveling direction from the one end side toward the other end side, and is peeled off at an interface between the first substrate and the adsorption layer, and is characterized in that it includes a peeling assembly. a first holding member that holds the first substrate, a second holding member that holds the second substrate, and a layer that surrounds the laminate a first casing of the body, wherein the space portion surrounded by the first holding member, the second holding member, and the first casing is configured as a liquid tank; and the tilting device tilts the peeling assembly with respect to a horizontal direction a liquid supply device that supplies a liquid to the liquid tank of the peeling assembly to fill a side surface of the laminated body with a liquid, and a peeling device that at least one of the first holding member and the second holding member It is curved along the peeling traveling direction from the upper end portion toward the lower end portion.

本發明之積層體之剝離方法之一態樣為了達成上述目的,其特徵在於具備:傾斜步驟,其使第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體相對於水平方向傾斜;液體供給步驟,其使傾斜之上述積層體之至少上端部側之側面充滿液體;及剝離步驟,其自傾斜之上述積層體之上端部朝向下端部於上述第1基板與上述吸附層之界面進行剝離;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於藉由上述界面之剝離而依序出現之剝離面上向下方移動一面將上述剝離面濡濕。 In order to achieve the above object, an aspect of the method for peeling a laminated body according to the present invention is characterized in that the step of inclining the first substrate and the second substrate with respect to the second substrate through which the adsorption layer is peeled off is a liquid supply step of filling the side surface of at least the upper end side of the inclined laminated body with a liquid; and a peeling step of tilting the upper end portion of the laminated body toward the lower end portion to the first substrate and the adsorption The interface of the layer is peeled off; and in the peeling step, the liquid is continuously supplied from the outside of the laminate, and the surface is moved downward by the gravity on the peeling surface which sequentially appears by the peeling of the interface The above-mentioned peeling surface is wetted.

本發明之積層體之剝離方法之另一態樣為了達成上述目的,係藉由對第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體使上述第1基板及上述第2基板中之至少其中一個基板沿著自其一端側朝向另一端側之剝離行進方向彎曲而於上述第1基板與上述吸附層之界面進行剝離者,其特徵在於:使用剝離組裝體,該剝離組裝體具備保持上述第1基板之第1保持構件、保持上述第2基板之第2保持構件、及包圍上述積層體之第1殼體,且將由上述第1保持構件、上述第2保持構件、及上述第1殼體包圍之空間部構成為液槽,且該積層體之剝離方法具備:傾斜步驟,其使上述剝離組裝體相對於水平方向傾斜;液體供給步驟,其對上述剝離組裝體之上述液槽供給液體,使上述積層體之側面充滿液體;及剝離步驟,其使上述第1保持構件及上述第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之上述剝離行進 方向彎曲;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於藉由上述界面之剝離而依序出現之剝離面上向下方移動一面將上述剝離面濡濕。 In another aspect of the method for peeling a laminated body of the present invention, the first substrate and the above-mentioned first substrate and the above-mentioned first substrate and the second substrate are attached to each other via a laminate which is detachably attached to the second substrate. At least one of the second substrates is bent along a peeling traveling direction from the one end side toward the other end side and is peeled off at an interface between the first substrate and the adsorption layer, and is characterized in that a peeling assembly is used. The peeling assembly includes a first holding member that holds the first substrate, a second holding member that holds the second substrate, and a first case that surrounds the laminated body, and the first holding member and the second holding member And the space portion surrounded by the first casing is configured as a liquid tank, and the method for peeling the laminated body includes: a tilting step of inclining the peeling assembly with respect to a horizontal direction; and a liquid supply step of the peeling assembly The liquid tank supplies a liquid to fill a side surface of the laminated body with a liquid, and a peeling step of holding at least one of the first holding member and the second holding member Along the member towards the upper portion from the lower end portion of the release travel The direction is curved; and in the peeling step, the liquid is continuously supplied from the outside of the laminated body, and the peeling surface is moved downward by gravity on the peeling surface which sequentially appears by peeling of the interface The face is damp.

本發明之電子裝置之製造方法之一態樣為了達成上述目的,係具備:功能層形成步驟,其對於第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體於上述第1基板之露出面形成功能層;及分離步驟,其自形成有上述功能層之上述第1基板分離上述第2基板;其特徵在於:上述分離步驟具備:傾斜步驟,其使上述積層體相對於水平方向傾斜;液體供給步驟,其使傾斜之上述積層體之至少上端部側之側面充滿液體;及剝離步驟,其自傾斜之上述積層體之上端部朝向下端部以上述第1基板與上述吸附層之界面進行剝離;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於藉由上述第1基板與上述吸附層之界面上之剝離而依序出現之剝離面上向下方移動一面將上述剝離面濡濕。 In order to achieve the above object, the method for producing an electronic device according to the present invention includes a functional layer forming step of laminating the first substrate and the second substrate with the adsorbing layer interposed therebetween. Forming a functional layer on the exposed surface of the first substrate; and separating the second substrate from the first substrate on which the functional layer is formed; wherein the separating step includes a tilting step of making the laminated body relatively a liquid supply step of filling the side surface of at least the upper end side of the inclined laminated body with a liquid; and a peeling step of the first substrate and the above-mentioned first substrate from the upper end portion of the laminated body from the inclined side toward the lower end portion The interface of the adsorption layer is peeled off; and in the peeling step, the liquid is continuously supplied from the outside of the laminate, and is separated by gravity from the interface between the first substrate and the adsorption layer. The peeling surface which is sequentially formed is moved downward while the peeling surface is wetted.

本發明之電子裝置之製造方法之另一態樣為了達成上述目的,具有:功能層形成步驟,其對第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體於上述第1基板之露出面形成功能層;及分離步驟,其自形成有上述功能層之上述第1基板分離上述第2基板;其特徵在於:上述分離步驟使用剝離組裝體,該剝離組裝體具備保持上述第1基板之第1保持構件、保持上述第2基板之第2保持構件、及包圍上述積層體之第1殼體,且將由上述第1保持構件、上述第2保持構件、及上述第1殼體包圍之空間部構成為液槽,且上述分離步驟包括:傾斜步驟,其使上述剝離組裝體相對於水平方向傾斜;液體供給步驟,其對上述剝離組裝體之上述液槽供給液體,使上述積層體之側面充滿液體;及剝離步驟,其使上述第1保持構件及上述第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之剝離行進方向彎曲;且於上 述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於藉由上述第1基板與上述吸附層之界面之剝離而依序出現之剝離面上向下方移動一面將上述剝離面濡濕。 In order to achieve the above object, another aspect of the method for producing an electronic device of the present invention includes a functional layer forming step of laminating the first substrate and the second substrate with the adsorbing layer interposed therebetween. The exposed surface of the first substrate forms a functional layer; and the separating step separates the second substrate from the first substrate on which the functional layer is formed; wherein the separation step uses a peeling assembly, and the peeling assembly has a holding a first holding member of the first substrate, a second holding member that holds the second substrate, and a first case that surrounds the laminated body, and the first holding member, the second holding member, and the first The space portion surrounded by the casing is configured as a liquid tank, and the separating step includes a tilting step of inclining the peeling assembly with respect to a horizontal direction, and a liquid supply step of supplying a liquid to the liquid tank of the peeling assembly. The side surface of the laminated body is filled with a liquid; and a peeling step of causing at least one of the first holding member and the second holding member to be along the upper end Peeling direction of travel of the lower end portion is bent; and over In the peeling step, the liquid is continuously supplied from the outside of the laminate, and is moved downward by the gravity on the peeling surface which sequentially appears by the peeling of the interface between the first substrate and the adsorption layer. The above-mentioned peeling surface is wetted.

根據本發明之上述一態樣,由於傾斜之積層體之至少上端部側之側面充滿液體,故而當自該狀態開始剝離時,液體直接流入至藉由界面上之剝離而依序出現之剝離面,且一面藉由重力於剝離面上向下方移動一面直接將上述剝離面濡濕。 According to the above aspect of the invention, since at least the upper end side side of the inclined laminated body is filled with the liquid, when peeling starts from the state, the liquid directly flows into the peeling surface which sequentially appears by peeling at the interface. The surface of the peeling surface is directly wetted while moving downward by gravity on the peeling surface.

即,本發明之上述一態樣具備使積層體傾斜之事項、及使積層體之側面充滿液體之事項,藉此,依存於液體之重力而使液體遍及剝離前線。 That is, the above aspect of the present invention includes the matter of inclining the laminated body and the fact that the side surface of the laminated body is filled with the liquid, whereby the liquid is spread over the peeling front line depending on the gravity of the liquid.

於本發明之上述另一態樣中,使用將由第1保持構件、第2保持構件、及第1殼體包圍之空間部構成為液槽之剝離組裝體以第1基板與吸附層之界面進行剝離。 In another aspect of the invention, the peeling assembly in which the space portion surrounded by the first holding member, the second holding member, and the first casing is configured as a liquid tank is used as an interface between the first substrate and the adsorption layer. Stripped.

於此情形時,於傾斜步驟中,使剝離組裝體相對於水平方向傾斜。其次,於液體供給步驟中,對剝離組裝體之液槽供給液體,使積層體之側面充滿液體。其次,於剝離步驟中,使第1保持構件及第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之剝離行進方向彎曲,而於第1基板與吸附層之界面進行剝離。於該剝離步驟中,液體一面藉由重力於藉由界面之剝離而依序出現之剝離面上向下方移動,一面將上述剝離面直接濡濕。 In this case, in the tilting step, the peeling assembly is inclined with respect to the horizontal direction. Next, in the liquid supply step, a liquid is supplied to the liquid tank of the peeling assembly, and the side surface of the laminated body is filled with the liquid. Then, in the peeling step, at least one of the first holding member and the second holding member is bent in a peeling traveling direction from the upper end portion toward the lower end portion, and is peeled off at the interface between the first substrate and the adsorption layer. In the peeling step, the liquid is directly wetted while moving downward by the gravity on the peeling surface which sequentially appears by the peeling of the interface.

於本發明之上述另一態樣中,當藉由剝離步驟中之剝離動作之行進而剝離前線自上端部朝向下端部行進時,除藉由因傾斜產生之重力之作用而於被剝離之傾斜面上朝向剝離前線移動之液體以外,由於在剝離中出現之剝離面低於填充至液槽之液體之液面,故而,藉由基於高低差之重力之作用,沿著剝離前線,液體被直接供給至剝離前線。 In the above aspect of the invention, when the peeling front line travels from the upper end portion toward the lower end portion by the progress of the peeling action in the peeling step, the tilt is peeled off by the action of gravity due to the tilting. In addition to the liquid moving toward the peeling front line, since the peeling surface which occurs in the peeling is lower than the liquid level of the liquid filled in the liquid tank, the liquid is directly discharged along the peeling front line by the action of the gravity based on the height difference Supply to the stripping front line.

剝離組裝體之傾斜方向較佳為積層體之上端部之角部配置於成 為最高之位置之方向。即,積層體中之開始剝離之上端部之角部變為最高,該角部中之對角線上之下端部之角部變為最低。當將剝離行進方向設定為自上述上端部之角部至上述下端部之角部之情形時,自剝離起始位置至剝離中間位置剝離前線逐漸變長,但液體亦自積層體之側方朝向該剝離前線流入。又,此時,由於積層體傾斜,故而剝離面上之液體亦藉由重力而朝向剝離前線流動。其結果,於剝離前線附近,成為實質上於液體中實施剝離之狀態,剝離順利地進行。 The inclined direction of the peeling assembly is preferably such that the corner portion of the upper end portion of the laminated body is disposed in The direction of the highest position. That is, the corner portion at the upper end portion of the laminated body at the beginning of peeling becomes the highest, and the corner portion at the lower end portion on the diagonal line in the corner portion becomes the lowest. When the peeling traveling direction is set from the corner portion of the upper end portion to the corner portion of the lower end portion, the peeling front line gradually becomes longer from the peeling start position to the peeling intermediate position, but the liquid also faces from the side of the laminated body The stripping front line flows in. Further, at this time, since the laminated body is inclined, the liquid on the peeling surface also flows toward the peeling front by gravity. As a result, in the vicinity of the peeling front line, the peeling was substantially performed in the liquid, and the peeling was smoothly performed.

於本發明之上述另一態樣中,較佳為於上述第1殼體之內側具備上述液體之供給孔。 In still another aspect of the invention, it is preferable that the liquid supply hole is provided inside the first casing.

根據本發明之上述另一態樣,藉由自供給孔對液槽供給液體,使液槽充滿液體而使積層體之側面充滿液體。較佳為供給孔設置於第1保持構件或第2保持構件,於使剝離組裝體傾斜時設置於液槽之下部。自液槽之下部之供給孔將液體供給至液槽,於液體自液槽之上部溢出時或即將溢出之前停止液體之供給。藉此,可容易地確認液槽充滿液體。再者,亦可一面將液體供給至液槽一面實施剝離。 According to still another aspect of the invention, the liquid is supplied to the liquid tank from the supply hole, the liquid tank is filled with the liquid, and the side surface of the laminated body is filled with the liquid. Preferably, the supply hole is provided in the first holding member or the second holding member, and is provided in the lower portion of the liquid tank when the peeling assembly is inclined. The supply hole from the lower portion of the liquid tank supplies the liquid to the liquid tank, and stops the supply of the liquid before the liquid overflows from the upper portion of the liquid tank or just overflows. Thereby, it can be easily confirmed that the liquid tank is filled with the liquid. Further, the liquid may be peeled off while supplying the liquid to the liquid tank.

於本發明之上述另一態樣中,較佳為於上述剝離組裝體具備包圍上述第1殼體之第2殼體,於上述第1殼體與上述第2殼體之間具備排水孔。 In the above aspect of the invention, it is preferable that the peeling assembly includes a second casing that surrounds the first casing, and a drain hole is provided between the first casing and the second casing.

根據本發明之上述另一態樣,自第1殼體溢出之液體被第2殼體阻擋而自排水孔排出,因此,可防止液體自剝離組裝體排出至外部。藉此,改善剝離裝置之使用環境,又,若回收自排水孔排出之液體,亦可對液體進行再利用。 According to the above aspect of the invention, the liquid overflowing from the first casing is blocked by the second casing and discharged from the drain hole, so that the liquid can be prevented from being discharged from the peeling assembly to the outside. Thereby, the use environment of the peeling device can be improved, and if the liquid discharged from the drain hole is recovered, the liquid can be reused.

於本發明中,較佳為上述吸附層為聚醯亞胺樹脂層,上述液體為水。 In the invention, it is preferable that the adsorption layer is a polyimide resin layer, and the liquid is water.

本發明之上述另一態樣之第1殼體較佳為獨立氣泡之海綿。第1殼體由第1保持構件及第2保持構件夾持而構成液槽,但藉由為獨立氣 泡之海綿,而以彈性抵接於第1保持構件及第2保持構件。藉此,液槽之水密性提昇。 The first casing of the above aspect of the invention is preferably a sponge of independent bubbles. The first casing is sandwiched by the first holding member and the second holding member to constitute a liquid tank, but by independent gas The sponge is made to elastically abut against the first holding member and the second holding member. Thereby, the watertightness of the liquid tank is improved.

根據本發明之積層體之剝離裝置及剝離方法、以及電子裝置之製造方法,一面對第1基板與吸附層之界面供給液體一面於界面進行剝離,且可順利且以較短時間進行利用液體之剝離。 According to the peeling apparatus and the peeling method of the laminated body of the present invention, and the method of manufacturing the electronic device, the liquid is supplied to the interface at the interface between the first substrate and the adsorption layer, and the liquid can be smoothly and in a short time. Stripping.

1‧‧‧積層體 1‧‧ ‧ laminated body

1A‧‧‧第1積層體 1A‧‧‧1st laminate

1B‧‧‧第2積層體 1B‧‧‧2nd layer body

2‧‧‧基板 2‧‧‧Substrate

2a‧‧‧基板之表面 2a‧‧‧Surface of the substrate

2b‧‧‧基板之背面 2b‧‧‧Back of the substrate

2A‧‧‧基板 2A‧‧‧Substrate

2Aa‧‧‧基板之表面 2Aa‧‧‧ surface of the substrate

2B‧‧‧基板 2B‧‧‧Substrate

2Ba‧‧‧基板之表面 2Ba‧‧‧ surface of the substrate

3‧‧‧補強板 3‧‧‧ reinforcing plate

3a‧‧‧補強板之表面 3a‧‧‧ Surface of the reinforcing plate

3A‧‧‧補強板 3A‧‧‧ reinforcing plate

3B‧‧‧補強板 3B‧‧‧ reinforcing plate

3Bb‧‧‧補強板之背面 3Bb‧‧‧ Back of the reinforcing board

4‧‧‧樹脂層 4‧‧‧ resin layer

4A‧‧‧樹脂層 4A‧‧‧ resin layer

4B‧‧‧樹脂層 4B‧‧‧ resin layer

6‧‧‧積層體 6‧‧‧Layer

6A、6B‧‧‧角部 6A, 6B‧‧‧ corner

7‧‧‧功能層 7‧‧‧ functional layer

10‧‧‧剝離起始部製成裝置 10‧‧‧ peeling start making device

12‧‧‧平台 12‧‧‧ platform

14‧‧‧支持器 14‧‧‧Support

16‧‧‧高度調整裝置 16‧‧‧ Height adjustment device

18‧‧‧進給裝置 18‧‧‧ Feeding device

20‧‧‧液體 20‧‧‧Liquid

22‧‧‧液體供給裝置 22‧‧‧Liquid supply device

24‧‧‧界面 24‧‧‧ interface

26‧‧‧剝離起始部 26‧‧‧ peeling start

28‧‧‧界面 28‧‧‧ interface

30‧‧‧剝離起始部 30‧‧‧ peeling start

40‧‧‧剝離裝置 40‧‧‧ peeling device

42‧‧‧剝離組裝體 42‧‧‧ Strip assembly

44‧‧‧可動體 44‧‧‧ movable body

46‧‧‧可撓性板 46‧‧‧Flexible board

46A‧‧‧角部 46A‧‧‧ corner

46B‧‧‧角部 46B‧‧‧ corner

48‧‧‧可撓性板 48‧‧‧Flexible board

48A‧‧‧角部 48A‧‧‧ corner

48B‧‧‧角部 48B‧‧‧ corner

50‧‧‧本體板 50‧‧‧ body board

52‧‧‧多孔質片材 52‧‧‧Porous sheets

54‧‧‧殼體 54‧‧‧Shell

56‧‧‧槽 56‧‧‧ slots

58‧‧‧貫通孔 58‧‧‧through holes

60‧‧‧真空泵 60‧‧‧vacuum pump

62‧‧‧供給孔 62‧‧‧Supply hole

64‧‧‧貫通孔 64‧‧‧through holes

66‧‧‧送液泵 66‧‧‧ Liquid pump

68‧‧‧液槽 68‧‧‧ liquid tank

70‧‧‧殼體 70‧‧‧shell

71‧‧‧貫通孔 71‧‧‧through holes

72‧‧‧排水孔 72‧‧‧Drainage holes

74‧‧‧本體板 74‧‧‧ body board

76‧‧‧多孔質片材 76‧‧‧Porous sheets

78‧‧‧槽 78‧‧‧ slots

80‧‧‧貫通孔 80‧‧‧through holes

82‧‧‧真空泵 82‧‧‧Vacuum pump

84‧‧‧貫通孔 84‧‧‧through holes

86‧‧‧可動裝置 86‧‧‧ movable device

88‧‧‧驅動裝置 88‧‧‧ drive

90‧‧‧控制器 90‧‧‧ Controller

92‧‧‧桿 92‧‧‧ pole

94‧‧‧球接頭 94‧‧‧Ball joint

96‧‧‧框架 96‧‧‧Frame

98‧‧‧緩衝構件 98‧‧‧ cushioning members

100‧‧‧液體 100‧‧‧Liquid

102‧‧‧面板 102‧‧‧ panel

104‧‧‧吸附墊 104‧‧‧Adsorption pad

106‧‧‧搬送裝置 106‧‧‧Transporting device

A‧‧‧箭頭 A‧‧‧ arrow

N‧‧‧刀 N‧‧‧ knife

θ‧‧‧傾斜角度 Θ‧‧‧ tilt angle

圖1係表示供給至電子裝置之製造步驟之積層體之一例之主要部分放大側視圖。 Fig. 1 is an enlarged side elevational view showing an essential part of an example of a laminate which is supplied to a manufacturing step of an electronic device.

圖2係表示於LCD之製造步驟之中途製作的積層體之一例之主要部分放大側視圖。 Fig. 2 is an enlarged side elevational view showing an essential part of an example of a laminate produced in the middle of the manufacturing process of the LCD.

圖3(A)~(E)係表示利用剝離起始部製成裝置之剝離起始部製成方法之說明圖。 3(A) to 3(E) are explanatory views showing a method of producing a peeling start portion of the apparatus using the peeling start portion.

圖4係利用剝離起始部製成方法製成剝離起始部之積層體之俯視圖。 Fig. 4 is a plan view showing a laminate in which a peeling start portion is formed by a method of producing a peeling starting portion.

圖5係表示實施形態之剝離裝置之構成之縱剖視圖。 Fig. 5 is a longitudinal sectional view showing the configuration of a peeling device of the embodiment.

圖6係模式地表示複數個可動體相對於剝離組裝體之配置位置之剝離組裝體之俯視圖。 Fig. 6 is a plan view schematically showing a peeling assembly of a plurality of movable bodies with respect to an arrangement position of a peeling assembly.

圖7(A)係構成剝離組裝體之可撓性板之俯視圖,圖7(B)係沿著圖7(A)之C-C線之可撓性板之側剖視圖。 Fig. 7(A) is a plan view showing a flexible plate constituting a peeling assembly, and Fig. 7(B) is a side cross-sectional view of the flexible plate taken along line C-C of Fig. 7(A).

圖8(A)係構成剝離組裝體之可撓性板之仰視圖,圖8(B)係沿著圖8(A)之D-D線之可撓性板之側剖視圖。 Fig. 8(A) is a bottom view of the flexible plate constituting the peeling assembly, and Fig. 8(B) is a side cross-sectional view of the flexible plate taken along the line D-D of Fig. 8(A).

圖9(A)係表示可撓性板與積層體之對應關係之側剖視圖,圖9(B)係藉由可撓性板保持積層體之側剖視圖。 Fig. 9(A) is a side cross-sectional view showing the correspondence between the flexible plate and the laminated body, and Fig. 9(B) is a side cross-sectional view showing the laminated body held by the flexible plate.

圖10係表示使剝離組裝體傾斜為剝離起始姿勢之狀態之側剖視圖。 Fig. 10 is a side cross-sectional view showing a state in which the peeling assembly is inclined to a peeling start posture.

圖11(A)~(D)係表示使積層體保持於剝離組裝體之步驟、使剝離 組裝體以θ角度傾斜之步驟、及使液槽填充液體之步驟之動作說明圖。 11(A) to (D) show the steps of holding the laminated body in the peeling assembly, and peeling off The operation of the step of inclining the assembly at an angle θ and the step of filling the liquid tank with a liquid.

圖12(A)~(E)係表示使下側之可撓性板彎曲變形而將下側之補強板剝離之步驟之動作說明圖。 12(A) to (E) are explanatory views showing the operation of the step of bending the lower flexible plate and peeling the lower reinforcing plate.

圖13(A)~(D)係表示剝離之下側之補強板之搬出步驟之動作說明圖。 Fig. 13 (A) to (D) are explanatory views showing the operation of the step of carrying out the reinforcing plate on the side under peeling.

圖14(A)~(D)係表示使上側之可撓性板彎曲變形而將上側之補強板剝離之步驟之動作說明圖。 14(A) to 14(D) are explanatory views showing the operation of the step of bending and deforming the upper flexible plate and peeling off the upper reinforcing plate.

圖15(A)~(D)係表示剝離之上側之補強板之搬出步驟、及面板之搬出步驟之動作說明圖。 15(A) to 15(D) are diagrams showing the operation of the step of carrying out the reinforcing plate on the upper side and the step of carrying out the panel.

以下,根據隨附圖式對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

以下,對於電子裝置之製造步驟中使用本發明之積層體之剝離裝置及剝離方法之情形進行說明。 Hereinafter, a case where the peeling device and the peeling method of the laminated body of the present invention are used in the manufacturing steps of the electronic device will be described.

所謂電子裝置係指顯示面板、太陽電池、薄膜二次電池等電子零件。作為顯示面板,可例示液晶顯示器(LCD:Liquid Crystal Display)面板、電漿顯示器面板(PDP:Plasma Display Panel)、及有機EL顯示器(OELD:Organic Electro Luminescence Display)面板。 The electronic device refers to an electronic component such as a display panel, a solar cell, or a thin film secondary battery. As the display panel, a liquid crystal display (LCD) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel can be exemplified.

〔電子裝置之製造步驟〕 [Manufacturing procedure of electronic device]

電子裝置係藉由於玻璃製、樹脂製、金屬製等基板之表面形成電子裝置用功能層(若為LCD,則為薄膜電晶體(TFT)、彩色濾光片層(CF))而製造。 The electronic device is manufactured by forming a functional layer for an electronic device (in the case of an LCD, a thin film transistor (TFT) or a color filter layer (CF)) on the surface of a substrate made of glass, resin, or metal.

上述基板係於形成功能層之前,使其背面貼附於補強板而構成為積層體。其後,以積層體之狀態於基板之表面形成功能層。而且,於功能層形成後,將補強板自基板剝離。 The substrate is formed as a laminate before being attached to the reinforcing plate before forming the functional layer. Thereafter, a functional layer is formed on the surface of the substrate in a state of a laminate. Further, after the functional layer is formed, the reinforcing plate is peeled off from the substrate.

即,於電子裝置之製造步驟中,具備以積層體之狀態於基板之 表面形成功能層之功能層形成步驟、及自形成有功能層之基板將補強板分離之分離步驟。於該分離步驟中應用本發明之積層體之剝離裝置及剝離方法。 That is, in the manufacturing step of the electronic device, the substrate is provided in a state of a laminate The functional layer forming step of forming a functional layer on the surface and the separating step of separating the reinforcing plate from the substrate on which the functional layer is formed. A peeling device and a peeling method of the laminated body of the present invention are applied in the separating step.

〔積層體1〕 [Layer 1]

圖1係表示積層體1之一例之主要部分放大側視圖。 Fig. 1 is an enlarged side elevational view showing an essential part of an example of the laminated body 1.

積層體1具備:基板(第1基板)2,其形成功能層;及補強板(第2基板)3,其補強該基板2。又,補強板3係於表面3a具備作為吸附層之樹脂層4,於樹脂層4貼附基板2之背面2b。即,基板2藉由作用於與樹脂層4之間之凡得瓦耳力、或樹脂層4之黏著力而介隔樹脂層4可剝離地貼附於補強板3。 The laminated body 1 includes a substrate (first substrate) 2 that forms a functional layer, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. Further, the reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the surface 3a, and a back surface 2b of the substrate 2 is attached to the resin layer 4. In other words, the substrate 2 is detachably attached to the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting on the resin layer 4 or the adhesive force of the resin layer 4.

〔基板2〕 [Substrate 2]

基板2係於其表面2a形成功能層。作為基板2,可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、半導體基板。該等基板之中,玻璃基板之耐化學品性、耐透濕性優異,且線膨脹係數較小,因此,作為電子裝置用基板2較佳。又,亦具有如下優勢:隨著線膨脹係數變小,於高溫下形成之功能層之圖案於冷卻時不易偏移。 The substrate 2 is formed on its surface 2a to form a functional layer. The substrate 2 can be exemplified by a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. Therefore, it is preferable as the substrate 2 for an electronic device. Moreover, it also has the advantage that as the coefficient of linear expansion becomes smaller, the pattern of the functional layer formed at a high temperature is less likely to shift upon cooling.

作為玻璃基板之玻璃,可例示無鹼玻璃、硼矽酸玻璃、鈉鈣玻璃、高二氧化矽玻璃、及其他以氧化矽為主要成分之氧化物系玻璃。作為氧化物系玻璃,較佳為利用酸化物換算之氧化矽之含有量為40~90質量%之玻璃。 Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a cerium oxide content of 40 to 90% by mass in terms of an acid compound.

較佳為玻璃基板之玻璃選擇並採用適於所製造之電子裝置之種類之玻璃、適於其製造步驟之玻璃。例如,較佳係液晶面板用玻璃基板採用實質上不包含鹼金屬成分之玻璃(無鹼玻璃)。 Preferably, the glass of the glass substrate is selected and used as a glass suitable for the type of electronic device to be manufactured, and a glass suitable for the manufacturing steps thereof. For example, a glass substrate for a liquid crystal panel is preferably a glass (alkali-free glass) which does not substantially contain an alkali metal component.

基板2之厚度係根據基板2之種類而設定。例如,於基板2採用玻璃基板之情形時,為了電子裝置之輕量化、薄板化,其厚度較佳為設定為0.7mm以下,更佳為設定為0.3mm以下,進而較佳為設定為0.1 mm以下。於厚度為0.3mm以下之情形時,可對玻璃基板賦予良好之可撓性。進而,於厚度為0.1mm以下之情形時,可將玻璃基板捲取為捲筒狀,但就玻璃基板之製造之觀點、及玻璃基板之操作之觀點而言,其厚度較佳為0.03mm以上。 The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 is made of a glass substrate, the thickness of the electronic device is preferably set to 0.7 mm or less, more preferably 0.3 mm or less, and further preferably set to 0.1 in order to reduce the weight and thickness of the electronic device. Below mm. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Further, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. However, from the viewpoint of the production of the glass substrate and the operation of the glass substrate, the thickness thereof is preferably 0.03 mm or more. .

再者,圖1中,基板2包含1片基板,但基板2亦可包含複數片基板。即,基板2亦可包含積層有複數片基板之積層體。於此情形時,構成基板2之所有基板之合計厚度成為基板2之厚度。 Furthermore, in FIG. 1, the substrate 2 includes one substrate, but the substrate 2 may include a plurality of substrates. That is, the substrate 2 may include a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the substrate 2 is the thickness of the substrate 2.

〔補強板3〕 [Reinforcing plate 3]

作為補強板3可例示玻璃基板、陶瓷基板、樹脂基板、金屬基板、半導體基板。 The reinforcing plate 3 can be exemplified by a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

補強板3之厚度設定為0.7mm以下,根據補強之基板2之種類、厚度等而設定。再者,補強板3之厚度可較基板2更厚,亦可更薄,但為了補強基板2較佳為0.4mm以上。 The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type, thickness, and the like of the reinforcing substrate 2. Further, the thickness of the reinforcing plate 3 may be thicker or thinner than the substrate 2, but it is preferably 0.4 mm or more for reinforcing the substrate 2.

再者,於本例中,補強板3包含1片基板,但補強板3亦可包含積層有複數片基板之積層體。於此情形時,構成補強板3之所有基板之合計厚度成為補強板3之厚度。 Further, in the present embodiment, the reinforcing plate 3 includes one substrate, but the reinforcing plate 3 may include a laminated body in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the reinforcing plate 3 is the thickness of the reinforcing plate 3.

〔樹脂層4〕 [Resin layer 4]

作為樹脂層4,為了防止於樹脂層4與補強板3之間剝離,將與補強板3之間之結合力設定為高於與基板2之間之結合力。藉此,於剝離步驟中,以樹脂層4與基板2之界面而被剝離。 As the resin layer 4, in order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the bonding force with the reinforcing plate 3 is set to be higher than the bonding force with the substrate 2. Thereby, in the peeling step, the interface between the resin layer 4 and the substrate 2 is peeled off.

構成樹脂層4之樹脂並無特別限定,可例示聚醯亞胺樹脂、丙烯酸樹脂、聚烯烴樹脂、聚胺基甲酸酯樹脂、矽酮樹脂、聚醯亞胺矽酮樹脂。亦可將若干種類之樹脂混合使用。其中,就耐熱性或剝離性之觀點而言,較佳為聚醯亞胺樹脂、聚醯亞胺矽酮樹脂、矽酮樹脂。於實施形態中,作為樹脂層4例示聚醯亞胺樹脂層。 The resin constituting the resin layer 4 is not particularly limited, and examples thereof include a polyimide resin, an acrylic resin, a polyolefin resin, a polyurethane resin, an anthrone resin, and a polyamidoxime resin. Several types of resins can also be used in combination. Among them, from the viewpoint of heat resistance and peelability, a polyimide resin, a polyamidoxime resin, and an anthrone resin are preferable. In the embodiment, a polyimine resin layer is exemplified as the resin layer 4.

樹脂層4之厚度並無特別限定,但較佳為設定為1~50μm,更佳 為設定為4~20μm。藉由將樹脂層4之厚度設為1μm以上,於在樹脂層4與基板2之間混入氣泡或異物時,藉由樹脂層4之變形可吸收氣泡或異物之厚度。另一方面,藉由將樹脂層4之厚度設為50μm以下,可縮短樹脂層4之形成時間,進而由於不過分地使用樹脂層4之樹脂,故而較經濟。 The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 μm, more preferably It is set to 4~20μm. When the thickness of the resin layer 4 is 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm or less, the formation time of the resin layer 4 can be shortened, and since the resin of the resin layer 4 is not excessively used, it is economical.

再者,樹脂層4之外形較佳為以補強板3可支持樹脂層4之整體之方式與補強板3之外形相同,或小於補強板3之外形。又,樹脂層4之外形較佳為以樹脂層4可密接基板2之整體之方式,與基板2之外形相同或大於基板2之外形。 Further, the outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 in such a manner that the reinforcing plate 3 can support the entirety of the resin layer 4, or is smaller than the outer shape of the reinforcing plate 3. Further, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can be in close contact with the entire substrate 2.

又,於圖1中,樹脂層4包含1層,但樹脂層4亦可包含2層以上。於此情形時,構成樹脂層4之所有層之合計厚度成為樹脂層4之厚度。又,於此情形時,構成各層之樹脂之種類亦可不同。 Further, in FIG. 1, the resin layer 4 includes one layer, but the resin layer 4 may include two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer 4. Moreover, in this case, the kind of the resin which comprises each layer may differ.

進而,於實施形態中,作為吸附層使用作為有機膜之樹脂層4,但亦可代替樹脂層4而使用無機層。構成無機層之無機膜例如包含選自由金屬矽化物、氮化物、碳化物、及碳氮化物所組成之群中之至少1種。 Further, in the embodiment, the resin layer 4 as the organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

進而,又,圖1之積層體1具備樹脂層4,但亦可去掉樹脂層4而設為包含基板2及補強板3之構成。於此情形時,藉由作用於基板2與補強板3之間之凡得瓦耳力等而將基板2與補強板3可剝離地貼附。又,於基板2及補強板3為玻璃基板之情形時,較佳為於補強板3之表面3a形成無機薄膜以使基板2與補強板3不會因高溫而接著。 Further, the laminated body 1 of Fig. 1 includes the resin layer 4, but the resin layer 4 may be removed to form the substrate 2 and the reinforcing plate 3. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by a van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. Further, when the substrate 2 and the reinforcing plate 3 are glass substrates, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 so that the substrate 2 and the reinforcing plate 3 are not prevented from being heated by the high temperature.

〔形成有功能層之積層體6〕 [Forming a laminated body with a functional layer 6]

藉由經由功能層形成步驟而於積層體1之基板2之表面2a形成功能層。作為功能層之形成方法使用CVD(Chemical Vapor Deposition,化學氣相沈積)法、PVD(Physical Vapor Deposition,物理氣相沈積)法等蒸鍍法、濺射法。功能層藉由光微影法、蝕刻法而形成為特定之圖 案。 The functional layer is formed on the surface 2a of the substrate 2 of the laminated body 1 by the functional layer forming step. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method or a sputtering method is used. The functional layer is formed into a specific image by photolithography and etching. case.

圖2係表示於LCD之製造步驟之中途製作的矩形狀之積層體6之一例之主要部分放大側視圖。 Fig. 2 is an enlarged side elevational view showing an essential part of an example of a rectangular laminated body 6 produced in the middle of the manufacturing process of the LCD.

積層體6係補強板3A、樹脂層4A、基板2A、功能層7、基板2B、樹脂層4B、及補強板3B依序積層而構成。即,圖2之積層體6相當於圖1所示之積層體1隔著功能層7對稱地配置之積層體。以下,將包含基板2A、樹脂層4A、及補強板3A之積層體稱為第1積層體1A,將包含基板2B、樹脂層4B、及補強板3B之積層體稱為第2積層體1B。 The laminated body 6-based reinforcing plate 3A, the resin layer 4A, the substrate 2A, the functional layer 7, the substrate 2B, the resin layer 4B, and the reinforcing plate 3B are sequentially laminated. That is, the laminated body 6 of FIG. 2 corresponds to the laminated body in which the laminated body 1 shown in FIG. 1 is symmetrically arranged via the functional layer 7. Hereinafter, the laminated body including the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminated body 1A, and the laminated body including the substrate 2B, the resin layer 4B, and the reinforcing plate 3B is referred to as a second laminated body 1B.

於第1積層體1A之基板2A之表面2Aa形成作為功能層7之薄膜電晶體(TFT),於第2積層體1B之基板2B之表面2Ba形成作為功能層7之彩色濾光片層(CF)。 A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter layer (CF) as the functional layer 7 is formed on the surface 2Ba of the substrate 2B of the second laminated body 1B. ).

第1積層體1A與第2積層體1B彼此將基板2A、2B之表面2Aa、2Ba重疊而一體化。藉此,製造第1積層體1A與第2積層體1B隔著功能層7而對稱地配置而成之構造之積層體6。 The first layered body 1A and the second layered body 1B are superposed on each other by overlapping the surfaces 2Aa and 2Ba of the substrates 2A and 2B. In this way, the laminated body 6 having the structure in which the first laminated body 1A and the second laminated body 1B are symmetrically arranged with the functional layer 7 interposed therebetween is manufactured.

積層體6係於分離步驟之剝離起始部製成步驟中利用刀形成剝離起始部之後,於分離步驟之剝離步驟中依序剝離補強板3A、3B,其後,安裝偏光板、背光裝置等而製造作為製品之LCD。 The laminated body 6 is formed by peeling the starting portion by a knife in the peeling start portion forming step of the separating step, and sequentially peeling the reinforcing plates 3A, 3B in the peeling step of the separating step, and thereafter, mounting the polarizing plate and the backlight device The LCD is manufactured as a product.

〔剝離起始部製成裝置10〕 [Peeling start making device 10]

圖3(A)~(E)係表示利用剝離起始部製成裝置10之剝離起始部製成方法之說明圖,圖3(A)係表示積層體6與刀N之位置關係之說明圖,圖3(B)係利用刀N於界面24製成剝離起始部26之說明圖,圖3(C)係表示即將於界面28製成剝離起始部30之前之狀態之說明圖,圖3(D)係利用刀N於界面28製成剝離起始部30之說明圖,圖3(E)係製成了剝離起始部26、30之積層體6之說明圖。又,圖4係製成了剝離起始部26、30之積層體6之俯視圖。 3(A) to 3(E) are explanatory views showing a method of producing the peeling starting portion of the apparatus 10 by the peeling start portion, and Fig. 3(A) is a view showing the positional relationship between the laminated body 6 and the knife N. 3(B) is an explanatory view in which the peeling start portion 26 is formed by the knife N at the interface 24, and FIG. 3(C) is an explanatory view showing a state immediately before the peeling start portion 30 is formed at the interface 28. 3(D) is an explanatory view in which the peeling start portion 30 is formed by the blade N at the interface 28, and FIG. 3(E) is an explanatory view in which the laminated body 6 of the peeling start portions 26, 30 is formed. Further, Fig. 4 is a plan view of the laminated body 6 in which the peeling start portions 26 and 30 are formed.

於剝離起始部26、30之製成時,如圖3(A)所示,積層體6之補強 板3B之背面3Bb吸附保持於平台12而水平(圖中X軸方向)地被支持。 When the peeling start portions 26, 30 are formed, as shown in FIG. 3(A), the reinforcement of the laminated body 6 The back surface 3Bb of the plate 3B is held by the stage 12 and supported horizontally (in the X-axis direction in the drawing).

刀N係以刀尖與積層體6之角部6A之端面對向之方式,由支持器14水平地支持。又,刀N藉由高度調整裝置16調整高度方向(圖中Z軸方向)之位置。進而,刀N與積層體6藉由滾珠螺桿裝置等進給裝置18於水平方向相對地移動。進給裝置18只要使刀N與平台12中之至少一者於水平方向移動即可,於實施形態中,係使刀N移動。進而,又,對刺入前或刺入中之刀N之上表面供給液體20之液體供給裝置22配置於刀N之上方。 The knife N is horizontally supported by the holder 14 such that the blade edge faces the end surface of the corner portion 6A of the laminated body 6. Further, the knife N is adjusted in the height direction (the Z-axis direction in the drawing) by the height adjusting device 16. Further, the blade N and the laminated body 6 are relatively moved in the horizontal direction by the feeding device 18 such as a ball screw device. The feed device 18 only needs to move at least one of the blade N and the stage 12 in the horizontal direction. In the embodiment, the knife N is moved. Further, the liquid supply device 22 that supplies the liquid 20 to the upper surface of the blade N before or during the piercing is disposed above the blade N.

[剝離起始部製成方法] [Method of making peeling start portion]

於利用剝離起始部製成裝置10之剝離起始部製成方法中,將刀N之刺入位置設定為積層體6之角部6A且於積層體6之厚度方向上重疊之位置,且將刀N之刺入量以針對界面24、28分別不同之方式設定。 In the method for producing the peeling starting portion by the peeling start portion forming device 10, the piercing position of the blade N is set to the corner portion 6A of the laminated body 6 and overlapped in the thickness direction of the laminated body 6, and The amount of penetration of the knife N is set differently for the interfaces 24 and 28, respectively.

對其製成順序進行說明。 The order in which they are made will be described.

於初始狀態中,刀N之刀尖存在於相對於作為第1刺入位置之基板2B與樹脂層4B之界面24而於高度方向(Z軸方向)錯開的位置。因此,首先,如圖3(A)所示,使刀N於高度方向移動,將刀N之刀尖之高度設定為界面24之高度。 In the initial state, the blade edge of the blade N is present at a position shifted in the height direction (Z-axis direction) with respect to the interface 24 between the substrate 2B and the resin layer 4B as the first piercing position. Therefore, first, as shown in FIG. 3(A), the blade N is moved in the height direction, and the height of the blade edge of the blade N is set to the height of the interface 24.

其後,如圖3(B)所示,使刀N朝向積層體6之角部6A水平地移動,將刀N刺入至界面24特定量。又,於刀N之刺入時或刺入前,自液體供給裝置22對刀N之上表面供給液體20。藉此,將角部6A之基板2B自樹脂層4B剝離,因此,於界面24製成如圖4所示般俯視為三角形狀之剝離起始部26。再者,雖並非必須供給液體20,但若使用液體20,則即便於拔去刀N之後亦可將液體20殘留於剝離起始部26,因此,可製成無法再附著之剝離起始部26。 Thereafter, as shown in FIG. 3(B), the blade N is horizontally moved toward the corner portion 6A of the laminated body 6, and the blade N is inserted into the interface 24 by a specific amount. Further, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N at the time of the piercing of the blade N or before the piercing. Thereby, the substrate 2B of the corner portion 6A is peeled off from the resin layer 4B. Therefore, the peeling start portion 26 having a triangular shape in plan view as shown in FIG. 4 is formed at the interface 24. Further, although it is not necessary to supply the liquid 20, if the liquid 20 is used, the liquid 20 can remain in the peeling start portion 26 even after the blade N is removed, so that the peeling start portion which can no longer be attached can be obtained. 26.

其次,將刀N自角部6A沿水平方向抜去,如圖3(C)所示,將刀N之刀尖設定為作為第2刺入位置之基板2A與樹脂層4A之界面28之高 度。 Next, the knife N is removed from the corner portion 6A in the horizontal direction, and as shown in Fig. 3(C), the blade edge of the blade N is set to be the height of the interface 28 between the substrate 2A and the resin layer 4A as the second piercing position. degree.

其後,如圖3(D)所示,使刀N朝向積層體6水平地移動,將刀N刺入至界面28特定量。同樣地,自液體供給裝置22對刀N之上表面供給液體20。藉此,如圖3(E)所示,於界面28製成剝離起始部30。此處,相對於界面28之刀N之刺入量少於相對於界面24之刺入量。以上為剝離起始部製成方法。再者,亦可使相對於界面24之刀N之刺入量少於相對於界面28之刺入量。 Thereafter, as shown in FIG. 3(D), the blade N is horizontally moved toward the laminated body 6, and the blade N is pierced to the interface 28 by a specific amount. Similarly, the liquid 20 is supplied from the liquid supply device 22 to the upper surface of the blade N. Thereby, as shown in FIG. 3(E), the peeling start portion 30 is formed at the interface 28. Here, the amount of penetration of the knife N relative to the interface 28 is less than the amount of penetration relative to the interface 24. The above is the method of making the peeling start portion. Furthermore, the amount of penetration of the knife N relative to the interface 24 can be made less than the amount of penetration relative to the interface 28.

將製成有剝離起始部26、30之積層體6自剝離起始部製成裝置10取出,並搬送至下述剝離裝置,藉由剝離裝置而以界面24、28將補強板3B、3A依序剝離。 The layered body 6 on which the peeling start portions 26 and 30 are formed is taken out from the peeling start portion forming device 10, and conveyed to a peeling device, and the reinforcing plates 3B, 3A are provided at the interfaces 24 and 28 by the peeling device. Stripped in sequence.

剝離方法之詳情將於下文中進行敍述,但如圖4之箭頭A所示,藉由使積層體6自角部6A朝向與角部6A對向之角部6B彎曲,而以剝離起始部26之面積較大之界面24之剝離起始部26為起點首先剝離。藉此,將補強板3B與樹脂層4B一同剝離。其後,藉由使積層體6自角部6A朝向角部6B再彎曲而以剝離起始部30之面積較小之界面28之剝離起始部30為起點進行剝離。藉此,將補強板3A與樹脂層4A一同剝離。 The details of the peeling method will be described later, but as shown by the arrow A in Fig. 4, the peeling start portion is bent by bending the laminated body 6 from the corner portion 6A toward the corner portion 6B opposed to the corner portion 6A. The peeling start portion 26 of the interface 24 having a large area of 26 is first peeled off from the starting point. Thereby, the reinforcing plate 3B is peeled off together with the resin layer 4B. Thereafter, the laminated body 6 is further bent from the corner portion 6A toward the corner portion 6B, and peeling is performed starting from the peeling start portion 30 of the interface 28 having a small area of the peeling start portion 30. Thereby, the reinforcing plate 3A is peeled off together with the resin layer 4A.

再者,刀N之刺入量根據積層體6之尺寸較佳為設定為7mm以上,更佳為設定為15~20mm左右。 Further, the amount of penetration of the blade N is preferably set to 7 mm or more, and more preferably set to about 15 to 20 mm, depending on the size of the laminated body 6.

〔剝離裝置40〕 [Peeling device 40]

圖5係表示實施形態之剝離裝置40之構成之縱剖視圖,圖6係模式地表示複數個可動體44相對於剝離裝置40之剝離組裝體42之配置位置之剝離組裝體42之俯視圖。再者,圖5相當於沿著圖6之B-B線之剖視圖,又,於圖6中,以實線表示積層體6。又,可動體44相對於剝離組裝體42配置為柵格狀。 5 is a longitudinal cross-sectional view showing the configuration of the peeling device 40 of the embodiment, and FIG. 6 is a plan view schematically showing the peeling assembly 42 of the plurality of movable bodies 44 with respect to the arrangement position of the peeling assembly 42 of the peeling device 40. 5 corresponds to a cross-sectional view taken along line B-B of FIG. 6, and in FIG. 6, the laminated body 6 is indicated by a solid line. Further, the movable body 44 is disposed in a lattice shape with respect to the peeling assembly 42.

[剝離組裝體42] [Paste assembly 42]

圖7(A)係構成剝離組裝體42之可撓性板(第1保持構件)46之俯視圖,圖7(B)係沿著圖7(A)之C-C線之可撓性板46之側剖視圖。又,圖8(A)係構成剝離組裝體42之可撓性板(第2保持構件)48之仰視圖,圖8(B)係沿著圖8(A)之D-D線之可撓性板48之側剖視圖。進而,圖9(A)係表示可撓性板46、48與積層體6(亦可為積層體1)之對應關係之側剖視圖,圖9(B)係藉由可撓性板46、48保持積層體6之側剖視圖。 Fig. 7(A) is a plan view of a flexible plate (first holding member) 46 constituting the peeling assembly 42, and Fig. 7(B) is a side of the flexible plate 46 along the CC line of Fig. 7(A). Cutaway view. 8(A) is a bottom view of the flexible plate (second holding member) 48 constituting the peeling assembly 42, and FIG. 8(B) is a flexible plate along the DD line of FIG. 8(A). Side view of section 48. Further, Fig. 9(A) is a side cross-sectional view showing the correspondence relationship between the flexible sheets 46, 48 and the laminated body 6 (which may also be the laminated body 1), and Fig. 9(B) is by the flexible sheets 46, 48. A side cross-sectional view of the laminated body 6 is maintained.

[可撓性板46] [Flexible plate 46]

如圖7及圖9所示,可撓性板46具備尺寸大於積層體6之矩形狀之本體板50、及吸附保持積層體6之補強板3B(參照圖2:第1基板)之矩形狀之橡膠製之多孔質片材52,且於本體板50之上表面貼附有多孔質片材52。 As shown in FIG. 7 and FIG. 9, the flexible plate 46 has a rectangular main body plate 50 having a larger size than the laminated body 6, and a rectangular plate of the reinforcing plate 3B (see FIG. 2: first substrate) that adsorbs and holds the laminated body 6. The porous sheet 52 made of rubber is attached to the upper surface of the main body plate 50 with a porous sheet 52 attached thereto.

基於使於剝離時補強板3B中產生之拉伸應力降低之目的,較佳為多孔質片材52之厚度為2mm以下,較佳為1mm以下。 The thickness of the porous sheet 52 is preferably 2 mm or less, preferably 1 mm or less, for the purpose of lowering the tensile stress generated in the reinforcing sheet 3B at the time of peeling.

於本體板50之上表面接著有包圍吸附保持於多孔質片材52之積層體6之殼體(第1殼體)54。殼體54例如為蕭氏E硬度為20度以上且50度以下之獨立氣泡之海綿,且設定為自吸附保持於多孔質片材52之積層體6之上表面(補強板3A)突出之高度(參照圖9(B))。 A casing (first casing) 54 that surrounds the laminated body 6 adsorbed and held by the porous sheet 52 is attached to the upper surface of the main body plate 50. The case 54 is, for example, a sponge of independent bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less, and is set to a height protruding from the upper surface (the reinforcing plate 3A) of the layered body 6 held by the porous sheet 52. (Refer to Fig. 9(B)).

於由殼體54包圍之多孔質片材52具備框狀之槽56。槽56經由設置於本體板50之複數個貫通孔58而連接於圖5所示之真空泵60。 The porous sheet 52 surrounded by the casing 54 is provided with a frame-shaped groove 56. The groove 56 is connected to the vacuum pump 60 shown in FIG. 5 via a plurality of through holes 58 provided in the main body plate 50.

因此,當驅動真空泵60時,會抽吸貫通孔58及槽56之空氣,而將積層體6之補強板3B真空吸附保持於多孔質片材52。藉此,積層體6之補強板3B支持於本體板50。 Therefore, when the vacuum pump 60 is driven, the air passing through the through holes 58 and the grooves 56 is sucked, and the reinforcing plate 3B of the laminated body 6 is vacuum-sucked and held by the porous sheet 52. Thereby, the reinforcing plate 3B of the laminated body 6 is supported by the main body plate 50.

又,如圖7所示,於由殼體54包圍之多孔質片材52之角落部具備液體(例如,水或有機溶劑,於樹脂層4為聚醯亞胺製之情形時較佳為水)之供給孔62。供給孔62連通於本體板50之貫通孔64,該貫通孔64連接於圖5之送液泵(液體供給器件)66。因此,當驅動送液泵66時, 液體經由貫通孔64及供給孔62而被供給至由殼體54包圍之液槽68。該供給孔62於剝離步驟時當使剝離組裝體42傾斜時,較佳為配置於液槽68內之最下部。 Further, as shown in Fig. 7, a liquid (for example, water or an organic solvent) is provided at a corner portion of the porous sheet 52 surrounded by the casing 54, and water is preferably used when the resin layer 4 is made of polyimide. a supply hole 62). The supply hole 62 communicates with the through hole 64 of the body plate 50, and the through hole 64 is connected to the liquid supply pump (liquid supply device) 66 of FIG. Therefore, when the liquid feed pump 66 is driven, The liquid is supplied to the liquid tank 68 surrounded by the casing 54 through the through hole 64 and the supply hole 62. When the supply hole 62 is inclined at the peeling step, it is preferably disposed at the lowermost portion in the liquid tank 68.

如圖7及圖9所示,於本體板50之上表面接著有包圍殼體54及可撓性板48之殼體(第2殼體)70。該殼體70為了阻擋於剝離步驟時自殼體54溢出之液體,設定為高於殼體54。又,殼體70亦與殼體54同樣地包含獨立氣泡之海綿。 As shown in FIGS. 7 and 9, a casing (second casing) 70 that surrounds the casing 54 and the flexible plate 48 is attached to the upper surface of the main body plate 50. The casing 70 is set higher than the casing 54 in order to block the liquid overflowing from the casing 54 at the time of the peeling step. Further, the casing 70 also includes a sponge of independent bubbles as in the case of the casing 54.

於位於殼體54與殼體70之間之多孔質片材52具備複數個貫通孔71。於本體板50具備連通於貫通孔71之複數個排水孔72。即,由殼體70阻擋之液體經由貫通孔71及排水孔72而被排出至剝離裝置40之設備外。 The porous sheet 52 located between the casing 54 and the casing 70 is provided with a plurality of through holes 71. The main body plate 50 includes a plurality of drain holes 72 that communicate with the through holes 71. That is, the liquid blocked by the casing 70 is discharged to the outside of the apparatus of the peeling device 40 through the through hole 71 and the drain hole 72.

本體板50之彎曲剛度高於多孔質片材52及殼體54、70,本體板50之彎曲剛度支配可撓性板46之彎曲剛度。可撓性板46之每單位寬度(1mm)之彎曲剛度較佳為1000~40000N‧mm2/mm。例如,於可撓性板46之寬度為100mm之部分,彎曲剛度成為100000~4000000N‧mm2。藉由將可撓性板46之彎曲剛度設為1000N‧mm2/mm以上,可防止吸附保持於可撓性板46之補強板3B之折彎。又,藉由將可撓性板46之彎曲剛度設為40000N‧mm2/mm以下,可使吸附保持於可撓性板46之補強板3B適度地彎曲變形。作為本體板50,可例示聚碳酸酯樹脂、聚氯乙烯(PVC)樹脂、丙烯酸樹脂、聚縮醛(POM)樹脂等樹脂製構件、及金屬製構件。 The bending stiffness of the body plate 50 is higher than that of the porous sheet 52 and the casings 54, 70. The bending stiffness of the body plate 50 governs the bending stiffness of the flexible plate 46. The bending rigidity per unit width (1 mm) of the flexible plate 46 is preferably from 1,000 to 40,000 N ‧ mm 2 /mm. For example, in the portion where the width of the flexible plate 46 is 100 mm, the bending rigidity becomes 100,000 to 4,000,000 N ‧ mm 2 . By setting the bending rigidity of the flexible plate 46 to 1000 N ‧ mm 2 /mm or more, it is possible to prevent the bending of the reinforcing plate 3B held by the flexible plate 46 by suction. Moreover, by setting the bending rigidity of the flexible plate 46 to 40000 N ‧ mm 2 /mm or less, the reinforcing plate 3B adsorbed and held by the flexible plate 46 can be appropriately bent and deformed. The main body plate 50 is exemplified by a resin member such as a polycarbonate resin, a polyvinyl chloride (PVC) resin, an acrylic resin, or a polyacetal (POM) resin, and a metal member.

[可撓性板48] [Flexible Plate 48]

如圖8及圖9所示,可撓性板48具備尺寸大於積層體6且尺寸小於本體板50之矩形狀之本體板74、及吸附保持積層體6之補強板3A(參照圖2:第2基板)之矩形狀之橡膠製之多孔質片材76,且於本體板74之下表面貼附有多孔質片材76。 As shown in FIGS. 8 and 9, the flexible plate 48 includes a main body plate 74 having a size larger than that of the laminated body 6 and having a smaller size than the main body plate 50, and a reinforcing plate 3A for adsorbing and holding the laminated body 6 (refer to FIG. 2: A porous sheet 76 made of a rectangular rubber of 2 substrates), and a porous sheet 76 is attached to the lower surface of the main body plate 74.

多孔質片材76之厚度亦與多孔質片材52之厚度同樣為2mm,較佳為1mm以下。 The thickness of the porous sheet 76 is also 2 mm, preferably 1 mm or less, similar to the thickness of the porous sheet 52.

於多孔質片材76中具備框狀之槽78。槽78經由設置於本體板74之複數個貫通孔80而連接於圖5所示之真空泵82。 The porous sheet 76 is provided with a frame-shaped groove 78. The groove 78 is connected to the vacuum pump 82 shown in FIG. 5 via a plurality of through holes 80 provided in the main body plate 74.

因此,當驅動真空泵82時,會抽吸貫通孔80及槽78之空氣,積層體6之補強板3A被真空吸附保持於多孔質片材76。藉此,積層體6之補強板3A支持於本體板74。 Therefore, when the vacuum pump 82 is driven, the air in the through hole 80 and the groove 78 is sucked, and the reinforcing plate 3A of the laminated body 6 is vacuum-sucked and held by the porous sheet 76. Thereby, the reinforcing plate 3A of the laminated body 6 is supported by the main body plate 74.

即,如圖9(B)所示,積層體6藉由將補強板3B吸附保持於可撓性板46,將補強板3A吸附保持於可撓性板48而支持於剝離組裝體42。而且,本體板74之下表面按壓至殼體54之上表面。藉此,圖7(A)所示之液槽68成為由上下之可撓性板48、46與殼體54密閉之液槽。因此,藉由自供給孔62供給至液槽68內之液體而將積層體6之側面充滿。 In other words, as shown in FIG. 9(B), the laminated body 6 is supported by the peeling assembly 42 by adsorbing and holding the reinforcing plate 3B on the flexible plate 46 and sucking and holding the reinforcing plate 3A on the flexible plate 48. Moreover, the lower surface of the body plate 74 is pressed to the upper surface of the casing 54. Thereby, the liquid tank 68 shown in FIG. 7(A) is a liquid tank which is sealed by the upper and lower flexible plates 48 and 46 and the casing 54. Therefore, the side surface of the laminated body 6 is filled by the liquid supplied from the supply hole 62 into the liquid tank 68.

再者,如圖8所示,於本體板74具備放掉液槽68內之空氣之貫通孔84。該貫通孔84配置於相對於圖7所示之供給孔62為對角線上之位置且於使剝離組裝體42傾斜時液槽68內之最上部。藉此,可利用液體將液槽68內填充,又,於液體之填充時液體自貫通孔84溢出時,或即將溢出之前,停止液體之供給,藉此,可容易地確認液槽68被液體充滿。 Further, as shown in FIG. 8, the main body plate 74 is provided with a through hole 84 for discharging the air in the liquid tank 68. The through hole 84 is disposed at a position on the diagonal line with respect to the supply hole 62 shown in FIG. 7 and at the uppermost portion in the liquid tank 68 when the peeling assembly 42 is inclined. Thereby, the liquid tank 68 can be filled with the liquid, and when the liquid overflows from the through hole 84 at the time of liquid filling, or immediately before the overflow, the supply of the liquid is stopped, whereby the liquid tank 68 can be easily confirmed to be liquid. full.

本體板74之構成及功能與本體板50相同,因此省略說明。 Since the configuration and function of the main body plate 74 are the same as those of the main body plate 50, description thereof will be omitted.

其次,返回圖5,對剝離裝置40之可動裝置(傾斜器件、剝離器件)86進行說明。 Next, returning to Fig. 5, a movable device (inclination device, peeling device) 86 of the peeling device 40 will be described.

[可動裝置86] [movable device 86]

可動裝置86隔著剝離組裝體42上下配置。由於上下配置之一對可動裝置86、86為相同構成,故而此處對配置於圖5之下側之可動裝置86進行說明,對配置於上側之可動裝置86藉由附註相同之符號而省略說明。 The movable device 86 is disposed vertically above the peeling assembly 42. Since one of the upper and lower arrangements has the same configuration for the movable devices 86 and 86, the movable device 86 disposed on the lower side of FIG. 5 will be described here, and the same reference numerals will be given to the movable device 86 disposed on the upper side, and the description will be omitted. .

可動裝置86包括複數個可動體44、針對每個可動體44使可動體44升降移動之複數個驅動裝置88、及針對每個驅動裝置88控制驅動裝置88之控制器90等。 The movable device 86 includes a plurality of movable bodies 44, a plurality of driving devices 88 that move the movable body 44 up and down for each movable body 44, a controller 90 that controls the driving device 88 for each driving device 88, and the like.

複數個可動體44如圖6所示般呈柵格狀固定於本體板50之下表面。該等可動體44藉由螺栓等緊固構件而固定於本體板50,但亦可代替螺栓而被接著固定。該等可動體44藉由被控制器90驅動控制之驅動裝置88而獨立地升降移動。 A plurality of movable bodies 44 are fixed to the lower surface of the main body plate 50 in a lattice shape as shown in FIG. The movable body 44 is fixed to the main body plate 50 by a fastening member such as a bolt, but may be fixed next to the bolt. The movable bodies 44 are independently moved up and down by the drive unit 88 that is driven and controlled by the controller 90.

即,控制器90可控制驅動裝置88使剝離組裝體42自圖5之水平姿勢傾斜為圖10所示之剝離起始位置之傾斜姿勢。又,控制器90使圖6中之位於積層體6之角部6A側之可動體44至位於箭頭A所示之剝離行進方向之角部6B側之可動體44依序下降移動。藉由該動作,積層體6之界面24以剝離起始部26(參照圖4)為起點進行剝離。再者,圖5、圖10所示之積層體6係利用圖3中說明之剝離起始部製成方法而製成了剝離起始部26、30之積層體6。 That is, the controller 90 can control the driving device 88 to incline the peeling assembly 42 from the horizontal posture of FIG. 5 to the inclined posture of the peeling start position shown in FIG. Further, the controller 90 sequentially lowers the movable body 44 on the side of the corner portion 6A of the laminated body 6 in Fig. 6 to the movable body 44 on the side of the corner portion 6B in the peeling traveling direction indicated by the arrow A. By this operation, the interface 24 of the laminated body 6 is peeled off starting from the peeling start portion 26 (see FIG. 4). Further, the layered body 6 shown in Figs. 5 and 10 is formed into a layered body 6 of the peeling start portions 26 and 30 by the method of producing the peeling starting portion described in Fig. 3 .

驅動裝置88例如包含旋轉式之伺服馬達及滾珠螺桿機構等。伺服馬達之旋轉運動藉由滾珠螺桿機構轉換為直線運動,並被傳遞至滾珠螺桿機構之桿92。於桿92之前端部經由球接頭94設置有可動體44。藉此,可動體44追隨可撓性板46之彎曲變形而傾動。由此,可不對可撓性板46施加過度之力而使可撓性板46自角部6A朝向角部6B彎曲變形。再者,作為驅動裝置88,並不限定於旋轉式之伺服馬達及滾珠螺桿機構,亦可為直線式之伺服馬達、或流體壓力汽缸(例如氣壓汽缸)。又,可撓性板46之彎曲變形方向可為自角部6A朝向角部6B之對角線上,亦可為相對於鄰接於角部6A之邊45度之方向。 The drive unit 88 includes, for example, a rotary servo motor, a ball screw mechanism, and the like. The rotary motion of the servo motor is converted into a linear motion by the ball screw mechanism and transmitted to the rod 92 of the ball screw mechanism. A movable body 44 is provided at the front end of the rod 92 via the ball joint 94. Thereby, the movable body 44 is tilted following the bending deformation of the flexible plate 46. Thereby, the flexible plate 46 can be bent and deformed from the corner portion 6A toward the corner portion 6B without applying excessive force to the flexible plate 46. Further, the drive unit 88 is not limited to the rotary servo motor and the ball screw mechanism, and may be a linear servo motor or a fluid pressure cylinder (for example, a pneumatic cylinder). Further, the bending deformation direction of the flexible plate 46 may be a diagonal line from the corner portion 6A toward the corner portion 6B, or may be a direction 45 degrees with respect to the side adjacent to the corner portion 6A.

較佳為複數個驅動裝置88經由緩衝構件98安裝於可升降之框架96。緩衝構件98以追隨可撓性板46之彎曲變形之方式彈性變形。藉此,桿92相對於框架96傾動。 Preferably, a plurality of drive units 88 are mounted to the elevating frame 96 via a cushioning member 98. The cushioning member 98 is elastically deformed in such a manner as to follow the bending deformation of the flexible plate 46. Thereby, the rod 92 is tilted relative to the frame 96.

控制器90作為包含CPU(Central Processing Unit,中央處理單元)、ROM(Read Only Memory,唯讀記憶體)、及RAM(Random Access Memory,隨機存取記憶體)等記錄媒體等之電腦而構成。控制器90藉由使CPU執行記錄於記錄媒體之程式而控制複數個驅動裝置88之每個驅動裝置88,從而控制複數個可動體44之升降移動。 The controller 90 is configured as a computer including a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The controller 90 controls the up and down movement of the plurality of movable bodies 44 by causing the CPU to execute the program recorded on the recording medium to control each of the plurality of driving devices 88.

〔利用剝離裝置40之補強板3A、3B之剝離方法〕 [Separation method of reinforcing plates 3A and 3B by peeling device 40]

圖11(A)~(D)~圖12(A)~(E)~圖13(A)~(D)~圖14(A)~(D)~圖15(A)~(D)表示利用圖3中說明之剝離起始部製成方法於角部6A製成剝離起始部26、30之積層體6之剝離方法。又,於該等圖中,按時間序列表示剝離積層體6之補強板3A、3B之剝離方法。 Figure 11 (A) ~ (D) ~ Figure 12 (A) ~ (E) ~ Figure 13 (A) ~ (D) ~ Figure 14 (A) ~ (D) ~ Figure 15 (A) ~ (D) The peeling method of the laminated body 6 of the peeling start parts 26 and 30 is formed in the corner part 6A by the peeling start part preparation method demonstrated in FIG. Moreover, in these figures, the peeling method of the reinforcing plates 3A and 3B of the peeling laminated body 6 is shown in time series.

即,於圖11(A)~(D)中依序表示使積層體6保持於剝離組裝體42之步驟、使剝離組裝體42相對於水平方向以θ傾斜角度傾斜之步驟、及使液體100填充至液槽68之步驟。 That is, the steps of holding the laminated body 6 in the peeling assembly 42, the step of inclining the peeling assembly 42 at an oblique angle of θ with respect to the horizontal direction, and the liquid 100 are sequentially shown in FIGS. 11(A) to 11(D). The step of filling into the liquid tank 68.

又,於圖12(A)~(E)中表示使可撓性板46彎曲變形而剝離補強板3B之步驟。 Further, in FIGS. 12(A) to (E), the step of bending and deforming the flexible plate 46 to peel off the reinforcing plate 3B is shown.

又,於圖13(A)~(D)中表示剝離之補強板3B之搬出步驟。 Further, the step of carrying out the peeling of the reinforcing plate 3B is shown in Figs. 13(A) to (D).

又,於圖14(A)~(D)中依序表示使剝離組裝體42相對於水平方向以θ角度傾斜,使液體100填充於液槽68之步驟、及使可撓性板48彎曲變形而將補強板3A剝離之步驟。 Further, in FIGS. 14(A) to 14(D), the peeling assembly 42 is inclined at an angle θ with respect to the horizontal direction, the liquid 100 is filled in the liquid tank 68, and the flexible plate 48 is bent and deformed. The step of peeling the reinforcing plate 3A.

又,於圖15(A)~(D)依序表示面板102之搬出步驟、及剝離之補強板3A之搬出步驟。 Further, the step of carrying out the panel 102 and the step of carrying out the peeling of the reinforcing plate 3A are sequentially shown in Figs. 15(A) to 15(D).

向剝離組裝體42之積層體6之搬入作業、及剝離之補強板3A、3B及面板102之搬出作業係藉由圖11(A)等所示之具備吸附墊104之搬送裝置106進行。再者,於圖11~圖15中,為了避免圖式之繁雜,省略可動裝置86之圖示。又,所謂面板102係介隔功能層7貼附有去除了補強板3A、3B之基板2A及基板2B之製品面板。 The carrying-in operation of the laminated body 6 of the peeling assembly 42 and the unloading of the reinforcing plates 3A and 3B and the panel 102 are performed by the conveying device 106 having the adsorption pad 104 shown in Fig. 11(A) and the like. In addition, in FIGS. 11 to 15, in order to avoid the complication of the drawings, the illustration of the movable device 86 is omitted. Further, the panel 102 is a product panel in which the functional layer 7 is attached with the substrate 2A and the substrate 2B from which the reinforcing plates 3A and 3B are removed.

以下,依序說明剝離方法。 Hereinafter, the peeling method will be described in order.

如圖11(A)所示,剝離起始前之可撓性板46、48藉由可動裝置86而將其姿勢定位於水平方向,且可撓性板48退避至可撓性板46之上方。於該初始狀態下藉由搬送裝置106將積層體6搬送至可撓性板46之上方,藉由可撓性板46之多孔質片材52吸附保持積層體6之補強板3B之後,使可撓性板48下降移動,如圖11(B)所示般,藉由可撓性板48之多孔質片材76吸附保持積層體6之補強板3A。藉此,將積層體6配置於液槽68內。 As shown in Fig. 11(A), the flexible plates 46, 48 before the start of peeling are positioned in the horizontal direction by the movable device 86, and the flexible plate 48 is retracted above the flexible plate 46. . In this initial state, the laminated body 6 is conveyed above the flexible plate 46 by the conveying device 106, and the reinforcing sheet 3B of the laminated body 6 is sucked and held by the porous sheet 52 of the flexible plate 46, and then The flexible plate 48 is moved downward, and as shown in Fig. 11(B), the reinforcing plate 3A of the laminated body 6 is sucked and held by the porous sheet 76 of the flexible plate 48. Thereby, the laminated body 6 is arrange|positioned in the liquid tank 68.

其次,如圖11(C)所示,使剝離組裝體42相對於水平方向以θ角度傾斜(傾斜步驟)。如上所述,剝離組裝體42之傾斜姿勢設為如下姿勢,即,供給孔62(圖7(A))位於液槽68之最下部,貫通孔84(圖8(A))位於液槽68之最上部。藉此,於液槽68內,積層體6之圖6之角部6A位於最高之位置,角部6B位於最低之位置。 Next, as shown in Fig. 11(C), the peeling assembly 42 is inclined at an angle θ with respect to the horizontal direction (inclination step). As described above, the inclined posture of the peeling assembly 42 is set to a posture in which the supply hole 62 (Fig. 7(A)) is located at the lowermost portion of the liquid tank 68, and the through hole 84 (Fig. 8(A)) is located at the liquid tank 68. The uppermost part. Thereby, in the liquid tank 68, the corner portion 6A of Fig. 6 of the laminated body 6 is located at the highest position, and the corner portion 6B is at the lowest position.

再者,剝離組裝體42之傾斜角度θ係以液體100藉由重力之作用而朝向剝離時產生之剝離前線移動之方式,由使可撓性板46、48彎曲時之可撓性板46、48之曲率半徑等決定。於實施形態中,可撓性板46、48之曲率半徑設定為1000mm,剝離組裝體42之傾斜角度θ設定為1至4度(較佳為2度)。 Further, the inclination angle θ of the peeling assembly 42 is such that the flexible sheet 46 when the flexible sheets 46 and 48 are bent is moved in such a manner that the liquid 100 moves toward the peeling front line generated by the action of gravity by the action of gravity. The radius of curvature of 48 is determined. In the embodiment, the radius of curvature of the flexible plates 46 and 48 is set to 1000 mm, and the inclination angle θ of the peeling assembly 42 is set to 1 to 4 degrees (preferably 2 degrees).

其次,如圖11(D)所示,藉由送液泵66(參照圖5)將液體100如箭頭所示般自供給孔62供給至液槽68。藉此,積層體6之所有側面充滿液體100(液體供給步驟)。 Next, as shown in Fig. 11(D), the liquid 100 is supplied from the supply hole 62 to the liquid tank 68 by the liquid supply pump 66 (refer to Fig. 5) as indicated by the arrow. Thereby, all the sides of the laminated body 6 are filled with the liquid 100 (liquid supply step).

其次,如圖12(A)~(D)所示,使可撓性板46向下方彎曲變形而開始補強板3B之剝離。可撓性板46之彎曲方向為圖6中自可撓性板46之角部46A朝向角部46B之箭頭A方向。藉此,補強板3B一面自角部6A朝向角部6B彎曲變形一面被剝離。 Next, as shown in FIGS. 12(A) to (D), the flexible plate 46 is bent downward and the peeling of the reinforcing plate 3B is started. The bending direction of the flexible plate 46 is the direction of the arrow A from the corner portion 46A of the flexible plate 46 toward the corner portion 46B in Fig. 6 . Thereby, the reinforcing plate 3B is peeled off while being bent and deformed from the corner portion 6A toward the corner portion 6B.

此時,積層體6之補強板3B以界面24之剝離起始部26(參照圖4)為 起點開始剝離。即,於圖10所示之下側之可撓性板46之複數個可動體44中,使位於可撓性板46之角部46A側之可動體44至位於角部46B側之可動體44依序下降移動。藉此,補強板3B向下方彎曲變形,因此,以界面24,自角部6A朝向角部6B剝離(剝離步驟)。而且,如圖12(E)所示,補強板3B被完全地剝離。 At this time, the reinforcing plate 3B of the laminated body 6 is formed by the peeling start portion 26 (refer to FIG. 4) of the interface 24. The starting point begins to peel off. That is, in the plurality of movable bodies 44 of the flexible plate 46 on the lower side shown in FIG. 10, the movable body 44 on the side of the corner portion 46A of the flexible plate 46 is moved to the movable body 44 on the side of the corner portion 46B. Move down in sequence. Thereby, since the reinforcing plate 3B is bent and deformed downward, the interface 24 is peeled off from the corner portion 6A toward the corner portion 6B (peeling step). Further, as shown in Fig. 12(E), the reinforcing plate 3B is completely peeled off.

又,於補強板3B之剝離中,自殼體54溢出之液體100被殼體70阻擋,而自排水孔72被排出至剝離組裝體42之外部。藉此,剝離裝置40之使用環境不會被液體100污染,又,若回收自排水孔72排出之液體100,則亦可對液體100進行再利用。 Further, in the peeling of the reinforcing plate 3B, the liquid 100 overflowing from the casing 54 is blocked by the casing 70, and is discharged from the drain hole 72 to the outside of the peeling assembly 42. Thereby, the use environment of the peeling device 40 is not contaminated by the liquid 100, and if the liquid 100 discharged from the drain hole 72 is recovered, the liquid 100 can be reused.

於圖12(A)~(D)所示之剝離步驟中,傾斜之積層體6之側面充滿液體100,因此,當自該狀態開始剝離時,液體100直接流入至藉由界面24中之剝離而依序出現之剝離面(剝離前線),一面於剝離面上藉由重力而向下方移動,一面直接濡濕剝離面。與液體100藉由重力而流入之同時,伴隨著剝離之行進形成新的空間。該空間由基板及液體100包圍,液體100被大氣壓擠壓,因此,剝離面直接被液體100濡濕。當自該狀態開始剝離時,由於處於積層體6之周圍之液體之水面高於剝離面,故而液體100直接藉由重力而流入至因界面24中之剝離而依序出現之剝離面(剝離前線),而將剝離面直接濡濕。 In the peeling step shown in Figs. 12(A) to (D), the side surface of the inclined laminated body 6 is filled with the liquid 100, and therefore, when peeling starts from this state, the liquid 100 directly flows into the peeling by the interface 24. On the other hand, the peeling surface (peeling front line) which appears in order is moved downward by gravity, and the peeling surface is directly wetted. At the same time as the liquid 100 flows in by gravity, a new space is formed along with the progress of the peeling. This space is surrounded by the substrate and the liquid 100, and the liquid 100 is pressed by the atmospheric pressure, so that the peeling surface is directly wetted by the liquid 100. When the peeling starts from this state, since the water surface of the liquid around the laminated body 6 is higher than the peeling surface, the liquid 100 directly flows by gravity to the peeling surface which sequentially appears due to the peeling in the interface 24 (peeling front line) ), and the peeling surface is directly damp.

即,剝離裝置40使積層體6傾斜而使積層體6之側面充滿液體,因此,可依存於液體100之重力使液體100自積層體之側面之外(自積層體之外部)連續地供給並遍及剝離前線。 In other words, the peeling device 40 tilts the laminated body 6 and fills the side surface of the laminated body 6 with the liquid. Therefore, the liquid 100 can be continuously supplied from the side surface of the laminated body (outside the laminated body) depending on the gravity of the liquid 100. Spread the front line throughout.

作為使液體100連續地供給並遍及剝離前線之態樣,存在如下方法:於剝離步驟中,亦驅動送液泵66,使積層體之側面充分充滿液體;及將利用送液泵66之驅動之液體之供給僅設為圖11(D)所示之階段,於剝離步驟中,停止送液泵66之驅動,將連續地供給至剝離前線之液體設為充滿積層體之側面之液體100。 As a state in which the liquid 100 is continuously supplied and spread over the peeling front line, there is a method in which the liquid feeding pump 66 is also driven in the peeling step to sufficiently fill the side surface of the laminated body with the liquid; and the driving by the liquid feeding pump 66 is used. The supply of the liquid is only at the stage shown in Fig. 11(D). In the peeling step, the driving of the liquid feeding pump 66 is stopped, and the liquid continuously supplied to the peeling front line is set to the liquid 100 which is filled on the side surface of the laminated body.

前者之方法適合如下情形,即,相對於剝離面之大小(寬度),僅以於圖11(D)所示之階段充滿積層體之側面之液體之量難以將液體自積層體之外部連續地供給至剝離前線。 The former method is suitable for the case where, with respect to the size (width) of the peeling surface, it is difficult to continuously carry the liquid from the outside of the laminated body only by the amount of the liquid which fills the side of the laminated body at the stage shown in FIG. 11(D). Supply to the stripping front line.

後者之情形適合如下情形,即,相對於剝離面之大小(寬度),僅以於圖11(D)所示之階段充滿積層體之側面之液體之量即可自積層體之外部對剝離前線連續充分地供給液體。 The latter case is suitable for the case where the amount of the liquid which is filled on the side of the laminated body at the stage shown in Fig. 11(D) can be peeled off from the outside of the laminated body with respect to the size (width) of the peeling surface. The liquid is continuously supplied continuously.

於圖12(E)所示之補強板3B之剝離狀態中,將剝離之補強板3B真空吸附保持於可撓性板46之多孔質片材52,將除去補強板3B之積層體6(包含補強板3A及面板102之積層體)真空吸附保持於可撓性板48之多孔質片材76。又,解除可撓性板46之彎曲變形。 In the peeling state of the reinforcing plate 3B shown in FIG. 12(E), the peeled reinforcing plate 3B is vacuum-sucked and held by the porous sheet 52 of the flexible plate 46, and the laminated body 6 of the reinforcing plate 3B is removed (including The laminated body of the reinforcing plate 3A and the panel 102 is vacuum-sucked and held by the porous sheet 76 of the flexible plate 48. Further, the bending deformation of the flexible plate 46 is released.

其次,如圖13(A)所示般將可撓性板46、48之姿勢變更為水平方向之後,如圖13(B)所示般使可撓性板48相對於可撓性板46退避至上方。 Next, as shown in FIG. 13(A), after the postures of the flexible plates 46 and 48 are changed to the horizontal direction, the flexible plate 48 is retracted from the flexible plate 46 as shown in FIG. 13(B). To the top.

其次,解除補強板3B之吸附保持之後,利用搬送裝置106之吸附墊104吸附補強板3B,藉由搬送裝置106將補強板3B自剝離組裝體42取出(圖13(C))。 Next, after the adsorption holding of the reinforcing plate 3B is released, the reinforcing plate 3B is sucked by the adsorption pad 104 of the conveying device 106, and the reinforcing plate 3B is taken out from the peeling assembly 42 by the conveying device 106 (FIG. 13(C)).

其後,開始補強板3A之剝離。 Thereafter, the peeling of the reinforcing plate 3A is started.

首先,使可撓性板48朝向可撓性板46下降移動,如圖13(D)所示,將基板2B吸附保持於可撓性板46之多孔質片材52。 First, the flexible plate 48 is moved downward toward the flexible plate 46, and as shown in Fig. 13(D), the substrate 2B is adsorbed and held by the porous sheet 52 of the flexible plate 46.

其次,如圖14(A)所示,使剝離組裝體42同樣地以傾斜角度θ傾斜之後,將液體100填充至液槽68。 Next, as shown in FIG. 14(A), the peeling assembly 42 is similarly inclined at an inclination angle θ, and then the liquid 100 is filled into the liquid tank 68.

其次,如圖14(B)~(C)所示,使可撓性板48向上方彎曲變形,開始補強板3A之剝離。可撓性板48之彎曲方向係圖6中自可撓性板48之角部48A朝向角部48B之箭頭A方向。藉此,補強板3A一面自角部6A朝向角部6B彎曲變形,一面被剝離。 Next, as shown in FIGS. 14(B) to (C), the flexible plate 48 is bent and deformed upward, and peeling of the reinforcing plate 3A is started. The bending direction of the flexible plate 48 is the direction of the arrow A from the corner 48A of the flexible plate 48 in FIG. 6 toward the corner 48B. Thereby, the reinforcing plate 3A is bent and deformed from the corner portion 6A toward the corner portion 6B, and is peeled off.

此時,積層體6之補強板3A以界面28之剝離起始部30(參照圖4)為 起點開始剝離。即,於圖10所示之可撓性板48之複數個可動體44中,使位於可撓性板46之角部46A側之可動體44至位於角部46B側之可動體44依序上升移動。藉此,補強板3A向上方彎曲變形,因此,以界面28自角部6A朝向角部6B開始剝離(剝離步驟)。而且,如圖14(D)所示,補強板3A被完全地剝離。 At this time, the reinforcing plate 3A of the laminated body 6 is the peeling start portion 30 (refer to FIG. 4) of the interface 28 as The starting point begins to peel off. That is, in the plurality of movable bodies 44 of the flexible plate 48 shown in Fig. 10, the movable body 44 located on the side of the corner portion 46A of the flexible plate 46 to the movable body 44 on the side of the corner portion 46B is sequentially raised. mobile. Thereby, since the reinforcing plate 3A is bent and deformed upward, the interface 28 is peeled off from the corner portion 6A toward the corner portion 6B (peeling step). Further, as shown in Fig. 14(D), the reinforcing plate 3A is completely peeled off.

於圖14(B)~(C)所示之剝離步驟中,傾斜之積層體6之側面充滿液體100,因此,當自該狀態開始剝離時,由於處於積層體6之周圍之液體之水面高於剝離面,故而液體100直接流入至因界面28中之剝離而依序出現之剝離面(剝離前線),且一面於剝離面上藉由重力而向下方移動,一面直接濡濕剝離面。當自該狀態開始剝離時,由於處於積層體6之周圍之液體之水面高於剝離面,故而液體100藉由重力直接流入至因界面28中之剝離而依序出現之剝離面(剝離前線),而直接濡濕剝離面。即,剝離裝置40使積層體6傾斜而使層體6之側面充滿液體,因此,可依存於液體100之重力使液體100自積層體之側面之外(自積層體之外部)連續地供給並遍及剝離前線。 In the peeling step shown in Figs. 14(B) to (C), the side surface of the inclined laminated body 6 is filled with the liquid 100, and therefore, when peeling starts from this state, the liquid surface of the liquid around the laminated body 6 is high. On the peeling surface, the liquid 100 directly flows into the peeling surface (peeling front line) which sequentially appears due to peeling in the interface 28, and directly moves the peeling surface while moving downward by gravity on the peeling surface. When the peeling starts from this state, since the water surface of the liquid around the laminated body 6 is higher than the peeling surface, the liquid 100 directly flows into the peeling surface (peeling front line) which sequentially appears due to the peeling in the interface 28 by gravity. And directly wet the peeling surface. In other words, the peeling device 40 tilts the laminated body 6 and fills the side surface of the layer body 6 with the liquid. Therefore, the liquid 100 can be continuously supplied from the side surface of the laminated body (outside the laminated body) depending on the gravity of the liquid 100. Spread the front line throughout.

於圖14(D)所示之補強板3A之剝離狀態下,將剝離之補強板3A真空吸附保持於可撓性板48之多孔質片材76,將面板102真空吸附保持於可撓性板46之多孔質片材52。又,解除可撓性板48之彎曲變形。 In the peeling state of the reinforcing plate 3A shown in FIG. 14(D), the peeled reinforcing plate 3A is vacuum-sucked and held by the porous sheet 76 of the flexible plate 48, and the panel 102 is vacuum-adsorbed and held on the flexible plate. A porous sheet 52 of 46. Further, the bending deformation of the flexible plate 48 is released.

其次,如圖15(A)所示般使可撓性板46、48之姿勢變更為水平方向之後,如圖15(B)所示般使可撓性板48相對於可撓性板46向上方退避。 Next, as shown in Fig. 15(A), after the postures of the flexible plates 46 and 48 are changed to the horizontal direction, the flexible plate 48 is made up with respect to the flexible plate 46 as shown in Fig. 15(B). Party retreat.

其次,解除面板102之吸附保持之後,利用搬送裝置106之吸附墊104吸附面板102,藉由搬送裝置106將面板102自剝離組裝體42取出。 Next, after the suction holding of the panel 102 is released, the panel 102 is sucked by the adsorption pad 104 of the conveying device 106, and the panel 102 is taken out from the peeling assembly 42 by the conveying device 106.

而且,最後,如圖15(C)所示,利用搬送裝置106之吸附墊104吸附保持補強板3A,其後,解除利用可撓性板48之補強板3A之吸附保 持,將補強板3A自剝離組裝體42取出(圖15(D))。 Finally, as shown in Fig. 15(C), the reinforcing plate 3A is suction-held by the adsorption pad 104 of the transfer device 106, and thereafter, the reinforcing plate 3A of the flexible plate 48 is released. The reinforcing plate 3A is taken out from the peeling assembly 42 (Fig. 15 (D)).

上述剝離方法係圖2所示之積層體6之剝離方法,但即便為圖1所示之積層體1,亦可使用同樣之剝離裝置40剝離補強板3。於此情形時,使補強板3保持於可撓性板46,並且使基板2保持於可撓性板48。其次,使剝離組裝體42相對於水平方向以θ角度傾斜。其次,將液體100填充至液槽68中,使積層體1之側面充滿液體100。然後,使可撓性板46如圖12(A)~(D)所示般彎曲變形。藉此,可將補強板3剝離。 The peeling method is the peeling method of the laminated body 6 shown in FIG. 2, but even if it is the laminated body 1 shown in FIG. 1, the reinforcing board 3 can be peeled off using the same peeling apparatus 40. In this case, the reinforcing plate 3 is held by the flexible plate 46, and the substrate 2 is held by the flexible plate 48. Next, the peeling assembly 42 is inclined at an angle θ with respect to the horizontal direction. Next, the liquid 100 is filled into the liquid tank 68, and the side surface of the laminated body 1 is filled with the liquid 100. Then, the flexible board 46 is bent and deformed as shown in Figs. 12(A) to (D). Thereby, the reinforcing plate 3 can be peeled off.

於上述剝離步驟中,傾斜之積層體1之側面亦充滿液體100,因此,當自該狀態開始剝離時,液體100直接流入至因界面上之剝離而依序出現之剝離面,且一面於剝離面上藉由重力而向下方移動,一面直接濡濕剝離面。由此,可順利且以較短時間進行利用液體100之剝離動作。 In the above-mentioned peeling step, the side surface of the inclined laminated body 1 is also filled with the liquid 100. Therefore, when peeling starts from this state, the liquid 100 directly flows into the peeling surface which sequentially appears due to the peeling on the interface, and is peeled off on one side. The surface is moved downward by gravity, and the peeling surface is directly wetted. Thereby, the peeling operation by the liquid 100 can be performed smoothly and in a short time.

詳細且參照特定之實施態樣對本發明進行了說明,但業者可知,可不脫離本發明之精神及範圍而施加各種變更或修正。 The present invention has been described in detail with reference to the specific embodiments of the invention. It is understood that various changes and modifications may be made without departing from the spirit and scope of the invention.

本申請案係基於2014年6月3日提出申請之日本專利申請2014-114644而完成者,其內容以參照之形式併入本文中。 The present application is based on Japanese Patent Application No. 2014-114644, filed on Jun. 3, 2014, the content of which is hereby incorporated by reference.

3B‧‧‧補強板 3B‧‧‧ reinforcing plate

6‧‧‧積層體 6‧‧‧Layer

24‧‧‧界面 24‧‧‧ interface

42‧‧‧剝離組裝體 42‧‧‧ Strip assembly

46‧‧‧可撓性板 46‧‧‧Flexible board

46A‧‧‧角部 46A‧‧‧ corner

46B‧‧‧角部 46B‧‧‧ corner

48‧‧‧可撓性板 48‧‧‧Flexible board

52‧‧‧多孔質片材 52‧‧‧Porous sheets

54‧‧‧殼體 54‧‧‧Shell

64‧‧‧貫通孔 64‧‧‧through holes

70‧‧‧殼體 70‧‧‧shell

72‧‧‧排水孔 72‧‧‧Drainage holes

76‧‧‧多孔質片材 76‧‧‧Porous sheets

100‧‧‧搬送裝置 100‧‧‧Transporting device

Claims (15)

一種積層體之剝離裝置,其特徵在於包括:傾斜器件,其使第1基板與第2基板介隔吸附層而可剝離地貼附而成之積層體相對於水平方向傾斜;液體供給器件,其使傾斜之上述積層體之至少上端部側之側面充滿液體;及剝離器件,其自傾斜之上述積層體之上端部朝向下端部於上述第1基板與上述吸附層之界面進行剝離。 A peeling device for a laminated body, comprising: a tilting device that tilts a laminate in which a first substrate and a second substrate are separated from each other by an adsorption layer with respect to a horizontal direction; and a liquid supply device The side surface of at least the upper end side of the inclined laminated body is filled with a liquid, and the peeling means is peeled off from the upper end portion of the laminated body from the inclined side toward the lower end portion at the interface between the first substrate and the adsorption layer. 一種積層體之剝離裝置,其對第1基板與第2基板介隔吸附層而可剝離地貼附而成之積層體,使上述第1基板及上述第2基板中之至少一個基板沿著自其一端側朝向另一端側之剝離行進方向彎曲,藉此於上述第1基板與上述吸附層之界面進行剝離,其特徵在於包括:剝離組裝體,其具備保持上述第1基板之第1保持構件、保持上述第2基板之第2保持構件、及包圍上述積層體之第1殼體,且將由上述第1保持構件、上述第2保持構件、及上述第1殼體包圍之空間部構成為液槽;傾斜器件,其使上述剝離組裝體相對於水平方向傾斜;液體供給器件,其對上述剝離組裝體之上述液槽供給液體,使上述積層體之側面充滿液體;及剝離器件,其使上述第1保持構件及上述第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之上述剝離行進方向彎曲。 A layered body peeling device which laminates a first substrate and a second substrate with a pressure-sensitive adhesive layer and which is detachably attached to each other, and at least one of the first substrate and the second substrate The one end side is bent toward the other end side in the peeling traveling direction, and the interface between the first substrate and the adsorption layer is peeled off, and the peeling assembly includes a first holding member that holds the first substrate. And holding the second holding member of the second substrate and the first case surrounding the laminated body, and forming a space portion surrounded by the first holding member, the second holding member, and the first case as a liquid a tilting device that inclines the peeling assembly with respect to a horizontal direction; a liquid supply device that supplies a liquid to the liquid tank of the peeling assembly to fill a side surface of the laminated body with a liquid; and a peeling device that causes the above At least one of the first holding member and the second holding member is curved in the peeling traveling direction from the upper end portion toward the lower end portion. 如請求項2之積層體之剝離裝置,其中於上述第1殼體之內側具備上述液體之供給孔。 A peeling device for a laminated body according to claim 2, wherein the liquid supply hole is provided inside the first casing. 如請求項2或3之積層體之剝離裝置,其中於上述剝離組裝體具備包圍上述第1殼體之第2殼體,且於上述第1殼體與上述第2殼體之間具備排水孔。 The peeling device of the laminated body according to claim 2 or 3, wherein the peeling assembly includes a second casing surrounding the first casing, and a drain hole is provided between the first casing and the second casing . 如請求項1至4中任一項之積層體之剝離裝置,其中上述液體為水。 A peeling device for a laminate according to any one of claims 1 to 4, wherein the liquid is water. 一種積層體之剝離方法,其特徵在於包括如下步驟:傾斜步驟,其使第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體相對於水平方向傾斜;液體供給步驟,其使傾斜之上述積層體之至少上端部側之側面充滿液體;及剝離步驟,其自傾斜之上述積層體之上端部朝向下端部,於上述第1基板與上述吸附層之界面進行剝離;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於因上述界面之剝離而依序出現之剝離面上向下方移動,一面將上述剝離面濡濕。 A method for peeling a laminated body, comprising the step of inclining a laminate in which a first substrate and a second substrate are detachably attached to each other via an adsorption layer, with respect to a horizontal direction; and a liquid supply step a side surface of the laminated body that is inclined at least on the upper end side is filled with a liquid, and a peeling step of peeling off from an upper end portion of the laminated body toward the lower end portion at an interface between the first substrate and the adsorption layer; In the peeling step, the liquid is continuously supplied from the outside of the laminated body, and the peeling surface is wetted while moving downward by the gravity on the peeling surface which sequentially appears due to peeling of the interface. 一種積層體之剝離方法,其對第1基板與第2基板介隔吸附層可剝離地貼附而成之積層體,使上述第1基板及上述第2基板中之至少一個基板沿著自其一端側朝向另一端側之剝離行進方向彎曲,藉此於上述第1基板與上述吸附層之界面進行剝離,其特徵在於:使用剝離組裝體,該剝離組裝體具備保持上述第1基板之第1保持構件、保持上述第2基板之第2保持構件、及包圍上述積層體之第1殼體,且將由上述第1保持構件、上述第2保持構件、及上述第1殼體包圍之空間部構成為液槽,且該積層體之剝離方法包括如下步驟:傾斜步驟,其使上述剝離組裝體相對於水平方向傾斜; 液體供給步驟,其對上述剝離組裝體之上述液槽供給液體,使上述積層體之側面充滿液體;及剝離步驟,其使上述第1保持構件及上述第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之上述剝離行進方向彎曲;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於因上述界面之剝離而依序出現之剝離面上向下方移動,一面將上述剝離面濡濕。 A method for peeling a laminated body, wherein a laminated body in which a first substrate and a second substrate are adhered to each other with an adsorption layer interposed therebetween, and at least one of the first substrate and the second substrate The one end side is bent toward the other end side in the peeling traveling direction, thereby peeling off the interface between the first substrate and the adsorption layer, and is characterized in that a peeling assembly is provided, and the peeling assembly includes the first substrate holding the first substrate a holding member, a second holding member that holds the second substrate, and a first casing that surrounds the laminated body, and that constitutes a space portion surrounded by the first holding member, the second holding member, and the first casing a liquid tank, and the peeling method of the laminated body includes the following steps: a tilting step of tilting the peeling assembly relative to a horizontal direction; a liquid supply step of supplying a liquid to the liquid tank of the peeling assembly to fill a side surface of the laminated body with a liquid; and a peeling step of causing at least one of the first holding member and the second holding member to follow The peeling traveling direction is curved from the upper end portion toward the lower end portion; and in the peeling step, the liquid is continuously supplied from the outside of the laminated body, and sequentially appears by gravity due to peeling of the interface. The peeling surface is moved downward while the peeling surface is wetted. 如請求項7之積層體之剝離方法,其中於上述第1殼體之內側具備上述液體之供給孔,自上述供給孔對上述液槽供給液體。 The peeling method of the laminated body according to claim 7, wherein the liquid supply hole is provided inside the first casing, and the liquid is supplied from the supply hole to the liquid tank. 如請求項7或8之積層體之剝離方法,其中於上述剝離組裝體具備包圍上述第l殼體之第2殼體,於上述第l殼體與上述第2殼體之間具備排水孔,將自上述第l殼體溢出之上述液體自上述排水孔排出。 The peeling method of the laminated body according to claim 7 or 8, wherein the peeling assembly includes a second casing surrounding the first casing, and a drain hole is provided between the first casing and the second casing; The liquid overflowing from the first housing is discharged from the drain hole. 如請求項6至9中任一項之積層體之剝離方法,其中上述吸附層為聚醯亞胺樹脂層,上述液體為水。 The method for peeling a laminate according to any one of claims 6 to 9, wherein the adsorption layer is a polyimide resin layer, and the liquid is water. 一種電子裝置之製造方法,其包括:功能層形成步驟,其相對於第1基板與第2基板介隔吸附層而可剝離地貼附而成之積層體,於上述第1基板之露出面形成功能層;及分離步驟,其自形成有上述功能層之上述第1基板將上述第2基板分離;其特徵在於:上述分離步驟包括:傾斜步驟,其使上述積層體相對於水平方向傾斜;液體供給步驟,其使傾斜之上述積層體之至少上端部側之側面充滿液體;及剝離步驟,其自傾斜之上述積層體之上端部朝向下端部,於 上述第1基板與上述吸附層之界面進行剝離;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於因上述第1基板與上述吸附層之界面上之剝離而依序出現之剝離面上向下方移動,一面將上述剝離面濡濕。 A method of manufacturing an electronic device, comprising: a functional layer forming step of forming a laminate which is detachably attached to a first substrate and a second substrate via an adsorption layer, and is formed on an exposed surface of the first substrate a functional layer; and a separating step of separating the second substrate from the first substrate on which the functional layer is formed; wherein the separating step includes a tilting step of tilting the laminated body with respect to a horizontal direction; a supply step of filling the side surface of at least the upper end side of the inclined laminated body with a liquid; and a peeling step of tilting the upper end portion of the laminated body toward the lower end portion The interface between the first substrate and the adsorption layer is peeled off; and in the peeling step, the liquid is continuously supplied from the outside of the laminate, and the interface between the first substrate and the adsorption layer is by gravity The peeling surface which is peeled off and sequentially appears to move downward, and the peeling surface is wetted. 一種電子裝置之製造方法,其包括:功能層形成步驟,其對第1基板與第2基板介隔吸附層而可剝離地貼附而成之積層體,於上述第1基板之露出面形成功能層;及分離步驟,其自形成有上述功能層之上述第1基板將上述第2基板分離;其特徵在於:上述分離步驟中,使用剝離組裝體,該剝離組裝體具備保持上述第1基板之第1保持構件、保持上述第2基板之第2保持構件、及包圍上述積層體之第1殼體,且將由上述第1保持構件、上述第2保持構件、及上述第1殼體包圍之空間部構成為液槽,且上述分離步驟包括如下步驟:傾斜步驟,其使上述剝離組裝體相對於水平方向傾斜;液體供給步驟,其對上述剝離組裝體之上述液槽供給液體,使上述積層體之側面充滿液體;及剝離步驟,其使上述第1保持構件及上述第2保持構件中之至少一個保持構件沿著自上端部朝向下端部之剝離行進方向彎曲;且於上述剝離步驟中,上述液體自上述積層體之外部被連續地供給,且一面藉由重力於因上述第1基板與上述吸附層之界面之剝離而依序出現之剝離面上向下方移動,一面將上述剝離面濡濕。 A method of manufacturing an electronic device, comprising: a functional layer forming step of attaching a laminate to which a first substrate and a second substrate are detachably attached to each other, and forming a layer on the exposed surface of the first substrate And a separating step of separating the second substrate from the first substrate on which the functional layer is formed; wherein in the separating step, a peeling assembly is used, and the peeling assembly includes the first substrate a first holding member, a second holding member holding the second substrate, and a first casing surrounding the laminated body, and a space surrounded by the first holding member, the second holding member, and the first casing The portion is configured as a liquid tank, and the separating step includes a step of inclining the peeling assembly with respect to a horizontal direction, and a liquid supply step of supplying a liquid to the liquid tank of the peeling assembly to form the laminated body a side surface filled with a liquid; and a peeling step of causing at least one of the first holding member and the second holding member to move from the upper end toward the lower end The peeling traveling direction is curved; and in the peeling step, the liquid is continuously supplied from the outside of the laminated body, and sequentially appears by gravity due to peeling of the interface between the first substrate and the adsorbing layer. The peeling surface is moved downward while the peeling surface is wetted. 如請求項12之電子裝置之製造方法,其中於上述第1殼體之內側 具備上述液體之供給孔,自上述供給孔對上述液槽供給液體。 The method of manufacturing an electronic device according to claim 12, wherein the inside of the first casing is inside A supply hole for the liquid is provided, and a liquid is supplied to the liquid tank from the supply hole. 如請求項12或13之電子裝置之製造方法,其中於上述剝離組裝體具備包圍上述第1殼體之第2殼體,於上述第1殼體與上述第2殼體之間具備排水孔,將自上述第1殼體溢出之上述液體自上述排水孔排出。 The method of manufacturing an electronic device according to claim 12, wherein the peeling assembly includes a second casing surrounding the first casing, and a drain hole is provided between the first casing and the second casing. The liquid overflowing from the first casing is discharged from the drain hole. 如請求項11至14中任一項之電子裝置之製造方法,其中上述吸附層為聚醯亞胺樹脂層,上述液體為水。 The method of manufacturing an electronic device according to any one of claims 11 to 14, wherein the adsorption layer is a polyimide resin layer, and the liquid is water.
TW104118005A 2014-06-03 2015-06-03 Peeling device and method of laminated body, and manufacturing method of electronic device TWI663060B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014114644A JP6268483B2 (en) 2014-06-03 2014-06-03 Laminate peeling apparatus, peeling method, and electronic device manufacturing method
JP2014-114644 2014-06-03

Publications (2)

Publication Number Publication Date
TW201605636A true TW201605636A (en) 2016-02-16
TWI663060B TWI663060B (en) 2019-06-21

Family

ID=54887565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104118005A TWI663060B (en) 2014-06-03 2015-06-03 Peeling device and method of laminated body, and manufacturing method of electronic device

Country Status (4)

Country Link
JP (1) JP6268483B2 (en)
KR (1) KR20150139445A (en)
CN (1) CN105291545A (en)
TW (1) TWI663060B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6944991B2 (en) 2016-08-05 2021-10-06 バッヘン・ホールディング・アクチエンゲゼルシャフト Drying container
JP7234109B2 (en) 2016-11-15 2023-03-07 コーニング インコーポレイテッド How to process the substrate
JP6899314B2 (en) * 2017-11-17 2021-07-07 浜松ホトニクス株式会社 Adsorption method
WO2022102096A1 (en) * 2020-11-13 2022-05-19 信越エンジニアリング株式会社 Workpiece adhesive chuck device and workpiece laminating machine
CN114311952B (en) * 2021-12-16 2022-12-09 珠海市奥德维科技有限公司 Diaphragm stripping platform

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3904795B2 (en) * 2000-03-15 2007-04-11 株式会社東芝 Substrate processing method and substrate processing apparatus
JP2004079613A (en) * 2002-08-12 2004-03-11 Disco Abrasive Syst Ltd Semiconductor wafer moving equipment
JP2005019591A (en) * 2003-06-25 2005-01-20 Central Glass Co Ltd Method of peeling off glass substrate from suction pad
JP4402144B2 (en) * 2006-09-29 2010-01-20 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
JP4459992B2 (en) * 2006-09-29 2010-04-28 株式会社半導体エネルギー研究所 Peeling device
JP2009182256A (en) * 2008-01-31 2009-08-13 Tokyo Ohka Kogyo Co Ltd Processing device for substrate and processing method for substrate
JP5360073B2 (en) * 2009-02-06 2013-12-04 旭硝子株式会社 Manufacturing method of electronic device and peeling apparatus used therefor
JP5155454B2 (en) * 2009-08-31 2013-03-06 旭硝子株式会社 Peeling device
EP2523208B1 (en) * 2010-04-23 2013-06-12 EV Group GmbH Device and method for releasing a product substrate from a holder substrate
FR2995447B1 (en) * 2012-09-07 2014-09-05 Soitec Silicon On Insulator METHOD FOR SEPARATING AT LEAST TWO SUBSTRATES ACCORDING TO A CHOSEN INTERFACE

Also Published As

Publication number Publication date
TWI663060B (en) 2019-06-21
JP2015230898A (en) 2015-12-21
CN105291545A (en) 2016-02-03
JP6268483B2 (en) 2018-01-31
KR20150139445A (en) 2015-12-11

Similar Documents

Publication Publication Date Title
TWI602703B (en) Substrate stripping apparatus and stripping method, and electronic device manufacturing method
TWI663060B (en) Peeling device and method of laminated body, and manufacturing method of electronic device
KR20170022917A (en) Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device
TWI659849B (en) Peeling device and method of laminated body, and manufacturing method of electronic device
KR102535656B1 (en) Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device
TW201725166A (en) Device for delaminating laminate, delamination method, and method for manufacturing electronic device
TWI673225B (en) Stripping device and peeling method of laminated body, and manufacturing method of electronic device
TW201441137A (en) Device for peeling substrate, method for peeling substrate, and method for producing electronic device
TWI601682B (en) Substrate stripping apparatus and stripping method, and electronic device manufacturing method
TWI652731B (en) Stripping device and peeling method of laminated body, and manufacturing method of electronic component
TWI659847B (en) Stripping device and method for laminated body, and manufacturing method of electronic component
TWI686307B (en) Lamination body peeling device, peeling method and electronic device manufacturing method
JP6468462B2 (en) Laminate peeling apparatus, peeling method, and electronic device manufacturing method
TWI659848B (en) Peeling device and method of laminated body, and manufacturing method of electronic device