KR20170022917A - Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device - Google Patents

Abstract

The present invention relates to an apparatus for peeling a laminate in which first and second substrates are attached in a peelable manner with an adsorption layer interposed. The laminate peeling apparatus includes: a laser light irradiation member removing a part of the adsorption layer by evaporation through irradiating a part of an outer circumferential edge portion of the laminate with laser light, and forming a peeling initiating portion at the part of the outer circumferential edge portion; a liquid supply member supplying a liquid to the peeling initiating portion and supplying the liquid to a gap between the first substrate and the adsorption layer or a gap between the second substrate and the adsorption layer; and a peeling member performing peeling from the peeling initiating portion after the first and second substrates are relatively separated.

Description

TECHNICAL FIELD [0001] The present invention relates to a peeling apparatus and a peeling method for a laminate, and a method of manufacturing an electronic device.

TECHNICAL FIELD [0001] The present invention relates to a peeling apparatus, a peeling method, and a manufacturing method of an electronic device.

Electronic devices such as display panels such as organic EL displays (OELDs) and liquid crystal displays (LCDs), solar cells, and thin film secondary batteries are known. [0003] As these electronic devices have become thinner and lighter in recent years, it is desired to thin a substrate (first substrate) such as a glass plate, a resin plate, or a metal plate used for an electronic device.

However, when the thickness of the substrate is reduced, the handling property of the substrate deteriorates. Therefore, a functional layer for an electronic device (OLED such as an anode, a buffer layer, a hole transporting layer, a light emitting layer, an electron transporting layer, Diode, it becomes difficult to form a thin film transistor (TFT: Thin Film Transistor) and a color filter (CF: Color Filter) on an LCD.

Therefore, in Patent Document 1, a support substrate (second substrate) made of glass is attached to the back surface of a substrate with an adsorption layer interposed therebetween to constitute a laminate in which the substrate is reinforced by a support substrate, A method of manufacturing an electronic device for forming a functional layer on a surface (exposed surface) of a substrate has been proposed. In this manufacturing method, since the handling property of the substrate is improved, the functional layer can be formed well on the surface of the substrate. Then, the supporting substrate is peeled from the substrate after formation of the functional layer.

Patent Document 2 discloses a peeling method for peeling a transfer body from a substrate in a laminate in which the surface of the transfer body and the surface of the substrate are laminated with the separation layer interposed therebetween. Patent Document 2 discloses that a separation layer is formed by a laminate of a light absorption layer made of amorphous silicon and a reflection layer made of a metal thin film.

According to the peeling method of Patent Document 2, irradiation light such as laser light is irradiated to the separation layer from the back side of the substrate to cause ablation in the light absorption layer to cause peeling in at least one of the separation layer or the interface , And the transfer body is peeled from the substrate.

Japanese Patent Application Laid-Open No. 2007-326358 Japanese Patent Application Laid-Open No. 10-125929

As a method of peeling a laminate, Patent Document 2 discloses a method of peeling a transfer body and a substrate by irradiating a laser beam to a separation layer. However, a method of peeling a transfer body from a substrate by evaporating a part of the light- Is not disclosed. Further, when the entire light absorbing layer is vaporized by laser light, there is a problem that the vaporized light absorbing layer component adheres to the surface of the substrate as soot.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and relates to peeling of a laminate using a laser beam. It is an object of the present invention to provide a peeling apparatus for a laminate capable of suppressing the adhesion of soot to a substrate, And a method for peeling and a method for manufacturing an electronic device.

In order to achieve the object of the present invention, one embodiment of the lamination body peeling apparatus of the present invention is a laminate body peeling apparatus in which a first substrate and a second substrate are detachably attached via an adsorption layer, A laser light irradiation member for irradiating a part of the outer peripheral edge portion of the sieve with laser light to vaporize and remove a part of the adsorption layer to form a separation start portion on a part of the outer peripheral edge portion; A liquid supply member for supplying a liquid to a gap between the substrate and the adsorbing layer or a gap between the second substrate and the adsorption layer, and a peeling-off method in which the first substrate and the second substrate are peeled off And a member.

One embodiment of the laminate peeling method of the present invention is a laminate peeling method in which a first substrate and a second substrate are peelably adhered via an adsorption layer in order to achieve the object of the present invention, A peeling initiation part manufacturing step of irradiating a part of the outer periphery edge of the adsorption layer by vaporizing a part of the adsorption layer to produce a peeling initiation part in a part of the outer peripheral edge part, And a peeling step of peeling off the first substrate and the second substrate while relatively separating the first substrate and the second substrate from the peeling start part while supplying the liquid to the gap between the substrate and the adsorption layer or the gap between the second substrate and the adsorption layer .

In order to achieve the object of the present invention, one aspect of the method of manufacturing an electronic device of the present invention is a method for manufacturing a multilayer body in which a first substrate and a second substrate are detachably attached via an adsorption layer, And a separating step of separating the second substrate from the first substrate on which the functional layer is formed, characterized in that the separating step is a step of separating the second substrate from the first substrate A peeling initiation part manufacturing step of irradiating a part of the adsorption layer by vaporizing a part of the adsorption layer to form a peeling initiation part on a part of the outer peripheral edge; And the liquid is supplied to the gap between the second substrate and the adsorption layer while relatively leaving the first substrate and the second substrate relatively apart from the peeling start portion And a peeling step for peeling off the substrate.

According to one aspect of the present invention, in the step of forming the peeling start portion, laser light is irradiated to a part of the outer peripheral edge portion of the laminate from the laser light irradiation member to remove part of the adsorption layer by vaporization, Create a starter. Then, in the peeling step, the liquid is supplied from the liquid supply member to the peeling initiation portion, and while supplying the liquid to the gap between the first substrate and the adsorption layer or the gap between the second substrate and the adsorption layer, The first substrate and the second substrate are peeled off while relatively separating the first substrate and the second substrate with the peeling member.

That is, according to one aspect of the present invention, the peeling range using the laser light is set as a part of the outer peripheral edge of the laminate, and the peeling range is set as the peeling start section. While supplying liquid to the peeling start section, And the second substrate are relatively separated from each other. By this peeling operation, the liquid is supplied to the gap between the first substrate and the adsorption layer which are gradually peeled off or the gap between the second substrate and the adsorption layer, and the liquid is soaked in the interface, .

Even after the peeling is completed, even if the adsorption layer remains on the substrate used as the supporting substrate, it is not necessary to remove the adsorption layer, and the substrate can be reused as the supporting substrate with the adsorption layer as it is. Further, when the adsorption layer remains on the substrate used as the product substrate, the adsorption layer is removed by washing.

As described above, according to one aspect of the present invention, regarding the peeling of a laminate using laser light, since the peeling range using laser light is only a part of the outer periphery of the laminate, It is possible to suppress the adhesion of soot to the substrate, which is caused by the adhesion of the soot.

One aspect of the present invention is that the thickness of the first substrate and the thickness of the second substrate are different from each other and that the laser light is irradiated to a part of the adsorption layer through a thick substrate of the first substrate or the second substrate desirable.

When the laser light is irradiated to the adsorption layer through the substrate, the surface layer of the adsorption layer irradiated with the laser light is vaporized, and the gas is trapped between the adsorption layer and the substrate in some cases. In this case, the substrate may be damaged by the pressure of the trapped gas. Therefore, according to one aspect of the present invention, laser light is irradiated onto the adsorption layer through a substrate of a thicker thickness among the first substrate or the second substrate, that is, a substrate having high strength. This makes it possible to prevent breakage of the thin substrate due to evaporation of the adsorption layer.

In one aspect of the present invention, it is preferable that the laser light irradiation member irradiate laser light to one corner portion of the outer peripheral portion of the laminate formed in a rectangular shape, thereby forming a peeling start portion in the corner portion.

According to one aspect of the present invention, in the case of a laminate formed in a rectangular shape, laser light is irradiated to only one corner portion of the outer peripheral edge portion, and a peeling start portion is formed in the corner portion. When the laminate is other than the rectangular shape, a part of the periphery of the laminate suitably selected is irradiated with a laser beam to form a peeling start portion.

According to one aspect of the present invention, the peeling member is provided on the first substrate and the second substrate along the peeling advancing direction from one corner of the laminate on which the peeling initiator is produced to the other corner opposite to the corner, It is preferable to warp at least one of the substrates.

According to one aspect of the present invention, in the case of peeling off from the peeling start portion formed at one corner portion, the peeling of the first peeling portion from the corner portion along the peeling progressing direction toward the other corner portion facing the corner portion on the diagonal line, At least one of the substrate and the second substrate is bent. Thereby, the first substrate and the second substrate are peeled while being relatively spaced along the peeling progress direction.

In an embodiment of the present invention, the first substrate and the second substrate are glass plates, and the adsorption layer is a polyimide layer. In the first and second substrates, a functional layer Forming step, and it is preferable that the step of forming the peeling initiation portion is performed after the functional layer forming step.

According to one aspect of the present invention, in a manufacturing process of an electronic device, a glass plate having higher heat resistance than a resin is used as a first substrate and a second substrate, a polyimide resin having high heat resistance is used as an adsorption layer, A functional layer is formed on the exposed surface of a thin glass plate in the laminate constituted by the above, under high temperature conditions. Thereafter, the respective glass plates are separated by carrying out the peeling initiation part manufacturing step and the peeling step, whereby a glass plate on which the functional layer is formed, that is, an electronic device can be manufactured.

In one form of the present invention, it is preferable that the adsorption layer remains on the surface of the first substrate opposite to the functional layer after the peeling process.

According to one aspect of the present invention, it is possible to suppress the enlargement of micro-scratches such as micro cracks generated on the surface of the first substrate opposite to the functional layer by the adsorption layer.

According to the laminate peeling apparatus, the peeling method and the electronic device manufacturing method of the present invention relating to the peeling of a laminate using laser light, it is possible to suppress the adhesion of soot to the substrate due to the component of the vaporized adsorption layer .

1 is a flowchart showing a manufacturing process of an electronic device.
2 is an enlarged side view of a main part of a laminate provided in a manufacturing process of an electronic device.
3 is a perspective view showing a configuration of the laser light irradiation device.
4 is an enlarged cross-sectional view of a main part of the laminate on which the peeling initiator is produced.
5 is a plan view of the laminate on which the peeling initiator is produced.
6 is a longitudinal sectional view showing the structure of the peeling apparatus of the present embodiment.
Fig. 7 is a plan view of a peeling assembly schematically showing the arrangement positions of a plurality of movable members relative to the peeling assembly. Fig.
Fig. 8A is a plan view of a flexible plate constituting the peeling assembly, and Fig. 8B is a sectional view of a flexible plate according to the CC line in Fig. 8A.
Fig. 9A is a bottom view of a flexible plate constituting a peeling assembly, and Fig. 9B is a sectional view of a flexible plate according to DD line of Fig. 9A.
Fig. 10 (A) is a cross-sectional view showing a correspondence relationship between the flexible plate and the laminate, and Fig. 10 (B) is a cross-sectional view in which the laminate is held by a flexible plate.
11 is a sectional view showing a state in which the peeling assembly is inclined to the peeling start posture.
Figs. 12A to 12D are explanatory views showing the steps of holding a laminate on a peeling assembly, a step of inclining the peeling assembly at an angle of?, And a step of filling a liquid tank with a liquid.
Figs. 13A to 13E are explanatory views showing the steps of bending the lower flexible plate to peel off the support substrate. Fig.
Figs. 14A to 14C are explanatory diagrams showing the step of removing the separated support substrate. Fig.
Figs. 15A to 15C are explanatory diagrams showing the steps of carrying out a peeled substrate.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

Hereinafter, the case where the peeling apparatus and the peeling method of the laminate according to the present invention are used in a manufacturing process of an electronic device will be described.

The electronic device refers to electronic components such as a display panel, a solar cell, a thin film secondary battery, and a liquid crystal lens. As the display panel, an OELD, an LCD, a plasma display panel, an electronic paper, and the like can be exemplified.

[Manufacturing process of electronic device]

1 is a flowchart showing a manufacturing process of an electronic device.

A manufacturing process of an electronic device is a process of forming a functional layer for forming a functional layer (an OLED element, an OLED element, an LCD, a TFT, and a CF) for an electronic device on the surface of a substrate (first substrate) such as glass, resin, (Step S100).

Here, the OLED element is composed of, for example, a composite sheet, a pixel electrode, an organic layer, an opposing electrode, and a sealing plate. The organic layer includes at least a light emitting layer and, if necessary, a hole injecting layer, a hole transporting layer, an electron transporting layer, and an electron injecting layer. For example, the organic layer includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the anode side. A top emission type OLED element is constituted by the pixel electrode, the organic layer, the counter electrode, and the like. The OLED element may be a bottom emission type.

As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method and a sputtering method are used. The functional layer is formed in a predetermined pattern by a photolithography method or an etching method.

Prior to the formation of the functional layer, the substrate is attached to the supporting substrate (second substrate) on its back surface, and is formed in the laminate. Thereafter, the functional layer is formed on the surface (exposed surface) of the substrate in the state of the laminate. Then, after the formation of the functional layer, the supporting substrate is peeled from the substrate.

That is, in the manufacturing process of the electronic device, a functional layer forming step (S100) for forming a functional layer on the surface of the substrate in the state of a laminate, a cap for sealing the functional layer formed on the substrate (2) , And a separating step (S120) of separating the supporting substrate from the substrate on which the functional layer is formed. The separation step (S120) includes a peeling start portion manufacturing step (S130) and a peeling step (S140). In this separation step (S120), the peeling apparatus and the peeling method of the laminate according to the present invention are applied.

[Layered product (1)]

2 is an enlarged side view of a main part showing an example of the layered product 1. As shown in Fig.

In the present embodiment, the rectangular laminated body 1 is illustrated, but the shape is not limited to a rectangular shape, and may be circular or elliptical.

The layered product 1 includes a substrate 2 on which a functional layer is formed and a supporting substrate 3 for reinforcing the substrate 2. The substrate 2 is provided with a resin layer 4 as an adsorption layer on the back surface 2b and the surface 3a of the support substrate 3 is attached to the resin layer 4. [ That is, the support substrate 3 is peeled off from the substrate 2 via the resin layer 4 by the van der Waals force acting between the support layer 3 and the resin layer 4, or by the adhesive force of the resin layer 4 Lt; / RTI >

[Substrate (2)]

In the substrate 2, a functional layer is formed on the surface 2a thereof. As the substrate 2, a glass substrate, a ceramics substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified. Among these substrates, the glass substrate is excellent as a substrate 2 for an electronic device because it has excellent chemical resistance and moisture-permeability, and has a small linear expansion coefficient. Further, as the coefficient of linear expansion becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be shifted at the time of cooling.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glass containing silicon oxide as a main component. As the oxide-based glass, a glass having a silicon oxide content of 40 to 90 mass% in terms of an oxide is preferable.

It is preferable to select glass suitable for the type of electronic device to be manufactured and glass suitable for the production process of the glass substrate. For example, it is preferable to employ a glass (alkali-free glass) that does not substantially contain an alkali metal component in the glass substrate for OELD or LCD.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed for the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, and still more preferably 0.1 mm or less Or less. When the thickness is 0.3 mm or less, good flexibility can be given to the glass substrate. When the thickness is 0.1 mm or less, the glass substrate may be rolled up in a roll shape, but the thickness is preferably 0.03 mm or more from the viewpoint of manufacturing the glass substrate and handling the glass substrate. Since a glass substrate for OELD requires high flexibility, its thickness is preferably 0.2 mm or less and preferably 0.02 mm or more.

[Support substrate (3)]

As the supporting substrate 3, a glass substrate, a ceramics substrate, a resin substrate, a metal substrate, and a semiconductor substrate can be exemplified.

The thickness of the support substrate 3 is set to 0.7 mm or less and is set according to the type, thickness, etc. of the substrate 2 to be reinforced. The thickness of the support substrate 3 may be thicker or thinner than that of the substrate 2, but it is preferable that the thickness of the support substrate 3 is 0.4 mm or more in order to reinforce the substrate 2.

In this example, the support substrate 3 is formed of a single substrate, but the support substrate 3 may be formed of a laminate in which a plurality of substrates are laminated.

[Resin Layer (4)]

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include polyimide resin, acrylic resin, polyolefin resin, polyurethane resin, silicone resin and polyimide silicone resin. Several kinds of resins may be mixed and used. Among them, a polyimide resin and a silicone resin are preferable from the viewpoint of heat resistance and releasability. In the present embodiment, as the resin layer 4, a polyimide resin suitable for OELD is exemplified.

The outer shape of the resin layer 4 is preferably the same as the outer shape of the supporting substrate 3 so that the supporting substrate 3 can support the entire substrate 2. [

In Fig. 2, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all of the layers constituting the resin layer 4 is the thickness of the resin layer 4. In this case, the kinds of resins constituting each layer may be different.

In the present embodiment, an organic film is used as the resin layer 4, but an inorganic film may be used instead of the organic film. The inorganic film includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide and carbonitride.

The average breaking strength of the substrate 2 when the tensile stress is generated on the back surface 2b that joins with the resin layer 4 of the substrate 2 when the resin layer 4 does not exist is 1 GPa . The resin layer 4 limits the back surface 2b that is joined to the resin layer 4 of the substrate 2 to be scratched and the scratches to spread. A method of measuring the average fracture strength will be described later. Here, the integral body of the substrate 2 and the resin layer 4 is referred to as a composite sheet A.

The resin layer 4 has a bonding force enough not to be peeled off from the substrate 2 even when the composite sheet A is bent and deformed along a roll of a wound core or the like. As a result, the resin layer 4 suppresses the spread of minute scratches, such as micro cracks, on the back surface 2b of the substrate 2. The resin layer 4 may be peeled from the substrate 2 during the manufacturing process of the electronic device, and may not be a part of the structure of the electronic device finally. In the present embodiment, the resin layer 4 also becomes a part of the structure of the electronic device.

The resin layer 4 covers at least a part of the back surface 2b of the substrate 2 as long as it covers a portion where the average breaking strength in the substrate 2 is desired to be increased. The resin layer 4 preferably covers the entire back surface 2b of the substrate 2. [ In addition, the resin layer 4 may come out from the back surface 2b of the substrate 2.

The resin layer 4 may be formed by applying a liquid resin composition on the substrate 2 and solidifying it, or may be formed by adhering a resin film to the substrate 2. [ In the latter case, the resin layer 4 may be composed of a resin film and an adhesive layer for bonding the resin film and the glass sheet. In the latter case, the surface of the glass sheet (for example, a silane coupling treatment) and the surface of the resin film (for example, corona treatment) may be bonded without using an adhesive. The change in the thickness of the resin film by the surface treatment is sufficiently small (for example, 10 nm or less) in comparison with the thickness of the resin film before the surface treatment.

The resin layer 4 may be formed of, for example, only a resin. The resin layer 4 may be formed of a material including a resin, and may be formed of, for example, a resin and a filler. Examples of the filler include fibrous fillers such as fibrous, plate, scaly, granular, irregular, and crushed. Specific examples thereof include glass fibers, carbon fibers of PAN type or pitch type, A metal fiber such as an aluminum fiber or a brass fiber, an organic fiber such as an aromatic polyamide fiber, a gypsum fiber, a ceramic fiber, an asbestos fiber, a zirconia fiber, an alumina fiber, a silica fiber, a titanium oxide fiber, a silicon carbide fiber, Calcium carbonate, glass beads, glass flakes, glass microballoons, clay, molybdenum disulphide, wollastonite, titanium oxide, zinc oxide, titanium oxide whiskers, titanium barium titanate whiskers, aluminum borate whiskers, silicon nitride whiskers, mica, talc, kaolin, silica, , Calcium polyphosphate, graphite, metal powder, metal flake, metal ribbon, metal oxide, carbon powder, graphite, Carbon flakes, scaly carbon, carbon nanotubes, and the like. Specific examples of the metal species of the metal powder, the metal flake and the metal ribbon include silver, nickel, copper, zinc, aluminum, stainless steel, iron, brass, chrome and tin. The kind of the glass fiber or the carbon fiber is not particularly limited as long as it is generally used for reinforcing the resin. For example, it can be selected from a cut fiberglass of a long fiber type or a short fiber type, a milled fiber and the like. The resin layer 4 may be composed of a woven fabric impregnated with a resin, a nonwoven fabric, or the like.

The resin of the resin layer 4 may be of various kinds, for example, a thermoplastic resin or a thermosetting resin. As the thermosetting resin, for example, polyimide (PI), epoxy (EP) and the like are used. Examples of the thermoplastic resin include polyamide (PA), polyamideimide (PAI), polyetheretherketone (PEEK), polybenzimidazole (PBI), polyethylene terephthalate (PET), polyethylene naphthalate (PES), cyclic polyolefin (COP), polycarbonate (PC), polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP), acrylic (PMMA), urethane Is used. The resin film may be formed of a photo-curable resin, or may be a copolymer or a mixture. The production process of the electronic device by the roll-to-roll method may include a process accompanied by a heat treatment, and the heat-resistant temperature (continuous usable temperature) of the resin is preferably 100 DEG C or more. Examples of the resin having a heat resistance temperature of 100 deg. C or higher include polyimide (PI), epoxy (EP), polyamide (PA), polyamideimide (PAI), polyetheretherketone (PEEK), polybenzimidazole ), Poly (ethylene terephthalate), polyethylene naphthalate (PEN), polyether sulfone (PES), cyclic polyolefin (COP), polycarbonate (PC), polyvinyl chloride (PU) and the like.

The average thickness of the resin layer 4 is, for example, less than 100 mu m. If the average thickness of the resin layer 4 is less than 100 mu m, the flexibility of the composite sheet A can be sufficiently secured. If the average thickness of the resin layer 4 is less than 100 占 퐉, the warp caused by the difference in thermal expansion coefficient between the resin and the glass can be suppressed. The average thickness of the resin layer 4 is preferably 90 占 퐉 or less, and more preferably 75 占 퐉 or less.

The average thickness of the resin layer 4 is, for example, 0.5 m or more. If the average thickness of the resin layer 4 is 0.5 탆 or more, it is possible to restrict the occurrence of scratches on the substrate 2 due to the presence of the resin layer 4. The average thickness of the resin layer 4 is preferably 1 占 퐉 or more, and more preferably 2 占 퐉 or more.

A portion of the resin layer 4 having a normal direction distance from the interface between the resin layer 4 and the substrate 2 in the range of 0 占 퐉 to 0.5 占 퐉 (hereinafter referred to as " the vicinity of the substrate 2 in the resin layer 4) Quot; portion ") is 100 MPa or more. The portion of the resin layer 4 in the vicinity of the substrate 2 is sufficiently rigid and the occurrence of scratches on the substrate 2 due to the presence of the resin layer 4 can be restricted. The partial Young's modulus in the vicinity of the substrate 2 in the resin layer 4 is preferably 500 MPa or more.

When the portion of the resin layer 4 near the substrate 2 is composed of n (n? 2) layers, the Young's modulus E of the portion of the resin layer 4 in the vicinity of the substrate 2 is Is calculated from the following equation (1).

E = Σ (E _k × I _k ) / I ... (One)

E _k ; Young's modulus of the material of the k-th layer

I _k ; The moment of inertia of the kth layer

k; 1 to n

I; The moment of inertia of the entire portion of the resin layer 4 in the vicinity of the substrate 2

As apparent from the formula (1), when the resin layer 4 is composed of an adhesive layer for bonding the resin film and the resin film to the glass sheet, if the thickness of the adhesive layer is sufficiently thinner than that of the resin film (for example, Or less), and the Young's modulus (E) is 100 MPa or more.

When one layer constituting the resin layer 4 is formed of a single material, the Young's modulus of one layer is measured by a method according to Japanese Industrial Standard JIS K7127: 1999. On the other hand, when one layer constituting the resin layer 4 is formed of an inclined material, the Young's modulus of one layer is measured by a nanoindenter.

The Young's modulus of the remainder of the resin layer 4 (a portion where the distance from the interface between the resin layer 4 and the substrate 2 exceeds 0.5 mu m) is, for example, 100 MPa or more, preferably 300 MPa Or more, more preferably 500 MPa or more.

[Laser light irradiation apparatus (10)]

3 is a perspective view showing a configuration of the laser light irradiation device (laser light irradiation member) 10 used in the peeling start portion manufacturing step (see FIG. 1: S130).

The laser irradiation apparatus 10 includes an output section 12 for outputting laser light and a table 14 provided below the output section 12 and on which the laminate 1 is mounted. The output section 12 is provided so as to be horizontally movable by a driving section (not shown), and is moved by the driving section, whereby laser light can be scanned on the stacked body 1 placed on the table 14. [

AVIA355-28 manufactured by Kohliant Japan Co., Ltd. was used as the emitting portion 12 of the laser beam irradiating device 10. [ The frequency of this output unit 12 was set to 100 kHz and the wavelength to 355 nm laser.

The stacked body 1 is stacked on the table 14 with the supporting substrate 3 facing upward so that the supporting substrate 3 faces the emitting portion 12. [ The laser light emitted from the light output section 12 enters the resin layer 4 through the support substrate 3 and is absorbed by the resin layer 4. [

The size of the layered product 1 is not limited, but the layered product 1 having a size of the sixth generation (1850 mm x 1500 mm) or more is exemplified.

The laser light irradiating apparatus 10 according to the present embodiment irradiates the laser light onto one corner portion 1A of the outer peripheral edge portion of the laminate 1 from the light emitting portion 12, A portion of the resin layer 4 is removed by vaporization to form the peeling start portion 5 on the corner portion 1A. It is preferable that the size of the peeling start portion 5 is an isosceles triangle having a corner portion 1A as a vertex angle in plan view and a pair of equilateral sides having a length of about 20 mm.

The size and shape of the peeling start portion 5 are not limited to the above-described form. For example, the actual size of the product substrate of the OELD and the LCD is the size of the region in which the predetermined amount is contained in the substrate from the outer peripheral edge portion of the substrate . Therefore, the size and shape of the peeling start portion 5, which corresponds to a part of the outer peripheral edge portion of the layered product 1, is preferably a size and a shape that do not enter the area of the product substrate.

4 is a cross-sectional view of the layered product 1 in which the peeling initiation portion 5 is formed in the corner portion 1A, and FIG. 5 is a plan view of the layered product 1 in FIG. 4 and 5, a part of the resin layer 4 corresponding to the corner portion 1A of the layered product 1 is removed by the laser light to form the peeling start portion 5. As shown in Fig.

Further, since the laser light is absorbed by the resin layer 4 and is not transmitted, the laser light does not affect the functional layer formed on the surface of the substrate 2.

[Embodiment of Production Method of Peeling Initiation Part]

The laminate 1 is mounted on the table 14 of the laser irradiation apparatus 10 shown in Fig. 3 with the supporting substrate 3 facing upward, and the laminate 1 is led out toward the corner portion 1A of the laminate 1, Laser light was irradiated from the light-receiving portion 12.

At this time, the energy density was set to 115 mj / cm < ² >, and the spot of the laser beam was overlapped 50% in the X-axis and Y-axis on the plane. As a result, the surface layer of the resin layer 4 at the position corresponding to the corner 1A can be completely removed.

Further, the energy density was set to 183 mj / cm < ² >, and the spot of the laser beam was not overlapped on the X axis and Y axis on the plane. As a result, the surface layer of the resin layer 4 at the position corresponding to the corner 1A can be completely removed.

[Separation device (40)]

7 is a longitudinal sectional view showing the arrangement position of a plurality of movable members 44 with respect to the peeling assembly 42 of the peeling apparatus 40 And is a plan view of the peeling assembly 42 shown schematically. 6 corresponds to a cross-sectional view taken along the line B-B in Fig. 7, and in Fig. 7, the laminate 1 is shown by a solid line. Further, the movable member 44 is arranged in a saw-tooth shape with respect to the peeling assembly 42.

[Peel assembly (42)]

8A is a plan view of the flexible plate 46 constituting the peeling assembly 42 and FIG. 8B is a side view of the flexible plate 46 along the CC line in FIG. 8A Sectional view. 9 (A) is a bottom view of the flexible plate 48 constituting the peeling assembly 42, and Fig. 9 (B) is a bottom view of the flexible plate 48 according to the DD line of Fig. 9 Fig. 10 (A) is a cross-sectional view showing a correspondence relationship between the flexible plates 46 and 48 and the laminate 1, and Fig. 10 (B) Fig. 2 is a cross-sectional view in which the body 1 is held.

[Flexible plate 46]

As shown in Figs. 8 and 10, the flexible plate 46 includes a rectangular main body plate 50 having a larger size than the laminated body 1, and a supporting substrate 3 2). The porous sheet 52 is adhered to the upper surface of the main plate 50. The porous sheet 52 is made of rubber.

The thickness of the porous sheet 52 is preferably 2 mm or less, preferably 1 mm or less, for the purpose of reducing tensile stress generated in the supporting substrate 3 at the time of peeling.

On the upper surface of the main plate 50, a frame member 54 surrounding the laminated body 1 held by the porous sheet 52 is adhered. The frame member 54 is a sponge of independent bubbles having a Shore E hardness of 20 degrees or more and 50 degrees or less, for example, and is a sponge having a shore E hardness of 20 degrees or more and 50 degrees or less from the top surface (substrate 2) (See Fig. 10 (B)).

The porous sheet 52 surrounded by the frame member 54 is provided with a frame-shaped groove 56. The grooves 56 are connected to the vacuum pump 60 shown in Fig. 6 through a plurality of through holes 58 provided in the main plate 50. Fig.

Therefore, when the vacuum pump 60 is driven, the air in the through holes 58 and the grooves 56 is sucked, and the support substrate 3 of the layered product 1 is vacuum-held and held on the porous sheet 52 . Thereby, the support substrate 3 of the layered product 1 is supported on the main plate 50.

As shown in Fig. 8, a corner portion of the porous sheet 52 surrounded by the frame member 54 is provided with a supply hole 62 for liquid (for example, water or organic solvent). The supply hole 62 communicates with the through hole 64 of the main plate 50. The through hole 64 is connected to the liquid delivery pump (liquid supply member) 66 shown in Fig. Therefore, when the liquid delivery pump 66 is driven, liquid is supplied to the liquid tank 68 through the through hole 64 and the supply hole 62. [ The liquid tank 68 is a rectangular parallelepiped shaped space surrounded by a porous sheet 52 as a bottom surface and a frame member 54 as a side wall. It is preferable that the supply hole 62 is disposed at the lowermost part of the liquid tank 68 when the peeling assembly 42 is inclined in the peeling step.

8 and 10, a frame member 70 surrounding the frame member 54 and the flexible plate 48 is bonded to the upper surface of the main body plate 50. As shown in Fig. The frame member 70 is set to be higher than the height of the frame member 54 in order to prevent the liquid from overflowing from the frame member 54 during the peeling process. The frame member 70 is also made of a sponge of a closed cell in the same manner as the frame member 54.

The porous sheet 52 positioned between the frame member 54 and the frame member 70 is provided with a plurality of through holes 71. The body plate (50) is provided with a plurality of drain holes (72) communicating with the through holes (71). That is, the liquid blocked by the frame member 70 is drained to the outside of the stripping apparatus 40 through the through hole 71 and the drain hole 72.

The body plate 50 has higher bending rigidity than the porous sheet 52 and the frame members 54 and 70 and the bending rigidity of the body plate 50 governs the bending rigidity of the flexible plate 46. [ The flexural rigidity per unit width (1 mm) of the flexible plate 46 is preferably 1000 to 40000 N mm ² / mm. For example, in a portion where the width of the flexible plate 46 is 100 mm, the bending rigidity is 100000 to 4000000 mm ² . By setting the flexural rigidity of the flexible plate 46 per unit width to 1000 N · mm ² / mm or more, it is possible to prevent the substrate 2, which is held by the flexible plate 46, from being bent. Further, by making the flexural rigidity of the flexible plate 46 per unit width equal to or less than 40000 N · mm ² / mm, the substrate 2 sucked and held by the flexible plate 46 can be flexibly deformed appropriately. As the body plate 50, resin members such as a polycarbonate resin, a polyvinyl chloride (PVC) resin, an acrylic resin, a polyacetal (POM) resin, and a metal member can be exemplified.

[Flexible plate (48)]

As shown in Figs. 9 and 10, the flexible plate 48 has a rectangular plate 74 having a larger size than the laminate 1 and a size smaller than that of the plate 50, 1 made of rubber and adsorbing and holding the substrate 2 (see Fig. 2). A porous sheet 76 is attached to the lower surface of the main plate 74.

It is preferable that the thickness of the porous sheet 76 is 2 mm or less, preferably 1 mm or less, similarly to the thickness of the porous sheet 52.

The porous sheet 76 is provided with a frame-shaped groove 78. The groove 78 is connected to the vacuum pump 82 shown in FIG. 6 via a plurality of through holes 80 provided in the main plate 74.

Therefore, when the vacuum pump 82 is driven, air in the through holes 80 and the grooves 78 is sucked, and the substrate 2 of the layered product 1 is vacuum-held and held on the porous sheet 76. Thereby, the substrate 2 of the layered product 1 is supported on the main plate 74.

10 (B), the support substrate 3 is held and held on the flexible plate 46, and the substrate 2 is held on the flexible plate 48 by the suction holding Thereby being supported on the peeling assembly 42. Then, the lower surface of the main plate 74 is pressed on the upper surface of the frame member 54. Thereby, the liquid tank 68 shown in FIG. 8 (A) becomes a liquid tank sealed by the upper and lower flexible plates 48, 46 and the frame member 54. Therefore, the side surface of the layered product 1 is filled up by the liquid supplied from the supply hole 62 into the basin 68.

9, the main plate 74 is provided with a through hole 84 through which air in the liquid tank 68 is drained. The through hole 84 is located on the diagonal line with respect to the supply hole 62 shown in Fig. 8 and is disposed at the top of the basin 68 when the exfoliating assembly 42 is inclined. Thereby, the inside of the liquid tank 68 can be filled with the liquid, and when the liquid overflows from the through hole 84 at the time of filling the liquid, or stops the supply of the liquid just before overflow, ) Is filled with liquid.

The structure and functions of the main plate 74 are the same as those of the main plate 50, and thus description thereof is omitted.

Next, returning to Fig. 6, the movable unit 86 of the peeling apparatus 40 will be described.

[Moving device (86)]

The movable device 86 is disposed on the upper and lower sides with the peeling assembly 42 interposed therebetween. Since the pair of movable units 86 and 86 disposed on the upper and lower sides have the same configuration, the movable unit 86 disposed on the lower side of FIG. 6 will be described here, and the movable unit 86 disposed on the upper side And a description thereof will be omitted.

The movable device 86 includes a plurality of movable devices 44 and a plurality of drive devices 88 for moving the movable device 44 up and down for each of the movable devices 44 and a drive device 88 for each of the drive devices 88 And a controller 90 for controlling the apparatus.

The plurality of movable members 44 are fixed to the lower surface of the main plate 50 in a grid shape as shown in Fig. These movable members 44 are fixed to the main plate 50 by fastening members such as bolts, but they may be adhesively fixed instead of bolts. These movable members 44 are independently moved up and down by the drive unit 88 that is controlled by the controller 90. [

That is, the controller 90 can control the driving device 88 to tilt the peeling assembly 42 from the horizontal posture of Fig. 6 to the posture of the peeling start position shown in Fig. The controller 90 is disposed on the side of the corner portion 1B in the peeling progress direction indicated by the arrow A from the movable body 44 located on the corner portion 1A side of the laminate 1 in Fig. The moving body 44 is moved downward. By this operation, the substrate 2 and the supporting substrate 3 of the layered product 1 are relatively separated from the peeling start portion 5 (see Fig. 4) , And peels along the peeling advancing direction toward the corner portion 1B facing the corner portion 1A on the diagonal line. The laminate 1 shown in Figs. 6 and 11 is a laminate 1 on which the peeling start portion 5 is formed by the laser light irradiating device 10 described in Fig.

The drive device 88 is constituted by, for example, a rotary servo motor and a ball screw mechanism. The rotary motion of the servo motor is converted into linear motion by a ball screw mechanism, and is transmitted to the rod 92 of the ball screw mechanism. A movable body 44 is provided at the distal end of the rod 92 via a ball joint 94. As a result, the movable member 44 is tilted in accordance with the bending deformation of the flexible plate 46. Therefore, the flexible plate 46 can be bent and deformed from the corner portion 1A toward the corner portion 1B without exerting an excessive force on the flexible plate 46. [ The drive device 88 is not limited to a rotary servo motor and a ball screw mechanism, but may be a linear servo motor or a fluid pressure cylinder (for example, an air pressure cylinder). The flexural deformation direction of the flexible plate 46 may be diagonal from the corner 1A toward the corner 1B or may be at 45 degrees to the side adjacent to the corner 1A.

It is preferable that the plurality of drive devices 88 are installed via the cushion member 98 in the liftable frame 96. The cushion member 98 elastically deforms so as to follow the flexural deformation of the flexible plate 46. [ Thereby, the rod 92 is tilted with respect to the frame 96.

The controller 90 is configured as a computer including a recording medium such as a CPU, ROM, and RAM. The controller 90 controls the plurality of actuators 88 for each of the actuators 88 by executing the program recorded on the recording medium to the CPU so as to control the elevation movement of the plurality of movable members 44. [

(Method of peeling the substrate 2 and the support substrate 3 by the peeling apparatus 40)

(A) to (D), Figs. 13A to 13E, Figs. 14A to 14C and Figs. 15A to 15C, A peeling method of the layered product 1 in which the peeling start portion 5 is formed on the corner portion 1A by the light irradiation device 10 is shown. In these figures, the peeling method for relatively peeling the substrate 2 and the supporting substrate 3 is shown in a time-wise manner.

12A to 12D show a process of holding the laminate 1 on the peeling assembly 42 and a process of inclining the peeling assembly 42 with an inclination angle of? And a step of filling the liquid tank 68 with the liquid 100 are shown in order.

13A to 13E show a step of bending and deforming the support substrate 3 with respect to the substrate 2 by flexing and deforming the flexible plate 46. As shown in Fig.

14 (A) to 14 (C) show the step of removing the separated support substrate 3.

15A to 15C, the steps of removing the peeled substrate 2 are shown in order.

The carry-over operation of the laminate 1 to the peeling assembly 42 and the removal operation of the peeled support substrate 3 and the substrate 2 are carried out in the same manner as in the case of using the adsorption pad 104 shown in Fig. And is carried out by the transfer device 106. 12 (A) to 15 (C), the illustration of the movable unit 86 is omitted in order to avoid the complexity of the drawing.

[Removal method]

Hereinafter, the peeling method will be described in order.

As shown in Fig. 12 (A), the flexible plates 46 and 48 before the peeling start are positioned in the horizontal direction by the movable device 86, and are positioned above the flexible plate 46 The flexible plate 48 is retracted. In this initial state, the laminate 1 is transported to the upper side of the flexible plate 46 by the transport device 106, and the support substrate 3 of the laminate 1 is sandwiched between the porous sheets of the flexible plate 46 The flexible sheet 48 is lowered and moved by the porous sheet 76 of the flexible plate 48 as shown in Figure 12 (B) Thereby holding and holding the substrate 2. Thereby, the layered product 1 is placed in the basin 68.

Then, as shown in Fig. 12C, the peeling assembly 42 is inclined at an angle of &thetas; with respect to the horizontal direction. 8A) is positioned at the lowermost portion of the basin 68 and the through hole 84 is formed in the uppermost portion of the basin 68 as shown in Fig. (Fig. 9 (A)). Thereby, the laminate 1 in the liquid bath 68 is positioned at the highest position of the corner portion 1A in Fig. 7, and the corner portion 1B is located at the lowest position.

The inclination angle? Of the peeling assembly 42 is set so that the liquid 100 is moved by the action of gravity toward the peeling wire generated at the time of peeling, and when the flexible plates 46, The radius of curvature of the gender plates 46 and 48, and the like. In this embodiment, the curvature radius of the flexible plates 46 and 48 is set to 1000 mm, and the inclination angle [theta] of the peeling assembly 42 is set to 1 to 4 degrees (preferably 2 degrees).

12 (D), the liquid 100 is supplied from the supply hole 62 to the liquid tank 68 by the liquid supply pump 66 (see FIG. 6) as shown by the arrow. As a result, all the side surfaces of the layered product 1 are filled with the liquid 100, and the liquid 100 is also supplied to the peeling initiation portion 5 (liquid supply step).

Subsequently, as shown in Figs. 13A to 13D, the flexible plate 46 is bent downward to start the separation of the support substrate 3. The bending direction of the flexible plate 46 is the direction of arrow A from the corner portion 46A of the flexible plate 46 toward the corner portion 46B in Fig. Thereby, the supporting substrate 3 is peeled off from the corner 1A toward the corner 1B while being flexed and deformed.

At this time, the layered product 1 is peeled off from the peeling start portion 5 (see Fig. 5) as a starting point. That is, in the plurality of movable members 44 of the lower flexible plate 46 shown in Fig. 11, the movable member 44 located on the corner portion 46A side of the flexible plate 46, And moves the movable member 44 located on the side of the movable member 46B in descending order. As a result, the support substrate 3 is bent downward, so that the substrate 2 and the support substrate 3 are peeled from the corner 1A toward the corner 1B (stripping step). Then, as shown in FIG. 13E, the support substrate 3 is completely peeled off from the substrate 2.

The liquid 100 overflowing from the frame member 54 is clogged by the frame member 70 and drained to the outside of the peeling assembly 42 from the drain hole 72 during the peeling of the supporting substrate 3. Thereby, when the use environment of the peeling apparatus 40 is not soiled with the liquid 100, and the liquid 100 drained from the drain hole 72 is recovered, the liquid 100 can be reused.

In the peeling step shown in Figs. 13A to 13D, since the side surface of the inclined laminate 1 is filled with the liquid 100, when the peeling is started from this state, The clearance between the substrate 2 and the resin layer 4 or the clearance between the support substrate 3 and the resin layer 4 is immediately introduced and the peeled release face image is moved downward by gravity, Immediately soak the release surface exposed by peeling immediately. The liquid 100 is introduced by gravity and a new space is formed as the peeling progresses. The space is surrounded by the substrate and the liquid 100, and the liquid 100 is pressed at atmospheric pressure, so that the release surface is immediately wetted by the liquid 100. When the peeling is started from this state, since the water surface of the liquid 100 around the layered body 1 is higher than the peeling surface, the peeling surface immediately flows into the peeling peeling surface by gravity, Immediately soaked.

That is, the peeling apparatus 40 is configured such that the side surface of the layered product 1 is filled with the liquid 100 by tilting the layered product 1, Can be continuously supplied from the side surface of the substrate 1 to the peeling surface immediately after peeling and spread widely.

The peeled support substrate 3 is vacuum-held and held on the porous sheet 52 of the flexible plate 46 and the substrate 2 is peeled off from the porous sheet 52. In the state of peeling the support substrate 3 shown in Fig. Is vacuum-held on the porous sheet (76) of the flexible plate (48). In addition, the flexible plate 46 is released from flexural deformation.

14 (A), the flexible plates 46 and 48 are returned to their positions in the horizontal direction. Thereafter, as shown in Fig. 14 (B), the flexible plate 48 So that the flexible plate 46 is retracted upward.

Subsequently, after the support substrate 3 is released from the holding and holding of the support substrate 3, the support substrate 3 is adsorbed by the adsorption pad 104 of the transport apparatus 106, and the support substrate 3 is transported by the transport apparatus 106 And is taken out from the peeling assembly 42 (Fig. 14 (C)).

Finally, as shown in Fig. 15A, the substrate 2 is sucked and held by the adsorption pad 104 of the transfer device 106, and then the substrate 2 is held by the flexible plate 48, The substrate 2 is taken out of the peeling assembly 42 by the transfer device 106 (Fig. 15 (B), (C)).

By the operation of the peeling apparatus 40 described above, the substrate 2 and the supporting substrate 3 can be separated smoothly.

[Operation and effect of the present embodiment]

A laser beam is irradiated to a part of the outer periphery of the laminate 1 from the exit portion 12 of the laser light irradiating apparatus 10 shown in Fig. 3 in the peeling start portion manufacturing step (S130) A portion of the resin layer 4 is removed by vaporization to form the peeling start portion 5 on a part of the outer peripheral edge portion.

Subsequently, in the peeling step (S140) in Fig. 1, the liquid 100 is supplied to the peeling initiation part 5 from the feeding pump 66 in Fig. 6, and the liquid 100 is supplied between the substrate 2 and the resin layer 4 The substrate 2 and the supporting substrate 3 are peeled off from the peeling start portion 5 while the liquid 100 is supplied to the gap between the supporting substrate 3 and the resin layer 4 (40).

That is, according to the present embodiment, the peeling range using the laser light is a part of the outer peripheral edge of the laminate 1, and the peeling range is set as the peeling start section 5, and the peeling start section 5 While the liquid 100 is being supplied, the substrate 2 and the supporting substrate 3 are separated from each other while relatively separating. The liquid 100 is supplied to the clearance between the substrate 2 and the resin layer 4 that is gradually peeled off or the gap between the support substrate 3 and the resin layer 4, So that the peeling operation is smoothly performed.

Even if the resin layer 4 remains on the support substrate 3 after the peeling is completed, it is not necessary to remove the resin layer 4 and the support substrate 3 can be used as it is for the support substrate 3 with the resin layer 4 (3). When the resin layer 4 remains on the substrate 2 as a product substrate, the resin layer 4 is removed by cleaning.

As described above, according to the present embodiment, regarding the peeling of the layered product 1 using laser light, since the peeling range using laser light is only a part of the outer peripheral edge of the layered product 1, Adhesion of soot to the substrate 2 and the support substrate 3 due to the components of the ground layer 4 can be suppressed.

The laser outputting section 12 irradiates a part of the resin layer 4 with the laser light through the support substrate 3 having a thicker thickness in the substrate 2 or the support substrate 3.

When the laser beam is irradiated to the resin layer 4 through the thin substrate 2, the surface layer of the resin layer 4 irradiated with the laser beam is vaporized and the gas is vaporized from the resin layer 4 and the substrate 2 ) In some cases. In this case, the substrate 2 may be damaged by the pressure of the trapped gas. Therefore, in the present embodiment, the laser beam is irradiated to the resin layer 4 through the support substrate 3 having a thickness larger than that of the substrate 2, that is, the support substrate 3 having higher strength than the substrate 2 . This can prevent breakage of the thin substrate 2 caused by vaporization of the resin layer 4.

The laser beam irradiating apparatus 10 irradiates laser beam to one corner portion 1A of the outer peripheral portion of the laminated body 1 formed in a rectangular shape to prepare a peeling start portion in the corner portion 1A.

In the case of the laminated body 1 configured in a rectangular shape, laser light is irradiated to only one corner portion 1A of the outer peripheral edge to form the peeling start portion 5 in the corner portion 1A. When the layered product 1 is other than a rectangular shape, a portion of the outer peripheral portion of the layered product 1 suitably selected is irradiated with a laser beam to form the peeling start portion 5. [

Along the peeling advancing direction from one corner portion 1A of the laminate 1 on which the peeling start portion 5 is formed to the other corner portion 1B facing the corner portion 1A on the diagonal line, The substrate 2 and the supporting substrate 3 are peeled off by the peeling apparatus 40 by bending at least one of the substrates of the supporting substrate 2 and the supporting substrate 3. [

Thereby, the substrate and the support substrate 3 can be smoothly peeled off while being relatively spaced along the peeling progress direction.

A functional layer for forming a functional layer on the exposed surface of the substrate 2 made of a thin glass is formed by using a glass plate as the substrate 2 and the supporting substrate 3 and applying a polyimide resin as the resin layer 4, (S100). After the functional layer forming step (S100), the separating step (S120) is performed.

A glass plate having a heat resistance higher than that of the resin is used as the substrate 2 and the support substrate 3 in the manufacturing process of the electronic device and a polyimide resin having high heat resistance is used as the resin layer 4, The functional layer is formed on the exposed surface of the thin substrate 2 under high temperature conditions. Thereafter, each of the glass plates is separated by passing through the peeling initiation part production step (S130) and the peeling step (S140), whereby a glass plate on which the functional layer is formed, that is, an electronic device can be manufactured.

The resin layer 4 may be left on the substrate 2 or the supporting substrate 3 after the substrate 2 and the supporting substrate 3 are separated from each other. The strength and impact resistance of the substrate 2 can be increased when the resin layer 4 is left on the substrate 2 (particularly when polyimide is used as the resin layer 4).

In this embodiment, since the resin layer 4 remains on the back surface 2b of the substrate 2 after the peeling step, the small scratches such as micro cracks generated on the back surface 2b are enlarged, . ≪ / RTI >

The present application is based on Japanese Patent Application No. 2015-163372 filed on August 21, 2015, the contents of which are incorporated herein by reference.

1:
2: substrate
2a: surface of the substrate
2b: the rear surface of the substrate
3: Support substrate
3a: surface of supporting substrate
4: Resin layer
5: peeling initiation portion
10: laser light irradiation device
12:
14: Table
40: peeling device
42: peeling assembly
44: movable body
46: flexible version
48: flexible version
50: Body plate
52: Porous sheet
54: frame member
56: Home
58: Through hole
60: Vacuum pump
62: Feed hole
64: Through hole
66: liquid pump
68:
70: frame member
72: drainage
74: Body plate
76: Porous sheet
78: Home
80: Through hole
82: Vacuum pump
84: Through hole
86: Movable device
88: Driving device
90: Controller
92: Load
94: ball joint
96: frame
98: Cushion member
100: liquid
104: adsorption pad
106:
A: composite sheet

Claims (10)

A peeling apparatus for a laminate body in which a first substrate and a second substrate are detachably attached via an adsorption layer,
A laser beam irradiating member for irradiating a part of the outer periphery of the laminate with laser light to vaporize a part of the adsorbed layer to remove the vapor of the adsorbed layer to form a peeling start portion on a part of the outer periphery,
A liquid supply member for supplying a liquid to the peeling initiation portion and supplying the liquid to a gap between the first substrate and the adsorption layer or a gap between the second substrate and the adsorption layer;
And a peeling member for relatively peeling off the first substrate and the second substrate from each other with the peeling start portion as a starting point. A method for peeling a laminated body in which a first substrate and a second substrate are detachably attached via an adsorption layer,
A peeling initiation part manufacturing step of irradiating a part of the outer peripheral edge of the laminate with laser light to remove a part of the adsorption layer by vaporizing to form a peeling start part on a part of the outer peripheral edge;
The liquid is supplied to the peeling initiation portion and the liquid is supplied to the gap between the first substrate and the adsorption layer or the gap between the second substrate and the adsorption layer, And a peeling step of peeling off the first substrate and the second substrate by relatively separating the first substrate and the second substrate. 3. The method of claim 2,
The thickness of the first substrate and the thickness of the second substrate are different from each other,
Wherein the laser light is irradiated to a part of the adsorption layer through a thick substrate of the first substrate or the second substrate. The method according to claim 2 or 3,
And the laser light is irradiated to one corner portion of the outer periphery of the laminate formed in a rectangular shape to form the peeling start portion in the corner portion. 5. The method of claim 4,
The peeling step may be performed such that at least one of the first substrate and the second substrate is peeled from the corner portion of the laminate on which the peeling start portion has been formed to the peeling progressing direction toward the other corner portion facing the corner portion on the diagonal line, And the substrate of the laminated body is warped. 6. The method according to any one of claims 2 to 5,
Wherein the first substrate and the second substrate are glass plates, the adsorption layer is a polyimide layer,
And a functional layer forming step of forming a functional layer on an exposed surface of a thin glass plate among the first substrate and the second substrate,
After the functional layer forming step, the peeling starting portion producing step is carried out. The method according to claim 6,
Wherein the functional layer forming step includes a step of forming an organic light emitting diode element. A functional layer forming step of forming a functional layer on an exposed surface of the first substrate and a second functional layer forming step of forming a functional layer on the exposed surface of the first substrate, 1. A method of manufacturing an electronic device having a separation step of separating the second substrate from a substrate,
In the separation step,
A peeling initiation part manufacturing step of irradiating a part of the outer peripheral edge of the laminate with laser light to remove a part of the adsorption layer by vaporizing to form a peeling start part on a part of the outer peripheral edge;
The liquid is supplied to the peeling initiation portion and the liquid is supplied to the gap between the first substrate and the adsorption layer or the gap between the second substrate and the adsorption layer, And a peeling step of peeling off the first substrate and the second substrate by relatively separating the first substrate and the second substrate. 9. The method of claim 8,
Wherein the functional layer forming step includes a step of forming an organic light emitting diode element. 10. The method according to claim 8 or 9,
Wherein the adsorption layer remains on a surface of the first substrate opposite to the functional layer after the peeling process.

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