KR20160039192A - Electronic device manufacturing method - Google Patents

Abstract

The present invention relates to a method for manufacturing an electronic device having a silicon resin layer with a silicone resin layer and a silicone resin layer as an interfacial surface between the silicon resin layer and the glass substrate, A method for manufacturing an electronic device, comprising the steps of: separating a supporting substrate and an electronic device to obtain the electronic device, wherein an organic solvent having a solubility parameter of more than 10 is applied to a peeling line, which is a boundary line between the silicon resin layer and the glass substrate, Or a mixed solution of the organic solvent and water, thereby separating the electronic device from the supporting substrate with the silicon resin layer.

Description

[0001] ELECTRONIC DEVICE MANUFACTURING METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic device, and more particularly, to a method of manufacturing an electronic device having a separating step of separating (separating) a predetermined organic solvent from a stripping line between a silicon resin layer and a glass substrate .

2. Description of the Related Art In recent years, thinner and lighter devices (electronic devices) such as a solar cell (PV), a liquid crystal panel (LCD), and an organic EL panel (OLED) have been made thinner. If the strength of the glass substrate is insufficient due to the thinning, the handling property of the glass substrate in the manufacturing process of the device is deteriorated.

Therefore, conventionally, a method of forming a device member (for example, a thin film transistor) on a glass substrate that is thicker than the final thickness and then thinning the glass substrate by chemical etching treatment is widely adopted.

However, in this method, for example, when the thickness of one glass substrate is reduced to 0.7 mm to 0.2 mm or 0.1 mm, most of the original glass substrate material is shaved by the etchant, so productivity and efficiency of use of raw materials It is not preferable from the viewpoint that it is. Further, in the method of thinning a glass substrate by the chemical etching, when fine scratches are present on the surface of the glass substrate, fine recesses (etch pits) are formed starting from the scratches by the etching treatment to become optical defects There was a case.

Recently, a glass laminate in which a thin plate glass substrate and a reinforcing plate are laminated is prepared in order to cope with the above-mentioned problem, and a member for an electronic device such as a display device is formed on a thin plate glass substrate of the glass laminate. A method of separating the support plate has been proposed (see, for example, Patent Document 1). The reinforcing plate has a support plate and a silicone resin layer fixed on the support plate, and the silicon resin layer and the thin plate glass substrate are brought into close contact with each other in a peelable manner. The reinforcing plate separated from the thin plate glass substrate by peeling the interface between the silicon resin layer of the glass laminate and the thin plate glass substrate is laminated with a new thin plate glass substrate and can be reused as a glass laminate.

International Publication No. 2007/018028

In recent years, along with the enhancement and complexity of the electronic device member formed on the glass substrate of the glass laminate, the temperature for forming the electronic device member becomes higher and the time for exposure to the high temperature is also long There are a few cases that need it.

The glass laminate described in Patent Document 1 does not cause any problems particularly in the atmosphere at 300 ° C for 1 hour. However, according to the study by the present inventors, when the glass laminate is subjected to the treatment at 350 占 폚 for 1 hour with reference to Patent Document 1, when the glass substrate is peeled from the surface of the silicone resin layer, A part of the resin layer of the resin layer remains on the glass substrate without being peeled off or the result is that the electronic device is not easily separated after the formation of the electronic device member and the productivity of the electronic device is lowered .

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing an electronic device in which a silicon resin layer and a glass substrate are easily peeled off even after a high temperature heat treatment condition.

The inventor of the present invention has studied the problems of the prior art and found that peeling easily proceeds by supplying an organic solvent having a predetermined property to a peeling line which is a boundary line between the silicon resin layer and the glass substrate. .

That is, in order to achieve the above-described object, a first aspect of the present invention is a method for manufacturing an electronic device, comprising the steps of: forming a silicone resin layer, a glass substrate, Separating the electronic device including the glass substrate and the member for the electronic device from the supporting base material with the silicon resin layer including the supporting base material and the silicone resin layer as an interfacial surface of the glass substrate, Wherein an organic solvent having a solubility parameter of more than 10 or a mixed solution of the organic solvent and water is supplied to a peeling line which is a boundary line between a silicon resin layer and a peeling interface of the glass substrate, The production of an electronic device for separating the electronic device from the supporting substrate with the silicon resin layer It is the law.

In the first aspect, it is preferable that the organic solvent includes an alcohol-based solvent or an aprotic polar solvent in which the organic solvent may have a halogen atom.

In the first aspect, the organic solvent is selected from the group consisting of an alcohol solvent having 1 to 6 carbon atoms, dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), dimethylsulfoxide (DMSO) NMP), sulfolane, and acetonitrile.

In the first aspect, it is preferable that the silicone resin in the silicone resin layer is a reactive cured product of an organoalkenyl polysiloxane and an organohydrogenpolysiloxane.

Further, the silicone resin is a cured product of addition reaction type silicone, and the addition reaction type silicone is a curable silicone resin composition comprising the following (a) and (b), and the silicone resin layer is the curable silicone resin composition (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (b) a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms and having at least three hydrogen atoms bonded to silicon atoms, A linear organopolysiloxane which is a linear organopolysiloxane and in which at least one hydrogen atom bonded to a silicon atom is present at the silicon atom at the molecular end.

According to the present invention, it is possible to provide an electronic device manufacturing method in which peeling of a silicon resin layer and a glass substrate easily proceeds even after a high-temperature heat treatment condition.

1 (A) to 1 (C) are schematic cross-sectional views sequentially showing the steps of a separation step of the method for manufacturing an electronic device of the present invention.
2 (A) and 2 (B) are a perspective sectional view and a top view, respectively, of the state of FIG. 1 (B).
3 (A) and 3 (B) are schematic cross-sectional views showing a configuration example of an electronic device.
4A to 4C are schematic cross-sectional views sequentially showing the procedure of each step of the method for manufacturing a laminated body for an electronic device.
5 is a schematic view of a peeling strength measuring apparatus.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications and substitutions may be made without departing from the scope of the present invention. .

The method for producing an electronic device of the present invention is characterized in that an organic solvent exhibiting a predetermined solubility parameter (SP value) or a mixed solution of the organic solvent and water is applied to a peeling line, which is a boundary line between the silicon resin layer and the glass substrate, We can supply the point that we supply. By supplying the organic solvent or mixed solution, the organic solvent invades the surface layer of the glass substrate side of the silicon resin layer to lower the interfacial adhesion between the silicon resin layer and the glass substrate, so that the silicon resin layer and the glass substrate are more easily peeled off .

A method of manufacturing an electronic device of the present invention is a method of manufacturing an electronic device by removing the interface between a silicon resin layer and a glass substrate from a laminated body for an electronic device having a supporting substrate, a silicone resin layer, a glass substrate and a member for an electronic device in this order (Separation step) of obtaining an electronic device by separating an electronic device including a glass substrate and an electronic device member from a supporting base material with a silicon resin layer containing a supporting substrate and a silicone resin layer.

1 (A) to 1 (C) are schematic cross-sectional views sequentially showing the steps of a separation step of the method for manufacturing an electronic device of the present invention. Hereinafter, the procedure of the separation step will be described in detail with reference to Figs. 1 (A) to 1 (C).

First, a laminated body for an electronic device including a supporting substrate, a silicon resin layer disposed on the supporting substrate, a glass substrate disposed on the silicon resin layer, and an electronic device member disposed on the glass substrate is prepared do. 1 (A) is a schematic cross-sectional view of an example of a laminated body for an electronic device according to the present invention.

1 (A), the laminated body 10 with an electronic device member includes a supporting substrate 12, a silicon resin layer 14, a glass substrate 16, and an electronic device member 18 In this order. The silicon resin layer 14 has one side fixed to the layer of the supporting substrate 12 and the other side contacting the first main surface of the glass substrate 16 and the silicon resin layer 14 It is preferable that the interface of the glass substrate 16 is in close contact with the substrate.

The two-layer portion including the layer of the supporting substrate 12 and the silicon resin layer 14 reinforces the glass substrate 16 in a member forming process to be described later for manufacturing a member for an electronic device such as a liquid crystal panel. The two-layer portion including the layer of the supporting substrate 12 and the silicone resin layer 14 is also referred to as the silicon resin layer-supported substrate 20.

Further, the two-layer portion including the glass substrate 16 and the member 18 for an electronic device is also referred to as an electronic device 22.

The individual members constituting the laminated body for electronic devices and their manufacturing procedures will be collectively described later.

First, a description will be given of a procedure for separating the electronic device from the supporting substrate with the silicon resin layer from the laminated body for electronic devices, with the interface between the silicon resin layer and the glass substrate being peeled off.

First, when separating the electronic device from the supporting base material with the silicone resin layer from the laminated body for electronic devices, it is preferable to provide a peeling mechanism at the interface between the silicon resin layer and the glass substrate. For example, a sharp blade shape is inserted into the interface between the glass substrate 16 and the silicon resin layer 14 in FIG. 1A to provide a peeling mechanism.

Subsequently, as shown in Fig. 1 (B), the electronic device 22 is separated from the silicon resin layer-supported substrate 20. At this time, an organic solvent having a solubility parameter of more than 10 or a mixed solution of the organic solvent and water (collectively referred to as the solution (24)) is applied to the peeling line, which is a boundary line between the silicon resin layer (14) and the glass substrate (16) .

2 (A) and 2 (B) are a perspective sectional view and a top view of the state of FIG. 1 (B), in which the peeling line X (peeling boundary line) is displayed. The peeling line X is a line indicating a boundary between a portion where the silicon resin layer 14 and the glass substrate 16 are not peeled off and a portion where the silicon resin layer 14 and the glass substrate 16 are peeled off. 2 (A) and 2 (B), when the one end side of the electronic device 22 is peeled while being lifted, the peeling line X extends from one end side of the electronic device to the other end side To the left side).

As the organic solvent to be supplied to the peeling line, an organic solvent having a solubility parameter (SP value: cal / cm ³ ) of more than 10 is used. Among them, the solubility parameter of the organic solvent is preferably 11 or more in that the delamination between the silicon resin layer and the glass substrate proceeds more satisfactorily. The upper limit is not particularly limited, but is usually preferably 23 or less from the viewpoint of wettability.

The organic solvent may be used alone or in combination of two or more.

Further, the solubility parameter by (δ) is, when said ΔH of evaporation heat per one mole of the organic solvent (cal / mol), the molar volume V (cm ³ and mol), δ = (ΔH / V) 1/2 It is a defined value.

The contact angle of the organic solvent with respect to the silicone resin layer to be described later is not particularly limited, but it is preferably 90 DEG or less in that the delamination between the silicone resin layer and the glass substrate proceeds more satisfactorily.

The contact angle was measured by using PCA-1 manufactured by Kyowa Chemical Co., Ltd., dropping the amount of the droplet to 1 μl, and dropping 5 drops per sample surface at 23 ° C, The contact angle was measured. The average value of the contact angles of the three points excluding the maximum value and the minimum value of the minimum value among the five contact angles is obtained as the contact angle.

A mixed solution of an organic solvent and water having a solubility parameter of more than 10 may also be used as a solution to be supplied to the peeling line. The definition of the organic solvent is as described above.

The content of the organic solvent in the mixed solution is not particularly limited, but is preferably 10% by mass or more, more preferably 20% by mass or more based on the total amount of the mixed solution from the viewpoint that the delamination between the silicon resin layer and the glass substrate proceeds more satisfactorily desirable. The upper limit is not particularly limited.

Examples of the suitable form of the organic solvent include an alcohol solvent or aprotic polar solvent which may have a halogen atom satisfying the above solubility parameter in that the release of the silicone resin layer and the glass substrate proceeds more satisfactorily.

The alcohol-based solvent is preferably an alcohol-based solvent having 1 to 6 carbon atoms, and more preferably an alcohol-based solvent having 1 to 3 carbon atoms since the separation of the silicone resin layer and the glass substrate proceeds more satisfactorily. Specific examples include ethanol, propanol, butanol, pentanol, hexanol and the like. The alcoholic solvent may be any of linear, branched and cyclic.

The alcohol-based solvent may contain a halogen atom. That is, it may be an alcohol solvent in which a hydrogen atom is substituted with a halogen atom. Examples of the halogen atom include a fluorine atom, a bromine atom, and an iodine atom.

Examples of the aprotic polar solvent include dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), dimethylsulfoxide (DMSO), N-methylpyrrolidone (NMP), sulfolane or acetonitrile have.

The method of supplying the organic solvent or the mixed solution is not particularly limited and a method of supplying the organic solvent or the mixed solution directly to the peeling line using a syringe or the like or a method of spraying the organic solvent or mixed solution onto the peeling line by spraying .

When the organic solvent or mixed solution is once supplied to the peeling line, when the peeling line moves along with the peeling of the silicon resin layer and the glass substrate, the organic solvent or the mixed solution also moves along the peeling line by capillary action, The peeling of the silicon resin layer and the glass substrate tends to proceed continuously. In addition, the organic solvent or the mixed solution may be continuously supplied to the peeling line during peeling.

The amount of the organic solvent or mixed solution to be supplied is not particularly limited, but an amount sufficient to cover the peeling line may be supplied.

A method of separating the electronic device 22 from the silicon resin layer-supported substrate 20 is not particularly limited, and a known method can be used.

For example, the supporting substrate 12 of the laminated body 10 for electronic devices is provided on the base plate so that the upper side and the side of the electronic device member 18 become the lower side, and the side of the electronic device member 18 In this state, the blade is first penetrated into the interface between the silicon resin layer 14 and the glass substrate 16. Thereafter, the support substrate 12 side is adsorbed by a plurality of vacuum adsorption pads, and the vacuum adsorption pads are raised in order from the vicinity of the point where the blade is inserted.

By performing the above process, the laminated body 10 with the electronic device member can be separated into the electronic device 22 and the supporting base material 20 with the silicone resin layer as shown in Fig. 1 (C).

The new glass substrate 16 and the electronic device member 18 are laminated on the supporting substrate 20 with the silicone resin layer and can be reused as the glass laminate 10 having the electronic device member.

The electronic device 22 (a laminate including the glass substrate 16 and the member 18 for an electronic device) manufactured by the above method may be a panel for a display device having a glass substrate and a display device member, A solar cell having a solar cell member, a thin film secondary cell having a glass substrate and a member for a thin film secondary battery, an electronic part having a glass substrate and a member for an electronic device, and the like. The display panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.

As a more specific example of the electronic device, a liquid crystal panel as shown in Fig. 3 (A) can be obtained when the TFT-LCD described in the member forming step described later is manufactured. A liquid crystal panel 80 shown in Fig. 3A is composed of a TFT substrate 82, a CF substrate 84, a liquid crystal layer 86, and the like. The TFT substrate 82 is formed by patterning a TFT element (thin film transistor) 83 or the like on a glass substrate 16. The CF substrate 84 is formed by patterning a color filter element 85 on a glass substrate 16. The TFT substrate 82 and the CF substrate 84 also correspond to the above electronic device.

Another specific example of the electronic device is the electronic paper shown in Fig. 3 (B). 3B, the electronic paper 90 includes a layer 94 including, for example, a glass substrate 16, a TFT layer 92, an electrical engineering medium (for example, a microcapsule) (96) and a front face plate (98). The electronic paper element 91 is constituted by the TFT layer 92, the layer 94 of the electro-optic medium and the transparent electrode 96 and the like. The electronic paper element may be any of microcapsule type, infoline type, twist ball type, particle type, electron class type, and polymer network type.

A description of each configuration (supporting substrate 12, silicon resin layer 14, glass substrate 16, electronic device member 18) of the laminated body 10 with electronic devices for use in the above description, and A method of manufacturing the member-laminated body 10 for an electronic device will be described.

The interface between the supporting substrate 12 and the silicone resin layer 14 has a peeling strength x and is exerted on the interface between the supporting substrate 12 and the silicone resin layer 14 in the peeling direction The interface between the supporting substrate 12 and the silicone resin layer 14 is peeled off. The interface between the silicon resin layer 14 and the glass substrate 16 has a peel strength y and a stress in the peeling direction exceeding the peel strength y is exerted on the interface between the silicon resin layer 14 and the glass substrate 16 The interface between the silicon resin layer 14 and the glass substrate 16 is peeled off.

In the laminated body 10 for an electronic device, generally, the peeling strength (x) is preferably higher than the peeling strength (y). When the stress in the direction in which the supporting substrate 12 and the glass substrate 16 are peeled off is applied to the laminated body 10 having the electronic device for the electronic device in the above-described manner, the glass laminate 10 Is peeled at the interface between the silicon resin layer 14 and the glass substrate 16 and is more easily separated by the electronic device 22 and the supporting substrate 20 with the silicon resin layer.

The peel strength (x) is preferably sufficiently high as compared with the peel strength (y). Raising the peel strength x means that the adhesion of the silicon resin layer 14 to the support substrate 12 can be increased and a relatively high adhesion force to the glass substrate 16 can be maintained after the heat treatment do.

In order to increase the adhesion of the silicone resin layer 14 to the supporting substrate 12, it is preferable to form the silicone resin layer 14 by, for example, crosslinking and curing the crosslinkable organopolysiloxane on the supporting substrate 12. The silicone resin layer 14 bonded to the supporting substrate 12 with high bonding force can be formed by the adhesive force at the time of crosslinking curing.

On the other hand, it is usual that the bonding force of the cured product of the crosslinkable organopolysiloxane to the glass substrate 16 after the crosslinking curing is lower than the bonding force generated at the time of crosslinking curing. Therefore, it is preferable that the silicone resin layer 14 is formed by crosslinking and curing the crosslinkable organopolysiloxane on the supporting substrate 12, and then the glass substrate 16 is laminated on the surface of the silicone resin layer 14.

[Supporting substrate]

The support substrate 12 supports the glass substrate 16 and reinforces the glass substrate 16 so that the glass substrate 16 is deformed during the manufacturing process of the electronic device member in the member forming process , Scratches, breakage, and the like.

As the supporting substrate 12, for example, a metal plate such as a glass plate, a plastic plate, an SUS plate, or the like is used. The supporting substrate 12 is preferably formed of a material having a small difference in coefficient of linear expansion from the glass substrate 16 and is formed of the same material as that of the glass substrate 16 And the supporting substrate 12 is preferably a glass plate. In particular, the supporting substrate 12 is preferably a glass plate containing the same glass material as the glass substrate 16.

The thickness of the supporting substrate 12 may be thicker or thinner than that of the glass substrate 16. Preferably, the thickness of the supporting substrate 12 is selected based on the thickness of the glass substrate 16 and the thickness of the silicon resin layer 14. For example, if the current member forming process is designed to process a substrate with a thickness of 0.5 mm and the sum of the thickness of the glass substrate 16 and the thickness of the silicon resin layer 14 is 0.1 mm, Is set to 0.4 mm. The thickness of the supporting substrate 12 is preferably 0.2 to 5.0 mm in general.

When the supporting substrate 12 is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for ease of handling and difficulty in breaking. The thickness of the glass plate is preferably not more than 1.0 mm from the reason that it is desired that the rigidity to bend properly without breaking after peeling off after formation of the electronic device member is desired.

The difference in average coefficient of linear expansion between the support substrate 12 and the glass substrate 16 at 25 to 300 ° C is preferably 500 × 10 ^-7 / ° C or less, more preferably 300 × 10 ^-7 / ° C or less , More preferably 200 x 10 < ^-7 > / DEG C or less. If the car is excessively large, there is a possibility that the supporting substrate 12 and the glass substrate 16 are peeled off during the heating and cooling in the member forming process to be described later. When the material of the supporting substrate 12 is the same as the material of the glass substrate 16, occurrence of such a problem can be suppressed.

[Silicone resin layer]

The silicon resin layer 14 prevents the positional deviation of the glass substrate 16 until the operation of separating the electronic device 22 from the silicon substrate layer 20 and the electronic device 22 is performed, Etc. are prevented from being broken by the separating operation. The surface 14a of the silicon resin layer 14 which is in contact with the glass substrate 16 is brought into close contact with the first main surface 16a of the glass substrate 16 in a peelable manner. The peeling strength y of the interface between the silicon resin layer 14 and the supporting substrate 12 is set so that the peeling strength y of the interface between the silicon resin layer 14 and the supporting substrate 12 Is preferably lower than the peel strength (x) of the interface.

That is, when separating the glass substrate 16 and the supporting substrate 12, the glass substrate 16 is peeled from the interface between the first main surface 16a of the glass substrate 16 and the silicone resin layer 14, It is preferable that it is difficult to peel off from the interface of the resin layer 14. In this embodiment, the silicone resin layer 14 is in close contact with the first main surface 16a of the glass substrate 16, but has a surface characteristic capable of easily peeling off the glass substrate 16. That is, the silicon resin layer 14 is bonded to the first main surface 16a of the glass substrate 16 with a certain degree of bonding force to prevent displacement of the glass substrate 16, 16 are peeled off, the glass substrate 16 is bonded to the glass substrate 16 with a bonding force so that the glass substrate 16 can be easily peeled without breaking. The property that the surface of the silicone resin layer 14 can easily be peeled off is referred to as peelability. On the other hand, the first main surface of the supporting substrate 12 and the silicone resin layer 14 are bonded with a bonding force that is relatively difficult to peel off.

The bonding force between the interface of the silicon resin layer 14 and the glass substrate 16 may be changed before or after the formation of the electronic device member on the surface of the glass substrate 16 (the second main surface 16b) That is, the peel strength (x) or peel strength (y) may be changed). However, even after forming the member for electronic devices, the peel strength (y) is preferably lower than the peel strength (x).

It is preferable that the layers of the silicone resin layer 14 and the glass substrate 16 are bonded to each other with a bonding force due to a weak adhesive force or a Bandaudz force. In the case where the glass substrate 16 is laminated on the surface of the silicon resin layer 14 after the silicon resin layer 14 is formed, if the silicone resin of the silicone resin layer 14 is sufficiently crosslinked so as not to exhibit the adhesive force, It is believed that they are bonded together. However, the silicone resin of the silicone resin layer 14 often has a weak adhesive strength to some extent. The silicon resin of the silicon resin layer 14 is adhered to the surface of the glass substrate 16 by the heating operation or the like so that the silicon resin layer 14 and the glass substrate 16 are adhered to each other, It is considered that the bonding force between the layer 16 and the layer is increased.

It is also possible to laminate the surface of the silicon resin layer 14 before lamination or the first main surface 16a of the glass substrate 16 before lamination by performing treatment to weaken the bonding force therebetween. The peeling strength y can be lowered by weakening the bonding force between the interface of the silicon resin layer 14 and the layer of the glass substrate 16 by performing non-adhesive treatment or the like on the layer to be laminated and then laminating it.

It is preferable that the silicone resin layer 14 is bonded to the surface of the supporting substrate 12 with a strong bonding force such as an adhesive force or an adhesive force. For example, as described above, the crosslinkable organopolysiloxane is crosslinked and cured at the surface of the supporting substrate 12, whereby a high bonding force can be obtained by bonding the silicone resin, which is a crosslinked product, to the surface of the supporting substrate 12. The surface of the supporting substrate 12 and the surface of the silicon resin layer 14 (for example, the surface of the supporting substrate 12) are subjected to a treatment (for example, a treatment using a coupling agent) Can be increased.

The reason why the layer of the silicone resin layer 14 and the layer of the supporting substrate 12 are bonded with a high bonding force means that the peeling strength x of the interface between them is high.

The thickness of the silicone resin layer 14 is not particularly limited, but is preferably 2 to 100 占 퐉, more preferably 3 to 50 占 퐉, and further preferably 7 to 20 占 퐉. If the thickness of the silicon resin layer 14 is within this range, it is possible to suppress the occurrence of distortion defects of the glass substrate 16 even when bubbles or foreign matter intervene between the silicon resin layer 14 and the glass substrate 16 . If the thickness of the silicone resin layer 14 is too thick, it takes time and material to form it, which is not economical and the heat resistance may be lowered. If the thickness of the silicon resin layer 14 is too small, the adhesion between the silicon resin layer 14 and the glass substrate 16 may be deteriorated.

The silicone resin layer 14 may include two or more layers. In this case, " the thickness of the silicon resin layer 14 " means the total thickness of all the layers.

When the silicone resin layer 14 includes two or more layers, the resin forming each layer may also include a crosslinked silicone resin.

The silicone resin contained in the silicone resin layer 14 is a crosslinked product of a crosslinkable organopolysiloxane, and the silicone resin preferably forms a three-dimensional mesh structure.

The kind of the crosslinkable organopolysiloxane is not particularly limited, and the structure is not particularly limited as long as it is crosslinked and cured through a predetermined crosslinking reaction to form a crosslinked product (cured product) constituting the silicone resin. If the crosslinked organopolysiloxane has a predetermined crosslinking property do. The type of crosslinking is not particularly limited, and a well-known type may be adopted depending on the type of crosslinkable group contained in the crosslinkable organopolysiloxane. For example, a hydrosilylation reaction, a condensation reaction or a heat treatment, a high energy ray treatment, or a radical reaction with a radical polymerization initiator can be given.

More specifically, when the crosslinkable organopolysiloxane has a radical reactive group such as an alkenyl group or an alkynyl group, the crosslinked organopolysiloxane is crosslinked by a reaction between radical reactive groups through the radical reaction to form a cured product (crosslinked silicone resin).

Further, when the crosslinkable organopolysiloxane has a silanol group, the silanol groups are crosslinked by the condensation reaction to form a cured product.

The organopolysiloxane having a hydrogen atom (hydrosilyl group) bonded to a silicon atom and an organopolysiloxane having an alkenyl group (e.g., vinyl group) bonded to a silicon atom (i.e., an organoalkenyl polysiloxane) in which the crosslinkable organopolysiloxane is bonded to a silicon atom (I.e., organohydrogenpolysiloxane), it is crosslinked by a hydrosilylation reaction in the presence of a hydrosilylation catalyst (for example, a platinum-based catalyst) to form a cured product.

Among them, an organopolysiloxane having an alkenyl group at both terminals and / or side chains of a crosslinkable organopolysiloxane (hereinafter referred to as " organopolysiloxane " Organopolysiloxane A ") and an organopolysiloxane having a hydrosilyl group at both ends and / or side chains (hereinafter referred to as organopolysiloxane B suitably).

Examples of the alkenyl group include, but are not limited to, a vinyl group (ethenyl group), an allyl group (2-propenyl group), a butenyl group, a pentenyl group and a hexynyl group. Among them, A vinyl group is preferable.

Examples of the group other than the alkenyl group contained in the organopolysiloxane A and the group other than the hydrosilyl group contained in the organopolysiloxane B include an alkyl group (particularly an alkyl group having 4 or less carbon atoms).

Although the position of the alkenyl group in the organopolysiloxane A is not particularly limited, when the organopolysiloxane A is linear, the alkenyl group may be present in any of the M units and D units shown below, and the M unit and the D unit Or the like. It is preferable that at least in the M unit in view of the curing rate, it is preferable that the two M units are present on both sides.

The M unit and D unit are examples of basic constituent units of an organopolysiloxane, and the M unit is a monofunctional siloxane unit in which three organic groups are bonded, and a D unit is a bifunctional siloxane unit in which two organic groups are bonded. In the siloxane unit, the siloxane bond is a bond in which two silicon atoms are bonded through one oxygen atom, and the oxygen atom per one silicon atom in the siloxane bond is regarded as _1/2, and represented by O _1/2 in the formula .

The number of alkenyl groups in the organopolysiloxane A is not particularly limited, but is preferably 1 to 3, and more preferably 2 in one molecule.

Although the position of the hydrosilyl group in the organopolysiloxane B is not particularly limited, when the organopolysiloxane A is linear, the hydrosilyl group may be present in either the M unit or the D unit, or both the M unit and the D unit . It is preferable that the curing agent exists at least in the D unit in terms of the curing rate.

The number of hydrosilyl groups in the organopolysiloxane B is not particularly limited, but it is preferably at least 3 in one molecule, and more preferably 3.

Although the mixing ratio of the organopolysiloxane A and the organopolysiloxane B is not particularly limited, the molar ratio (hydrogen atom / alkenyl group) of the hydrogen atoms bonded to the silicon atom in the organopolysiloxane B and the total alkenyl groups in the organopolysiloxane A is 0.7 To 1.05. Among them, it is preferable to adjust the mixing ratio to be 0.8 to 1.0.

As the hydrosilylation catalyst, it is preferable to use a platinum group metal catalyst. Examples of the platinum group metal catalyst include platinum, palladium, and rhodium catalysts. Particularly, it is preferable to use the catalyst as a platinum catalyst in terms of economy and reactivity. As the platinum group metal catalyst, those known can be used. Specific examples thereof include platinum compounds such as platinum powder, platinum black, chloroplatinic acid, chloroplatinic acid and the like, chloroplatinic acid, platinum tetrachloride, alcohol compounds of chloroplatinic acid, aldehyde compounds or platinum olefin complexes, alkenylsiloxane complexes, And the like.

The hydrosilylation catalyst is used in an amount of preferably from 0.1 to 20 parts by mass, more preferably from 1 to 10 parts by mass per 100 parts by mass of the total mass of the organopolysiloxane A and the organopolysiloxane B.

The number average molecular weight of the crosslinkable organopolysiloxane is not particularly limited, but it is excellent in handleability, has excellent film forming properties, and is more resistant to decomposition of the silicone resin under high temperature treatment conditions. Therefore, the gel permeation chromatography (GPC) , The weight average molecular weight in terms of polystyrene is preferably 1,000 to 5,000,000, more preferably 2,000 to 3,000,000.

The viscosity of the crosslinkable organopolysiloxane is preferably 10 to 5000 mPa · s, more preferably 15 to 3000 mPa · s.

Examples of commercially available trade name or type number of the crosslinkable organopolysiloxane include KNS-320A, KS-847 (all manufactured by Shin-Etsu Silicone Co., Ltd.), TPR6700 (Momentive Performance Co., , A combination of vinyl silicone 8500 (manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane 12031 (manufactured by Arakawa Chemical Industries, Ltd.), vinyl silicone 11364 (manufactured by Arakawa Chemical Industries, Ltd.) 11365 " manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane " 12031 " (available from Arakawa Chemical Industries, Ltd.) Manufactured by Kao Chemical Industry Co., Ltd.). As the silicone resin, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of peeling property when the silicone resin layer is formed is good, and the heat resistance is high. The addition reaction type silicone is preferably a curable silicone resin composition comprising the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b) (linear organopolysiloxane (a): at least an alkenyl group (B): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one hydrogen atom bonded to silicon atoms is a linear organopolysiloxane having two terminal Linear organopolysiloxane present in silicon atoms.

The silicone resin layer 14 is more preferably a cured silicone resin layer formed by curing the curable silicone resin composition on the surface of the supporting substrate 12. [

[Glass Substrate]

The glass substrate 16 is provided with the electronic device member on the second main surface 16b where the first main surface 16a contacts the silicon resin layer 14 and the opposite side from the side of the silicon resin layer 14. [

The type of the glass substrate 16 may be a general one, and examples thereof include glass substrates for display devices such as LCDs and OLEDs. The glass substrate 16 is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage rate. The coefficient of thermal expansion specified in JIS R 3102 (revised in 1995) is used as an index of the heat shrinkage ratio.

If the coefficient of linear expansion of the glass substrate 16 is large, the member forming process to be described later often involves heat treatment, and thus various problems are likely to occur. For example, in the case of forming a TFT on the glass substrate 16, if the glass substrate 16 on which the TFT is formed under heating is cooled, the positional shift of the TFT may be excessive due to the heat shrinkage of the glass substrate 16 .

The glass substrate 16 is obtained by melting a glass raw material and molding the molten glass into a plate shape. Such a molding method may be a general one. For example, a float method, a fusion method, a slot down draw method, a Fourcault method, a rubber method, or the like is used. In particular, the glass substrate 16 having a small thickness can be obtained by heating the glass molded into a plate shape at a moldable temperature and stretching it by means of drawing or the like (thinning method) (lead-through method).

The type of glass of the glass substrate 16 is not particularly limited, but is preferably an alkali-free borosilicate glass, borosilicate glass, soda lime glass, high silica glass, or other oxide glass containing silicon oxide as a main component. As the oxide-based glass, a glass having a silicon oxide content of 40 to 90 mass% in terms of an oxide is preferable.

As the glass of the glass substrate 16, glass suitable for the kind of the electronic device member and the manufacturing process thereof is employed. For example, a glass substrate for a liquid crystal panel includes a glass (alkali-free glass) substantially free from an alkali metal component since the elution of the alkali metal component is likely to affect the liquid crystal (note that generally, Is included). As described above, the glass of the glass substrate 16 is appropriately selected based on the kind of the applied device and the manufacturing process thereof.

The thickness of the glass substrate 16 is preferably 0.3 mm or less, more preferably 0.15 mm or less, and further preferably 0.10 mm or less from the viewpoints of reducing the thickness and / or weight of the glass substrate 16. [ If it is 0.3 mm or less, it is possible to provide the glass substrate 16 with good flexibility. When the thickness is 0.15 mm or less, the glass substrate 16 can be rolled up.

The thickness of the glass substrate 16 is preferably 0.03 mm or more for easy production of the glass substrate 16 and easy handling of the glass substrate 16. [

Further, the glass substrate 16 may include two or more layers. In this case, the materials for forming the respective layers may be the same material or different materials. In this case, the "thickness of the glass substrate 16" means the total thickness of all the layers.

[Member for electronic device (functional element)]

The member 18 for the electronic device is a member formed on the glass substrate 16 and constituting at least a part of the electronic device. More specifically, the member 18 for an electronic device may be a member used for a display device panel, a solar cell, a thin-film secondary battery, or an electronic part such as a semiconductor wafer on which a circuit is formed on a surface (for example, Members for solar cells, members for thin film secondary batteries, circuits for electronic parts).

For example, as a member for a solar cell, a transparent electrode such as tin oxide of a positive electrode in a silicon type, a silicon layer and a negative electrode metal in a p layer / an i layer / an n layer, and the like, Various types of members corresponding to the type, the quantum dot type, and the like.

Examples of the member for a thin film secondary battery include a transparent electrode such as a metal or a metal oxide of a positive electrode and a negative electrode in a lithium ion type, a lithium compound in an electrolyte layer, a metal in a current collecting layer, a resin as a sealing layer, Various kinds of members corresponding to a small size, a polymer type, a ceramics electrolyte type, and the like.

As a circuit for an electronic component, a metal of a conductive part, a silicon oxide of an insulating part and silicon nitride can be cited in a CCD or a CMOS, and various sensors such as a pressure sensor and an acceleration sensor, a rigid printed board, a flexible printed board, Various members corresponding to substrates and the like.

[Manufacturing method of laminated body for electronic devices]

The method of producing the laminated body 10 for electronic devices is not particularly limited. However, in order to obtain a laminate having a peel strength (x) higher than the peel strength (y), a predetermined cross- And a step of crosslinking and curing the organopolysiloxane to form the silicone resin layer 14. That is, a layer containing a crosslinkable organopolysiloxane is formed on the surface of the supporting substrate 12, and a crosslinkable organopolysiloxane is crosslinked on the surface of the supporting substrate 12 to form a silicone resin layer 14 (crosslinked silicone resin) A glass substrate 16 is laminated on the silicon resin surface of the silicon resin layer 14 and an electronic device member 18 is formed on the glass substrate 16 to form a laminate 10).

When the crosslinkable organopolysiloxane is cured on the surface of the support substrate 12, the adhesion is caused by the interaction with the surface of the support substrate 12 during the curing reaction to increase the peel strength between the silicone resin and the surface of the support substrate 12 I think. Therefore, even if the glass substrate 16 and the supporting substrate 12 include the same material, the peeling strength between the silicon resin layer 14 and the both can be made different.

Hereinafter, a step of forming a layer containing a crosslinkable organopolysiloxane on the surface of the supporting substrate 12, and crosslinking the crosslinkable organopolysiloxane on the surface of the supporting substrate 12 to form the silicone resin layer 14 A layer forming step, a step of laminating the glass substrate 16 on the silicon resin surface of the silicon resin layer 14 as a lamination step, and a step of forming the electronic device member 18 on the glass substrate 16 as a member forming step And the procedure of each step will be described in detail.

(Resin layer forming step)

In the resin layer forming step, a layer containing a crosslinkable organopolysiloxane is formed on the surface of the supporting substrate 12, and a crosslinkable organopolysiloxane is crosslinked on the surface of the supporting substrate 12 to form a silicone resin layer 14 do.

In order to form a layer containing a crosslinkable organopolysiloxane on the supporting substrate 12, a coating composition in which a crosslinkable organopolysiloxane is dissolved in a solvent is used, and the composition is applied on the supporting substrate 12 It is preferable to form a layer of the solution and subsequently remove the solvent to obtain a layer containing the crosslinkable organopolysiloxane. The thickness of the layer containing the crosslinkable organopolysiloxane can be controlled by adjusting the concentration of the crosslinkable organopolysiloxane in the composition.

The solvent is not particularly limited as long as it is a solvent capable of easily dissolving the crosslinkable organopolysiloxane in a working environment and capable of easily removing volatilization. Specific examples thereof include butyl acetate, heptane, 2-heptanone, 1-methoxy-2-propanol acetate, toluene, xylene, THF, chloroform and the like.

The method of applying the composition containing the crosslinkable organopolysiloxane on the surface of the support substrate 12 is not particularly limited and a known method can be used. Examples of the coating method include a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, a screen printing method and a gravure coating method.

Thereafter, a drying treatment for removing the solvent may be carried out if necessary. The method of the drying treatment is not particularly limited, and examples thereof include a method of removing the solvent under a reduced pressure condition, a method of heating at a temperature at which the crosslinking organopolysiloxane is not cured, and the like.

Subsequently, the crosslinkable organopolysiloxane on the supporting substrate 12 is crosslinked to form the silicone resin layer 14. [ More specifically, as shown in Fig. 4 (A), the silicon resin layer 14 is formed on the surface of at least one surface of the supporting substrate 12 in the above step.

As for the method of curing (crosslinking), an optimum method is appropriately selected according to the crosslinking type of the crosslinkable organopolysiloxane as described above, and examples thereof include a heat treatment and an exposure treatment. In particular, when a crosslinkable organopolysiloxane is crosslinked by a hydrosilylation reaction, a condensation reaction or a radical reaction, a silicone resin having excellent adhesion to the glass substrate 16 and heat resistance can be obtained, It is desirable to produce the layer 14.

Hereinafter, the form of thermosetting will be described in detail.

The temperature condition for thermally curing the crosslinkable organopolysiloxane is preferably 150 to 300 占 폚, more preferably 180 to 250 占 폚 so as to improve the heat resistance of the silicone resin layer 14. [ The heating time is preferably 10 to 120 minutes, more preferably 30 to 60 minutes.

Further, the crosslinkable organopolysiloxane may be cured by pre-curing (pre-curing) followed by post-curing (final curing). By performing pre-curing, a silicon resin layer 14 having better heat resistance can be obtained. The precure is preferably carried out subsequent to the removal of the solvent. In this case, the step of removing the solvent from the layer to form the layer containing the crosslinkable organopolysiloxane and the step of performing the pre-cure are not particularly distinguished.

The formation of the silicone resin layer 14 is not limited to the above method.

For example, when the support base material 12 having a higher adhesion to the surface of the silicone resin than the glass substrate 16 is used, the crosslinkable organopolysiloxane is cured on any releasable surface to produce a film of silicone resin And the film can be laminated at the same time with the glass substrate 16 and the supporting substrate 12 interposed therebetween.

When the adhesion of the crosslinkable organopolysiloxane by curing is sufficiently low with respect to the glass substrate 16 and the adhesiveness thereof is sufficiently high with respect to the supporting substrate 12, the glass substrate 16 and the supporting substrate 12, the silicone resin layer 14 can be formed by curing the crosslinkable organopolysiloxane.

Even in the case where the supporting substrate 12 includes the same glass material as the glass substrate 16, a treatment for increasing the adhesiveness of the surface of the supporting substrate 12 is performed to increase the peeling strength with respect to the silicon resin layer 14 It is possible. For example, chemical methods such as silane coupling agents, such as chemical methods (primer treatment) to increase the fixing force, physical methods to increase the surface activation period such as frame (flame) treatment, And a mechanical treatment method for increasing the amount of the water-soluble polymer.

(Lamination step)

In the laminating step, the glass substrate 16 is laminated on the silicone resin surface of the silicon resin layer 14 obtained in the resin layer forming step and the layer of the supporting substrate 12, the silicon resin layer 14 and the glass substrate 16 ) Layer in this order on the glass laminate. More specifically, as shown in Fig. 4 (B), the surface 14a of the silicon resin layer 14 opposite to the side of the support base material 12 and the surface 14a of the first main surface 16a and the second main surface 16a, The glass laminate 26 is obtained by laminating the silicon resin layer 14 and the glass substrate 16 with the first main surface 16a of the glass substrate 16 having the first main surface 16b as the lamination surface.

A method of laminating the glass substrate 16 on the silicon resin layer 14 is not particularly limited, and a known method can be employed.

For example, a method of overlapping the glass substrate 16 on the surface of the silicon resin layer 14 under atmospheric pressure can be mentioned. If necessary, the glass substrate 16 may be pressed against the silicon resin layer 14 by using a roll or a press after the glass substrate 16 is superimposed on the surface of the silicon resin layer 14. The bubbles mixed in between the silicone resin layer 14 and the glass substrate 16 are relatively easily removed by pressing by roll or press.

The vacuum lamination method or the vacuum press method is more preferable because it suppresses mixing of bubbles and secures good adhesion. Even when minute bubbles remain, there is an advantage that bubbles do not grow due to heating, and it is difficult to lead to distortion defects of the glass substrate 16.

When the glass substrate 16 is laminated, it is preferable that the surface of the glass substrate 16 which contacts the silicon resin layer 14 is sufficiently cleaned and laminated in an environment with high cleanliness. The higher the cleanliness, the better the flatness of the glass substrate 16 is.

Further, after the glass substrate 16 is laminated, a pre-annealing treatment (heat treatment) may be performed if necessary. By performing the pre-annealing process, the adhesion of the laminated glass substrate 16 to the silicon resin layer 14 can be improved and the appropriate peel strength (y) can be obtained. In the member forming process described later, And the productivity of the electronic device is improved.

The conditions of the pre-annealing process are appropriately selected in accordance with the type of the silicon resin layer 14 to be used, but it is preferable that the peel strength (y) between the glass substrate 16 and the silicon resin layer 14 is more appropriate It is preferable to carry out the heat treatment at 300 占 폚 or higher (preferably 300 to 400 占 폚) for 5 minutes or longer (preferably 5 to 30 minutes).

(Member forming process)

The member forming step is a step of forming an electronic device member on the glass substrate 16 in the glass laminate 26 obtained in the laminating step. More specifically, as shown in Fig. 4C, the electronic device member 18 is formed on the second main surface 16b (exposed surface) of the glass substrate 16, To obtain a laminate (10).

The procedure of the present step is not particularly limited and may be carried out by a conventionally known method in accordance with the type of the constituent member of the electronic device member, Thereby forming a member 18 for a device.

It should be noted that the electronic device member 18 is not a whole of a member finally formed on the second main surface 16b of the glass substrate 16 Quot; partial member "). A glass substrate having a partial member peeled off from the silicon resin layer 14 may be formed as a glass substrate (corresponding to an electronic device described later) having an entire member in a subsequent step.

Further, a glass substrate having an entire member, which is peeled off from the silicon resin layer 14, may be provided with another electronic device member on its peeling surface (first main surface 16a). Alternatively, the electronic device may be manufactured by assembling the laminated body having the entire members, and thereafter peeling the supporting substrate 12 from the laminated body with the entire members. Further, it is also possible to fabricate a glass substrate with two glass substrates by using two sheets of the entire member-laminated body to assemble them, then peeling the two supporting substrates 12 from the laminated body with the entire members have.

For example, in the case of manufacturing an OLED, it is possible to form an OLED on the surface of the glass substrate 16 opposite to the side of the silicon resin layer 14 (corresponding to the second main surface 16b of the glass substrate 16) A hole injecting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and the like are deposited on the surface on which the transparent electrode is formed to form the EL structure and the back electrode is formed and sealed with a sealing plate And the like are formed and processed. Specific examples of such layer formation and treatment include film forming treatment, vapor deposition treatment, bonding treatment of a sealing plate, and the like.

For example, in the case of manufacturing a TFT-LCD, a resist solution is used on a second main surface 16b of the glass substrate 16 of the glass laminate 26 to form a film by a general film formation method such as a CVD method and a sputtering method (TFT) on the second main surface 16b of the glass substrate 16 of the other glass laminate 26, and a step of forming a thin film transistor And a bonding step of laminating the CF deposited laminate obtained in the TFT deposited laminate and the CF forming step obtained in the TFT forming step, and the like.

In the TFT forming step and the CF forming step, a TFT or a CF is formed on the second main surface 16b of the glass substrate 16 by using a well-known photolithography technique or an etching technique. At this time, a resist solution is used as a coating liquid for pattern formation.

Further, the second main surface 16b of the glass substrate 16 may be cleaned before forming the TFT or the CF, if necessary. As the cleaning method, well-known dry cleaning or wet cleaning can be used.

In the bonding step, the thin film transistor formation surface of the TFT-laminated body and the color filter formation surface of the CF laminated body are bonded to each other using an encapsulant (for example, ultraviolet curable encapsulant for cell formation). Thereafter, the liquid crystal material is injected into the cell formed of the stacked body including the TFT and the CF laminated body. As a method of injecting the liquid crystal material, for example, there are a reduced pressure injection method and a dropping injection method.

<Examples>

Hereinafter, the present invention will be described in detail by way of examples and the like, but the present invention is not limited to these examples.

&Lt; Example 1 >

A support glass substrate (AN100, manufactured by Asahi Glass Co., Ltd.) having a length of 400 mm, a width of 300 mm, a thickness of 0.7 mm and a coefficient of linear expansion of 38 × 10 ^-7 / ° C was cleaned by pure cleaning, UV cleaning, 100 parts by mass of a silicone for release-free addition type release material (KNS-320A, manufactured by Shinetsu Silicones Co., Ltd., mixture of organoalkenyl polysiloxane and organohydrogenpolysiloxane) and 100 parts by mass of a platinum- (Coating amount: 10 g / m ² ), and the mixture was heated and cured at 180 캜 for 30 minutes in the air to obtain a silicone resin layer having a thickness of 16 탆.

The side of the thin plate glass substrate (AN100) having a length of 400 mm, a width of 300 mm, a thickness of 0.7 mm and a coefficient of linear expansion of 38 x 10 &lt; ^-7 &gt; / [deg.] C in contact with the silicone resin layer was cleaned by pure cleaning, UV cleaning, The surface of the substrate on which the silicone resin layer was formed and the thin plate glass substrate were bonded to each other by a vacuum press under room temperature to obtain a glass laminate A having a silicone resin layer.

Subsequently, the glass laminate A was subjected to heat treatment at 350 占 폚 for 60 minutes under the atmosphere.

Then, a stainless steel blade having a thickness of 0.1 mm was inserted into the interface between the thin plate glass substrate and the silicone resin layer at the corner of one of the four places of the glass laminate A to form the notch portion of the peeling. Subsequently, the vacuum adsorption pad was adsorbed on the surface of each of the thin plate glass substrate and the supporting glass substrate other than the peeling surface side, and methanol (the solubility parameter of the thin film glass substrate was measured using a syringe as a boundary line between the silicon resin layer and the peeling interface of the thin plate glass substrate : 14.5 cal / cm &lt; ³ &gt;), an external force was applied in the direction in which the thin plate glass substrate and the supporting glass plate were separated, and the thin plate glass substrate was separated without breakage.

(Measurement of peel strength)

A peel test was conducted using the jig described in paragraph 0050 of Japanese Patent No. 5200538. The used jig is shown in Fig. 5, the glass laminate A has a supporting glass substrate 40, a silicon resin layer 30, and a thin plate glass substrate 50. In Fig.

The glass laminate A was cut to a size of 50 mm in length and 50 mm in width and was laminated on both surfaces of the glass laminate A (supporting glass substrate 40 and thin plate glass substrate 50) in a size of 50 mm in width x 50 mm in width x 5 mm in thickness And the polycarbonate (60) were bonded to each other with an epoxy two-liquid glass adhesive. Further, the polycarbonate (70) having a length of 50 mm, a width of 50 mm and a thickness of 5 mm was bonded vertically to the surface of both bonded polycarbonate (60). As shown in Fig. 5, the position where the polycarbonate 70 is bonded is the position at the end of the polycarbonate 60 in the longitudinal direction and the position at the position parallel to the side of the polycarbonate 60 Respectively.

The glass laminate A having the polycarbonates 60 and 70 bonded thereto was provided so that the supporting glass substrate was positioned on the lower side. The polycarbonate 70 attached to the side of the thin plate glass substrate was jig fixed and the polycarbonate 70 attached to the side of the supporting glass substrate was separated vertically downward at a rate of 300 mm / / cm &lt; ² &gt; was applied, the support glass substrate was peeled off.

&Lt; Example 2 >

Methanol (solubility parameter: 14.5cal / cm ³⁾ in place of ethanol (solubility parameter: 12.7cal / cm ³⁾ except that, in Example 1, and the thin plate glass substrate was subjected to the peeling of the thin plate glass substrate according to a procedure similar to Were separated without breakage. Table 1 shows the measurement results of peel strength.

&Lt; Example 3 >

Methanol: (: 12.7cal / cm ³ the solubility parameter) and water mixture (Ethanol: Water (mass ratio) = 1: 1), the same as in Example 1 except that there was used (solubility parameter 14.5cal / cm ³⁾ in place of ethanol The thin plate glass substrate was peeled off, and the thin plate glass substrate was separated without breakage. Table 1 shows the measurement results of peel strength.

<Example 4>

Methanol (solubility parameter: 14.5cal / cm ³⁾ instead of ethanol and a mixture of 1-propanol for (content: 90% by weight ethanol, 10% by weight 1-propanol solubility parameter: ethanol 12.7cal / cm ^3, 1-propanol 12.0 cal / cm &lt; ³ &gt;) was used instead of the glass substrate, the thin plate glass substrate was peeled according to the same procedure as in Example 1, and the thin plate glass substrate was separated without breakage. Table 1 shows the measurement results of peel strength.

&Lt; Example 5 >

Methanol (solubility parameter: 14.5cal / cm ³⁾ in place of 1-propanol was used a (solubility parameter 12.0cal / cm ^3), Example 1, according to the procedures similar to those subjected to the peeling of the thin plate glass substrate, bar, thin plate The glass substrate was separated without breaking. Table 1 shows the measurement results of peel strength.

&Lt; Example 6 >

Methanol: (: 11.5cal / cm ³ the solubility parameter), except that, in Example 1, and the thin plate glass substrate was subjected to the peeling of the thin plate glass substrate according to a procedure similar to (solubility parameter 14.5cal / cm ³⁾ instead of isopropanol to Were separated without breakage. Table 1 shows the measurement results of peel strength.

&Lt; Example 7 >

Methanol (solubility parameter: 14.5cal / cm ³⁾ in place of 1-butanol was used a (solubility parameter 11.4cal / cm ^3), Example 1, according to the procedures similar to those subjected to the peeling of the thin plate glass substrate, bar, thin plate The glass substrate was separated without breaking. Table 1 shows the measurement results of peel strength.

&Lt; Example 8 >

Methanol (solubility parameter: 14.5cal / cm ³⁾ in place of 1-hexanol: except that there was used (solubility parameter 10.7cal / cm ^3), according to Example 1, a procedure similar to those carried out in the peeling of the thin plate glass substrate, The thin plate glass substrate was separated without breaking. Table 1 shows the measurement results of peel strength.

&Lt; Example 9 >

Methanol (solubility parameter: 14.5cal / cm ^3), instead of dimethyl sulfoxide (solubility parameter: 12.0cal / cm ³⁾ was used in the Example 1, and according to the procedures similar to those subjected to the peeling of the thin plate glass substrate, bar, thin plate The glass substrate was separated without breaking. Table 1 shows the measurement results of peel strength.

&Lt; Example 10 >

Methanol (solubility parameter: 14.5cal / cm ³⁾ instead of dimethylformamide (solubility parameter: 12.1cal / cm ³⁾ was used in the Example 1, and according to the procedures similar to those subjected to the peeling of the thin plate glass substrate, bar, thin plate The glass substrate was separated without breaking. Table 1 shows the measurement results of peel strength.

&Lt; Example 11 >

Methanol (solubility parameter: 14.5cal / cm ³⁾ in place of N- methylpyrrolidone: except that there was used (solubility parameter 11.3cal / cm ^3), Example 1, according to the procedures similar to those subjected to the peeling of the thin plate glass substrate The bar and the thin plate glass substrate were separated without breaking. Table 1 shows the measurement results of peel strength.

&Lt; Comparative Example 1 &

When the thin plate glass substrate was peeled off in accordance with the same procedure as in Example 1 except that the supply of methanol (solubility parameter: 14.5 cal / cm ³ ) was not performed, the thin plate glass substrate was hardly peeled off and the breakage of the thin plate glass substrate . The results of the peel strength are shown in Table 1.

&Lt; Comparative Example 2 &

Methanol (solubility parameter: 14.5cal / cm ³⁾ in place of heptane (solubility parameter: 7.4cal / cm ³⁾ except that, in Example 1, and the thin plate glass substrate was subjected to the peeling of the thin plate glass substrate according to a procedure similar to Was not easily peeled off, and the thin plate glass substrate was damaged. The results of the peel strength are shown in Table 1.

In Table 1, &quot; glass peeling &quot; refers to the case where the peeling of the thin plate glass proceeded without problems and the case where the breakage or peeling of the thin plate glass was difficult to progress.

In Table 1, the "SP value" in the example 3 indicates the SP value of ethanol, and the "SP value" in the example 4 indicates the SP value of ethanol and 1-propanol, respectively.

As shown in Table 1, when an organic solvent exhibiting a predetermined SP value or a mixed solution of the organic solvent and water was used, the peel strength was lowered and no breakage of the thin plate glass substrate was observed at the time of peeling.

On the other hand, in Comparative Example 1 in which the organic solvent or mixed solution was not used and Comparative Example 2 in which the organic solvent having an SP value outside the predetermined range was used, the peel strength was large and breakage of the thin plate glass substrate was observed upon peeling.

&Lt; Example 12 >

In the present embodiment, an OLED was manufactured using the glass laminate A obtained in Example 1.

More specifically, molybdenum was deposited on the thin plate glass substrate of the glass laminate A by the sputtering method, and the gate electrode was formed by etching using the photolithography method. Subsequently, a film is further formed on the second main surface side of the releasable glass substrate provided with the gate electrode by the plasma CVD method in the order of silicon nitride, intrinsic amorphous silicon, and n-type amorphous silicon. Subsequently, molybdenum is deposited by sputtering And a gate insulating film, a semiconductor element portion, and a source / drain electrode were formed by etching using a photolithography method. Subsequently, a silicon nitride film is further formed on the second main surface side of the releasable glass substrate by the plasma CVD method to form a passivation layer. Then, indium tin oxide is formed by the sputtering method, and by the etching using the photolithography method, Electrodes were formed.

Subsequently, 4,4 ', 4 "-tris (3-methylphenylphenylamino) triphenylamine was used as a hole injecting layer, and bis [(N- (4-methoxyphenyl) -N-phenyl] benzosteine as a light emitting layer was added to an 8-quinolinol aluminum complex (Alq ₃ ) ] Naphthalene-1,5-dicarbonitrile (BSN-BCN) in an amount of 40% by volume, and Alq ₃ as an electron transporting layer were further deposited in this order on the surface of the laminate, Aluminum was formed by the method described above and an opposite electrode was formed by etching using a photolithography method. Next, another glass substrate was bonded to the surface on which the counter electrode was formed, via an ultraviolet curable adhesive layer, and sealed . On the thin plate glass substrate obtained by the above procedure, an organic EL structure Glass laminate having the A2, which corresponds to the layered product over a member for an electronic device.

In the above manufacturing process, the heat treatment at 350 占 폚 for 1 hour was the treatment at the highest temperature.

The silicone resin layer and the thin plate glass substrate were peeled off in the same procedure as in Example 1 except that the above-mentioned glass laminate A2 was used in place of the glass laminate A1. As a result, The peeling progressed, and an electronic device including a thin plate glass substrate and a member for an electronic device could be obtained.

Further, even when the respective procedures of Examples 2 to 11 were carried out in place of the procedure of Example 1, the silicon resin layer and the thin plate glass substrate can be peeled off with the same peeling strength as in Examples 2 to 11 , A thin plate glass substrate, and a member for an electronic device.

On the other hand, when each of the procedures of Comparative Examples 1 and 2 was carried out in place of the procedure of Example 1, breakage of the thin plate glass substrate occurred at the time of peeling the silicon resin layer from the thin plate glass substrate, .

While the invention has been described in detail and with reference to specific embodiments thereof, it is evident to those skilled in the art that various modifications and variations can be made without departing from the scope and spirit of the invention.

The present application is based on Japanese Patent Application No. 2013-159724 filed on July 31, 2013, the contents of which are incorporated herein by reference.

10: Memberless laminate for electronic device
12: support substrate
14, 30: Silicone resin layer
14a: a first main surface of the silicone resin layer
16: glass substrate
16a: a first main surface of the glass substrate
16b: a second main surface of the glass substrate
18: Member for electronic device
20: Silicone resin layer-supported substrate
22: electronic device
24: solution
26: Glass laminate
40: support glass substrate
50: thin plate glass substrate
60, 70: Polycarbonate
80: liquid crystal panel
82: TFT substrate
83: TFT element
84: CF substrate
85: Color filter element
90: electronic paper
91: Electronic paper device
92: TFT layer
94: layer of electrical engineering media
96: Transparent electrode

Claims (5)

Wherein the interface between the silicon resin layer and the glass substrate is peeled off from the laminated body for the electronic device having the support substrate, the silicon resin layer, the glass substrate, and the electronic device member in this order, A method of manufacturing an electronic device having a step of obtaining an electronic device by separating an electronic device including the glass substrate and the electronic device member from a supporting substrate having a silicon resin layer including a resin layer,
An organic solvent having a solubility parameter of more than 10 or a mixed solution of the organic solvent and water is supplied to a peeling line which is a boundary line between the silicon resin layer and the peeling interface of the glass substrate, Is carried out. The method of manufacturing an electronic device according to claim 1, wherein the organic solvent comprises an alcohol-based solvent capable of having a halogen atom, or an aprotic polar solvent. The method of claim 1 or 2, wherein the organic solvent is selected from the group consisting of an alcohol solvent having 1 to 6 carbon atoms, dimethylformamide (DMF), N, N-dimethylacetamide (DMAc), dimethylsulfoxide (DMSO) -Methylpyrrolidone (NMP), sulfolane, and acetonitrile. &Lt; / RTI &gt; The method of manufacturing an electronic device according to any one of claims 1 to 3, wherein the silicone resin in the silicone resin layer is a reactive cured product of an organoalkenyl polysiloxane and an organohydrogenpolysiloxane. 5. The method according to claim 4, wherein the silicone resin is a cured product of addition reaction-
Wherein the addition reaction type silicone is a curable silicone resin composition comprising (a) and (b)
Wherein the silicon resin layer is formed by curing the curable silicone resin composition on the surface of the supporting substrate.
(a) a linear organopolysiloxane having at least two alkenyl groups per molecule,
(b) a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, wherein at least one hydrogen atom bonded to the silicon atom is present at the silicon atom of the molecular end.

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