CN105432147B - A method of manufacturing an electronic device - Google Patents

A method of manufacturing an electronic device Download PDF

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Publication number
CN105432147B
CN105432147B CN201480043262.4A CN201480043262A CN105432147B CN 105432147 B CN105432147 B CN 105432147B CN 201480043262 A CN201480043262 A CN 201480043262A CN 105432147 B CN105432147 B CN 105432147B
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silicone resin
glass substrate
resin layer
electronic device
substrate
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CN201480043262.4A
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Chinese (zh)
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CN105432147A (en
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角田纯
角田纯一
江畑研
江畑研一
松山祥孝
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旭硝子株式会社
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Priority to JP2013159724 priority
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Priority to PCT/JP2014/069461 priority patent/WO2015016113A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/064Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material synthetic resin
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2227/00Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
    • H01L2227/32Devices including an organic light emitting device [OLED], e.g. OLED display
    • H01L2227/326Use of temporary substrate, e.g. for manufacturing of OLED dsiplays having an inorganic driving circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of products other than chlorine, adipic acid, caprolactam, or chlorodifluoromethane, e.g. bulk or fine chemicals or pharmaceuticals
    • Y02P20/58Recycling
    • Y02P20/582Recycling of unreacted starting or intermediate materials

Abstract

本发明涉及一种电子设备的制造方法,其具备如下工序:从依次具有支撑基材、有机硅树脂层、玻璃基板和电子设备用构件的带电子设备用构件的层叠体中,以前述有机硅树脂层和前述玻璃基板的界面作为剥离面,将带有机硅树脂层的支撑基材和电子设备分离,得到前述电子设备,其中,对前述有机硅树脂层和前述玻璃基板的剥离界面的边界线即剥离线供给溶解度参数超过10的有机溶剂或前述有机溶剂和水的混合溶液,进行前述带有机硅树脂层的支撑基材与前述电子设备的分离。 The present invention relates to a method of manufacturing an electronic device, comprising the steps of: sequentially from a support base, the laminate member of the electronic device with the silicone resin layer, a glass substrate and a member of the electronic device, to the silicone and the interface between the resin layer as a release face of the glass substrate, the silicone resin layer with a supporting substrate and an electronic device separated to give the electronic apparatus, wherein the boundary line of the silicone resin layer and the glass substrate interface peeling i.e. the release of more than 10 line feeding a solubility parameter of an organic solvent or a mixed solution of the organic solvent and water for separation of the supporting substrate and the electronic device having a silicone resin layer.

Description

电子设备的制造方法 A method of manufacturing an electronic device

技术领域 FIELD

[0001] 本发明涉及电子设备的制造方法,特别是涉及具备对有机硅树脂层和玻璃基板之间的剥离线供给规定的有机溶剂进行分离(剥离)的分离工序的电子设备的制造方法。 [0001] The present invention relates to a method of manufacturing an electronic device, particularly to a method for manufacturing an electronic device comprising an organic solvent line supplying a predetermined peeling between the silicone resin layer and the glass substrate separating step of separating (peeling) of.

背景技术 Background technique

[0002] 近年来,太阳能电池(PV)、液晶面板(LCD)、有机EL面板(OLED)等设备(电子装置) 的薄型化、轻量化正在进行,这些设备中使用的玻璃基板的薄板化正在进行。 [0002] In recent years, a solar cell (the PV), a liquid crystal panel (LCD), organic EL panel (OLED) and other equipment (an electronic device) is thin, being lightweight, thin glass substrates are used in these devices get on. 由于薄板化而玻璃基板的强度不足时,设备的制造工序中,玻璃基板的处理性降低。 Due to insufficient strength while thinning the glass substrate, the device manufacturing step, the processing of the glass substrate is reduced.

[0003] 因此,一直以来,广泛采用了在比最终厚度还厚的玻璃基板上形成设备用构件(例如薄膜晶体管)后通过化学蚀刻处理将玻璃基板薄板化的方法。 [0003] Thus, it has been widely adopted a method of processing by chemical etching of the thin glass substrate after forming apparatus with a member (e.g. thin film transistors) on a glass substrate is thicker than the final thickness.

[0004] 然而,对于该方法,例如将1张玻璃基板的厚度从0.7mm薄板化至0.2mm、0. Imm的情况下,用蚀刻液削去原来的玻璃基板材料的大半,因此在生产率、原材料的使用效率的观点上不优选。 [0004] However, with this method, for example, a thickness of a glass substrate is thinned from 0.7mm to 0.2mm, 0. Imm case, the etching solution slashing half the original glass substrate material, and therefore the productivity, efficient use of raw material is not preferable from the viewpoint. 另外,上述利用化学蚀刻的玻璃基板的薄板化方法中,在玻璃基板表面存在微细的划痕时,由于蚀刻处理而以划痕作为起点形成微细的凹陷(蚀痕),有时变为光学缺陷。 Further, a method thinning the glass substrate by chemical etching, the fine scratches in the presence of a glass substrate surface, since the etching process as a starting point to form fine scratches recess (eroded), and sometimes becomes an optical defect.

[0005] 最近,为了应对上述问题,提出了如下方法:准备层叠有薄板玻璃基板和加强板的玻璃层叠体,在玻璃层叠体的薄板玻璃基板上形成显示装置等电子设备用构件,然后从薄板玻璃基板上分离支撑板(例如参照专利文献1)。 [0005] Recently, to deal with these problems, a method of: preparing a laminated glass laminate thin glass substrate and the reinforcing plate, forming an electronic device member display device on a glass substrate a thin plate glass laminate, and then from the sheet separating the support plate on a glass substrate (see Patent Document 1). 加强板具有支撑板和固定于该支撑板上的有机硅树脂层,有机硅树脂层和薄板玻璃基板可剥离地密合。 Having a support plate and a reinforcing plate fixed to the silicone resin layer of the support plate, the silicone resin layer and thin glass substrate can be peeled adhesion. 玻璃层叠体的有机硅树脂层和薄板玻璃基板的界面被剥离,从薄板玻璃基板分离出的加强板与新的薄板玻璃基板层叠,可以作为玻璃层叠体再利用。 Interface silicone resin layer and the thin plate glass laminate of the glass substrate is peeled off, the thin glass substrate is separated from the reinforcing plate with the new laminate thin glass substrate, a glass laminate can be reused.

[0006] 现有技术文献[0007] 专利文献 [0006] The prior art document [0007] Patent Document

[0008] 专利文献1:国际公开第2007/018028号 [0008] Patent Document 1: International Publication No. 2007/018028

发明内容 SUMMARY

[0009] 发明要解决的问题 [0009] Problems to be solved

[0010] 近年来,伴随着形成于玻璃层叠体的玻璃基板上的电子设备用构件的高功能化、 复杂化,形成电子设备用构件时的温度变得更高、且暴露于该高温的时间也需要长时间的情况不少。 [0010] In recent years, along with high functionality of electronic equipment member is formed on a glass substrate in the glass laminate, the temperature of the complex formed with the member when the electronic device becomes higher, and the time of exposure to high temperatures also many cases take a long time.

[0011] 专利文献1所记载的玻璃层叠体在大气中300°C、1小时的处理中不会特别产生问题。 [0011] The glass laminate described in Patent Document 1, in the air 300 ° C, 1 hour treatment is not particularly a problem. 然而,根据本发明人等的研究,参照专利文献1,对玻璃层叠体进行350°C、1小时的处理时,将玻璃基板从有机硅树脂层表面剥离时,玻璃基板未从树脂层表面剥离,其一部分被破坏,或者树脂层的树脂的一部分残留在玻璃基板上,因此,作为结果,形成电子设备用构件后,电子设备的分离无法顺利进行,有时导致电子设备的生产率降低。 However, according to studies by the present inventors, see Patent Document 1, the glass laminate 350 ° C, 1 hour of treatment, when the glass substrate is peeled off from the surface of the silicone resin layer, a glass substrate is not peeled from the surface of the resin layer after which a part is broken, or a portion of the residual resin in the resin layer on the glass substrate, and therefore, as a result, the electronic equipment forming member, an electronic device can not be separated smoothly, sometimes leading to a decrease in productivity of the electronic device.

[0012] 本发明是鉴于上述问题而作出的,目的在于,提供即使为高温加热处理条件后有机硅树脂层与玻璃基板的剥离也容易地进行的电子设备的制造方法。 [0012] The present invention is made in view of the above problems, it aims to provide a method of manufacturing the electronic device even in a high-temperature heat treatment conditions after peeling the silicone resin layer and the glass substrate is easily performed.

[0013] 用于解决问题的方案 [0013] for solutions to the problem

[0014] 本发明人对现有技术的问题进行了研究,结果发现:通过对有机硅树脂层和玻璃基板的剥离界面的边界线即剥离线供给规定性质的有机溶剂,剥离会容易地进行,从而完成了本发明。 [0014] The present invention is of problems of the prior art were studied and found that: by boundary peeling interface on the silicone resin layer and the glass substrate, i.e., the nature of the release line feeding a predetermined organic solvent, peeling can be easily performed, thereby completed the present invention.

[0015] S卩,为了达成上述目的,本发明的第1方式为一种电子设备的制造方法,其具备如下工序:从依次具有支撑基材、有机硅树脂层、玻璃基板和电子设备用构件的带电子设备用构件的层叠体中,以上述有机硅树脂层和上述玻璃基板的界面作为剥离面,将包含上述支撑基材和上述有机硅树脂层的带有机硅树脂层的支撑基材与包含上述玻璃基板和上述电子设备用构件的电子设备分离,得到上述电子设备,其中,对有机硅树脂层和上述玻璃基板的剥离界面的边界线即剥离线供给溶解度参数超过10的有机溶剂或上述有机溶剂和水的混合溶液,进行上述带有机硅树脂层的支撑基材与上述电子设备的分离。 [0015] S Jie, in order to achieve the above object, a first embodiment of the present invention is a method of manufacturing an electronic device, comprising the steps of: sequentially from a support base, the silicone resin layer, a glass substrate and an electronic device with member laminate member with electronic equipment in order to interface between the silicone resin layer and the glass substrate as the release face, the supporting substrate including the above-described silicone resin layer and supporting substrate with a silicone resin layer and the electronic device separation including the glass substrate and the electronic equipment components, to give the electronic device, wherein the boundary lines interfacial peeling the silicone resin layer and the glass substrate, i.e., the release line feeding a solubility parameter of more than 10 organic solvent or said a mixed solution of an organic solvent and water, separating the supporting substrate with a silicone resin layer and the electronic device.

[0016] 第1方式中,有机溶剂优选包含任选具有卤原子的醇类溶剂或非质子性极性溶剂。 [0016] In the first embodiment, the organic solvent preferably contains an alcohol solvent, optionally with or aprotic polar solvent is a halogen atom. [0017]第1方式中,有机溶剂优选包含选自由碳数1〜6的醇类溶剂、二甲基甲酰胺(DMF)、 N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)、环丁砜和乙腈组成的组中的至少1种。 [0017] In the first embodiment, the organic solvent preferably contains an alcohol solvent selected from the group consisting of a carbon number of 1~6, dimethylformamide (DMF), N, N- dimethylacetamide (DMAc), dimethyl sulfoxide at least one sulfone group (DMSO), N- methylpyrrolidone (NMP), sulfolane and acetonitrile in.

[0018] 第1方式中,有机硅树脂层中的有机硅树脂优选为有机烯基聚硅氧烷和有机氢聚硅氧烷的反应固化物。 [0018] In the first embodiment, the silicone resin layer is an organic silicone resin is preferably an alkenyl organopolysiloxane and organohydrogenpolysiloxane of the reaction cured product.

[0019] 另外,优选的是,前述有机硅树脂为加成反应型有机硅的固化物,前述加成反应型有机硅为包含下述(a)和(b)的固化性有机硅树脂组合物,前述有机硅树脂层是通过使前述固化性有机硅树脂组合物在前述支撑基材的表面固化而形成的:(a)每1分子中具有至少2 个烯基的线状有机聚硅氧烷、(b)每1分子中具有至少3个与硅原子键合的氢原子、且与硅原子键合的氢原子的至少1个存在于分子末端的硅原子上的线状有机聚硅氧烷。 [0019] Further, preferably, the silicone resin is an addition reaction type silicone cured product of the addition reaction type silicone comprising the following (a) and (b) a curable silicone resin composition , the silicone resin layer is obtained by curing the silicone resin composition on a surface of the supporting substrate and the cured form of: (a) having per molecule at least two alkenyl groups in the linear organopolysiloxane , (b) per molecule at least 3 silicon-bonded hydrogen atom, a linear organic polysiloxane on at least one silicon atom and a silicon atom-bonded hydrogen atoms present in the molecule terminal .

[0020] 发明的效果 [0020] Effect of the Invention

[0021] 根据本发明,可以提供即使为高温加热处理条件后有机硅树脂层与玻璃基板的剥离也容易地进行的电子设备的制造方法。 [0021] According to the present invention can provide a method of manufacturing the electronic device even after the peeling process conditions silicone resin layer and the glass substrate can be easily heated to a high temperature.

附图说明 BRIEF DESCRIPTION

[0022] 图1的(A)〜图1的(C)为依次示出本发明的电子设备的制造方法的分离工序的步骤的示意性截面图。 [0022] FIG. 1 (A) ~ FIG. (C) 1 is a schematic sectional view sequentially illustrating steps of a method for producing the separation step of the electronic device according to the present invention.

[0023] 图2的㈧和图2的⑶分别为图1的⑶的状态的立体截面图和顶视图。 ⑶ [0023] (viii) of FIG. 2 and FIG. 2 are respectively a perspective cross-sectional view illustrating a state ⑶ FIG. 1 and a top view.

[0024] 图3的㈧和图3的⑶为示出电子设备的构成例的示意性截面图。 And (viii) ⑶ [0024] FIG. 3 FIG. 3 is a sectional view illustrating a schematic configuration of an electronic device.

[0025] 图4的〜图4的(C)为依次示出带电子设备用构件的层叠体的制造方法的各工序的步骤的示意性截面图。 A schematic sectional view of the step of [0025] FIG. 4 to FIG. 4 (C) is sequentially illustrating each step of a method for producing a laminate with a member of the electronic device.

[0026] 图5为剥离强度的测定装置的概要图。 [0026] FIG. 5 is a schematic view of a measuring apparatus peel strength.

具体实施方式 Detailed ways

[0027] 以下,对用于实施本发明的方案参照附图来说明,但本发明不限定于以下的实施方式,可以在不脱离本发明的范围的情况下,对以下实施方式加以各种变形和置换。 [0027] Hereinafter, schemes for implementing the invention will be described with reference to the accompanying drawings, but the present invention is not limited to the following embodiments may be made without departing from the scope of the present invention, the following embodiments be variously modified embodiment and replacement.

[0028] 作为本发明的电子设备的制造方法的特征,可以举出如下方面:对有机硅树脂层和玻璃基板的剥离界面的边界线即剥离线供给显示出规定的溶解度参数(SP值)的有机溶剂或上述有机溶剂和水的混合溶液。 [0028] As a feature of the method for producing an electronic device of the present invention may include the following aspects: i.e., the supply line of peel peeling interface boundary lines silicone resin layer and the glass substrate displayed a predetermined solubility parameter (SP value) of an organic solvent or a mixed solution of the organic solvent and water. 可以推测:通过供给上述有机溶剂或混合溶液,有机溶剂侵入到有机硅树脂层的玻璃基板侧的表层,使有机硅树脂层和玻璃基板的界面粘接力降低,因此,有机硅树脂层和玻璃基板的剥离更容易地进行。 It presumed: by supplying the organic solvent or a mixed solution, an organic solvent intrudes into the surface of the glass substrate side of the silicone resin layer, the interfacial adhesive force of the silicone resin layer and the glass substrate is reduced, and therefore, the silicone resin layer and the glass Removal of the substrate more easily.

[0029] 本发明的电子设备的制造方法至少具有如下工序(分离工序):从依次具有支撑基材、有机硅树脂层、玻璃基板和电子设备用构件的带电子设备用构件的层叠体中,以有机硅树脂层和玻璃基板的界面作为剥离面,将包含支撑基材和有机硅树脂层的带有机硅树脂层的支撑基材与包含玻璃基板和电子设备用构件的电子设备分尚,得到电子设备。 [0029] The method for producing an electronic device according to the present invention has at least the following step (separation step): successively from a support base, the silicone resin layer, a laminate member of the electronic device and an electronic device using a glass substrate member belt, interface to the silicone resin layer and the glass substrate as a release surface comprising a supporting substrate and a silicone resin layer with a supporting substrate with a silicone resin layer comprises a glass substrate in electronic equipment and electronic equipment components still give Electronic equipment.

[0030] 图1的(A)〜图1的(C)为依次示出本发明的电子设备的制造方法的分离工序的步骤的示意性截面图。 [0030] FIG. 1 (A) ~ FIG. (C) 1 is a schematic sectional view sequentially illustrating steps of a method for producing the separation step of the electronic device according to the present invention. 以下,边参照图1的㈧〜图1的(C)边对分离工序的步骤进行详述。 Hereinafter, with reference to FIG. ㈧~ FIG. 1 (C) a step edge separation step will be described in detail.

[0031] 首先,准备带电子设备用构件的层叠体,其具有支撑基材、配置于支撑基材上的有机硅树脂层、配置于有机硅树脂层上的玻璃基板和配置于玻璃基板上的电子设备用构件。 [0031] First, a laminate with an electronic device with a member having a supporting substrate on the silicone resin layer disposed on a substrate support disposed on the glass substrate and the silicone resin layer disposed on a glass substrate electronic equipment member. 图1的(A)为本发明的带电子设备用构件的层叠体的一例的示意性截面图。 A schematic cross-sectional view showing an example of FIG. 1 (A) of the present invention with a laminate member of the electronic device.

[0032] 如图1的(A)所示那样,带电子设备用构件的层叠体10依次具有:支撑基材12、有机硅树脂层14、玻璃基板16和电子设备用构件18。 [0032] As shown in FIG. 1 (A) as shown in the electronic device with tape stack body member 10 having a sequence: a support base 12, the silicone resin layer 14, the glass substrate 16 with the member 18 and the electronic device. 需要说明的是,对于有机硅树脂层14,优选其一个面固定于支撑基板12的层,并且另一个面与玻璃基板16的第1主表面相接触,有机硅树脂层14和玻璃基板16的界面可剥离地密合。 Incidentally, the silicone resin layer 14, which is preferably a surface layer of the substrate 12 is fixed to the support, and the other surface in contact with the first main surface of the glass substrate 16, the silicone resin layer 14 and the glass substrate 16 adhesion interface may be peeled off.

[0033] 由支撑基材12的层和有机硅树脂层14构成的2层部分在制造液晶面板等电子设备用构件的后述的构件形成工序中加强玻璃基板16。 Member to be described later [0033] 2 layer portion composed of a layer and a silicone resin layer 12 of the support base 14 in the manufacture of electronic devices such as a liquid crystal panel with a reinforcing member in the step of forming the glass substrate 16. 由支撑基材12的层和有机硅树脂层14构成的2层部分也称为带有机硅树脂层的支撑基材20。 2 layer portion composed of a layer and a silicone resin layer of the support base 12 with a supporting substrate 14 is also referred to as a silicone resin layer 20.

[0034] 另外,由玻璃基板16和电子设备用构件18构成的2层部分也称为电子设备22。 [0034] Further, the two-layer portion 16 and a glass substrate 18 constituting the electronic equipment member is also referred to the electronic device 22.

[0035] 需要说明的是,对于构成带电子设备用构件的层叠体的各构件和其制造步骤,在后段中归纳说明。 [0035] Incidentally, for each member constituting the laminate member with electronic devices and their manufacturing steps described are summarized in the subsequent stage.

[0036] 首先,对分离步骤进行说明,所述分离步骤以有机硅树脂层和玻璃基板的界面作为剥离面,从带电子设备用构件的层叠体中分离带有机硅树脂层的支撑基材和电子设备。 [0036] First, the separation steps will be described, the interface separation step to the silicone resin layer and the glass substrate as a release surface, separating the supporting substrate with a silicone resin layer from the laminate with electronic equipment components and Electronic equipment.

[0037] 首先,从带电子设备用构件的层叠体中分离带有机硅树脂层的支撑基材和电子设备时,优选对有机硅树脂层和玻璃基板的界面赋予剥离的起点。 When [0037] First, separate supporting substrate and an electronic device having a silicone resin layer with a member from the laminate with an electronic device, preferably, an interfacial peeling starting silicone resin layer and the glass substrate. 例如,在图1的(A)中的玻璃基板16和有机硅树脂层14的界面插入锐利的刀具状物体,赋予剥离的起点。 For example, the interface between the glass substrate 16 in FIG. (A) 1 in the silicone resin layer 14 and the insertion tool like a sharp object, given the peeling starting point.

[0038] 接着,如图1的(B)所示那样,进行带有机硅树脂层的支撑基材20和电子设备22的分离。 [0038] Next, as shown in FIG. 1 (B) as shown, for supporting substrate 20 and the electronic device having a silicone resin layer 22 is separated. 此时,对有机硅树脂层14和玻璃基板16的剥离界面的边界线即剥离线供给溶解度参数超过10的有机溶剂或该有机溶剂和水的混合溶液(将它们统称为溶液24)。 At this time, i.e., the release of more than 10 line feeding a solubility parameter of the organic solvent or a mixed solution of an organic solvent and water to the boundary line 14 and the glass substrate interface peeling the silicone resin layer 16 (collectively referred to as 24 solution).

[0039] 图2的㈧和图2的⑶示出图1的⑶的状态的立体截面图和顶视图,示出了剥离线X (剥离边界线)。 [0039] (viii) of FIG. 2 and FIG. 2 shows a state ⑶ ⑶ FIG. 1 is a top perspective view and a cross-sectional view showing a peeling line X (peeling boundary line). 剥离线X为表示有机硅树脂层14和玻璃基板16没有被剥离的部分与有机硅树脂层14和玻璃基板16被剥离的部分的边界的线。 Line X represents the release line 14 is the silicone resin layer 14 and the glass substrate 16 is not peeled portion of the silicone resin layer and the peeled portion of the boundary of the glass substrate 16. 如图2的(A)和图2的(B)所示那样,边提起电子设备22的一端侧边进行剥离时,剥离线X从电子设备的一端侧向另一端侧(从图2的⑶的右侧起向左侧)移动。 FIG When (A) and 2 (B), as shown in FIG. 2, lift the side edge 22 of the electronic device side peeling, the peeling line X from one end toward the other end of the electronic device (in FIG. 2 ⑶ from the right to left) moves.

[0040] 作为对剥离线供给的有机溶剂,使用溶解度参数(SP值:cal/cm3)超过10的有机溶剂。 [0040] Examples of the organic solvent supply line to release, a solubility parameter (SP value: cal / cm3) the organic solvent exceeds 10. 其中,在有机硅树脂层和玻璃基板的剥离更良好地进行的方面,有机溶剂的溶解度参数优选为11以上。 Wherein, in the release silicone resin layer and the glass substrate is carried out more favorably, the solubility parameter of the organic solvent is preferably 11 or more. 上限没有特别限制,从湿润性的方面出发,通常优选为23以下。 The upper limit is not particularly limited, from the viewpoint of wettability, is usually preferably 23 or less.

[0041] 有机溶剂可以仅使用1种也可以组合使用2种以上。 [0041] The organic solvents may be used singly or in combination of two or more.

[0042] 需要说明的是,溶解度参数(δ)是指,将有机溶剂的每1摩尔的蒸发热设为Δ H (cal/mol)、摩尔体积设为V (cm3 · mol)时由δ= (Δ H/V)1/2所定义的值。 [0042] Incidentally, solubility parameter ([delta]) refers to the evaporation heat per mole of organic solvent is defined as Δ H (cal / mol), is set to the molar volume V (cm3 · mol) of δ = (Δ H / V) 1/2 defined value.

[0043] 另外,有机溶剂相对于后述有机硅树脂层的接触角没有特别限制,在有机硅树脂层和玻璃基板的剥离更良好地进行的方面,优选为90°以下。 [0043] Further, the contact angle of the silicone resin layer will be described later with respect to the organic solvent is not particularly limited in terms of peeling the silicone resin layer and the glass substrate is more satisfactorily performed, preferably 90 ° or less.

[0044] 需要说明的是,接触角的测定方法如下:使用协和界面科学株式会社制造的PCA-1,将液滴的滴加量设为1μ 1,在23 °C下对每1个样品面滴加5点,测定滴加60秒后的接触角。 [0044] Incidentally, the contact angle measurement method is as follows: using the PCA-1 manufactured by Kyowa Interface Science Co., a dropping amount of the droplet to 1μ 1, at 23 ° C for one sample for each surface dropwise 5:00, the measured contact angle after dropwise addition of 60 seconds. 将去除了5点的接触角中的最大值、最小值的各1点后的3点的接触角的平均值作为接触角求出。 In addition to the maximum value of the contact angle in the 5:00, 3:00 average contact angle of each of the minimum contact angle is determined as 1:00.

[0045] 另外,作为对剥离线供给的溶液,还可以举出:溶解度参数超过10的有机溶剂和水的混合溶液。 [0045] Further, as a solution to release the supply lines, further include: a solubility parameter exceeds a mixed solution of water and an organic solvent 10. 有机溶剂的定义如上所述。 The organic solvent defined as described above.

[0046] 混合溶液中的有机溶剂的含量没有特别限制,在有机硅树脂层和玻璃基板的剥离更良好地进行的方面,相对于混合溶液总量,优选为10质量%以上,更优选为20质量%以上。 [0046] The content of the organic solvent in the mixed solution is not particularly limited in terms of peeling the silicone resin layer and the glass substrate is more favorably carried out with respect to the total amount of the mixed solution is preferably 10 mass% or more, more preferably 20 mass% or more. 上限没有特别限制。 The upper limit is not particularly limited.

[0047] 作为有机溶剂的优选方案,在有机硅树脂层和玻璃基板的剥离更良好地进行的方面,可以举出:满足上述溶解度参数的、任选具有卤原子的醇类溶剂或非质子性极性溶剂。 [0047] As a preferable embodiment of the organic solvent, in the silicone resin layer peeling and the glass substrate is more satisfactorily performed may include: a solubility parameter satisfying the above, optionally with an alcohol or aprotic solvent, a halogen atom polar solvents.

[0048] 作为醇类溶剂,在有机硅树脂层和玻璃基板的剥离更良好地进行的方面,可以优选举出碳数1〜6的醇类溶剂,更优选为碳数1〜3的醇类溶剂。 [0048] Examples of the alcohol solvent, in the silicone resin layer peeling and the glass substrate to perform better and to be preferred solvents include alcohols having a carbon number of 1~6, and more preferably an alcohol having a carbon number of 1 ~ 3 solvent. 具体而言,可以举出:乙醇、丙醇、丁醇、戊醇、己醇等。 Specific examples include: ethanol, propanol, butanol, pentanol, hexanol and the like. 需要说明的是,醇类溶剂可以为直链状、支链状、环状的任意种。 Incidentally, an alcohol solvent may be linear, branched, cyclic any species.

[0049] 另外,醇类溶剂中也可以包含卤原子。 [0049] Further, the alcohol solvent may also contain a halogen atom. 即,也可以为氢原子被卤原子取代而得的醇类溶剂。 I.e., may also be substituted by a halogen atom, a hydrogen atom is an alcoholic solvent. 作为卤原子,可以举出:氟原子、溴原子、碘原子等。 Examples of the halogen atom include: fluorine atom, bromine atom, iodine atom and the like.

[0050] 作为非质子性极性溶剂,可以举出:二甲基甲酰胺(DMF)、N,N_二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)、环丁砜或乙腈等。 [0050] Examples of the aprotic polar solvents include: dimethylformamide (DMF), N, N_-dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), N- methyl pyrrolidone (NMP), sulfolane, acetonitrile and the like.

[0051] 有机溶剂或混合溶液的供给方法没有特别限制,可以举出:使用注射器等对剥离线直接供给有机溶剂或混合溶液的方法;利用喷雾器对剥离线吹送有机溶剂或混合溶液的方法等。 [0051] The method of supplying an organic solvent or a mixed solution is not particularly limited, and can include: using a method such as a syringe to the line of peel organic solvent or a mixed solution supplied directly; blown line using a nebulizer to release an organic solvent or a solution mixing method and the like.

[0052] 另外,一旦对剥离线供给有机溶剂或混合溶液,伴随着有机硅树脂层和玻璃基板的剥离而剥离线移动时,有机溶剂或混合溶液也由于毛细管现象而沿着剥离线移动,因此, 有机硅树脂层和玻璃基板的剥离容易继续进行。 [0052] Further, an organic solvent or a mixed solution once the supply of the release line, accompanied by peeling the silicone resin layer and the glass substrate while peeling the line moves, a mixed solution of an organic solvent, or also by a capillary phenomenon moved along the release line, and therefore peeling the silicone resin layer and the glass substrate tends to proceed. 另外,也可以在剥离进行中,对剥离线连续地供给有机溶剂或混合溶液。 Further, the peeling may be carried out in an organic solvent or a mixed solution is continuously fed to the line of peel.

[0053] 需要说明的是,有机溶剂或混合溶液的供给量没有特别限制,只要供给覆盖剥离线的程度的量即可。 [0053] Incidentally, the supply amount of the organic solvent or a mixed solution is not particularly limited, as long as the extent of the amount of supply lines to cover stripping.

[0054] 进行带有机硅树脂层的支撑基材20和电子设备22的分离的方法没有特别限制,可以使用公知的方法。 [0054] The supporting substrate 20 and the electronic device having a silicone resin layer 22 of the separation method is not particularly limited, and a known method may be used.

[0055] 例如,以带电子设备用构件的层叠体10的支撑基材12成为上侧、电子设备用构件18侧成为下侧的方式设置在平台上,使电子设备用构件18侧真空吸附于平台上,在该状态下首先使刀具侵入到有机硅树脂层14-玻璃基板16的界面。 Supporting substrate [0055] For example, an electronic device with a tape member 12 of the laminated body 10 on the upper side, the electronic device 18 side becomes a member disposed at the lower side of the platform, so that the electronic equipment-side member 18 by vacuum suction on the platform, in this state, the tool is first invade into the interface of the silicone resin layer 14- glass substrate 16. 然后,之后将支撑基材12侧用多个真空吸盘吸附,从插入了刀具的位置附近起依次使真空吸盘上升。 Then, after the suction side of the support base 12 with a plurality of vacuum suction cups, from a position near the insertion tool successively increase the vacuum chuck.

[0056] 通过实施上述处理,如图1的(C)所示那样,可以将带电子设备用构件的层叠体10 分离成带有机硅树脂层的支撑基材20和电子设备22。 [0056] separated into a supporting substrate with a silicone resin layer 20 and the electronic device 1 of the laminate (C) as an electronic device may be used with member 10 of the illustrated embodiment of the above process 22, as shown in FIG.

[0057] 需要说明的是,在带有机硅树脂层的支撑基材20上层叠新的玻璃基板16和电子设备用构件18,可以作为带电子设备用构件的玻璃层叠体10再利用。 [0057] Incidentally, the laminated glass substrate 16 and the new electronic equipment member 18 on a supporting substrate with a silicone resin layer 20, the glass laminate can be used as an electronic device with a member 10 for reuse.

[0058] 另外,作为由上述方法制造的电子设备22 (包含玻璃基板16和电子设备用构件18 的层叠体),可以作为具有玻璃基板和显示装置用构件的显示装置用面板、具有玻璃基板和太阳能电池用构件的太阳能电池、具有玻璃基板和薄膜二次电池用构件的薄膜二次电池、 具有玻璃基板和电子设备用构件的电子部件等使用。 [0058] Further, an electronic device 22 manufactured by the above method (comprising a glass substrate laminate 16 and the electronic equipment member 18), can be panels, a glass substrate as a display device having a glass substrate and a display apparatus member and a solar cell of the solar cell member, a glass substrate and a thin film secondary battery, the secondary battery of the member, with the use of electronic components and electronic equipment glass substrate member. 作为显示装置用面板,包括:液晶面板、有机EL面板、等离子体显示器面板、场发射面板等。 Panel as a display device, comprising: a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel.

[0059] 需要说明的是,作为电子设备的更具体的例子,进行后述的构件形成工序中所述的TFT-LCD的制造的情况下,可以得到图3的㈧所示的液晶面板。 [0059] Incidentally, as a more specific example of an electronic device, components to be described later is formed in the case of the manufacturing step of the TFT-LCD can be obtained a liquid crystal panel shown in FIG. 3 (viii). 图3的㈧所示的液晶面板80由TFT基板82、CF基板84和液晶层86等构成。 (Viii) the liquid crystal panel shown in FIG. 3 is constituted by a TFT substrate 80 of 82, CF substrate 84 and a liquid crystal layer 86 and the like. TFT基板82是在玻璃基板16上图案形成TFT元件(薄膜晶体管)83等而成的。 The TFT substrate 82 is a pattern of a TFT element (thin film transistors) 83, etc. formed on the glass substrate 16. CF基板84是在玻璃基板16上图案形成滤色器元件85而成的。 CF substrate 84 is formed a pattern of color filter elements 85 formed on the glass substrate 16. TFT基板82和CF基板84也相当于上述电子设备。 TFT substrate 82 and the CF substrate 84 also corresponds to the electronic device.

[0060] 另外,作为电子设备的其他具体的例子,可以举出图3的(B)所示的电子纸。 [0060] Further, as other specific examples of electronic devices include (B) the electronic paper 3 shown in FIG. 图3的⑶中,电子纸90例如由玻璃基板16、TFT层92、包含电气工程学介质(例如微囊)的层94、透明电极96和前面板98构成。 ⑶ FIG. 3, the electronic paper 90, for example, a glass substrate 16, TFT layer 92, dielectric layer 94 comprises electrical engineering (e.g., microcapsules) of the transparent electrodes 96 and 98 constituting the front panel. 由TFT层92、电气工程学介质的层94和透明电极96等构成电子纸元件91。 Of 92, the transparent electrode layer 94 and the layer 96 TFT electrical engineering medium like an electronic paper element 91. 电子纸元件可以为微囊型、面内型、扭转球型、颗粒移动型、电子喷流型、聚合物网络型中的任意种。 The electronic component may be a microcapsule type paper, inner face, twisting ball type, particle movement type, electron spray pattern, any type of network polymers.

[0061] 以下记载上述使用的带电子设备用构件的层叠体10的各构成(支撑基材12、有机硅树脂层14、玻璃基板16、电子设备用构件18)的说明以及带电子设备用构件的层叠体10的制造方法。 DESCRIPTION laminate [0061] The following describes an electronic device with the above-described member for use in each component 10 (a support base 12, the silicone resin layer 14, a glass substrate 16, the electronic device member 18) and with the electronic device member a method for producing a laminated body 10.

[0062] 需要说明的是,支撑基材12和有机硅树脂层14的界面具有剥离强度(X),对支撑基材12和有机硅树脂层14的界面施加超过剥离强度(X)的、剥离方向的应力时,支撑基材12和有机硅树脂层14的界面发生剥离。 [0062] Incidentally, the interface 12 and the supporting substrate 14, the silicone resin layer having a peel strength (X), is applied over the peel strength (X) on the support base 12 and interfaces the silicone resin layer 14, peeling when the stress direction, the interface 12 and the supporting substrate 14. the silicone resin layer peeled off. 有机硅树脂层14和玻璃基板16的界面具有剥离强度(y), 对有机硅树脂层14和玻璃基板16的界面施加超过剥离强度(y)的、剥离方向的应力时,有机硅树脂14层和玻璃基板16的界面发生剥离。 When the interface silicone resin layer 14 and the glass substrate 16 having a peel strength (y), a stress is applied over the peeling, the peeling direction strength (y) of the interface of the silicone resin layer 14 and the glass substrate 16, the silicone resin 14 layer 16 and the glass substrate interface peeling occurs.

[0063] 带电子设备用构件的层叠体10中,通常优选上述剥离强度(X)高于上述剥离强度(y)。 The laminate [0063] Electronic equipment with member 10, is generally preferable that the peel strength (X) exceeds the above peel strength (y). 如果为该方案,则对带电子设备用构件的层叠体10施加剥离支撑基材12和玻璃基板16 的方向的应力时,本发明的带电子设备用构件的玻璃层叠体10在有机硅树脂层14和玻璃基板16的界面发生剥离,更容易分离为电子设备22和带有机硅树脂层的支撑基材20。 If for the program, the stress is applied in directions 16 and 12 of the glass substrate laminate release tape support base member 10 of the electronic device, an electronic device with a glass laminate member of the present invention is a silicone resin layer 10 interface 14 and the glass substrate 16 is peeled off, is easier to separate the electronic device 22 and supporting substrate 20 with a silicone resin layer.

[0064] 优选剥离强度(X)与剥离强度(y)相比足够高。 [0064] Preferably the peel strength (X) and the peel strength (y) is sufficiently high compared. 提高剥离强度(X)是指,提高有机硅树脂层14对支撑基材12的附着力,且在加热处理后能够维持与对玻璃基板16的附着力相比相对更高的附着力。 Improve the peel strength (X) refers to improve the adhesion of the silicone resin layer 14 pairs of support base 12, and can maintain adhesion to the glass substrate 16 as compared to a relatively higher adhesion after heat treatment.

[0065] 为了提高有机硅树脂层14对支撑基材12的附着力,例如优选的是,在支撑基材12 上使交联性有机聚硅氧烷交联固化而形成有机硅树脂层14。 [0065] In order to improve the adhesion of the silicone resin layer 14 of support substrate 12, preferably, for example, the supporting substrate 12 in the crosslinkable organopolysiloxane crosslinked and cured silicone resin layer 14 is formed. 可以利用交联固化时的粘接力来形成以高结合力结合于支撑基材12的有机硅树脂层14。 It may be formed in the silicone resin layer 1412 at a high bonding force binding the substrate to the support by an adhesive force of crosslinking.

[0066] 另一方面,交联固化后的交联性有机聚硅氧烷的固化物对玻璃基板16的结合力低于上述交联固化时产生的结合力是通常例子。 [0066] On the other hand, the crosslinking crosslinkable organopolysiloxane cured product of the bonding strength of the glass substrate 16 is lower than the binding force of the above-described crosslinking is generally an example. 因此,优选在支撑基材12上使交联性有机聚硅氧烷交联固化而形成有机硅树脂层14,之后在有机硅树脂层14的表面上层叠玻璃基板16。 Accordingly, it is preferable that the crosslinked organopolysiloxane crosslinked and cured on a supporting substrate 12 and the silicone resin layer 14 is formed on the surface after the silicone resin layer 14 of the laminated glass substrate 16.

[0067] [支撑基材] [0067] [supporting substrate]

[0068] 支撑基材12支撑玻璃基板16而进行加强,防止后述的构件形成工序(制造电子设备用构件的工序)中制造电子设备用构件时玻璃基板16的变形、划伤、破损等。 [0068] The supporting glass substrate 12 and the substrate 16 to reinforce the support, to prevent the member after said forming step (a member of the electronic device manufacturing process) for producing an electronic device in deformation member 16 of the glass substrate, scratches and breakage.

[0069] 作为支撑基材12,例如可以使用:玻璃板、塑料板、SUS板等金属板等。 [0069] 12 as, for example, using a supporting base material: glass plate, a plastic plate, the SUS plate or the like. 通常,后述的构件形成工序伴随热处理,因此,支撑基材12优选由与玻璃基板16的线膨胀系数之差小的材料形成,更优选由与玻璃基板16同样的材料形成,支撑基材12优选为玻璃板。 Typically, the member to be described later is formed along the heat treatment step, therefore, the supporting substrate 12 is preferably formed from a material of the glass substrate 16 small difference in coefficient of linear expansion, more preferably the same material as the glass substrate 16 is formed, the supporting substrate 12 preferably a glass plate. 支撑基材12 特别优选为由与玻璃基板16相同的玻璃材料形成的玻璃板。 Particularly preferred support base 12 is formed by a glass plate in the same glass material of the glass substrate 16.

[0070] 支撑基材12的厚度可以比玻璃基板16厚,也可以比玻璃基板16薄。 [0070] The thickness of the support substrate 12 may be thicker than the glass substrate 16, 16 may be thinner than the glass substrate. 优选的是,基于玻璃基板16的厚度、有机硅树脂层14的厚度来选择支撑基材12的厚度。 Preferably, the thickness of the support base 12 is selected based on the thickness, the silicone resin layer 14 of the glass substrate 16. 例如,现行的构件形成工序是以处理厚度〇.5mm的基板的方式而设计的,玻璃基板16的厚度和有机硅树脂层14 的厚度之和为0. Imm时,将支撑基材12的厚度设为0.4_。 For example, the existing member is formed by way of a step of processing the substrate thickness 〇.5mm designed, the thickness of the silicone resin layer and the glass substrate 16 and the thickness 14 is 0. Imm, thickness of the substrate 12 of the support set 0.4_. 支撑基材12的厚度在通常情况下优选为〇. 2〜5.0mm。 Thickness of the support base 12 is preferably square. 2~5.0mm under normal conditions.

[0071] 支撑基材12为玻璃板的情况下,出于容易操作、难以破裂等理由,玻璃板的厚度优选为0.08mm以上。 [0071] The case where the supporting substrate is a glass plate 12, for ease of operation, it is difficult to rupture reason, the thickness of the glass plate is preferably 0.08mm or more. 另外,在电子设备用构件形成后剥离时,出于期望不破裂而适度弯曲那样的刚性的理由,玻璃板的厚度优选为I .Omm以下。 Further, after peeling member is formed with an electronic device, it is not desirable for the breaking and moderate flexural rigidity that reason, the thickness of the glass plate is preferably I .Omm less.

[0072] 支撑基材12和玻璃基板16的25〜300°C的平均线膨胀系数之差优选为500 X HT7/ °c以下,更优选为300 X 10—v°c以下,进一步优选为200 X 10—v°c以下。 [0072] 12 and the average linear coefficient of the glass substrate 25~300 ° 16 C-supporting substrate expansion difference is preferably 500 X HT7 / ° c or less, more preferably 300 X 10-v ° c or less, more preferably 200 X 10-v ° c or less. 差过大时,后述的构件形成工序中的加热冷却时,支撑基材12和玻璃基板16有可能会剥离等。 When the difference is too large, the heating member described later is formed in the cooling step, the glass substrate 12 and the support substrate 16 is likely to peel off and the like. 支撑基材12的材料与玻璃基板16的材料相同时,可以抑制产生这样的问题。 The material of the supporting substrate 12 and the glass substrate 16 of the same, such a problem can be suppressed.

[0073] [有机硅树脂层] [0073] [silicone resin layer]

[0074] 有机硅树脂层14防止玻璃基板16的位置偏移直至进行将带有机硅树脂层的支撑基材20与电子设备22分离的操作为止,并且防止玻璃基板16等由于分离操作而破损。 [0074] silicone resin layer 14 prevents the glass substrate 16 is shifted until the position for the supporting substrate with a silicone resin layer 20 and separated from the electronic device 22 takes place, and to prevent the glass substrate 16 and the like due to the separation operation damaged. 有机硅树脂层14的与玻璃基板16接触的表面14a可剥离地密合于玻璃基板16的第1主表面16a。 Surface in contact with the glass substrate 16 silicone resin layer 14 is releasably adhered 14a bonded to the glass substrate 16 of the first main surface 16a. 有机硅树脂层14与玻璃基板16的第1主表面16a以弱的结合力结合,优选该界面的剥离强度(y)低于有机硅树脂层14和支撑基材12之间的界面的剥离强度(X)。 14 silicone resin layer 16a with a weak binding force and binding the first main surface of the glass substrate 16, the peel strength (y) is preferably less than the peel strength of the interface 12 is the interface between the silicone resin layer 14 and the supporting substrate (X).

[0075] S卩,将玻璃基板16和支撑基材12分离时,优选的是,在玻璃基板16的第1主表面16a 和有机硅树脂层14的界面发生剥离,在支撑基材12和有机硅树脂层14的界面难以剥离。 [0075] S Jie, separating the glass substrate 16 and the supporting substrate 12, it is preferable that peeling occurs at the interface between the first main surface 16a and the silicone resin layer 14 of the glass substrate 16, supporting substrate 12 and the organic interface between the silicon resin layer 14 is difficult to peel off. 该优选方案中,具有虽然有机硅树脂层14与玻璃基板16的第1主表面16a密合、但能够容易地剥离玻璃基板16的表面特性。 In the preferred embodiment, although the surface properties having the silicone resin layer 14 and the first main surface 16a of the adhesion of the glass substrate 16, but can be easily peeled off the glass substrate 16. 即,有机硅树脂层14相对于玻璃基板16的第1主表面16a以一定程度的结合力结合而防止玻璃基板16的位置偏移等,同时以在剥离玻璃基板16时能够容易地剥离而不会破坏玻璃基板16的程度的结合力结合。 That is, the silicone resin layer 14 with respect to the first main surface 16a of the glass substrate 16 in combination with a certain degree of binding force to prevent the positional displacement of the glass substrate 16 while being able to be easily peeled off when peeling the glass substrate 16 without degree of damage of the glass substrate 16 will bind binding force. 将该有机硅树脂层14表面的能够容易剥离的性质称为剥离性。 The properties of the silicone resin layer 14 can be easily peeled surface referred releasability. 另一方面,支撑基材12的第1主表面和有机硅树脂层14以相对难以剥离的结合力结合。 On the other hand, the first main surface of the supporting substrate 12 and the silicone resin layer 14 joined to the binding force is relatively difficult to peel.

[0076] 需要说明的是,有机硅树脂层14和玻璃基板16的界面的结合力在玻璃基板16的表面(第2主表面16b)上形成电子设备用构件的前后可以发生变化(S卩,剥离强度(X)、剥离强度(y)可以发生变化)。 [0076] Incidentally, before and after the electronic equipment member binding force of the interface of the silicone resin layer 14 and the glass substrate 16 is formed changes (S Jie may occur on the surface (the second main surface 16b) of the glass substrate 16, The peel strength (X), the peel strength (y) may vary). 然而,优选即使在形成电子设备用构件后剥离强度(y)也低于剥离强度(X)。 Preferably, however, even if the peel strength is formed (y) after the electronic device is lower than the peeling strength member (X).

[0077] 有机硅树脂层14和玻璃基板16的层优选以弱的粘接力、起因于范德华力的结合力结合。 [0077] The layer of the silicone resin layer 14 and the glass substrate 16 is preferably a weak adhesive force, the binding force due to van der Waals forces in combination. 可以认为,形成有机硅树脂层14后在其表面上层叠玻璃基板16的情况下,有机硅树脂层14的有机硅树脂以不显示出粘接力的程度充分交联时,以起因于范德华力的结合力结合。 It is believed that the silicone resin layer 14 is formed on the surface thereof in the case of the laminated glass substrate 16, a silicone resin, a silicone resin layer 14 so as not to exhibit sufficient adhesive force when the degree of crosslinking due to van der Waals forces to the combined force combined. 然而,有机硅树脂层14的有机硅树脂具有一定程度的弱的粘接力的情况不少。 However, a silicone resin, the silicone resin layer 14 having a number of cases a degree of weak adhesive force. 认为即使为粘接性极低的情况,形成电子设备用构件时,通过加热操作等,有机硅树脂层14的有机硅树脂也与玻璃基板16表面粘接,有机硅树脂层14和玻璃基板16的层之间的结合力上升。 Even when the adhesive is low, the electronic device member that is formed by the heating operation or the like, a silicone resin, a silicone resin layer 14 is also adhered to the surface of the glass substrate 16, the silicone resin layer 14 and the glass substrate 16 bonding force between the layers increases.

[0078] 根据情况,也可以对层叠前的有机硅树脂层14的表面、层叠前的玻璃基板16的第1 主表面16a进行减弱两者之间的结合力的处理而层叠。 [0078] According to circumstances, the processing may be performed between the two weakened binding force to the surface of the silicone resin layer 14 prior to lamination of the first main surface 16a of the front glass substrate 16 are laminated laminate. 通过对层叠的表面进行非粘接性处理等,之后进行层叠,可以减弱有机硅树脂层14和玻璃基板16的层的界面的结合力,降低剥离强度(y)。 By non-adhesive treatment on the surface of the other laminated, followed by laminating, bonding force can be weakened interfacial layer of silicone resin layer 14 and the glass substrate 16, reducing the peel strength (y).

[0079] 另外,有机硅树脂层14优选以粘接力、粘合力等强的结合力与支撑基材12表面结合。 [0079] Further, the silicone resin layer 14 is preferably joined to the surface of strong binding force and adhesive force of the supporting substrate 12, the adhesive force and the like. 例如,如上述那样,通过使交联性有机聚硅氧烷在支撑基材12表面进行交联固化,可以将作为交联物的有机硅树脂粘接到支撑基材12表面,得到高的结合力。 For example, as described above, by making the crosslinked organopolysiloxane on the support surface of the substrate 12 for crosslinking and curing, the silicone resin may be a crosslinked adhesive to the surface of the supporting substrate 12, to obtain a high binding force. 另外,可以实施使支撑基材12表面和有机硅树脂层14之间产生强的结合力的处理(例如,使用偶联剂的处理)而提高支撑基材12表面和有机硅树脂层14之间的结合力。 Further, the surface 12 may be embodied so that the supporting substrate and the silicone resin layer 14 between the generation processing (e.g., processing using a coupling agent) strong binding force to improve the surface of the supporting substrate 12 and the silicone resin layer 14 between the binding force.

[0080] 有机硅树脂层14和支撑基材12的层以高的结合力结合是指,两者的界面的剥离强度(X)高。 [0080] The silicone resin layer 14 and the supporting substrate layer 12 at a high binding means binding strength, peel strength at the interface between the two (X) is high.

[0081] 有机硅树脂层14的厚度没有特别限定,优选为2〜ΙΟΟμπι,更优选为3〜50μπι,进一步优选为7〜20μπι。 [0081] The thickness of the silicone resin layer 14 is not particularly limited, but preferably 2~ΙΟΟμπι, more preferably 3~50μπι, more preferably 7~20μπι. 有机硅树脂层14的厚度为这样的范围时,有机硅树脂层14和玻璃基板16 之间即使存在气泡、杂质,也可以抑制玻璃基板16的变形缺陷的发生。 The thickness of the silicone resin layer 14 such a range, even if the bubbles and impurities between the silicone resin layer 14 and the glass substrate 16, deformation can be suppressed defects of the glass substrate 16. 另外,有机硅树脂层14的厚度过厚时,形成需要时间和材料,因此是不经济的,有时耐热性降低。 Further, when the thickness of the silicone resin layer 14 is too thick, which requires time and material, and therefore is not economical, the heat resistance decreases. 另外,有机硅树脂层14的厚度过薄时,有时有机硅树脂层14和玻璃基板16的密合性降低。 Further, when the thickness of the silicone resin layer 14 is too small, sometimes silicone resin layer 14 and the adhesion between the glass substrate 16 is reduced.

[0082] 需要说明的是,有机硅树脂层14可以由2层以上形成。 [0082] Incidentally, the silicone resin layer 14 may be formed of two or more layers. 这种情况下,“有机硅树脂层14的厚度”是指全部层的总厚度。 In this case, "thickness of the silicone resin layer 14" refers to the total thickness of all the layers.

[0083] 另外,有机硅树脂层14由2层以上形成时,也可以由形成各层的树脂不同的交联有机硅树脂形成。 [0083] Further, when the silicone resin layer 14 is formed of two or more layers may be composed of different layers of resin crosslinked silicone resin forming.

[0084] 有机硅树脂层14中所包含的有机硅树脂为交联性有机聚硅氧烷的交联物,有机硅树脂优选形成三维网状结构。 [0084] The silicone resin is a silicone resin layer 14 is included in the crosslinkable organopolysiloxane crosslinked silicone resin is preferably a three-dimensional network structure.

[0085] 交联性有机聚硅氧烷的种类没有特别限制,只要通过规定的交联反应进行交联固化而成为构成有机硅树脂的交联物(固化物)即可,对其结构没有特别限定,只要具有规定的交联性即可。 [0085] The cross-linked type organopolysiloxane is not particularly limited so long as to become crosslinked (cured) silicone resin constituting the crosslinked cured by crosslinking reaction can be predetermined, its structure is not particularly is defined, as long as having a crosslinkable predetermined. 交联的形式没有特别限制,可以根据交联性有机聚硅氧烷中所包含的交联性基团的种类而采用适当公知的形式。 Crosslinked form is not particularly limited, depending on the type of crosslinkable groups crosslinkable organopolysiloxane contained in the appropriate form known. 例如,可以举出:氢化硅烷化反应、缩合反应或加热处理、高能量射线处理或利用自由基聚合引发剂的自由基反应等。 For example, there may be mentioned: a hydrosilylation reaction, condensation reaction or the heating treatment, or treatment using a high energy beam radical polymerization initiator of radical reactions.

[0086] 更具体而言,交联性有机聚硅氧烷具有烯基或炔基等自由基反应性基团时,通过介由上述自由基反应的自由基反应性基团彼此的反应发生交联而成为固化物(交联有机硅树脂)。 [0086] More specifically, when the crosslinkable organopolysiloxane having alkenyl or alkynyl radicals such as reactive group, the cross occurs via a radical by reactive group react with each other the radical reaction linking becomes cured (cross-linked silicone resin).

[0087] 另外,交联性有机聚硅氧烷具有硅烷醇基时,通过硅烷醇基彼此的缩合反应发生交联而成为固化物。 [0087] Further, when the crosslinkable organopolysiloxane having silanol groups, crosslinking takes place by condensation reaction between silanol groups and become cured.

[0088] 进而,交联性有机聚硅氧烷包含具有与硅原子键合的烯基(乙烯基等)的有机聚硅氧烷(即,有机烯基聚硅氧烧)和具有与硅原子键合的氢原子(氢化硅烷基)的有机聚硅氧烷(即,有机氢聚硅氧烷)时,在氢化硅烷化催化剂(例如,铂系催化剂)的存在下,通过氢化硅烷化反应发生交联而成为固化物。 [0088] Further, the crosslinkable organopolysiloxane containing an alkenyl group (vinyl group) organopolysiloxane bonded to the silicon atom (i.e., an organic silicone alkenyl burn) having a silicon atom when bonded hydrogen atoms (hydrosilyl groups) in the organopolysiloxane (i.e., an organohydrogenpolysiloxane), in the presence of a hydrosilylation catalyst (e.g., platinum catalyst), by hydrosilylation reaction crosslinking becomes cured.

[0089] 其中,在有机硅树脂层14的形成容易、且玻璃基板的剥离性更优异的方面,优选交联性有机聚娃氧烧包含在两末端和/或侧链具有稀基的有机聚娃氧烧(以后,也适当称为有机聚硅氧烷A)和在两末端和/或侧链具有氢化硅烷基的有机聚硅氧烷(以后,也适当称为有机聚硅氧烷B)的方案。 [0089] wherein the silicone resin layer 14 is formed is easily peeled off the glass substrate and the superior aspect, preferably the crosslinkable organopolysiloxane comprises a lean burn baby oxide groups at both terminals and / or side chain of organopolysiloxane baby burning oxygen (hereinafter, also appropriately referred to as organopolysiloxane a), and at both ends and / or side chain organopolysiloxane having a hydrosilyl group (hereinafter, also appropriately referred to as organopolysiloxane B) program.

[0090] 需要说明的是,作为烯基,没有特别限定,例如可以举出:乙烯基(次乙基)、烯丙基(2-丙烯基)、丁烯基、戊烯基、己烯基等,其中,从耐热性优异的方面出发,优选为乙烯基。 [0090] Incidentally, the alkenyl group is not particularly limited, and examples thereof include: vinyl (ethenyl), allyl (2-propenyl), butenyl, pentenyl, hexenyl among these, from the excellent heat resistance, preferably a vinyl group.

[0091] 另外,作为有机聚硅氧烷A中所包含的烯基以外的基团和有机聚硅氧烷B中所包含的氢化硅烷基以外的基团,可以举出烷基(特别是碳数4以下的烷基)。 [0091] In addition, groups other than the group and a hydrosilyl group B as the organopolysiloxane an organopolysiloxane other than alkenyl groups contained in A contained, include an alkyl group (particularly carbon an alkyl group having 4 or less).

[0092] 有机聚硅氧烷A中的烯基的位置没有特别限制,有机聚硅氧烷A为直链状的情况下,烯基可以存在于下述所示的M单元和D单元中的任一者,也可以存在于M单元和D单元这两者。 [0092] A position of the organopolysiloxane of the alkenyl group is not particularly limited, the organopolysiloxane A is a linear, alkenyl groups may be present in D units and M units shown below in either one may also be present in both the D units and M units. 从固化速度的方面出发,优选至少存在于M单元,优选存在于2个M单元的两者中。 In terms of curing speed, it is preferable that at least the M unit, preferably M 2 is present in both the units.

[0093] 需要说明的是,M单元和D单元是有机聚娃氧烧的基本结构单元的例子,M单元是指键合有3个有机基团的1官能性的硅氧烷单元,D单元是指键合有2个有机基团的2官能性的硅氧烷单元。 [0093] Incidentally, M and D units are units example of the basic structure of the organic baby polyethylene oxide burn units, M units are bonded thereto a bifunctional siloxane unit 3 organic groups, D units It means bonded to a bifunctional siloxane unit 2 2 organic groups. 硅氧烷单元中,硅氧烷键为2个硅原子借助1个氧原子键合而成的键,因此,硅氧烷键中的每1个硅原子中的氧原子视为1 /2个,式中表现为Ov2。 Siloxane units, the siloxane bond two silicon atoms by means of an oxygen atom bonded to each key, therefore, the oxygen atom of a siloxane bond per 1 silicon atom is regarded as 1/2 , where the performance of Ov2.

Figure CN105432147BD00101

[0095] 有机聚硅氧烧A中的烯基的数量没有特别限制,1分子中优选为1〜3个,更优选为2 个。 Quantity [0095] A organopolysiloxane burning of the alkenyl group is not particularly limited, one molecule is preferably 1 ~ 3, more preferably 2.

[0096] 有机聚娃氧烧B中的氢化娃烧基的位置没有特别限制,有机聚娃氧烧A为直链状的情况下,氢化硅烷基可以存在于M单元和D单元中的任一者,也可以存在于M单元和D单元这两者。 [0096] wa oxygen burning position organopolysiloxane B is hydrogenated baby burn group is not particularly limited, and baby oxygen burning organopolysiloxane A is a linear, hydrosilyl group may be present in D units and M units in any one who may be present in both the D units and M units. 从固化速度的方面出发,优选至少存在于D单元。 In terms of curing speed, it is preferable that at least the D unit.

[0097] 有机聚硅氧烷B中的氢化硅烷基的数量没有特别限制,1分子中优选至少具有3个, 更优选为3个。 [0097] The amount of the organopolysiloxane B is hydrosilyl group is not particularly limited, preferably one molecule having at least 3, more preferably 3.

[0098] 有机聚硅氧烧A和有机聚硅氧烷B的混合比率没有特别限制,优选以有机聚硅氧烷B中的和硅原子键合的氢原子与有机聚硅氧烷A中的全部烯基的摩尔比(氢原子/烯基)变为0.7〜1.05的方式进行调整。 [0098] the mixing ratio of the organopolysiloxane A and burning B organopolysiloxane is not particularly limited, is preferably organopolysiloxane B, and silicon atom-bonded hydrogen atoms in the organopolysiloxane A the molar ratio of total alkenyl groups (hydrogen atom / alkenyl group) becomes embodiment 0.7~1.05 adjusted. 其中,优选以变为0.8〜1.0的方式调整混合比率。 Among them, as to the mixing ratio adjustment becomes 0.8~1.0.

[0099] 作为氢化硅烷化催化剂,优选使用铂族金属系催化剂。 [0099] As the hydrosilylation catalyst, it is preferred to use platinum group metal-based catalyst. 作为铂族金属系催化剂,可以举出:铂系、钯系、铑系等的催化剂,从经济性、反应性的方面出发,特别优选作为铂系催化剂使用。 As the platinum group metal catalyst include: platinum-based catalyst, a palladium, rhodium or the like, from the viewpoint of economy, reactivity, particularly preferably used as the platinum catalyst. 作为铂族金属系催化剂,可以使用公知的物质。 As the platinum group metal-based catalyst, known materials can be used. 具体而言,可以举出:钼微粉、铂黑、氯亚铂酸、氯铂酸等氯铂酸、四氯化铂、氯化铂酸的醇化合物、醛化合物、或铂的烯烃络合物、烯基硅氧烷络合物、羰基络合物等。 Specific examples include: molybdenum powder, platinum black, chloroplatinic acid, platinum alkylene, chloroplatinic acid, chloroplatinic acid, platinum tetrachloride, chloroplatinic acid, an alcohol compound, an aldehyde compound, a platinum-olefin complex, or , alkenylsiloxane complexes, carbonyl complexes.

[0100] 作为氢化硅烷化催化剂的用量,相对于有机聚硅氧烷A和有机聚硅氧烷B的总质量100质量份,优选为0.1〜20质量份,更优选为1〜10质量份。 [0100] The amount of hydrosilylation catalyst with respect to the total parts by mass of an organopolysiloxane, and the organopolysiloxane B A 100 mass, preferably 0.1~20 parts by mass, more preferably 1~10 parts by mass.

[0101] 交联性有机聚硅氧烷的数均分子量没有特别限制,在处理性优异、且成膜性也优异、高温处理条件下的有机硅树脂的分解进一步被抑制的方面,利用GPC (凝胶渗透色谱法) 测定的、聚苯乙烯换算的重均分子量优选为1000〜5000000,更优选为2000〜3000000。 [0101] organopolysiloxane cross-linking a number average molecular weight is not particularly limited, and is excellent in handling properties, and also excellent in film-forming property, the silicone resin decomposition aspect under conditions of high temperature treatment is further suppressed by GPC ( , and the polystyrene equivalent by gel permeation chromatography) measurement 1000~5000000 average molecular weight of, more preferably 2000~3000000.

[0102] 交联性有机聚硅氧烷的粘度优选为10〜5000mPa · s,更优选为15〜3000mPa · s。 [0102] The crosslinkable organopolysiloxane preferably has a viscosity 10~5000mPa · s, more preferably 15~3000mPa · s.

[0103] 另外,对于交联性有机聚硅氧烷的具体市售的商品名或型号,作为不具有芳香族基团的交联性有机聚硅氧烷,可以举出:KNS-320A、KS-847 (均为Shin-Etsu SiIicone株式会社制造)、TPR6700 (Momentive Performance Materials Japan合同会社制造)、乙稀基有机硅“8500”(荒川化学工业株式会社制造)和甲基氢聚硅氧烷“12031”(荒川化学工业株式会社制造)的组合、乙烯基有机硅“11364”(荒川化学工业株式会社制造)和甲基氢聚硅氧烷“1203Γ (荒川化学工业株式会社制造)的组合、乙烯基有机硅“11365”(荒川化学工业株式会社制造)和甲基氢聚硅氧烷“1203Γ (荒川化学工业株式会社制造)的组合等。 [0103] Further, the crosslinkable organopolysiloxane specific commercial trade name or model number, as the crosslinkable organopolysiloxane having no aromatic groups include: KNS-320A, KS -847 (both Shin-Etsu SiIicone Co., Ltd.), TPR6700 (Momentive Performance Materials Japan contract will be manufactured), ethylene-based silicone "8500" (manufactured by Arakawa chemical industries, Ltd.) and methylhydrogen polysiloxane " 12031 "(manufactured by Arakawa chemical industries, Ltd.), a combination of vinyl silicone" 11364 combination "(manufactured by Arakawa chemical industries, Ltd.) and methylhydrogen polysiloxane" 1203Γ (manufactured by Arakawa chemical industries, Ltd.), and ethylene based silicone "11365" (manufactured by Arakawa chemical industries, Ltd.) and methylhydrogen polysiloxane "composition 1203Γ (manufactured by Arakawa chemical industries, Ltd.) and the like. 作为有机硅树脂,优选为加成反应型有机硅。 As the silicone resin, preferably an addition reaction type silicone. 这是由于,固化反应进行容易,形成有机硅树脂层时剥离性的程度良好,且耐热性也高。 This is because the curing reaction proceeds readily, to form a good releasability of the silicone resin layer extent, and the heat resistance is high. 加成反应型有机硅优选为包含下述线状有机聚硅氧烷(a)和下述线状有机聚硅氧烷(b)的固化性有机硅树脂组合物(线状有机聚硅氧烷(a):每1分子中具有至少2个烯基的线状有机聚硅氧烷。线状有机聚硅氧烷(b):每1分子中具有至少3个与硅原子键合的氢原子、且与硅原子键合的氢原子的至少1个存在于分子末端的硅原子上的线状有机聚硅氧烷。)。 Curable addition reaction type silicone is preferably a linear organic polysiloxane comprising the following (a) and the following linear organopolysiloxane (b) a silicone resin composition (linear organopolysiloxane (a): having per molecule at least two alkenyl groups in the linear organopolysiloxane linear organopolysiloxane (b):. per molecule having at least 3 silicon-bonded hydrogen atoms and at least one end of a molecule present on a silicon atom and a linear silicon atom-bonded hydrogen atoms in organopolysiloxanes.).

[0104] 有机硅树脂层14更优选为通过使该固化性有机硅树脂组合物在支撑基材12的表面固化而形成的固化有机硅树脂层。 [0104] silicone resin layer cured silicone resin layer 14 is more preferably formed by making the curable silicone resin composition is cured at a surface of the supporting substrate 12.

[0105] [玻璃基板] [0105] [glass substrate]

[0106] 对于玻璃基板16,第1主表面16a与有机硅树脂层14相接触,与有机硅树脂层14侧处于相反侧的第2主表面16b设有电子设备用构件。 [0106] For a glass substrate 16, the first main surface 16a in contact with 14 silicone resin layer, and the silicone resin layer 14 side is opposite to the second main surface side of the member 16b is provided with an electronic device.

[0107] 玻璃基板16的种类可以为一般的玻璃基板,例如可以举出:IXD、0LED之类的显示装置用的玻璃基板等。 [0107] kind of a glass substrate 16 may be a general glass substrate, and examples thereof include: IXD, 0LED display device or the like with a glass substrate or the like. 玻璃基板16的耐化学药品性、耐透湿性优异,且热收缩率低。 Chemical resistance of the glass substrate 16, excellent moisture resistance, and low heat shrinkage. 作为热收缩率的指标,可以使用JIS R 3102 (1995年修订)中规定的线膨胀系数。 As an index of thermal shrinkage can be used JIS R 3102 (revised 1995) in a predetermined linear expansion coefficient.

[0108] 玻璃基板16的线膨胀系数大时,由于后述的构件形成工序大多伴随加热处理,因此容易产生各种不良情况。 [0108] Glass substrates linear expansion coefficient is large, since the member to be described later is formed along most of the heat treatment step 16, so prone to various problems. 例如,在玻璃基板16上形成TFT的情况下,将在加热下形成有TFT 的玻璃基板16冷却时,有由于玻璃基板16的热收缩而TFT的位置偏移变得过大的担心。 For example, the case of forming a TFT on a glass substrate 16, there is formed a TFT glass substrate 16 is cooled under heating with heat shrinkage of the glass substrate 16 and the TFT positional displacement becomes too large concern.

[0109] 玻璃基板16是将玻璃原料熔融、将熔融玻璃成型为板状而得到的。 [0109] The molten glass substrate 16 is glass material, the molten glass is formed into a plate shape is obtained. 这样的成型方法可以为一般的成型方法,例如可以使用:浮法、熔融法、狭缝下拉法、垂直引上法、拉伯斯法(Lubbers method)等。 Such a molding method may be a general molding method may be used for example: a float, a fusion method, a slot down method, a vertical riser France, France Labo Si (Lubbers method) and the like. 另外,厚度特别薄的玻璃基板16可以通过将暂时成型为板状的玻璃加热至能够成型的温度、利用拉伸等手段进行拉伸使其变薄的方法(平拉法)进行成型而得到。 Further, extremely thin thickness of the glass substrate 16 may be formed by temporarily heated to a temperature capable of molding a plate of glass by means of stretching of the stretching or the like method thinned (Pull Method) obtained by molding.

[0110] 玻璃基板16的玻璃的种类没有特别限定,优选无碱硼硅酸盐玻璃、硼硅酸盐玻璃、 钠钙玻璃、高硅氧玻璃、其他以氧化硅作为主要成分的氧化物系玻璃。 [0110] the type of glass of the glass substrate 16 is not particularly limited, but preferably alkali-free borosilicate glass, borosilicate glass, soda lime glass, high silica glass, other silicon oxide-based oxide glass as a main component . 作为氧化物系玻璃, 优选基于氧化物换算的氧化硅的含量为40〜90质量%的玻璃。 As an oxide glass, preferably a silica content in terms of oxide-based glass is 40~90% by mass.

[0111] 作为玻璃基板16的玻璃,采用符合电子设备用构件的种类、其制造工序的玻璃。 [0111] As the glass substrate 16 of glass, in line with the kind of electronic apparatus using the member, the manufacturing process of the glass. 例如,对于液晶面板用的玻璃基板,碱金属成分的溶出容易对液晶造成影响,因此由实质上不含碱金属成分的玻璃(无碱玻璃)形成(其中,通常包含碱土金属成分)。 For example, a glass substrate for a liquid crystal panel, the elution of the alkali metal component tends to affect the liquid crystal, thereby forming the metal component substantially no alkali glass (alkali-free glass) (which typically comprises an alkaline earth metal component). 如此,玻璃基板16的玻璃可以基于应用的设备的种类和其制造工序来适当选择。 Thus, the glass of the glass substrate 16 can be appropriately selected based on the type of application equipment and manufacturing steps.

[0112] 从玻璃基板16的薄型化和/或轻量化的观点出发,玻璃基板16的厚度优选为0.3mm 以下,更优选为〇. 15mm以下,进一步优选为0. IOmm以下。 [0112] From the thickness and / or weight reduction viewpoint of the glass substrate 16, the thickness of the glass substrate 16 is preferably 0.3mm or less, and more preferably square. 15mm or less, more preferably 0. IOmm less. 0.3mm以下的情况下,可以对玻璃基板16赋予良好的挠性。 Case of 0.3mm or less, good flexibility can be imparted to the glass substrate 16. 0.15mm以下的情况下,可以将玻璃基板16卷绕为卷状。 0.15mm or less in the case of the glass substrate 16 may be wound into a roll.

[0113] 另外,出于玻璃基板16的制造容易、玻璃基板16的处理容易等理由,玻璃基板16的厚度优选为〇.〇3mm以上。 [0113] Further, for easy manufacturing a glass substrate 16, a glass substrate 16 is easy to handle other reasons, the thickness of the glass substrate 16 is preferably 〇.〇3mm above.

[0114] 需要说明的是,玻璃基板16可以由2层以上形成,上述情况下,形成各层的材料可以为同种材料也可以为不同种材料。 [0114] Incidentally, the glass substrate 16 may be formed of two or more layers, the above-described circumstances, materials forming each layer may be the same material may be different materials. 另外,这种情况下,“玻璃基板16的厚度”是指全部层的总厚度。 Further, in this case, "thickness of the glass substrate 16" refers to the total thickness of all the layers.

[0115] [电子设备用构件(功能性元件)] [0115] [member for electronic equipment (functional element)]

[0116] 电子设备用构件18为形成于玻璃基板16上且构成电子设备的至少一部分的构件。 [0116] The electronic device 18 is a member formed on the glass substrate 16 and the member constituting at least part of the electronic device. 更具体而言,作为电子设备用构件18,可以举出:在显示装置用面板、太阳能电池、薄膜二次电池或表面形成有电路的半导体晶圆等电子部件等中使用的构件(例如,显示装置用构件、 太阳能电池用构件、薄膜二次电池用构件、电子部件用电路)。 More specifically, an electronic device member 18 may include: a display device forming an electronic component such as semiconductor wafer with a circuit panel, solar cells, thin film secondary battery or the like member used in the surface (e.g., a display device member, a solar cell member, the film member for a secondary battery, an electronic circuit components).

[0117] 例如,作为太阳能电池用构件,对于硅型,可以举出:正极的氧化锡等透明电极、p 层/i层/n层所示的硅层和负极的金属等,此外,可以举出:与化合物型、染料敏化型、量子点型等对应的各种构件等。 [0117] For example, as a solar cell member, for the silicon type, may include: tin oxide transparent electrode such as a positive electrode, p is layer / Si layer and the negative electrode metal or the like as shown in the i-layer / n layer, in addition, can give a: type compound, a dye-sensitized, quantum dot corresponding to the other member or the like.

[0118] 另外,作为薄膜二次电池用构件,对于锂离子型,可以举出:正极和负极的金属或金属氧化物等透明电极、电解质层的锂化合物、集电层的金属、作为密封层的树脂等,此外, 可以举出:与镍氢型、聚合物型、陶瓷电解质型等对应的各种构件等。 [0118] Further, a secondary battery as a thin film member, for lithium-ion type, include: positive and negative electrodes of metal or metal oxide transparent electrode, an electrolyte layer is a lithium compound, a metal collector layer, a sealing layer resin or the like, in addition, may include: nickel metal hydride type, polymer type, a ceramic electrolyte, and other corresponding members and the like.

[0119] 另外,作为电子部件用电路,对于CCD、CM0S,可以举出:导电部的金属、绝缘部的氧化硅、氮化硅等,此外,可以举出:与压力传感器•加速度传感器等各种传感器、刚性印刷基板、挠性印刷基板、刚性挠性印刷基板等对应的各种构件等。 [0119] Further, an electronic circuit component, for CCD, CM0S, may include: a conductive metal portion, the insulating portion of silicon oxide, silicon nitride, in addition, may include: • a pressure sensor and an acceleration sensor each member or the like corresponding to various kinds of sensors, a rigid printed board, a flexible printed board, a rigid flexible printed circuit board and the like.

[0120] [带电子设备用构件的层叠体的制造方法] [0120] [Method for producing a laminate with an electronic device with a member]

[0121] 带电子设备用构件的层叠体10的制造方法没有特别限制,为了得到剥离强度(X) 高于剥离强度(y)的层叠体,优选包括如下工序:在支撑基材12表面上使规定的交联性有机聚硅氧烷交联固化而形成有机硅树脂层14。 A method for producing [0121] electronic device with a laminate member 10 is not particularly limited, in order to obtain the peel strength (X) is higher than the peel strength (y) of the laminate, preferably comprising the step of: making the supporting substrate 12 on the surface predetermined crosslinkable organopolysiloxane crosslinked and cured to form a silicone resin layer 14. 即,为如下方法:在支撑基材12的表面形成包含交联性有机聚硅氧烷的层,在支撑基材12表面上使交联性有机聚硅氧烷交联而形成有机硅树脂层14 (交联有机硅树脂),接着,在有机硅树脂层14的有机硅树脂面上层叠玻璃基板16, 进而,在玻璃基板16上形成电子设备用构件18,从而制造带电子设备用构件的层叠体10。 That is, a method of: forming a cross-linked organopolysiloxane layer on the surface of the supporting substrate 12, the crosslinkable organopolysiloxane crosslinked on the surface of the supporting substrate 12 and the silicone resin layer is formed 14 (a crosslinked silicone resin), then, in the laminated glass substrate surface of the silicone resin silicone resin layer 14 is 16, and further, the electronic device 18 with the member 16 is formed on the glass substrate, thereby manufacturing an electronic device with a member laminate 10.

[0122] 可以认为,使交联性有机聚硅氧烷在支撑基材12表面固化时,通过固化反应时的与支撑基材12表面的相互作用进行粘接,有机硅树脂和支撑基材12表面的剥离强度变高。 [0122] It is believed that the crosslinkable organopolysiloxane a substrate support surface 12 upon curing, the adhesive, the silicone resin and the surface of the supporting substrate 12 by an interaction with the curing reaction when the supporting substrate 12 peel strength of the surface becomes high. 因此,即使玻璃基板16和支撑基材12由相同材质形成,也能够对与有机硅树脂层14两者之间的剥离强度设置差异。 Thus, even if the glass substrate 16 and the supporting substrate 12 formed of the same material, it is possible to set the difference between the peel strength of both the silicone resin layer 14.

[0123] 以下,将在支撑基材12的表面形成包含交联性有机聚硅氧烷的层、在支撑基材12 表面上使交联性有机聚硅氧烷交联而形成有机硅树脂层14的工序称为树脂层形成工序,将在有机硅树脂层14的有机硅树脂面上层叠玻璃基板16的工序称为层叠工序,将在玻璃基板16上形成电子设备用构件18的工序称为构件形成工序,对各工序的步骤进行详述。 [0123] Hereinafter, the form containing organopolysiloxane cross-linking in the surface layer of the supporting substrate 12, the crosslinkable organopolysiloxane crosslinked on the surface of the supporting substrate 12 and the silicone resin layer is formed step 14 is referred to as a resin layer forming step, the step will be referred to in the laminating step the laminated glass substrate of the silicone resin silicone resin layer 14 surface 16, the electronic device formed on the glass substrate 16 is referred to as a step member 18 member forming step, the step of each step will be described in detail.

[0124] (树脂层形成工序) [0124] (resin layer forming step)

[0125] 树脂层形成工序中,在支撑基材12的表面上形成包含交联性有机聚硅氧烷的层, 在支撑基材12表面上使交联性有机聚硅氧烷交联而形成有机硅树脂层14。 [0125] The resin layer forming step, is formed comprising a cross-linked organopolysiloxane layer on the surface of the supporting substrate 12, the crosslinkable organopolysiloxane crosslinked on the surface of the supporting substrate 12 is formed silicone resin layer 14.

[0126] 为了在支撑基材12上形成包含交联性有机聚硅氧烷的层,优选的是,使用在溶剂中溶解有交联性有机聚硅氧烷的涂覆用组合物,将该组合物涂布到支撑基材12上形成溶液的层,接着去除溶剂而形成包含交联性有机聚硅氧烷的层。 [0126] To form comprising a crosslinked organopolysiloxane layer, preferably on a supporting substrate 12 is a coating that dissolves the crosslinkable organopolysiloxane composition in a solvent, the forming layer coating solution composition to a supporting substrate 12, and then removing the solvent to form a layer comprising a cross-linkable organopolysiloxane. 通过组合物中的交联性有机聚硅氧烷的浓度的调整等,可以控制包含交联性有机聚硅氧烷的层的厚度。 By adjusting the concentration of other compositions crosslinkable organopolysiloxane, you can control the thickness of the layer comprising the crosslinkable organopolysiloxane.

[0127] 作为溶剂,只要为在作业环境下能够容易地溶解交联性有机聚硅氧烷、且能够容易地挥发去除的溶剂即可,没有特别限定。 [0127] As the solvent, as long as it can be easily dissolved in a working environment crosslinkable organopolysiloxane, can be easily volatilized and removed solvent is not particularly limited. 具体而言,例如可以举出:乙酸丁酯、庚烷、2-庚酮、1-甲氧基-2-丙醇乙酸酯、甲苯、二甲苯、THF、氯仿等。 Specifically, examples thereof include: butyl acetate, heptane, 2-heptanone, 1-methoxy-2-propyl acetate, toluene, xylene, THF, chloroform and the like.

[0128] 在支撑基材12表面上涂布包含交联性有机聚硅氧烷的组合物的方法没有特别限定,可以使用公知的方法。 Method [0128] a coating containing a crosslinking organopolysiloxane composition on the surface of the supporting substrate 12 is not particularly limited, and a known method may be used. 例如可以举出:喷涂法、模涂法、旋涂法、浸涂法、辊涂法、棒涂法、 丝网印刷法、凹版涂布法等。 Examples thereof include: a spray coating method, a die coating method, a spin coating method, dip coating method, roll coating method, bar coating method, a screen printing method, a gravure coating method.

[0129] 之后,可以根据需要,实施用于去除溶剂的干燥处理。 After [0129], as needed, a drying process embodiments for removing the solvent. 干燥处理的方法没有特别限制,例如可以举出:在减压条件下去除溶剂的方法;在交联性有机聚硅氧烷的固化不会进行的温度下加热的方法等。 The method of drying treatment is not particularly limited, and examples thereof include: removing the solvent under reduced pressure; heating at a temperature of the crosslinkable organopolysiloxane curing method is not performed.

[0130] 接着,使支撑基材12上的交联性有机聚硅氧烷交联,形成有机硅树脂层14。 [0130] Next, the supporting substrate is a crosslinked organopolysiloxane crosslinked on 12, the silicone resin layer 14 is formed. 更具体而言,如图4 (A)所示那样,该工序中,在支撑基材12的至少单面的表面上形成有机硅树脂层14〇 More specifically, 4 (A) as shown in FIG., The step, the silicone resin layer formed on at least one surface 14〇 the surface of the support substrate 12

[0131] 固化(交联)的方法如上述那样,根据交联性有机聚硅氧烷的交联形式而适当选择最佳的方法,例如可以举出:加热处理、曝光处理。 [0131] curing (crosslinking) a method as described above, according to the crosslinkable organopolysiloxane crosslinked form appropriately select the best method, for example, can include: heat treatment, an exposure process. 其中,交联性有机聚硅氧烷通过氢化硅烷化反应、缩合反应、自由基反应进行交联时,在可以得到对玻璃基板16的密合性和耐热性优异的有机硅树脂的方面,优选通过热固化来制造有机硅树脂层14。 Wherein the crosslinkable organopolysiloxane by a hydrosilylation reaction, condensation reaction, radical reaction during crosslinking, can be obtained in terms of adhesion and heat resistance of the silicone resin of the glass substrate 16, preferably the silicone resin layer 14 produced by thermal curing.

[0132] 以下,对热固化的方案进行详述。 [0132] Hereinafter, the embodiment of the heat-curable be described in detail.

[0133] 对于使交联性有机聚硅氧烷进行热固化的温度条件,提高有机硅树脂层14的耐热性,优选为150〜300°C,更优选为180〜250°C。 [0133] For the crosslinkable organopolysiloxane thermal curing temperature conditions, the silicone resin layer 14, improving heat resistance, preferably 150~300 ° C, more preferably 180~250 ° C. 另外,加热时间通常优选为10〜120分钟,更优选为30〜60分钟。 The heating time is generally 10~120 minutes, more preferably 30~60 minutes.

[0134] 需要说明的是,交联性有机聚硅氧烷可以在进行预固化(pre cure)后、进行后固化(完全硬化)而使其固化。 [0134] It should be noted that the post-crosslinking organopolysiloxane can be performed pre-cured (pre cure), after curing (complete curing) and cured. 通过进行预固化,可以得到耐热性更优异的有机硅树脂层14。 By pre-curing can be obtained more excellent in heat resistance silicone resin layer 14. 预固化优选紧接着溶剂的去除而进行,上述情况下,不特别区分从层中去除溶剂而形成包含交联性有机聚硅氧烷的层的工序和进行预固化的工序。 Pre-curing is preferably followed by removal of the solvent is carried out, the above case is not particularly distinguished and forming a layer comprising a cross-linkable organopolysiloxane layer and the solvent was removed from the pre-curing step.

[0135] 需要说明的是,有机硅树脂层14的形成不限定于上述方法。 [0135] Incidentally, the silicone resin layer 14 is formed is not limited to the above method.

[0136] 例如,使用对有机硅树脂表面的密合性高于玻璃基板16的材质的支撑基材12时, 可以将交联性有机聚硅氧烷在某些剥离性表面上固化而制造有机硅树脂的薄膜,使该薄膜存在于玻璃基板16和支撑基材12之间,同时进行层叠。 Supporting substrate [0136] For example, adhesion using silicone resin material above the surface of the glass substrate 16 of 12, may be crosslinked organopolysiloxane cured on a releasable surface of certain manufacturing an organic silicone resin film so that the film 12 is present between the glass substrate and the supporting substrate 16 while being stacked.

[0137] 另外,由交联性有机聚硅氧烷的固化而产生的粘接性对于玻璃基板16而言足够低、且该粘接性对于支撑基材12而言足够高时,可以在玻璃基板16和支撑基材12之间使交联性有机聚硅氧烷固化而形成有机硅树脂层14。 [0137] Further, the adhesiveness of the curable organopolysiloxane crosslinkable generated sufficiently low for the glass substrate 16, and the adhesion to the support base 12 when sufficiently high, the glass may be substrate 16 and the supporting base material crosslinked organopolysiloxane between the cured silicone resin layer 12 and 14 is formed.

[0138] 进而,支撑基材12为由与玻璃基板16同样的玻璃材料形成的情况下,也可以实施提尚支撑基材12表面的粘接性的处理而提尚对有机娃树脂层14的剥尚强度。 [0138] Further, the case where the glass substrate 12 by the same glass material forming the support substrate 16, the adhesive may be implemented process 12 is still lifting the supporting substrate and the surface yet provide an organic resin layer 14 of the doll peel strength yet. 例如可以举出:如硅烷偶联剂那样的在化学上提高固定力的化学方法(底漆处理);如火焰(火炎)处理那样增加表面活性基团的物理方法;如喷砂处理那样通过增加表面的粗糙度而增加钩挂的机械处理方法等。 Examples thereof include: silane coupling agent such as a chemical method (primer treatment) to improve the fixing force chemically; flame (flame) to increase the physical processing such as a surface active group; such as by increasing the grit blasting surface roughness increases the mechanical processing method hooked.

[0139] (层叠工序) [0139] (lamination step)

[0140] 层叠工序为在上述树脂层形成工序中得到的有机硅树脂层14的有机硅树脂面上层叠玻璃基板16、得到依次具备支撑基材12的层、有机硅树脂层14和玻璃基板16的层的玻璃层叠体的工序。 [0140] Step of laminating the silicone resin layer 16 laminated glass substrate surface 14 of the silicone resin obtained in the step of forming the resin layer, the supporting layer includes, in order to obtain the substrate 12, the silicone resin layer 14 and the glass substrate 16 a step of glass laminate layer. 更具体而言,如图4的⑶所示那样,以与有机硅树脂层14的支撑基材12侧处于相反侧的表面14a和具有第1主表面16a和第2主表面16b的玻璃基板16的第1主表面16a 作为层叠面,将有机硅树脂层14和玻璃基板16层叠,得到玻璃层叠体26。 More specifically, ⑶ 4 as shown in FIG, 12 to the support surface 14a side of the substrate silicone resin layer 14 is at the opposite side and having a first main surface 16a and the second main surface of the glass substrate 16 16b the first main surface 16a as a lamination surface, the silicone resin layer 14 and the glass substrate 16 are stacked to obtain a glass laminate 26.

[0M1]在有机硅树脂层14上层叠玻璃基板16的方法没有特别限制,可以采用公知的方法。 [0M1] There is no particular limitation in the method of laminating a glass substrate 14 on the silicone resin layer 16, a known method can be employed.

[0142] 例如可以举出:在常压环境下在有机硅树脂层14的表面上重叠玻璃基板16的方法。 [0142] Examples thereof include: a method to overlap the glass substrate 16 on the surface of the silicone resin layer 14 in the atmospheric environment. 需要说明的是,根据需要,在有机硅树脂层14的表面上重叠玻璃基板16后,也可以使用辊、加压机使玻璃基板16压接到有机硅树脂层14上。 Incidentally, if necessary, the overlapping glass substrate 16 on the surface of the silicone resin layer 14 may be a roll pressing machine so that the glass substrate 16 is crimped onto the silicone resin layer 14. 通过利用辊或加压的压接,有机硅树脂层14和玻璃基板16的层之间混入的气泡比较容易被去除,故优选。 By using a pressure roller or pressure bonding, silicone resin mixed layer between the layer 14 and the glass substrate 16 to be more easily removed air bubbles, which is preferable.

[0143] 利用真空层压法、真空加压法进行压接时,可以抑制气泡混入、确保良好的密合, 故更优选。 When the [0143] pressure-bonded by a vacuum lamination method or a vacuum pressing method, inclusion of air bubbles can be suppressed, ensuring good adhesion, it is more preferable. 通过在真空下进行压接,即使在残留微小的气泡的情况下,也具有气泡不会因加热而生长、不易导致玻璃基板16的变形缺陷的优点。 By pressure bonding under vacuum, even in the case where the residual fine bubbles, the bubbles have not grow by heating, resulting in the advantage of easy deformation defects of the glass substrate 16.

[0144] 层叠玻璃基板16时,优选充分清洗与有机硅树脂层14接触的玻璃基板16的表面, 在清洁度高的环境下进行层叠。 [0144] When the laminated glass substrate 16, preferably sufficiently clean the surface of the glass substrate in contact with the silicone resin layer 14, 16 laminated at high cleanliness environment. 清洁度越高,玻璃基板16的平坦性变得越良好,故优选。 Cleanliness higher, the flatness of the glass substrate 16 becomes good, which is preferable.

[0145] 需要说明的是,层叠玻璃基板16后,可以根据需要进行预退火处理(加热处理)。 [0145] Incidentally, the laminated glass substrate 16, may be pre-annealing treatment (heat treatment) as necessary. 通过进行该预退火处理,层叠后的玻璃基板16对有机硅树脂层14的密合性提高,可以形成适当的剥离强度(y),后述的构件形成工序时,不易产生电子设备用构件的位置偏移等,电子设备的生广率提尚。 By performing the pre-annealing, the glass substrate after laminating 16 pairs of the silicone resin layer to improve the adhesion 14, may be formed in an appropriate peel strength (Y), when the later member forming step, difficult to produce an electronic device with member position offset, etc., Shengguang of electronic devices to mention yet.

[0M6]预退火处理的条件可以根据使用的有机硅树脂层14的种类而适当选择最佳的条件,从使玻璃基板16和有机硅树脂层14之间的剥离强度(y)更适当的方面出发,优选在300 °C以上(优选300〜400°C)进行5分钟以上(优选5〜30分钟)的加热处理。 [0M6] Preconditioned annealing treatment may be suitably selected according to the kind of conditions optimal use of the silicone resin layer 14, more suitable from the aspect of the glass substrate 16 and the silicone resin layer 14 between the peeling strength (Y) starting, preferably 5 minutes or more (preferably 5~30 minutes) heat treatment at 300 ° C (preferably 300~400 ° C).

[0147] (构件形成工序) [0147] (step forming member)

[0148] 构件形成工序为在上述层叠工序中得到的玻璃层叠体26中的玻璃基板16上形成电子设备用构件的工序。 [0148] member forming step Step electronic equipment member is a glass laminate obtained in the laminating step 26 is formed on the glass substrate 16. 更具体而言,如图4的(C)所示那样,在玻璃基板16的第2主表面16b (露出表面)上形成电子设备用构件18,得到带电子设备用构件的层叠体10。 More specifically, as shown in FIG. 4 (C) as shown in the second main surface 16b of the glass substrate 16 (exposed surface) of the electronic device is formed on the member 18, to obtain a laminate with an electronic device with member 10.

[0149] 本工序的步骤没有特别限定,可以根据电子设备用构件的构成构件的种类利用以往公知的方法,在玻璃层叠体26的玻璃基板16的第2主表面16b表面上形成电子设备用构件18。 [0149] step of the present process is not particularly limited, and conventionally known methods depending on the type constituting member electronic equipment member, forming an electronic device member on the second main surface 16b surface of the glass substrate of the glass laminate 26 16 18.

[0150] 需要说明的是,电子设备用构件18也可以不是最终形成于玻璃基板16的第2主表面16b的构件的全部(以下,称为“全部构件”),而是全部构件的一部分(以下,称为“部分构件”)。 [0150] Incidentally, the electronic equipment is not the last member 18 may be formed on the entire glass substrate member 16 of the second main surface 16b (hereinafter, referred to as "all members"), all but a part of the member ( hereinafter referred to as "component part"). 也可以将从有机硅树脂层14剥离出的带部分构件的玻璃基板在之后的工序中制成带全部构件的玻璃基板(相当于后述的电子设备)。 May be from the glass substrate with a portion of the member 14 is peeled off the silicone resin layer in a subsequent step is made of a glass substrate (corresponding to the electronic apparatus described later) are all members.

[0151] 另外,对于从有机硅树脂层14剥离出的、带全部构件的玻璃基板,可以在其剥离面(第1主表面16a)上形成其他电子设备用构件。 [0151] Further, the silicone resin layer 14 is peeled from the glass substrate with the entire member may be formed with other electronic devices in which the release member surface (first main surface 16a) on. 另外,也可以组装带全部构件的层叠体,之后从带全部构件的层叠体剥离支撑基材12,制造电子设备。 Further, the laminate may be assembled with all components, after peeling the laminate from the support substrate 12 with all of the member, the electronic device manufacturing. 进而,也可以使用2张带全部构件的层叠体并组装,之后,从带全部构件的层叠体剥离2张支撑基材12,制造具有2张玻璃基板的带构件的玻璃基板。 Further, two may be used with all components of the laminate and assembled, after the two supporting substrate from the laminate with all of the release member 12, for producing a glass substrate having a member with two glass substrates.

[0152] 例如,以制造OLED的情况为例时,为了在玻璃基板16的与有机硅树脂层14侧处于相反侧的表面上(相当于玻璃基板16的第2主表面16b)形成有机EL结构体,进行了如下各种层形成、处理:形成透明电极,进而在形成有透明电极的面上蒸镀空穴注入层•空穴输送层·发光层•电子输送层等,形成背面电极,使用密封板进行密封等。 [0152] For example, in the case of producing OLED, for example, to the side of the glass substrate 14 in the silicone resin layer 16 of the organic EL structure on the surface side (the second main surface of the glass substrate 16 corresponding to 16b) are formed opposite body, various layers were formed in the following process: forming a transparent electrode, a transparent electrode surface and further deposited a hole injection layer-hole transport layer • • a light emitting layer is formed in an electron transport layer, forming a back electrode, sealing plate for sealing. 作为这些层形成、处理,具体而言,例如可以举出:成膜处理、蒸镀处理、密封板的粘接处理等。 As these layers are formed, the process, specifically, examples thereof include: a film forming process, a vapor deposition process, a sealing plate adhesion treatment and the like.

[0153] 另外,例如,制造TFT-LCD时,具备如下等各种工序:TFT形成工序,在玻璃层叠体26 的玻璃基板16的第2主表面16b上,使用抗蚀液,对通过CVD法和溅射法等一般的成膜法形成的金属膜和金属氧化膜等进行图案形成,形成薄膜晶体管(TFT) ;CF形成工序,在另一个玻璃层叠体26的玻璃基板16的第2主表面16b上,将抗蚀液用于图案形成而形成滤色器(CF); 贴合工序,将TFT形成工序中得到的带TFT的层叠体和CF形成工序中得到的带CF的层叠体层置。 Various processes [0153] Further, for example, the production of TFT-LCD, and the like comprising the following: TFT forming step, on the second main surface 16b of the glass substrate 26 of the glass laminate 16, using the resist solution, by a CVD method on and the metal film and a metal oxide film formed by a sputtering method or the like is generally patterned deposition method, a thin film transistor (TFT); CF forming step, another glass laminate second main surface of the glass substrate 26 of 16 on 16b, the resist pattern formation was used for forming a color filter (CF); bonding step of the TFT form a laminated body obtained in step with TFT and CF CF-forming layer facing the belt laminated body obtained in the step .

[0154] TFT形成工序、CF形成工序中,利用公知的光刻技术、蚀刻技术等,在玻璃基板16的第2主表面16b上形成TFT、CF。 [0154] TFT forming step, CF forming step, by a known photolithography technique, an etching technique, etc., a TFT is formed on the second main surface 16b of the glass substrate 16, CF. 此时,作为图案形成用的涂覆液,使用抗蚀液。 At this time, as the coating liquid for forming a pattern using the resist solution.

[0155] 需要说明的是,在形成TFT、CF前,可以根据需要,对玻璃基板16的第2主表面16b进行清洗。 [0155] Incidentally, prior to forming the TFT, CF, as needed, to the second main surface 16b of the glass substrate 16 is cleaned. 作为清洗方法,可以利用公知的干式清洗、湿式清洗。 As a cleaning method using a dry cleaning can be known, wet cleaning.

[0156] 贴合工序中,使带TFT的层叠体的薄膜晶体管形成面和带CF的层叠体的滤色器形成面对置,使用密封剂(例如,单元形成用紫外线固化型密封剂)使其贴合。 [0156] In the bonding step, forming surface of the thin film transistor and a color filter CF of the laminate with a laminate formed with TFT opposite face, so that a sealant (e.g., units formed by ultraviolet-curable sealing agent) it fit. 之后,向由带TFT 的层叠体和带CF的层叠体形成的单元内注入液晶材料。 Thereafter, the liquid crystal material is injected into the unit formed by the laminate with TFT and CF of the laminate tape. 作为注入液晶材料的方法,例如有减压注入法、滴加注入法。 As a method of injecting a liquid crystal material, for example, vacuum injection method, dropping injection method.

[0157] 实施例 [0157] Example

[0158] 以下,根据实施例等具体地说明本发明,但本发明不受这些例子的限定。 [0158] Hereinafter, the embodiments of the present invention is specifically described embodiments and the like, but the present invention is not limited to these examples.

[0159] <实施例1> [0159] <Example 1>

[0160] 利用纯水清洗、UV清洗等对长400mm、宽300mm、厚度0.7mm、线膨胀系数38 X 1(T7/°C 的支撑玻璃基板(旭硝子株式会社制造、AN100)进行清洁化,然后使用旋涂机将无溶剂加成反应型剥离纸用有机娃(Shin-Etsu Silicone株式会社制造KNS-320A。有机稀基聚娃氧烧和有机氢聚娃氧烧的混合物)100质量份和钼系催化剂(Shin-Etsu Silicone株式会社制造CAT-PL-56) 2质量份的混合物涂覆(涂覆量10g/m2)在支撑玻璃基板上,以180°C,在大气中进行30分钟的加热固化,得到膜厚16μπι的有机硅树脂层。 [0160] washed with pure water, UV cleaning or the like of length 400mm, width 300mm, thickness 0.7mm, a linear expansion coefficient of 38 X 1 (supporting glass substrate T7 / ° C of (Asahi Glass Co., Ltd., AN100) for clean, then using a spin coater solventless addition reaction-type organic baby release paper (Shin-Etsu Silicone Co., Ltd. KNS-320A. the mixture of oxygen and burning the organic organohydrogenpolysiloxane Wa Wa polyethylene oxide lean burn yl) and 100 parts by mass of molybdenum based catalyst (Shin-Etsu Silicone Co., Ltd. CAT-PL-56) 2 parts by mass mixture was coated (coating amount of 10g / m2) on a supporting glass substrate to 180 ° C, for 30 minutes in air heated cured silicone resin layer having a thickness of 16μπι.

[0161] 利用纯水清洗、UV清洗等对长400_、宽300_、厚度0.7_、线膨胀系数38X10—7/°C 的薄板玻璃基板(AN100)的与有机硅树脂层接触的一侧的表面进行清洁化,然后使支撑玻璃基板的有机硅树脂层形成面和薄板玻璃基板在室温下真空加压下贴合,得到具有有机硅树脂层的玻璃层叠体A。 [0161] washed with pure water, UV cleaning or the like of 400 angstroms long, wide side surface 300 F, 0.7_ thickness of the thin plate glass substrate (AN100) coefficient of linear expansion 38X10-7 / ° C in contact with the silicone resin layer be clean, and then the silicone resin layer formed surface of the supporting glass substrate and thin glass substrate under a vacuum pressure bonding at room temperature to obtain a glass laminate having a silicone resin layer A.

[0162] 接着,将玻璃层叠体A在大气下、以350°C进行60分钟的加热处理。 [0162] Next, the glass laminate A in the atmosphere, heated to 350 ° C for 60 minutes.

[0163] 然后,在玻璃层叠体A的4个角部中的1个角部的薄板玻璃基板和有机硅树脂层的界面插入厚度0.1mm的不锈钢制刀具,形成剥离的切口部。 [0163] Then, the thin glass substrate 1 interface corner portions at four corners of the glass laminate A in the silicone resin layer and the thickness of 0.1mm is inserted into a stainless steel tool, the cutout portion is formed in the release. 接着,使真空吸盘吸附于薄板玻璃基板和支撑玻璃基板各自的非剥离面侧的面,使用注射器对有机硅树脂层和薄板玻璃基板的剥离界面的边界线即剥离线供给甲醇(溶解度参数:14.5cal/cm3),同时在薄板玻璃基板和支撑玻璃基板分离的方向上施加外力,结果薄板玻璃基板分离而无破损。 Next, the vacuum chuck adsorbed to the respective surfaces of non-release side of the thin glass substrate and supporting glass substrate using a syringe i.e. release line supplying methanol (solubility parameter of the boundary line interfacial peeling the silicone resin layer and the thin glass substrate: 14.5 cal / cm3), while the external force is applied in the direction of separating the thin glass substrate and supporting glass substrate, the thin glass substrate from the results without breakage.

[0164] (剥离强度的测定) [0164] (Measurement of peel strength)

[0165] 使用日本国专利第5200538号的段落0050所述的夹具,进行剥离试验。 [0165] Japanese Patent No. 5200538 using the jig according to paragraph 0050, a peeling test. 将使用的夹具示于图5。 The use of a jig 5 shown in FIG. 图5中,玻璃层叠体A具有支撑玻璃基板40、有机硅树脂层30、薄板玻璃基板50。 5, the glass laminate A having a supporting glass substrate 40, the silicone resin layer 30, the thin glass substrate 50.

[0166] 将玻璃层叠体A切断成长50mmX宽50mm的大小,用环氧双组分玻璃用粘接剂,使长50mmX宽50mmX厚度5mm的聚碳酸酯60分别贴合于玻璃层叠体A两侧的玻璃(支撑玻璃基板40和薄板玻璃基板50)表面。 [0166] The glass laminate A 50mmX cut into a size 50mm wide, with a two-component epoxy adhesive glass, the thickness of the long 50mmX width 5mm polycarbonate 50mmX 60 are bonded to both sides of the glass laminate A glass (the support glass substrate 40 and the thin glass substrate 50) surfaces. 进而,使长50mmX宽50mmX厚度5mm的聚碳酸酯70分别进一步垂直贴合于两边的被贴合的聚碳酸酯60的表面。 Further, the elongated 50mmX width of 5mm thickness of the polycarbonate 50mmX 70 are further attached to a vertical surface 60 is bonded to the polycarbonate is bonded to both sides. 聚碳酸酯70的贴合位置如图5那样,纵向设为聚碳酸酯60的最末端的位置,横向设为与聚碳酸酯60的边平行的位置。 Polycarbonate bonding position 70 in FIG. 5, the endmost longitudinal polycarbonate to a position 60, sides parallel to the lateral position 60 of polycarbonate.

[0167] 以使支撑玻璃基板成为下侧的方式设置贴合有聚碳酸酯60和70的玻璃层叠体A。 [0167] In the supporting glass substrate becomes a lower side is provided with a bonded glass laminate of polycarbonate and 60 to 70 A. 用夹具将粘附于薄板玻璃基板侧的聚碳酸酯70固定,将粘附于支撑玻璃基板侧的聚碳酸酯70向垂直下方以300mm/分钟的速度剥离,结果施加0.34kg/cm2时支撑玻璃基板被剥离。 The jig is adhered to the glass substrate side of the polycarbonate sheet 70 is fixed, adhered to the glass substrate side of the polycarbonate support at a rate of 70 peel 300mm / min vertically downward, when the result is applied 0.34kg cm2 / supporting glass the substrate is peeled off.

[0168] <实施例2> [0168] <Example 2>

[0169] 使用乙醇(溶解度参数:12.7cal/cm3)代替甲醇(溶解度参数:14.5cal/cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0169] ethanol (solubility parameter: 12.7cal / cm3) instead of methanol (solubility parameter: 14.5cal / cm3), except that, according to the same procedure as in Example 1, peeling the thin glass substrate, the thin glass results separating the substrate without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0170] <实施例3> [0170] <Example 3>

[0171] 使用乙醇(溶解度参数:12.7cal/cm3)和水的混合溶液(乙醇:水(质量比)=1:1) 代替甲醇(溶解度参数:14.5cal/cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0171] ethanol (solubility parameter: 12.7cal / cm3) and a mixed solution of water (ethanol: water (mass ratio) = 1: 1) was used instead of methanol (solubility parameter: 14.5cal / cm3), in addition, in accordance with the same procedure as in Example 1, peeling the thin glass substrate, the thin glass substrate from the results without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0172] <实施例4> [0172] <Example 4>

[0173] 使用乙醇和1-丙醇的混合溶液(含量:乙醇90质量%、1_丙醇10质量%。溶解度参数:乙醇12.7cal/cm3、l-丙醇12.0cal/cm3)代替甲醇(溶解度参数:14.5cal/cm3),除此之夕卜,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0173] 1-propanol and ethanol mixed solution (content: 90% by mass of ethanol, propanol, 10 mass% 1_ solubility parameter: ethanol 12.7cal / cm3, l- propanol 12.0cal / cm3) instead of methyl ( solubility parameters: 14.5cal / cm3), the evening Bu in addition, according to the same procedures as in Example 1, peeling the thin glass substrate, the thin glass substrate from the results without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0174] <实施例5> [0174] <Example 5>

[0175] 使用1-丙醇(溶解度参数:12.Ocal/cm3)代替甲醇(溶解度参数:14.5cal/cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0175] 1-propanol (solubility parameter: 12.Ocal / cm3) instead of methanol (solubility parameter: 14.5cal / cm3), except that, in accordance with the same procedures as in Example 1, a thin glass substrate is peeled , separating the thin glass substrate results without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0176] <实施例6> [0176] <Example 6>

[0177] 使用异丙醇(溶解度参数:11.5cal/cm3)代替甲醇(溶解度参数:14.5cal/cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0177] isopropanol (solubility parameter: 11.5cal / cm3) instead of methanol (solubility parameter: 14.5cal / cm3), except that, according to the same procedure as in Example 1, peeling the thin glass substrate, the result separated without breakage of the thin glass substrate. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0178] <实施例7> [0178] <Example 7>

[0179] 使用1-丁醇(溶解度参数:11.4cal/cm3)代替甲醇(溶解度参数:14.5cal/Cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0179] using 1-butanol (solubility parameter: 11.4cal / cm3) instead of methanol (solubility parameter: 14.5cal / Cm3), except that the release sheet glass substrate according to the same procedure as Example 1 was carried out, results separated without breakage of the thin glass substrate. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0180] <实施例8> [0180] <Example 8>

[0181] 使用1-己醇(溶解度参数:10.7cal/cm3)代替甲醇(溶解度参数:14.5cal/cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0181] using 1-hexanol (solubility parameter: 10.7cal / cm3) instead of methanol (solubility parameter: 14.5cal / cm3), in addition, peeling the thin glass substrate in accordance with the same procedure as Example 1 was carried out, results separated without breakage of the thin glass substrate. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0182] <实施例9> [0182] <Example 9>

[0183] 使用二甲基亚砜(溶解度参数:12. Ocal/cm3)代替甲醇(溶解度参数:14.5cal/ cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0183] Dimethyl sulfoxide (solubility parameter:. 12 Ocal / cm3) instead of methanol (solubility parameter: 14.5cal / cm3), except that, according to the same procedure as in Example 1, a thin plate glass substrate peeling the thin glass substrate separation results without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0184] <实施例10> [0184] <Example 10>

[0185] 使用二甲基甲酰胺(溶解度参数:12.1cal/Cm3)代替甲醇(溶解度参数:14.5cal/ cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0185] A dimethylformamide (solubility parameter: 12.1cal / Cm3) instead of methanol (solubility parameter: 14.5cal / cm3), except that, in accordance with the same procedures as in Example 1, a thin glass substrate is peeled , separating the thin glass substrate results without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0186] < 实施例11> [0186] <Example 11>

[0187] 使用N-甲基吡咯烷酮(溶解度参数:11.3cal/cm3)代替甲醇(溶解度参数: 14.5cal/cm3),除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板分离而无破损。 [0187] using N- methylpyrrolidone (solubility parameter: 11.3cal / cm3) instead of methanol (solubility parameter: 14.5cal / cm3), except that, according to the same procedure as in Example 1, peeling the thin glass substrate , separating the thin glass substrate results without breakage. 需要说明的是,将剥离强度的测定结果示于表1。 Note that the measurement results of the peel strength shown in Table 1.

[0188] <比较例1> [0188] <Comparative Example 1>

[0189] 不进行甲醇(溶解度参数:14.5cal/cm3)的供给,除此之外,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板难以剥离,观察到薄板玻璃基板的破损。 [0189] without methanol (solubility parameter: 14.5cal / cm3) is supplied, in addition, according to the same procedure as in Example 1, peeling the thin glass substrate, the results difficult to peel the thin glass substrate, the glass sheet was observed crack in the substrate. 需要说明的是,将剥离强度的结果示于表1。 Incidentally, the results of the peel strength shown in Table 1.

[0190] <比较例2> [0190] <Comparative Example 2>

[0191] 使用庚烷(溶解度参数:7.4cal/Cm3)代替甲醇(溶解度参数:14.5cal/cm3),除此之夕卜,按照与实施例1同样的步骤,进行薄板玻璃基板的剥离,结果薄板玻璃基板难以分离,观察到薄板玻璃基板的破损。 [0191] heptane (solubility parameter: 7.4cal / Cm3) instead of methanol (solubility parameter: 14.5cal / cm3), the evening Bu In addition, according to the same procedures as in Example 1, peeling the thin glass substrate, the result difficult to separate the thin glass substrate was observed for breakage of the thin glass substrate. 需要说明的是,将剥离强度的结果示于表1。 Incidentally, the results of the peel strength shown in Table 1.

[0192] 表1中,“玻璃剥离”栏中,将薄板玻璃的剥离没有问题地进行的情况评价为“〇”, 将薄板玻璃破损、剥离难以进行的情况评价为“ X ”。 Evaluated [0192] In Table 1, "Glass peel" column, peeling the thin glass without problem as "square", the thin glass breakage, difficult to perform peeling was evaluated as "X".

[0193] 需要说明的是,表1中,实施例3的“SP值”栏示出乙醇的SP值,实施例4的“SP值”栏示出乙醇和1-丙醇的SP值。 [0193] Incidentally, in Table 1, SP value shown embodiment of ethanol "SP value" column of the embodiment 3, SP value shown embodiment of ethanol and 1-propanol "SP value" column 4 embodiment.

[0194] [表1] [0194] [Table 1]

[0195] 表1 [0195] TABLE 1

Figure CN105432147BD00181

[0197] 如表1所示那样,使用显示出规定的SP值的有机溶剂或该有机溶剂和水的混合溶液时,剥离强度降低,剥离时未见薄板玻璃基板的破损。 When [0197] As shown in Table 1 above, shows the use of a mixed solution of an organic solvent or a predetermined SP value of the organic solvent and water, peel strength decreased, no breakage of the thin glass substrate during the peeling.

[0198] 另一方面,对于不使用上述有机溶剂或混合溶液的比较例1、和使用SP值为规定的范围外的有机溶剂的比较例2,剥离强度大,剥离时可见薄板玻璃基板的破损。 [0198] On the other hand, do not use 1, and Comparative Examples using an organic solvent having an SP value outside the predetermined range of the organic solvent or a mixed solution of Comparative Example 2, peel strength, breakage of the thin glass substrate when seen peeling .

[0199] < 实施例12> [0199] <Example 12>

[0200] 本实施例中,使用实施例1中得到的玻璃层叠体A制造0LED。 [0200] In this embodiment, in Example 1 using the glass laminate A obtained in Manufacturing 0LED.

[0201] 更具体而言,在玻璃层叠体A的薄板玻璃基板上,通过溅射法将钼成膜,通过利用光刻法的蚀刻形成栅电极。 [0201] More specifically, the thin glass substrate of the glass laminate A, a molybdenum film formation by a sputtering method, the gate electrode is formed by etching using photolithography. 接着,通过等离子体CVD法,在设有栅电极的剥离性玻璃基板的第2主表面侧上进一步按照氮化硅、本征非晶硅、η型非晶硅的顺序进行成膜,接着通过溅射法将钼成膜,通过利用光刻法的蚀刻,形成栅极绝缘膜、半导体元件部和源电极/漏电极。 Then, by the plasma CVD method is further on the second main surface side of the glass substrate with the release of the gate electrode in the order of silicon nitride, intrinsic amorphous silicon, amorphous silicon deposition type [eta], followed by the molybdenum sputtering deposition, by etching by photolithography, a gate insulating film, the semiconductor element portion and the source / drain electrodes. 接着,通过等离子体CVD法,在剥离性玻璃基板的第2主表面侧上进一步将氮化硅成膜而形成钝化层,然后通过溅射法将氧化铟锡成膜,通过利用光刻法的蚀刻,形成像素电极。 Next, by plasma CVD, a silicon nitride film formation and further forming a passivation layer on the second main surface side of the glass substrate is peeled off, and then by sputtering indium tin oxide film formation by photolithography, etching a pixel electrode.

[0202] 接着,在所得层叠体的薄板玻璃基板侧表面上进一步通过蒸镀法依次将如下物质成膜:作为空穴注入层的4,4',4”_三(3-甲基苯基苯基氨基)三苯基胺、作为空穴输送层的双[(N-萘基)-N-苯基]联苯胺、作为发光层的在8-羟基喹啉铝络合物(Alq3)中混合有40体积%的2,6-双[4- [N- (4-甲氧基苯基)-N-苯基]氨基苯乙烯基]萘-1,5-二甲腈(BSN-BCN)而成的物质、作为电子输送层的Alq3。接着,在所得层叠体的薄板玻璃基板侧表面上,通过溅射法将铝成膜,通过利用光刻法的蚀刻形成对电极。接着,在形成有对电极的表面上借助紫外线固化型的粘接层贴合另一张玻璃基板并密封。通过上述步骤得到的、在薄板玻璃基板上具有有机EL结构体的玻璃层叠体A2相当于带电子设备用构件的层叠体。 [0202] Next, on the substrate side surface of the thin glass laminate obtained by further evaporation method sequentially forming the following materials: as the hole injection layer 4, 4 ', 4 "_ tris (3-methylphenyl phenylamino) triphenylamine as a hole transport layer-bis [(N-naphthyl) -N- phenyl] benzidine in 8-quinolinol aluminum complex (Alq3) as a light-emitting layer mixed with 40% by volume of 2,6-bis [4- [N- (4- methoxyphenyl) -N- phenyl] aminostyryl] naphthalene-1,5-dicarbonitrile (BSN-BCN ) made of material, Alq3 as the electron transporting layer. Next, on the side surface of the thin glass substrate, the resulting laminate, the aluminum deposition by a sputtering method, forming an electrode by etching using photolithography. Next, are formed by means of ultraviolet-curing adhesive layer bonded to another glass substrate and the sealing surface of the electrode. by the foregoing step, having a glass laminate structure of the organic EL A2 corresponds with electrons in the thin plate glass substrate laminate member equipment.

[0203] 需要说明的是,上述制造工艺中,作为加热处理,以350°C、1小时的处理为最高温下的处理。 [0203] Incidentally, the above-described manufacturing process, as the heat treatment to 350 ° C, 1 hour of treatment at the highest temperature processing.

[0204] 使用上述玻璃层叠体A2代替玻璃层叠体Al,除此之外,按照与实施例1同样的步骤进行有机硅树脂层和薄板玻璃基板的剥离,结果以与实施例1同等程度的剥离强度进行两者的剥离,可以得到包含薄板玻璃基板和电子设备用构件的电子设备。 [0204] using the glass laminate A2 instead of the glass laminate Al, except that, according to the same procedure as in Example 1 and the silicone resin layer peeling the thin glass substrate, the result of Example 1 with the same level of peel embodiment both peeling strength can be obtained an electronic device comprising the thin glass substrate and a member of the electronic equipment.

[0205] 另外,实施实施例2〜11的各步骤代替上述实施例1的步骤时,也可以分别以与实施例2〜11同等程度的剥离强度进行有机硅树脂层和薄板玻璃基板的剥离,可以得到包含薄板玻璃基板和电子设备用构件的电子设备。 [0205] Further, embodiments 2~11 embodiment, when each step in place of step 1 above embodiments, may each peeling strength as in Example 2~11 same degree peel the silicone resin layer and the thin glass substrate, the electronic device can be obtained comprising a substrate and a thin glass member for an electronic device.

[0206] 另一方面,实施比较例1〜2的各步骤代替上述实施例1的步骤的情况下,在有机硅树脂层和薄板玻璃基板的剥离时,产生薄板玻璃基板的破损,无法得到期望的电子设备。 In the case [0206] On the other hand, each of Comparative Examples 1 to 2 step procedure of Example 1 in place of the embodiment described above, when peeling the silicone resin layer and the thin glass substrate, breakage of the thin glass substrate can not be obtained the desired the electronic equipment.

[0207] 详细且参照特定的实施方式说明了本发明,但在不脱离本发明的范围和精神的情况下可以加以各种修正、变更,这对于本领域技术人员来说是显而易见的。 [0207] in detail and with reference to the specific embodiments described embodiment of the present invention, but without departing from the scope and spirit of the present invention may be various modifications, changes, it will be apparent to those skilled in the art.

[0208] 本申请基于2013年7月31日申请的日本专利申请2013-159724,将其内容作为参照引入至此。 [0208] This application is based on Japanese patent July 31, 2013 filed 2013-159724, the content of which is introduced as a reference point.

[0209] 附图标记说明 [0209] REFERENCE NUMERALS

[0210] 1〇带电子设备用构件的层叠体 [0210] with laminate 1〇 electronic equipment member

[0211] 12 支撑基材 [0211] support base 12

[0212] 14、30 有机硅树脂层 [0212] silicone resin layer 14, 30

[0213] 14a 有机硅树脂层的第1主表面 [0213] 14a first main surface of the silicone resin layer

[0214] 16 玻璃基板 [0214] 16 glass substrate

[0215] 16a 玻璃基板的第1主表面 [0215] 16a first main surface of the glass substrate

[0216] 16b 玻璃基板的第2主表面 [0216] 16b second main surface of the glass substrate

[0217] 18 电子设备用构件 [0217] The electronic device 18 with member

[0218] 20 带有机硅树脂层的支撑基材 [0218] support base 20 with a silicone resin layer

[0219] 22 电子设备 [0219] The electronic device 22

[0220] 24 溶液 [0220] 24 solution of

[0221] 26 玻璃层叠体 [0221] 26 glass laminate

[0222] 40 支撑玻璃基板 [0222] 40 supporting glass substrate

[0223] 50 薄板玻璃基板 [0223] 50 thin glass substrate

[0224] 60、70 聚碳酸酯 [0224] Polycarbonate 60,70

[0225] 80 液晶面板 [0225] The liquid crystal panel 80

[0226] 82 TFT 基板 [0226] 82 TFT substrate

[0227] 83 TFT 元件 [0227] 83 TFT element

[0228] 84 CF 基板 [0228] 84 CF substrate

[0229] 85 滤色器元件 [0229] 85 filter elements

[0230] 90 电子纸 [0230] The electronic paper 90

[0231] 91 电子纸元件 [0231] The electronic paper device 91

[0232] 92 TFT层 [0232] 92 TFT layer

[0233] 94 电气工程学介质的层 [0233] Electrical Engineering medium layer 94

[0234] 96 透明电极 [0234] The transparent electrode 96

Claims (5)

1. 一种电子设备的制造方法,其具有如下工序:从依次具有支撑基材、有机硅树脂层、 玻璃基板和电子设备用构件的带电子设备用构件的层叠体中,以所述有机硅树脂层和所述玻璃基板的界面作为剥离面,将包含所述支撑基材和所述有机硅树脂层的带有机硅树脂层的支撑基材与包含所述玻璃基板和所述电子设备用构件的电子设备分离,得到所述电子设备, 其中,对所述有机硅树脂层和所述玻璃基板的剥离界面的边界线即剥离线供给溶解度参数超过10的有机溶剂或所述有机溶剂和水的混合溶液,进行所述带有机硅树脂层的支撑基材与所述电子设备的分离,所述有机溶剂或所述有机溶剂和水的混合溶液相对于所述有机硅树脂层的接触角为90°以下。 1. A method for manufacturing an electronic device, having the following steps: successively from a support base, the silicone resin layer, a laminate with an electronic device substrate and the glass member by means of an electronic device, to the silicone interface resin layer and the glass substrate as the release surface, said support comprising a supporting substrate with a silicone resin layer and the base material with a silicone resin layer comprising the glass substrate and the electronic device member separation of the electronic device, the electronic device obtained, wherein the release line feeding a solubility parameter that is more than 10 on the boundary line of the organic solvent interfacial peeling the silicone resin layer and the glass substrate, or the organic solvent and water a mixed solution of, for separating said supporting substrate having a silicone resin layer and the electronic device, the organic solvent of said organic solvent and water or a mixed solution of the silicone resin relative to the contact angle of the layer 90 the following.
2. 根据权利要求1所述的电子设备的制造方法,其中,所述有机溶剂包含任选具有卤原子的醇类溶剂或非质子性极性溶剂。 2. The method of manufacturing an electronic device according to claim 1, wherein said organic solvent comprises optionally an alcoholic solvent or an aprotic polar solvent having a halogen atom.
3. 根据权利要求1或2所述的电子设备的制造方法,其中,所述有机溶剂包含选自由碳数1〜6的醇类溶剂、二甲基甲酰胺、N,N-二甲基乙酰胺、二甲基亚砜、N-甲基吡咯烷酮、环丁砜和乙腈组成的组中的至少1种。 The method of manufacturing an electronic device of claim 1 or claim 2, wherein said organic solvent is selected from the group consisting of carbon number 1~6 comprising the alcoholic solvent, dimethylformamide, N, N- dimethylacetamide at least one group, dimethyl sulfoxide, N- methylpyrrolidone, sulfolane and acetonitrile in.
4. 根据权利要求1或2所述的电子设备的制造方法,其中,所述有机硅树脂层中的有机硅树脂为有机烯基聚硅氧烷和有机氢聚硅氧烷的反应固化物。 The method for producing an electronic device of claim 1 or claim 2, wherein the silicone resin is a silicone resin layer is an organic polysiloxane and an alkenyl group organohydrogenpolysiloxane reaction cured product.
5. 根据权利要求4所述的电子设备的制造方法,其中,所述有机硅树脂为加成反应型有机硅的固化物, 所述加成反应型有机硅为包含下述(a)和⑹的固化性有机硅树脂组合物, 所述有机硅树脂层是通过使所述固化性有机硅树脂组合物在所述支撑基材的表面固化而形成的: (a)每1分子中具有至少2个烯基的线状有机聚硅氧烷、 ⑹每1分子中具有至少3个与硅原子键合的氢原子、且与硅原子键合的氢原子的至少1 个存在于分子末端的硅原子上的线状有机聚硅氧烷。 5. The method of manufacturing an electronic device according to claim 4, wherein the silicone resin is an addition reaction type silicone cured product, the addition reaction type silicone comprising the following (a) and ⑹ the curable silicone resin composition, the silicone resin layer is obtained by curing the silicone resin of the curable composition on a surface of supporting substrate formed by: (a) having per molecule at least 2 linear organopolysiloxane alkenyl groups, per molecule ⑹ having at least 3 silicon-bonded hydrogen atoms, silicon atoms and at least one silicon atom-bonded hydrogen atoms present in the molecule terminal the linear organopolysiloxane.
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