TW201514110A - Production method of film glass, production method of electronic device and production method of glass film laminate - Google Patents
Production method of film glass, production method of electronic device and production method of glass film laminate Download PDFInfo
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- TW201514110A TW201514110A TW103133952A TW103133952A TW201514110A TW 201514110 A TW201514110 A TW 201514110A TW 103133952 A TW103133952 A TW 103133952A TW 103133952 A TW103133952 A TW 103133952A TW 201514110 A TW201514110 A TW 201514110A
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- 239000011521 glass Substances 0.000 title claims abstract description 574
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 239000006059 cover glass Substances 0.000 claims description 39
- 239000007788 liquid Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 21
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 16
- 238000000926 separation method Methods 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 7
- 150000002222 fluorine compounds Chemical class 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 324
- 239000010410 layer Substances 0.000 description 23
- 230000007246 mechanism Effects 0.000 description 19
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 238000005401 electroluminescence Methods 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000003513 alkali Substances 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000007654 immersion Methods 0.000 description 4
- 229910052809 inorganic oxide Inorganic materials 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000007500 overflow downdraw method Methods 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- -1 tetrafluoroborate Chemical compound 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000005407 aluminoborosilicate glass Substances 0.000 description 2
- 239000005354 aluminosilicate glass Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
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- 238000000576 coating method Methods 0.000 description 2
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- 238000003280 down draw process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000005340 laminated glass Substances 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
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- LNOLJFCCYQZFBQ-BUHFOSPRSA-N (ne)-n-[(4-nitrophenyl)-phenylmethylidene]hydroxylamine Chemical compound C=1C=C([N+]([O-])=O)C=CC=1C(=N/O)/C1=CC=CC=C1 LNOLJFCCYQZFBQ-BUHFOSPRSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
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- 229920006223 adhesive resin Polymers 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
- H01L31/1896—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates for thin-film semiconductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Abstract
Description
本發明是有關於一種膜(film)狀玻璃(glass)及電子元件(device)的製造方法，更具體而言，是有關於一種用以將製造電子元件等時所使用的玻璃膜(glass film)積層體分離為玻璃膜與支持玻璃的技術。 The present invention relates to a method for manufacturing a film-like glass and an electronic device, and more particularly to a glass film for use in manufacturing an electronic component or the like. The technique of separating the laminated body into a glass film and a supporting glass.
就省空間(space)化的觀點而言，近年，液晶顯示器(display)、電漿(plasma)顯示器、有機電致發光(Electroluminescence，EL)顯示器、場發射顯示器(field emission display)等平板顯示器(flat panel display)代替先前普及的陰極射線管(cathode-ray tube，CRT)型顯示器而正在普及。於該些平板顯示器中，為了輕量化而要求更薄型化。特別是要求有機EL顯示器可利用摺疊或捲取而使搬運容易，並且不僅可使用為平面亦可使用為曲面。而且，被要求不僅可使用為平面亦可使用為曲面的情況並不限定於顯示器，例如，只要可於汽車的車體表面或建 築物的屋頂、柱或外壁等具有曲面的物體表面形成太陽電池或形成有機EL照明，其用途便會擴大。因此，對該些元件所使用的基板或覆蓋玻璃(cover glass)要求更薄板化與高可撓性。 In terms of space saving, in recent years, flat panel displays such as liquid crystal displays, plasma displays, organic electroluminescence (EL) displays, and field emission displays ( Flat panel display) is becoming popular in place of the conventional cathode-ray tube (CRT) type display. In these flat panel displays, thinner thickness is required for weight reduction. In particular, an organic EL display is required to be easily handled by folding or winding, and can be used not only as a flat surface but also as a curved surface. Moreover, it is required to be used not only as a flat surface but also as a curved surface, and is not limited to the display, for example, as long as it can be used on the surface of a car body or built. The surface of a curved surface such as a roof, a column or an outer wall of a building forms a solar cell or forms an organic EL illumination, and its use is expanded. Therefore, the substrate or cover glass used for these components is required to be thinner and more flexible.
有機EL顯示器等所使用的發光體會因氧氣或水蒸氣等氣體接觸而劣化。因此，對有機EL顯示器所使用的基板要求高氣體阻隔(gas barrier)性，故而期待使用玻璃基板。然而，基板所使用的玻璃由於與樹脂膜不同而拉伸應力弱，故而可撓性低，當藉由將玻璃基板彎曲而使拉伸應力施加於玻璃基板表面時，會導致破損。為了對玻璃基板賦予可撓性而需要進行玻璃基板的超薄板化，而提出有如下述專利文獻1所記載的厚度小於等於200μm的玻璃膜或玻璃輥(glass roll)。 An illuminant used in an organic EL display or the like is deteriorated by contact with a gas such as oxygen or water vapor. Therefore, since a substrate used for an organic EL display is required to have a high gas barrier property, it is expected to use a glass substrate. However, since the glass used for the substrate has a weak tensile stress unlike the resin film, the flexibility is low, and when the glass substrate is bent and tensile stress is applied to the surface of the glass substrate, damage is caused. In order to impart flexibility to the glass substrate, it is necessary to carry out ultra-thin slab formation of the glass substrate, and a glass film or a glass roll having a thickness of 200 μm or less as described in Patent Document 1 below is proposed.
對平板顯示器或太陽電池等電子元件所使用的玻璃基板實施加工處理或洗淨處理等各種電子元件製造相關的處理。可是，若進行該些電子元件所使用的玻璃基板的膜化，則存在如下問題：玻璃由於為脆性材料，故會因少許應力變化而導致破損，於進行上述各種電子元件製造相關處理時，操作非常困難。另外，由於厚度小於等於200μm的玻璃膜富有可撓性，故而亦存在進行處理時難以進行定位等而於圖案化(patterning)時會產生偏差等的問題。 A glass substrate used for an electronic component such as a flat panel display or a solar cell is subjected to processing related to various electronic components such as processing or cleaning. However, when the glass substrate used for the electronic components is formed into a film, the glass is a brittle material, and is damaged by a slight stress change, and is operated when the above-described various electronic component manufacturing processes are performed. very difficult. In addition, since the glass film having a thickness of 200 μm or less is rich in flexibility, there is a problem that it is difficult to perform positioning during processing, and variations occur during patterning.
為了使玻璃膜的操作性提高，於下述專利文獻2中提出有使玻璃膜積層於支持玻璃上而成的玻璃膜積層體。據此，即便使用作為單體不具強度或剛性的玻璃膜，亦由於支持玻璃的剛性高，而於處理時作為玻璃膜積層體整體容易定位。而且，於下述專利文獻2中，於步驟結束後不損壞玻璃膜而可迅速地自支持玻 璃剝離玻璃膜。 In order to improve the operability of the glass film, Patent Document 2 listed below proposes a glass film laminate in which a glass film is laminated on a supporting glass. According to this, even if a glass film which does not have strength or rigidity as a monomer is used, since the rigidity of the supporting glass is high, it is easy to position as a whole of the glass film laminate at the time of processing. Further, in Patent Document 2 below, the glass film can be quickly self-supported after the end of the step without damaging the glass film. The glass is peeled off from the glass film.
於如下述專利文獻2所記載的玻璃膜積層體中，通常自玻璃膜的角(corner)部開始玻璃膜的剝離。然而，專利文獻2所記載的玻璃膜積層體由於玻璃膜的整個面與支持玻璃接觸，故而不存在剝離玻璃膜時的起點。因此，在支持玻璃與玻璃膜的附著力牢固的情況下，存在難以抓持玻璃膜的角部而於剝離玻璃膜時容易於玻璃膜的角部產生破損或缺口等的問題。 In the glass film layered body described in the following Patent Document 2, the peeling of the glass film is usually started from the corner portion of the glass film. However, since the glass film laminate described in Patent Document 2 is in contact with the support glass over the entire surface of the glass film, there is no starting point when the glass film is peeled off. Therefore, when the adhesion between the support glass and the glass film is strong, there is a problem in that it is difficult to grip the corner portion of the glass film, and when the glass film is peeled off, it is likely to cause breakage or chipping at the corner portion of the glass film.
為了解決該問題，於下述專利文獻3中提出有於支持玻璃上形成階差而使玻璃膜的角部或一邊自支持玻璃分開的玻璃膜積層體。藉此，於剝離玻璃膜時，能以玻璃膜自支持玻璃分開的部位為起點，而容易地自支持玻璃剝離玻璃膜。 In order to solve this problem, Patent Document 3 listed below proposes a glass film laminate in which a step is formed on a supporting glass to separate a corner portion or a side of a glass film from a supporting glass. Thereby, when the glass film is peeled off, the glass film can be easily peeled off from the support glass with the glass film separated from the support glass as a starting point.
先前技術文獻 Prior technical literature
專利文獻 Patent literature
專利文獻1：日本專利特開2010-132531號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-132531
專利文獻2：日本專利特開2011-183792號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2011-183792
專利文獻3：日本專利特開2012-131664號公報 Patent Document 3: Japanese Patent Laid-Open Publication No. 2012-131664
通常，於顯示器等電子元件的製造步驟中，因要對玻璃基板表面進行透明導電膜等的成膜處理等而具有塗佈光阻劑(photoresist)等步驟的情況較多。 In the manufacturing process of an electronic component such as a display, a step of applying a photoresist or the like to a film forming process such as a transparent conductive film on the surface of the glass substrate is often employed.
然而，於專利文獻3所記載的玻璃膜積層體中，由於玻璃膜與支持玻璃之間分開，故而會產生如下問題：若於玻璃膜上 進行樹脂材料等的塗佈，則因樹脂繞進分開部分而導致玻璃膜與支持玻璃被牢固地黏著。若玻璃膜與支持玻璃因樹脂材料等而黏著，則有於自支持玻璃剝離玻璃膜時產生玻璃膜破損的問題的顧慮。而且，於專利文獻3所記載的玻璃膜積層體中，有於製作階差時產生玻璃粉或污物(dirt)等的顧慮，若此種玻璃粉或污物等殘留於支持玻璃的上表面，則有於玻璃膜積層時會成為氣泡的原因的顧慮。若於玻璃膜積層體存在此種氣泡，則有於對玻璃膜進行製造相關處理時難以適當地進行製造相關處理的顧慮。 However, in the glass film laminate described in Patent Document 3, since the glass film is separated from the support glass, the following problem occurs: if it is on the glass film When the coating of the resin material or the like is performed, the glass film and the supporting glass are firmly adhered by the resin being wound into the separated portion. When the glass film and the supporting glass are adhered by a resin material or the like, there is a concern that the glass film is broken when the glass film is peeled off from the supporting glass. Further, in the glass film layered product described in Patent Document 3, there is a concern that glass powder or dirt is generated when a step is produced, and such glass frit or dirt remains on the upper surface of the support glass. There is a concern that it may become a cause of bubbles when the glass film is laminated. When such a bubble is present in the glass film laminate, there is a concern that it is difficult to appropriately perform the production-related treatment when the glass film is subjected to a production-related treatment.
本發明是為了解決上述現有技術的問題點而完成，目的在於在電子元件等的製造相關處理後可容易地自支持玻璃剝離玻璃膜。而且，本發明的目的在於製作於積層界面產生的氣泡少的玻璃膜積層體。 The present invention has been made to solve the above problems of the prior art, and an object thereof is to easily peel a glass film from a supporting glass after the manufacturing process of an electronic component or the like. Further, an object of the present invention is to produce a glass film laminate having few bubbles generated at a laminate interface.
為了解決上述課題而發明的本發明是有關於一種膜狀玻璃的製造方法，該膜狀玻璃的製造方法包括：玻璃膜積層體製作步驟，於支持玻璃上積層玻璃膜而製作玻璃膜積層體；剝離開始部形成步驟，於上述玻璃膜積層體的側部，形成上述玻璃膜與上述支持玻璃一部分分開而成的剝離開始部；以及分離步驟，於上述剝離開始部形成步驟後，以上述玻璃膜積層體的上述剝離開始部為起點，將上述玻璃膜積層體分離為上述玻璃膜與上述支持玻璃。 The present invention has been made in order to solve the above problems, and relates to a method for producing a film-shaped glass, comprising: a step of producing a glass film layered product; and laminating a glass film on a supporting glass to form a glass film layered body; a peeling start portion forming step of forming a peeling start portion in which the glass film is partially separated from the support glass in a side portion of the glass film layered body; and a separating step of forming the glass film after the peeling start portion forming step The peeling start portion of the laminate is a starting point, and the glass film laminate is separated into the glass film and the support glass.
於上述構成中，較佳為，於上述玻璃膜積層體製作步驟與上述剝離開始部形成步驟之間，包括對上述玻璃膜進行製造相關處理的製造相關處理步驟。 In the above configuration, preferably, between the glass film layer forming step and the peeling start portion forming step, a manufacturing-related processing step of performing the manufacturing process on the glass film is included.
於上述構成中，較佳為，上述剝離開始部形成步驟是藉由對上述玻璃膜積層體的側部賦予含有氟化合物的液體而形成上述剝離開始部。 In the above-described configuration, it is preferable that the peeling start portion forming step is to form the peeling start portion by applying a liquid containing a fluorine compound to a side portion of the glass film laminate.
於上述構成中，較佳為，上述玻璃膜積層體具有大致矩形狀的玻璃膜積層體經切角(corner cut)後的形狀，且上述剝離開始部形成步驟是於上述玻璃膜積層體的至少一個角部形成上述剝離開始部。 In the above configuration, preferably, the glass film layered body has a shape in which a substantially rectangular glass film layered body is subjected to a corner cut, and the peeling start portion forming step is at least the glass film layered body One corner portion forms the above-described peeling start portion.
於上述構成中，較佳為，上述玻璃膜積層體為大致矩形狀，且上述剝離開始部形成步驟是於上述玻璃膜積層體的至少一邊形成上述剝離開始部。 In the above configuration, it is preferable that the glass film layered body has a substantially rectangular shape, and the peeling start portion forming step is to form the peeling start portion on at least one side of the glass film layered body.
於上述構成中，較佳為，上述玻璃膜積層體為大致矩形狀，且上述剝離開始部形成步驟是對上述玻璃膜積層體的側部中的至少三邊賦予含有氟化合物的液體，並將中央的一邊作為上述剝離開始部。 In the above configuration, it is preferable that the glass film layered body has a substantially rectangular shape, and the peeling start portion forming step is to apply a liquid containing a fluorine compound to at least three sides of a side portion of the glass film layered body, and One side of the center serves as the peeling start portion.
於上述構成中，較佳為，距上述玻璃膜端面的上述剝離開始部的分開距離大於等於1mm。 In the above configuration, preferably, the separation distance from the peeling start portion of the end surface of the glass film is 1 mm or more.
為了解決上述課題而發明的本發明是有關於一種電子元件的製造方法，該電子元件的製造方法的特徵在於包括：玻璃膜積層體製作步驟，於支持玻璃上積層玻璃膜而製作玻璃膜積層體；電子元件製作步驟，藉由對上述玻璃膜積層體中的上述玻璃膜進行電子元件製造相關處理，於上述玻璃膜積層體的上述玻璃膜上形成元件(element)，並利用密封基板密封上述元件而製作帶支持玻璃的電子元件；剝離開始部形成步驟，於上述製造相關處理後的上述帶支持玻璃的電子元件中的上述玻璃膜積層體的側 部，形成上述玻璃膜與上述支持玻璃一部分分開而成的剝離開始部；以及分離步驟，以上述剝離開始部為起點，將上述剝離開始部形成步驟後的上述帶支持玻璃的電子元件分離為上述電子元件與上述支持玻璃。 The present invention has been made in order to solve the above problems, and relates to a method for producing an electronic component, which comprises the steps of: manufacturing a glass film layered body, and laminating a glass film on a supporting glass to form a glass film layered body. In the electronic component manufacturing step, an element is formed on the glass film of the glass film layered body by performing an electronic component manufacturing process on the glass film in the glass film layered body, and the element is sealed by a sealing substrate. And producing an electronic component with a supporting glass; a peeling start portion forming step of the side of the glass film laminate in the glass-supporting electronic component after the manufacturing process described above a separation start portion in which the glass film is separated from a part of the support glass, and a separation step of separating the electronic component with the support glass after the peeling start portion forming step from the peeling start portion as described above Electronic components and the above supporting glass.
於上述構成中，較佳為，上述密封基板為覆蓋玻璃膜積層於載體玻璃(carrier glass)而成的覆蓋玻璃膜積層體，且於上述玻璃膜積層體製作步驟中，進而包括於上述載體玻璃上積層上述覆蓋玻璃膜而製作覆蓋玻璃膜積層體的步驟，於上述剝離開始部形成步驟中，進而包括於上述覆蓋玻璃膜積層體的側部形成上述覆蓋玻璃膜與上述載體玻璃一部分分開而成的覆蓋玻璃膜側剝離開始部的步驟，於上述分離步驟中，進而包括以上述覆蓋玻璃膜側剝離開始部為起點而分離上述載體玻璃與上述覆蓋玻璃膜的步驟。 In the above configuration, preferably, the sealing substrate is a cover glass film laminate in which a cover glass film is laminated on a carrier glass, and is further included in the carrier glass in the glass film laminate production step. The step of forming the cover glass film layer by laminating the cover glass film, and forming the cover glass film on the side portion of the cover glass film layer to form the cover glass film and the carrier glass are separated by a part of the cover film forming step. The step of covering the glass film side peeling start portion further includes a step of separating the carrier glass and the cover glass film from the covering glass film side peeling start portion as the starting point in the separating step.
為了解決上述課題而發明的本發明是有關於一種玻璃膜積層體的製造方法，該玻璃膜積層體的製造方法包括：玻璃膜積層體製作步驟，於支持玻璃上積層玻璃膜而製作玻璃膜積層體；以及剝離開始部形成步驟，於上述玻璃膜積層體的側部，形成上述玻璃膜與上述支持玻璃一部分分開而成的剝離開始部。 The present invention has been made in order to solve the above problems, and relates to a method for producing a glass film layered body comprising the steps of: forming a glass film layered body, and laminating a glass film on a supporting glass to form a glass film layer. And a peeling start portion forming step of forming a peeling start portion in which the glass film is partially separated from the support glass in a side portion of the glass film layered body.
根據本發明，於電子元件等的製造相關處理後，可容易地自支持玻璃剝離玻璃膜。而且，可製作於積層界面氣泡產生少的玻璃膜積層體。 According to the present invention, after the manufacturing process of the electronic component or the like, the glass film can be easily peeled off from the support glass. Further, it is possible to produce a glass film laminate having less generation of bubbles at the laminated interface.
1‧‧‧玻璃膜積層體 1‧‧‧Glass laminar body
2‧‧‧元件 2‧‧‧ components
3‧‧‧剝離開始部 3‧‧‧ peeling start
4‧‧‧成形爐 4‧‧‧Forming furnace
5‧‧‧處理槽 5‧‧‧Processing tank
6‧‧‧玻璃膜剝離裝置 6‧‧‧glass film stripping device
7‧‧‧覆蓋玻璃膜積層體 7‧‧‧ Covering the film laminate
8‧‧‧帶支持玻璃載體玻璃的電子元件 8‧‧‧With electronic components supporting glass carrier glass
11‧‧‧玻璃膜 11‧‧‧ glass film
11a‧‧‧玻璃膜的上表面 11a‧‧‧ Upper surface of the glass film
11b‧‧‧玻璃膜的下表面 11b‧‧‧The lower surface of the glass film
12‧‧‧支持玻璃 12‧‧‧Support glass
12a‧‧‧支持玻璃的上表面 12a‧‧‧Support the upper surface of the glass
12b‧‧‧支持玻璃的上表面 12b‧‧‧Support the upper surface of the glass
13‧‧‧調整層 13‧‧‧Adjustment layer
14、73‧‧‧側部 14, 73‧‧‧ side
15、74‧‧‧界面 15, 74‧‧‧ interface
21‧‧‧間隔物 21‧‧‧ spacers
22‧‧‧保護構件 22‧‧‧Protection components
31‧‧‧覆蓋玻璃膜側剝離開始部 31‧‧‧ Covering the beginning of the peeling of the glass film side
41‧‧‧成形體 41‧‧‧Formed body
42‧‧‧下端部 42‧‧‧Bottom
43‧‧‧冷卻輥 43‧‧‧Cooling roller
51‧‧‧處理液 51‧‧‧ treatment solution
61‧‧‧噴嘴 61‧‧‧Nozzles
62‧‧‧流體 62‧‧‧ fluid
63‧‧‧支持玻璃保持機構 63‧‧‧Support glass retention mechanism
63a‧‧‧支持玻璃保持機構的真空吸附墊 63a‧‧‧Vacuum suction pad supporting glass holding mechanism
64‧‧‧玻璃膜保持機構 64‧‧‧Glass film holding mechanism
64a‧‧‧玻璃膜保持機構的真空吸附墊 64a‧‧‧Vacuum film holding mechanism vacuum suction pad
65‧‧‧載體玻璃保持機構 65‧‧‧Carrier glass retention mechanism
71‧‧‧覆蓋玻璃膜 71‧‧‧ Covering the glass film
72‧‧‧載體玻璃 72‧‧‧ Carrier glass
81‧‧‧電子元件 81‧‧‧Electronic components
110‧‧‧膜狀玻璃 110‧‧‧film glass
d‧‧‧浸漬深度 d‧‧‧Dip depth
G‧‧‧玻璃帶 G‧‧‧glass ribbon
h‧‧‧分開高度 h‧‧‧Separate height
t‧‧‧分開距離 t‧‧‧Separate distance
圖1是表示本發明的一實施方式的膜狀玻璃的製造方法的模式圖。 Fig. 1 is a schematic view showing a method of producing a film glass according to an embodiment of the present invention.
圖2是表示本發明的玻璃膜積層體製作步驟的一例的圖。 Fig. 2 is a view showing an example of a procedure for producing a glass film laminate according to the present invention.
圖3是表示玻璃膜及支持玻璃的製造方法的一例的圖。 3 is a view showing an example of a method of producing a glass film and a support glass.
圖4是於玻璃膜積層體的側部形成有剝離開始部的圖。 4 is a view in which a peeling start portion is formed on a side portion of a glass film laminate.
圖5是表示剝離開始部的另一實施方式的圖。 Fig. 5 is a view showing another embodiment of a peeling start portion.
圖6是於包含調整層的玻璃膜積層體的側部形成有剝離開始部的圖。 FIG. 6 is a view in which a peeling start portion is formed on a side portion of a glass film laminate including an adjustment layer.
圖7是表示剝離開始部形成步驟(剝離開始部的形成方法)的一例的圖。 FIG. 7 is a view showing an example of a peeling start portion forming step (a method of forming a peeling start portion).
圖8是表示本發明的剝離步驟的一例的圖。 Fig. 8 is a view showing an example of a peeling step of the present invention.
圖9是表示本發明的實施方式的電子元件的製造方法的圖。 FIG. 9 is a view showing a method of manufacturing an electronic component according to an embodiment of the present invention.
圖10是表示帶支持玻璃載體玻璃的電子元件的一例的圖。 Fig. 10 is a view showing an example of an electronic component with a supporting glass carrier glass.
圖11是表示電子元件的製造方法的實施方式中的剝離步驟的一例的圖。 FIG. 11 is a view showing an example of a peeling step in the embodiment of the method of manufacturing an electronic component.
以下，一面參照圖式，一面對本發明的電子元件的製造方法的較佳實施方式進行說明。然而，以下的實施方式僅為一例，本發明不受以下的實施方式任何限定。 Hereinafter, a preferred embodiment of the method of manufacturing an electronic component of the present invention will be described with reference to the drawings. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments.
本發明的較佳的膜狀玻璃的製造方法如圖1所示，包括：玻璃膜積層體製作步驟，於支持玻璃12上積層玻璃膜11而製作玻璃膜積層體1；製造相關處理步驟，藉由對玻璃膜11進行 電子元件等的製造相關處理，於玻璃膜積層體1的玻璃膜11上形成元件2；剝離開始部形成步驟，於玻璃膜積層體1的側部形成剝離開始部3；以及剝離步驟，以剝離開始部3為起點，剝離支持玻璃12與玻璃膜11。 As shown in FIG. 1, the method for producing a preferred film glass of the present invention includes a step of producing a glass film layered product, and laminating a glass film 11 on a supporting glass 12 to produce a glass film layered body 1; By the glass film 11 In the manufacturing process of an electronic component or the like, the element 2 is formed on the glass film 11 of the glass film laminate 1; the peeling start portion forming step is performed to form the peeling start portion 3 on the side portion of the glass film layered body 1; and the peeling step is performed to peel off The starting portion 3 is a starting point, and the support glass 12 and the glass film 11 are peeled off.
圖2是表示本發明的玻璃膜積層體製作步驟的一例的圖。 Fig. 2 is a view showing an example of a procedure for producing a glass film laminate according to the present invention.
玻璃膜11使用矽酸鹽玻璃(silicate glass)或二氧化矽玻璃(silica glass)，較佳為使用硼矽酸玻璃(borosilicate glass)、鋁矽酸鹽玻璃(aluminosilicate glass)、鋁硼矽酸鹽玻璃(aluminoborosilicate glass)，最佳為使用無鹼玻璃(alkali free glass)。當玻璃膜11含有鹼(alkali)成分時，會於表面產生陽離子(ion)的脫落，而產生所謂的噴鈉(soda)的現象，而使構造上變得粗糙。在此情況下，若使玻璃膜11彎曲而使用，則可能會自因長年劣化而變得粗糙的部分破損。另外，此處所謂無鹼玻璃，是指實質上不包含鹼成分(鹼金屬氧化物)的玻璃，具體而言，是指鹼成分小於等於3000ppm的玻璃。本發明中的鹼成分的含量較佳為小於等於1000ppm，更佳為小於等於500ppm，進而較佳為小於等於300ppm。 The glass film 11 is made of silicate glass or silica glass, preferably borosilicate glass, aluminosilicate glass, or aluminum borosilicate. Aluminoborosilicate glass, preferably using alkali free glass. When the glass film 11 contains an alkali component, cations are detached on the surface, and a so-called soda phenomenon occurs, which makes the structure rough. In this case, when the glass film 11 is bent and used, the portion which is roughened due to deterioration over a long period of time may be damaged. In addition, the term "alkali-free glass" as used herein means a glass which does not substantially contain an alkali component (alkali metal oxide), and specifically refers to a glass having an alkali component of 3,000 ppm or less. The content of the alkali component in the present invention is preferably 1000 ppm or less, more preferably 500 ppm or less, still more preferably 300 ppm or less.
玻璃膜11的厚度較佳為小於等於300μm，更佳為5μm~200μm，最佳為5μm~100μm。藉此，可使玻璃膜11的厚度更薄而賦予適當的可撓性，並且對於操作(handling)性困難且容易產生定位錯誤(miss)或圖案化時的撓曲等問題的玻璃膜11，藉由使用下述支持玻璃12，可容易地進行電子元件製造相關處理等。若玻璃膜11的厚度未滿5μm，則有玻璃膜11的強度易變得 不足而難以自支持玻璃12剝離玻璃膜11的顧慮。 The thickness of the glass film 11 is preferably 300 μm or less, more preferably 5 μm to 200 μm, and most preferably 5 μm to 100 μm. Thereby, the thickness of the glass film 11 can be made thinner, and appropriate flexibility can be imparted, and the glass film 11 which is difficult in handling and which is liable to cause problems such as misalignment or distortion at the time of patterning, By using the support glass 12 described below, it is possible to easily perform processing related to electronic component manufacturing and the like. If the thickness of the glass film 11 is less than 5 μm, the strength of the glass film 11 tends to become It is difficult to self-support the concern that the glass 12 peels off the glass film 11.
支持玻璃12與玻璃膜11同樣地使用矽酸鹽玻璃或二氧化矽玻璃，較佳為使用硼矽酸玻璃、鋁矽酸鹽玻璃、鋁硼矽酸鹽玻璃，最佳為使用無鹼玻璃。關於支持玻璃12，較佳為使用在30~380℃時與玻璃膜11的熱膨脹係數的差為5×10-7/℃以內的玻璃。藉此，即便於電子元件製造相關處理時伴有加熱，亦不易產生因膨脹率差而引起的熱翹曲或玻璃膜11的破裂等，從而可製成能維持穩定的積層狀態的玻璃膜積層體1。支持玻璃12與玻璃膜11最佳為使用具有相同組成的玻璃。 The support glass 12 is made of tantalate glass or cerium oxide glass similarly to the glass film 11, and it is preferable to use a borosilicate glass, an aluminosilicate glass, an aluminoborosilicate glass, and it is preferable to use an alkali-free glass. As the support glass 12, it is preferable to use a glass having a difference in thermal expansion coefficient from the glass film 11 of 5 × 10 -7 / ° C at 30 to 380 °C. As a result, even when heating is performed in the process of manufacturing the electronic component, heat warpage due to a difference in expansion ratio or cracking of the glass film 11 is less likely to occur, and a glass film layer capable of maintaining a stable laminated state can be produced. Body 1. The support glass 12 and the glass film 11 are preferably made of glass having the same composition.
支持玻璃12的厚度較佳為大於等於300μm。若支持玻璃12的厚度未滿300μm，則在將支持玻璃12以單體進行操作的情況下，有於強度方面產生問題的顧慮。支持玻璃12的厚度較佳為400μm~700μm，最佳為500μm~700μm。藉此，可確實地支持玻璃膜11。另外，於電子元件等的製造相關處理時，於在未圖示的安裝器(setter)上載置玻璃膜積層體1的情況下，支持玻璃12的厚度亦可未滿300μm(例如為200μm等與玻璃膜11相同的厚度)。 The thickness of the support glass 12 is preferably 300 μm or more. If the thickness of the supporting glass 12 is less than 300 μm, there is a concern that there is a problem in strength when the supporting glass 12 is operated as a single body. The thickness of the support glass 12 is preferably from 400 μm to 700 μm, and most preferably from 500 μm to 700 μm. Thereby, the glass film 11 can be surely supported. In the case of manufacturing the electronic component or the like, when the glass laminate 1 is placed on a setter (not shown), the thickness of the support glass 12 may be less than 300 μm (for example, 200 μm or the like). The glass film 11 has the same thickness).
本發明所使用的玻璃膜11及支持玻璃12較佳為利用下拉(down-draw)法、浮式(float)法、流孔下引(slot down-draw)法、滾壓(roll out)法、上拉(up-draw)法、再曳引(redraw)法等成形，更佳為利用溢流下拉(overflow down-draw)法成形。特別是圖3所示的溢流下拉法是於成形時玻璃板的兩面不與成形構件接觸的成形法，而於所獲得之玻璃板的兩面(透光面)不易產生損傷，即便不進行研磨，亦可獲得高表面品質。 The glass film 11 and the support glass 12 used in the present invention are preferably a down-draw method, a float method, a slot down-draw method, or a roll out method. Forming such as an up-draw method or a redraw method is more preferably formed by an overflow down-draw method. In particular, the overflow down-draw method shown in Fig. 3 is a molding method in which both surfaces of the glass sheet are not in contact with the forming member at the time of molding, and it is less likely to cause damage on both surfaces (light-transmitting surfaces) of the obtained glass sheet, even if polishing is not performed. , also can get high surface quality.
於圖3所示的溢流下拉法中，剛自成形爐4內的剖面為楔型的成形體41的下端部42流下之後的玻璃帶(glass ribbon)G一面由冷卻輥(roller)43限制寬度方向的收縮，一面向下方拉伸，而變薄至規定的厚度。繼而，將達到上述規定厚度的玻璃帶G於緩冷爐(anneal)中緩慢冷卻以去除玻璃帶G的熱應變，並將玻璃帶G切斷為規定尺寸，藉此，玻璃膜11及支持玻璃12分別成形。 In the overflow down-draw method shown in FIG. 3, the glass ribbon G immediately after flowing down from the lower end portion 42 of the wedge-shaped molded body 41 in the forming furnace 4 is restricted by a cooling roller 43. Shrinkage in the width direction, one side stretched downward, and thinned to a prescribed thickness. Then, the glass ribbon G having the predetermined thickness is slowly cooled in the anneal to remove the thermal strain of the glass ribbon G, and the glass ribbon G is cut into a predetermined size, whereby the glass film 11 and the supporting glass are used. 12 separately formed.
於圖2中，支持玻璃12與玻璃膜11為大致相同的大小，但就保護玻璃膜11的觀點而言，較佳為玻璃膜11較支持玻璃12小一圈。在此情況下，支持玻璃12自玻璃膜11的超出量較佳為0.5~30mm，更佳為0.5~5mm。藉由減少支持玻璃12的超出量，可確保玻璃膜11的有效面更寬。特別是在玻璃膜11較支持玻璃12小一圈的玻璃膜積層體1的情況下，玻璃膜11的前表面與支持玻璃12接觸，因此，因無剝離玻璃膜11的起點而難以自支持玻璃12剝離玻璃膜11。即便在此種情況下，藉由利用下述剝離開始部形成步驟形成剝離開始部3，即便玻璃膜11較支持玻璃12小一圈，亦可較佳地剝離玻璃膜11。 In FIG. 2, the support glass 12 and the glass film 11 are substantially the same size, but from the viewpoint of protecting the glass film 11, it is preferable that the glass film 11 is smaller than the support glass 12. In this case, the excess amount of the support glass 12 from the glass film 11 is preferably from 0.5 to 30 mm, more preferably from 0.5 to 5 mm. By reducing the excess of the support glass 12, it is ensured that the effective surface of the glass film 11 is wider. In particular, in the case where the glass film 11 is thinner than the glass film laminate 1 which supports the glass 12, the front surface of the glass film 11 is in contact with the support glass 12, and therefore it is difficult to self-support the glass because there is no starting point of the peeling glass film 11. 12 peels off the glass film 11. Even in such a case, the peeling start portion 3 is formed by the following peeling start portion forming step, and even if the glass film 11 is smaller than the supporting glass 12, the glass film 11 can be preferably peeled off.
玻璃膜11及支持玻璃12的相互接觸側的表面(玻璃膜11的下表面11b與支持玻璃12的上表面12a)的表面粗糙度Ra較佳為分別小於等於2.0nm。藉此，不使用黏著劑便可使玻璃膜11與支持玻璃12穩定地積層。玻璃膜11的下表面11b及支持玻璃12的上表面12a的表面粗糙度Ra較佳為分別小於等於1.0nm，更佳為小於等於0.5nm，最佳為小於等於0.2nm。 The surface roughness Ra of the surfaces of the glass film 11 and the supporting glass 12 on the mutually contacting side (the lower surface 11b of the glass film 11 and the upper surface 12a of the supporting glass 12) is preferably 2.0 nm or less. Thereby, the glass film 11 and the support glass 12 can be stably laminated without using an adhesive. The surface roughness Ra of the lower surface 11b of the glass film 11 and the upper surface 12a of the support glass 12 is preferably 1.0 nm or less, more preferably 0.5 nm or less, and most preferably 0.2 nm or less.
於圖1所示的實施方式中是藉由使玻璃膜11與支持玻 璃12直接面接觸而使玻璃膜11與支持玻璃12積層，但為了適當調整玻璃膜11與支持玻璃12的黏著性或製造相關處理後的剝離性，亦可於支持玻璃12的上表面12a上或玻璃膜11的下表面11b上適當形成氧化銦錫(Indium Tin Oxides，ITO)等無機氧化物薄膜(金屬氧化物薄膜)或Ti等金屬薄膜等、丙烯酸系樹脂(acrylic resin)或矽酮樹脂(silicone resin)等樹脂層等。於在玻璃膜11的下表面11b或支持玻璃的上表面12a形成上述無機氧化物(金屬氧化物薄膜)或Ti等金屬薄膜的情況下，所形成的膜表面的表面粗糙度Ra較佳為小於等於2.0nm，更佳為小於等於1.0nm，更佳為小於等於0.5nm，最佳為小於等於0.2nm。 In the embodiment shown in FIG. 1 by making the glass film 11 and supporting glass The glass 12 is directly surface-contacted to laminate the glass film 11 and the support glass 12, but may be applied to the upper surface 12a of the support glass 12 in order to appropriately adjust the adhesion of the glass film 11 to the support glass 12 or the peelability after the manufacturing process. Or an inorganic oxide thin film (metal oxide thin film) such as indium tin oxide (ITO) or a metal thin film such as Ti, or an acrylic resin or an oxime resin, is formed on the lower surface 11b of the glass film 11. A resin layer or the like such as (silicone resin). When the inorganic oxide (metal oxide film) or the metal thin film such as Ti is formed on the lower surface 11b of the glass film 11 or the upper surface 12a of the support glass, the surface roughness Ra of the formed film surface is preferably smaller than It is equal to 2.0 nm, more preferably 1.0 nm or less, still more preferably 0.5 nm or less, and most preferably 0.2 nm or less.
較佳為，於玻璃膜積層體製作步驟與下述剝離開始部形成步驟之間包括製造相關處理步驟。本實施方式中的製造相關處理步驟是如下的步驟：藉由進行製造相關處理，於在玻璃膜積層體製作步驟中所製作的玻璃膜積層體1的玻璃膜11的上表面11a(有效面)上形成元件2。作為於玻璃膜11的上表面11a(有效面)上形成的元件2，可列舉液晶元件、有機EL元件、觸控面板(touch panel)元件、太陽電池元件、壓電元件、受光元件、鋰離子(lithium ion)二次電池等電池元件、微機電系統(Micro Electro Mechanical Systems，MEMS)元件、半導體元件等。在製造相關處理步驟中形成於玻璃膜11上者並不限定於如圖1所示的元件2，亦包括玻璃料(glass frit)的燒結處理等或成膜抗反射膜、防透過膜、反射膜、防污塗層(coat)等。 Preferably, the manufacturing process step is included between the glass film layer forming step and the peeling start portion forming step described below. The manufacturing-related processing step in the present embodiment is a step of performing the manufacturing-related processing on the upper surface 11a (effective surface) of the glass film 11 of the glass film layered body 1 produced in the glass film layer forming step. Element 2 is formed thereon. Examples of the element 2 formed on the upper surface 11a (effective surface) of the glass film 11 include a liquid crystal element, an organic EL element, a touch panel element, a solar cell element, a piezoelectric element, a light receiving element, and a lithium ion. (lithium ion) battery element such as a secondary battery, a micro electro mechanical system (MEMS) element, a semiconductor element, or the like. The film formed on the glass film 11 in the manufacturing-related processing step is not limited to the element 2 as shown in FIG. 1, but also includes a glass frit sintering treatment or the like, or a film-forming anti-reflection film, an anti-reflection film, and a reflection. Membrane, antifouling coating, etc.
作為製造相關處理步驟中的製造相關處理，較佳為伴隨加熱的製造相關處理，例如可列舉利用化學蒸氣沈積(Chemical Vapor Deposition，CVD)法或濺鍍(sputtering)等的成膜處理等。於伴隨加熱的製造相關處理後，特別是於不易自支持玻璃12剝離玻璃膜11時，藉由於下述剝離開始部形成步驟中形成剝離開始部3，可容易地自支持玻璃12剝離玻璃膜11。於液晶顯示器或有機EL元件等的製造中，於玻璃膜11上形成有光阻劑或彩色濾光片(color filter)等，但於製造相關處理步驟時，本發明中的玻璃膜積層體1由於在玻璃膜11與支持玻璃12之間不存在分開的部位，故而該些有機系材料意外地殘留於玻璃膜積層體1的端部(玻璃膜11與支持玻璃12的界面)而使支持玻璃12與玻璃膜11黏著的情況較少。 The manufacturing-related treatment in the manufacturing-related processing step is preferably a manufacturing-related treatment accompanying heating, and for example, chemical vapor deposition (Chemical vapor deposition) Film formation treatment such as Vapor Deposition, CVD) or sputtering. After the production-related treatment with heating, in particular, when the glass film 11 is not easily peeled off from the support glass 12, the glass film 11 can be easily peeled off from the support glass 12 by forming the peeling start portion 3 in the peeling start portion forming step described below. . In the manufacture of a liquid crystal display, an organic EL element, or the like, a photoresist or a color filter or the like is formed on the glass film 11, but the glass film laminate 1 of the present invention is produced in the relevant processing steps. Since there is no separate portion between the glass film 11 and the support glass 12, the organic materials are accidentally left at the end of the glass film laminate 1 (the interface between the glass film 11 and the support glass 12) to support the glass. 12 is less likely to adhere to the glass film 11.
剝離開始部形成步驟是於玻璃膜積層體1的側部14形成包含玻璃膜11與支持玻璃12的界面15的凹狀的剝離開始部3的步驟，藉此，玻璃膜11與支持玻璃12一部分分開。換言之，於玻璃膜積層體1的側部14的周向的至少一部分形成有剝離開始部3。 The peeling start portion forming step is a step of forming a concave peeling start portion 3 including the interface 15 between the glass film 11 and the supporting glass 12 on the side portion 14 of the glass film layered body 1, whereby the glass film 11 and the supporting glass 12 are partially formed. separate. In other words, the peeling start portion 3 is formed in at least a part of the circumferential direction of the side portion 14 of the glass film layered body 1.
於本實施方式中，於玻璃膜積層體製作步驟後進行剝離開始部形成步驟，故而與先進行剝離開始部形成步驟的情況相比，可防止如下情況：因於剝離開始部形成步驟時產生的玻璃粉等污物或異物附著於支持玻璃12的上表面12a而導致污物等異物混入界面15，從而導致於製作玻璃膜積層體1時產生氣泡等。因此，可製作氣泡產生少的玻璃膜積層體1。而且，藉由於製造相關處理步驟後進行剝離開始部形成步驟，可防止玻璃膜11與支持玻璃12因樹脂等黏著。 In the present embodiment, the peeling start portion forming step is performed after the glass film layer forming step. Therefore, compared with the case where the peeling start portion forming step is performed first, it is possible to prevent the occurrence of the peeling start portion forming step. Contaminants or foreign matter such as glass frit adhere to the upper surface 12a of the support glass 12, and foreign matter such as dirt is mixed into the interface 15, resulting in generation of bubbles or the like when the glass film laminate 1 is produced. Therefore, the glass film layered body 1 which produces little bubbles can be produced. Further, by performing the peeling start portion forming step after the production process step, it is possible to prevent the glass film 11 and the support glass 12 from adhering to the resin or the like.
圖4是於玻璃膜積層體1的側部14形成有玻璃膜11與 支持玻璃12分開而成的剝離開始部3的圖。 4 is a glass film 11 formed on the side portion 14 of the glass film laminate 1 and A diagram of the peeling start portion 3 in which the glass 12 is separated.
剝離開始部3是於玻璃膜積層體1的側部14玻璃膜11與支持玻璃12相互分開而成的區域。詳細而言，於玻璃膜積層體1的側部14，藉由使玻璃膜11的下表面11a側與支持玻璃12的上表面12a側的各自的厚度減少，而形成剝離開始部3。另外，剝離開始部3的玻璃膜積層體1的外側開放。由於使玻璃膜11的厚度與支持玻璃12的厚度分別減少，故而不對玻璃膜積層體1施加外力、亦即玻璃膜11的上表面11a與支持玻璃12b的下表面12b未變形而於保持玻璃膜積層體1原樣的狀態下便可使玻璃膜11與支持玻璃12分開。於圖4中，藉由使玻璃膜11與支持玻璃12的兩者的厚度減少而形成剝離開始部3，但並不限定於此，亦可藉由僅使玻璃膜11與支持玻璃12的其中任一者的厚度減少而形成剝離開始部3。特別是若僅使玻璃膜11的厚度減少，則可再利用(recycle)支持玻璃12，故而較佳。 The peeling start portion 3 is a region in which the glass film 11 and the support glass 12 are separated from each other in the side portion 14 of the glass film layered body 1. Specifically, the peeling start portion 3 is formed on the side portion 14 of the glass film laminate 1 by reducing the thickness of each of the lower surface 11a side of the glass film 11 and the upper surface 12a side of the support glass 12. Further, the outer side of the glass film layered body 1 of the peeling start portion 3 is opened. Since the thickness of the glass film 11 and the thickness of the support glass 12 are respectively reduced, no external force is applied to the glass film laminate 1, that is, the upper surface 11a of the glass film 11 and the lower surface 12b of the support glass 12b are not deformed to maintain the glass film. The glass film 11 can be separated from the support glass 12 in the state in which the laminated body 1 is as it is. In FIG. 4, the peeling start portion 3 is formed by reducing the thickness of both the glass film 11 and the supporting glass 12, but the present invention is not limited thereto, and only the glass film 11 and the supporting glass 12 may be formed. The thickness of either of them is reduced to form the peeling start portion 3. In particular, if only the thickness of the glass film 11 is reduced, the support glass 12 can be recycled, which is preferable.
剝離開始部3中的玻璃膜11與支持玻璃12的分開高度h並無特別限定，於在下述剝離步驟時使用金屬刀等剝離構件的情況下，較佳為大於所使用的剝離構件的壁厚。藉此，藉由將剝離構件切入玻璃膜11的端面，可防止玻璃膜11的端面的品質變差。 The separation height h of the glass film 11 and the support glass 12 in the peeling start portion 3 is not particularly limited, and when a peeling member such as a metal knife is used in the peeling step described below, it is preferably larger than the thickness of the peeling member to be used. . Thereby, the quality of the end surface of the glass film 11 can be prevented from being deteriorated by cutting the peeling member into the end surface of the glass film 11.
自玻璃膜積層體1的側部14朝向內側的方向上的剝離開始部3的深度、即剝離開始部3距玻璃膜端面的分開距離t較佳為大於上述分開高度h。藉此，於開始剝離玻璃膜11與支持玻璃12時，可使於剝離開始時賦予至玻璃膜11的應力減少。分開距離t較佳為大於支持玻璃12的厚度，且較佳為大於玻璃膜積層體1的總厚度。具體而言，分開距離t較佳為大於等於1mm，更佳為 大於等於5mm。藉此，於下述剝離步驟時，能以剝離開始部3為起點自支持玻璃12容易地剝離玻璃膜11。距玻璃膜端面的分開距離t較佳為小於等於20mm，更佳為小於等於10mm。藉此，可於短時間內形成剝離開始部3。 The depth of the peeling start portion 3 in the direction from the side portion 14 of the glass film laminate 1 toward the inner side, that is, the separation distance t from the end surface of the glass film of the peeling start portion 3 is preferably larger than the above-described separation height h. Thereby, when the glass film 11 and the support glass 12 are peeled off, the stress applied to the glass film 11 at the start of peeling can be reduced. The separation distance t is preferably larger than the thickness of the support glass 12, and is preferably larger than the total thickness of the glass film laminate 1. Specifically, the separation distance t is preferably 1 mm or more, more preferably Greater than or equal to 5mm. Thereby, in the peeling step described below, the glass film 11 can be easily peeled off from the support glass 12 from the peeling start portion 3 as a starting point. The separation distance t from the end surface of the glass film is preferably 20 mm or less, more preferably 10 mm or less. Thereby, the peeling start part 3 can be formed in a short time.
如圖4所示，剝離開始部3較佳為如玻璃膜11與支持玻璃12的分開距離自玻璃膜積層體1的側部14朝向內側逐漸變窄的V字型的錐(taper)形狀。於開始自支持玻璃12剝離玻璃膜11時需要賦予較大曲率(較大彎曲應力)，但由於剝離開始部的前端的壁厚最小，故而於剝離開始時即便賦予較大曲率，玻璃膜11或支持玻璃12亦不易破損。而且，在使用上述剝離構件的情況下，剝離開始部3亦發揮剝離構件插入時的導向(guide)的功能，從而可更順利地完成自支持玻璃12剝離玻璃膜11。剝離開始部3的形狀並不限定於V字型的錐形狀，亦可為如圖5般的U字型。 As shown in FIG. 4, the peeling start portion 3 is preferably a V-shaped taper shape in which the separation distance between the glass film 11 and the supporting glass 12 is gradually narrowed from the side portion 14 of the glass film laminate 1 toward the inside. When the glass film 11 is peeled off from the support glass 12, it is necessary to impart a large curvature (large bending stress). However, since the thickness of the tip end of the peeling start portion is the smallest, even if a large curvature is given at the start of peeling, the glass film 11 or Support glass 12 is also not easily damaged. Further, when the peeling member is used, the peeling start portion 3 also functions as a guide at the time of insertion of the peeling member, and the glass film 11 can be peeled off from the self-supporting glass 12 more smoothly. The shape of the peeling start portion 3 is not limited to the V-shaped tapered shape, and may be a U-shape as shown in FIG.
剝離開始部3只要形成於經切角後的矩形狀的玻璃膜積層體1的至少一處角部即可。藉由形成於一處角部，能以該角部為起點自支持玻璃12容易地剝離玻璃膜11。 The peeling start portion 3 may be formed at at least one corner portion of the rectangular glass film layered body 1 after the chamfering. By forming the corner portion, the glass film 11 can be easily peeled off from the support glass 12 from the corner portion.
剝離開始部3亦可形成於大致矩形狀的玻璃膜積層體1的至少一邊。藉由形成於一邊，能以該邊部為起點容易地自支持玻璃12剝離玻璃膜11。 The peeling start portion 3 may be formed on at least one side of the substantially rectangular glass film laminate 1 . By forming on one side, the glass film 11 can be easily peeled off from the support glass 12 from the side.
如圖6所示，可於支持玻璃12的上表面12a上或玻璃膜11的下表面11b上適當形成ITO等無機氧化物薄膜(金屬氧化物薄膜)或Ti等金屬薄膜等、丙烯酸系樹脂或矽酮樹脂等樹脂層等(以下稱為調整層13)，在此情況下，亦可藉由使調整層13的厚度減少或去除一部分而形成凹狀的剝離開始部3。 As shown in FIG. 6, an inorganic oxide film (metal oxide film) such as ITO or a metal film such as Ti or the like may be suitably formed on the upper surface 12a of the support glass 12 or the lower surface 11b of the glass film 11, or an acrylic resin or A resin layer such as an anthrone resin (hereinafter referred to as an adjustment layer 13) may be formed in a concave shape by reducing or removing a part of the thickness of the adjustment layer 13 in this case.
圖7是表示剝離開始部形成步驟中的剝離開始部3的形成方法的一例的圖。於圖7中，將處理液51貯存於處理槽5內，並使玻璃膜積層體1變更姿勢成縱向後，將玻璃膜積層體1的側部14浸漬於處理液51內。此處，所謂將玻璃膜積層體1的側部14浸漬於處理液51內，是指將玻璃膜11的側面與支持玻璃12的側面兩者浸漬於處理液51內。 FIG. 7 is a view showing an example of a method of forming the peeling start portion 3 in the peeling start portion forming step. In FIG. 7, the processing liquid 51 is stored in the processing tank 5, and the glass film laminated body 1 is changed to the longitudinal direction, and the side part 14 of the glass film laminated body 1 is immersed in the processing liquid 51. Here, the immersion of the side portion 14 of the glass film laminate 1 in the treatment liquid 51 means that both the side surface of the glass film 11 and the side surface of the support glass 12 are immersed in the treatment liquid 51.
處理液51只要為可溶解玻璃的液體，則無特別限定，較佳為含有氟化合物的液體。作為氟化合物，可列舉氫氟酸(fluorinated acid)、酸性氟化銨(ammonium fluoride)、四氟硼酸(tetrafluoroborate)等，較佳為利用氫氟酸。於本實施方式中，使用含有氫氟酸的液體。處理液51的濃度較佳為10~50%，更佳為15~30%。藉此，可適當地形成剝離開始部3。另外，如圖6所示，為了對包含調整層13的玻璃膜積層體1製作剝離開始部3，處理液51只要為可溶解調整層13的液體即可。在使用ITO等無機氧化物薄膜(金屬氧化物薄膜)或Ti等金屬薄膜等無機薄膜作為調整層13的情況下，亦可使用鹽酸或硫酸等作為處理液51。在使用丙烯酸系樹脂或矽酮樹脂等樹脂層作為調整層13的情況下，可使用能溶解樹脂層的有機溶劑等作為處理液51。 The treatment liquid 51 is not particularly limited as long as it is a liquid that can dissolve the glass, and is preferably a liquid containing a fluorine compound. Examples of the fluorine compound include fluorinated acid, ammonium fluoride, and tetrafluoroborate. Hydrofluoric acid is preferably used. In the present embodiment, a liquid containing hydrofluoric acid is used. The concentration of the treatment liquid 51 is preferably from 10 to 50%, more preferably from 15 to 30%. Thereby, the peeling start part 3 can be formed suitably. In addition, as shown in FIG. 6, in order to manufacture the peeling start part 3 in the glass film laminated body 1 containing the adjustment layer 13, the process liquid 51 should just be the liquid which can melt the adjustment layer 13. When an inorganic thin film such as an inorganic oxide thin film (metal oxide thin film) such as ITO or a metal thin film such as Ti is used as the adjustment layer 13, hydrochloric acid, sulfuric acid or the like can be used as the processing liquid 51. When a resin layer such as an acrylic resin or an fluorene ketone resin is used as the adjustment layer 13, an organic solvent or the like capable of dissolving the resin layer can be used as the treatment liquid 51.
於處理液51內的玻璃膜積層體1的側部14的浸漬時間亦依賴於所使用的處理液的濃度，較佳為5分鐘~360分鐘，更佳為10分鐘~60分鐘，最佳為20~40分鐘。藉此，可於短時間內形成適當的剝離開始部3。 The immersion time of the side portion 14 of the glass film layered body 1 in the treatment liquid 51 also depends on the concentration of the treatment liquid to be used, and is preferably from 5 minutes to 360 minutes, more preferably from 10 minutes to 60 minutes, and most preferably 20~40 minutes. Thereby, an appropriate peeling start portion 3 can be formed in a short time.
如圖7所示，若將玻璃膜積層體1的側部14浸漬於處理液51內，則玻璃膜11與支持玻璃12直接積層，因此玻璃膜11 與支持玻璃12的端面角部最易受到處理液51的腐蝕。因此，首先於界面15的端部形成楔狀(V字狀)的微小的剝離開始部3，該剝離開始部3逐漸擴大，而處理液51向玻璃膜積層體1內部滲透。藉此，如圖4或如圖5所示，可形成使玻璃膜11的下表面11b側與支持玻璃12的上表面12a側的各自的厚度減少後的V字形狀或U字形狀的剝離開始部3。而且，可製成分開距離t大於分開高度h的剝離開始部3。玻璃膜積層體1的側部14於處理液51內的浸漬深度d(自處理液51的液面浸漬有玻璃膜11的端面與支持玻璃12的端面的兩者的距離)較佳為小於等於50mm，更佳為小於等於30mm，最佳為小於等於10mm。藉此，可防止玻璃膜11的上表面11a側因處理液而劣化。而且，就防止形成於玻璃膜11的上表面11a側的元件2劣化的觀點而言，亦可於玻璃膜11的上表面11a側設置利用樹脂膜等形成的保護層。 As shown in FIG. 7, when the side portion 14 of the glass film laminate 1 is immersed in the treatment liquid 51, the glass film 11 and the support glass 12 are directly laminated, and thus the glass film 11 is laminated. The end face corners of the support glass 12 are most susceptible to corrosion by the treatment liquid 51. Therefore, first, a wedge-shaped (V-shaped) minute peeling start portion 3 is formed at the end portion of the interface 15, and the peeling start portion 3 is gradually enlarged, and the processing liquid 51 is infiltrated into the inside of the glass film layered body 1. As a result, as shown in FIG. 4 or as shown in FIG. 5, peeling of the V-shape or the U-shape after the thickness of the lower surface 11b side of the glass film 11 and the upper surface 12a side of the support glass 12 can be reduced can be formed. Department 3. Further, the peeling start portion 3 in which the separation distance t is larger than the separation height h can be made. The immersion depth d of the side portion 14 of the glass film laminate 1 in the treatment liquid 51 (the distance between the end surface of the treatment liquid 51 impregnated with the end surface of the glass film 11 and the end surface of the support glass 12) is preferably equal to or less than 50 mm, more preferably 30 mm or less, and most preferably 10 mm or less. Thereby, it is possible to prevent the upper surface 11a side of the glass film 11 from being deteriorated by the treatment liquid. Further, from the viewpoint of preventing deterioration of the element 2 formed on the upper surface 11a side of the glass film 11, a protective layer formed of a resin film or the like may be provided on the upper surface 11a side of the glass film 11.
於圖7中，對將玻璃膜積層體1的側部14浸漬於處理液51的實施方式進行了說明，但並不限定於該實施方式，亦可藉由將處理液51直接塗佈於玻璃膜積層體1的側部14，或使側部15接觸於含浸了處理液51的多孔質體等，而形成剝離開始部3。 In the embodiment of the present invention, the side portion 14 of the glass film laminate 1 is immersed in the treatment liquid 51. However, the embodiment is not limited to this embodiment, and the treatment liquid 51 may be directly applied to the glass. The side portion 14 of the film laminate 1 or the side portion 15 is brought into contact with a porous body or the like impregnated with the treatment liquid 51 to form a peeling start portion 3.
於圖7中，對使用處理液51於玻璃膜積層體1的側部14形成剝離開始部3的實施方式進行了說明，但亦可藉由使用未圖示的研削構件等研削玻璃膜積層體1的側部14而物理性地形成剝離開始部3。 In the embodiment in which the peeling start portion 3 is formed on the side portion 14 of the glass film laminate 1 using the processing liquid 51, the glass film laminate may be ground by using a grinding member or the like (not shown). The peeling start portion 3 is physically formed by the side portion 14 of 1.
在使用圖7所示的處理液51形成剝離開始部3的情況下，較佳為遍及矩形狀的玻璃膜積層體1的至少整個一邊而形成，且較佳為形成於三邊以上。於下述剝離步驟時，於以剝離開始部3 為起點剝離支持玻璃12與玻璃膜11時，彎曲應力被賦予至玻璃膜11的側面，但藉由處理液51產生於玻璃膜11的側面的微裂痕(micro crack)被去除，故而變得不易破損。 When the peeling start portion 3 is formed using the processing liquid 51 shown in FIG. 7, it is preferably formed over at least the entire side of the rectangular glass film laminate 1, and is preferably formed on three sides or more. At the peeling step described below, the peeling start portion 3 is used When the support glass 12 and the glass film 11 are peeled off from the starting point, the bending stress is applied to the side surface of the glass film 11, but the micro crack generated on the side surface of the glass film 11 by the treatment liquid 51 is removed, so that it becomes difficult damaged.
於本實施方式中，剝離步驟是以剝離開始部3為起點將剝離開始部形成步驟後的玻璃膜積層體1分離為玻璃膜11與支持玻璃12的步驟。 In the present embodiment, the peeling step is a step of separating the glass film layered body 1 after the peeling start portion forming step from the peeling start portion 3 into the glass film 11 and the supporting glass 12.
圖8係表示剝離步驟的一例的圖。圖8所示的玻璃膜剝離裝置6可藉由賦予拉開支持玻璃12與玻璃膜11的力而自支持玻璃12剝離玻璃膜11。在此情況下，剝離開始部3因支持玻璃12與玻璃膜11分開而可作為剝離開始的起點。 Fig. 8 is a view showing an example of a peeling step. The glass film peeling device 6 shown in Fig. 8 can peel the glass film 11 from the support glass 12 by imparting a force to pull the support glass 12 and the glass film 11. In this case, the peeling start portion 3 can serve as a starting point for the start of peeling because the support glass 12 is separated from the glass film 11.
於自支持玻璃12剝離玻璃膜11時，較佳為自噴嘴(nozzle)61對界面15賦予流體62。藉此，不與支持玻璃12或玻璃膜11進行物理性接觸便可促進自支持玻璃12剝離玻璃膜11。藉此，防止於剝離時玻璃膜11產生損傷等。作為流體62，可較佳地使用空氣或水等。於自支持玻璃12剝離玻璃膜11時有產生剝離帶電的顧慮，且會因形成於玻璃膜11上的元件(device)或元件(element)2而產生靜電放電破壞，故而較佳為使用具有徐電作用的流體62。藉由使流體噴出噴嘴具有離子化器(ionizer)功能或吹送高濕度的空氣或水，可製成具有徐電作用的流體62。 When the glass film 11 is peeled off from the support glass 12, it is preferable to apply the fluid 62 to the interface 15 from the nozzle 61. Thereby, the glass film 11 can be peeled off from the support glass 12 without being in physical contact with the support glass 12 or the glass film 11. Thereby, damage or the like of the glass film 11 at the time of peeling is prevented. As the fluid 62, air, water, or the like can be preferably used. When the glass film 11 is peeled off from the support glass 12, there is a concern that peeling electrification occurs, and electrostatic discharge breakdown occurs due to a device or an element 2 formed on the glass film 11. Therefore, it is preferable to use Electrically acting fluid 62. The fluid 62 having a rectilinear action can be produced by having the fluid ejection nozzle have an ionizer function or blowing high humidity air or water.
如圖8所示，剝離步驟是自噴嘴61利用以高壓噴射的方法(例如噴水(water jet)的方法)對玻璃膜積層體1的界面15吹送作為流體62的液體(例如水)。於圖8中表示如下過程：使用支持玻璃保持機構63與玻璃膜保持機構64，一面利用玻璃膜保持機構64的真空吸附墊(pad)64a、真空吸附墊64a…固定玻璃 膜積層體1的玻璃膜11並利用支持玻璃保持機構63的真空吸附墊63a、真空吸附墊63a…牽引支持玻璃12，一面對界面15吹送液體62而以剝離開始部3為起點進行剝離。 As shown in FIG. 8, the peeling step is to blow a liquid (for example, water) as the fluid 62 from the nozzle 61 by the method of spraying at a high pressure (for example, a method of water jet) to the interface 15 of the glass laminate. In Fig. 8, a process of fixing the glass by using the support glass holding mechanism 63 and the glass film holding mechanism 64 while using the vacuum suction pad 64a of the glass film holding mechanism 64, the vacuum suction pad 64a, and the like is shown. The glass film 11 of the film laminate 1 is pulled by the vacuum suction pad 63a of the support glass holding mechanism 63, the vacuum suction pad 63a..., and the liquid glass 62 is blown toward the interface 15, and peeling is started from the peeling start portion 3.
玻璃膜保持機構64可使用排列有多個真空吸附墊64a者或具有真空吸附功能的板(plate)，或者亦可使用黏著性的樹脂片材(sheet)。特別是在將玻璃膜積層體1以保持為水平的狀態操作的情況下，由於基板容易撓曲，故而較佳為使用板狀的真空吸附機構。而且，在因於玻璃膜11上形成有元件而難以利用板固定為平面狀的情況下，較佳為使用真空吸附墊。而且，在有形成於元件表面的配線或元件的密封劑等因自液體62受到的壓力或因真空吸附墊的接觸而會受到損壞(damage)的顧慮的情況下，亦可於想要避免損壞的部位貼上保護膜。而且，亦可於密封劑的外周設置液體62的浸入防止層。 The glass film holding mechanism 64 may use a plate in which a plurality of vacuum suction pads 64a are arranged or which has a vacuum suction function, or an adhesive resin sheet may be used. In particular, when the glass film laminate 1 is operated while being horizontal, since the substrate is easily deflected, it is preferable to use a plate-shaped vacuum suction mechanism. Further, when an element is formed on the glass film 11 and it is difficult to fix the plate to a flat shape, it is preferable to use a vacuum suction pad. Further, in the case where the sealant or the like having the wiring or the element formed on the surface of the element is damaged by the pressure received from the liquid 62 or the contact by the vacuum suction pad, it is also desirable to avoid damage. Place a protective film on the part. Further, the immersion prevention layer of the liquid 62 may be provided on the outer circumference of the sealant.
而且，由於存在支持玻璃及玻璃膜的各保持機構63、保持機構64一面在用以將支持玻璃12或玻璃膜11等固定為平面狀的用途與用以牽引玻璃膜11或支持玻璃12等的用途的兩種用途之間進行切換一面使用的情況，故而亦可不對各保持機構63、保持機構64的構成設置差異而設為共通的構成。 Further, the holding mechanism 63 and the holding mechanism 64 which support the glass and the glass film are used for fixing the support glass 12, the glass film 11, and the like in a planar shape, and for pulling the glass film 11, the support glass 12, and the like. There is a case where the two uses of the application are used for switching, and therefore, the configuration of the holding mechanism 63 and the holding mechanism 64 may be different, and the configuration may be common.
於自支持玻璃12剝離玻璃膜時，亦可與圖8的實施方式不同，而使用未圖示的剝離構件。因具有剝離開始部3而可將剝離構件順利地插入剝離開始部3，繼而藉由將剝離構件繼續插入界面15，可自支持玻璃12剝離玻璃膜11。於自支持玻璃12剝離玻璃膜11時，亦可將玻璃膜積層體1浸漬於水中，於浸漬於水中時，亦可施加超音波。 When the glass film is peeled off from the support glass 12, a peeling member (not shown) may be used instead of the embodiment of FIG. Since the peeling start portion 3 is provided, the peeling member can be smoothly inserted into the peeling start portion 3, and then the peeling member can be continuously inserted into the interface 15, whereby the glass film 11 can be peeled off from the support glass 12. When the glass film 11 is peeled off from the support glass 12, the glass film laminate 1 may be immersed in water, and when immersed in water, ultrasonic waves may be applied.
較佳為使用剝離構件的形狀為片狀、帶狀、板狀、短條狀等的厚度薄且於剝離行進方向上寬幅的構件。具體而言，剝離構件的厚度較佳為0.01mm~1mm，更佳為0.1mm~0.5mm。藉此，可將剝離構件順利地插入剝離開始部3。剝離構件的寬度亦依賴於成為剝離對象的玻璃膜積層體1的面積，較佳為至少於剝離行進方向上較玻璃膜積層體1寬幅。 It is preferable to use a member in which the shape of the peeling member is thin, such as a sheet shape, a belt shape, a plate shape, or a short strip shape, and is wide in the peeling traveling direction. Specifically, the thickness of the peeling member is preferably from 0.01 mm to 1 mm, more preferably from 0.1 mm to 0.5 mm. Thereby, the peeling member can be smoothly inserted into the peeling start portion 3. The width of the peeling member also depends on the area of the glass film layered body 1 to be peeled off, and is preferably wider than the glass film layered body 1 at least in the peeling traveling direction.
剝離構件的材質可使用具有剛性的鋁(aluminum)、不鏽鋼(stainless)等金屬，較佳為使用具有可撓性的聚乙烯(polyethylene)或丙烯酸系等的樹脂膜，更佳為使用氟樹脂膜等疏水性的樹脂片材。 As the material of the peeling member, a metal such as aluminum or stainless steel having rigidity can be used, and a resin film such as polyethylene or acrylic which is flexible is preferably used, and a fluororesin film is more preferably used. A hydrophobic resin sheet.
並且，如圖8所示，藉由剝離步驟自玻璃膜積層體1剝離支持玻璃12，藉此可最終製造膜狀玻璃110。 Further, as shown in FIG. 8, the support glass 12 is peeled off from the glass film laminate 1 by a peeling step, whereby the film glass 110 can be finally produced.
圖9是表示本發明的一實施方式的電子元件的製造方法的圖。圖9所記載的實施方式與上述實施方式的不同點在於，在元件2的周圍配置有間隔物(spacer)21，且藉由受到載體玻璃72支持的覆蓋玻璃膜71而被密封。將覆蓋玻璃膜71積層於載體玻璃72上而成者作為覆蓋玻璃膜積層體7。於本實施方式中，藉由將帶支持玻璃載體玻璃的電子元件8沿縱向浸漬於處理液51中，於覆蓋玻璃膜積層體7的側部73亦形成覆蓋玻璃膜側剝離開始部31。覆蓋玻璃膜71與上述玻璃膜11相同，載體玻璃72與上述支持玻璃12相同，覆蓋玻璃膜側剝離開始部31與上述剝離開始部3相同。 FIG. 9 is a view showing a method of manufacturing an electronic component according to an embodiment of the present invention. The embodiment described in FIG. 9 is different from the above-described embodiment in that a spacer 21 is disposed around the element 2, and is sealed by a cover glass film 71 supported by the carrier glass 72. The cover glass film 71 is laminated on the carrier glass 72 as a cover glass film laminate 7. In the present embodiment, the electronic component 8 with the support glass carrier glass is immersed in the processing liquid 51 in the longitudinal direction, and the cover glass film side peeling start portion 31 is also formed on the side portion 73 of the cover glass film laminate 7. The cover glass film 71 is the same as the above-described glass film 11, and the carrier glass 72 is the same as the support glass 12 described above, and the cover glass film side peeling start portion 31 is the same as the peeling start portion 3.
於本實施方式中，如圖10所示，於浸漬於處理液51時，較佳為於玻璃膜11與覆蓋玻璃膜71之間且間隔物21的外側設置 保護構件22。藉此，有時會於間隔物21外側的玻璃膜11或覆蓋玻璃膜71設置電極等，可防止該些電極因處理液51而劣化。而且，於下述剝離步驟時，於使支持玻璃12或載體玻璃72自剝離開始部3或覆蓋玻璃側剝離開始部31剝離時，於間隔物21的外側利用保護構件22固定玻璃膜11與覆蓋玻璃膜71，故而於剝離開始時玻璃膜積層體1或覆蓋玻璃膜積層體7不會因牽引力而撓曲，從而可順利地開始剝離。作為保護構件22，可使用不會被處理液51侵蝕的構件，可較佳地使用環氧(epoxy)樹脂或紫外線硬化樹脂等。保護構件22於剝離支持玻璃12或載體玻璃72後，最終被去除。 In the present embodiment, as shown in FIG. 10, when immersed in the treatment liquid 51, it is preferable to provide between the glass film 11 and the cover glass film 71 and outside the spacer 21. Protective member 22. As a result, an electrode or the like may be provided on the glass film 11 or the cover glass film 71 outside the spacer 21, and the electrodes may be prevented from being deteriorated by the treatment liquid 51. In the peeling step described below, when the support glass 12 or the carrier glass 72 is peeled off from the peeling start portion 3 or the cover glass side peeling start portion 31, the glass film 11 and the cover are fixed to the outside of the spacer 21 by the protective member 22. Since the glass film 71 is not deflected by the traction force at the start of peeling, the peeling of the glass film layered body 1 or the cover glass film layered body 7 can be smoothly started. As the protective member 22, a member which is not corroded by the treatment liquid 51 can be used, and an epoxy resin, an ultraviolet curable resin or the like can be preferably used. After the protective member 22 is peeled off the support glass 12 or the carrier glass 72, it is finally removed.
圖11是表示電子元件的製造方法的實施方式中的剝離步驟的一例的圖。 FIG. 11 is a view showing an example of a peeling step in the embodiment of the method of manufacturing an electronic component.
於圖11中，首先，利用支持玻璃保持機構63牽引支持玻璃12並利用載體玻璃保持機構65固定載體玻璃72，藉此將玻璃膜11保持為平面，並自噴嘴61對支持玻璃12與玻璃膜11的界面15吹送作為流體62的水而剝離支持玻璃12。 In FIG. 11, first, the support glass 12 is pulled by the support glass holding mechanism 63 and the carrier glass 72 is fixed by the carrier glass holding mechanism 65, whereby the glass film 11 is held flat, and the support glass 12 and the glass film are opposed from the nozzle 61. The interface 15 of 11 blows water as the fluid 62 to peel off the support glass 12.
其次，於剝離支持玻璃12後，利用支持玻璃保持機構63將玻璃膜11固定為平面狀，且一面利用載體玻璃保持機構65牽引載體玻璃72，一面對載體玻璃72與覆蓋玻璃膜71的界面74吹送作為流體62的水而剝離載體玻璃72。 Next, after the support glass 12 is peeled off, the glass film 11 is fixed in a planar shape by the support glass holding mechanism 63, and the carrier glass 72 is pulled by the carrier glass holding mechanism 65 to face the interface between the carrier glass 72 and the cover glass film 71. The carrier glass 72 is peeled off by blowing water as the fluid 62.
於剝離步驟中，於與剝離玻璃膜11及支持玻璃12相同的步驟內，亦剝離覆蓋玻璃膜71與載體玻璃72。於剝離覆蓋玻璃膜71與載體玻璃72時，亦一面牽引載體玻璃72，一面進行剝離。 In the peeling step, the cover glass film 71 and the carrier glass 72 are also peeled off in the same step as the peeling of the glass film 11 and the support glass 12. When the cover glass film 71 and the carrier glass 72 are peeled off, the carrier glass 72 is pulled while being peeled off.
於本實施方式中，藉由剝離步驟自帶支持玻璃載體玻璃 的電子元件8剝離支持玻璃12與載體玻璃72，藉此可最終製造所期望的電子元件81。 In the present embodiment, the support glass carrier glass is provided by the stripping step. The electronic component 8 strips the support glass 12 and the carrier glass 72, whereby the desired electronic component 81 can be finally fabricated.
於上述實施方式中，繼剝離支持玻璃12後進行了載體玻璃72的剝離，但亦可自載體玻璃72先進行剝離。 In the above embodiment, the carrier glass 72 is peeled off after the support glass 12 is peeled off, but the carrier glass 72 may be peeled off first.
於上述實施方式中，對使用覆蓋玻璃膜積層體7作為密封基板的實施方式進行了說明，但並不限定於此，可使用一片玻璃板作為密封基板，亦可使用一片樹脂基板作為密封基板。 In the above embodiment, the embodiment in which the cover glass film laminate 7 is used as the sealing substrate has been described. However, the present invention is not limited thereto, and one glass plate may be used as the sealing substrate, or one resin substrate may be used as the sealing substrate.
本發明如圖1或圖9以示意的方式表示，可連續地進行玻璃膜積層體製作步驟、製造相關處理步驟(電子元件製作步驟)、剝離開始部形成步驟、及剝離步驟。而且，本發明並不限定於自玻璃膜積層體製作步驟連續進行至剝離步驟的構成，例如，亦可為如下構成：於玻璃膜積層體製作步驟後，將所製造的玻璃膜積層體1或覆蓋玻璃膜積層體7捆包、出貨，並另外於電子元件製造相關處理設施中，進行製造相關處理步驟(電子元件製作步驟)、剝離開始部形成步驟、及剝離步驟。 The present invention is schematically shown in Fig. 1 or Fig. 9, and the glass film laminate production step, the production-related processing step (electronic component fabrication step), the peeling start portion forming step, and the peeling step can be continuously performed. Further, the present invention is not limited to the configuration in which the glass film layer forming step is continuously performed to the peeling step, and for example, the glass film layered body 1 or the produced glass film layered body 1 may be formed after the glass film layer forming step. The cover glass film laminate 7 is packaged and shipped, and a manufacturing-related processing step (electronic component production step), a peeling start portion forming step, and a peeling step are performed in the electronic component manufacturing-related processing facility.
(實施例1) (Example 1)
作為支持玻璃、玻璃膜、覆蓋玻璃膜、及載體玻璃，使用日本電氣硝子股份有限公司製造的無鹼玻璃(OA-10G，30~380℃時的熱膨脹係數：38×10-7/℃)。利用溢流下拉法進行製造，並於未研磨的狀態下使用。作為支持玻璃、載體玻璃，準備縱680mm、橫880mm、厚500μm的矩形狀的板玻璃。作為玻璃膜、覆蓋玻璃膜，準備縱678mm、橫878mm、厚200μm的矩形狀的透明玻璃。於支持玻璃上積層玻璃膜而製作玻璃膜積層體。於載體玻璃上積層覆蓋玻璃膜而製作覆蓋玻璃膜積層體。其後，於玻璃膜上 形成有機EL元件。形成有機EL元件時的形成溫度為350°。於形成有機EL元件後，利用覆蓋玻璃膜積層體密封有機EL元件，藉此製作帶支持玻璃載體玻璃的電子元件。其後，將所製作的帶支持玻璃載體玻璃的電子元件的側部5mm(自玻璃膜側面起5mm)浸漬於濃度20%的氫氟酸水溶液中30分鐘。將帶支持玻璃載體玻璃的電子元件的三個側部同樣地浸漬於氫氟酸水溶液。觀察玻璃膜與覆蓋玻璃膜的剝離開始部，結果發現於厚度方向上薄化150μm而成為50μm。此後，於利用純水洗淨之後，利用圖11所記載的方法自剝離開始部嘗試剝離支持玻璃與載體玻璃，結果可分別在10分鐘以內剝離。 As the supporting glass, the glass film, the cover glass film, and the carrier glass, an alkali-free glass (OA-10G, thermal expansion coefficient at 30 to 380 ° C: 38 × 10 -7 / ° C) manufactured by Nippon Electric Glass Co., Ltd. was used. It is manufactured by the overflow down-draw method and used in an unground state. As the supporting glass or the carrier glass, a rectangular plate glass of 680 mm in length, 880 mm in width, and 500 μm in thickness was prepared. As the glass film or the cover glass film, a rectangular transparent glass having a length of 678 mm, a width of 878 mm, and a thickness of 200 μm was prepared. A glass film laminate was produced by laminating a glass film on a supporting glass. A cover glass film was laminated on the carrier glass to form a cover glass film laminate. Thereafter, an organic EL element was formed on the glass film. The formation temperature at the time of forming the organic EL element was 350°. After the organic EL element was formed, the organic EL element was sealed with a cover glass film laminate to prepare an electronic component with a support glass carrier glass. Thereafter, the side portion of the produced electronic component supporting the glass carrier glass of 5 mm (5 mm from the side of the glass film) was immersed in a hydrofluoric acid aqueous solution having a concentration of 20% for 30 minutes. The three side portions of the electronic component with the support glass carrier glass were similarly immersed in a hydrofluoric acid aqueous solution. The peeling start portion of the glass film and the cover glass film was observed, and as a result, it was found to be thinned by 150 μm in the thickness direction to be 50 μm. After that, after washing with pure water, the support glass and the carrier glass were peeled off from the peeling start portion by the method described in FIG. 11, and as a result, they were peeled off within 10 minutes.
(實施例2) (Example 2)
除僅將帶支持玻璃載體玻璃的電子元件的一個側部浸漬於氫氟酸水溶液中以外，其他與實施例1相同。支持玻璃與載體玻璃的剝離時間分別需要10~20分鐘左右。 The same as in Example 1 except that only one side portion of the electronic component with the supporting glass carrier glass was immersed in the hydrofluoric acid aqueous solution. The peeling time of the supporting glass and the carrier glass takes about 10 to 20 minutes, respectively.
(實施例3) (Example 3)
除僅將帶支持玻璃載體玻璃的電子元件的一個角部浸漬於氫氟酸水溶液中以外，其他與實施例1相同。支持玻璃與載體玻璃的剝離時間分別需要20分鐘~30分鐘左右。 The same as in Example 1 except that only one corner of the electronic component with the supporting glass carrier glass was immersed in the hydrofluoric acid aqueous solution. The peeling time of the supporting glass and the carrier glass takes about 20 minutes to 30 minutes, respectively.
(比較例1) (Comparative Example 1)
除未浸漬於氫氟酸水溶液中以外，其他與實施例1相同。為了剝離支持玻璃與載體玻璃而分別需要1小時以上。 The same as Example 1 except that it was not immersed in the hydrofluoric acid aqueous solution. It takes 1 hour or more to peel off the support glass and the carrier glass, respectively.
[產業上之可利用性] [Industrial availability]
本發明可較佳地使用於液晶顯示器或有機EL顯示器等平板顯示器或太陽電池等元件所使用的玻璃基板、及有機EL照明 的覆蓋玻璃。 The present invention can be preferably used for a glass substrate used for components such as a flat panel display such as a liquid crystal display or an organic EL display, or a solar cell, and organic EL illumination. Cover glass.
1‧‧‧玻璃膜積層體 1‧‧‧Glass laminar body
2‧‧‧元件 2‧‧‧ components
3‧‧‧剝離開始部 3‧‧‧ peeling start
11‧‧‧玻璃膜 11‧‧‧ glass film
12‧‧‧支持玻璃 12‧‧‧Support glass
110‧‧‧膜狀玻璃 110‧‧‧film glass
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| TW103133952A TW201514110A (en) | 2013-09-30 | 2014-09-30 | Production method of film glass, production method of electronic device and production method of glass film laminate |
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| CN106356375A (en) * | 2015-07-17 | 2017-01-25 | 群创光电股份有限公司 | Substrate unit, component substrate, display device and manufacturing method of display device |
| TWI681939B (en) * | 2015-07-24 | 2020-01-11 | 日商日本電氣硝子股份有限公司 | Method for manufacturing glass film, and method for manufacturing electronic device including glass film |
| TWI822930B (en) * | 2018-12-20 | 2023-11-21 | 日商日本電氣硝子股份有限公司 | Manufacturing method and manufacturing device of glass film and manufacturing method of electronic components including glass film |
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| JP6260869B2 (en) * | 2014-06-13 | 2018-01-17 | 日本電気硝子株式会社 | Manufacturing method of glass film and manufacturing method of electronic device including the glass film |
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| JP7054066B2 (en) * | 2017-09-27 | 2022-04-13 | 日本電気硝子株式会社 | Glass plate with optical film and its manufacturing method |
| JPWO2022113874A1 (en) * | 2020-11-26 | 2022-06-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009186916A (en) * | 2008-02-08 | 2009-08-20 | Asahi Glass Co Ltd | Method of manufacturing display device panel |
| JP5029523B2 (en) * | 2008-07-14 | 2012-09-19 | 旭硝子株式会社 | GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT, PANEL FOR DISPLAY DEVICE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF |
| CN102695685B (en) * | 2010-01-12 | 2015-02-11 | 日本电气硝子株式会社 | Glass film laminate, method of producing the same, and method of producing glass film |
| JP5585937B2 (en) * | 2010-07-28 | 2014-09-10 | 日本電気硝子株式会社 | Glass film laminate |
| JP5692513B2 (en) * | 2010-12-22 | 2015-04-01 | 日本電気硝子株式会社 | Glass film laminate |
-
2014
- 2014-09-29 JP JP2014197855A patent/JP2015091746A/en active Pending
- 2014-09-29 WO PCT/JP2014/075816 patent/WO2015046490A1/en active Application Filing
- 2014-09-30 TW TW103133952A patent/TW201514110A/en unknown
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| TWI551440B (en) * | 2015-07-17 | 2016-10-01 | 群創光電股份有限公司 | Substrate unit, element substrate and manufacturing method of display device |
| CN106356375A (en) * | 2015-07-17 | 2017-01-25 | 群创光电股份有限公司 | Substrate unit, component substrate, display device and manufacturing method of display device |
| US10177346B2 (en) | 2015-07-17 | 2019-01-08 | Innolux Corporation | Substrate unit, display device and method for manufacturing display device |
| CN106356375B (en) * | 2015-07-17 | 2019-12-03 | 群创光电股份有限公司 | Base board unit, device substrate, display device and display device manufacturing method |
| TWI681939B (en) * | 2015-07-24 | 2020-01-11 | 日商日本電氣硝子股份有限公司 | Method for manufacturing glass film, and method for manufacturing electronic device including glass film |
| TWI822930B (en) * | 2018-12-20 | 2023-11-21 | 日商日本電氣硝子股份有限公司 | Manufacturing method and manufacturing device of glass film and manufacturing method of electronic components including glass film |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015046490A1 (en) | 2015-04-02 |
| JP2015091746A (en) | 2015-05-14 |
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