CN107009265A - Cutting machine vacuum suction disc work bench device and its course of work - Google Patents
Cutting machine vacuum suction disc work bench device and its course of work Download PDFInfo
- Publication number
- CN107009265A CN107009265A CN201710199664.9A CN201710199664A CN107009265A CN 107009265 A CN107009265 A CN 107009265A CN 201710199664 A CN201710199664 A CN 201710199664A CN 107009265 A CN107009265 A CN 107009265A
- Authority
- CN
- China
- Prior art keywords
- cutting
- vacuum
- metal backing
- plate
- middle level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Jigs For Machine Tools (AREA)
Abstract
The invention discloses a kind of cutting machine vacuum suction disc work bench device, including bottom plate, middle level dividing plate, metal backing, micro vacuum sucker, spacer and blanking bracket are constituted.Negative pressure is by middle level dividing plate, the cavity of metal backing formation and multiple micro vacuum sucker insertions in bottom plate vacuum tank described in the device, and vacuum cup absorbing elements plate is fixed to it；The spacer carries out pre-determined bit to device, and realizes that two plates are positioned.The present invention also provides the course of work of above-mentioned cutting machine vacuum suction disc work bench device, comprises the following steps：1) before cutting, first blanking bracket is placed on metal backing, device plate positioned by spacer；2) when cutting, useless frame directly departs from work top due to the flushing of gravity and cutting coolant；3) after cutting, close vacuum and manually lift blanking bracket, device particle disposably takes out with blanking bracket.
Description
Technical field
The present invention relates to vacuum work table apparatus, and in particular to cutting machine vacuum suction disc work bench device and its worked
Journey.
Background technology
Cutting machine is a kind of semiconductor post package key equipment, its act on be by Device singulation into single circuit unit or
Large scale material is separated into small-size materials.The working mechanism of cutting machine is the high-rate grinding of emery wheel blade, in cutting process
The emery wheel blade of high speed operating is contacted with work piece, and cutting process is completed by the feed motion in several directions.
In cutting process, in order to complete cutting separation, one layer of blue film or UV films are typically pasted at the device back side, again from film after the completion of cutting
On product sorting is come out.
Device board is directly placed on vacuum suction carrying workbench by apparatus of the present invention in order to improve traditional cutting technique
Upper carry out cutting processing, exempts the consumption reduction cutting cost of blue film or UV films, product and waste material side can be directly separated after cutting
Frame, reduces artificial participation and improves cutting efficiency.
The content of the invention
It is an object of the invention to provide a kind of cutting machine vacuum suction disc work bench device, blue film or UV films can be avoided to consume
The participation of material, reduces production cost；Stationary positioned while realizing two panels device board so that two plate devices are cut in a loading and unloading
Part, effectively improves production efficiency；Adsorbed for the device board of easy buckling deformation using vacuum cup, it is desirable to which absorption firmly may be used
Lean on.
To achieve the above object, the present invention provides a kind of cutting machine vacuum suction disc work bench device, it is characterised in that including
Bottom plate, the bottom plate is connected with middle level dividing plate by screw, and centre forms a closed cavity；It is fixed above the middle level dividing plate
Two pieces of metal backings, form two other closed cavity, and two layers of closed cavity is connected by aperture up and down；The metal backing
On be screwed the miniature sucker of multiple vacuum, sucker is connected with closed cavity respectively, and vacuum is acted on by the closed cavity
In miniature sucker groove, vacuum adsorbed fixation is entered to device board；Respectively in 3 spacers of metal backing periphery design, to device
Position carries out pre-determined bit；Before being cut, a piece of blanking bracket, bracket and device board will be pre-placed on the metal backing
Between keep certain gap, prevent disturb cutting accuracy, the blanking bracket to after cutting device carry out transfer collection.
It is preferred that, need to be sealed using O-ring seal between the bottom plate and middle level dividing plate, middle level dividing plate and metal
Sealed between liner plate using diaphragm seal, micro vacuum sucker is slightly higher to cross metal backing, is protected between blanking bracket and device board
Hold certain gap.
It is preferred that, the metal backing quantity is 2, and spacer quantity is 6, and micro vacuum sucker quantity is single device
2 times of number of devices on part plate.
The present invention also provides the course of work of vacuum suction disc work bench device, comprises the following steps：
1) before cutting, first blanking bracket is placed on metal backing, device plate positioned by spacer, is adjusted
Start vacuum suction whole plate device after whole；
2) in cutting process, useless frame directly departs from work top due to the flushing of gravity and cutting coolant；
3) after the completion of cutting, close vacuum and manually lift blanking bracket, the device particle after cutting is with blanking bracket one
Secondary property is all taken out.
The advantages of the present invention are：A kind of cutting machine vacuum suction disc work bench device is provided, passes through metal
The groove structure of liner plate exempts the participation of blue film during cutting, so as to avoid consumption；Metal backing can be according to different components specification
Change, a whole set of cost changed of reduction；Individual devices particle is fixed respectively using micro vacuum sucker, effectively solved such
The problem of device board buckling deformation produces vacuum momentary loss；Device for pre-positioning can be effectively compressed the cutting alignment time, and raising is cut
Cut efficiency；Product and waste material frame can be directly separated after cutting, artificial participation is reduced and improves cutting efficiency.
Present system is simple in construction, easy to process, and interchangeability is strong, and adaptability is good.The present invention can be miniature true by adjusting
The height of suction disk, improves the reliability that device adsorbs different components plate.
Brief description of the drawings
Fig. 1 is the schematic diagram of vacuum suction disc work bench device of the present invention；
Fig. 2 is the sectional view of vacuum suction disc work bench device of the present invention.
Embodiment
With reference to the accompanying drawings and examples, the embodiment to the present invention is further described.Following examples are only
For clearly illustrating technical scheme, and it can not be limited the scope of the invention with this.
The technical scheme that the present invention is embodied is：
As shown in Figure 1 and Figure 2, the present invention provides a kind of cutting machine vacuum suction disc work bench device, including bottom plate 1, bottom plate 1
It is connected with middle level dividing plate 2 by screw 11, centre forms a closed cavity lower floor vacuum chamber 12；Middle level dividing plate 2 is fixed above
Two pieces of metal backings 3, form two other closed cavity middle level vacuum chamber 21 and middle level vacuum chamber 22, lower floor's vacuum chamber 12 is with
Layer vacuum chamber 21 and middle level vacuum chamber 22 are connected by aperture 23；The miniature sucker of multiple vacuum that are screwed on metal backing 3
4, the miniature sucker 4 of vacuum is communicated with middle level vacuum chamber 21 and middle level vacuum chamber 22 respectively, and vacuum passes through lower floor's vacuum chamber 12, middle level
Vacuum chamber 21 and middle level vacuum chamber 22 are acted in miniature sucker 4, and vacuum adsorbed fixation is entered to device board 5；In metal backing 3
3 spacers 6 of periphery design, pre-determined bit is carried out to the position of device board 5；Before cutting, a piece of blanking is pre-placed on metal backing 3
Bracket 7.
Need to be sealed using O-ring seal 13 between the bottom plate 1 and middle level dividing plate 2, middle level dividing plate 2 and metal liner
Sealed between plate 3 using diaphragm seal 24, micro vacuum sucker 4 is slightly higher to cross metal backing 3, blanking bracket 7 and device board 5 it
Between keep gap 51.
The quantity of metal backing 3 is 2, and the quantity of spacer 6 is 6, and the quantity of micro vacuum sucker 4 is individual devices plate
Twice of number of devices on 5.
The present invention also provides the course of work of above-mentioned cutting machine vacuum suction disc work bench device, comprises the following steps：
1) before cutting, blanking bracket 7 is placed on metal backing 3, two pieces of device boards 5 are then individually positioned in two again
On block metal backing 3, device board 5 is positioned respectively by the spacer 6 on the periphery of metal backing 3, starts vacuum after adjustment
Two pieces of device boards 5 are adsorbed, the fixation of device board 5 is reliable after absorption；
2) in cutting process, useless device board frame 52 directly departs from vacuum due to the flushing of gravity and cutting coolant
Suction plate bench face, cutting process is without manually participating in；
3) after the completion of cutting, vacuum is closed, lifts blanking bracket 7 either manually or by two macropores 25 on middle level dividing plate 2,
Device particle 53 after cutting all takes out with blanking bracket 7 is disposable, and device particle 53 has been detached from device board frame 52
It need not sort again.
The present invention can be by adjusting the height of micro vacuum sucker 4, and configuration absorption different components plate 5 can configure not in addition
The different vacuum suction disc work bench of the correspondence of metal lot liner plate 3 carries out cutting processing to different components plate 5.
The present invention in the selection of its part material, it is necessary to note because the present apparatus is chronically among water smoke, should be from anti-
The stronger material of corrosion ability.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (3)
1. cutting machine vacuum suction disc work bench device, it is characterised in that including bottom plate, the bottom plate passes through screw with middle level dividing plate
It is connected, centre forms a closed cavity；Two pieces of metal backings are fixed above the middle level dividing plate, two other closing chamber is formed
Body, up and down two layers of closed cavity connected by aperture；The miniature sucker of multiple vacuum that are screwed on the metal backing, sucker
It is connected respectively with closed cavity, vacuum is acted in miniature sucker groove by the closed cavity, vacuum suction is carried out to device board
Attached fixation；Respectively in 3 spacers of metal backing periphery design, pre-determined bit is carried out to device position；Before being cut, by institute
State and a piece of blanking bracket is pre-placed on metal backing, certain gap is kept between bracket and device board, prevent interference from cutting
Precision, the blanking bracket carries out transfer collection to the device after cutting.
2. cutting machine vacuum suction disc work bench device according to claim 1, it is characterised in that the bottom plate and middle level every
Need to be sealed using O-ring seal between plate, sealed between middle level dividing plate and metal backing using diaphragm seal, it is miniature
Vacuum cup is slightly higher to cross metal backing, and certain gap is kept between blanking bracket and device board.
3. cutting machine vacuum suction disc work bench device according to claim 1, it is characterised in that the metal backing quantity
For 2, spacer quantity is 6, and micro vacuum sucker quantity is 2 times of number of devices on individual devices plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710199664.9A CN107009265A (en) | 2017-03-28 | 2017-03-28 | Cutting machine vacuum suction disc work bench device and its course of work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710199664.9A CN107009265A (en) | 2017-03-28 | 2017-03-28 | Cutting machine vacuum suction disc work bench device and its course of work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107009265A true CN107009265A (en) | 2017-08-04 |
Family
ID=59445047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710199664.9A Pending CN107009265A (en) | 2017-03-28 | 2017-03-28 | Cutting machine vacuum suction disc work bench device and its course of work |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107009265A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
| DE19628237A1 (en) * | 1995-07-13 | 1997-01-16 | Nippon Denso Co | Semiconductor device and manufacturing method of the same |
| CN1229267A (en) * | 1998-03-13 | 1999-09-22 | 东和株式会社 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| JP2006055978A (en) * | 2004-08-24 | 2006-03-02 | Ichiro Komatsubara | Pad for sander |
| CN101734849A (en) * | 2008-11-05 | 2010-06-16 | 细美事有限公司 | Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same |
-
2017
- 2017-03-28 CN CN201710199664.9A patent/CN107009265A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
| DE19628237A1 (en) * | 1995-07-13 | 1997-01-16 | Nippon Denso Co | Semiconductor device and manufacturing method of the same |
| CN1229267A (en) * | 1998-03-13 | 1999-09-22 | 东和株式会社 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
| JP2006055978A (en) * | 2004-08-24 | 2006-03-02 | Ichiro Komatsubara | Pad for sander |
| CN101734849A (en) * | 2008-11-05 | 2010-06-16 | 细美事有限公司 | Trasferring unit for scribing apparatus, cutting apparatus having the same and method of cutting substrate using the same |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170804 |
|
| WD01 | Invention patent application deemed withdrawn after publication |