CN204565884U - A kind of single side polishing machine bonding device - Google Patents
A kind of single side polishing machine bonding device Download PDFInfo
- Publication number
- CN204565884U CN204565884U CN201520176335.9U CN201520176335U CN204565884U CN 204565884 U CN204565884 U CN 204565884U CN 201520176335 U CN201520176335 U CN 201520176335U CN 204565884 U CN204565884 U CN 204565884U
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- holding tray
- workpiece
- polishing machine
- single side
- side polishing
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model is a kind of single side polishing machine bonding device, this device comprises ceramic disk, described ceramic disk upper surface is bonded with holding tray, described holding tray is provided with multiple work hole of closing with workpiece size and matching form, described workpiece embeds in holding tray by work hole, described holding tray (1) is the one in glass epoxy plate or blue steel sheet, and it directly should be bonding firm, smooth with ceramic disk (2).Adopt technical solutions of the utility model, avoid absorption layer and paste wax defect separately, workpiece convenient and swiftly can put into holding tray workpiece hole, workpiece is fixing reliable, and save the inconsistency defect of the loaded down with trivial details and wax-layer thickness pasting wax, substantially reduce the bonding die time, improve machining accuracy, and applied widely, interchangeability is high.
Description
Technical field
The utility model relates to single-sided polishing/grinder field, is specifically related to a kind of single side polishing machine bonding device.
Background technology
The bonding die of electronics special processing equipment single side polishing machine usually adopts absorption layer or pastes wax two kinds of modes.Adopt absorption layer bonding die mode, namely absorption layer is adsorbed on ceramic disk, then absorption of workpieces is processed at absorption layer another side, this mode shortcoming is that absorption layer is easily movable in process, and it is not firm to adsorb, and easily produces waste paper; Adopting and paste wax bonding die mode, namely directly workpiece being attached on ceramic disk after wax heating, then flattening, after wax cooling and can process.This mode shortcoming is that to paste ceroplastic more complicated, needs special to paste that wax machine is auxiliary just can be completed, and the wax-layer thickness uniformity of each workpiece can not get fine guarantee simultaneously, therefore machining accuracy is greatly affected.
Utility model content
The purpose of this utility model is to overcome prior art Problems existing, provides a kind of bonding device.To solve because adopting absorption layer or pasting that wax bonding die mode bonding die is of poor quality, cost is high and the defect such as complex operation.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
A kind of single side polishing machine bonding device, this device comprises ceramic disk, and described ceramic disk upper surface is bonded with holding tray, described holding tray is provided with multiple work hole of closing with workpiece size and matching form, and described workpiece is embedded in holding tray by work hole.
Further, described work hole is evenly distributed on holding tray end face, is advisable at holding tray center with the center of gravity after embedding full workpiece.
Further, described holding tray is provided with three work holes, and in 120 degree of angle distributions between described work hole.
Further, the thickness of described holding tray is no more than the thickness of workpiece, with reserved allowance.
Further, described holding tray is the one in glass epoxy plate or blue steel sheet.
The beneficial effects of the utility model are:
The utility model bonding device avoids absorption layer and pastes wax defect separately, workpiece convenient and swiftly can put into holding tray workpiece hole, and workpiece is fixing reliable, and saves the inconsistency defect of the loaded down with trivial details and wax-layer thickness pasting wax, substantially reduce the bonding die time, improve machining accuracy.
The utility model bonding device, is mainly used in electronics special processing equipment single-sided polishing/grinder bonding die, also can be used for the occasion that other need bonding die.
Accompanying drawing explanation
Fig. 1 is bonding device structure chart of the present utility model;
Fig. 2 is the structural representation after bonding device of the present utility model embeds workpiece.
Number in the figure illustrates: 1, holding tray; 2, ceramic disk; 3 workpiece, 4, work hole.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
With reference to shown in Fig. 1, a kind of single side polishing machine bonding device, this device comprises ceramic disk 2, described ceramic disk 2 upper surface is bonded with holding tray 1, described holding tray 1 is provided with multiple work hole 4 of closing with workpiece 3 size and matching form, described workpiece 3 embeds in holding tray 1 by work hole 4, in the present embodiment, workpiece 3 is embedded after in holding tray 1, entirety can put into equipment and carry out one side grinding/polishing.
Described work hole 4 is evenly distributed on holding tray 1 end face, is advisable at holding tray 1 center with the center of gravity after embedding full workpiece 3.
Described holding tray 1 is provided with three work holes 4, and in 120 degree of angle distributions between described work hole 4.
The thickness of described holding tray 1 is no more than the thickness of workpiece 3, with reserved allowance.
Described holding tray 1 is the one in glass epoxy plate or blue steel sheet, and it directly answers bonding firm, smooth with ceramic disk 2.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection domain of the present utility model.
Claims (5)
1. a single side polishing machine bonding device, this device comprises ceramic disk (2), it is characterized in that, described ceramic disk (2) upper surface is bonded with holding tray (1), described holding tray (1) is provided with multiple work hole (4) of closing with workpiece (3) size and matching form, described workpiece (3) is embedded in holding tray (1) by work hole (4).
2. single side polishing machine bonding device according to claim 1, is characterized in that, described work hole (4) is evenly distributed on holding tray (1) end face, is advisable at holding tray (1) center with the center of gravity after embedding full workpiece (3).
3. single side polishing machine bonding device according to claim 2, is characterized in that, described holding tray (1) is provided with three work holes (4), and in 120 degree of angle distributions between described work hole (4).
4. single side polishing machine bonding device according to claim 3, is characterized in that, the thickness of described holding tray (1) is no more than the thickness of workpiece (3), with reserved allowance.
5. single side polishing machine bonding device according to claim 1, is characterized in that, described holding tray (1) is the one in glass epoxy plate or blue steel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520176335.9U CN204565884U (en) | 2015-03-27 | 2015-03-27 | A kind of single side polishing machine bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520176335.9U CN204565884U (en) | 2015-03-27 | 2015-03-27 | A kind of single side polishing machine bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204565884U true CN204565884U (en) | 2015-08-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520176335.9U Active CN204565884U (en) | 2015-03-27 | 2015-03-27 | A kind of single side polishing machine bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204565884U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104759984A (en) * | 2015-03-27 | 2015-07-08 | 苏州赫瑞特电子专用设备科技有限公司 | Die bonding device of single-sided polisher |
| CN109968176A (en) * | 2019-03-18 | 2019-07-05 | 湖南经纬辉开科技有限公司 | A kind of 3D glass protection piece clears off processing jig component and processing method |
-
2015
- 2015-03-27 CN CN201520176335.9U patent/CN204565884U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104759984A (en) * | 2015-03-27 | 2015-07-08 | 苏州赫瑞特电子专用设备科技有限公司 | Die bonding device of single-sided polisher |
| CN109968176A (en) * | 2019-03-18 | 2019-07-05 | 湖南经纬辉开科技有限公司 | A kind of 3D glass protection piece clears off processing jig component and processing method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |