CN104759984A - Die bonding device of single-sided polisher - Google Patents
Die bonding device of single-sided polisher Download PDFInfo
- Publication number
- CN104759984A CN104759984A CN201510137560.6A CN201510137560A CN104759984A CN 104759984 A CN104759984 A CN 104759984A CN 201510137560 A CN201510137560 A CN 201510137560A CN 104759984 A CN104759984 A CN 104759984A
- Authority
- CN
- China
- Prior art keywords
- work
- holding tray
- bonding device
- workpiece
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a die bonding device of a single-sided polisher. The device comprises a ceramic disk, the upper surface of the ceramic disk is glued with a remaining disk on which a plurality of work-piece holes matched with the sizes and shapes of work-pieces are formed, the work-pieces are embedded into the remaining disk through the work-piece holes, the remaining disk 1 is made from either an epoxy resin glass plate or a blue steel disc, and is directly, firmly and flatly glued with the ceramic disc 2. By adopting the technical scheme provided by the invention, the defects of cushion absorbing and wax pasting can be prevented; furthermore, the work-pieces can be convenient and quick to be placed in the work-piece holes of the remaining disk, and the work-pieces are fixed and reliable, therefore the triviality of wax pasting and the inconsistency defects of the thickness of a wax layer can be saved, the gluing time can be greatly reduced, and the processing precision can be improved; furthermore, the die bonding device is wide in range of application and high in interchangeability.
Description
Technical field
The present invention relates to single-sided polishing/grinder field, be specifically related to a kind of single side polishing machine bonding device.
Background technology
The bonding die of electronics special processing equipment single side polishing machine usually adopts absorption layer or pastes wax two kinds of modes.Adopt absorption layer bonding die mode, namely absorption layer is adsorbed on ceramic disk, then absorption of workpieces is processed at absorption layer another side, this mode shortcoming is that absorption layer is easily movable in process, and it is not firm to adsorb, and easily produces waste paper; Adopting and paste wax bonding die mode, namely directly workpiece being attached on ceramic disk after wax heating, then flattening, after wax cooling and can process.This mode shortcoming is that to paste ceroplastic more complicated, needs special to paste that wax machine is auxiliary just can be completed, and the wax-layer thickness uniformity of each workpiece can not get fine guarantee simultaneously, therefore machining accuracy is greatly affected.
Summary of the invention
The object of the invention is to overcome prior art Problems existing, a kind of bonding device is provided.To solve because adopting absorption layer or pasting that wax bonding die mode bonding die is of poor quality, cost is high and the defect such as complex operation.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
A kind of single side polishing machine bonding device, this device comprises ceramic disk, and described ceramic disk upper surface is bonded with holding tray, described holding tray is provided with multiple work hole of closing with workpiece size and matching form, and described workpiece is embedded in holding tray by work hole.
Further, described work hole is evenly distributed on holding tray end face, is advisable at holding tray center with the center of gravity after embedding full workpiece.
Further, described holding tray is provided with three work holes, and in 120 degree of angle distributions between described work hole.
Further, the thickness of described holding tray is no more than the thickness of workpiece, with reserved allowance.
Further, described holding tray is the one in glass epoxy plate or blue steel sheet.
The invention has the beneficial effects as follows:
Bonding device of the present invention avoids absorption layer and pastes wax defect separately, workpiece convenient and swiftly can put into holding tray workpiece hole, and workpiece is fixing reliable, and saves the inconsistency defect of the loaded down with trivial details and wax-layer thickness pasting wax, substantially reduce the bonding die time, improve machining accuracy.
Bonding device of the present invention, is mainly used in electronics special processing equipment single-sided polishing/grinder bonding die, also can be used for the occasion that other need bonding die.
Accompanying drawing explanation
Fig. 1 is bonding device structure chart of the present invention;
Fig. 2 is the structural representation after bonding device of the present invention embeds workpiece.
Number in the figure illustrates: 1, holding tray; 2, ceramic disk; 3 workpiece, 4, work hole.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
With reference to shown in Fig. 1, a kind of single side polishing machine bonding device, this device comprises ceramic disk 2, described ceramic disk 2 upper surface is bonded with holding tray 1, described holding tray 1 is provided with multiple work hole 4 of closing with workpiece 3 size and matching form, described workpiece 3 embeds in holding tray 1 by work hole 4, in the present embodiment, workpiece 3 is embedded after in holding tray 1, entirety can put into equipment and carry out one side grinding/polishing.
Described work hole 4 is evenly distributed on holding tray 1 end face, is advisable at holding tray 1 center with the center of gravity after embedding full workpiece 3.
Described holding tray 1 is provided with three work holes 4, and in 120 degree of angle distributions between described work hole 4.
The thickness of described holding tray 1 is no more than the thickness of workpiece 3, with reserved allowance.
Described holding tray 1 is the one in glass epoxy plate or blue steel sheet, and it directly answers bonding firm, smooth with ceramic disk 2.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a single side polishing machine bonding device, this device comprises ceramic disk (2), it is characterized in that, described ceramic disk (2) upper surface is bonded with holding tray (1), described holding tray (1) is provided with multiple work hole (4) of closing with workpiece (3) size and matching form, described workpiece (3) is embedded in holding tray (1) by work hole (4).
2. single side polishing machine bonding device according to claim 1, is characterized in that, described work hole (4) is evenly distributed on holding tray (1) end face, is advisable at holding tray (1) center with the center of gravity after embedding full workpiece (3).
3. single side polishing machine bonding device according to claim 2, is characterized in that, described holding tray (1) is provided with three work holes (4), and in 120 degree of angle distributions between described work hole (4).
4. single side polishing machine bonding device according to claim 3, is characterized in that, the thickness of described holding tray (1) is no more than the thickness of workpiece (3), with reserved allowance.
5. single side polishing machine bonding device according to claim 1, is characterized in that, described holding tray (1) is the one in glass epoxy plate or blue steel sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510137560.6A CN104759984A (en) | 2015-03-27 | 2015-03-27 | Die bonding device of single-sided polisher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510137560.6A CN104759984A (en) | 2015-03-27 | 2015-03-27 | Die bonding device of single-sided polisher |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104759984A true CN104759984A (en) | 2015-07-08 |
Family
ID=53642249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510137560.6A Pending CN104759984A (en) | 2015-03-27 | 2015-03-27 | Die bonding device of single-sided polisher |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104759984A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110818397A (en) * | 2019-11-28 | 2020-02-21 | 溆浦易锋精细瓷业有限责任公司 | Ceramic wafer processing method and ceramic wafer |
| CN111185858A (en) * | 2020-02-28 | 2020-05-22 | 北京道天技术研发有限公司 | Method for processing high-precision superhard abrasive material integral cutting grinding wheel |
| CN111571367A (en) * | 2020-03-18 | 2020-08-25 | 江苏普世祥光电技术有限公司 | Processing method of optical prism |
| CN115008341A (en) * | 2022-06-28 | 2022-09-06 | 东莞市盈鑫半导体材料有限公司 | Wax-free polishing adsorption pad positive pressure heat lamination process |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87202507U (en) * | 1987-03-02 | 1988-03-23 | 天津市半导体技术研究所 | Wax-free polishing gasket for silicon pellet |
| CN201077033Y (en) * | 2007-04-19 | 2008-06-25 | 刘培东 | Integral polishing ceramic plate for silicon chip wax-free polishing |
| CN202114565U (en) * | 2011-05-05 | 2012-01-18 | 深圳市科利德光电材料股份有限公司 | Glass polishing fixing device |
| CN102581750A (en) * | 2012-03-31 | 2012-07-18 | 天津西美科技有限公司 | Wax-free grinding and polishing template with double inlaying layers |
| CN202498431U (en) * | 2012-03-27 | 2012-10-24 | 蓝思旺科技(深圳)有限公司 | Jig for polishing glass surfaces |
| CN104440497A (en) * | 2014-11-24 | 2015-03-25 | 蓝思科技股份有限公司 | Polishing device and method for cambered surfaces of mobile phone panels |
| CN204565884U (en) * | 2015-03-27 | 2015-08-19 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of single side polishing machine bonding device |
-
2015
- 2015-03-27 CN CN201510137560.6A patent/CN104759984A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87202507U (en) * | 1987-03-02 | 1988-03-23 | 天津市半导体技术研究所 | Wax-free polishing gasket for silicon pellet |
| CN201077033Y (en) * | 2007-04-19 | 2008-06-25 | 刘培东 | Integral polishing ceramic plate for silicon chip wax-free polishing |
| CN202114565U (en) * | 2011-05-05 | 2012-01-18 | 深圳市科利德光电材料股份有限公司 | Glass polishing fixing device |
| CN202498431U (en) * | 2012-03-27 | 2012-10-24 | 蓝思旺科技(深圳)有限公司 | Jig for polishing glass surfaces |
| CN102581750A (en) * | 2012-03-31 | 2012-07-18 | 天津西美科技有限公司 | Wax-free grinding and polishing template with double inlaying layers |
| CN104440497A (en) * | 2014-11-24 | 2015-03-25 | 蓝思科技股份有限公司 | Polishing device and method for cambered surfaces of mobile phone panels |
| CN204565884U (en) * | 2015-03-27 | 2015-08-19 | 苏州赫瑞特电子专用设备科技有限公司 | A kind of single side polishing machine bonding device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110818397A (en) * | 2019-11-28 | 2020-02-21 | 溆浦易锋精细瓷业有限责任公司 | Ceramic wafer processing method and ceramic wafer |
| CN111185858A (en) * | 2020-02-28 | 2020-05-22 | 北京道天技术研发有限公司 | Method for processing high-precision superhard abrasive material integral cutting grinding wheel |
| CN111571367A (en) * | 2020-03-18 | 2020-08-25 | 江苏普世祥光电技术有限公司 | Processing method of optical prism |
| CN115008341A (en) * | 2022-06-28 | 2022-09-06 | 东莞市盈鑫半导体材料有限公司 | Wax-free polishing adsorption pad positive pressure heat lamination process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104759984A (en) | Die bonding device of single-sided polisher | |
| JP2009246240A (en) | Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same | |
| CN103341820A (en) | Flat grinder using vacuum chuck | |
| KR20160110150A (en) | Method of producing protective member | |
| CN104589211B (en) | The flat surface grinding processing unit (plant) of a kind of ultrathin gasket part and use processing method thereof | |
| CN204565884U (en) | A kind of single side polishing machine bonding device | |
| JP7321893B2 (en) | Spacer, substrate laminate, substrate manufacturing method, and magnetic disk substrate manufacturing method | |
| CN105102189A (en) | Template assembly and method for manufacturing template assembly | |
| CN103700607A (en) | Tooling for reconditioning pin in ceramic column grid array (CCGA) | |
| CN102935611A (en) | Grinding machine | |
| CN105834801A (en) | Fixing method for lathing of thin plate | |
| JP5912696B2 (en) | Grinding method | |
| CN206366872U (en) | A kind of positioning tool of surface grinding machine | |
| CN103962866A (en) | Non-magnetic sheet clamping and positioning tool and manufacturing method thereof | |
| CN109909764A (en) | A kind of rotatable clamp | |
| KR20160086995A (en) | Polishing Jig for pannel | |
| CN205074924U (en) | Orbital sander abrasive paper clamping device | |
| CN204277770U (en) | A kind of flat surface grinding processing unit (plant) of ultrathin gasket part | |
| CN203875651U (en) | Clamping and locating tool for non-magnetic sheets | |
| CN207696229U (en) | A kind of blowout patche surface grinding machine | |
| CN106903565A (en) | Equipment for grinding, method for grinding and the carborundum plate for glass manufacturing apparatus | |
| CN105499673A (en) | Processing method of small thin shape-variable single-sided processed part | |
| TWI224832B (en) | Process for machining a wafer-like workpiece | |
| CN214817709U (en) | Double-sided machining fixing structure of large thin-wall plate on grinding machine workbench | |
| CN210650335U (en) | Device for quickly and accurately positioning glass sample block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150708 |