CN104440497A - Polishing device and method for cambered surfaces of mobile phone panels - Google Patents
Polishing device and method for cambered surfaces of mobile phone panels Download PDFInfo
- Publication number
- CN104440497A CN104440497A CN201410680488.7A CN201410680488A CN104440497A CN 104440497 A CN104440497 A CN 104440497A CN 201410680488 A CN201410680488 A CN 201410680488A CN 104440497 A CN104440497 A CN 104440497A
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- polishing
- mobile phone
- cambered surface
- matrix
- protective sleeve
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a polishing device for the cambered surfaces of mobile phone panels, and more particularly relates to the polishing device for the cambered surfaces of 2.5D and 3D mobile phone panels. The polishing device comprises base bodies and a ceramic disk with a protective jacket. Each base body is provided with a countersunk groove used for placing the mobile phone panels, and absorption pads which are fixedly connected and used for absorbing the mobile phone panels are arranged in the countersunk grooves. The protective jacket is fixedly connected to the ceramic disk, and the protective jacket is provided with cavities used for placing the base bodies. The invention further provides a polishing method correspondingly. By means of the cambered surface polishing device, the problems that the polishing effect of the cambered surfaces is poor, the device is complex, clamping is difficult, and machining efficiency is low in the prior art can be solved, the plane polishing precision is further improved, and the plane polishing difficulty is lowered; the device is particularly suitable for the situation that the cambered surface is bad and thus reworking is needed.
Description
Technical field
The present invention relates to a kind of burnishing device for mobile phone faceplate cambered surface and finishing method, especially a kind of burnishing device for processing 2.5D or 3D Sapphire mobile phone panel cambered surface and finishing method.
Background technology
Synthetic sapphire crystal (a-Al
2o
3) because have special physics, chemistry, optical characteristics, be widely used in form material.Sapphire, as form material, needs its surface to carry out polishing, thus obtains good optics and aesthetic effect.At present, mobile phone faceplate plane polishing comparative maturity, but relative to there being 2.5D or the 3D mobile phone faceplate of cambered surface, its cambered surface polishing is technical bottleneck always.The hairbrush of different materials is mainly utilized to sweep grinding and polishing light to mobile phone faceplate cambered surface at present, as patent CN201320885994.0 provides a kind of globoidal glass burnishing device and patent CN201120347925.5 to provide a kind of arc-surface polishing wheel of single-crystal silicon rod.But its polishing effect is not good, and poor stability, mainly the inhomogeneities of hairbrush and the reason of cambered surface own cause unbalance stress, finally cause polishing effect not good.Especially for the sapphire material that hardness is larger, if there is no certain pressure, its polishing effect extreme difference.And utilize hairbrush to carry out polishing to four arc limits, need special device and equipment.Its clamping is numerous and diverse, and working (machining) efficiency is low, and may destroy plane precision, increases plane polishing difficulty.
Therefore, the deficiency improving existing hairbrush burnishing device is badly in need of in this area, and provides a kind of burnishing device for mobile phone faceplate cambered surface and method.
Summary of the invention
The invention provides a kind of burnishing device for mobile phone faceplate cambered surface, comprise the ceramic disk 4 of matrix 1 and band protective sleeve 5; Described matrix being provided with the deep gouge 2 for holding mobile telephone panel, in deep gouge, being provided with the absorption layer 3 for adsorbing described mobile phone faceplate be fixedly connected with; Described protective sleeve is fixedly connected on described ceramic disk, and protective sleeve is provided with the die cavity 6 for placing matrix.
In the present invention, the die cavity number on ceramic disk protective sleeve is determined by mobile phone faceplate size, and die cavity is generally the circumferential position being in a row distributed in ceramic disk, such as, on the circumferential position of ceramic disk, be evenly provided with a row totally 5 die cavities.When mobile phone faceplate size is less, described die cavity also can be in concentrically ringed two row or multi-row distribution.
Device provided by the invention not only can improve the problem that the cambered surface polishing effect of cambered surface glossing in prior art is poor, device is loaded down with trivial details, clamping is difficult, working (machining) efficiency is low, and can also improve plane polishing precision and reduce plane polishing difficulty.The present invention, by arranging absorption layer in deep gouge, directly can place product, avoid the troublesome operation such as clamping.
Preferably, described mobile phone faceplate is 2.5D or 3D Sapphire mobile phone panel.
Preferably, the material of described matrix is bakelite, and the material of described protective sleeve is PVC or epoxy resin.
Preferably, described absorption layer is damping cloth.In the present invention, described absorption layer is of a size of consistent with mobile phone faceplate surface size or smaller.Damping cloth of the present invention is such as carrying the damping cloth of glue-line.In preparation burnishing device process of the present invention, first cut the damping cloth of corresponding size according to the size of mobile phone faceplate and deep gouge, tear the diaphragm of its glue-line off, damping cloth is pasted onto in the deep gouge 2 of matrix 1, obtain the absorption layer be fixedly connected with deep gouge 2.
Preferably, be fixedly connected with between described matrix with the ceramic disk of described band protective sleeve; More preferably, described matrix is bonded in the die cavity of described protective sleeve by bonding agent.Ceramic disk is arranged the object of protective sleeve mainly in order to prevent matrix in process from departing from.In the polishing process that the present invention relates to, matrix can be effectively fixing.In the present invention, as do not specialized, then bonding agent used in the present invention can be such as AB glue.
Preferably, described absorption layer is bonded in described deep gouge by bonding agent.
Preferably, described protective sleeve is bonded on described ceramic disk by bonding agent.
In the present invention, polishing polishing pad used is such as the 3D polishing pad of high compression ratio, under certain pressure condition, can carry out polishing to cambered surface.
The present invention also provides the preparation method of device described above, comprising: on ceramic disk, be first fixedly connected with the protective sleeve with die cavity, and be fixedly connected in the deep gouge of matrix by described absorption layer, then is fixedly connected in die cavity by matrix and namely obtains described device; Preferably matrix glue to be bonded in die cavity and platen solidification 0.5 ~ 3 hour.In the present invention, described platen is such as the pressure using machine to produce some strength cements compressing between each parts and glue.
The present invention also provides a kind of cambered surface to mobile phone faceplate to carry out the method for polishing, comprises and uses said apparatus and the polishing of four-head polishing machine.Concrete embodiment is such as: the absorption layer first in wetting deep gouge, and will treat that the mobile phone faceplate of cambered surface polishing is positioned over compacting in deep gouge, all around promote to shift out, the cambered surface of mobile phone faceplate exposes; Particle diameter is used to be the polishing fluid of 5 ~ 500nm and to adopt the four-head polishing machine being fitted with 3D polishing pad to carry out polishing to the cambered surface of mobile phone faceplate.In the present invention, will treat that the mobile phone faceplate of cambered surface polishing is positioned over the process of compacting in deep gouge and uses artificial hand.Complete in cambered surface polishing process, although also can directly manual mobile phone faceplate be taken out from the absorption layer deep gouge, but taken out more preferably by sucker, the suction perpendicular to mobile phone faceplate surface that sucker produces is greater than the adhesion between mobile phone faceplate and absorption layer, thus uses sucker to be taken out by the product completing cambered surface polishing like a cork.
Use cambered surface burnishing device provided by the invention can simplify cambered surface glossing, cut down finished cost, increase the cambered surface surface accuracy of mobile phone faceplate simultaneously.Present invention, avoiding the unequal undesirable condition of hairbrush, the difficulty of CMP (chemically mechanical polishing) can also be reduced simultaneously; Especially there is the product that cambered surface scratches after being directed to plane polishing, do not need to do over again again to cambered surface polishing and plane polishing, only need directly to use device of the present invention to carry out cambered surface polishing.
Accompanying drawing explanation
Fig. 1 is the structural representation of matrix in the present invention;
Fig. 2 is the structural representation of the protective sleeve of belt type cavity;
Fig. 3 is the cambered surface burnishing device structural representation in a kind of detailed description of the invention of the present invention;
In figure, 1-matrix, 2-deep gouge, 3-absorption layer, 4-ceramic disk, 5-protective sleeve, 6-die cavity.
Detailed description of the invention
Below by way of specific embodiment, the specific embodiment of the present invention is described in further detail.Wherein embodiment 1 ~ 3 relates to and carries out cambered surface polishing to normal mobile phone faceplate product.Embodiment 4 relate to exist cambered surface scratch, not thoroughly, the mobile phone faceplate abnormal article such as hot spot does over again and carries out cambered surface polishing.
Embodiment 1
Cambered surface burnishing device: as shown in accompanying drawing 1 ~ 3, provides a kind of cambered surface burnishing device for mobile phone faceplate in the present embodiment, comprise the ceramic disk 4 of matrix 1 and band protective sleeve 5; Described matrix being provided with according to mobile phone faceplate sample size and the deep gouge 2 of respective design, in deep gouge, being provided with the absorption layer 3 for adsorbing described mobile phone faceplate be fixedly connected with it; Described protective sleeve is fixedly connected on described ceramic disk, and protective sleeve is provided with the die cavity 6 for placing matrix.Those skilled in the art's easy understand ground, designs groove depth and/or the different deep gouge of surface size according to the difference of mobile phone faceplate sample size.When using cambered surface burnishing device of the present invention, mobile phone faceplate sample is positioned in deep gouge and cambered surface exposes, and uses polishing machine (as four-head polishing machine) to carry out polishing to it.Those skilled in the art know, mobile phone faceplate forms 6 outer surfaces altogether by its length and width and thick three directions, the present invention relates to one of them long × wide outer surface of polishing, the center of this outer surface is a plane, but four cambered surfaces have been processed as in the position of its former four edges, main purpose of the present invention is by these four cambered surface polishings, can certainly simultaneously to this central plane polishing.Wherein, in the process obtaining apparatus of the present invention, ceramic disk 4 is cleaned up, stick the protective sleeve 5 with die cavity 6.Matrix 1 is fitted in die cavity 6, fixes with glue, and coil solidification 1 hour with defeating of 300kg.
The using method of cambered surface burnishing device: first post 3D polishing pad on SPEEDFAM four-head polishing machine, carry out platen, pastes steady.Absorption layer in wetting deep gouge 2, will treat that the mobile phone faceplate sample of cambered surface polishing is positioned over compacting in deep gouge, and front, rear, left and right promote to shift out, and cambered surface highlights outside deep gouge.
Selection particle diameter is the SiO2 polishing fluid of 75.0nm, adopts the SPEEDFAM four-head polishing machine being fitted with 3D polishing pad to carry out polishing.Machined parameters is, polishing fluid proportioning: 3L (polishing fluid): 6L (pure water); Pressure: 0.24g/cm
2; Polishing fluid flow: 6L/min; Lower wall rotating speed: 45rpm; Polishing time: 45min.
According to the processes sapphire cambered surface of the present embodiment, cambered surface roughness reaches below 1.5nm, adopt this processing technology, plane is not only damaged, but also be conducive to planar smoothness and fineness, reduce the polishing difficulty of plane CMP, after cambered surface polishing, plane roughness reaches 0.5-0.8nm.
Embodiment 2
Cambered surface burnishing device in the present embodiment and the using method of cambered surface burnishing device all in the same manner as in Example 1.
Particle diameter is selected to be the SiO of 80nm
2polishing fluid, adopts the SPEEDFAM four-head polishing machine being fitted with 3D polishing pad to carry out polishing: machined parameters is, polishing fluid proportioning: 3L (polishing fluid): 6L (pure water); Pressure: 0.32g/cm
2; Polishing fluid flow: 6L/min; Lower wall rotating speed: 45rpm; Polishing time: 30min.
According to the processes sapphire cambered surface of the present embodiment, cambered surface roughness reaches below 1.5nm, adopt this processing technology, plane is not only damaged, but also be conducive to planar smoothness and fineness, reduce the polishing difficulty of plane CMP, after cambered surface polishing, plane roughness reaches 0.5-0.8nm.
Embodiment 3
Cambered surface burnishing device in the present embodiment and the using method of cambered surface burnishing device all in the same manner as in Example 1.In addition, the optimum configurations in polishing process is as follows.
First mill:
Particle diameter is selected to be the SiO of 80nm
2polishing fluid, adopts the SPEEDFAM four-head polishing machine being fitted with 3D polishing pad to carry out polishing: machined parameters is, polishing fluid proportioning: 5L (polishing fluid): 5L (pure water); Pressure: 0.24g/cm
2; Polishing fluid flow: 6L/min; Lower wall rotating speed: 45rpm; Polishing time: 60min;
Cleaning machine after polishing terminates, scrubs card;
Second mill:
The polishing fluid of the first mill recycles, and newly add polishing fluid 2L (polishing fluid): 2L (pure water), the material and first newly with polishing fluid is ground identical, starts polishing product.Burnishing parameters is, pressure: 0.24g/cm
2; Polishing fluid flow: 6L/min; Lower wall rotating speed: 45rpm; Polishing time: 60min;
Cleaning machine after polishing terminates, scrubs card;
3rd mill:
The polishing fluid of the second mill recycles, and newly with polishing fluid proportioning: 2L (polishing fluid): 2L (pure water), the material and first newly with polishing fluid is ground identical.Burnishing parameters is, pressure: 0.24g/cm
2; Polishing fluid flow: 6L/min; Lower wall rotating speed: 45rpm; Polishing time: 60min;
According to the processes sapphire cambered surface of the present embodiment, cambered surface roughness reaches below 1.5nm, adopt this processing technology, plane is not only damaged, but also be conducive to planar smoothness and fineness, reduce the polishing difficulty of plane CMP, after cambered surface polishing, plane roughness reaches 0.5-0.8nm.
Embodiment 4
Cambered surface burnishing device in the present embodiment and the using method of cambered surface burnishing device all in the same manner as in Example 1.In addition, the optimum configurations in polishing process is as follows.
First mill:
Particle diameter is selected to be the SiO of 80nm
2polishing fluid, adopts the SPEEDFAM four-head polishing machine being fitted with 3D polishing pad to carry out polishing: machined parameters is, polishing fluid proportioning: 3L (polishing fluid): 6L (pure water); Pressure: 0.2g/cm
2; Polishing fluid flow: 6L/min; Lower wall rotating speed: 45rpm; Polishing time: 45min.
To do over again the bad product of cambered surface according to the technique of the present embodiment, a yield more than 85%, and can also surface polishing scuffing simultaneously etc. bad, do not need again to do over again to special-shaped polishing, then to CMP, optimize technological process to a great extent.Product below cambered surface roughness 1.5nm after polishing, plane roughness reaches below 0.4nm, and TTV (surface smoothness) is 5um, angularity 2um.
Claims (10)
1., for a burnishing device for mobile phone faceplate cambered surface, comprise the ceramic disk (4) of matrix (1) and band protective sleeve (5); Described matrix being provided with the deep gouge (2) for holding mobile telephone panel, in deep gouge, being provided with the absorption layer (3) for adsorbing described mobile phone faceplate be fixedly connected with; Described protective sleeve is fixedly connected on described ceramic disk, and protective sleeve is provided with the die cavity (6) for placing matrix (1).
2. device according to claim 1, is characterized in that, described mobile phone faceplate is 2.5D or 3D Sapphire mobile phone panel.
3. device according to claim 1, is characterized in that, the material of described matrix is bakelite, and the material of described protective sleeve is PVC or epoxy resin.
4. device according to claim 1, is characterized in that, described absorption layer is damping cloth.
5. according to the device in Claims 1 to 4 described in any one, it is characterized in that, be fixedly connected with between described matrix with the ceramic disk of described band protective sleeve, preferred described matrix is bonded in the die cavity of described protective sleeve by bonding agent.
6. according to the device in Claims 1 to 4 described in any one, it is characterized in that, described absorption layer is bonded in described deep gouge by bonding agent.
7. according to the device in Claims 1 to 4 described in any one, it is characterized in that, described protective sleeve is bonded on described ceramic disk by bonding agent.
8. the preparation method as the device in claim 1 ~ 7 as described in any one, comprise: on ceramic disk, be first fixedly connected with the protective sleeve with die cavity, and described absorption layer is fixedly connected in the deep gouge of matrix, then matrix is fixedly connected in die cavity namely obtains described device; Preferably matrix glue to be bonded in die cavity and platen solidification 0.5 ~ 3 hour.
9. mobile phone faceplate cambered surface is carried out to a method for polishing, comprise the device in use claim 1 ~ 7 described in any one and the polishing of four-head polishing machine.
10. method according to claim 9, is characterized in that, the absorption layer first in wetting deep gouge, will treat that the mobile phone faceplate of cambered surface polishing is positioned over compacting in deep gouge, and all around promote to shift out, the cambered surface of mobile phone faceplate exposes; Particle diameter is used to be the polishing fluid of 5 ~ 500nm and to adopt the four-head polishing machine being fitted with 3D polishing pad to carry out polishing to the cambered surface of mobile phone faceplate.
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| CN104759984A (en) * | 2015-03-27 | 2015-07-08 | 苏州赫瑞特电子专用设备科技有限公司 | Die bonding device of single-sided polisher |
| CN104889874A (en) * | 2015-06-25 | 2015-09-09 | 蓝思科技（长沙）有限公司 | Adsorption cushion for polishing sapphire and preparation method thereof |
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| CN110125799A (en) * | 2018-02-08 | 2019-08-16 | 蓝思科技（长沙）有限公司 | Bend glass polishing clamp and polishing method and burnishing device |
| CN110125799B (en) * | 2018-02-08 | 2020-06-30 | 蓝思科技（长沙）有限公司 | Curved glass polishing clamp, polishing method and polishing device |
| CN108381344A (en) * | 2018-03-05 | 2018-08-10 | 苏州润桐专利运营有限公司 | A kind of panel computer shell arc surface grinding apparatus |
| CN108527130A (en) * | 2018-06-04 | 2018-09-14 | 佛山市同鑫智能装备科技有限公司 | A kind of stainless steel cell phone rear cover processing method |
| CN110576341A (en) * | 2018-06-11 | 2019-12-17 | 蓝思科技（长沙）有限公司 | Polishing fixing device, polishing equipment and polishing method |
| CN110576341B (en) * | 2018-06-11 | 2022-04-12 | 蓝思科技（长沙）有限公司 | Polishing method, polishing fixing device and polishing equipment |
| CN109332341A (en) * | 2018-10-16 | 2019-02-15 | 重庆两江联创电子有限公司 | The repair method of 3D glass cover-plate |
| US11338392B2 (en) | 2018-11-09 | 2022-05-24 | Industrial Technology Research Institute | Cutting method for forming chamfered corners |
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