CN103700607A - Tooling for reconditioning pin in ceramic column grid array (CCGA) - Google Patents
Tooling for reconditioning pin in ceramic column grid array (CCGA) Download PDFInfo
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- CN103700607A CN103700607A CN201310701591.0A CN201310701591A CN103700607A CN 103700607 A CN103700607 A CN 103700607A CN 201310701591 A CN201310701591 A CN 201310701591A CN 103700607 A CN103700607 A CN 103700607A
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- spacing
- pin
- grid array
- column grid
- clamp
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a tooling for reconditioning a pin in a ceramic column grid array (CCGA), belonging to the technical field of the CCGA. In the tooling for removing an oxidized layer, the exposure quantity of the pin of the CCGA device, relative to a clamping plate, can be adjusted by an adjusting washer, and is properly controlled to be about 0.1mm. An operator slightly grinds special abrasive paper stably by holding a pressure block handle, so as to achieve the purpose of removing the oxidized layer on the welded surface of the pin. The tooling is convenient to operate in the overall process, good in grinding effect, and capable of improving the overall planeness of the welded surface while the oxidized layer on the welded surface of the pin is removed.
Description
Technical field
The present invention relates to a kind ofly for repairing the frock of Ceramic column grid array pin, belong to Ceramic column grid array technical field.
Background technology
Ceramic column grid array (CCGA) encapsulation is due to its high density I/O, high reliability, good electric and hot property, is widely used and the electronic product such as military and Aero-Space.But simultaneously because special architectural feature own makes the welding and assembling technics technology of CCGA device have certain difficulty.
Surface-mounting equipment and the technological process of the veneer assembling employing standard of CCGA, the links such as experience printed board cleaning, soldering paste are bitten, paster, reflow soldering, cleaning and detection.Before packaging technology carries out, to note especially depositing and protecting of CCGA device.In general, CCGA device supplier can provide special apparatus protective device, mostly is black electrostatic drying box, with dry filler sealing, intact injury-free to guarantee colonnade.Not removable dry filler before using, in order to avoid colonnade oxidation affects reflow soldering.If preserve, be not good at, cause the crooked or colonnade oxidation of indivedual welding columns, generally can only plant post and avoid occurring the quality problems after welding by CCGA device ceramic substrate is re-started.
Summary of the invention
The object of the invention is, in order to overcome in prior art the problem of the crooked or oxidation of pin in Ceramic column grid array, to propose a kind of for repairing the frock of Ceramic column grid array pin.
The object of the invention is to be achieved through the following technical solutions.
Of the present invention a kind of for repairing the frock of Ceramic column grid array pin, this frock comprises polishing tool and shape righting tool, shape righting tool is an orthopedic clamp, and its center position distribution has 717 spacing holes, and the distribution of spacing hole and the position of the pin in Ceramic column grid array match; The diameter of spacing hole is 0.6mm, 0.7mm or 0.8mm, and the spacing of spacing hole is 1.27mm;
Polishing tool comprises briquetting handle, spacing clamp combination, safetied pin, sponge cushion and adjusts pad;
Spacing clamp combination comprises posting and spacing clamp, and the centre bit of spacing clamp is equipped with a square service area, and Ceramic column grid array is positioned in service area; Four angles of service area are respectively with a macropore, and the diameter of macropore is 5mm, is distributed with 717 spacing holes on service area, and the distribution of spacing hole and the position of the pin in Ceramic column grid array match; The diameter of the spacing hole on spacing clamp is 0.6mm, and the spacing of spacing hole is 1.27mm, and the pin in Ceramic column grid array is fixed on spacing clamp by spacing hole; Posting is fixed on spacing clamp by glue;
Adjustment pad is formed in one, and the upper part of adjusting pad is cylinder, and thickness is 0.1-0.3mm, and diameter is 5.2mm, and the lower part of adjusting pad is also cylinder, and thickness is 2.5mm, and diameter is 4.8mm; Adjust pad and be positioned in macropore, by adjusting pad, adjust the ceramic substrate and the spacing of spacing clamp in Ceramic column grid array, and then reach the object that pin in adjustment Ceramic column grid array exposes the length of spacing clamp; Adjust pad and can also protect the cornerite of the pin in Ceramic column grid array;
Sponge cushion is bonded on the bottom surface of briquetting handle inside, briquetting handle together with sponge cushion be placed on Ceramic column grid array above, Ceramic column grid array is compressed;
Briquetting handle and posting are fixed by safetied pin;
The one side of the spacing hole on orthopedic clamp is equipped with the guide hole of 15 °, and the degree of depth is half of spacing hole overall depth.
Beneficial effect
Orthopedic clamp by plurality of specifications is proofreaied and correct the position of pin successively, can improve orthopedic precision and orthopedic quality.The quality of device after the multiple means assurance deoxidation layers such as Pin locations, protection pin cornerite are not scratched by protecting, control device clamping force, control pin stock removal, control pin solder side flatness.
This frock can correct Pin locations, remove pin solder side oxide layer, so can there is no need CCGA device again to plant post, has avoided lacking the problem of planting post ability for this device.Device can to a certain degree improve welding quality through finishing, strengthens soldering reliability.
The correction accuracy of shape righting tool relies on the relative positional accuracy of frock self guide hole and aperture precision to guarantee, deoxidation layer frock can guarantee that device pin slightly polishes reposefully on special-purpose sand paper by self structure, reaches the object of removing pin solder side oxide layer.Frock of the present invention is divided into pin shape righting tool and deoxidation layer frock two parts.Pin shape righting tool is that number and the relative position of the spacing guide hole of orthopedic clamp all set with reference to the pin of CCGA device.The thickness of orthopedic clamp is slightly less than the height of CCGA device pin, and the helical pitch of its guide hole is about its thickness half.By aperture, be the orthopedic clamp of 0.8mm, 0.7mm and tri-kinds of specifications of 0.6mm, successively the position of device pin proofreaied and correct, can facilitate like this device pin to enter smoothly guide hole, also can avoid pin stressed excessive and be scratched.In the middle of deoxidation layer frock is wrapped in CCGA device, device bottom is combined and is adjusted pad by spacing clamp and supports, and device top clamps by sponge cushion, briquetting handle, and the clamping force of device depends on the decrement of sponge cushion.Adjust pad except adjusting height, can also protect the not limited clamp of cornerite of pin to scratch.Spacing clamp combination comprises that a base plate is spacing clamp and a profile fixed frame, glued together by AB.After spacing clamp combination and briquetting handle combination, by former and later two safetied pins, both are fixed, in the middle of other assemblies are sandwiched in, integral body cannot be become flexible.
In deoxidation layer frock of the present invention, CCGA device pin, with respect to the amount of exposing of clamp, can be adjusted by adjusting pad, and the amount of exposing is controlled at 0.1mm left and right and is advisable.Operator slightly polishes reposefully with hand steered briquetting handle on special-purpose sand paper, reaches the object of removing pin solder side oxide layer.Whole process operation is convenient, polishes effective, has also improved the flatness of solder side integral body when having removed the oxide layer of pin solder side.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the service area on spacing clamp;
Fig. 2 is the structural representation of spacing hole;
Fig. 3 is the stereogram of frock of the present invention;
Fig. 4 is the structural representation of frock of the present invention;
Fig. 5 is the position relationship schematic diagram between pin and spacing hole.
Embodiment
Below in conjunction with drawings and Examples, the present invention will be further described.
Embodiment
For repairing a frock for Ceramic column grid array pin, this frock comprises polishing tool and shape righting tool;
As depicted in figs. 1 and 2, shape righting tool is orthopedic clamp, and its center position distribution has 717 spacing holes, and the distribution of spacing hole and the position of the pin in Ceramic column grid array match; The diameter of spacing hole is 0.6mm, 0.7mm and 0.8mm, and the spacing of spacing hole is 1.27mm, and the one side of spacing hole is equipped with the guide hole of 15 °, and the degree of depth is half of spacing hole overall depth;
As shown in Figure 3 and Figure 4, polishing tool comprises briquetting handle 2, the combination of spacing clamp, safetied pin 4, sponge cushion 5 and adjusts pad 6;
Spacing clamp combination comprises posting 3 and spacing clamp 1;
The centre bit of spacing clamp 1 is equipped with a square service area, and Ceramic column grid array 7 is positioned in service area; Four angles of service area are respectively with a macropore, and the diameter of macropore is 5mm, is distributed with 717 spacing holes on service area, and the distribution of spacing hole and the position of the pin in Ceramic column grid array match; The diameter of spacing hole is 0.6mm, and the spacing of spacing hole is 1.27mm, and the pin in Ceramic column grid array is fixed on spacing clamp 1 by spacing hole; Posting 3 is fixed on spacing clamp 1 by glue;
Sponge cushion 5 is bonded on the bottom surface of briquetting handle 2 inside, briquetting handle 2 together with sponge cushion 5 be placed on Ceramic column grid array 7 above, Ceramic column grid array 7 is compressed;
Described shape righting tool comprises that aperture is the orthopedic clamp of 0.8mm, 0.7mm and tri-kinds of specifications of 0.6mm, successively the position of pin is proofreaied and correct, and to improve orthopedic precision and orthopedic quality, avoids pin too much to scratch.
The material of shape righting tool and spacing clamp 1 is glass fabric of epoxy resin plate;
The course of work:
1) Ceramic column grid array 7 is installed in shape righting tool, with the orthopedic clamp of 0.8mm, 0.7mm, 0.6mm, the pin of Ceramic column grid array 7 is carried out successively orthopedicly, after orthopedic completing, Ceramic column grid array 7 is transferred in polishing tool;
2) first according to the height of pin, select the adjustment pad 6 of suitable thickness to be installed in the macropore of spacing clamp 1, the part that makes the pin of Ceramic column grid array 7 expose spacing clamp 1 is 0.1mm, then Ceramic column grid array 7 is installed on the relevant position in spacing clamp combination, subsequently by briquetting handle 2 together with sponge cushion 5 be placed on Ceramic column grid array 7 above, Ceramic column grid array 7 is compressed, and by safetied pin 4, briquetting handle 2 and posting 3 are fixed, the pin of Ceramic column grid array 7 exposes the part of spacing clamp 1 and polishes by sand paper, sand paper refers to polishing sand papers more than 1500 orders.
The unspecified content of the present invention is known to the skilled person technology.
Claims (1)
1. for repairing a frock for Ceramic column grid array pin, it is characterized in that: this frock comprises polishing tool and shape righting tool; Shape righting tool is three orthopedic clamps, and its center is distributed with respectively spacing hole, and the distribution of spacing hole and the position of the pin in Ceramic column grid array match; The diameter of the spacing hole of three orthopedic clamps is respectively 0.6mm, 0.7mm and 0.8mm, and the spacing of the spacing hole on each orthopedic clamp is 1.27mm;
Polishing tool comprises briquetting handle, spacing clamp combination, safetied pin, sponge cushion and adjusts pad;
Spacing clamp combination comprises that spacing clamp and posting, the centre bit of spacing clamp are equipped with a square service area, and Ceramic column grid array is positioned in service area; Four angles of service area are respectively with a macropore, and the diameter of macropore is 5mm, is distributed with spacing hole on service area, and the distribution of spacing hole and the position of the pin in Ceramic column grid array match; The diameter of the spacing hole on spacing clamp is 0.6mm, and the spacing of spacing hole is 1.27mm, and the pin in Ceramic column grid array is fixed on spacing clamp by spacing hole; Posting is fixed on spacing clamp by glue;
Adjustment pad is formed in one, and the upper part of adjusting pad is cylinder, and thickness is 0.1-0.3mm, and diameter is 5.2mm, and the lower part of adjusting pad is also cylinder, and thickness is 2.5mm, and diameter is 4.8mm; Adjust pad and be positioned in macropore, by transposing pad, can adjust ceramic substrate in Ceramic column grid array and the spacing of spacing clamp;
Sponge cushion is bonded on the bottom surface of briquetting handle inside, briquetting handle together with sponge cushion be placed on Ceramic column grid array above, Ceramic column grid array is compressed;
Briquetting handle and posting are fixed by safetied pin;
The one side of the spacing hole on orthopedic clamp is equipped with the guide hole of 15 °, and the degree of depth is half of spacing hole overall depth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310701591.0A CN103700607B (en) | 2013-12-19 | 2013-12-19 | A kind of frock for repairing pin in Ceramic column grid array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310701591.0A CN103700607B (en) | 2013-12-19 | 2013-12-19 | A kind of frock for repairing pin in Ceramic column grid array |
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| CN103700607A true CN103700607A (en) | 2014-04-02 |
| CN103700607B CN103700607B (en) | 2016-02-10 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029088A (en) * | 2014-06-27 | 2014-09-10 | 宜特科技(昆山)电子有限公司 | Semiconductor chip grinding method |
| CN105655264A (en) * | 2015-12-30 | 2016-06-08 | 北京时代民芯科技有限公司 | Column planting device and column planting method of CCGA (Ceramic Column Gate Array) device |
| CN106564002A (en) * | 2016-11-09 | 2017-04-19 | 北京时代民芯科技有限公司 | Tool and method for controlling coplanarity, position tolerance and perpendicularity of CCGA device welding columns |
| CN109616929A (en) * | 2018-12-04 | 2019-04-12 | 广东电网有限责任公司 | A kind of current transformer restorative procedure |
| CN113421830A (en) * | 2021-06-15 | 2021-09-21 | 西安微电子技术研究所 | Nondestructive grinding method and device for welding column of CCGA (ceramic column grid array) device |
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| CN102148215A (en) * | 2011-01-21 | 2011-08-10 | 哈尔滨理工大学 | Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method |
| US20120081872A1 (en) * | 2010-09-30 | 2012-04-05 | Alcatel-Lucent Canada Inc. | Thermal warp compensation ic package |
| CN102856215A (en) * | 2012-07-27 | 2013-01-02 | 北京时代民芯科技有限公司 | Column set-up device and method of ceramic column grid array device |
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2013
- 2013-12-19 CN CN201310701591.0A patent/CN103700607B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120081872A1 (en) * | 2010-09-30 | 2012-04-05 | Alcatel-Lucent Canada Inc. | Thermal warp compensation ic package |
| CN102148215A (en) * | 2011-01-21 | 2011-08-10 | 哈尔滨理工大学 | Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method |
| CN102856215A (en) * | 2012-07-27 | 2013-01-02 | 北京时代民芯科技有限公司 | Column set-up device and method of ceramic column grid array device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104029088A (en) * | 2014-06-27 | 2014-09-10 | 宜特科技(昆山)电子有限公司 | Semiconductor chip grinding method |
| CN105655264A (en) * | 2015-12-30 | 2016-06-08 | 北京时代民芯科技有限公司 | Column planting device and column planting method of CCGA (Ceramic Column Gate Array) device |
| CN105655264B (en) * | 2015-12-30 | 2018-07-31 | 北京时代民芯科技有限公司 | A kind of the plant column device and plant column method of CCGA devices |
| CN106564002A (en) * | 2016-11-09 | 2017-04-19 | 北京时代民芯科技有限公司 | Tool and method for controlling coplanarity, position tolerance and perpendicularity of CCGA device welding columns |
| CN109616929A (en) * | 2018-12-04 | 2019-04-12 | 广东电网有限责任公司 | A kind of current transformer restorative procedure |
| CN113421830A (en) * | 2021-06-15 | 2021-09-21 | 西安微电子技术研究所 | Nondestructive grinding method and device for welding column of CCGA (ceramic column grid array) device |
| CN113421830B (en) * | 2021-06-15 | 2023-06-23 | 珠海天成先进半导体科技有限公司 | CCGA device welding column nondestructive grinding method and device |
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| Publication number | Publication date |
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| CN103700607B (en) | 2016-02-10 |
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