CN105280488A - Grinding apparatus and method for grinding rectangular substrate - Google Patents
Grinding apparatus and method for grinding rectangular substrate Download PDFInfo
- Publication number
- CN105280488A CN105280488A CN201510282208.1A CN201510282208A CN105280488A CN 105280488 A CN105280488 A CN 105280488A CN 201510282208 A CN201510282208 A CN 201510282208A CN 105280488 A CN105280488 A CN 105280488A
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- China
- Prior art keywords
- grinding
- rectangular substrate
- chuck table
- unit
- cutting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
The invention provides a grinding apparatus and a method for grinding a rectangular substrate. The grinding apparatus is used for grinding the front/back surface of the rectangular substrate. The grinding apparatus is characterized by comprising a chuck station provided with a retaining surface for absorbing and retaining the rectangular substrate; a grinding unit for supporting a grinding wheel of the rectangular substrate retained and grounded on the chuck station in the rotatable manner; a grinding feed-in unit for grinding and feeding the rectangular substrate in a direction vertical to the retaining surface of the chuck station; a Y-axis movement unit for driving the chuck station and the grinding unit to move relatively between a dismounting region for dismounting the rectangular substrate and a grinding region for grinding the rectangular substrate along the Y-axis direction; and an X-axis movement unit for the chuck station and the grinding unit to move relatively along the X-axis direction orthogonal to the Y-axis direction. The grinding wheel is provided with a wheel base and a grinding stone. The outer diameter of the grinding stone is smaller than the shorter edge of the rectangular substrate.
Description
Technical field
The method for grinding of the grinding attachment that the present invention relates to the rectangular substrate being suitable for the large-scale base plate for packaging of grinding etc. and the rectangular substrate using this grinding attachment.
Background technology
In the manufacturing process of semiconductor device, the multiple semiconductor chips being formed with the circuit such as LSI are installed on lead frame or printed base plate, by the electrode welding of semiconductor chip on the electrode of substrate, then rely on resin seal front or the back side, thus form the base plate for packaging of CSP (ChipSizePackage: chip size packages) substrate or BGA (BallGridArray: ball array encapsulates) substrate etc.
After this, use the cutting base plate for packaging such as bite to make its singualtion, thus produce by each semiconductor device of resin seal (for example, referring to Japanese Unexamined Patent Publication 2009-253058 publication).As above the semiconductor device manufactured can be widely used in the various electronic equipment such as mobile phone and personal computer.
With miniaturization, the slimming of electronic equipment in the last few years, expect that very much semiconductor device also realizes miniaturization, slimming, for the manufacturing process of semiconductor device, there is the resin seal face of the base plate for packaging that semiconductor chip resin seal forms by expectation, i.e. grinding as follows and make its thinning and grinding be installed on the back side of the semiconductor chip on printed base plate and make its thinning.
In these grinding process, such as, be widely used in the grinding attachment being referred to as grinder disclosed in Japanese Unexamined Patent Publication 2008-272866 publication.Grinding attachment has absorption and remains potted the chuck table being ground thing of substrate etc. and have the Grinding wheel of grinding grinding stone, this grinding grinding stone be disposed of be held in chuck table to be ground thing relative, be connected to the state lower swing be ground on thing at grinding grinding stone, thus complete grinding.
In order to the thickness of the sealing resin be covered on the back side making the base plate for packaging of csp substrate etc. becomes even, use grinding attachment grinding sealing resin (for example, referring to Japanese Unexamined Patent Publication 2011-192781 publication).
Patent documentation 1 Japanese Unexamined Patent Publication 2009-253058 publication
Patent documentation 2 Japanese Unexamined Patent Publication 2008-272866 publication
Patent documentation 3 Japanese Unexamined Patent Publication 2011-192781 publication
But the base plate for packaging of csp substrate in recent years etc. has maximized to the degree of such as 500mm × 700mm, and the Grinding wheel of grinding attachment also maximizes thereupon, there is the problem being difficult to change Grinding wheel.In addition, also exist and make grinding attachment also must become large problem due to the maximization of Grinding wheel.
Summary of the invention
The present invention completes in view of the foregoing, its object is to provide a kind of and can suppress the grinding attachment of the maximization of Grinding wheel and the method for grinding of rectangular substrate.
According to the 1st aspect of the present invention, provide a kind of grinding attachment, it carries out grinding to the front of rectangular substrate or the back side, and it is characterized in that having: chuck table, it has holding surface, and the absorption of this holding surface keeps rectangular substrate; Grinding unit, it supports Grinding wheel in the mode that can rotate, and this Grinding wheel carries out grinding to the rectangular substrate be held in this chuck table; Grinding and feeding unit, it carries out grinding and feeding to this grinding unit in the vertical direction vertical with the holding surface of this chuck table; Y-axis shift moving cell, it makes this chuck table and this grinding unit relatively move in the Y-axis direction between dismounting region and grinding area, wherein, this dismounting region is the region of rectangular substrate being carried out to dismounting, and this grinding area is the region of rectangular substrate being carried out to grinding; And X-axis mobile unit, it makes this chuck table and this grinding unit relatively move in the X-direction orthogonal with Y direction, this Grinding wheel comprises wheel pedestal and is located at cyclic ligand the grinding grinding stone that this takes turns the lower surface peripheral part of pedestal, and the external diameter of the grinding grinding stone that should arrange with ring-type is set to be less than the minor face of rectangular substrate.
In chuck table, be preferably equipped with the grip unit that clamping is held in the rectangular substrate in chuck table.Preferred grinding attachment has cutting unit, and this cutting unit is provided with bite in the mode that can rotate, and this bite cuts the rectangular substrate be held in chuck table.
4th aspect of the present invention provides the method for grinding of the rectangular substrate of the grinding attachment grinding rectangular substrate of a kind of use described in the 3rd aspect, it is characterized in that, have: cutting process, use this bite of this cutting unit not reach the cutting slot of grinding depth being held in Formation Depth in the rectangular substrate in this chuck table, alleviate the internal stress of rectangular substrate; And grinding process, after implementing this cutting process, grinding is carried out to the rectangular substrate be held in this chuck table.
Preferably when using this bite Formation Depth of this cutting unit not reach the cutting slot of grinding depth, utilizing this grip unit to clamp rectangular substrate, after formation cutting slot, removing this grip unit.
According to grinding attachment of the present invention, the external diameter of the grinding grinding stone arranged with ring-type is set smaller than the minor face of rectangular substrate, therefore can either suppresses the maximization of Grinding wheel, be easy to again change Grinding wheel.In addition, Grinding wheel can be made to become small-sized, thus can suppress the maximization of grinding attachment.
And then, owing to having grip unit, therefore bending rectangular substrate also can be held in chuck table, and owing to having cutting unit, therefore, it is possible to the internal stress of alleviation rectangular substrate is with bending with sizing, the absorption affinity of chuck table can be relied on to keep rectangular substrate when relieving grip unit.
Accompanying drawing explanation
Fig. 1 is the stereogram of the grinding attachment of embodiment of the present invention.
(A) of Fig. 2 is the face side stereogram of base plate for packaging, and (B) of Fig. 2 is the rear side stereogram of base plate for packaging, and (C) of Fig. 2 is the partial enlargement side figure of base plate for packaging.
Fig. 3 represents the schematic plan view cutting step.
(A) of Fig. 4 is the schematic isometric of method for grinding, and (B) of Fig. 4 is the schematic plan view of the method for grinding representing the 1st execution mode.
(A) of Fig. 5 is the schematic plan view of the method for grinding representing the 2nd execution mode, (B) of Fig. 5 is the schematic plan view of the method for grinding representing the 3rd execution mode, and (C) of Fig. 5 is the schematic plan view of the method for grinding representing the 4th execution mode.
Label declaration
11: rectangular-shaped base plate for packaging, 13: substrate, 15: segmentation preset lines, 16: grinding subassembly feed mechanism, 17: chip forming portion, 19: semiconductor chip, 21: resin (sealing resin), 28: grinding subassembly (grinding unit), 38: Grinding wheel, 42: grinding grinding stone, 44: cutter assembly (cutting unit), 54: bite, 58: chuck table, 68: clamping.
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.With reference to Fig. 1, show the stereoscopic figure of the grinding attachment 2 of embodiment of the present invention.4 is bases of grinding attachment 2, is uprightly provided with column 6 at the rear of base 4.
Column 6 is fixed with the pair of guide rails 8 extended at above-below direction.Z axis movable block 10 is guided by this pair of guide rails 8, and arranges as above moving in Z-direction (above-below direction) by means of the Z axis travel mechanism 16 be made up of ball-screw 12 and pulse motor 14.
Z axis movable block 10 is fixed with the pair of guide rails 18 extended in the X-axis direction.Back-up block 20 is guided by this pair of guide rails 18, and arranges as moving in the X-axis direction by means of the X-axis travel mechanism 26 be made up of ball-screw 22 and pulse motor 24.
Back-up block 20 supports grinding subassembly (grinding unit) 28.Grinding subassembly 28 has main shaft shell 30, the motor 34 of the main shaft 32 be contained in the mode that can rotate in main shaft shell 30, rotary actuation main shaft 32, be fixed on wheel erector 36 on the front end of main shaft 32 and the mode of dismounting can be installed on Grinding wheel 38 on wheel erector 36.
As shown in (A) of Fig. 4, Grinding wheel 38 by the wheel pedestal 40 of ring-type and below being attached at wheel pedestal 40 with ring-type multiple grinding grinding stones 42 of peripheral part formed.The external diameter of the grinding grinding stone 42 arranged with ring-type is set to be less than the minor face of the base plate for packaging 11 shown in Fig. 2.
Back-up block 20 carries cutter assembly (cutting unit) 44.The fixed part 46 of cutter assembly 44 is fixed on back-up block 20, and moving-member 48 can the mode of movement in the Z-axis direction be installed on this fixed part 46 to rely on cylinder etc.
Moving-member 48 is fixed wtih main shaft shell 50, in main shaft shell 50, contains main shaft 52 in the mode that can rotate, main shaft 52 is accommodated in the not shown motor rotary actuation in main shaft shell 50.At the leading section of main shaft 52, bite 54 is installed.
Base 4 is equipped chuck table mechanism 56.Chuck table mechanism 56 has chuck table 58, and chuck table 58 can rotate, and utilizes not shown travel mechanism to move at wafer removal position A and between the grinding position B of grinding subassembly 28 along Y direction.
Chuck table 58 has the holding surface 58a formed by the porous members of porous ceramic etc.Be equipped in the corner of chuck table 58 and clamp and fix the clamp (grip unit) 68 of the corner of the rectangular substrate of tilting (bending).
Around chuck table 58, be equipped with bucker 60, this bucker 60 and the leading section of base 4 and the whole region of rearward end are equipped with wrinkle protective cover 62,64.The guidance panel 66 for being inputted grinding condition etc. by the operator of grinding attachment 2 is equipped at the front side of base 4.
With reference to (A) of Fig. 2, show the face side stereogram of the base plate for packaging 11 of csp substrate etc.(B) of Fig. 2 is the rear side stereogram of base plate for packaging 11.Be formed in the front of the substrate 13 of printed base plate or metal frame etc. with many of latticed formation segmentation preset lines 15, each region that divided preset lines 15 marks off forms chip forming portion 17.
Each chip forming portion 17 is formed with multiple electrode.Semiconductor chip 19 is pasted with by DAF (DieAttachFilm: die bonding film) in the rear side of chip forming portion 17.As shown in (C) of Fig. 2, be equipped on the semiconductor chip 19 of the rear side of substrate 13 by resin 21 sealing.Base plate for packaging 11 such as has the size of 500mm × 700mm.
In the grinding attachment 2 of present embodiment, remained potted the 11a side, front of substrate 11, and the resin 21 at the back side is exposed, use Grinding wheel 38 grinding resin 21 by chuck table 58 absorption with rectangular-shaped holding surface 58a, making it thinning is specific thickness.
One of feature of the grinding attachment 2 of present embodiment is, has the cutter assembly 44 being provided with bite 54 in the mode that can rotate.Owing to having cutter assembly 44, therefore use bite 54 Formation Depth on the sealing resin 21 of the back side 11b of base plate for packaging 11 not reach the cutting slot of grinding depth, thus the internal stress of base plate for packaging 11 can be alleviated, correct warpage (bending).
Another of the grinding attachment of present embodiment is characterised in that, is provided with clamp 68 at the corner place of rectangular-shaped chuck table 58.Arrange clamp 68 in chuck table 58, thus clamping has the corner of the rectangular substrate of the base plate for packaging of warpage etc., and adsorb maintenance rectangular substrate by chuck table 58, can implement on sealing resin 21, to form cutting slot to alleviate the cutting process of internal stress.
Below, with reference to Fig. 3 to Fig. 5, the method for grinding of the rectangular substrate of the grinding attachment 2 using above-mentioned execution mode is described.The grinding attachment 2 of present embodiment, especially when being applied in the rectangular substrate with warpage (bending), can play its effect especially.
When base plate for packaging 11 has warpage, before the sealing resin 21 using grinding subassembly 28 grinding base plate for packaging 11, implement the sealing resin 21 cutting base plate for packaging 11, alleviate internal stress and correct the cutting process of warpage.
In this cutting process, as shown in (A) of Fig. 3, chuck table 58 is carried base plate for packaging 11, and use clamp 68 to clamp base plate for packaging 11, thus correct the warpage of base plate for packaging 11, and remained potted the 11a side, front of substrate 11 by the holding surface 58a absorption of chuck table 58, the sealing resin 21 of back side 11b is exposed.
Then, the bite 54 carrying out High Rotation Speed of cutter assembly 44 is made to cut the degree of depth not reaching grinding depth on the sealing resin 21 of base plate for packaging 11, and rely on X-axis travel mechanism 26 to make base plate for packaging 11 process feeding, the sealing resin 21 of base plate for packaging 11 forms cutting slot 23.
Make the travel mechanism of not shown chuck table 58 carry out work, make chuck table 58 carry out index feed with prescribed distance in the Y-axis direction, on the sealing resin 21 of base plate for packaging 11, form multiple cutting slot 23 simultaneously.
When as above defining multiple cutting slot 23 on the sealing resin 21 of base plate for packaging 11, the internal stress of the sealing resin 21 of base plate for packaging 11 is alleviated, the warpage (bending) of recoverable base plate for packaging 11.
About the formation of the cutting slot 23 that the bite 54 of cutter assembly 44 realizes, both can be formed on the long side direction of base plate for packaging 11 as shown in (B) of Fig. 3, or also as shown in (C) of Fig. 3, long side direction and this both direction of short side direction can all form cutting slot 23.
As shown in (C) of Fig. 3, when the sealing resin 21 of base plate for packaging 11 forms multiple cutting slot 23 along long side direction and this both direction of short side direction, the internal stress of sealing resin 21 is alleviated, and more effectively can carry out the correction of the warpage of base plate for packaging 11.
By implementing cutting process, the warpage of recoverable base plate for packaging 11, therefore removing clamp 68, just can remain potted substrate 11 by the absorption holding surface 58a absorption of chuck table 58.
Therefore, as shown in (A) of Fig. 4, the 11a side, front of substrate 11 is remained potted by the absorption of not shown chuck table 58, and be pressed in by the grinding subassembly 38 rotated up in arrow b side on the sealing resin 21 of the back side 11b of base plate for packaging 11, can implement sealing resin 21 grinding is the grinding process of specific thickness.
(C) with reference to (B) ~ Fig. 5 of Fig. 4 illustrates this grinding process.In addition, the chuck table 58 that absorption remains potted substrate 11 is eliminated in these figures.
With reference to (B) of Fig. 4, show the schematic plan view of the method for grinding of expression the 1st execution mode.In the method for grinding of the 1st execution mode, the chuck table 58 remaining potted substrate 11 is such as rotated with 300rpm on the direction shown in arrow a, and Grinding wheel 38 is such as rotated with 6000rpm on the direction shown in arrow b, drive grinding subassembly feed mechanism 16 simultaneously, make the grinding grinding stone 42 of Grinding wheel 38 contact the sealing resin 21 of the back side 11b of base plate for packaging 11.
And the travel mechanism by means of chuck table 58 makes base plate for packaging 11 swing (reciprocating) in the Y-axis direction, the sealing resin 21 of the base plate for packaging of grinding simultaneously 11.Swing in the Y-axis direction owing to making base plate for packaging 11 and carry out grinding, thus can by the whole front of the sealing resin 21 of the back side 11b of the less Grinding wheel 38 grinding base plate for packaging 11 of diameter.
With reference to (A) of Fig. 5, show the schematic plan view of the method for grinding representing second embodiment of the present invention.In the method for grinding of present embodiment, the grinding grinding stone 42 of Grinding wheel 38 is positioned through the pivot of the base plate for packaging 11 be held in chuck table 58, chuck table 58 is such as rotated with 300rpm, and Grinding wheel 38 is such as rotated, the central portion of the back side 11b of grinding base plate for packaging 11 with 6000rpm.
After central portion grinding, even if the pivot chuck table 58 making Grinding wheel 38 leave base plate for packaging 11 by means of the travel mechanism of chuck table 58 moves up in arrow Y1 side, the whole front, the back side of the base plate for packaging of grinding simultaneously 11.Grinding area is represented with 11c in (A) of Fig. 5.
With reference to (B) of Fig. 5, show the schematic plan view of the method for grinding representing third embodiment of the present invention.In the method for grinding of present embodiment, Grinding wheel 38 is positioned in the most peripheral part of the base plate for packaging 11 kept in chuck table 58 by the travel mechanism by means of chuck table 58, chuck table 58 is such as rotated with 300rpm on arrow a direction, and Grinding wheel 38 is such as rotated on arrow b direction, the most peripheral of the back side 11b of grinding base plate for packaging 11 with 6000rpm.
Then, even if make chuck table 58 move up Grinding wheel 38 towards pivot relative movement from the most peripheral of base plate for packaging 11 in arrow Y2 side, the whole front of the back side 11b of grinding base plate for packaging 11.Grinding area is represented with 11c in (B) of Fig. 5.
With reference to (C) of Fig. 5, show the schematic plan view of the method for grinding representing fourth embodiment of the present invention.In the method for grinding of present embodiment, by means of the travel mechanism of chuck table 58 and the X-axis travel mechanism 26 of grinding subassembly 28, Grinding wheel 38 is positioned along on the end of a sidepiece of the base plate for packaging 11 be held in chuck table 58, make Grinding wheel 38 such as rotate with 6000rpm on arrow b direction when not making chuck table 58 rotate, and chuck table 58 is moved up, the sealing resin 21 of the back side 11b of grinding base plate for packaging 11 in arrow Y2 side.Then, make grinding subassembly 28 index feed in the X-axis direction by means of X-axis travel mechanism 26, similarly the non-grinding area of the back side 11b of grinding base plate for packaging 11.
In the respective embodiments described above, describe the example be used for by method for grinding of the present invention in rectangular-shaped base plate for packaging 11, but be ground thing and be not limited thereto, method for grinding of the present invention not only can be used for the large-scale base plate for packaging with warpage, also can be used in the large-scale front of rectangular-shaped substrate or the purposes at the back side that grinding has warpage equally.
Claims (5)
1. a grinding attachment, it carries out grinding to the front of rectangular substrate or the back side,
The feature of this grinding attachment is to have:
Chuck table, it has holding surface, and the absorption of this holding surface keeps rectangular substrate;
Grinding unit, it supports Grinding wheel in the mode that can rotate, and this Grinding wheel carries out grinding to the rectangular substrate be held in this chuck table;
Grinding and feeding unit, it carries out grinding and feeding to this grinding unit in the vertical direction vertical with the holding surface of this chuck table;
Y-axis shift moving cell, it makes this chuck table and this grinding unit relatively move in the Y-axis direction between dismounting region and grinding area, wherein, this dismounting region is the region of rectangular substrate being carried out to dismounting, and this grinding area is the region of rectangular substrate being carried out to grinding; And
X-axis mobile unit, it makes this chuck table and this grinding unit relatively move in the X-direction orthogonal with Y direction,
This Grinding wheel comprises wheel pedestal and grinding grinding stone, and this grinding grinding stone is located at cyclic ligand the lower surface peripheral part that this takes turns pedestal,
The external diameter of the grinding grinding stone that should arrange with ring-type is set to be less than the minor face of rectangular substrate.
2. grinding attachment according to claim 1, wherein,
This chuck table is equipped with grip unit, and this grip unit clamps the rectangular substrate be held in this chuck table.
3. grinding attachment according to claim 1 and 2, wherein,
This grinding attachment also has cutting unit, and this cutting unit is provided with bite in the mode that can rotate, and this bite cuts the rectangular substrate be held in this chuck table.
4. a method for grinding for rectangular substrate, use the grinding attachment described in claim 3 to carry out grinding to rectangular substrate, the feature of this method for grinding is to have:
Cutting process, uses this bite of this cutting unit not reach the cutting slot of grinding depth being held in Formation Depth in the rectangular substrate in this chuck table, alleviates the internal stress of rectangular substrate; And
Grinding process, after implementing this cutting process, carries out grinding to the rectangular substrate be held in this chuck table.
5. method for grinding according to claim 4, wherein,
When using this bite Formation Depth of this cutting unit not reach the cutting slot of grinding depth, utilizing this grip unit to clamp rectangular substrate, after formation cutting slot, removing this grip unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-110056 | 2014-05-28 | ||
| JP2014110056A JP2015223667A (en) | 2014-05-28 | 2014-05-28 | Griding device and grinding method for rectangular substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105280488A true CN105280488A (en) | 2016-01-27 |
Family
ID=54840840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510282208.1A Pending CN105280488A (en) | 2014-05-28 | 2015-05-28 | Grinding apparatus and method for grinding rectangular substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015223667A (en) |
| KR (1) | KR20150136993A (en) |
| CN (1) | CN105280488A (en) |
| TW (1) | TW201544244A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589540A (en) * | 2019-10-02 | 2021-04-02 | 株式会社迪思科 | Method for grinding plate-like workpiece |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101971059B1 (en) * | 2016-05-26 | 2019-04-23 | 주식회사 케이엔제이 | Semiconductor package sliming apparatus and method of the same |
| JP6858543B2 (en) * | 2016-12-13 | 2021-04-14 | 株式会社ディスコ | Method of forming a holding surface of a holding table |
| JP2019080024A (en) * | 2017-10-27 | 2019-05-23 | 株式会社ディスコ | Processing method of workpiece |
| KR101831137B1 (en) * | 2018-01-19 | 2018-02-26 | 장범식 | The gate valve processing method for semiconductor equipment |
| JP2023102923A (en) | 2022-01-13 | 2023-07-26 | 株式会社ディスコ | Grinding device |
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| JPH09290357A (en) * | 1996-04-25 | 1997-11-11 | Yotaro Hatamura | Method and device for grinding plate-shaped material |
| CN1655327A (en) * | 2004-02-09 | 2005-08-17 | 株式会社迪斯科 | Method for cutting wafer |
| CN101615589A (en) * | 2008-06-26 | 2009-12-30 | 富士通株式会社 | The manufacture method of semiconductor device, the manufacturing equipment of semiconductor device and pin |
| CN102458766A (en) * | 2009-06-04 | 2012-05-16 | 旭硝子株式会社 | Method for grinding plate-like body |
| JP2014027000A (en) * | 2012-07-24 | 2014-02-06 | Disco Abrasive Syst Ltd | Grinding device |
| CN103579105A (en) * | 2012-07-25 | 2014-02-12 | 株式会社迪思科 | Package substrate processing method |
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2014
- 2014-05-28 JP JP2014110056A patent/JP2015223667A/en active Pending
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2015
- 2015-04-15 TW TW104112093A patent/TW201544244A/en unknown
- 2015-04-30 KR KR1020150061468A patent/KR20150136993A/en unknown
- 2015-05-28 CN CN201510282208.1A patent/CN105280488A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09290357A (en) * | 1996-04-25 | 1997-11-11 | Yotaro Hatamura | Method and device for grinding plate-shaped material |
| CN1655327A (en) * | 2004-02-09 | 2005-08-17 | 株式会社迪斯科 | Method for cutting wafer |
| CN101615589A (en) * | 2008-06-26 | 2009-12-30 | 富士通株式会社 | The manufacture method of semiconductor device, the manufacturing equipment of semiconductor device and pin |
| CN102458766A (en) * | 2009-06-04 | 2012-05-16 | 旭硝子株式会社 | Method for grinding plate-like body |
| JP2014027000A (en) * | 2012-07-24 | 2014-02-06 | Disco Abrasive Syst Ltd | Grinding device |
| CN103579105A (en) * | 2012-07-25 | 2014-02-12 | 株式会社迪思科 | Package substrate processing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589540A (en) * | 2019-10-02 | 2021-04-02 | 株式会社迪思科 | Method for grinding plate-like workpiece |
| CN112589540B (en) * | 2019-10-02 | 2024-02-23 | 株式会社迪思科 | Grinding method for plate-shaped workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150136993A (en) | 2015-12-08 |
| JP2015223667A (en) | 2015-12-14 |
| TW201544244A (en) | 2015-12-01 |
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