CN105196162B - Carrying device - Google Patents

Carrying device Download PDF

Info

Publication number
CN105196162B
CN105196162B CN201510297363.0A CN201510297363A CN105196162B CN 105196162 B CN105196162 B CN 105196162B CN 201510297363 A CN201510297363 A CN 201510297363A CN 105196162 B CN105196162 B CN 105196162B
Authority
CN
China
Prior art keywords
machined
chip
press
chuck
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510297363.0A
Other languages
Chinese (zh)
Other versions
CN105196162A (en
Inventor
凑浩吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014-124362 priority Critical
Priority to JP2014124362A priority patent/JP6335672B2/en
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN105196162A publication Critical patent/CN105196162A/en
Application granted granted Critical
Publication of CN105196162B publication Critical patent/CN105196162B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • B24B37/345Feeding, loading or unloading work specially adapted to lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Abstract

The present invention provides a kind of carrying device, which includes holding unit, keeps machined object;Mobile unit moves holding unit between temporary placement table and chuck table and moves in vertical direction;And support portion, holding unit is supported from the ends sag of mobile unit.Holding unit includes: discoid support member, is fixed on support portion;And cyclic annular pressing pad, it is disposed in the periphery lower surface of discoid support member, cyclic annular pressing pad includes press section, is formed as cyclic annular by elastomeric element, presses the outer region of machined object;And the dip portion of cone cell, be formed as cyclic annular by elastomeric element, be disposed in the circumferential lateral surface of press section, extend downward from press section, with downward and towards radial outside extension and thickness it is thinning.

Description

Carrying device
Technical field
The present invention relates to carrying device, the plate machined object with warpage is transported to chucking work by the carrying device Platform, and the machined object attracting holding can be made in chuck table.
Background technique
In the manufacturing process of semiconductor devices or optical device, the shape on the front of semiconductor wafer or optical device wafer At the segmentation preset lines of a plurality of clathrate for being known as spacing track, it is formed on each region divided by segmentation preset lines and partly leads Body device, optical device.
Be ground the back side of these chips and after thickness as defined in being thinned to, along segmentation preset lines using cutting apparatus or Person's laser processing device etc. is split, to produce semiconductor devices, optical device one by one.
When implementing grinding to the plates machined object such as semiconductor wafer or optical device wafer, grinding attachment is utilized Chuck table slides grinding tool while abutting with the back side of chip via the face side of protection band attracting holding chip It is dynamic, grinding and feeding is carried out thereby executing grinding to Grinding wheel.
Also, when implementing Tool in Cutting processing to plate machined object, rotate cutter tool along circuit orbit Meanwhile processing feeding is carried out to the chuck table that remain plate machined object with defined processing feed speed, thus lead to Cutter tool is crossed to carry out rotary cutting to the surface for the plate machined object being maintained on chuck table and make its planarization.
But plate machined object has warpage sometimes, for example, sometimes in WL-CSP (Wafer Level-Chip Size Package: wafer scale sized package) chip etc. is laminated in the chip of unlike material has biggish warpage.Also, major diameter Chip sometimes also have biggish warpage.
When chip significantly warpage, create the problem that since the retaining surface of chuck table is flat, it can not benefit With chuck table attracting holding chip.In the case where the outer region warpage upwards of chip, the outer region of chip is floating It rises, negative pressure leakage occurs and leads to not keep chip using chuck table.In Japanese Unexamined Patent Publication 2005-109057 bulletin and Disclosing in Japanese Unexamined Patent Publication 2006-019566 bulletin being capable of removing using the chip of this warpage of chuck table attracting holding Send device.
The absorption hand for the carrying device recorded in bulletin disclosed above includes absorption layer, only adsorbs the central portion of chip Point;Plate covers the top of chip;Or pin, it is corresponding with the outer region of chip.
In these absorption hands, the chip for being transported to chuck table is pressed into the guarantor of chuck table using plate or pin Face is held, to correct the warpage of chip, wafer suction is made to be held in chuck table.
Existing patent document
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2005-109057 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2006-019566 bulletin
Summary of the invention
However, script carrying device is not used to for chip to be pressed into the device of chuck table, it is larger in order to obtain Pressing force and the motor for being used to that carrying device to be made to move up and down must be changed to powerful device.
Also, in this antidote, there are the following problems: because of the generation when chip to be pressed on chuck table Counter-force and cause the track for being equipped with carrying device or keep track frame be deformed.
In mass-production process, when being iteratively produced this deformation in a device, it is possible to failure can be generated, needed pair Deformed part is reinforced.When replacing to cope with above such problems or when the component of bracing means, can generate into This increase such problems.
The present invention is completed in view of such point, and its purpose is to provide a kind of carrying devices, in conveying perimeter region Domain the plate machined object of warpage and makes its attracting holding when chuck table upwards, not bracing means motor or remove In the case where sending mechanism, the chip of outer region warpage upwards can be corrected as flat state, and can be normally Attracting holding is in chuck table.
According to the present invention, a kind of carrying device is provided, by machined object from the interim of the interim machined object for placing plate Work platform for placing is transported to the chuck table with retaining surface, even if for the quilt of peripheral part nearby than center warpage upwards Machining object also can carry out attracting holding using chuck table, and the carrying device is characterized in that, it is single to include holding Member keeps machined object;Mobile unit makes the holding unit between the temporary placement table and the chuck table It moves and also moves in vertical direction;And support portion, from the ends sag of the mobile unit and support the holding list Member, the holding unit include: discoid support member, are fixed on the support portion;Rod unit, it is discoid that one end penetrates through this The central part of support member and the end that can be movably inserted in the support portion;Absorption layer is fixed on the rod unit The other end, and there is adsorption plane;Helical spring is mounted between the absorption layer and the discoid support member, to absorption layer It exerts a force downwards;And cyclic annular pressing pad, it is disposed in the periphery lower surface of the discoid support member, the ring-type pressing pad Press section is included, is formed as cyclic annular by elastomeric element, there is the outer diameter for being greater than machined object and be less than the interior of machined object Diameter, and press the outer region of machined object;And the dip portion of cone cell, be formed as cyclic annular by elastomeric element, be disposed in this The circumferential lateral surface of press section extends downward from the press section, with downward and towards radial outside extension and thick Spend thinning, which can move between prominent position and reception position, and the prominent position is the adsorption plane than should be by Splenium position outstanding downwards, the reception position are the adsorption planes unlike press section position outstanding downwards.
Invention effect
Carrying device according to the present invention, after conveying plate machined object is placed on the retaining surface of chuck table, Further make holding unit decline and utilize pressing pad press section pressing machined object outer region when, dip portion with The outer peripheral portion of the retaining surface of chuck table contacts and presses the press section of the outer region of machined object, dip portion, chuck The retaining surface and machined object area defined of workbench, form closed area, are processed being attracted using chuck table When object, closed area becomes negative pressure and is adjacent to the machined object of warpage and the retaining surface of chuck table, being capable of attracting holding Machined object with warpage.
Detailed description of the invention
Fig. 1 is the perspective view with the grinding attachment of carrying device of the invention.
Fig. 2 is the perspective view shown the case where pasting protection band on the front of semiconductor wafer.
Fig. 3 is the sectional view of the state of the chip of chuck table attracting holding warpage to be utilized.
Fig. 4 is the sectional view (one) being illustrated to the effect of the carrying device of embodiment of the present invention.
Fig. 5 be the effect of carrying device is illustrated sectional view (secondly).
Fig. 6 be the effect of carrying device is illustrated sectional view (thirdly).
Label declaration
10: thick grinding unit;11: semiconductor wafer;30: fine ginding unit;48: turntable;50: chuck table;66: facing When work platform for placing;70: carrying device;80: holding unit;82: column;84: arm;86: support portion;88: discoid support portion Part;90: rod unit;92: absorption layer;96: cyclic annular pressing pad;98: press section;100: dip portion;102: closed area.
Specific embodiment
Hereinafter, referring to attached drawing, the embodiment of the present invention will be described in detail.Referring to Fig.1, Fig. 1 is shown with this hair The stereoscopic figure of the grinding attachment 2 of the carrying device of bright embodiment.Label 4 is the pedestal of grinding attachment, after pedestal 4 Column 6a, 6b there are two being just vertically arranged.
The a pair of guide rails 8 vertically extended is fixed on column 6a.Thick grinding unit 10 is installed to be being capable of edge This pair of guide rails 8 move in the up-down direction.The shell 20 of thick grinding unit 10 is installed in along a pair of guide rails 8 upper and lower The movable drill base 12 moved on direction.
Thick grinding unit 10 includes: shell 20;Axis 22 can rotatably be stored within the casing 20;Servo motor is received It receives within the casing 20, for rotating drive shaft 22;Wheel assembly device 24, is fixed on the tip of the axis;And Grinding wheel 26, tool There are multiple grinding tools roughly ground and cut, the grinding tool is detachably fixed on wheel assembly device 24.
Thick grinding unit 10 has thick grinding unit feed mechanism 18, and the thick grinding unit feed mechanism 18 is roughly ground by making The ball-screw 14 that unit 10 moves in the up-down direction along a pair of guide rails 8 is cut to constitute with pulse motor 16.When to pulse electricity When machine 16 is driven, ball-screw 14 rotates and moves movable drill base 12 along the vertical direction.
The a pair of guide rails 28 vertically extended is also fixed on another column 6b.Fine ginding unit 30 is installed to be It can be moved in the up-down direction along this pair of guide rails 28.
The shell 40 of fine ginding unit 30 is installed in the movable drill base moved in the up-down direction along a pair of guide rails 28 32.Fine ginding unit 30 includes: shell 40;Axis 42 can be rotatably accommodated in shell 40;Servo motor is accommodated in In shell 40, for rotating drive shaft 42;Wheel assembly device 44, is fixed on the end of axis 42;And Grinding wheel 46, have The grinding tool of fine ginding, the grinding tool are detachably fixed on wheel assembly device 44.
Fine ginding unit 30 has fine ginding unit feed mechanism 38, and the fine ginding unit feed mechanism 38 is refined by making The ball-screw 34 that unit 30 moves in the up-down direction along a pair of guide rails 28 is cut to constitute with pulse motor 36.When to pulse electricity When machine 36 is driven, ball-screw 34 rotates and moves fine ginding unit 30 along the vertical direction.
Grinding attachment 2 has turntable 48 in the front side of column 6a, 6b, and the turntable 48 matches the upper surface being set as with pedestal 4 In parallel.Turntable 48 is formed as bigger discoid of diameter, by rotary drive mechanism (not shown) to side shown in arrow 49 To rotation.
Configured with 3 chuck tables 50 for being along the circumferential direction separated by 120 °, the chucking work on turntable 48 Platform 50 can rotate in the horizontal plane.Chuck table 50, which has, is formed as discoid maintaining part by porous ceramic film material, leads to Crossing makes vacuum sucking unit be acted and carry out attracting holding to the chip in the retaining surface for being positioned in maintaining part.
It is suitably rotated by turntable 48,3 chuck tables 50 being disposed on turntable 48 are successively moved to chip and remove Enter to move out region A, corase grinding cuts machining area B, fine ginding machining area C and chip carrying-in/carrying-out region A.
Box mounting region 52 is equipped in the front part of pedestal 4, box mounting region 52 is by being fixed on pedestal 4 2 box microscope carriers 54,56 are constituted.Box 58 of the mounting for the chip before storing grinding, is uploaded in box microscope carrier 56 on box microscope carrier 54 Set the box 60 for storing chip after grinding.
As shown in Fig. 2, on the front of semiconductor wafer (hereinafter, sometimes referred to simply as chip) 11, multiple segmentation preset lines (spacing track) 13 is formed as clathrate, and IC (integrated circuit), LSI are formed on each region divided by segmentation preset lines 13 Devices such as (large scale integrated circuits) 15.The orientation plane 17 for indicating the crystal orientation of chip 11 is formed on chip 11.
In order to which protection is formed in positive device 15 when being ground at the back side for implementing chip 11, glued on the front of chip 11 Front protecting band 19 is posted, chip 11 is accommodated in box 58 in the state of making to be pasted on positive protection band 19 downward.
It is formed with recess portion 62 on the part adjacent with box mounting region 52 of pedestal 4, is equipped with crystalline substance in the recess portion 62 Piece conveying machine people 64.It is adjacent to recess portion 62 and is equipped with temporary placement table 66, the temporary placement table 66 is interim The chip taken out by wafer transfer robot 64 from box 58 is placed, is equipped with shooting unit in the top of temporary placement table 66 68, the shooting unit 68 shoots the chip 11 being positioned on temporary placement table 66.
Label 70 is the carrying device of embodiment of the present invention comprising can move up and down and can borrow by cylinder etc. Help the column 82 of the rotations such as motor, the upper end for being installed on column 82 arm 84, be fixed on arm 84 end support portion 86 with And the holding unit 80 supported by support portion 86.
Carrying device 70 keeps the chip 11 being temporarily placed on temporary placement table 66 using the absorption of holding unit 80, Chip 11 is transported to the chuck table 50 for being positioned at chip carrying-in/carrying-out region A.Carrying device 70 is also from being positioned at chip Absorption keeps the chip of grinding completion and is transported to rotation cleaning unit 72 on the chuck table 50 of carrying-in/carrying-out region A.
The carrying device 70 of embodiment of the present invention is with the structure especially suitable for following situation: by the crystalline substance with warpage Piece 11 is transported to from temporary placement table 66 to be positioned at the chuck table 50 of chip carrying-in/carrying-out region A and carries out attraction guarantor It holds.
The problem of when referring to Fig. 3 to chip 11 using chuck table 50 to keep warpage, is illustrated.Chuck work Make platform 50 with multiple attraction slots 74 in its retaining surface 50a upper opening, each attraction slot 74 is via attraction access 76,78 and does not scheme The attraction source connection shown.
When the chip 11 for connecting the attraction access 76 of chuck table 50 with attraction source and wanting attracting holding that there is warpage When, the partial compromise that negative pressure is not adjacent to the retaining surface 50a of chuck table 50 from chip 11 can not utilize chuck table 50 attracting holding chips 11.
When pressing chip 11 using press unit and keep it flat relative to the retaining surface 50a of chuck table 50, by It will not be leaked from the retaining surface 50a of chuck table 50 in negative pressure, therefore 50 attracting holding chip of chuck table can be utilized 11。
Hereinafter, being described in detail referring to carrying device 70 of the fig. 4 to fig. 6 to embodiment of the present invention.As described above, Carrying device 70 includes: the column 82 installed in a manner of it can move up and down and rotate relative to pedestal 4;It is installed on column 82 Upper end arm 84;The support portion 86 sagging from the terminal part of arm 84;And the holding unit 80 of the support by support portion 86.
As shown in (A) of Fig. 4, holding unit 80 has the discoid support member 88 for the end for being fixed on support portion 86. One end of rod unit 90 penetrates through the central part of discoid support member 88 and can movably be inserted in the end of support portion 86, Absorption layer 92 with adsorption plane 92a is installed on the other end of rod unit 90.In absorption layer 92 and discoid support member The helical spring 94 to exert a force downwards to absorption layer 92 is installed between 86.
Cyclic annular pressing pad 96 is installed in the lower surface of the outer peripheral portion of discoid support member 88.Cyclic annular pressing pad 96 by The dip portion 100 of press section 98 and cone cell is constituted, and the press section 98 is formed as cyclic annular by elastomeric elements such as rubber, is had and is greater than The outer diameter of chip 11 and the internal diameter for being less than chip 11, the dip portion 100 utilize the rubber etc. of the material more soft than press section 98 Elastomeric element is formed as cyclic annular, is disposed in the circumferential lateral surface of press section 98, extends downward from press section 98, the dip portion 100 with downward and towards radial outside extension and thickness it is thinning.
Absorption layer 92 can move between prominent position and reception position, and the prominent position is absorption layer 92 by spiral Spring 94 exert a force and make the position outstanding downwards than press section 98 adsorption plane 92a, the reception position be adsorption plane 92a not Than position shown in press section 98 downwards (B) outstanding such as Fig. 6.
Hereinafter, being illustrated to the effect of carrying device 70.As shown in (A) of Fig. 4, rotate carrying device 70 arm 84 and Holding unit 80 is positioned on the chip 11 of temporary placement table 66.
Then, as shown in (B) of Fig. 4, to the mobile holding unit 80 in lower section shown in arrow Z1, absorption layer 92 is pressed into The central part of chip 11.Since the central part warpage in chip 11 is smaller, temporary placement table 66 is being relieved Absorption after, can using absorption layer 92 absorption keep chip 11.
It is mobile to the direction arrow Y1 as shown in (A) of Fig. 5 in the state of keeping chip 11 using the absorption of absorption layer 92 Holding unit 80, that is, cursor 84 and the chip 11 for being held in absorption layer 92 is transported to and is positioned at chip carrying-in/carrying-out region A Chuck table 50 on.Then, as shown in (B) of Fig. 5, to the mobile holding unit 80 in lower section shown in arrow Z1 by chip 11 are positioned on chuck table 50.
When further moving holding unit 80 downwards, as shown in (A) of Fig. 6, while helical spring 94 shortens, The upper end of rod unit 90 enters in support portion 86.At the same time, due to the press section 98 of cyclic annular pressing pad 96 and chip 11 Peripheral part abuts, and cyclic annular dip portion 100 is abutted with the peripheral part of the retaining surface 50a of chuck table 50, therefore, cyclic annular sagging Closed area 102 is formd between portion 100, press section 98, chip 11 and the retaining surface 50a of chuck table 50.
When in this state, by chuck table 50 connect with attraction source and as shown by arrow A to attracting access 76 to carry out When attraction, suction function makes to become negative pressure (negative pressure) in closed area 102 in attraction slot 74.Therefore, When pressing holding unit 80 along the direction arrow Z1, as shown in (B) of Fig. 6, due to also can be sharp with not too much big pressing force It is flat for pressing the peripheral part of chip 11 with press section 98 and correcting chip 11, even therefore the chip 11 with warpage Also attracting holding can be carried out using chuck table 50.
When increase arm 84, due to the retaining surface of chip 11 and chuck table 50 50a is adjacent to, therefore is able to maintain that the state using 50 attracting holding chip 11 of chuck table.
After in this way using 50 attracting holding of chuck table chip 11, turntable 48 is made to rotate 120 ° and determine chip 11 Machining area B is cut positioned at corase grinding, is cut using the corase grinding that thick grinding unit 10 implements chip 11.After implementing corase grinding and cutting, it will turn Disk 48 further rotates 120 ° and chip 11 is positioned at fine ginding machining area C, implements chip 11 using fine ginding unit 30 Fine ginding.
After implementing fine ginding, turntable 48 is further rotated 120 ° and the chuck table 50 of chip 11 will be remain It is positioned at chip carrying-in/carrying-out region A.Then, it rotates the arm 84 of carrying device 70 and holding unit 80 is located in chip 11 On, then decline holding unit 80, contacts the adsorption plane 92a of absorption layer 92 with chip 11.
After the attracting holding for releasing chuck table 50, chip 11 is adsorbed using absorption layer 92, rotation carrying device 70 Arm 84 and chip 11 after grinding is transported to rotation cleaning unit 72, chip 11 is rotated using rotation cleaning unit 72 Cleaning and rotary drying.
In the above-described embodiment, the example that carrying device 70 is applied to the chip 11 with warpage is said It is bright, but the chip 11 of warpage can certainly not transported.In addition, and be not only the conveying of chip, also can be same Carrying device of the invention is applied to the conveying of other plate machined objects such as WL-CSP chip by ground.
In the above description, the example that carrying device 70 of the invention is applied to grinding attachment is illustrated, But the invention is not restricted to this, can also be equally applicable to the chucking work with the plates machined object such as attracting holding chip The processing unit (plant)s such as cutting apparatus, grinding device, Tool in Cutting device, the laser processing device of platform.

Claims (1)

1. machined object is transported to by a kind of carrying device from the temporary placement table of the interim machined object for placing plate Chuck table with retaining surface, even if for the machined object of peripheral part nearby than center warpage upwards, it also being capable of benefit Attracting holding is carried out with chuck table, the carrying device is characterized in that,
It is included
Holding unit keeps machined object;
Mobile unit makes the holding unit move between the temporary placement table and the chuck table and also hang down Histogram moves up;And
Support portion from the ends sag of the mobile unit and supports the holding unit,
The holding unit includes: discoid support member, is fixed on the support portion;
Rod unit, one end penetrate through the central part of the discoid support member and can movably be inserted in the end of the support portion End;
Absorption layer is fixed on the other end of the rod unit, and has adsorption plane;
Helical spring, is mounted between the absorption layer and the discoid support member, exerts a force downwards to absorption layer;And
Cyclic annular pressing pad is disposed in the periphery lower surface of the discoid support member,
The ring-type pressing pad includes press section, is formed as cyclic annular by elastomeric element, have greater than the outer diameter of machined object with it is small In the internal diameter of machined object, and press the outer region of machined object;And
The dip portion of cone cell is formed as cyclic annular by elastomeric element, the circumferential lateral surface of the press section is disposed in, from the press section court Extend downward, with downward and towards radial outside extension and thickness it is thinning,
The absorption layer can move between prominent position and reception position, and the prominent position is the adsorption plane than the press section Position outstanding downwards, the reception position are the adsorption planes unlike press section position outstanding downwards.
CN201510297363.0A 2014-06-17 2015-06-03 Carrying device Active CN105196162B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014-124362 2014-06-17
JP2014124362A JP6335672B2 (en) 2014-06-17 2014-06-17 Transport device

Publications (2)

Publication Number Publication Date
CN105196162A CN105196162A (en) 2015-12-30
CN105196162B true CN105196162B (en) 2019-03-08

Family

ID=54944289

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510297363.0A Active CN105196162B (en) 2014-06-17 2015-06-03 Carrying device

Country Status (4)

Country Link
JP (1) JP6335672B2 (en)
KR (1) KR102214368B1 (en)
CN (1) CN105196162B (en)
TW (1) TWI649157B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6761271B2 (en) * 2016-04-05 2020-09-23 キヤノン株式会社 Processing equipment and manufacturing method of articles
JP6696851B2 (en) * 2016-07-13 2020-05-20 株式会社ディスコ Chuck table mechanism
JP6855217B2 (en) * 2016-11-04 2021-04-07 株式会社東京精密 Wafer transfer holding device
CN108615697B (en) * 2016-12-09 2020-11-03 矽电半导体设备(深圳)股份有限公司 Automatic chip loading and unloading device
JP2018126830A (en) * 2017-02-09 2018-08-16 株式会社ディスコ Processing system
TWI647782B (en) * 2018-05-16 2019-01-11 力成科技股份有限公司 Vacuum positioning device for fan-out wafer- panel level packaging

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117758A (en) * 2009-11-27 2011-07-06 株式会社迪思科 Transfer mechanism
CN102456600A (en) * 2010-10-18 2012-05-16 株式会社迪思科 Wafer transfer mechanism

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100396454C (en) * 2003-01-29 2008-06-25 三星钻石工业股份有限公司 Vacuum suction head
JP2005109057A (en) 2003-09-30 2005-04-21 Okamoto Machine Tool Works Ltd Substrate carrying instrument
JP2006019566A (en) 2004-07-02 2006-01-19 Toshiba Corp Semiconductor substrate adsorption hand and its operation method
JP5180557B2 (en) * 2007-10-31 2013-04-10 株式会社ディスコ Processing equipment
JP2010153419A (en) * 2008-12-24 2010-07-08 Ushio Inc Workpiece stage and exposure apparatus using the workpiece stage
JP5368200B2 (en) * 2009-07-15 2013-12-18 株式会社ディスコ Processing equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102117758A (en) * 2009-11-27 2011-07-06 株式会社迪思科 Transfer mechanism
CN102456600A (en) * 2010-10-18 2012-05-16 株式会社迪思科 Wafer transfer mechanism

Also Published As

Publication number Publication date
CN105196162A (en) 2015-12-30
KR20150144713A (en) 2015-12-28
TWI649157B (en) 2019-02-01
TW201603947A (en) 2016-02-01
JP2016004909A (en) 2016-01-12
KR102214368B1 (en) 2021-02-08
JP6335672B2 (en) 2018-05-30

Similar Documents

Publication Publication Date Title
CN105196162B (en) Carrying device
KR100709457B1 (en) Semiconductor wafer grinding method
JP2011135026A (en) Holding method and holding mechanism for work unit
KR102185238B1 (en) Grinding apparatus and method for grinding rectangular substrate
JP2010186971A (en) Wafer processing method
KR20160021030A (en) Conveyance device
KR20150136993A (en) Grinding apparatus and method for grinding rectangular substrate
JP2013128070A (en) Wafer grinding method and wafer grinding apparatus
JP2017152442A (en) Processing method
JP6312463B2 (en) Processing equipment
CN105374708A (en) Breaking device
KR20080041094A (en) Loader for hole cutting machine
JP5520729B2 (en) Loading device
JP2012146889A (en) Method for grinding wafer
JP6305245B2 (en) Chuck table
JP2018111159A (en) Chuck table and grinding device
JP6730879B2 (en) Peeling method and peeling device
JP6300683B2 (en) Processing equipment
JP5005904B2 (en) Transfer device and transfer method
TW201600244A (en) Grinding apparatus and method for grinding rectangular substrate
JP6879807B2 (en) Processing equipment
JP6025325B2 (en) Wafer grinding method
KR20150136995A (en) Grinding apparatus
CN108074849A (en) Carrying device, processing unit (plant) and transport method
JP2012124420A (en) Expanding device

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant