CN102856215A - Column set-up device and method of ceramic column grid array device - Google Patents
Column set-up device and method of ceramic column grid array device Download PDFInfo
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- CN102856215A CN102856215A CN2012102643533A CN201210264353A CN102856215A CN 102856215 A CN102856215 A CN 102856215A CN 2012102643533 A CN2012102643533 A CN 2012102643533A CN 201210264353 A CN201210264353 A CN 201210264353A CN 102856215 A CN102856215 A CN 102856215A
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Abstract
The invention relates to a column set-up device and method of a ceramic column grid array device and belongs to the packaging technology of ceramic electronic devices. The device comprises a base, a weld column leveling mechanism, a welding column positioning mechanism, a ceramic housing positioning mechanism and an upper cover successively from bottom to top, wherein the welding column leveling mechanism, the welding column positioning mechanism, the ceramic housing positioning mechanism and the upper cover are fixedly connected by screws, and the base and the weld column leveling mechanism are fixedly connected by a screw; and after connection, column set-up holes of the ceramic housing positioning mechanism and the welding column positioning mechanism are all located at a hollow position of the upper cover. The ceramic column grid array device prepared by the method provided by the invention has good welding column position degree and coplanarity.
Description
Technical field
What the present invention relates to a kind of Ceramic column grid array components and parts plants column device and method, belongs to ceramic electronic component encapsulation technology field.
Background technology
The develop rapidly of modern integrated circuits technology, the miniaturization of integrated circuit, high speed and high reliability request electronic devices and components impel new encapsulation technology also constantly to occur and development to miniaturization and integrated transformation simultaneously thereupon.BGA Package is widely used in different field as the main packing forms of current large scale integrated circuit.Ceramic ball grid array package has advantages of that as a kind of packing forms of BGA Package electric heating property is good, air-tightness is strong, anti humility performance good and reliability is high.The Ceramic column grid array encapsulation is development and the improvement of ceramic ball grid array package, replace ball bar with the post grid, greatly link between aluminium oxide ceramics shell and the glass epoxy printed board because the thermal fatigue problem of bringing is not mated in thermal expansion system, thereby improved the reliability of assembling.The Ceramic column grid array encapsulation can realize a lot of logics and microprocessor function, and its packing forms determines its characteristic high temperature resistant, high pressure resistant and high reliability, is applicable to the situation of large scale and many I/O.Therefore occupy an important position in electronic product manufacturing field.With respect to ball grid array, the diameter of column gate array is little, highly high, difficult fixing, so that there is difficulty in the technology of Ceramic column grid array encapsulation.And the coplanarity of welding column and position degree are two main performance assessment criteria of planting the post processing quality, and it is directly connected to the q﹠r of Ceramic column grid array device Surface Mount technique.Can develop a kind of high-precision ceramic column gate array components and parts and plant column device and method, guarantee position degree and the coplanarity of welding column, be one of great bottleneck of using in China electronic product manufacturing field of restriction Ceramic column grid array components and parts.
Summary of the invention
The objective of the invention is to plant column device and method for what propose a kind of Ceramic column grid array components and parts, this device and method can be so that the welding column of Ceramic column grid array components and parts has good position degree and coplanarity, and effectively controlled the voidage at solder joint place, guaranteed the quality of Surface Mount technique when the Ceramic column grid array components and parts are assembled into the plate level, easy and simple to handle.
The objective of the invention is to be achieved through the following technical solutions.
The present invention proposes a kind of column device of planting of Ceramic column grid array components and parts, this device comprises base, welding column leveling mechanism, welding column detent mechanism, ceramic package detent mechanism and loam cake from the bottom up successively;
With the flat board of boss, the height of boss determines according to the thickness of welding column leveling centered by the base;
Welding column leveling mechanism is the flat board of hollow; A dull and stereotyped side is cutting edge, and namely the thickness of this limit from the edge to the center diminishes gradually; The hollow part of welding column leveling mechanism and the boss of base are complementary;
The welding column detent mechanism is a flat board, is that the web plate by the several piece same thickness combines.The post hole is planted with what adapt with welding column diameter to be welded in its center;
The ceramic package detent mechanism is the flat board of hollow, and each side of ceramic package detent mechanism is respectively with a limiting stand, and space and the ceramic package of four limiting stand compositions are complementary; Hollow space between per two limiting stands is used for the volatilization of reflow process scaling powder and the conduction of heat;
Loam cake is the flat board of hollow, is used for being connected with welding column leveling mechanism and by screw welding column detent mechanism and ceramic package detent mechanism being combined;
Welding column leveling mechanism, welding column detent mechanism, ceramic package detent mechanism are connected connection with loam cake, and base is screwed with welding column leveling mechanism and is connected; After the connection, ceramic package detent mechanism and welding column detent mechanism plant the hollow part that the post hole all is positioned at loam cake.
The present invention proposes a kind of column method of planting of Ceramic column grid array components and parts, steps of the method are:
1) welding column leveling mechanism, welding column detent mechanism, ceramic package detent mechanism are connected connection with loam cake, and then with screw base are fixedly connected with welding column leveling mechanism;
2) welding column to be welded is placed on planting in the post hole of welding column detent mechanism according to the requirement that the ceramic package pad distributes, and passes and plant the post hole to the boss of base;
3) printed solder paste on the pad of ceramic package is positioned over ceramic package on the welding column, solder(ing) paste is fully contacted with welding column to be welded, and by the limiting stand on the ceramic package detent mechanism ceramic package is positioned;
The column device of planting that 4) will be placed with ceramic package is put in the Reflow Soldering of carrying out solder joint in the reflow ovens, after planting the column device cooling, base is taken off, with the cutting edge of cutting tools by welding column leveling mechanism planarizing process is carried out on the welding column surface, the ceramic package that will plant at last welding column is that components and parts take out from plant column device.
Beneficial effect
The present invention defines the position of welding column accurately by the welding column detent mechanism, so that the Ceramic column grid array components and parts are planted behind the post position degree of welding column is good;
The present invention effectively sheds the gas that scaling powder in the reflow process produces by the hollow part between the ceramic package detent mechanism positive stop lug boss, and heat is effectively conducted, so that the voidage at solder joint place is controlled after the Reflow Soldering;
The present invention by welding column leveling mechanism and in conjunction with cutting tools so that the Ceramic column grid array components and parts are planted the surfacing of welding column behind the post, the coplanarity on welding column surface is better;
The present invention is connected welding column leveling mechanism, welding column detent mechanism, ceramic package detent mechanism and is screwed connection with loam cake, and then base is screwed with welding column leveling mechanism is connected, and makes things convenient for the dismounting of base;
Welding column detent mechanism among the present invention and ceramic package detent mechanism are to be that the web plate of 0.1～0.6mm combines by using laser to carry out precision machined thickness; Because its machining accuracy is higher, the precision that use polylith web plate is combined rear single unit system is also higher, satisfies the Ceramic column grid array components and parts are planted the post precision to welding column requirement.
Description of drawings
Fig. 1 is structural representation of planting column device of the present invention;
Fig. 2 is the structural representation of base;
Fig. 3 is the structural representation of welding column leveling mechanism;
Fig. 4 is the structural representation of welding column detent mechanism;
Fig. 5 is the structural representation of ceramic package detent mechanism;
Fig. 6 is the structural representation of loam cake;
Wherein, 1-base, 2-welding column leveling mechanism, 3-welding column detent mechanism, 4-ceramic package detent mechanism, 5-loam cake.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Require:
The LGA560 ceramic package is planted post technique, and the ceramic package pad size is Φ 0.89mm, and pitch is 1.27mm; Welding column is of a size of Φ 0.89mm, highly is 2.2mm.
Implementation step:
A kind of CCGA560 of being applicable to Ceramic column grid array components and parts plant column device, this device comprises base 1, welding column leveling mechanism 2, welding column detent mechanism 3, ceramic package detent mechanism 4 and loam cake 5 from the bottom up successively, as shown in Figure 1;
With the flat board of boss, this flat board is of a size of centered by the base 1: 85mm * 85mm * 3mm, boss are 60mm * 60mm * 2mm, as shown in Figure 2;
Welding column leveling mechanism 2 is the flat board of hollow, and this flat board is of a size of: 85mm * 85mm * 3mm, and the part of hollow is of a size of 60mm * 60mm, as shown in Figure 3; A side of welding column leveling mechanism 2 is cutting edge, and namely the thickness of this limit from the edge to the center diminishes gradually, and gradient is less than 10 °.The hollow part of welding column leveling mechanism 2 and the boss of base 1 are complementary.As shown in Figure 3;
Welding column detent mechanism 3 is dull and stereotyped, and this flat board is of a size of: 85mm * 85mm * 3mm.Its center is with planting the post hole; Be that the web plate of 0.5mm precise laser processing combines by 5 thickness, the diameter of planting the post hole is 0.65～0.75mm, and pitch is 1.27mm.As shown in Figure 4;
Ceramic package detent mechanism 4 is the flat board of hollow, and this flat board is of a size of: 85mm * 85mm * 3mm.Each side of ceramic package detent mechanism 4 each with a limiting stand, the spacing 20mm * 2mm that is of a size of; Space and the ceramic package of four limiting stand compositions are complementary; Hollow space between per two limiting stands is used for the diffusion of gas or heat.As shown in Figure 5;
Welding column leveling mechanism 2, welding column detent mechanism 3, ceramic package detent mechanism 4 are connected with loam cake and are screwed connection, and base 1 is screwed with welding column leveling mechanism 2 and is connected; After the connection, ceramic package detent mechanism 4 and welding column detent mechanism 3 plant the hollow part that the post hole all is positioned at loam cake 5.
The welding column detent mechanism, ceramic package detent mechanism and the welding column leveling mechanism that combine are positioned between loam cake and the lower cover, then by the fixation kit on four limits loam cake, welding column detent mechanism, ceramic package detent mechanism, welding column leveling mechanism and lower cover are fixed, the relative position that guarantees each assembly remains constant, with reference to Fig. 1.
The array arrangement mode of welding column according to the LGA560 pad is positioned in the location hole of corresponding welding column, guarantees that the bottom surface of welding column touches on the bottom platform.To print equably a certain amount of solder(ing) paste on the LGA560 shell pad, by aligning equipment the inversion of LGA560 shell is placed in the ceramic package detent mechanism, guarantee that the scolder on each pad all fully contacts with corresponding welding column.The column device of planting that places components and parts is positioned over stably and carries out Reflow Soldering in the reflow soldering, and the peak temperature of Reflow Soldering is 250～275 ℃, and return time is 30～60s.Make scolder melting through in the process of Reflow Soldering, pad and welding column are linked together fully.Wait planting after column device is cooled to room temperature, by the screw of outwarding winding lower cover is taken off, by cutting tools planarizing process is carried out on the welding column surface, and remove the welding column end that machines away clean.Use at last pick device with components and parts undamaged taking-up from plant column device.
Claims (6)
- Ceramic column grid array components and parts plant column device, it is characterized in that: this device comprises base (1), welding column leveling mechanism (2), welding column detent mechanism (3), ceramic package detent mechanism (4) and loam cake (5) from the bottom up successively;Centered by the base (1) with the flat board of boss;Welding column leveling mechanism (2) is the flat board of hollow; A dull and stereotyped side is cutting edge, and the boss of the hollow part of welding column leveling mechanism (2) and base (1) is complementary;Welding column detent mechanism (3) is a flat board, is made up by web plate; The post hole is planted with what adapt with welding column diameter to be welded in its center;Ceramic package detent mechanism (4) is the flat board of hollow, and each side of ceramic package detent mechanism (4) is respectively with a limiting stand, and space and the ceramic package of four limiting stand compositions are complementary; Hollow between per two limiting stands;Loam cake (5) is the flat board of hollow;Welding column leveling mechanism (2), welding column detent mechanism (3), ceramic package detent mechanism (4) and loam cake (5) are fixedly connected with, and base (1) is fixedly connected with welding column leveling mechanism (2); After the connection, ceramic package detent mechanism (4) and welding column detent mechanism (3) plant the hollow part that the post hole all is positioned at loam cake (5).
- A kind of Ceramic column grid array components and parts according to claim 1 plant column device, it is characterized in that: web plate is to carry out precision machinedly with laser, and its thickness is 0.1～0.6mm.
- A kind of Ceramic column grid array components and parts according to claim 1 plant column device, it is characterized in that: the thickness of cutting edge from the edge of welding column leveling mechanism (2) to the center diminishes gradually, and the gradient of cutting edge is less than 10 °.
- Ceramic column grid array components and parts plant column method, it is characterized in that steps of the method are:1) welding column leveling mechanism (2), welding column detent mechanism (3), ceramic package detent mechanism (4) and loam cake (5) are fixedly connected with, then base (1) are fixedly connected with welding column leveling mechanism (2);2) welding column to be welded is placed on planting in the post hole of welding column detent mechanism (3) according to the requirement that the ceramic package pad distributes, and passes and plant the post hole to the boss of base (1);3) printed solder paste on the pad of ceramic package is positioned over ceramic package on the welding column, solder(ing) paste is fully contacted with welding column to be welded, and by the limiting stand on the ceramic package detent mechanism (4) ceramic package is positioned;4) will be placed with the Reflow Soldering that column device carries out solder joint of planting of ceramic package, after planting the column device cooling, base (1) is taken off, with the cutting edge of cutting tools by welding column leveling mechanism (2) planarizing process is carried out on the welding column surface, the ceramic package that will plant at last welding column takes out from plant column device.
- A kind of Ceramic column grid array components and parts according to claim 4 plant column method, it is characterized in that: step 4) in Reflow Soldering in reflow ovens, carry out.
- According to claim 4 or 5 described a kind of Ceramic column grid array components and parts plant column method, it is characterized in that: the peak temperature of Reflow Soldering is 250～275 ℃, return time is 30～60s.
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| CN103258748A (en) * | 2013-05-16 | 2013-08-21 | 无锡中微高科电子有限公司 | Assembling method of welding columns used for ceramic column grid array packaging |
| CN103394842A (en) * | 2013-07-23 | 2013-11-20 | 中国电子科技集团公司第五十八研究所 | Arrangement device for CCGA (ceramic column grid array) packaging welding columns and pins |
| CN103700607A (en) * | 2013-12-19 | 2014-04-02 | 北京遥测技术研究所 | Tooling for reconditioning pin in ceramic column grid array (CCGA) |
| CN104779186A (en) * | 2014-12-31 | 2015-07-15 | 中国航天科技集团公司第五研究院第五一三研究所 | Device for column planting technology of CCGA chip |
| CN105655264A (en) * | 2015-12-30 | 2016-06-08 | 北京时代民芯科技有限公司 | Column planting device and column planting method of CCGA (Ceramic Column Gate Array) device |
| CN105789097A (en) * | 2016-05-04 | 2016-07-20 | 中国电子科技集团公司第十三研究所 | Clamp for ceramic pin grid array shell parallel seam welding for system level packaging |
| CN106564002A (en) * | 2016-11-09 | 2017-04-19 | 北京时代民芯科技有限公司 | Tool and method for controlling coplanarity, position tolerance and perpendicularity of CCGA device welding columns |
| CN109920741A (en) * | 2019-04-10 | 2019-06-21 | 成都智明达电子股份有限公司 | A kind of CCGA device, which is reprocessed, plants column process |
| CN110116252A (en) * | 2019-06-19 | 2019-08-13 | 西安微电子技术研究所 | A kind of LCCC device is planted column welding tooling and is planted method of column to LCCC device using its |
| CN111586990A (en) * | 2020-05-07 | 2020-08-25 | 中国航空无线电电子研究所 | Protection processing method for ceramic column grid array device of printed circuit board |
| CN112164670A (en) * | 2020-09-28 | 2021-01-01 | 西安微电子技术研究所 | Visual alignment column planting device and method for CCGA device |
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| CN104779186B (en) * | 2014-12-31 | 2017-06-13 | 中国航天科技集团公司第五研究院第五一三研究所 | A kind of device for CCGA chip post techniques |
| CN105655264A (en) * | 2015-12-30 | 2016-06-08 | 北京时代民芯科技有限公司 | Column planting device and column planting method of CCGA (Ceramic Column Gate Array) device |
| CN105655264B (en) * | 2015-12-30 | 2018-07-31 | 北京时代民芯科技有限公司 | A kind of the plant column device and plant column method of CCGA devices |
| CN105789097B (en) * | 2016-05-04 | 2019-03-26 | 中国电子科技集团公司第十三研究所 | The ceramic pin grid array shell parallel seam welding fixture of system in package |
| CN105789097A (en) * | 2016-05-04 | 2016-07-20 | 中国电子科技集团公司第十三研究所 | Clamp for ceramic pin grid array shell parallel seam welding for system level packaging |
| CN106564002A (en) * | 2016-11-09 | 2017-04-19 | 北京时代民芯科技有限公司 | Tool and method for controlling coplanarity, position tolerance and perpendicularity of CCGA device welding columns |
| CN109920741A (en) * | 2019-04-10 | 2019-06-21 | 成都智明达电子股份有限公司 | A kind of CCGA device, which is reprocessed, plants column process |
| CN110116252A (en) * | 2019-06-19 | 2019-08-13 | 西安微电子技术研究所 | A kind of LCCC device is planted column welding tooling and is planted method of column to LCCC device using its |
| CN111586990A (en) * | 2020-05-07 | 2020-08-25 | 中国航空无线电电子研究所 | Protection processing method for ceramic column grid array device of printed circuit board |
| CN112164670A (en) * | 2020-09-28 | 2021-01-01 | 西安微电子技术研究所 | Visual alignment column planting device and method for CCGA device |
| CN112164670B (en) * | 2020-09-28 | 2023-09-26 | 珠海天成先进半导体科技有限公司 | Visual alignment column planting device and method for CCGA (CCGA) device |
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