CN112164670B - Visual alignment column planting device and method for CCGA (CCGA) device - Google Patents
Visual alignment column planting device and method for CCGA (CCGA) device Download PDFInfo
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- CN112164670B CN112164670B CN202011045075.3A CN202011045075A CN112164670B CN 112164670 B CN112164670 B CN 112164670B CN 202011045075 A CN202011045075 A CN 202011045075A CN 112164670 B CN112164670 B CN 112164670B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Abstract
The invention provides a visual alignment post-planting device and a visual alignment post-planting method for a CCGA device, wherein the device comprises a base, a post-welding bearing plate and a dual-optical alignment system; the welding column bearing plate is provided with a through hole array for fixing welding columns, and a plurality of welding column bearing plate alignment reference points are arranged in the blank area of the welding column bearing plate; the welding column bearing plates are provided with a plurality of welding column bearing plate alignment reference points along the edges of the through hole arrays; a welding column bearing plate accommodating cavity is formed in the base, a to-be-planted column device positioning cavity is formed in the welding column bearing plate accommodating cavity, and base alignment reference points are respectively arranged at positions, corresponding to the welding column bearing plate alignment reference points, of the edges of the to-be-planted column device positioning cavity; the positions of the through hole arrays are correspondingly arranged with the column devices to be planted which are placed in the column device positioning concave cavities to be planted; the shape of the welding column bearing plate is arranged corresponding to the accommodating concave cavity of the welding column bearing plate; the processing requirement is lower, the operation is convenient, the column planting process with high precision and low damage can be realized, and the yield and quality of CCGA devices are improved.
Description
Technical Field
The invention relates to the field of microelectronic packaging technology, in particular to a visual alignment post-planting device and method for a CCGA device.
Background
Along with the development of miniaturization, high density and high reliability of integrated circuits, ceramic Column Grid Arrays (CCGA) are gradually adopted to replace Ceramic Ball Grid Arrays (CBGA) in large-size ceramic tube shell packages, compared with the CCGA, the CCGA increases the interconnection pin distance between a PCB and a ceramic circuit, reduces the problem of overlarge shearing force stress caused by mismatch of thermal expansion coefficients, and has higher reliability and longer service life. At present, a method of aligning a welding column bearing plate and a base by using a positioning pin is mostly adopted in a column planting device, namely, a ceramic tube shell to be planted is firstly placed in a groove of the base, then the positioning pin is utilized to realize the alignment of the welding column bearing plate and the base, and then the welding columns are sequentially placed in the welding column bearing plate, so that a column planting process is realized through reflow. This method has the following drawbacks:
(1) The compatibility of the external dimensions is poor. The mechanical alignment of the welding columns and the welding pads is realized by adopting the external dimension of the column planting device, and the centering between the welding pads of all devices and the welding columns is difficult to ensure in consideration of the fact that the external dimension of the ceramic tube shell floats in a certain range, so that the inclination angle of the welding columns of the CCGA devices with partial dimensions is overlarge, the position degree of the welding columns relative to the welding pads is overlarge, and the yield of the CCGA devices is reduced.
(2) The dimensional fit is difficult to grasp. The difficulty of processing high accuracy location pinhole in the corresponding position of upper and lower device is great, and if the cooperation of locating pin and hole is too tight, bumps askew welding post in the drawing of patterns in-process easily, and the locating pin is too loose with the cooperation of hole, and the locating pin drops easily in the device transfer process, leads to welding post position deviation.
(3) The welding post is damaged greatly. When the welding columns are planted, the welding columns of the welding column transfer support plate are required to be transferred into the welding column planting device, the welding columns are easy to scratch in the welding column transferring process, the perpendicularity and quality of the welding columns are affected, and therefore the quality of CCGA devices is reduced.
Disclosure of Invention
Aiming at the problems of poor compatibility of external dimensions, difficult grasp of dimensional matching and large damage to welding columns in the prior art when the alignment of the welding column bearing plate and the base is realized through the positioning pins, the invention provides the visual alignment column planting device and method for the CCGA device, which have the advantages of lower processing requirements, convenient operation and high reliability, realize high-precision alignment of a ceramic tube shell bonding pad and a welding column by adjusting an optical image, do not need to consider the floating external dimensions of the column to be planted, can realize a column planting process with high precision and low damage, and improve the yield and quality of the CCGA device.
The invention is realized by the following technical scheme:
a visual alignment post-planting device of a CCGA device is characterized by comprising a base, a post-welding bearing plate and a dual-optical alignment system;
a through hole array for fixing the welding columns is processed on the welding column bearing plate, and a plurality of welding column bearing plate alignment reference points are arranged at the edge position of the through hole array;
a welding column bearing plate accommodating cavity is formed in the base, a to-be-planted column device positioning cavity is formed in the welding column bearing plate accommodating cavity, and base alignment reference points are respectively arranged at positions, corresponding to the welding column bearing plate alignment reference points, of the edges of the to-be-planted column device positioning cavity; the positions of the through hole arrays are correspondingly arranged with the column devices to be planted which are placed in the column device positioning concave cavities to be planted; the shape of the welding column bearing plate is arranged corresponding to the accommodating concave cavity of the welding column bearing plate;
the dual-optical alignment system comprises a vacuum adsorption head, an alignment camera, a bearing platform, a display, a first supporting rod and a second supporting rod; the bottom end of the first supporting rod is vertically and fixedly arranged on the bearing platform, and the second supporting rod is vertically arranged at the top end of the first supporting rod; the vacuum adsorption head is arranged on the second supporting rod, and a vacuum port of the vacuum adsorption head is vertically arranged towards the bearing platform; a base is placed on the bearing platform, and a welding column bearing plate is adsorbed on the vacuum adsorption head and is positioned right above the base; a lifting unit is arranged in the vacuum adsorption head and used for lifting and placing the welding column bearing plate on the base; the alignment camera is horizontally and rotatably arranged on the first support rod and positioned between the base and the welding column bearing plate, and is used for simultaneously observing images of samples in the base and the welding column bearing plate; the alignment camera is connected with the display.
Preferably, each side edge of the base is respectively provided with a clamping groove for clamping the surrounding ceramic circuits; the clamping groove stretches to the to-be-planted column device positioning concave cavity along the edge of the base, wherein the to-be-planted column device positioning concave cavity, the clamping groove and the bottom surface of the welding column bearing plate accommodating concave cavity are arranged in a step shape, and the base alignment reference point is arranged at the position, corresponding to the welding column bearing plate alignment reference point, of the bottom surface of the clamping groove along the edge of the to-be-planted column device positioning concave cavity.
Preferably, the arc-shaped groove is formed in the direction of the accommodating concave cavity of the welding column bearing plate towards the positioning concave cavity of the column device to be implanted.
Preferably, the thickness of the welding column bearing plate is 1.70-1.75 mm.
Preferably, the diameter of the array of vias is greater than the diameter of the bond posts.
Preferably, the thickness of the post carrier plate is less than the length of the post.
Preferably, the device further comprises a controller, wherein the input end of the controller is connected with the signal input module, and the output end of the controller is connected with the display and the lifting output module; the input end of the signal input module is connected with the alignment camera; the output end of the lifting output module is connected with the vacuum adsorption head.
A visual alignment column planting method of a CCGA device based on the device comprises the following steps:
step 1, printing solder paste on the surface of a welding disc of a ceramic tube shell to be implanted with a post, placing the tube shell in a positioning concave cavity of a groove to be implanted with the post device of a base, and placing the welding disc face upwards;
step 2, placing the base provided with the column device to be planted on a bearing platform of a dual-optical alignment system, and placing a welding column bearing plate filled with welding columns right above the base through vacuum adsorption of a vacuum adsorption head;
step 3, opening up and down alignment cameras of the dual optical alignment system, and adjusting the positions or angles of the welding column bearing plates according to the optical images of the welding pads and the welding column arrays on the display to sequentially finish the optical alignment of the welding column bearing plate alignment reference points on two sides of the welding column bearing plates and the base alignment reference points on two sides of the base;
step 4, after the rough alignment of the reference points is completed, continuously finely adjusting the position or angle of the welding column bearing plate according to the optical image positions of the welding pads and the welding columns on the display so that the circle centers of the welding pads and the welding columns are highly aligned;
step 5, after alignment is completed, vertically placing the welding column bearing plate on the base 1 through the lifting vacuum adsorption head to complete column planting alignment;
step 6, transferring the whole device into a vacuum reflow oven, and reflowing by using a preset curve to weld the welding post on a ceramic tube shell bonding pad to be planted with the post;
and 7, after the post-planting device is cooled to room temperature, taking the whole device out of the reflow oven, and taking the device out of the space between the base and the post-welding bearing plate to complete the CCGA post-planting process.
Preferably, the circular center distances of the through hole arrays are arranged in one-to-one correspondence with the bonding pads on the surface of the ceramic tube shell.
Preferably, the base and the welding column bearing plate are made of graphite.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a visual alignment post-planting device of a CCGA device, wherein a post-welding bearing plate alignment reference point and a base alignment reference point are correspondingly arranged at the edges of a through hole array and a post-to-be-planted device positioning concave cavity respectively, so that the post-welding bearing plate and the base are positioned roughly through the reference points, the alignment of the post-welding bearing plate and the base in real time optical image adjustment position is realized by a double optical alignment system, the dimensional deviation caused by positioning pins alignment is avoided, the post-welding bearing plate is effectively adsorbed above the base by a vacuum adsorption head, the post-to-be-planted device in the post-to-be-planted device positioning concave cavity is correspondingly placed by the through hole array of the post-welding bearing plate by a lifting vacuum adsorption head through a lifting unit, and the accurate alignment of the post-welding bearing plate and the base is effectively realized.
Further, the clamping grooves are respectively formed in each side edge of the base, so that a ceramic circuit is placed on the base, the bottom surfaces of the positioning concave cavities of the column device to be planted, the clamping grooves and the holding concave cavities of the column welding bearing plates are arranged in a step shape, and the situation that the column welding bearing plates are pressed onto the ceramic circuit to damage the column welding is avoided when the column welding bearing plates are placed on the base.
Further, the arc-shaped groove is formed in the direction of the concave cavity of the welding column bearing plate towards the positioning concave cavity of the column device to be implanted, so that the ceramic tube shell can be placed conveniently.
Further, the diameter of the through hole array is larger than that of the welding post, so that the perpendicularity of the welding post array after post implantation is ensured.
Further, the thickness of the solder column bearing plate is smaller than the length of the solder column, so that the form of the printing soldering paste and the tin climbing of the solder in the reflow process are effectively protected.
Further, the controller effectively controls the dual-optical alignment system, so that high-precision alignment of the welding column bearing plate and the welding column is realized, and the operation efficiency is improved.
A visual alignment column planting method of CCGA device uses a dual optical alignment system to project optical images of a bonding pad and a welding column array on a plane at the same time, and high-precision alignment of a ceramic tube shell bonding pad and a welding column is realized by adjusting the optical images without considering the floating of the external dimension of the column device to be planted.
Preferably, the circular center distances of the through hole arrays are in one-to-one correspondence with bonding pads on the surface of the ceramic tube shell, so that high-precision alignment of the bonding pads of the ceramic tube shell and the bonding columns is realized, dimensional deviation caused by alignment of positioning pins is avoided, and the quality of finished CCGA devices is improved.
Preferably, the materials of the base and the welding column bearing plate are graphite, on one hand, the graphite has the characteristic of high heat conductivity, the heat conduction effect in the reflow process is improved, the ceramic tube shell in the cavity is prevented from being heated unevenly, and the temperature difference of the surface of the ceramic tube shell can be controlled within 1 ℃; on the other hand, the graphite has smaller thermal expansion coefficient and better lubrication effect, reduces the deformation in the reflow process, can realize zero-damage demolding of the welding column, and ensures that the yield of CCGA devices is more than 98%.
Drawings
FIG. 1 is a schematic perspective view of the device of the present invention in use;
FIG. 2 is a top view of the base of the device of the present invention;
FIG. 3 is a front view of the base of the device of the present invention;
FIG. 4 is a top view of a post carrier plate of the device of the present invention;
FIG. 5 is a front view of a post carrier plate of the device of the present invention;
FIG. 6 is a schematic diagram of a dual optical alignment system of the apparatus of the present invention;
fig. 7 is a schematic diagram of the structural principle of the controller of the present invention.
In the figure: 1-a base; 2-welding column bearing plates; 3-dual optical alignment system; 11-positioning concave cavities of column devices to be planted; 12-aligning the base with a reference point; 13-clamping grooves; 14-the post carrier plate accommodates the cavity; 21-an array of through holes; 22-aligning reference points of the welding column bearing plates; 31-a vacuum adsorption head; 32-aligning the camera; 33-a load-bearing platform; 34-a display; 35-a first strut; 36-a second strut.
Detailed Description
The invention will now be described in further detail with reference to specific examples, which are intended to illustrate, but not to limit, the invention.
The invention provides a visual alignment post-planting device of a CCGA device, which is shown in figure 1, and comprises a base 1, a post-welding bearing plate 2 and a dual-optical alignment system 3;
according to fig. 4 and 5, a through hole array 21 for fixing the welding columns is processed on the welding column bearing plate 2, and a plurality of welding column bearing plate alignment reference points 22 are arranged at the edge positions of the through hole array 21;
according to fig. 2 and 3, a welding post bearing plate accommodating cavity 14 is formed in the base 1, a to-be-planted post device positioning cavity 11 is formed in the welding post bearing plate accommodating cavity 14, and a base alignment reference point 12 is respectively arranged at the edge of the to-be-planted post device positioning cavity 11 corresponding to the welding post bearing plate alignment reference point 22;
the position of the through hole array 21 is correspondingly arranged with the column device to be planted in the column device positioning concave cavity 11 to be planted; the shape of the welding column bearing plate 2 is arranged corresponding to the welding column bearing plate accommodating concave cavity 14;
the dual optical alignment system 3 comprises a vacuum adsorption head 31, an alignment camera 32, a bearing platform 33, a display 34, a first support rod 35 and a second support rod 36; as shown in fig. 6, the bottom end of the first supporting rod 35 is vertically fixed on the bearing platform 33, and the second supporting rod 36 is vertically arranged at the top end of the first supporting rod 35; the vacuum adsorption head 31 is arranged on the second support rod 36, and a vacuum port of the vacuum adsorption head 31 is vertically arranged towards the bearing platform 33; the base 1 is placed on the bearing platform 33, the welding column bearing plate 2 is adsorbed on the vacuum adsorption head 31 and is positioned right above the base 1, and a lifting unit is arranged in the vacuum adsorption head 31 and is used for lifting and placing the welding column bearing plate 2 on the base 1; the alignment camera 32 is horizontally and rotatably arranged on the first supporting rod 35 and is positioned between the base 1 and the welding column bearing plate 2, so as to simultaneously observe images of samples in the base 1 and the welding column bearing plate 2; the alignment camera 32 is connected to a display 34.
Wherein, each side edge of the base 1 is respectively provided with a clamping groove 13 for clamping the surrounding ceramic circuit; the clamping groove 13 stretches onto the column device positioning concave cavity 11 to be planted along the edge of the base 1, wherein the bottom surfaces of the column device positioning concave cavity 11 to be planted, the clamping groove 13 and the column welding bearing plate accommodating concave cavity 14 are arranged in a step mode, and a base alignment reference point 12 is arranged at the position, corresponding to the column welding bearing plate alignment reference point 22, of the bottom surface of the clamping groove 13 along the edge of the column device positioning concave cavity 11 to be planted.
The arc-shaped groove is formed in the direction of the accommodating concave cavity 14 of the welding column bearing plate towards the positioning concave cavity 11 of the column device to be implanted, so that the ceramic tube shell is convenient to place; the diameter of the through hole array 21 is larger than that of the welding post, so that the perpendicularity of the welding post array after post implantation is ensured; the thickness of the solder column bearing plate 2 is smaller than the length of the solder column, so that the form of the printing soldering paste and the tin climbing of the solder in the reflow process are effectively protected.
According to the structural principle schematic diagram of the controller shown in fig. 7, the input end of the controller is connected with the signal input module, and the output end of the controller is connected with the display and the lifting output module; the input end of the signal input module is connected with the alignment camera 32; the output end of the lifting output module is connected with the vacuum adsorption head 31.
The visual alignment column planting method of the CCGA device comprises the following steps:
step 1, printing solder paste on the surface of a welding disc of a ceramic tube shell to be implanted with a post, placing the tube shell in a positioning concave cavity 11 of a groove to be implanted with the post device of a base 1, and placing the welding disc face upwards; the method comprises the steps of carrying out a first treatment on the surface of the
Step 2, placing the base 1 with the column device to be planted on a bearing platform 33 of the dual-optical alignment system 3, and placing a column bearing plate 2 filled with the welding columns right above the base 1 through vacuum adsorption of a vacuum adsorption head 31;
step 3, opening the upper and lower alignment cameras 32 of the dual optical alignment system 3, and adjusting the positions or angles of the welding column bearing plates 2 according to the optical images of the welding pads and the welding column arrays on the display 34, so as to sequentially complete the optical alignment of the welding column bearing plate alignment reference points 22 on two sides of the welding column bearing plates 2 and the base alignment reference points on two sides of the base 1;
step 4, after the rough alignment of the reference points is completed, continuously finely adjusting the position or angle of the welding column bearing plate 2 according to the optical image positions of the welding pads and the welding columns on the display 34, so that the circle centers of the welding pads and the welding columns are aligned in height;
step 5, after alignment is completed, vertically placing the welding column bearing plate 2 on the base 1 through the lifting vacuum adsorption head 31, and completing column planting alignment;
step 6, transferring the whole device into a vacuum reflow oven, and reflowing by using a preset curve to weld the welding post on a ceramic tube shell bonding pad to be planted with the post;
and 7, after the post-planting device is cooled to room temperature, taking the whole device out of the reflow oven, and taking out the device from between the base 1 and the post-welding bearing plate 2 to complete the CCGA post-planting process.
The circle center distances of the through hole arrays 21 are arranged in one-to-one correspondence with the bonding pads on the surface of the ceramic tube shell, so that the high-precision alignment of the bonding pads of the ceramic tube shell and the bonding columns is realized, the dimensional deviation caused by alignment of the positioning pins is avoided, and the quality of finished CCGA devices is improved.
Examples
The invention is applied to the CCGA484 column planting process, and the visual alignment column planting device for the CCGA484 device comprises a base 1, a welding column bearing plate 2 and a dual-optical alignment system 3; the welding post bearing plate accommodating cavity 14 is formed in the base 1, the welding post bearing plate accommodating cavity 14 is internally provided with a to-be-planted post device positioning cavity 11, the dimension of the to-be-planted post device positioning cavity 11 is consistent with the external dimension of the ceramic tube shell, the dimension is 29.0 multiplied by 29.0mm, the four corners of the welding post bearing plate accommodating cavity 14, which face the direction of the to-be-planted post device positioning cavity 11, are provided with arc-shaped grooves, and the ceramic tube shell is convenient to place; the four sides of the positioning concave cavity 11 of the column to be planted are provided with rectangular grooves which are about 1mm higher than the bottom of the groove, so that the ceramic tube shell can be conveniently taken out, and the welding column bearing plate accommodating concave cavity 14 is formed by the flanges at the four corners of the outer edge of the base 1 and is used for accommodating the welding column bearing plate 2, so that displacement during taking out is avoided; the welding column bearing plate 2 is provided with a through hole array 21 which is equidistant from the welding pads, and the mesh diameter of the through hole array is 0.6mm; the thickness of the solder column bearing plate 2 is 1.70-1.75 mm, which is smaller than the length of the solder column 2.25mm, so that solder climbing and solder column perpendicularity in the reflow process can be ensured; the base 1 and the welding column bearing plate 2 are both made of graphite materials; the upper side of the dual optical alignment system 3 is provided with a vacuum adsorption head 31 and is connected with a display 34, so that optical images on the upper side and the lower side can be projected on a screen at the same time, and the up-down alignment precision is ensured.
The device is used for completing the column planting of the CCGA484 device, and the concrete using steps are as follows:
step 1, printing solder paste on the surface of a welding disc of a ceramic tube shell to be implanted with a post, placing the tube shell in a positioning concave cavity 11 of a groove to be implanted with the post device of a base 1, and placing the welding disc face upwards;
step 2, placing the base 1 with the column device to be planted on a bearing platform 33 of the dual-optical alignment system 3, and placing a column bearing plate 2 filled with the welding columns right above the base 1 through vacuum adsorption of a vacuum adsorption head 31;
step 3, opening the upper and lower alignment cameras 32 of the dual optical alignment system 3, and adjusting the positions or angles of the welding column bearing plates 2 according to the optical images of the welding pads and the welding column arrays on the display 34, so as to sequentially complete the optical alignment of the welding column bearing plate alignment reference points 22 on two sides of the welding column bearing plates 2 and the base alignment reference points on two sides of the base 1;
step 4, after the rough alignment of the reference points is completed, continuously finely adjusting the position or angle of the welding column bearing plate 2 according to the optical image positions of the welding pads and the welding columns on the display 34, so that the circle centers of the welding pads and the welding columns are aligned in height;
step 5, after alignment is completed, vertically placing the welding column bearing plate 2 on the base 1 through the lifting vacuum adsorption head 31, and completing column planting alignment;
step 6, transferring the whole device into a vacuum reflow oven, and reflowing by using a preset curve to weld the welding post on a ceramic tube shell bonding pad to be planted with the post;
and 7, after the post-planting device is cooled to room temperature, taking the whole device out of the reflow oven, and taking out the device from between the base 1 and the post-welding bearing plate 2 to complete the CCGA post-planting process.
The invention utilizes the dual optical alignment system 3 to project the bonding pad of the ceramic tube shell of the column to be planted and the optical image of the welding column on the screen at the same time, realizes the high-precision alignment of the welding column and the bonding pad by adjusting the optical image, avoids the alignment deviation caused by the size floating of the ceramic tube shell, ensures that the inclination angle of the welding column is within 2 degrees, ensures that the position degree is within 80 mu m, and maximally ensures the quality of the finished product of the CCGA device. According to the invention, graphite is preferably used as a device material, compared with other materials, the heat conduction in the reflow process is increased, the thermal expansion deformation is reduced, meanwhile, the self lubrication effect can avoid the damage of the welding column during demolding, the yield of CCGA devices is ensured to be more than 98%, and the thickness of the welding column bearing plate 2 is 75% -80% of the height of the welding column; the mesh diameter of the post carrier plate 2 is about 15% larger than the post diameter.
Claims (10)
1. The visual alignment post-planting device of the CCGA device is characterized by comprising a base (1), a post-welding bearing plate (2) and a dual-optical alignment system (3);
the welding column bearing plate (2) is provided with a through hole array (21) for fixing welding columns, and a plurality of welding column bearing plate alignment reference points (22) are arranged at the edge positions of the through hole array (21);
a welding column bearing plate accommodating cavity (14) is formed in the base (1), a to-be-planted column device positioning cavity (11) is formed in the welding column bearing plate accommodating cavity (14), and base alignment reference points (12) are respectively arranged at positions, corresponding to the welding column bearing plate alignment reference points (22), of edges of the to-be-planted column device positioning cavity (11); the positions of the through hole arrays (21) are arranged corresponding to column devices to be planted in the column device positioning concave cavities (11) to be planted; the shape of the welding column bearing plate (2) is arranged corresponding to the welding column bearing plate accommodating concave cavity (14);
the dual-optical alignment system (3) comprises a vacuum adsorption head (31), an alignment camera (32), a bearing platform (33), a display (34), a first supporting rod (35) and a second supporting rod (36); the bottom end of the first supporting rod (35) is vertically and fixedly arranged on the bearing platform (33), and the second supporting rod (36) is vertically arranged at the top end of the first supporting rod (35); the vacuum adsorption head (31) is arranged on the second support rod (36), and a vacuum port of the vacuum adsorption head (31) is vertically arranged towards the bearing platform (33); a base (1) is placed on the bearing platform (33), and the welding column bearing plate (2) is adsorbed on the vacuum adsorption head (31) and is positioned right above the base (1); a lifting unit is arranged in the vacuum adsorption head (31) and used for lifting and placing the welding column bearing plate (2) on the base (1); the alignment camera (32) is horizontally and rotatably arranged on the first support rod (35) and is positioned between the base (1) and the welding column bearing plate (2) and used for simultaneously observing images of samples in the base (1) and the welding column bearing plate (2); an alignment camera (32) is coupled to the display (34).
2. The device for visually aligning and planting the columns of the CCGA device according to claim 1, wherein each side edge of the base (1) is provided with a clamping groove (13) for clamping the periphery of the ceramic circuit; the clamping groove (13) stretches to the position, along the edge of the base (1), of the column device positioning concave cavity (11) to be planted, wherein the bottom surfaces of the column device positioning concave cavity (11), the clamping groove (13) and the column welding bearing plate accommodating concave cavity (14) are arranged in a step shape, and base alignment reference points (12) are arranged at the positions, corresponding to column welding bearing plate alignment reference points (22), of the bottom surfaces of the clamping groove (13) along the edge of the column device positioning concave cavity (11) to be planted.
3. The device for visually aligning and planting a post of a CCGA device according to claim 1, wherein the receiving cavity (14) of the post carrier is provided with a circular arc-shaped groove facing the positioning cavity (11) of the post device to be planted.
4. The device for visually aligning and planting columns of the CCGA device according to claim 1, wherein the thickness of the column-welding bearing plate (2) is 1.70-1.75 mm.
5. A CCGA device visual alignment post mounting device according to claim 1, wherein the diameter of the array of vias (21) is larger than the diameter of the solder posts.
6. The apparatus for visually aligning and planting columns of CCGA devices according to claim 1, wherein the thickness of the column carrier plate (2) is smaller than the length of the columns.
7. The device for visually aligning and planting a column of a CCGA device according to claim 1, further comprising a controller, wherein the input end of the controller is connected with a signal input module, and the output end of the controller is connected with a display and a lifting output module; the input end of the signal input module is connected with an alignment camera (32); the output end of the lifting output module is connected with a vacuum adsorption head (31).
8. A visual alignment column planting method of a CCGA device is characterized in that: the device according to any one of claims 1-6, comprising the steps of:
step 1, printing solder paste on the surface of a welding disc of a ceramic tube shell to be implanted, placing the tube shell in a positioning concave cavity (11) of a device to be implanted of a base (1), and placing the welding disc face upwards;
step 2, placing the base (1) provided with the column device to be planted on a bearing platform (33) of the dual-optical alignment system (3), and placing a column bearing plate (2) filled with the welding columns right above the base (1) through vacuum adsorption of a vacuum adsorption head (31);
step 3, opening up and down alignment cameras (32) of the dual optical alignment system (3), and adjusting the positions or angles of the welding column bearing plates (2) according to the optical images of the welding pads and the welding column arrays on the display (34), so as to sequentially complete the optical alignment of the welding column bearing plate alignment reference points (22) on two sides of the welding column bearing plates (2) and the base alignment reference points on two sides of the base (1);
step 4, after the rough alignment of the reference points is completed, continuously and finely adjusting the position or angle of the welding column bearing plate (2) according to the optical image positions of the welding pads and the welding columns on the display (34) so as to align the circle center heights of the welding pads and the welding columns;
step 5, after alignment is completed, vertically placing the welding column bearing plate (2) on the base (1) through the lifting vacuum adsorption head (31), and completing column planting alignment;
step 6, transferring the whole device into a vacuum reflow oven, and reflowing by using a preset curve to weld the welding post on a ceramic tube shell bonding pad to be planted with the post;
and 7, after the post-planting device is cooled to room temperature, taking the whole device out of the reflow oven, and taking out the device from between the base (1) and the post-welding bearing plate (2), thereby completing the CCGA post-planting process.
9. The method for visually aligning and planting columns of the CCGA device according to claim 8, wherein the circle centers of the through hole arrays (21) are arranged in one-to-one correspondence with the circle centers of the bonding pads on the surface of the ceramic package.
10. The method for visually aligning and implanting columns of a CCGA device according to claim 8, wherein the base (1) and the solder column carrier plate (2) are made of graphite.
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