CN105102189A - Template assembly and method for manufacturing template assembly - Google Patents
Template assembly and method for manufacturing template assembly Download PDFInfo
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- CN105102189A CN105102189A CN201480016816.1A CN201480016816A CN105102189A CN 105102189 A CN105102189 A CN 105102189A CN 201480016816 A CN201480016816 A CN 201480016816A CN 105102189 A CN105102189 A CN 105102189A
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- Prior art keywords
- template
- workpiece
- liner
- template portion
- template assembly
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Abstract
The present invention is a template assembly for holding a workpiece when the workpiece is polished, the template assembly being characterized in having a PET substrate, an annular template part bonded to the outer periphery part of the lower surface of the PET substrate, and a disc-shaped backing pad bonded to the center part of the lower surface of the PET substrate; the inner surface of the template part and the lower surface of the backing pad forming a recess for accommodating and holding the workpiece during polishing, an annular cutout part being formed on the upper part of the inner surface of the template part, and the peripheral edge part of the backing pad engaging with the cutout part. It is thereby possible to reduce the in-plane variation of the depth of the recess while minimizing the occurrence of faults and scratches on the workpiece, and thereby improve the flatness of the polished workpiece.
Description
Technical field
The present invention relates to a kind of template assembly and manufacture method thereof, this template assembly is when grinding the surface of the works such as the semiconductor crystal wafer headed by Silicon Wafer, in order to holding workpiece.
Background technology
As the device of surface of the work such as grinding Silicon Wafer etc., there are the single-sided grinding device of the one side of grinding work-piece one by one and the two-sided double-side polishing apparatus of simultaneous grinding.Common single-sided grinding device 200 is as shown in Figure 8 made up of the platform being pasted with abrasive cloth 202 (surfaceplate) 203, grinding agent feed mechanism 204, grinding head 201 etc.Lapping device 200 carrys out holding workpiece W utilizing grinding head 201, by grinding agent 205 from while grinding agent feed mechanism 204 is supplied to abrasive cloth 202, by making platform 203 and each spinning of grinding head 201 and making the surface of workpiece W and abrasive cloth 202 slidingly contact to grind.
As the method for holding workpiece, use one to employ retainer ring (リ テ ー ナ ー リ Application グ) grinding head or employ the grinding head of template assembly.
Employ the grinding head of retainer ring, its retainer ring is the periphery pressing abrasive cloth at workpiece, to prevent the compression of the abrasive cloth caused due to workpiece itself, has the function preventing workpiece generation periphery turned-down edge etc. thus.But, because grinding head structure can become complicated, thus cause high cost.
Fig. 9 represents an example of the grinding head employing existing template assembly.As shown in Figure 9, template assembly has the template portion 103 of liner (backingpad) 102 and ring-type, the template portion 103 of this ring-type is bonded to the peripheral part of this liner 102 bottom surface, and utilizes the bottom surface of the inner face in template portion and liner 102 to form recess.When grinding, workpiece W being accommodated and remains on this recess.Grinding head 101 is that by this template assembly, the mode be bonded in grinding head main body 104 is formed by two-sided tape 105.The material in template portion 103 can use glass epoxy resin etc.
In the grinding head 101 employing this template assembly, the peripheral shape of workpiece W is controlled by the difference of the degree of depth of the recess of template assembly and the thickness of workpiece W.That is, by the thickness in suitably selected template portion 103, the pressure in Workpiece periphery portion when can regulate grinding, therefore can not make the complex structure of grinding head, and can suppress periphery turned-down edge with comparalive ease.
But compared to the thickness and precision of wafer, the depth offset of the recess of template assembly is large, is difficult to stablize and obtains the thickness difference wanted.
Therefore, in order to improve the depth offset of recess, polishing (バ Off ィ Application グ) processing is carried out on the surface of the liner after film forming, or carries out (with reference to patent document 1) such as the grinding in template portion or polish (ラ ッ プ).
In addition, also known a kind of template assembly (with reference to patent document 2) employing PET (PET, Polyethyleneterephthalate) base material as shown in Figure 10.As shown in Figure 10, in template assembly 110, the template portion 103 after carrying out grinding or polish is directly bonded in PET base material 106, and attaches the liner 102 after lowering thickness deviation by polishing processing in the inner side of this PET base material 106.
Prior art document
Patent document
Patent document 1: Japanese Patent Publication 2009-208199 publication
Patent document 2: Japanese Patent Publication 2008-93811 publication
Patent document 3: Japanese Patent Publication becomes 7-58066 publication
Summary of the invention
(1) technical problem that will solve
Above-mentionedly polishing processing is carried out to liner or template portion is carried out to the method for grinding and attrition process, although there is the effect making liner and template portion thickness deviation separately lower, but be difficult to improve template portion and the adhesive reinforcement as elastomeric liner, and the precision as template assembly that in the face significantly can not improving the degree of depth being called as recess, deviation is such.
The depth accuracy of the recess of the template assembly that open market is sold has ± the deviation of 20 μm relative to desired value, and in the face of the degree of depth, deviation is about 15 μm.
Relative to by the target thickness after the grinding of template portion, attrition process, thickness deviation can be improved as ± 3 μm, and deviation in the face of thickness is improved as less than 3 μm.But the depth accuracy this template portion being bonded to the recess of the template assembly after liner has the ± deviation of 10 μm relative to desired value, and in the face of the degree of depth, deviation also deteriorates to about 10 μm.
As shown in Figure 10 by template portion and the liner template assembly 110 directly bonding with PET base material, because the glass epoxy resin used as template portion is hard, therefore improve adhesive reinforcement than being easier to, and the precision as template assembly can be improved.But, owing to being pasted with discoid liner at the inner face in template portion, therefore in grinding, slurries can enter in the gap formed between template portion and liner, this can become sends out dirt source, and have the microscratches of workpiece or defect etc., for the problem that the workpiece quality after grinding causes harmful effect such.
In above-mentioned template assembly 110, when making the thickness in template portion thickening, compared to the template assembly be bonded in template portion on liner shown in Fig. 9, do not have sinking to of template portion when grinding, therefore the gap of template portion and abrasive cloth can be changed little.Therefore the slurries quantity delivered towards surface of the work is not enough, and has and cause dysgenic situation to workpiece quality, also has the problem that template portion can not be too thick.
In addition, in order to suppress the periphery turned-down edge of workpiece, there will be a known a kind of method (with reference to patent document 3) that inner face along template portion forms the ditch of ring-type on liner, even if the method, in grinding, slurries enter in ditch to become and send out dirt source, therefore can not improve the blemish of workpiece.
The present invention completes in view of the above problems, and its object is to provides a kind of template assembly, while the generation of its scratch at suppression workpiece or defect etc., can be improved the flatness of the workpiece after grinding by deviation in the face of the degree of depth of reduction recess.
(2) technical scheme
To achieve these goals, according to the present invention, provide a kind of template assembly, it, is characterized in that in order to keep this workpiece when grinding work-piece, has PET (PET) base material; The template portion of ring-type, it is bonded in the peripheral part of the bottom surface of this PET base material; And discoid liner, it is bonded in the central portion of the bottom surface of described PET base material; In the inner face in described template portion and the bottom surface of described liner, be formed and accommodate when grinding and to keep the recess of described workpiece; Be formed with the notch part of ring-type on the inner face top in described template portion, have the circumference of described liner in the engaging of this notch part.
If such template assembly, very close to each other between template portion and liner, therefore can not send out dirt in grinding, and the generation of the scratch or defect etc. of workpiece can be suppressed.In addition, template portion and liner are bonded to PET base material, deviation in the face of therefore these thickness, in the face of the even degree of depth of recess, deviation can reduce, and can improve the flatness of the workpiece after grinding.
Now, the thickness of described notch part is preferably below the target thickness of described liner.
If this template assembly, between template portion and liner, gap can not be formed; In addition, if the target thickness of the Thickness Ratio liner of notch part is less, then can reduce the grinding pressure in Workpiece periphery portion, the amount of grinding in Workpiece periphery portion can be reduced, therefore, it is possible to suppress periphery turned-down edge.
In addition, the material in described template portion is preferably glass epoxy resin.
If this template assembly, then mechanical property is excellent, and can prevent from causing metallic pollution or damage etc. to workpiece.
In addition, in the face of the degree of depth of described recess, deviation is preferably below 10 μm.
If this template assembly, the flatness of the workpiece after grinding can be improved effectively.
In addition, according to the present invention, provide a kind of manufacture method of template assembly, it is the method for the template assembly manufacturing the invention described above, it is characterized in that having following operation: the operation preparing the template portion of ring-type, the template portion of this ring-type is formed with the notch part of ring-type on inner face top; Discoid liner is bonded to the operation of the central portion of PET base material; And in the mode making the circumference of described liner snap into the notch part in described template portion, described template portion is bonded to the operation of the peripheral part of the bottom surface of described PET base material.
By such manufacture method, can manufacture template assembly of the present invention, deviation in its face that can reduce the thickness of template portion and liner, can improve the flatness of the workpiece after grinding, and can suppress the generation of the scratch or defect etc. of workpiece.
Now, in the operation preparing described template portion, prepare the substrate in template portion, after this prepared substrate cut is gone out ring-type, by the inner face top of the substrate of this ring-type of grinding, described notch part can be formed.
Like this, the template assembly of the ring-type with notch part can easily be prepared.
In addition, in the operation preparing above-mentioned template portion, preferably before the described notch part of formation, by polish and/or grind described template portion, deviation in the face of the thickness in described template portion is made less than 10 μm.
Like this, deviation in the face of the degree of depth of the recess that the bottom surface of the inner face and liner that can conscientiously be reduced in template portion is formed.
(3) beneficial effect
Template assembly of the present invention has PET base material; The template portion of ring-type, it is bonded in the peripheral part of the bottom surface of this PET base material; And discoid liner, it is bonded in the central portion of the bottom surface of described PET base material; The notch part of ring-type is formed on the inner face top in described template portion, the circumference of described liner is had in the engaging of this notch part, therefore dirt can not be sent out in grinding, the generation of the scratch or defect etc. of workpiece can be suppressed, in addition, deviation in the face of the thickness of template portion and liner, in the face of the even degree of depth of recess, deviation can reduce, and can improve the flatness of the workpiece after grinding.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of an example of template assembly of the present invention.
Fig. 2 has the enlarged drawing with the periphery of the notch part of the target thickness same thickness of the liner in template assembly of the present invention.
Fig. 3 is the enlarged drawing of the periphery of the notch part with thickness less of the target thickness of the liner in template assembly of the present invention.
Fig. 4 represents turned-down edge in embodiment 1 ~ 2, comparative example 1 ~ 2 figure relative to the relation of the side-play amount counted from desired value of recess depths.
Fig. 5 is the figure of the mean value of the turned-down edge represented in embodiment 1 ~ 2, comparative example 1 ~ 2, maximum, minimum of a value.
Fig. 6 be the turned-down edge represented in embodiment 1 ~ 2, comparative example 1 ~ 2 face in the radar map of 8 respective shift in position.
Fig. 7 is the figure of the wafer defect quantity represented in embodiment 1 ~ 2, comparative example 1,3.
Fig. 8 is the schematic diagram of the example representing general lapping device.
Fig. 9 is the schematic diagram of the example representing existing template assembly.
Figure 10 is the schematic diagram of other examples representing existing template assembly.
Figure 11 is the figure of the measuring method of the degree of depth of the recess illustrated in embodiment 1 ~ 2, comparative example 1 ~ 3.
Detailed description of the invention
, for the present invention, embodiment is described below, but the present invention is not limited to this embodiment.
First, for template assembly of the present invention, with reference to Fig. 1, Fig. 2 while be described.
As shown in Figure 1, template assembly 1 of the present invention has PET base material 2, the template portion 3 of ring-type and discoid liner 4.The thickness of PET base material 2 and shape etc. are not particularly limited, and such as, shape can be made discoid.
Liner 4 contains moisture and workpiece W is attached to bottom surface, with holding workpiece W.Liner 4 can be such as polyurathamc system.By arranging this liner 4 and making it contain moisture, thus can by the surface tension holding workpiece W effectively of the moisture contained by liner.
Template portion 3 is bonded in the peripheral part of the bottom surface of PET base material 2.Liner 4 is bonded in the central portion of the bottom surface of PET base material 2.
The bottom surface of the inner face in template portion 3 and liner 4 is formed with recess 6.When grinding work-piece W, accommodate workpiece W at this recess 6, the edge part of workpiece W is maintained at the inner face in template portion 3, and the end face of workpiece W is maintained at the bottom surface of liner 4.
Like this, if template portion 3 is directly bonded to PET base material 2 together with liner 4, then the degree of depth that can reduce recess 6 is relative to deviation in the face of the error of target depth and the degree of depth of recess 6.Therefore, the workpiece W after using template assembly of the present invention to grind, can reduce periphery turned-down edge especially, improves the flatness of workpiece W.Particularly by making deviation in the face of the degree of depth of recess make less than 10 μm, the flatness of workpiece W can be improved effectively.
In order to not pollute workpiece W, and do not cause damage or impression, the material in template portion 3 is preferably a kind of more soft than workpiece W, even if slidingly contact the material being also difficult to the high abrasion resistance of wearing and tearing in grinding with abrasive cloth.Consider based on this viewpoint, such as, the material in template portion 3 can be set to glass epoxy resin.
And then, as shown in Figure 1, be formed with the notch part 5 of ring-type on the inner face top in template portion 3.Liner 4, the circumference of liner 4 to be engaged the mode of so far notch part 5, is bonded to the central portion of the bottom surface of PET base material 2.If this template portion, then while employing template portion 3 is directly bonded to the structure in PET base material 2 with liner 4, the gap between template portion 3 and liner 4 can be eliminated.Therefore, it is possible to prevent from occurring in existing template assembly, in grinding, slurries enter gap and send out the problem of dirt, can suppress the generation of the small scratch of workpiece or defect etc.
As shown in Figure 2, the thickness d of notch part 5 is preferably below the target thickness of liner 4, to make not form gap between liner 4.
When wanting the turned-down edge of the peripheral part suppressing workpiece further, as shown in Figure 3, as long as make the thickness d of notch part 5 less than the target thickness of liner 4.Like this, the circumference of the liner 4 clamped by template portion 3 can be compressed annularly, and therefore the grinding pressure in Workpiece periphery portion reduces, and can reduce the amount of grinding in Workpiece periphery portion to suppress the turned-down edge in Workpiece periphery portion.
If have the template assembly of notch part 5 of the present invention, by adjusting the thickness of notch part 5, the grinding pressure in Workpiece periphery portion can be adjusted when not changing the thickness in template portion 3, and can suppress because of the gap smaller between template portion 3 and abrasive cloth cause the deficiency of slurries quantity delivered, the generation of the blemish of workpiece can be suppressed.
In addition, if this kind of structure, can be used together method liner 4 being cut annularly groove.
Then, the manufacture method for template assembly of the present invention is described.
First, the inside top surface prepared as shown in Figure 1 is formed with the template portion 3 of the ring-type of the notch part 5 of ring-type.This operation such as can be implemented as follows.
That prepare template portion, that such as glass epoxy substrate is such substrate.Polish and/or grinding are carried out to this substrate, the thickness of substrate is processed into desired value.
Now, preferably deviation in the face of the thickness in template portion 3 is made less than 10 μm.Like this, when grinding work-piece, the surface configuration generation local deteriorated in Workpiece periphery portion can be suppressed.
Herein, when carrying out polish, abrasive particle such as can use the abrasive particle of alumina type, SiC class.When grinding, such as, can use the alkaline solution containing colloidal silica.
Then, aforesaid substrate is cleaned in order to remove in polish or grinding accompanying abrasive particle or alkaline solution.
Then, such as, by NC processing (Numerical Control is processed, NumericalControlmachining) etc., after substrate cut being gone out the template portion 3 of ring-type, the inner face top grinding in the template portion 3 of grinding ring-type is to form notch part 5.Now, the specific thickness below the target thickness as above the thickness of notch part 5 being made liner 4.
Discoid liner 4 is bonded to the central portion of PET base material 2.Herein, the diameter of liner 4 is set to the size engaged with the notch part 5 of the ring-type of above-mentioned formation.The circumference of this liner 4 is made to snap into the notch part 5 in template portion 3, template portion 3 to be bonded to the peripheral part of the bottom surface of PET base material 2.
By the manufacture method of the template assembly of the invention described above, the template assembly of the invention described above can be manufactured.
Embodiment
Below, represent embodiments of the invention and comparative example, to further illustrate the present invention, but the present invention is not limited to these examples.
(embodiment 1)
Manufacturing method according to the invention carrys out the template assembly of the present invention shown in shop drawings 1, and evaluates the depth accuracy of recess.The depth accuracy of recess evaluates relative to deviation in the skew of target depth and face.
By after near glass epoxy substrate polish to target thickness, use the slurries comprising the cerium oxide powder of about 1 μm to grind substrate, and be processed into the annular of given size.Then, by lathe, with the thickness identical with liner, be that ring-type forms notch part by the position grinding from interior thoughtful 5mm.
By bonding with the PET base material that central portion has been bonded with liner for the template portion made like this, to manufacture template assembly.
When measuring the degree of depth of recess of this template assembly, as shown in table 1, be-0.51 μm relative to the mean value (Ave) of the skew of target depth, maximum is on the occasion of side (Max) 4.8 μm, minus value side (Min) 6.5 μm.In the face of the degree of depth, deviation is as shown in table 2, and the mean value (Ave) of the scope (range) of 8 is 5.3 μm, and the maximum (Max) of scope is 7 μm.According to this result, compared to the result of aftermentioned comparative example 1,2, the depth accuracy of known recess is improved greatly.
Herein, the measurement of the degree of depth of recess is carried out as follows.As shown in figure 11, at face internal labeling 8 point of the 1 ~ 2mm from periphery (apart from periphery 1 ~ 2mm) of workpiece, the thickness (thickness of workpiece) of measurement markers part.This workpiece is being put into the recess of template assembly, and by 100g/cm
2load be applied to workpiece state under, the thickness of workpiece (workpiece portion thickness) of measurement markers part.In addition, the thickness (template portion thickness) from the inner circumferential in the template portion template portion of the position of circumferential direction 1 ~ 2mm is toward the outside measured.Use these measured values, utilize following mathematical expression to calculate the degree of depth of recess.The degree of depth of recess is representatively worth with the mean value of 8 and scope (range).
The degree of depth=template portion thickness-(the workpiece portion thickness-thickness of workpiece) of recess
In addition, thickness measure is the altimeter HDF-300N (model) that use three rich (ミ Star ト ヨ) manufactures.
Then, use and have the Silicon Wafer carrying out lapping diameter 300mm with the lapping device as shown in Figure 8 of the template assembly manufactured by embodiment 1, and have rated flatness and wafer surface defects.As the evaluation of flatness, employ edge turned-down edge measurement mechanism LER-310M (model) that Kobelco scientific research company (コ ベ Le コ scientific research society) manufactures and carry out turned-down edge measurement.
The Calculation Basis face of turned-down edge is set to the scope counting 3 ~ 6mm from periphery, and for 4 wafer, each measurement counts the turned-down edge of 0.5mm, 0.7mm, 1.0mm, 2.0mm position from periphery.
Represent the mean value of the turned-down edge of each point in table 3.In addition, Fig. 4 is shown in by the degree of depth of the recess of table 1 from the relation of the skew of desired value and the turned-down edge of table 3.As shown in Figure 4, the skew counted from desired value of the degree of depth of recess, it is the skew at minus value side (depth shallower of recess) counted from desired value, along with skew quantitative change is large, can reduce the reduction effect of the grinding pressure in the Workpiece periphery portion caused by template portion, the turned-down edge change of the position of 0.5mm from periphery being particularly easily subject to the impact of the degree of depth of recess is significant.
Represent the mean value (Ave) of the turned-down edge of each wafer of the position of 0.5mm from periphery, maximum (Max), minimum of a value (Min) in Figure 5.In addition, in the face representing the turned-down edge of each measuring position in figure 6, the respective position of 8 is the radar map how to change.
In embodiment 1, owing to can obtain the recess depths being substantially equal to target depth, therefore as shown in Figure 5, Figure 6, compared to comparative example 1 ~ 2 described later, turned-down edge is also improved, and in face, deviation is also significantly improved.
In addition, as shown in Figure 6, radar map becomes roughly concentric circles, changes in the known face that can suppress turned-down edge.
Fig. 7 represents the result of wafer surface defects.As shown in Figure 7, the known result compared to comparative example 3 described later, can suppress wafer surface defects.
In addition, the evaluation of blemish uses Lasertec company (レ ー ザ ー テ ッ Network society) Magics350 (model) that manufactures, evaluates the overall defect quantity of comparative example 1 as 1.0.
(embodiment 2)
Except the thickness in template portion being made thinner than the thickness of embodiment 1 10 μm, and the thickness of notch part being made beyond thinner than the thickness of liner 20 μm, manufacturing template assembly of the present invention in the same manner as in Example 1, and carrying out same evaluation.In addition, thin 10 μm of the Thickness Ratio embodiment 1 in the template portion of use, but owing to being come the circumference of compression gaskets by template portion, therefore the thickness of notch part is set as and makes applying 100g/cm to workpiece
2load state under recess depths and embodiment 1 roughly equal.
When measuring the degree of depth of recess of this template assembly, as shown in table 1, be-0.43 μm relative to the mean value of the skew of target depth, maximum is on the occasion of 2.0 μm, side, minus value side 2.8 μm.In the face of the degree of depth, deviation is as shown in table 2, and the mean value of the scope of 8 is 5.8 μm, and the maximum of scope is 7 μm.According to this result, compared to the result of comparative example 1,2 described later, the depth accuracy of known recess is improved greatly.
Then, use and have with the lapping device as shown in Figure 8 of the template assembly manufactured by embodiment 2, carry out the Silicon Wafer of lapping diameter 300mm, and have rated flatness and wafer surface defects similarly to Example 1.
As mentioned above, employ the template portion had with embodiment 1 different-thickness in example 2, but the degree of depth of recess is roughly equal, the turned-down edge of the wafer therefore after grinding also becomes equal result.Radar map according to Fig. 6, similarly to Example 1 known, can suppress to change in the face of turned-down edge.
Fig. 7 represents the result of wafer surface defects.As shown in Figure 7, the known result compared to comparative example 3 described later, can suppress wafer surface defects.
In embodiment 1 and embodiment 2, the turned-down edge of the wafer after grinding is phase same level, and in the face of turned-down edge, deviation is also phase same level.Namely, even if make the lower thickness in template portion as embodiment 2, if the thickness of adjustment notch part also can form the recess of target depth, even such as because the impact of the compression ratio of the abrasive cloth used, when causing the degree of depth of selected recess can make to reduce the slurries quantity delivered of crystal column surface during grinding, the thickness that also Thickness Ratio in template portion can be made in the past to need is thinner.Therefore, it is possible to while suppressing the reduction to the slurries quantity delivered of crystal column surface during grinding, improve turned-down edge and wafer surface defects.
(comparative example 1)
Use the template assembly that existing market is sold, when not carrying out the polish in template portion and grinding etc., carry out evaluation similarly to Example 1, as shown in Figure 9, its template portion is bonded in the peripheral part of the bottom surface of liner to this existing commercially available template assembly.
When measuring the degree of depth of recess of this template assembly, as shown in table 1, be-4.46 μm relative to the mean value of the skew of target depth, maximum is on the occasion of 11.0 μm, side, minus value side 16.9 μm.In the face of the degree of depth, deviation is as shown in table 2, and the mean value of the scope of 8 is 15.63 μm, and the maximum of scope is 26 μm.By this result, the known result compared to above-described embodiment 1,2, the depth accuracy of recess significantly worsens.
Then, use the lapping device as shown in Figure 8 possessing the template assembly of comparative example 1, carry out the Silicon Wafer of lapping diameter 300mm, and carry out evaluation similarly to Example 1.
In comparative example 1, as shown in table 1, table 2, compared to embodiment 1 ~ 2, the skew from desired value of the degree of depth of recess becomes large, and therefore turned-down edge also becomes large, and the deviation in face also becomes large.According to the radar map of Fig. 6, the turned-down edge of the known wafer had in face has skew.
In addition, Fig. 7 represents the result of wafer surface defects.As shown in Figure 7, in the template assembly that comparative example 1 uses, as shown in Figure 10, very close to each other between template portion and liner, therefore compared to the result of comparative example 3 described later, wafer surface defects is suppressed.
(comparative example 2)
Except carrying out the polish in template portion, use the template assembly same with comparative example 1, carry out same evaluation.
When measuring the degree of depth of recess of this template assembly, as shown in table 1, be-3.04 μm relative to the mean value of the skew of target depth, maximum is on the occasion of 8.9 μm, side, minus value side 10.9 μm.In the face of the degree of depth, deviation is as shown in table 2, and the mean value of the scope of 8 is 9.77 μm, and the maximum of scope is 16 μm.
Compared to above-mentioned comparative example 1, the polish by carrying out template portion can being seen, being improved depth accuracy, but compared to the result of above-described embodiment 1,2, the depth accuracy of known recess significantly worsens.
Then, use the lapping device as shown in Figure 8 possessing the template assembly of comparative example 2, carry out the Silicon Wafer of lapping diameter 300mm, evaluate flatness similarly to Example 1.
In comparative example 2, as shown in table 1, table 2, compared to comparative example 1, the skew from desired value of the degree of depth of recess diminishes, and therefore in turned-down edge and face, deviation improves further compared to comparative example 1, but compared to embodiment 1 ~ 2, is but significantly worsen.According to the radar map of Fig. 6, observe the skew of the turned-down edge in face same with comparative example 1, the known turned-down edge of periphery that can not suppress changes.
The skew from desired value of the degree of depth of recess, passes through the thickness of used all parts or the improvement of adhering method and can diminish, therefore as shown in comparative example 2, how much can improve the mean value of turned-down edge, but deviation in the face but can not improving turned-down edge.If in contrast, template assembly of the present invention, above-mentioned interior deviation can also be improved.
In Table 1, represent that the degree of depth of the recess of embodiment 1 ~ 2, comparative example 1 ~ 2 is whole relative to the remittance of the result of the skew of target depth.In the face that table 2 represents the degree of depth of the recess of embodiment 1 ~ 2, comparative example 1 ~ 2, the remittance of the result of deviation is whole.
(table 1)
| Comparative example 1 | Comparative example 2 | Embodiment 1 | Embodiment 2 | |
| N | 40 | 26 | 10 | 5 |
| Ave | -4.46 | -3.04 | -0.51 | -0.43 |
| S | 7.37 | 6.00 | 3.53 | 2.03 |
| Max | 11.0 | 8.9 | 4.8 | 2.0 |
| Min | -16.9 | -10.9 | -6.5 | -2.8 |
(table 2)
| Comparative example 1 | Comparative example 2 | Embodiment 1 | Embodiment 2 | |
| N | 40 | 26 | 10 | 5 |
| Ave | 15.63 | 9.77 | 5.30 | 5.80 |
| S | 4.91 | 2.67 | 1.64 | 1.30 |
| Max | 26.0 | 16.0 | 7.0 | 7.0 |
| Min | 8.0 | 6.0 | 2.0 | 4.0 |
(table 3)
(comparative example 3)
As shown in Figure 10, use the lapping device as shown in Figure 8 possessing existing template assembly, carry out the Silicon Wafer of lapping diameter 300mm, and deviation and wafer surface defects in the face evaluating recess depths similarly to Example 1, this existing template assembly does not have notch part in template portion.
Deviation in the face that consequently can obtain the recess depths equal with embodiment 1 ~ 2, but compared to embodiment 1 ~ 2 and comparative example 1, wafer surface defects but worsens.This blemish is considered to that cause because of the slurries gap entered between template portion and liner, send out dirt in grinding reason.
In addition, the present invention is not limited to above-mentioned embodiment.Above-mentioned embodiment illustrates, as long as have structure identical in fact with the technological thought described in claims of the present invention, and plays same purpose effect, and no matter whichever is included in technical scope of the present invention.
Claims (7)
1. a template assembly, it, is characterized in that in order to keep this workpiece when grinding work-piece,
There is PET base material; The template portion of ring-type, it is bonded in the peripheral part of the bottom surface of this PET base material; And discoid liner, it is bonded in the central portion of the bottom surface of described PET base material;
In the inner face in described template portion and the bottom surface of described liner, be formed and accommodate when grinding and to keep the recess of described workpiece;
Be formed with the notch part of ring-type on the inner face top in described template portion, have the circumference of described liner in the engaging of this notch part.
2. template assembly according to claim 1, is characterized in that, the thickness of described notch part is below the target thickness of described liner.
3. template assembly according to claim 1, is characterized in that, the material in described template portion is glass epoxy resin.
4. the template assembly according to any one of claims 1 to 3, is characterized in that, in the face of the degree of depth of described recess, deviation is below 10 μm.
5. a manufacture method for template assembly, it is the method for the template assembly manufactured according to any one of Claims 1 to 4, it is characterized in that having following operation:
Prepare the operation in the template portion of ring-type, the template portion of this ring-type is formed with the notch part of ring-type on inner face top;
Discoid liner is bonded to the operation of the central portion of PET base material; And
In the mode making the circumference of described liner snap into the notch part in described template portion, described template portion is bonded to the operation of the peripheral part of the bottom surface of described PET base material.
6. the manufacture method of template assembly according to claim 5, is characterized in that, in the operation preparing described template portion, prepare the substrate in template portion, after this prepared substrate cut is gone out ring-type, by the inner face top of the substrate of this ring-type of grinding, form described notch part.
7. the manufacture method of the template assembly according to claim 5 or 6, it is characterized in that, in the operation preparing described template portion, before the described notch part of formation, by polish and/or grind described template portion, deviation in the face of the thickness in described template portion is made less than 10 μm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013060418A JP5821883B2 (en) | 2013-03-22 | 2013-03-22 | Template assembly and method for manufacturing template assembly |
| JP2013-060418 | 2013-03-22 | ||
| PCT/JP2014/000997 WO2014147969A1 (en) | 2013-03-22 | 2014-02-26 | Template assembly and method for manufacturing template assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105102189A true CN105102189A (en) | 2015-11-25 |
| CN105102189B CN105102189B (en) | 2017-05-10 |
Family
ID=51579672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480016816.1A Active CN105102189B (en) | 2013-03-22 | 2014-02-26 | Template assembly and method for manufacturing template assembly |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160008947A1 (en) |
| JP (1) | JP5821883B2 (en) |
| KR (1) | KR102058923B1 (en) |
| CN (1) | CN105102189B (en) |
| DE (1) | DE112014001031T5 (en) |
| SG (1) | SG11201507321WA (en) |
| TW (1) | TWI577501B (en) |
| WO (1) | WO2014147969A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6398939B2 (en) | 2015-10-07 | 2018-10-03 | 信越半導体株式会社 | Method for measuring and evaluating template |
| JP6508003B2 (en) * | 2015-11-06 | 2019-05-08 | 信越半導体株式会社 | Method of manufacturing template assembly, polishing method using the template assembly, and template assembly |
| JP6394569B2 (en) * | 2015-11-06 | 2018-09-26 | 信越半導体株式会社 | Wafer polishing method and polishing apparatus |
| US20170252893A1 (en) * | 2016-03-03 | 2017-09-07 | P.R. Hoffman Machine Products Inc. | Polishing machine work piece holder |
| US10556317B2 (en) | 2016-03-03 | 2020-02-11 | P.R. Hoffman Machine Products Inc. | Polishing machine wafer holder |
| JP6508123B2 (en) | 2016-05-13 | 2019-05-08 | 信越半導体株式会社 | Method of sorting template assembly, method of polishing workpiece and template assembly |
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- 2014-02-26 WO PCT/JP2014/000997 patent/WO2014147969A1/en active Application Filing
- 2014-02-26 DE DE112014001031.6T patent/DE112014001031T5/en not_active Withdrawn
- 2014-02-26 CN CN201480016816.1A patent/CN105102189B/en active Active
- 2014-02-26 KR KR1020157025269A patent/KR102058923B1/en active IP Right Grant
- 2014-02-26 US US14/771,967 patent/US20160008947A1/en not_active Abandoned
- 2014-03-10 TW TW103108183A patent/TWI577501B/en active
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| JP2000233363A (en) * | 1999-02-16 | 2000-08-29 | Ebara Corp | Polishing device and method therefor |
| US20020173256A1 (en) * | 2001-05-02 | 2002-11-21 | Hitoshi Suwabe | Polishing machine |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20160008947A1 (en) | 2016-01-14 |
| SG11201507321WA (en) | 2015-10-29 |
| JP5821883B2 (en) | 2015-11-24 |
| DE112014001031T5 (en) | 2015-12-17 |
| KR102058923B1 (en) | 2019-12-24 |
| JP2014184511A (en) | 2014-10-02 |
| CN105102189B (en) | 2017-05-10 |
| TWI577501B (en) | 2017-04-11 |
| TW201505761A (en) | 2015-02-16 |
| WO2014147969A1 (en) | 2014-09-25 |
| KR20150133714A (en) | 2015-11-30 |
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