CN101934495A - Embedded retaining ring for chemical mechanical polishing - Google Patents
Embedded retaining ring for chemical mechanical polishing Download PDFInfo
- Publication number
- CN101934495A CN101934495A CN2010102420042A CN201010242004A CN101934495A CN 101934495 A CN101934495 A CN 101934495A CN 2010102420042 A CN2010102420042 A CN 2010102420042A CN 201010242004 A CN201010242004 A CN 201010242004A CN 101934495 A CN101934495 A CN 101934495A
- Authority
- CN
- China
- Prior art keywords
- ring
- retaining ring
- mechanical polishing
- annular groove
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 40
- 239000000126 substance Substances 0.000 title abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000007767 bonding agent Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of chemical mechanical polishing equipment, in particular to an embedded retaining ring for chemical mechanical polishing. A stiffening ring is a circular ring of which the axial section is rectangular or square; the annular groove on the upper surface of an elastic ring has same diameter with the rigid ring; the shape and the size of the axial sections are same; the rigid ring of the retaining ring is embedded into the annular groove in an embedded splicing mode, and adhesive is adopted for splicing. The invention has the advantages that the retaining ring adds splicing area and improves splicing strength; and because the adhesive is filled in the annular ring, a splicing seam is not on the side surface of the retaining ring. When in use, the invention avoids directly contacting with outside deionized water and chemical substances, such as polishing solution and the like, avoids corroding adhesive and prolongs the service life of the retaining ring. The invention is installed on the polishing head of the chemical mechanical polishing equipment, performs the action of containing and positioning wafers and is suitable for chemical mechanical polishing.
Description
Technical field
The present invention relates to the chemical-mechanical polisher technical field, the retaining ring that particularly a kind of embedded chemically mechanical polishing is used.
Background technology
When chemically mechanical polishing, wafer in the rubbing head clamping, and wafer is pressed on the polishing pad.Wafer is among polishing the time is contained in retaining ring on the rubbing head, and retaining ring plays a part to hold and locate wafer.In polishing process, polishing fluid with retaining ring contacts constantly, so retaining ring need have certain corrosion resistance with deionized water.
Existing retaining ring is will to bond together with the following ring 3 of going up ring 1 and making of elastomeric material that rigid material is made by specific bonding agent, its structure as depicted in figs. 1 and 2, Fig. 1 is the structural representation of existing retaining ring, and Fig. 2 is the schematic cross-section of existing retaining ring, and 2 is bonding agent among the figure.The ring 1 of going up of retaining ring is used for supporting the location, and the following ring 3 of retaining ring then directly contacts with polishing pad with silicon chip.It is in polishing process that there is greatest problem in existing retaining ring, bonding agent on the bonding plane directly contacts with chemical substances such as extraneous deionized water, polishing fluids, therefore behind general several thousand polishing cycles, because the corrosiveness of chemical solution, the bonding agent of bonding plane damages, two layers of material is thrown off up and down, has reduced the retaining ring life-span.
Summary of the invention
The object of the invention is for solving in the CMP process, retaining ring is two-part bonding plane and extraneous deionized water up and down, chemical substances such as polishing fluid are contact and the short problem of life-span that causes directly, the retaining ring that provides a kind of embedded chemically mechanical polishing to use, it is characterized in that, the retaining ring that embedded chemically mechanical polishing is used is by stiffening ring 4 and elastic ring 5 usefulness bonding agents 2 bonding forming, stiffening ring 4 is rectangle or foursquare annulus for axial cross section, the upper surface of stiffening ring 4 has locating hole and screwed hole, an annular groove is arranged on the upper surface of elastic ring 5, annular groove is identical with stiffening ring 4 diameters, the shape of axial cross section is all identical with size, stiffening ring 4 is embedded in the annular groove of elastic ring 5, three set of contact faces of stiffening ring 4 and annular groove, be the inner surface of stiffening ring 4 and the medial surface of annular groove, the outer surface of stiffening ring 4 and the lateral surface of annular groove, the lower surface of stiffening ring 4 and the bottom surface of annular groove all use bonding agent 2 bonding.
The material of described stiffening ring 4 is stainless steel, aluminium alloy or pottery.
The material of described elastic ring 5 is polytetrafluoroethylene (PTFE), polyphenylene sulfides, polyether-ether-ketone, poly terephthalic acid ethanol ester or poly terephthalic acid Aden ester.
Described bonding agent 2 is epoxy resin, epoxy-polyamide glue or polyurethane adhesive.
The lower surface of the retaining ring that embedded chemically mechanical polishing of the present invention is used by elastic ring contacts with polishing pad, locatees with rubbing head with screwed hole and is connected by the locating hole of stiffening ring upper surface.
The retaining ring that embedded chemically mechanical polishing is used adopts stiffening ring 4 and the elastic ring 5 that rigid material is embedded into the next bonding retaining ring of mode of elastomeric material, have three bonding planes, the bonding agent landfill does not directly contact with chemical substances such as extraneous deionized water, polishing fluids during use between the annular groove surface and stiffening ring 4 of elastic ring 5.
Beneficial effect of the present invention is: bonding agent did not directly contact with chemical substances such as the deionized water in the external world, polishing fluids when retaining ring that embedded chemically mechanical polishing is used was used, avoided the corrosion of chemical substance to bonding agent, solved existing retaining ring reduces adhesive strength because of external world's corrosion problem, also reduce the rigid body part of retaining ring and the possibility of elastomer portion disengagement, increased the service life of retaining ring; The existing retaining ring of contrast has only a bonding plane, the present invention adopts embedded adhering method, the retaining ring that embedded chemically mechanical polishing is used has three bonding planes, has increased bond area, has improved the bonding strength of retaining ring rigid body part and elastomer portion greatly.
Description of drawings
Fig. 1 is the structural representation of existing retaining ring;
Fig. 2 is the schematic cross-section of existing retaining ring;
The schematic cross-section of the retaining ring that Fig. 3 uses for embedded chemically mechanical polishing;
The structural representation of the retaining ring that Fig. 4 uses for embedded chemically mechanical polishing.
The specific embodiment
The invention will be further described below in conjunction with accompanying drawing:
As shown in Figure 3 and Figure 4, the retaining ring that embedded chemically mechanical polishing is used is made up of two parts, comprise stiffening ring 4 and elastic ring 5, with bonding agent 2 bonding forming, stiffening ring 4 is rectangle or foursquare annulus for axial cross section, the upper surface of stiffening ring 4 has locating hole and screwed hole, an annular groove is arranged on the upper surface of elastic ring 5, annular groove is identical with stiffening ring 4 diameters, the shape of axial cross section is all identical with size, stiffening ring 4 is embedded in the annular groove of elastic ring 5, and stiffening ring 4 is the inner surface of stiffening ring 4 and the medial surface of annular groove with three set of contact faces of annular groove, the outer surface of stiffening ring 4 and the lateral surface of annular groove, the lower surface of stiffening ring 4 and the bottom surface of annular groove are bonding with bonding agent 2.
Stiffening ring 4 usefulness rigid materials are made, and can be metal materials such as stainless steel, aluminium alloy, also can be pottery, and present embodiment adopts stainless steel material.Elastic ring 5 usefulness elastomeric materials are made, and can be plastics such as polytetrafluoroethylene (PTFE), polyphenylene sulfides, polyether-ether-ketone, poly terephthalic acid ethanol ester or poly terephthalic acid Aden ester, and present embodiment adopts polytetrafluoroethylene (PTFE).Bonding agent 2 is epoxy resin, epoxy-polyamide glue or polyurethane adhesive, and present embodiment adopts epoxy resin.Stiffening ring 4 and elastic ring 5 link together by embedded bonding method, and bonding agent 2 landfills are between two parts.
The annular groove of elastic ring 5, its bottom surface and two sides are formed three bonding planes bonding with stiffening ring 4; Stiffening ring 4 is embedded in the annular groove of elastic ring 5, and the upper surface of stiffening ring 4 and elastic ring is in same plane.
Principle of the present invention is: adopt embedded bonding mode that stiffening ring 4 and elastic ring 5 are linked together, bonding agent spreads upon on three bonding planes of stiffening ring 4 and elastic ring 5 landfill in the annular groove of elastic ring 5, and stiffening ring is embedded in the groove the inside of elastic ring, bond together by bonding agent, binding agent is epoxy resin, epoxy-polyamide glue or polyurethane adhesive.Retaining ring is located with rubbing head with screwed hole by the locating hole on stiffening ring 4 upper surfaces and is connected.In polishing process, retaining ring contacts with polishing pad by the lower surface of elastic ring, because the bonding agent landfill is in annular groove, cemented side seam is not in the side of retaining ring, avoided during use directly contacting with chemical substances such as the deionized water in the external world, polishing fluids, prevent corrosion, prolonged the service life of retaining ring bonding agent.
The present invention installs the rubbing head that is used for chemical-mechanical polisher, and when chemically mechanical polishing, wafer in the rubbing head clamping, and wafer is pressed on the polishing pad, and wafer is contained among the rubbing head when polishing.The present invention plays a part to hold and locate wafer, is applicable to chemically mechanical polishing.
Claims (4)
1. retaining ring that embedded chemically mechanical polishing is used, it is characterized in that, the retaining ring that embedded chemically mechanical polishing is used by stiffening ring (4) and elastic ring (5) with bonding the forming of bonding agent (2), stiffening ring (4) is rectangle or foursquare annulus for axial cross section, the upper surface of stiffening ring (4) has locating hole and screwed hole, an annular groove is arranged on the upper surface of elastic ring (5), annular groove is identical with stiffening ring (4) diameter, the shape of axial cross section is all identical with size, stiffening ring (4) is embedded in the annular groove of elastic ring (5), three set of contact faces of stiffening ring (4) and annular groove, be the inner surface of stiffening ring (4) and the medial surface of annular groove, the outer surface of stiffening ring (4) and the lateral surface of annular groove, the lower surface of stiffening ring (4) and the bottom surface of annular groove all use bonding agent (2) bonding.
2. the retaining ring of using according to the embedded chemically mechanical polishing described in the claim 1 is characterized in that, the material of described stiffening ring (4) is stainless steel, aluminium alloy or pottery.
3. the retaining ring of using according to the embedded chemically mechanical polishing described in the claim 1, it is characterized in that the material of described elastic ring (5) is polytetrafluoroethylene (PTFE), polyphenylene sulfides, polyether-ether-ketone, poly terephthalic acid ethanol ester or poly terephthalic acid Aden ester.
4. the retaining ring of using according to the embedded chemically mechanical polishing described in the claim 1 is characterized in that, described bonding agent (2) is epoxy resin, epoxy-polyamide glue or polyurethane adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102420042A CN101934495A (en) | 2010-07-30 | 2010-07-30 | Embedded retaining ring for chemical mechanical polishing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102420042A CN101934495A (en) | 2010-07-30 | 2010-07-30 | Embedded retaining ring for chemical mechanical polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101934495A true CN101934495A (en) | 2011-01-05 |
Family
ID=43388192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102420042A Pending CN101934495A (en) | 2010-07-30 | 2010-07-30 | Embedded retaining ring for chemical mechanical polishing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101934495A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103659548A (en) * | 2013-12-06 | 2014-03-26 | 清华大学 | Polishing head |
| CN105102189A (en) * | 2013-03-22 | 2015-11-25 | 信越半导体株式会社 | Template assembly and method for manufacturing template assembly |
| CN105922101A (en) * | 2016-06-20 | 2016-09-07 | 苏州华徕光电仪器有限公司 | Polishing device used for lens |
| CN108687657A (en) * | 2017-04-05 | 2018-10-23 | 中芯国际集成电路制造(北京)有限公司 | A kind of chemical-mechanical grinding device |
| CN109732473A (en) * | 2019-01-11 | 2019-05-10 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer slide holder and wafer charging crane |
| CN111318959A (en) * | 2020-04-16 | 2020-06-23 | 清华大学 | Retaining ring and carrier head for chemical mechanical polishing |
| CN111571427A (en) * | 2020-05-22 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN112621538A (en) * | 2020-12-15 | 2021-04-09 | 中国建筑材料科学研究总院有限公司 | Polishing method for harmonic oscillator shell end face |
| CN114147624A (en) * | 2021-11-02 | 2022-03-08 | 北京子牛亦东科技有限公司 | Check ring of grinding head for chemical mechanical grinding equipment |
| CN114178981A (en) * | 2021-12-20 | 2022-03-15 | 上海江丰平芯电子科技有限公司 | Retaining ring for chemical mechanical polishing and bonding method thereof |
| WO2024078547A1 (en) * | 2022-10-11 | 2024-04-18 | 丰凯利医疗器械(上海)有限公司 | Medical device assembly and method for connection of medical device assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050095964A1 (en) * | 2003-10-09 | 2005-05-05 | Hengel Raymond J.Jr. | Method and apparatus for two-part CMP retaining ring |
| CN2841245Y (en) * | 2003-04-30 | 2006-11-29 | 应用材料公司 | Two-part fixing-ring |
| KR20070000980U (en) * | 2007-08-16 | 2007-09-05 | (주)선일테크론 | Retainer ring structure for chemical-mechanical polishing machine |
| US20080261497A1 (en) * | 2005-08-12 | 2008-10-23 | Tsutomu Ichinoshime | Retainer Ring For Cmp Device |
| KR20090039123A (en) * | 2007-10-17 | 2009-04-22 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
| CN201249404Y (en) * | 2008-07-25 | 2009-06-03 | 孙建忠 | Grinding positioning ring |
-
2010
- 2010-07-30 CN CN2010102420042A patent/CN101934495A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2841245Y (en) * | 2003-04-30 | 2006-11-29 | 应用材料公司 | Two-part fixing-ring |
| US20050095964A1 (en) * | 2003-10-09 | 2005-05-05 | Hengel Raymond J.Jr. | Method and apparatus for two-part CMP retaining ring |
| US20080261497A1 (en) * | 2005-08-12 | 2008-10-23 | Tsutomu Ichinoshime | Retainer Ring For Cmp Device |
| KR20070000980U (en) * | 2007-08-16 | 2007-09-05 | (주)선일테크론 | Retainer ring structure for chemical-mechanical polishing machine |
| KR20090039123A (en) * | 2007-10-17 | 2009-04-22 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
| CN201249404Y (en) * | 2008-07-25 | 2009-06-03 | 孙建忠 | Grinding positioning ring |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105102189A (en) * | 2013-03-22 | 2015-11-25 | 信越半导体株式会社 | Template assembly and method for manufacturing template assembly |
| CN105102189B (en) * | 2013-03-22 | 2017-05-10 | 信越半导体株式会社 | Template assembly and method for manufacturing template assembly |
| CN103659548A (en) * | 2013-12-06 | 2014-03-26 | 清华大学 | Polishing head |
| CN105922101A (en) * | 2016-06-20 | 2016-09-07 | 苏州华徕光电仪器有限公司 | Polishing device used for lens |
| CN108687657A (en) * | 2017-04-05 | 2018-10-23 | 中芯国际集成电路制造(北京)有限公司 | A kind of chemical-mechanical grinding device |
| CN109732473A (en) * | 2019-01-11 | 2019-05-10 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer slide holder and wafer charging crane |
| CN111318959A (en) * | 2020-04-16 | 2020-06-23 | 清华大学 | Retaining ring and carrier head for chemical mechanical polishing |
| CN111318959B (en) * | 2020-04-16 | 2024-02-06 | 清华大学 | Retaining ring and carrier head for chemical mechanical polishing |
| CN111571427A (en) * | 2020-05-22 | 2020-08-25 | 宁波江丰电子材料股份有限公司 | Retaining ring |
| CN112621538A (en) * | 2020-12-15 | 2021-04-09 | 中国建筑材料科学研究总院有限公司 | Polishing method for harmonic oscillator shell end face |
| CN114147624A (en) * | 2021-11-02 | 2022-03-08 | 北京子牛亦东科技有限公司 | Check ring of grinding head for chemical mechanical grinding equipment |
| CN114178981A (en) * | 2021-12-20 | 2022-03-15 | 上海江丰平芯电子科技有限公司 | Retaining ring for chemical mechanical polishing and bonding method thereof |
| WO2024078547A1 (en) * | 2022-10-11 | 2024-04-18 | 丰凯利医疗器械(上海)有限公司 | Medical device assembly and method for connection of medical device assembly |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20110105 |