KR20070000980U - Retainer ring structure for chemical-mechanical polishing machine - Google Patents

Abstract

The present invention relates to a retainer ring structure for a chemical mechanical polishing apparatus, the ring structure, a plurality of bolt holes for coupling to the head of the chemical mechanical polishing apparatus is formed on the upper surface, the central groove portion of a predetermined depth is formed in the center Therefore, the upper ring of the metal material having a pair of edge protrusions naturally formed on the side of the center groove portion, and the coupling groove to which the upper ring is coupled is formed at the center, and the center protrusion inserted into the central groove portion of the upper ring is the coupling groove. It characterized in that it comprises a lower ring of the resin material formed in the center of the. In this case, it is preferable that coupling bolt holes are formed in the center protrusions of the upper ring and the lower ring so that the upper ring and the lower ring are coupled by the coupling bolt. According to the above configuration of the present invention, by hard and easy to combine the metal ring and the resin ring formed with the projection and the coupling groove can increase the strength of the ring structure and reduce the flatness time of the wafer while increasing the flatness. In addition, by preventing the force imbalance caused by the combination of the metal ring and the resin ring to prevent the occurrence of uneven wear to increase the durability, when the resin material is worn out, the metal part can be recycled.

Polishing device, wafer, retainer ring, coupling bolt, resin

Description

Retainer ring structure for chemical-mechanical polishing machine}

The present invention relates to a chemical-mechanical polishing (CMP) device, and more particularly, a resin ring and a metal ring as a retainer ring structure that fixes the position of a silicon wafer during the CMP process. The present invention relates to a retainer ring structure for a chemical-mechanical polishing apparatus that can be easily combined to reduce the mounting time of the retainer ring, as well as to maintain and increase the marketability.

In general, with the high speed and high integration of semiconductor devices, there is an increasing demand for increasing the number of wiring layers and miniaturization of wiring patterns in a multilayer wiring structure, so that multilayer wiring technology is an important problem in a submicron process.

In particular, as the process margin for the depth of focus of the exposure apparatus for realizing fine pattern formation is reduced in the process era of 0.35 μm or less, a wide area planarization technique over the chip region is required to secure sufficient depth of focus.

Therefore, a technique called chemical mechanical polishing (CMP) is widely used to realize wide-area flattening, and this technique is not only applied to a semiconductor device manufacturing process but also actively researched for next-generation devices. In addition, the above-described CMP technology is not only applied to logic devices that require multi-layer wiring in order to realize high speed, but also gradually applied to memory devices as they are multilayered.

In addition, a retainer ring is installed in the polishing head that fixes the wafer to perform a mechanical action in the CMP apparatus, and the retainer ring is used to fix the held position of the held wafer.

However, since the retainer ring is made of a plastic material such as plastic, it is not only weak in strength, but also increases the time required for flattening the ring itself before the CMP process, and uneven wear occurs due to an unbalanced force caused by the cover bolt tightening. There was a problem.

As a result, a ring made of a resin material such as metal and plastic is used, but the liquid slurry supplied for chemical polishing is not easily discharged from the retainer ring, so that surface scratches occur during wafer polishing, as well as the retainer ring. There was a problem that the surface scratches caused by the foreign matter caused by the internal cleaning of the difficulty.

Therefore, the present invention has been devised to solve the problems described above, and an object of the present invention is a retainer ring structure that fixes the position of a silicon wafer during the CMP process. Easily coupled to reduce the mounting time of the retainer ring, as well as to provide a retainer ring structure for the CMP device that can be easily maintained by the maintenance management.

This object is achieved by the present invention, and according to one aspect of the present invention, a retainer ring structure for a chemical mechanical polishing (CMP) device has a plurality of bolt holes formed on the upper surface thereof to be coupled to the head of the chemical mechanical polishing device. The upper ring of the metal material and the lower ring of the resin material formed in the center of the coupling groove to which the upper ring is coupled, wherein the upper surface of the upper ring is bonded by an adhesive so as to coincide with the upper surface of the lower ring in plan view. It features.

According to another aspect of the present invention, the retainer ring structure for a chemical mechanical polishing (CMP) device, the plurality of bolt holes for coupling to the head of the chemical mechanical polishing device is formed on the upper surface, the center groove portion of a predetermined depth in the center An upper ring formed of metal material having a pair of edge protrusions formed naturally on the side of the central groove portion thereof; And a lower ring of resin material formed at a center of the coupling groove to which the upper ring is coupled, and a central protrusion inserted into the center groove of the upper ring.

According to another aspect of the present invention, the upper ring and the central projection of the lower ring is formed with a coupling bolt hole in communication with each other is characterized in that the upper ring and the lower ring is coupled by a coupling bolt.

The present invention can increase the strength of the ring structure and reduce the flatness of the wafer by increasing the strength of the ring structure by easily and easily bonding the metal ring and the resin ring formed with the projection and the coupling groove formed according to the above configuration. In addition, by preventing the unbalance of force due to the combination of the metal ring and the resin ring to prevent the occurrence of uneven wear to increase the durability, when the resin material is worn, the effect of recycling the metal part occurs.

Hereinafter, in order to be described in detail so that those skilled in the art can easily implement the present invention, the most preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and also In describing the present invention, the same reference numerals will be used for the same parts throughout the drawings.

1 is a view schematically showing a shape of a retainer ring structure mounted on a CMP apparatus according to a preferred embodiment of the present invention, Figures 2 and 3 is a schematic view of a retainer ring structure according to a preferred embodiment of the present invention Exploded perspective view and sectional view.

As shown in the figure, the retainer ring structure according to the present invention shown by the reference numeral 10 will be described with reference to FIG.

First, the CMP apparatus is composed of a main body 108 and a polishing head 112, the main body 108 is a polishing platen 11 mounted on an upper surface and a polishing pad 106 provided on an upper surface of the polishing platen 110. ).

The polishing head 112 includes a retainer ring structure 10 for fixing the wafer 100, a polishing housing 102 and a rotating arm 104 on which the structure 10 is mounted, and the rotating arm 104. As a result, the polishing housing 102 rotates.

The polishing platen 110 is provided with a polishing pad 106 on the upper surface of which the surfaces of the wafer 100 are in contact with each other and is polished, and a rotating driving shaft 114 connected to the driving means is formed at the lower side thereof. The driving platen 110 is orbital (orbital) movement by the drive means.

As shown in FIGS. 2 and 3, the retainer ring structure 10 includes a metal upper ring 12 having a plurality of bolt holes 16 formed thereon for coupling to the head 112 of the chemical mechanical polishing apparatus. ) And a lower ring 22 of a resin material formed at the center of the coupling groove 18 to which the upper ring 12 is coupled, and an upper surface of the upper ring 12 is an upper surface of the lower ring 22. And bonded by an adhesive so as to coincide with the plane.

In this case, the lower ring 22 is typically made of a resin material having mechanical properties, chemical resistance, high heat resistance, and the like superior to metals and other materials.

4 and 5 are schematic exploded perspective view and cross-sectional view of the retainer ring structure according to another embodiment of the present invention.

As shown in the drawing, the retainer ring structure 30 according to FIGS. 4 and 5 has a lower ring of resin material having an upper ring 32 of a metal material and a coupling groove 38 to which the upper ring 32 is coupled ( 34).

The upper ring 32 has a plurality of bolt holes 50 formed on an upper surface thereof to be coupled to the head 112 of the chemical mechanical polishing apparatus, and a central groove portion 42 having a predetermined depth is formed at the center thereof. (42) It has a pair of edge protrusions 48 naturally formed in the side surface.

The lower ring 34 has a coupling groove 38 to which the upper ring 32 is coupled, and a central protrusion 36 inserted into the center groove 42 of the upper ring 32. It is formed in the center of the engaging groove 38.

The bolting process is performed to harden the coupling between the upper ring 32 and the lower ring 34, that is, the central projections 36 of the upper ring 32 and the lower ring 34 communicate with each other. The coupling bolt hole 40 is formed so that the upper ring 32 and the lower ring 34 are coupled by the coupling bolt 38.

1 is a view schematically showing the shape of the retainer ring structure mounted on the CMP apparatus according to an embodiment of the present invention.

2 and 3 are schematic exploded perspective and cross-sectional view of the retainer ring structure according to an embodiment of the present invention.

4 and 5 is a schematic exploded perspective view and cross-sectional view of the retainer ring structure according to another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

10,30: retainer ring structure, 12,32: upper ring,

16: bolt hole, 18: coupling groove,

22,34: lower ring, 36: center projection,

38: coupling bolt, 40: coupling bolt hole,

42: center groove, 48: projection,

50: bolt hole

Claims (3)

A retainer ring structure for a chemical mechanical polishing (CMP) device, The upper ring of the metal material formed on the upper surface of the plurality of bolt holes for coupling to the head of the chemical mechanical polishing apparatus and the lower ring of the resin material formed in the center of the coupling groove to which the upper ring is coupled, The upper surface is retaining structure for a chemical mechanical polishing apparatus, characterized in that bonded by the adhesive so as to coincide with the upper surface of the lower ring. A retainer ring structure for a chemical mechanical polishing (CMP) device, A top ring of metal material having a plurality of bolt holes formed on an upper surface thereof to be coupled to the head of the chemical mechanical polishing apparatus, and having a center groove portion having a predetermined depth at a center thereof, and having a pair of edge protrusions formed naturally on the side of the center groove portion; And A coupling groove to which the upper ring is coupled is formed at the center, and a central protrusion inserted into the central groove portion of the upper ring includes a lower ring of resin material formed at the center of the coupling groove. Retaining Structure. 3. The retainer ring of claim 2, wherein a coupling bolt hole is formed in the center protrusion of the upper ring and the lower ring, and the upper ring and the lower ring are coupled by the coupling bolt. structure.

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