TWI592257B - Retainer ring structure for chemical-mechanical polishing machine - Google Patents

Description

Buckle structure for chemical mechanical polishing device

The present invention relates to a chemical-mechanical polishing ("CMP") device, and more particularly to a resin material by a buckle structure for fixing the position of a wafer in a chemical mechanical polishing method. The ring structure of the chemical mechanical polishing device, which can be easily combined with the ring of the metal material, can be easily repaired and repaired, and the value of the product can be improved.

In general, with the increase in the speed and integration of semiconductor elements, in the multilayer wiring structure, the increase in the number of wiring layers and the refinement of the wiring pattern are becoming higher and higher, and the multilayer wiring technology becomes sub-micron. Important issues in the method.

In particular, as the method age of 0.35 μm or less is entered, the depth of focus method for the exposure apparatus for realizing fine pattern formation is gradually reduced, and in order to secure a sufficient depth of focus, a global planarization technique in the field of wafers is required.

Therefore, in order to achieve global planarization, a technique called chemical mechanical polishing (CMP) is widely used, which is widely used not only as a necessary technique for a semiconductor device manufacturing method, but also for its next-generation components. . And, on The chemical mechanical polishing technique is not only widely applied to a logic type element requiring multilayer wiring in order to achieve high speed of components, but also appears to be gradually applied as a result of multilayering in a memory type element.

Further, in the above chemical mechanical polishing apparatus, a buckle is attached to a polishing head for fixing a wafer for mechanical action, and such a buckle is used to fix the positioning of the wafer to be held.

However, the above-mentioned buckle is made of a synthetic resin material, and the strength is not only weak, but also the time required for the flattening operation of the ring itself which is performed before the chemical mechanical polishing method is long, and the force unevenness due to the tightening of the cap bolt is also unbalanced. And cause uneven wear.

Thus, although a ring made of a metal and a synthetic resin material is used, the liquid slurry supplied for chemical polishing cannot be easily discharged from the buckle, and not only surface scratching occurs when the wafer is polished ( Scratch, and the internal cleaning of the buckle is more difficult, and there is also the problem of surface scratches caused by foreign matter.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to provide a ring of a resin material and a ring of a metal material by a buckle structure for fixing a position of a silicon wafer in a chemical mechanical polishing method. The buckle structure for a chemical mechanical polishing device which can reduce the installation time of the buckle and can easily perform maintenance management, thereby improving the commercial value.

In order to achieve the above object, according to one embodiment of the present invention, chemistry A buckle structure for a mechanical polishing device, comprising: an upper ring of a metal material, on the upper surface, a plurality of bolt holes for combining with the head of the chemical mechanical polishing device, and a lower ring of a resin material are formed A coupling groove for coupling with the upper ring is formed at the center; the upper surface of the upper ring is combined with the upper surface of the edge of the lower ring to ensure uniformity in a plane.

According to still another embodiment of the present invention, preferably, a lower portion of the upper ring of the metal material is formed into a shape having a height difference, and the coupling groove coupled to a lower portion of the upper ring is formed to correspond to a lower portion of the upper ring. The height difference shape is combined by inserting or welding.

According to another embodiment of the present invention, a snap ring structure for a chemical mechanical polishing apparatus, comprising: an upper ring of a metal material, and a plurality of upper surfaces are formed for combining with the head of the chemical mechanical polishing apparatus; a bolt hole, and a central groove portion having a predetermined depth formed at a central portion of the upper ring, and having a pair of edge protrusions naturally formed on a side surface of the center groove portion; and a lower ring of a resin material, which is useful at the center A coupling groove that is coupled to the upper ring and a central protrusion that is inserted into the center groove portion of the upper ring is formed at a center portion of the coupling groove.

According to the above configuration of the present invention, the ring of the metal material having the projection formed at the lower portion and the ring of the resin material having the coupling groove combined with the projection are firmly and easily joined, thereby not only enhancing the strength of the ring structure, Reduces the flatness of the wafer and also improves flatness.

Moreover, by preventing the ring of the metal material and the ring of the resin material The resulting imbalance of forces prevents uneven wear, which not only enhances durability, but also re-uses metal parts in the event of wear of the resin material.

10, 30‧‧‧ buckle structure

12, 32‧‧‧ upper ring

16, 50‧‧‧ bolt holes

18‧‧‧ Combination slot

22, 34‧‧‧ lower ring

36‧‧‧Center protrusion

38‧‧‧ Combined bolt

40‧‧‧With bolt holes

42‧‧‧ center slot

48‧‧‧ Protrusion

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a state in which a buckle structure according to a preferred embodiment of the present invention is attached to a chemical mechanical polishing apparatus.

2 and 3 are a schematic exploded perspective view and a cross-sectional view showing a buckle structure according to a preferred embodiment of the present invention.

4 and 5 are a schematic exploded perspective view and a cross-sectional view showing a buckle structure according to still another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which FIG. Parts will use the same symbol.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a state in which a buckle structure according to a preferred embodiment of the present invention is attached to a chemical mechanical polishing apparatus, and as shown in the figure, the buckle structure of the present invention shown by the reference numeral 10 is as follows. .

First, the chemical mechanical polishing apparatus includes a body 108 including a polishing platen 110 mounted on the upper surface and a polishing pad 106 disposed on the upper surface of the polishing platen 110, and a polishing head 112.

The polishing head 112 described above includes a buckle structure for fixing the wafer 100 10 and a polishing cover 102 and a rotating arm 104 for mounting the above-described buckle structure 10, and the polishing cover 102 is rotated by the rotating arm 104.

The polishing platen 110 has a polishing pad 106 on its upper surface that is polished by the surface of the wafer 100, and a polishing drive shaft 114 connected to the driving device is formed under the polishing platen 110. The polishing platen 110 described above performs orbital motion.

As shown in FIGS. 2 and 3, the buckle structure 10 includes an upper ring 12 made of a metal material, and a plurality of upper surfaces 12 are combined with the head 112 of the chemical mechanical polishing apparatus. A bolt hole 16, and a lower ring 22 of a resin material, are formed at the center with a coupling groove 18 for coupling with the upper ring 12; an upper surface of the upper ring 12 and an upper surface of the lower ring 22 to ensure a plane A consistent approach is combined.

In this case, it is preferable that the lower ring 22 is made of a resin material which is generally superior in mechanical properties, chemical resistance, high heat resistance, and the like to metals and other substances.

Further, although not shown, those skilled in the art to which the present invention pertains can easily know that the lower portion of the upper ring 12 of the metal material is formed into a shape having a height difference, and the above-described lower portion of the upper ring 12 is combined with the above. The coupling groove 18 is formed in a height difference shape corresponding to the lower portion of the upper ring 12 described above, and is joined by inserting or welding.

Further, a male thread is formed in a lower portion of the upper ring 12 of the metal material, and an inner side wall of the coupling groove 18 coupled to a lower portion of the upper ring 12 is formed with a female thread, and the upper ring 12 is threaded with the lower ring 22 Combine.

4 and 5 are a schematic exploded perspective view and a cross-sectional view showing a buckle structure according to still another embodiment of the present invention.

The buckle structure 30 according to Figs. 4 and 5, as shown, includes an upper ring 32 of a metallic material and a lower ring 34 of a resin material having a coupling groove 18 joined to the upper ring 32.

The upper ring 32 is formed with a plurality of bolt holes 50 for coupling with the head portion 112 of the chemical mechanical polishing apparatus, and a central groove portion 42 having a predetermined depth is formed at a central portion of the upper ring 32, and has A pair of edge protrusions 48 are naturally formed on the side surface of the center groove portion 42.

Further, the lower ring 34 has a coupling groove 18 for coupling with the upper ring 32 at its center, and a central projection 36 that is inserted into the center groove portion 42 of the upper ring 32 is formed at a central portion of the coupling groove 18.

Further, in order to more firmly bond the upper ring 32 and the lower ring 34, a bolting process is performed, that is, a coupling bolt hole 40 that communicates with each other is formed in the center ring portion 36 of the upper ring 32 and the lower ring 34. The upper ring 32 and the lower ring 34 are combined by the bolts 38.

The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the spirit and scope of the invention. Therefore, such modifications or modifications are considered to fall within the scope of the patent application.

18‧‧‧ Combination slot

30‧‧‧ buckle structure

32‧‧‧ Upper ring

34‧‧‧Lower ring

38‧‧‧ Combined bolt

40‧‧‧With bolt holes

50‧‧‧Bolt holes

Claims (1)

A buckle structure for a chemical mechanical polishing device, comprising: an upper ring of a metal material, on the upper surface, a plurality of bolt holes for combining with a head of the chemical mechanical polishing device, and a resin material The lower ring is formed at the center with a coupling groove for coupling with the upper ring; the upper surface of the upper ring is combined with the upper surface of the edge of the lower ring to ensure uniformity in a plane, and the upper ring of the metal material is The lower portion is formed into a shape having a height difference, and the coupling groove coupled to the lower portion of the upper ring is formed in a height difference shape corresponding to a lower portion of the upper ring, and is joined by inserting or welding.