KR20090123043A - Retainer ring structure for chemical-mechanical polishing machine - Google Patents

Abstract

PURPOSE: A retainer ring structure for a chemical-mechanical polishing machine is provided to suppress the corrosion of bolts coupled to a head of a polishing tool by attaching an inner metal ring and an outer resin ring. CONSTITUTION: A retainer ring structure for a chemical-mechanical polishing machine comprises an inner ring(12) of metal material, an outer ring(14) of resin material, and bushings(18) of metal material. The inner metal ring has bolt holes for attachment to the head of a polishing tool. The outer resin ring surrounds the inner ring so that the top of the bolt holes are exposed outside. The metal bushings are mounted on the perimeter of the bolt holes. The metal material for the inner ring is one of Steel Use Stainless 303, STS304, S45, SS41, and Al.

Description

Retainer ring structure for chemical-mechanical polishing machine}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical mechanical polishing (CMP) apparatus, and more particularly, a metal and resin ring of a retainer ring structure that fixes a position of a silicon wafer during a CMP process. The retainer ring structure for CMP devices can be easily and tightly combined to increase the maintenance of flatness and reduce the mounting time of the retainer ring as well as to improve the durability due to the corrosion of the bolts mounted on the head. It is about.

In general, with the high speed and high integration of semiconductor devices, there is an increasing demand for increasing the number of wiring layers and miniaturization of wiring patterns in a multilayer wiring structure, so that multilayer wiring technology is an important problem in a submicron process.

In particular, as the process era of 0.35 μm or less is reduced, a process margin for the depth of focus of an exposure apparatus for realizing fine pattern formation is reduced, and a wide area planarization technique is required to secure a sufficient depth of focus.

Therefore, a technique called chemical mechanical polishing (CMP) is widely used to realize wide-area flattening, and this technique is not only applied to a semiconductor device manufacturing process but also actively researched for next-generation devices. In addition, the above-described CMP technology is not only applied to logic devices that require multi-layer wiring in order to realize high speed, but also gradually applied to memory devices as they are multilayered.

In addition, a retainer ring is installed in the polishing head that fixes the wafer to perform a mechanical action in the CMP apparatus, and the retainer ring is used to fix the held wafer in position.

However, the retainer ring is made of plastic, which is only made of resin, so that the strength of the retainer ring is not only weak, but also increases the time required for the planarization of the ring itself before the CMP process, and uneven wear occurs due to the unbalance of the force of the cover bolt. There was a problem.

As a result, a ring made of a resin material such as metal and plastic is used, but the liquid slurry supplied for chemical polishing is not easily discharged from the retainer ring, so that surface scratches occur during wafer polishing, as well as the retainer ring. There was a problem that the surface scratches caused by the foreign matter caused by the internal cleaning of the difficulty.

In addition, it is difficult to combine the metal ring and the resin ring, and thus workability is reduced, and bonding or welding is used at the time of joining, but the function is inferior and uneven bonding causes uneven wear.

Accordingly, the present invention has been made to solve the problems described above, the object of the present invention is to maintain the flatness by easily and tightly bonding the ring of the metal and resin material of the retainer ring structure with each other and the mounting of the retainer ring The present invention provides a retainer ring structure for a CMP device that not only reduces time but also improves durability due to corrosion of bolts mounted to the head, thereby increasing the marketability.

This object is achieved by the present invention, and in accordance with one aspect of the present invention, a retainer ring structure for a chemical mechanical polishing (CMP) device includes a plurality of bolt holes penetrating up and down for coupling to a head of the chemical mechanical polishing device. And a metal ring mounted on the outer periphery of the bolt hole, a metal ring mounted on the outer periphery of the bolt hole formed by enclosing the metal ring formed by the metal ring, the upper surface of the plurality of bolt holes formed in the internal ring, and being exposed to the outside. It includes.

At this time, the inner ring and the outer ring further comprises a plurality of through slits formed through the side.

And the metal material of the built-in ring is made of any one of STS303, STS304, S45, SS41, Al, the bushing is preferably made of any one of STS316 and STS316L.

According to the configuration as described above, by maintaining the flatness of the retainer ring and the mounting time of the retainer ring by easily and tightly bonding the ring of the metal and the resin material to each other easily and tightly according to the corrosion of the bolt mounted to the head Improved durability and easy maintenance and maintenance has the effect of increasing the marketability.

DETAILED DESCRIPTION Hereinafter, the most preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the present invention. In describing the present invention, the same reference numerals will be used for the same parts throughout the drawings.

1 is a schematic view of a CMP apparatus according to a preferred embodiment of the present invention, Figure 2 is a schematic perspective view of a retainer ring structure according to a preferred embodiment of the present invention, Figures 3a and 3b is FIG. Sectional views taken along lines AA and BB of the retainer ring structure according to FIG.

As shown in the figure, the retainer ring structure according to the present invention shown by the reference numeral 10 will be described with reference to FIG.

First, the CMP apparatus is composed of a main body 108 and a polishing head 112, the main body 108 is a polishing platen 11 mounted on an upper surface and a polishing pad 106 provided on an upper surface of the polishing platen 110. ).

The polishing head 112 includes a retainer ring structure 10 for fixing the wafer 100, a polishing housing 102 and a rotating arm 104 on which the structure 10 is mounted, and the rotating arm 104. As a result, the polishing housing 102 rotates.

The polishing platen 110 is provided with a polishing pad 106 on the upper surface of which the surfaces of the wafer 100 are in contact with each other and is polished, and a rotating driving shaft 114 connected to the driving means is formed at the lower side thereof. The driving platen 110 is orbital (orbital) movement by the drive means.

The retainer ring structure 10 is composed of an inner ring 12 of a metal material and an outer ring 14 of a resin material bonded to the inner ring 12 as shown in FIGS. 2 and 3A and 3B.

The inner ring 12 is formed by a plurality of bolt holes 16 to be coupled to the polishing head 112 up and down, and the outer ring 14 of the resin material is formed in the inner ring 12 The inner surface of the bolt hole 16 is formed to surround the inner ring 12 so as to be exposed to the outside.

At this time, the bushing (18) of the metal material is mounted on the outer periphery of the bolt hole (16). The mounting of the bushing (18) can be easily understood by those skilled in the art that it is possible to use a welding, bonding and indentation process. will be.

In addition, it further includes a plurality of through slits 20 formed by penetrating the inner ring 12 and the outer ring 14 laterally, which are formed to provide easy discharge of the slurry generated during processing of the wafer.

In this case, the outer ring 14 is typically made of a resin material having mechanical properties, chemical resistance, and high temperature resistance characteristics superior to those of metals and other materials. For example, polyether ether ketone (PEEK), Polyethylene (POM), Polybutylene terephthalate (PBT), Polyphenylene sulfide (PPS), Polyamideimide (PAI), Polyimide (PI), Polypropylene (PP), Polyethylene (PE), Polybenzimidazole It is preferable to use any one of (PBI), acetal, polycarbonate, polyetherimide (PEI), LL5, XF1, PVC, or a mixture thereof.

And the metal material of the inner ring 12 is STS (steel use stainless) (Korea KS standard) 303, STS304, S45C (medium carbon steel, 0.45% average carbon steel), SS41 (tension strength of 41 kg / mm2 or more in general Structural rolled steel) and Al, and the bushing 18 is preferably made of any one of STS316 and STS316L (steel containing less carbon than STS316) having strong chemical resistance.

4 is a cross-sectional view illustrating main parts of a retainer ring structure with a bushing according to another embodiment of the present invention.

Bushing 30 in the embodiment according to Figure 4 is to form a jaw portion at a certain outer portion such that the formation of the jaw is to facilitate the coupling of the built-in ring 12 and the bushing 30 of different materials other than this The configuration of is the same as the embodiment according to Figures 3a and 3b it will be omitted below.

It is apparent to those skilled in the art that the present invention is not limited to the described embodiments, and that various modifications and changes can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a view schematically showing a CMP apparatus according to an embodiment of the present invention.

2 is a schematic perspective view of a retainer ring structure in accordance with a preferred embodiment of the present invention.

3a and 3b a sectional view taken along lines A-A and B-B of the retainer ring structure according to FIG. 2;

4 is a cross-sectional view of a main portion of a retainer ring structure equipped with a bushing according to another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

10: retainer ring structure, 12: built-in ring,

14: outer ring, 16: bolt holes,

18,30 bushing, 20 through slit,

22: groove,

Claims (5)

A retainer ring structure for a chemical mechanical polishing (CMP) device, A metal ring having a plurality of bolt holes penetrated up and down to be coupled to the head of the chemical mechanical polishing apparatus; An outer ring formed of a resin material formed to surround the inner ring so that upper surfaces of the plurality of bolt holes formed in the inner ring are exposed to the outside; And And a bushing of a metal material mounted on an outer periphery of said bolt hole. 2. The retainer ring structure of claim 1, further comprising a plurality of through slits formed through the interior ring and the exterior ring from side to side. The retainer ring structure for chemical mechanical polishing apparatus according to claim 1, wherein the metal material of the internal ring is made of any one of STS303, STS304, S45, SS41, and Al. 2. The retainer ring structure of claim 1, wherein the bushing is made of any one of STS316 and STS316L. 2. A retainer ring structure for a mechanical mechanical polishing machine according to claim 1, wherein the bushing has a tuck at an outer side of the bushing.

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