KR20100012719U - retainer ring structure for chemical-mechanical polishing machine - Google Patents

Abstract

The present invention relates to a retainer ring structure for a chemical mechanical polishing apparatus (CMP), the structure comprising a main ring having a plurality of bolt holes in the upper surface for coupling to the head of the chemical mechanical polishing apparatus, and an upper portion of the main ring The lower ring having a plurality of incisions formed by being spaced apart by a predetermined distance from the auxiliary ring is formed along the periphery of the edge of the main ring as a border, and is formed to be developed downward downward from the bottom of the main ring and cut at radial equal intervals. It is integrally formed with ash. In this case, it is preferable to attach the outer surface of the auxiliary ring with a silicon pad, and a slip pad is filled in the groove formed between the upper part of the main ring and the auxiliary ring. According to the above configuration, the lower part of the retainer ring structure is formed at the radial equal intervals so as to not only easily discharge the slurry but also to form the resin material integrally to reduce the mounting time of the retainer ring There is an effect that can increase the commerciality by improving the properties and reducing the defective rate.

Polishing device, retainer ring, wafer, resin material, silicon

Description

Retainer ring structure for chemical-mechanical polishing machine}

The present invention relates to a retainer ring structure for a chemical-mechanical polishing (CMP) device, and more particularly, to a radial portion of the retainer ring structure that fixes the position of a silicon wafer during the CMP process. CMP device that can not only easily discharge the slurry by forming the cutouts at equal intervals but also consist of resin material to be integrated to reduce the mounting time of the retainer ring to improve the workability and reduce the defective rate to increase the commerciality A retainer ring structure.

In general, with the high speed and high integration of semiconductor devices, there is an increasing demand for increasing the number of wiring layers and miniaturization of wiring patterns in a multilayer wiring structure, so that multilayer wiring technology is an important problem in a submicron process.

In particular, as the process era of the exposure apparatus for realizing fine pattern formation is reduced as the process era of 0.35 μm or less is reduced, a wide area planarization technique over the chip region is required to secure a sufficient depth of focus.

Therefore, a technique called chemical mechanical polishing (CMP) is widely used to realize wide-area flattening, and this technique is not only applied to a semiconductor device manufacturing process but also actively researched for next-generation devices. In addition, the above-described CMP technology is not only applied to logic devices that require multi-layer wiring in order to realize high speed, but also gradually applied to memory devices as they are multilayered.

In addition, a retainer ring is installed in the polishing head that fixes the wafer to perform a mechanical action in the CMP apparatus, and the retainer ring is used to fix the held wafer in position.

As a result, the ring made of recyclable metals and plastics is widely used, but the liquid slurry supplied for chemical polishing cannot be easily discharged from the retainer ring, resulting in surface scratches during wafer polishing. In addition to the occurrence of the surface scratches caused by the foreign matter generated by the internal cleaning of the retainer ring is difficult.

In addition, it is difficult to combine the metal ring and the resin ring, and thus workability is reduced, and bonding or welding is used at the time of joining, but the function is inferior and uneven bonding causes uneven wear.

Therefore, the present invention is devised to solve the problems as described above, the object of the present invention is to form a cutout at radial equal intervals in the lower portion of the retainer ring structure to easily discharge the slurry as well as the resin material The present invention provides a retainer ring structure for a CMP apparatus that can be integrated to reduce the mounting time of the retainer ring, thereby improving the workability and reducing the defective rate, thereby increasing the marketability.

This object is achieved by the present invention, and according to one aspect of the present invention, a retainer ring structure for a chemical mechanical polishing apparatus (CMP) has a plurality of bolt holes formed on an upper surface thereof to be coupled to a head of the chemical mechanical polishing apparatus. A main ring, an auxiliary ring spaced apart by a predetermined distance from an upper portion of the main ring, and formed as an edge along an edge of the main ring; A lower ring having a plurality of cutouts is integrally formed of a resin material.

In this case, it is preferable to attach the outer surface of the auxiliary ring with a silicon pad, and a slip pad is filled in the groove formed between the upper part of the main ring and the auxiliary ring.

According to the above configuration, the lower part of the retainer ring structure is formed at the radial equal intervals so as to not only easily discharge the slurry but also to form the resin material integrally to reduce the mounting time of the retainer ring There is an effect that can improve the productability by improving the properties and reducing the defective rate.

Hereinafter, in order to be described in detail so that those skilled in the art can easily implement the present invention, the most preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, and also In describing the present invention, the same reference numerals will be used for the same parts throughout the drawings.

1 is a schematic view showing a CMP apparatus according to an embodiment of the present invention, Figure 2 is a schematic plan perspective view of a retainer ring structure according to an embodiment of the present invention, Figure 3 is a retainer according to 2 Back perspective view of the ring structure.

As shown in the figure, the retainer ring structure according to the present invention shown by the reference numeral 10 will be described with reference to FIG.

First, the CMP apparatus is composed of a main body 108 and a polishing head 112, the main body 108 is a polishing platen 11 mounted on an upper surface and a polishing pad 106 provided on an upper surface of the polishing platen 110. ).

The polishing head 112 includes a retainer ring structure 10 for fixing the wafer 100, a polishing housing 102 and a rotating arm 104 on which the structure 10 is mounted, and the rotating arm 104. As a result, the polishing housing 102 rotates.

The polishing platen 110 is provided with a polishing pad 106, the surface of the wafer 100 is in contact with each other on the upper surface of the polishing plate, the rotating drive shaft 114 is connected to the driving means is formed on the lower side By the driving means, the polishing platen 110 is to orbital (orbital) movement.

As shown in FIGS. 2 and 3, the retainer ring structure 10 includes a main ring 12 having a plurality of bolt holes 16 formed thereon to be coupled to the head 112 of the chemical mechanical polishing apparatus. , An auxiliary ring 14 and a lower ring 18.

The auxiliary ring 14 is spaced apart from the upper portion of the main ring 12 by a predetermined distance to form a border around the edge of the main ring 12, the lower ring 18 is the main ring 12 Is formed to be deployed downward from the bottom of the plurality of incisions 20 are formed by cutting at radial intervals.

At this time, the main ring 12, the auxiliary ring 14 and the lower ring 18 are integrally formed with a resin material.

In addition, it is attached to the outer surface of the auxiliary ring 14 with a silicon pad (not shown), which not only prevents the up and down rocking of the retainer ring structure 10, but also serves to suppress the generation of foreign substances due to the planarization process. do.

In addition, the groove portion 22 formed between the upper portion of the main ring 12 and the auxiliary ring 14 is preferably filled with a slip pad to make a smoother flattening process.

It is apparent to those skilled in the art that the present invention is not limited to the embodiments described, and that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, such modifications or modifications will have to belong to the utility model registration claims of the present invention.

1 is a view schematically showing a CMP apparatus according to an embodiment of the present invention.

Figure 2 is a schematic plan perspective view of the retainer ring structure according to an embodiment of the present invention.

3 is a rear perspective view of the retainer ring structure according to FIG. 2;

* Description of the symbols for the main parts of the drawings *

10: retainer ring structure, 12: main ring,

14: secondary ring, 16: bolt hole,

18: lower ring, 20: incision,

22: groove

Claims (3)

In the retainer ring structure for a chemical mechanical polishing apparatus (CMP), A main ring having a plurality of bolt holes formed on an upper surface thereof to be coupled to the head of the chemical mechanical polishing apparatus, an auxiliary ring spaced apart by a predetermined distance from an upper portion of the main ring, and formed as an edge around an edge of the main ring; Retainer ring structure for a chemical mechanical polishing apparatus, characterized in that the lower ring is formed by unfolding downward from the lower portion of the main ring, the lower ring having a plurality of incisions formed by cutting at radial equal intervals integrally made of a resin material. 2. A retainer ring structure for a chemical mechanical polishing apparatus according to claim 1, wherein a silicon pad is attached to an outer surface of the auxiliary ring. 2. The retainer ring structure of claim 1, wherein a groove formed between an upper portion of the main ring and the auxiliary ring is filled with a slip pad.

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