CN108687657A - A kind of chemical-mechanical grinding device - Google Patents
A kind of chemical-mechanical grinding device Download PDFInfo
- Publication number
- CN108687657A CN108687657A CN201710217706.7A CN201710217706A CN108687657A CN 108687657 A CN108687657 A CN 108687657A CN 201710217706 A CN201710217706 A CN 201710217706A CN 108687657 A CN108687657 A CN 108687657A
- Authority
- CN
- China
- Prior art keywords
- chemical
- agent structure
- mechanical grinding
- grinding device
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Abstract
The present invention relates to a kind of chemical-mechanical grinding devices.The chemical-mechanical grinding device includes at least grinding head, and the grinding head includes the locating ring for stationary grinder part;Wherein, the locating ring includes agent structure and bonds the location structure being integrated in the agent structure and with the agent structure, and the protrusion and recess of the cutting ferrule setting being mutually matched are formed between the agent structure and the location structure.It can so that cutting ferrule performance is more preferable between the agent structure and location structure by the setting of the protrusion and recess, it keeps stablizing under pressure that can be in all directions, effective the problem of preventing layering viscose glue splitting, the scratch of chip occurs to reduce CMP machine platform, and influences the risk of product yield.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of chemical-mechanical grinding device.
Background technology
Chemical mechanical grinding is a kind of common method for realizing surface global planarization, is chemical attack effect and machine
Tool removal acts on the processing technology being combined.The method of existing chemical mechanical grinding is usually that substrate is clamped in grinding head
On, and certain pressure is applied to substrate by grinding head, so that it is rotated and is ground on abrasive disk under the drive of grinding head.
Wherein, grinding head is the major part of chemical-mechanical grinding device, wherein in the grinding head substrate periphery
It would generally be provided with locating ring (retaining ring), wherein the locating ring is usually by High performance plastic resin and stainless
Steel part is integrated by adhesive glue bonding, but since constantly by high temperature, chemistry is rotten during chemical mechanical grinding
The influences such as erosion, once adhesive glue is damaged, it is easy to and it splits on grinding pad, causes the scratch of chip, influence product yield.
Therefore, it is necessary to a kind of chemical-mechanical grinding device be proposed, to solve problems of the prior art.
Invention content
A series of concept of reduced forms is introduced in Summary, this will in the detailed description section into
One step is described in detail.The Summary of the present invention is not meant to attempt to limit technical solution claimed
Key feature and essential features do not mean that the protection domain for attempting to determine technical solution claimed more.
In order to overcome the problems, such as presently, there are, the present invention provides a kind of chemical-mechanical grinding device, the chemical machinery
Milling apparatus includes at least grinding head, and the grinding head includes the locating ring for stationary grinder part;
Wherein, the locating ring includes agent structure and is bonded as in the agent structure and with the agent structure
The location structure of one, one in the agent structure, the location structure is provided with protrusion, another is provided with recess,
The protrusion is mutually matched with recess and cutting ferrule is arranged.
Optionally, it is integrated by adhesive glue bonding between the agent structure and the location structure.
Optionally, it is provided with the recess in the agent structure, the protrusion is provided on the location structure.
Optionally, several spaced recess are provided in the agent structure, on the location structure
It is provided with several spaced protrusions.
Optionally, the recess, raised side wall are vertical.
Optionally, it is provided with the protrusion in the agent structure, the recess is provided on the location structure.
Optionally, the protrusion is along towards the cone become larger in width on the direction of the location structure.
Optionally, the locating ring is equipped with groove, and for accommodating wafer to be ground, the opening of the groove is set the groove
It sets on the surface of the location structure, and the groove is extended to from the surface in the agent structure.
Optionally, the material of the location structure includes thermoplastic resin.
In order to solve the problems in the existing technology the present invention, provides a kind of chemical-mechanical grinding device, described
Locating ring described in chemical-mechanical grinding device include agent structure and in the agent structure and with the agent structure
The location structure being integrated is bonded, the cutting ferrule setting being mutually matched is formed between the agent structure and the location structure
Protrusion and recess.It can make cutting ferrule performance between the agent structure and location structure by the setting of the protrusion and recess
More preferably, the problem of keeping stablizing under pressure that can be in all directions, effectively preventing layering viscose glue splitting, to reduce CMP
The scratch of chip occurs for board, and influences the risk of product yield.
Description of the drawings
The following drawings of the present invention is used to understand the present invention in this as the part of the present invention.Shown in the drawings of this hair
Bright embodiment and its description, principle used to explain the present invention.
In attached drawing:
Fig. 1 is the structural schematic diagram of the grinding head of chemical-mechanical grinding device according to an embodiment of the invention;
Fig. 2 is the structural schematic diagram of the locating ring of chemical-mechanical grinding device according to an embodiment of the invention;
Fig. 3 is the structural schematic diagram of the locating ring of chemical-mechanical grinding device according to another embodiment of the present invention.
Specific implementation mode
In the following description, a large amount of concrete details are given in order to provide more thorough understanding of the invention.So
And it is obvious to the skilled person that the present invention may not need one or more of these details and be able to
Implement.In other examples, in order to avoid with the present invention obscure, for some technical characteristics well known in the art not into
Row description.
It should be understood that the present invention can be implemented in different forms, and should not be construed as being limited to propose here
Embodiment.Disclosure will be made thoroughly and complete on the contrary, providing these embodiments, and will fully convey the scope of the invention to
Those skilled in the art.In the accompanying drawings, for clarity, the size and relative size in the areas Ceng He may be exaggerated.From beginning to end
Same reference numerals indicate identical element.
It should be understood that when element or layer be referred to as " ... on ", " with ... it is adjacent ", " being connected to " or " being coupled to " it is other
When element or layer, can directly on other elements or layer, it is adjacent thereto, be connected or coupled to other elements or layer, or
There may be elements or layer between two parties by person.On the contrary, when element is referred to as " on directly existing ... ", " with ... direct neighbor ", " directly
It is connected to " or " being directly coupled to " other elements or when layer, then element or layer between two parties is not present.It should be understood that although can make
Various component, assembly units, area, floor and/or part are described with term first, second, third, etc., these component, assembly units, area, floor and/
Or part should not be limited by these terms.These terms be used merely to distinguish a component, assembly unit, area, floor or part with it is another
One component, assembly unit, area, floor or part.Therefore, do not depart from present invention teach that under, first element discussed below, portion
Part, area, floor or part are represented by second element, component, area, floor or part.
Spatial relationship term for example " ... under ", " ... below ", " below ", " ... under ", " ... it
On ", " above " etc., herein can for convenience description and being used describe an elements or features shown in figure with
The relationship of other elements or features.It should be understood that other than orientation shown in figure, spatial relationship term intention further includes making
With the different orientation with the device in operation.For example, if the device in attached drawing is overturn, then, it is described as " under other elements
Face " or " under it " or " under it " elements or features will be oriented in other elements or features "upper".Therefore, exemplary art
Language " ... below " and " ... under " it may include upper and lower two orientations.Device can additionally be orientated (be rotated by 90 ° or its
It is orientated) and spatial description language as used herein correspondingly explained.
The purpose of term as used herein is only that description specific embodiment and not as the limitation of the present invention.Make herein
Used time, " one " of singulative, "one" and " described/should " be also intended to include plural form, unless context is expressly noted that separately
Outer mode.It is also to be understood that term " composition " and/or " comprising ", when being used in this specification, determines the feature, whole
The presence of number, step, operations, elements, and/or components, but be not excluded for one or more other features, integer, step, operation,
The presence or addition of component, assembly unit and/or group.Herein in use, term "and/or" includes any of related Listed Items and institute
There is combination.
It describes to send out herein with reference to the cross-sectional view of the schematic diagram of the desirable embodiment (and intermediate structure) as the present invention
Bright embodiment.As a result, it is contemplated that due to caused by such as manufacturing technology and/or tolerance from the variation of shown shape.Therefore,
The embodiment of the present invention should not necessarily be limited to the specific shape in area shown here, but include due to for example manufacturing caused shape
Shape deviation.For example, be shown as the injection region of rectangle its edge usually there is circle or bending features and/or implantation concentration ladder
Degree, rather than the binary from injection region to non-injection regions changes.Equally, the disposal area can be led to by injecting the disposal area formed
Some injections in area between the surface passed through when injection progress.Therefore, the area shown in figure is substantially schematic
, their shape is not intended the true form in the area of display device and is not intended to limit the scope of the present invention.
In order to thoroughly understand the present invention, detailed step and detailed structure will be proposed in following description, so as to
Illustrate technical solution proposed by the present invention.Presently preferred embodiments of the present invention is described in detail as follows, however in addition to these detailed descriptions
Outside, the present invention can also have other embodiment.
Embodiment one
In the following, referring to Fig.1 and Fig. 2 shows to describe one of chemical-mechanical grinding device of proposition of the embodiment of the present invention
Example.Wherein, Fig. 1 is the structural schematic diagram of the grinding head of chemical-mechanical grinding device according to an embodiment of the invention;Fig. 2
It is the structural schematic diagram of the locating ring of chemical-mechanical grinding device according to an embodiment of the invention.
In the manufacturing process of integrated circuit, it is usually sequentially depositing semiconductor layer, conductive layer, oxide layer etc. on silicon
A variety of layers of structure.After it deposited each layer, it may be desirable to which etch process is to form required pattern, to form circuit elements
Part.Etch process can cause the layer surface of deposition out-of-flatness or non-uniform problem occur, in the subsequent processing step phase
Between generate defect.Therefore it needs to planarize the surface of device.
Chemical mechanical grinding (CMP) is a kind of process means for being commonly used in and device surface being made to planarize.Chemical machinery
Grinding technique, which needs to use, has abrasiveness and corrosive grinding milk, and is used cooperatively grinding pad or support ring, by comprehensive
It closes and utilizes chemical action and mechanism, semiconductor wafer is ground.
In general, typical chemical-mechanical grinding device includes turntable, grinding pad, abrasive nozzle and grinding head.Wherein, it grinds
Mill pad is adhered to the surface of turntable, has multiple apertures thereon to help to maintain and transmit abrasive material and improve grinding uniformly
Property;Abrasive nozzle is used for the surface spraying grinding milk to grinding pad, and grinding milk is typically that abrasive grains of fine size and chemistry are ground
The mixture of grinding fluid;Grinding head makes the surface to be ground of chip to be ground towards grinding for loading and fix chip to be ground
Mill pad.When being ground, to the surface spraying grinding milk of grinding pad, grinding head is downwardly applied to pressure will wait grinding abrasive nozzle
Mill chip rides on grinding pad, makes the lapped face of chip to be ground that chemical reaction occur with chemical grinding liquid and generates one layer of phase
To the superficial layer easily removed, then the superficial layer passes through the relative motion generated between grinding pad and the effect of abrasive grains
And mechanically grind off, to realize the purpose for planarizing chip to be ground.
Therefore in order to preferably describe the present invention the improvement, in the following description no longer to the turntable, grind
Mill pad and abrasive nozzle repeated and explained, can select in this field the structure of any type routine and set-up mode and
The improved grinding head of the present invention is combined use.
Wherein, the grinding head movably and can be rotatably set in the top of the abrasive disk, for by substrate card
It holds in the lower surface of the grinding head and applies pressure to the substrate in process of lapping.
The grinding head is further described below, wherein as shown in Figure 1, the grinding head has grinding head ontology
102, and be formed with loading on the inside of grinding head and fix the space of chip 103 to be ground, such as the space is groove knot
Structure.Grinding head ontology can rotate, and the grinding head ontology can move up and down, such as be arranged in center upper portion
There is axle construction 104, to realize the rotation of the grinding head and move up and down, specific rotation and move mode do not limit herein
It is fixed.
Optionally, the through hole of pressure adjustment is also provided on the grinding head, to be connected to pressure adjustment
Mechanism.
Wherein, the locating ring constitutes a part for the grinding head ontology, and the usually described locating ring setting is ground described
The lower part of bistrique ontology.Optionally, the locating ring is equipped with groove, and the groove is for accommodating wafer to be ground, the groove
Opening be arranged on the surface of the location structure, and the groove is extended to from the surface in the agent structure.
The grinding head ontology connects discoid bracket made of concentric circles configuration by diaphragm.
Wherein, the grinding head ontology is smooth, rigidity height and the gold that will not cause wafer contamination using such as retaining surface
Belong to, is suitble to using circular slabs made of ceramics such as aluminium oxide etc..In addition, can also use rubber chuck bracket as be described hereinafter etc. various
Bracket.
In order to support the back side of chip all, the workpiece retaining surface of bracket with grinding chip same diameter size or
It is that a little larger degree is preferred.
As shown in Fig. 2, wherein Fig. 2 is the enlarged diagram of the locating ring, the locating ring includes side in the present invention
Edge agent structure 1011 outstanding and the location structure being integrated in the agent structure and with agent structure bonding
1013, the protrusion and recess of the cutting ferrule setting being mutually matched are formed between the agent structure and the location structure.
Wherein, it is integrated by the bonding of adhesive glue 1012 between the agent structure 1011 and the location structure 1013.
The recess is provided in the agent structure in this embodiment, is arranged on the location structure described convex
It rises, as shown in Figure 2.
Wherein, the number of the recess is not limited to a certain numberical range, can be configured according to actual needs,
Described in be provided with matching protrusion on location structure, and by the adhesive glue, the agent structure can be made
What is sealed between 1011 and the location structure 1013 is combined into one.
Wherein, due to the agent structure on the direction of the agent structure 1011 and the stacking of the location structure 1013
It is mutually nested between 1011 and the location structure 1013, be interlocked, therefore can make institute in practical mask process
It states that Joint Properties between agent structure and location structure are more preferable, keeps stablizing under pressure that can be in all directions, it is effective anti-
Only the problem of the splitting of layering viscose glue.The scratch of chip occurs to reduce CMP machine platform, and influences the risk of product yield.Especially
It is that, since the protrusion and recess play the role of blocking, slip layer will not occur when by pressure in horizontal direction.
It should be noted that the shape of the groove and the protrusion is not limited to a certain kind, such as it can be depth-to-width ratio
Larger groove, such as can be the groove of sidewalls vertical, those skilled in the art can select according to actual needs.
In addition, it can also be formed through the groove of the filling of adhesive glue 1012 on the surface of the agent structure 1011, with
Further increase the adhesion property between the adhesive glue 1012 and the agent structure.
The number and shape for the groove filled by adhesive glue 1012 are again not limited to a certain example.
Embodiment two
As a kind of alternative of embodiment one, below in conjunction with the accompanying drawings 1 and attached drawing 3 be further described.
Wherein as shown in Figure 1, the grinding head has grinding head ontology 102, and it is formed on the inside of grinding head ontology
The space of chip to be ground is loaded and fixes, such as the space is groove structure.Grinding head ontology is can to rotate, and described
Grinding head ontology can move up and down, such as center upper portion is provided with axle construction 104, to realize the rotation of the grinding head
Turn and move up and down, specific rotation and move mode do not limit herein.
Optionally, the through hole of pressure adjustment is also provided on the grinding head, to be connected to pressure adjustment
Mechanism.
The grinding head ontology connects discoid bracket made of concentric circles configuration by diaphragm.
Wherein, the grinding head ontology is smooth, rigidity height and the gold that will not cause wafer contamination using such as retaining surface
Belong to, is suitble to using circular slabs made of ceramics such as aluminium oxide etc..In addition, can also use rubber chuck bracket as be described hereinafter etc. various
Bracket.
In order to support the back side of chip all, the workpiece retaining surface of bracket with grinding chip same diameter size or
It is that a little larger degree is preferred.
Grinding head integrally constitutes the present invention in groove structure at the outwardly projecting position in the outside of grinding head ontology
The locating ring 101 agent structure.
As shown in figure 3, wherein Fig. 3 is the enlarged diagram of the locating ring, the locating ring includes side in the present invention
Edge agent structure 1011 outstanding and the location structure being integrated in the agent structure and with agent structure bonding
1013, the protrusion and recess of the cutting ferrule setting being mutually matched are formed between the agent structure and the location structure.
Wherein, it is integrated by the bonding of adhesive glue 1012 between the agent structure 1011 and the location structure 1013.
The protrusion is provided in the agent structure in this embodiment, is arranged on the location structure described recessed
It falls into, as shown in Figure 3.
Wherein, the number of the protrusion and the recess is one, and the protrusion and the recess be set to it is described
The centre of agent structure 1011 and the location structure 1013.
And the size of the protrusion and the recess is much larger than the ruler of the protrusion and the recess in embodiment one
It is very little.
Such as the protrusion and the recess account for the three of the surface of the agent structure 1011 and the location structure 1013
/ mono- or so.
The protrusion and the recess can make the agent structure 1011 and the location structure by the adhesive glue
What is sealed between 1013 is combined into one.
Wherein, the protrusion is in the cone to become larger in width along the direction of the location structure, as shown in figure 3, described
Cone structure makes more difficult separation between the cutting ferrule agent structure 1011 being arranged and the location structure 1013.
Due to the agent structure 1011 on the direction of the agent structure 1011 and the stacking of the location structure 1013
It is mutually nested between the location structure 1013, be interlocked, therefore can make the master in practical mask process
Joint Properties are more preferable between body structure and location structure, keep stablizing under pressure that can be in all directions, effectively prevent point
The problem of layer viscose glue splitting.To reduce, the scratch of chip occurs for CMP machine platform and influences the risk of product yield.Especially meeting with
When by pressure in horizontal direction, since the protrusion and recess play the role of blocking, slip layer will not occur.
In order to solve the problems in the existing technology the present invention, provides a kind of chemical-mechanical grinding device, described
Locating ring described in chemical-mechanical grinding device include edge agent structure outstanding and in the agent structure and with institute
It states agent structure and bonds the location structure that is integrated, be formed with and be mutually matched between the agent structure and the location structure
The protrusion and recess of cutting ferrule setting.By the setting of the protrusion and recess can make the agent structure and location structure it
Between cutting ferrule performance it is more preferable, under pressure that can be in all directions keep stablize, effectively prevent layering viscose glue splitting the problem of, from
And the scratch that CMP machine platform causes chip is reduced, influence the risk of product yield.
The present invention is illustrated by above-described embodiment, but it is to be understood that, above-described embodiment is only intended to
The purpose of citing and explanation, and be not intended to limit the invention within the scope of described embodiment.In addition people in the art
It is understood that the invention is not limited in above-described embodiment, introduction according to the present invention can also be made more kinds of member
Variants and modifications, these variants and modifications are all fallen within scope of the present invention.Protection scope of the present invention by
The appended claims and its equivalent scope are defined.
Claims (9)
1. a kind of chemical-mechanical grinding device, which is characterized in that the chemical-mechanical grinding device includes at least grinding head, described
Grinding head includes the locating ring for stationary grinder part;
Wherein, the locating ring includes agent structure and is integrated in the agent structure and with agent structure bonding
Location structure, one in the agent structure, the location structure is provided with protrusion, another is provided with recess, described
Protrusion is mutually matched with recess and cutting ferrule is arranged.
2. chemical-mechanical grinding device according to claim 1, which is characterized in that the agent structure and positioning knot
It is integrated by adhesive glue bonding between structure.
3. chemical-mechanical grinding device according to claim 1, which is characterized in that be arranged in the agent structure
Recess is stated, the protrusion is provided on the location structure.
4. chemical-mechanical grinding device according to claim 1, which is characterized in that if being provided in the agent structure
The dry spaced recess, is provided with several spaced protrusions on the location structure.
5. chemical-mechanical grinding device according to claim 1, which is characterized in that the recess, raised side wall are perpendicular
Straight.
6. chemical-mechanical grinding device according to claim 1, which is characterized in that be arranged in the agent structure
Protrusion is stated, the recess is provided on the location structure.
7. chemical-mechanical grinding device according to claim 6, which is characterized in that the protrusion is along towards the positioning
The cone become larger in width on the direction of structure.
8. chemical-mechanical grinding device according to claim 1, which is characterized in that the locating ring is equipped with groove, described
For accommodating wafer to be ground, the opening of the groove is arranged on the surface of the location structure groove, and the groove is from institute
Surface is stated to extend in the agent structure.
9. chemical-mechanical grinding device according to claim 1, which is characterized in that the material of the location structure includes heat
Plastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710217706.7A CN108687657A (en) | 2017-04-05 | 2017-04-05 | A kind of chemical-mechanical grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710217706.7A CN108687657A (en) | 2017-04-05 | 2017-04-05 | A kind of chemical-mechanical grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108687657A true CN108687657A (en) | 2018-10-23 |
Family
ID=63842671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710217706.7A Pending CN108687657A (en) | 2017-04-05 | 2017-04-05 | A kind of chemical-mechanical grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108687657A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
| CN111823131A (en) * | 2020-08-03 | 2020-10-27 | 上海江丰平芯电子科技有限公司 | Bonding structure of retaining ring for chemical mechanical polishing of semiconductor |
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| CN101293332A (en) * | 2006-11-22 | 2008-10-29 | 应用材料股份有限公司 | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| CN101934495A (en) * | 2010-07-30 | 2011-01-05 | 清华大学 | Embedded retaining ring for chemical mechanical polishing |
| JP2012171035A (en) * | 2011-02-18 | 2012-09-10 | Shin Etsu Handotai Co Ltd | Insert material and double-sided polishing apparatus |
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| CN104416456A (en) * | 2013-08-20 | 2015-03-18 | Cnus株式会社 | Buckle structure for chemical mechanical polishing device |
| CN205734400U (en) * | 2016-05-11 | 2016-11-30 | 普斐特油气工程（江苏）有限公司 | A kind of baseplane, valve body and valve seat hole grinding tool |
| CN206029582U (en) * | 2016-09-28 | 2017-03-22 | 中芯国际集成电路制造（天津）有限公司 | Wafer retainer ring and grinding head |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH03132029A (en) * | 1989-10-18 | 1991-06-05 | Fujitsu Ltd | Polishing |
| CN2841245Y (en) * | 2003-04-30 | 2006-11-29 | 应用材料公司 | Two-part fixing-ring |
| CN101293332A (en) * | 2006-11-22 | 2008-10-29 | 应用材料股份有限公司 | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| CN101934495A (en) * | 2010-07-30 | 2011-01-05 | 清华大学 | Embedded retaining ring for chemical mechanical polishing |
| JP2012171035A (en) * | 2011-02-18 | 2012-09-10 | Shin Etsu Handotai Co Ltd | Insert material and double-sided polishing apparatus |
| CN103802271A (en) * | 2012-11-05 | 2014-05-21 | 韩相孝 | Method of manufacturing retainer ring for polishing wafer |
| CN104416456A (en) * | 2013-08-20 | 2015-03-18 | Cnus株式会社 | Buckle structure for chemical mechanical polishing device |
| CN104290023A (en) * | 2014-09-30 | 2015-01-21 | 上海华力微电子有限公司 | Retaining ring steel ring device for chemical machinery grinding equipment |
| CN205734400U (en) * | 2016-05-11 | 2016-11-30 | 普斐特油气工程（江苏）有限公司 | A kind of baseplane, valve body and valve seat hole grinding tool |
| CN206029582U (en) * | 2016-09-28 | 2017-03-22 | 中芯国际集成电路制造（天津）有限公司 | Wafer retainer ring and grinding head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
| CN111823131A (en) * | 2020-08-03 | 2020-10-27 | 上海江丰平芯电子科技有限公司 | Bonding structure of retaining ring for chemical mechanical polishing of semiconductor |
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Application publication date: 20181023 |
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