CN105102189B - Template assembly and method for manufacturing template assembly - Google Patents
Template assembly and method for manufacturing template assembly Download PDFInfo
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- CN105102189B CN105102189B CN201480016816.1A CN201480016816A CN105102189B CN 105102189 B CN105102189 B CN 105102189B CN 201480016816 A CN201480016816 A CN 201480016816A CN 105102189 B CN105102189 B CN 105102189B
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- Prior art keywords
- template
- template portion
- liner
- notch part
- ring
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Abstract
The present invention is a template assembly for holding a workpiece when the workpiece is polished, the template assembly being characterized in having a PET substrate, an annular template part bonded to the outer periphery part of the lower surface of the PET substrate, and a disc-shaped backing pad bonded to the center part of the lower surface of the PET substrate; the inner surface of the template part and the lower surface of the backing pad forming a recess for accommodating and holding the workpiece during polishing, an annular cutout part being formed on the upper part of the inner surface of the template part, and the peripheral edge part of the backing pad engaging with the cutout part. It is thereby possible to reduce the in-plane variation of the depth of the recess while minimizing the occurrence of faults and scratches on the workpiece, and thereby improve the flatness of the polished workpiece.
Description
Technical field
The present invention relates to a kind of template assembly and its manufacture method, the template assembly is half in grinding headed by Silicon Wafer
During the surface of the works such as semiconductor wafer, to keep workpiece.
Background technology
As the device of the grinding surface of the work such as Silicon Wafer, there is the single-sided grinding device of the one side of grinding work-piece one by one and same
When grind two-sided double-side polishing apparatus.Common single-sided grinding device 200 as shown in Figure 8, is by being pasted with abrasive cloth 202
Platform (surface plate) 203, grinding agent feed mechanism 204, grinding head 201 etc. constitute.Lapping device 200 is being utilized
Grinding head 201 keeping workpiece W, by grinding agent 205 from grinding agent feed mechanism 204 supply to abrasive cloth 202 while, lead to
Crossing makes platform 203 and each spinning of grinding head 201 and makes the surface of workpiece W make sliding contact to be ground with abrasive cloth 202.
As keep workpiece method, used retainer ring (リ テ ー ナ ー リ Application グ using one kind) grinding head or use
The grinding head of template assembly.
The grinding head of retainer ring is used, its retainer ring is the periphery pressing abrasive cloth in workpiece, to prevent due to workpiece
The compression of the abrasive cloth caused by itself, thus with the function of preventing workpiece from periphery turned-down edge etc. occurring.However, due to grinding
Bistrique construction can become complicated, so as to cause high cost.
Fig. 9 represents of the grinding head for having used existing template assembly.As shown in figure 9, template assembly has liner
The template portion 103 of (backing pad) 102 and ring-type, the template portion 103 of the ring-type is bonded to the outer of the bottom surface of liner 102
All portions, and the inner face using template portion forms recess with the bottom surface of liner 102.In grinding, workpiece W is housed and kept
In the recess.Grinding head 101 be by way of two-sided tape 105 is bonded in the template assembly in grinding head main body 104 come
Constitute.The material in template portion 103 can be using glass epoxy resin etc..
In the grinding head 101 for having used this template assembly, the peripheral shape of workpiece W is the recess by template assembly
Depth control with the difference of the thickness of workpiece W.That is, by the thickness for suitably selecting template portion 103, grinding can be adjusted
When Workpiece periphery portion pressure, therefore the complex structure of grinding head will not be made, and periphery can be easily rejected by collapse
Side.
But, compared to the thickness and precision of wafer, the depth offset of the recess of template assembly is big, it is difficult to stablizes and is thought
The thickness difference wanted.
Therefore, in order to improve the depth offset of recess, the surface of the liner after film forming carry out polishing (バ Off ィ Application グ) plus
Work, or carry out grinding or the polish (ラ ッ プ) in template portion etc. (with reference to patent document 1).
In addition, it is also known that a kind of as shown in Figure 10 to have used PET (PET, Polyethylene
Terephthalate) the template assembly (with reference to patent document 2) of base material.As shown in Figure 10, in template assembly 110, will carry out
Template portion 103 after grinding or polish is directly bonded in PET base material 106, and the inner side attaching in the PET base material 106 is led to
Cross polishing processing and lower the liner 102 after thickness deviation.
Prior art literature
Patent document
Patent document 1：Japanese Patent Publication 2009-208199 publication
Patent document 2：Japanese Patent Publication 2008-93811 publication
Patent document 3：Japanese Patent Publication is into 7-58066 publications
The content of the invention
(1) technical problem to be solved
It is above-mentioned polishing processing is carried out to liner or template portion is ground and attrition process method, although make liner
The effect lowered with the respective thickness deviation in template portion, it can be difficult to improving template portion essence bonding with the liner as elastomer
Degree, and can not greatly improve and be referred to as the such precision as template assembly of deviation in the face of the depth of recess.
The depth accuracy of the recess of the template assembly that open market is sold has ± 20 μm of deviation relative to desired value, and
Deviation is 15 μm or so in the face of depth.
Relative to thickness deviation, by the grinding of template portion, the target thickness after attrition process, can be improved as ± 3 μm, and
Deviation in the face of thickness is improved as into less than 3 μm.But, the template portion is bonded to the depth of the recess of the template assembly after liner
Degree precision has ± 10 μm of deviation relative to desired value, and deviation also deteriorates to 10 μm or so in the face of depth.
In the bonding template assembly 110 direct with PET base material by template portion and liner as shown in Figure 10, due to
The glass epoxy resin used as template portion is hard, therefore is easier to improve adhesive reinforcement, and can improve work
For the precision of template assembly.But, because the inner face in template portion is pasted with discoid liner, therefore the slurries meeting in grinding
Into in the gap formed between template portion and liner, this can become sends out dirt source, and has the microscratches or defect of workpiece
Deng for the workpiece quality after grinding has undesirable effect such problem.
In above-mentioned template assembly 110, in the case where the thickness for making template portion is thickening, compared to shown in Fig. 9 by mould
Plate portion is bonded to the template assembly on liner, does not have sinking to for template portion, therefore template portion and abrasive cloth in grinding
Gap can change little.Therefore the slurries quantity delivered towards surface of the work is not enough, and has what workpiece quality was had undesirable effect
Situation, also has the problem that template portion can not be too thick.
In addition, the periphery turned-down edge in order to suppress workpiece, it is known to which a kind of inner face along template portion forms ring on liner
The method (with reference to patent document 3) of the ditch of shape, even the method, slurries can become to send out dirt source in ditch in grinding,
Therefore the surface defect of workpiece can not be improved.
The present invention is completed in view of the above problems, its object is to provide a kind of template assembly, and it is suppressing workpiece
Scratch or defect etc. generation while, the workpiece after grinding can be improved by reducing deviation in the face of depth of recess
Flatness.
(2) technical scheme
To achieve these goals, according to the present invention, there is provided a kind of template assembly, it is in grinding work-piece to keep this
Workpiece, it is characterised in that with PET (PET) base material；The template portion of ring-type, it is bonded in the PET
The peripheral part of the bottom surface of base material；And discoid liner, it is bonded in the central portion of the bottom surface of the PET base material；Institute
The inner face in template portion and the bottom surface of the liner are stated, the recess for housing in grinding and keeping the workpiece is formed with；Described
The inner face top in template portion is formed with the notch part of ring-type, has the circumference of the liner in the notch part engaging.
It is very close to each other between template portion and liner if such template assembly, therefore dirt, and energy will not be sent out in grinding
Enough suppress the generation of the scratch or defect of workpiece etc..In addition, template portion and liner are bonded to into PET base material, therefore these thickness
Face in deviation, or even the face of the depth of recess deviation can reduce, and the flatness of the workpiece after grinding can be improved.
Now, the thickness of the notch part is preferably below the target thickness of the liner.
If this template assembly, gap will not be formed between template portion and liner；If in addition, the thickness of notch part is than lining
The target thickness of pad is less, then can reduce the grinding pressure in Workpiece periphery portion, can reduce the amount of grinding in Workpiece periphery portion, because
This can suppress periphery turned-down edge.
In addition, the material in the template portion is preferably glass epoxy resin.
If this template assembly, then mechanical property is excellent, and is prevented from causing workpiece metallic pollution or damage etc..
In addition, deviation is preferably below 10 μm in the face of the depth of the recess.
If this template assembly, the flatness of the workpiece after grinding can be effectively improved.
In addition, according to the present invention, there is provided a kind of manufacture method of template assembly, it is the template group for manufacturing the invention described above
The method of part, it is characterised in that with following operation：Prepare the operation in the template portion of ring-type, the template portion of the ring-type is in inner face
Top is formed with the notch part of ring-type；Discoid liner is bonded to the operation of the central portion of PET base material；And it is so that described
The circumference of liner snaps into the mode of the notch part in the template portion, and the template portion is bonded to into the bottom of the PET base material
The operation of the peripheral part in face.
By such manufacture method, the template assembly of the present invention can be manufactured, it can reduce template portion with liner
Deviation in the face of thickness, it is possible to increase the flatness of the workpiece after grinding, and sending out for the scratch or defect of workpiece etc. can be suppressed
It is raw.
Now, in the operation for preparing the template portion, prepare the substrate in template portion, the substrate for being prepared is being cut
After cutting out ring-type, the inner face top of the substrate that can pass through to be ground the ring-type is forming the notch part.
In such manner, it is possible to easily prepare the template assembly of the ring-type with notch part.
In addition, in the operation for preparing above-mentioned template portion, preferably before the notch part is formed, by polish and/or grind
The template portion is ground, deviation in the face of the thickness in the template portion is made into less than 10 μm.
In such manner, it is possible to conscientiously in the face of the depth of the recess that reduction is formed in the inner face in template portion and the bottom surface of liner partially
Difference.
(3) beneficial effect
The template assembly of the present invention has PET base material；The template portion of ring-type, it is bonded in the bottom surface of the PET base material
Peripheral part；And discoid liner, it is bonded in the central portion of the bottom surface of the PET base material；In the template portion
Face top is formed with the notch part of ring-type, has the circumference of the liner in the notch part engaging, therefore will not send out in grinding
Dirt, can suppress the generation of the scratch or defect of workpiece etc., in addition, template portion and deviation in the face of the thickness of liner, or even it is recessed
Deviation can be reduced in the face of the depth in portion, and can improve the flatness of the workpiece after grinding.
Description of the drawings
Fig. 1 is the schematic diagram of of the template assembly of the present invention.
Fig. 2 is the periphery of the notch part of the target thickness same thickness of the liner having in the template assembly with the present invention
Enlarged drawing.
Fig. 3 is the periphery of the notch part of the less thickness of target thickness of the liner having in the template assembly than the present invention
Enlarged drawing.
Fig. 4 is to represent that the turned-down edge in embodiment 1～2, comparative example 1～2 is counted relative to recess depths from desired value
Side-play amount relation figure.
Fig. 5 is mean value, maximum, the figure of minimum of a value for representing the turned-down edge in embodiment 1～2, comparative example 1～2.
Fig. 6 is the radar of 8 points of respective shift in position in the face for represent the turned-down edge in embodiment 1～2, comparative example 1～2
Figure.
Fig. 7 is the figure for representing the wafer defect quantity in embodiment 1～2, comparative example 1,3.
Fig. 8 is the schematic diagram of that represents general lapping device.
Fig. 9 is the schematic diagram of that represents existing template assembly.
Figure 10 is other the schematic diagram for representing existing template assembly.
Figure 11 is the figure of the measuring method of the depth for illustrating the recess in embodiment 1～2, comparative example 1～3.
Specific embodiment
Below, embodiment is illustrated for the present invention, but the present invention is not limited to the embodiment.
First, for the template assembly of the present invention, while with reference to Fig. 1, Fig. 2 while illustrating.
As shown in figure 1, the template assembly 1 of the present invention has the template portion 3 of PET base material 2, ring-type and discoid liner 4.
Thickness and shape of PET base material 2 etc. are not particularly limited, and for example, shape can be made discoid.
Workpiece W containing moisture and is attached to bottom surface by liner 4, to keep workpiece W.Liner 4, for example, can be the poly- ammonia of foaming
Ester system.By arranging this liner 4 and making it contain moisture such that it is able to cut by the surface tension of the moisture contained by liner
Workpiece W is kept on the spot.
Template portion 3 is bonded in the peripheral part of the bottom surface of PET base material 2.Liner 4 is bonded in the bottom surface of PET base material 2
Centre portion.
Recess 6 is formed with the inner face in template portion 3 and the bottom surface of liner 4.In grinding work-piece W, in the recess 6 work is housed
Part W, the edge part of workpiece W is maintained at the inner face in template portion 3, and the top surface of workpiece W is maintained at the bottom surface of liner 4.
So, if template portion 3 is directly bonded to into PET base material 2 together with liner 4, the depth phase of recess 6 can be reduced
For deviation in the face of the depth of the error and recess 6 of target depth.Therefore, ground using the template assembly of the present invention
Workpiece W after mill, is particular enable to reduce periphery turned-down edge, improves the flatness of workpiece W.Especially by the face of the depth for making recess
Interior deviation makes less than 10 μm, can effectively improve the flatness of workpiece W.
In order to not pollute workpiece W, and do not cause to damage or impression, the material in template portion 3 is preferably a kind of more soft than workpiece W
It is soft, even if making the material of the high abrasion resistance that sliding contact is also difficult to wear and tear with abrasive cloth in grinding.Based on this viewpoint come
Consider, for example, the material in template portion 3 can be set to glass epoxy resin.
Further, as shown in figure 1, being formed with the notch part 5 of ring-type on the inner face top in template portion 3.Liner 4 is with by liner 4
Circumference engaging so far notch part 5 mode, be bonded to the central portion of the bottom surface of PET base material 2.If this template portion,
Then template portion 3 and liner 4 can be eliminated while the structure in PET base material 2 is directly bonded to using template portion 3 and liner 4
Between gap.Therefore, it is possible to prevent, occurring in existing template assembly, slurries enter gap and send out dirt in grinding
Problem, the generation of the small scratch or defect of workpiece etc. can be suppressed.
As shown in Fig. 2 the thickness d of notch part 5 is preferably below the target thickness of liner 4, so that the not shape between liner 4
Into gap.
In the case of the turned-down edge of the peripheral part for wanting further to suppress workpiece, as long as shown in figure 3, making notch part 5
Thickness d is less than the target thickness of liner 4.So, can annularly be pressed the circumference of the liner 4 clamped by template portion 3
Contracting, therefore the grinding pressure in Workpiece periphery portion reduces, and can reduce the amount of grinding in Workpiece periphery portion to suppress Workpiece periphery portion
Turned-down edge.
If the template assembly of the notch part 5 with the present invention, by the thickness for adjusting notch part 5, can not change
Adjust the grinding pressure in Workpiece periphery portion in the case of the thickness in template portion 3, and can suppress because template portion 3 and abrasive cloth it
Between gap diminish the deficiency of caused slurries quantity delivered, the generation of the surface defect of workpiece can be suppressed.
If in addition, this kind of structure, can be used together the method that liner 4 is annularly cut into groove.
Then, illustrate for the manufacture method of the template assembly of the present invention.
First, preparation inside top surface as shown in Figure 1 is formed with the template portion 3 of the ring-type of the notch part 5 of ring-type.The operation
For example can implement as follows.
Prepare template portion, substrate as such as glass epoxy substrate.Polish is carried out to the substrate and/or is ground
Mill, by the thickness of substrate desired value is processed into.
Now, preferably deviation in the face of the thickness in template portion 3 is made into less than 10 μm.So, in grinding work-piece, can
There is local deteriorated in the surface configuration for suppressing Workpiece periphery portion.
Herein, in the case where polish is carried out, abrasive particle can for example use alumina type, the abrasive particle of SiC classes.Ground
In the case of mill, for example, can use the alkaline solution containing colloidal silica.
Then, aforesaid substrate is cleaned in order to remove abrasive particle accompanying in polish or grinding or alkaline solution.
Then, for example by NC processing (Numerical Control is processed, Numerical Control machining) etc., by base
Plate is cut out behind the template portion 3 of ring-type, is ground the inner face top grinding in template portion 3 of ring-type to form notch part 5.Now, such as
The thickness of notch part 5 is made the specific thickness below the target thickness of liner 4 as above-mentioned.
Discoid liner 4 is bonded to into the central portion of PET base material 2.Herein, the diameter of liner 4 is set to and above-mentioned shape
Into ring-type notch part 5 engaging size.The circumference for making the liner 4 snaps into the notch part 5 in template portion 3, by template
Portion 3 is bonded to the peripheral part of the bottom surface of PET base material 2.
By the manufacture method of the template assembly of the invention described above, the template assembly of the invention described above can be manufactured.
Embodiment
Below, embodiments of the invention and comparative example are represented, to further illustrate the present invention, but the present invention is unrestricted
In these examples.
(embodiment 1)
Manufacturing method according to the invention evaluates the depth of recess manufacturing the template assembly of the invention shown in Fig. 1
Precision.The depth accuracy of recess is that the skew relative to target depth is evaluated with deviation in face.
After near by glass epoxy substrate polish to target thickness, using the slurry comprising about 1 μm of cerium oxide powder
Liquid is ground to substrate, and is processed into the annular of given size.Then, by lathe, with liner identical thickness, will be from
The position grinding of inner circumferential to 5mm forms notch part for ring-type.
Such template portion for making is bonding with the PET base material that central portion has been bonded with liner, to manufacture template assembly.
When the depth of recess of the template assembly is measured, as shown in table 1, relative to the mean value of the skew of target depth
(Ave) it is -0.51 μm, maximum is on the occasion of 4.8 μm of side (Max), 6.5 μm of minus value side (Min).Deviation such as table 2 in the face of depth
Shown, the mean value (Ave) of 8 points of scope (range) is 5.3 μm, and the maximum (Max) of scope is 7 μm.According to the result,
Compared to the result of aftermentioned comparative example 1,2, it is known that the depth accuracy of recess is improved greatly.
Herein, the measurement of the depth of recess is carried out as follows.As shown in figure 11, in workpiece from periphery 1～2mm
8 points of the face internal labeling of (away from 1～2mm of periphery), the thickness (thickness of workpiece) of measurement markers part.The workpiece is being put into into template group
In the recess of part, and by 100g/cm2Load apply to workpiece, thickness of workpiece (the workpiece portion of measurement markers part
Thickness).In addition, the thickness in the template portion of position of the measurement from the inner circumferential in template portion towards 1～2mm of peripheral direction (template portion is thick
Degree).Using these measured values, the depth of recess is calculated using following mathematical expression.The depth of recess is with 8 points of mean value
With scope (range) as typical value.
The depth of recess=template portion thickness-(workpiece portion thickness-thickness of workpiece)
Additionally, thickness measure is the altimeter HDF-300N (model) for using three rich (ミ Star ト ヨ) manufactures.
Then, using possessing, to have the lapping device as shown in Figure 8 with the template assembly manufactured by embodiment 1 straight to grind
The Silicon Wafer of footpath 300mm, and have rated flatness and wafer surface defects.As the evaluation of flatness, Kobelco sections have been used
Edge turned-down edge measurement apparatus LER-310M (model) of company (U ベ ルコ scientific researches society) manufacture is ground carrying out turned-down edge measurement.
The calculating benchmark face of turned-down edge is set to count the scope of 3～6mm from periphery, and for 4 wafers, each measurement is from outer
Count the turned-down edge at 0.5mm, 0.7mm, 1.0mm, 2.0mm position week.
The mean value of the turned-down edge of each point is represented in table 3.In addition, by the skew from desired value of the depth of the recess of table 1
Fig. 4 is shown in the relation of the turned-down edge of table 3.As shown in figure 4, the skew counted from desired value of the depth of recess, is from desired value
The skew in minus value side (depth shallower of recess) counted, as skew quantitative change is big, can reduce the work by caused by template portion
The reduction effect of the grinding pressure of part peripheral part, is especially susceptible to the 0.5mm from periphery of the impact of the depth of recess
Turned-down edge change at position is significant.
Mean value (Ave), the maximum of the turned-down edge of each wafer from periphery at the position of 0.5mm are represented in Figure 5
(Max), minimum of a value (Min).In addition, how the respective position for representing 8 points in the face of the turned-down edge of each measurement position in figure 6 is
The radar map of variation.
In embodiment 1, due to obtaining being substantially equal to the recess depths of target depth, therefore as shown in Figure 5, Figure 6,
Compared to comparative example described later 1～2, turned-down edge also improves, and deviation is also greatly improved in face.
In addition, as shown in fig. 6, radar map becomes substantially concentric circles, it is known that can suppress to be changed in the face of turned-down edge.
Fig. 7 represents the result of wafer surface defects.As shown in Figure 7, it is known that compared to the result of comparative example described later 3, energy
Enough suppress wafer surface defects.
Additionally, the evaluation of surface defect be use (レ ー ザ ー テ ッ Network society of Lasertec companies) manufacture Magics
350 (models), the overall defect quantity of comparative example 1 is evaluated as 1.0.
(embodiment 2)
It is thinner than the thickness of embodiment 1 10 μm except the thickness in template portion is made, and the thickness of notch part is made into ratio
The thickness of liner it is thinner 20 μm in addition, in the same manner as in Example 1 manufacturing the template assembly of the present invention, and carry out same
Evaluation.Additionally, the thickness in the template portion for using is than 1 thin 10 μm of embodiment, but due to by template portion come compresses liner
Circumference, therefore the thickness of notch part is set as so that applying 100g/cm to workpiece2Load in the state of recess depths
It is roughly equal with embodiment 1.
When the depth of recess of the template assembly is measured, as shown in table 1, relative to the mean value of the skew of target depth
It it is -0.43 μm, maximum is on the occasion of 2.0 μm of side, 2.8 μm of minus value side.Deviation is as shown in table 2 in the face of depth, 8 points of scope
Mean value is 5.8 μm, and the maximum of scope is 7 μm.According to the result, compared to the result of comparative example described later 1,2, it is known that recessed
The depth accuracy in portion is improved greatly.
Then, the lapping device as shown in Figure 8 with the template assembly manufactured by embodiment 2 grinds using possessing
The Silicon Wafer of diameter 300mm, and flatness and wafer surface defects are have rated similarly to Example 1.
As described above, used in example 2 with the template portion with the different-thickness of embodiment 1, but the depth of recess
It is substantially equal, therefore the turned-down edge of the wafer after grinding also becomes equal result.Radar map according to Fig. 6, it is known that with reality
Apply example 1 same, can suppress to be changed in the face of turned-down edge.
Fig. 7 represents the result of wafer surface defects.As shown in Figure 7, it is known that compared to the result of comparative example described later 3, energy
Enough suppress wafer surface defects.
In embodiment 1 and embodiment 2, the turned-down edge of the wafer after grinding is phase same level, and deviation in the face of turned-down edge
It is phase same level.That is, even if making the lower thickness in template portion as in Example 2, if the thickness of adjustment notch part also can
The recess of target depth is formed, even for example because the impact of the compression ratio of the abrasive cloth for using, causes selected recess
In the case that depth can make to reduce the slurries quantity delivered of crystal column surface during grinding, it is also possible to make the thickness in template portion than ever
The thickness of needs is thinner.Therefore, it is possible to suppress to grinding when crystal column surface slurries quantity delivered reduction while, improve
Turned-down edge and wafer surface defects.
(comparative example 1)
The template assembly sold using existing market, in the case of polish and grinding for not carrying out template portion etc., is entered
Row evaluation similarly to Example 1, the existing commercially available template assembly is as shown in figure 9, its template portion is bonded in the bottom of liner
The peripheral part in face.
When the depth of recess of the template assembly is measured, as shown in table 1, relative to the mean value of the skew of target depth
It it is -4.46 μm, maximum is on the occasion of 11.0 μm of side, 16.9 μm of minus value side.Deviation is as shown in table 2 in the face of depth, 8 points of scope
Mean value be 15.63 μm, the maximum of scope is 26 μm.By the result, it is known that compared to the knot of above-described embodiment 1,2
Really, the depth accuracy of recess significantly deteriorates.
Then, using the lapping device as shown in Figure 8 of the template assembly for possessing comparative example 1, come lapping diameter 300mm's
Silicon Wafer, and carry out evaluation similarly to Example 1.
In comparative example 1, as shown in table 1, table 2, compared to embodiment 1～2, the depth of recess it is inclined from desired value
Move and become big, therefore turned-down edge also becomes big, the deviation in face also becomes big.According to the radar map of Fig. 6, it is known that the wafer having collapsing in face
While offsetting.
In addition, Fig. 7 represents the result of wafer surface defects.As shown in fig. 7, in the template assembly that comparative example 1 is used,
As shown in Figure 10, it is very close to each other between template portion and liner, therefore compared to the result of comparative example described later 3, crystal column surface lacks
Fall into and be suppressed.
(comparative example 2)
In addition to carrying out the polish in template portion, the template assembly same with comparative example 1 is used, carry out same evaluation.
When the depth of recess of the template assembly is measured, as shown in table 1, relative to the mean value of the skew of target depth
It it is -3.04 μm, maximum is on the occasion of 8.9 μm of side, 10.9 μm of minus value side.Deviation is as shown in table 2 in the face of depth, 8 points of scope
Mean value be 9.77 μm, the maximum of scope is 16 μm.
Compared to above-mentioned comparative example 1, it can be seen that by the polish for carrying out template portion, having improves depth accuracy, but compared to
The result of above-described embodiment 1,2, it is known that the depth accuracy of recess significantly deteriorates.
Then, using the lapping device as shown in Figure 8 of the template assembly for possessing comparative example 2, come lapping diameter 300mm's
Silicon Wafer, evaluates similarly to Example 1 flatness.
In comparative example 2, as shown in table 1, table 2, compared to comparative example 1, the skew from desired value of the depth of recess
Diminish, therefore deviation is further improved compared to comparative example 1 in turned-down edge and face, but be big compared to embodiment 1～2
Width deteriorates.According to the radar map of Fig. 6, it was observed that with the same face of comparative example 1 in turned-down edge skew, it is known that periphery can not be suppressed
Turned-down edge change.
Offseting from desired value for the depth of recess, passes through the thickness of used all parts or the improvement of adhering method
And can diminish, therefore as shown in comparative example 2, how much can improve the mean value of turned-down edge, but can not but improve turned-down edge
Deviation in face.If in contrast, the template assembly of the present invention, additionally it is possible to improve deviation in above-mentioned face.
In table 1, the knot of embodiment 1～2, the depth of the recess of comparative example 1～2 relative to the skew of target depth is represented
The remittance of fruit is whole.The remittance of the result of deviation is whole in the expression embodiment 1～2 of table 2, the face of the depth of the recess of comparative example 1～2.
(table 1)
| Comparative example 1 | Comparative example 2 | Embodiment 1 | Embodiment 2 | |
| N | 40 | 26 | 10 | 5 |
| Ave | -4.46 | -3.04 | -0.51 | -0.43 |
| S | 7.37 | 6.00 | 3.53 | 2.03 |
| Max | 11.0 | 8.9 | 4.8 | 2.0 |
| Min | -16.9 | -10.9 | -6.5 | -2.8 |
(table 2)
| Comparative example 1 | Comparative example 2 | Embodiment 1 | Embodiment 2 | |
| N | 40 | 26 | 10 | 5 |
| Ave | 15.63 | 9.77 | 5.30 | 5.80 |
| S | 4.91 | 2.67 | 1.64 | 1.30 |
| Max | 26.0 | 16.0 | 7.0 | 7.0 |
| Min | 8.0 | 6.0 | 2.0 | 4.0 |
(table 3)
(comparative example 3)
As shown in Figure 10, using the lapping device as shown in Figure 8 for possessing existing template assembly, lapping diameter 300mm is carried out
Silicon Wafer, and similarly to Example 1 evaluate recess depths face in deviation and wafer surface defects, the existing template group
Part is in template portion without notch part.
Its result is deviation in the face of the recess depths that can obtain equal with embodiment 1～2, but compared to embodiment 1
～2 and comparative example 1, wafer surface defects but deteriorate.The surface defect is considered as because slurries are entered between template portion and liner
Gap institute caused by, in grinding send out dirt the reason for.
Additionally, the present invention is not limited to above-mentioned embodiment.Above-mentioned embodiment is to illustrate, as long as the power with the present invention
Technological thought described in sharp claim has substantially the same structure, and plays same purpose effect, no matter whichever is all wrapped
It is contained in the technical scope of the present invention.
Claims (13)
1. a kind of template assembly, it is in grinding work-piece to keep the workpiece, it is characterised in that
With PET base material；The template portion of ring-type, it is bonded in the peripheral part of the bottom surface of the PET base material；And discoid lining
Pad, it is bonded in the central portion of the bottom surface of the PET base material；
Inner face and the bottom surface of the liner in the template portion, is formed with and houses and keep the recessed of the workpiece in grinding
Portion；
The notch part of ring-type is formed with the inner face top in the template portion, has the periphery of the liner in the notch part engaging
Portion.
2. template assembly according to claim 1, it is characterised in that target of the thickness of the notch part in the liner
Below thickness.
3. template assembly according to claim 1, it is characterised in that the material in the template portion is glass epoxy resin.
4. template assembly according to claim 2, it is characterised in that the material in the template portion is glass epoxy resin.
5. the template assembly according to any one of Claims 1 to 4, it is characterised in that in the face of the depth of the recess
Deviation is below 10 μm.
6. a kind of manufacture method of template assembly, it is the side for manufacturing the template assembly as any one of Claims 1 to 4
Method, it is characterised in that with following operations：
Prepare the operation in the template portion of ring-type, the template portion of the ring-type is formed with the notch part of ring-type on inner face top；
Discoid liner is bonded to the operation of the central portion of PET base material；And
In the way of the notch part that the circumference for making the liner snaps into the template portion, the template portion is bonded to described
The operation of the peripheral part of the bottom surface of PET base material.
7. the manufacture method of template assembly according to claim 6, it is characterised in that in the operation for preparing the template portion
In, prepare the substrate in template portion, after the substrate cut for being prepared is gone out into ring-type, by being ground in the substrate of the ring-type
Face top is forming the notch part.
8. the manufacture method of template assembly according to claim 6, it is characterised in that in the operation for preparing the template portion
In, before the notch part is formed, by polish and/or the grinding template portion, will be in the face of the thickness in the template portion partially
Difference makes less than 10 μm.
9. the manufacture method of template assembly according to claim 7, it is characterised in that in the operation for preparing the template portion
In, before the notch part is formed, by polish and/or the grinding template portion, will be in the face of the thickness in the template portion partially
Difference makes less than 10 μm.
10. a kind of manufacture method of template assembly, it is the method for manufacturing template assembly as claimed in claim 5, its feature
It is, with following operations：
Prepare the operation in the template portion of ring-type, the template portion of the ring-type is formed with the notch part of ring-type on inner face top；
Discoid liner is bonded to the operation of the central portion of PET base material；And
In the way of the notch part that the circumference for making the liner snaps into the template portion, the template portion is bonded to described
The operation of the peripheral part of the bottom surface of PET base material.
The manufacture method of 11. template assemblies according to claim 10, it is characterised in that in the work for preparing the template portion
In sequence, prepare the substrate in template portion, after the substrate cut for being prepared is gone out into ring-type, by the substrate for being ground the ring-type
Inner face top is forming the notch part.
The manufacture method of 12. template assemblies according to claim 10, it is characterised in that in the work for preparing the template portion
In sequence, before the notch part is formed, by polish and/or the grinding template portion, by the face of the thickness in the template portion
Deviation makes less than 10 μm.
The manufacture method of 13. template assemblies according to claim 11, it is characterised in that in the work for preparing the template portion
In sequence, before the notch part is formed, by polish and/or the grinding template portion, by the face of the thickness in the template portion
Deviation makes less than 10 μm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-060418 | 2013-03-22 | ||
| JP2013060418A JP5821883B2 (en) | 2013-03-22 | 2013-03-22 | Template assembly and method for manufacturing template assembly |
| PCT/JP2014/000997 WO2014147969A1 (en) | 2013-03-22 | 2014-02-26 | Template assembly and method for manufacturing template assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105102189A CN105102189A (en) | 2015-11-25 |
| CN105102189B true CN105102189B (en) | 2017-05-10 |
Family
ID=51579672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480016816.1A Active CN105102189B (en) | 2013-03-22 | 2014-02-26 | Template assembly and method for manufacturing template assembly |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160008947A1 (en) |
| JP (1) | JP5821883B2 (en) |
| KR (1) | KR102058923B1 (en) |
| CN (1) | CN105102189B (en) |
| DE (1) | DE112014001031T5 (en) |
| SG (1) | SG11201507321WA (en) |
| TW (1) | TWI577501B (en) |
| WO (1) | WO2014147969A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6398939B2 (en) * | 2015-10-07 | 2018-10-03 | 信越半導体株式会社 | Method for measuring and evaluating template |
| JP6394569B2 (en) * | 2015-11-06 | 2018-09-26 | 信越半導体株式会社 | Wafer polishing method and polishing apparatus |
| JP6508003B2 (en) * | 2015-11-06 | 2019-05-08 | 信越半導体株式会社 | Method of manufacturing template assembly, polishing method using the template assembly, and template assembly |
| US20170252893A1 (en) * | 2016-03-03 | 2017-09-07 | P.R. Hoffman Machine Products Inc. | Polishing machine work piece holder |
| US10556317B2 (en) | 2016-03-03 | 2020-02-11 | P.R. Hoffman Machine Products Inc. | Polishing machine wafer holder |
| JP6508123B2 (en) | 2016-05-13 | 2019-05-08 | 信越半導体株式会社 | Method of sorting template assembly, method of polishing workpiece and template assembly |
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| US5588902A (en) * | 1994-02-18 | 1996-12-31 | Shin-Etsu Handotai Co., Ltd. | Apparatus for polishing wafers |
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| US6251215B1 (en) * | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| JP2000233363A (en) * | 1999-02-16 | 2000-08-29 | Ebara Corp | Polishing device and method therefor |
| US6527624B1 (en) * | 1999-03-26 | 2003-03-04 | Applied Materials, Inc. | Carrier head for providing a polishing slurry |
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| DE10247179A1 (en) | 2002-10-02 | 2004-04-15 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing device |
| US7033252B2 (en) * | 2004-03-05 | 2006-04-25 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
| US7063604B2 (en) * | 2004-03-05 | 2006-06-20 | Strasbaugh | Independent edge control for CMP carriers |
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- 2014-02-26 WO PCT/JP2014/000997 patent/WO2014147969A1/en active Application Filing
- 2014-02-26 US US14/771,967 patent/US20160008947A1/en not_active Abandoned
- 2014-02-26 KR KR1020157025269A patent/KR102058923B1/en active IP Right Grant
- 2014-02-26 CN CN201480016816.1A patent/CN105102189B/en active Active
- 2014-02-26 SG SG11201507321WA patent/SG11201507321WA/en unknown
- 2014-02-26 DE DE112014001031.6T patent/DE112014001031T5/en not_active Withdrawn
- 2014-03-10 TW TW103108183A patent/TWI577501B/en active
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| US5588902A (en) * | 1994-02-18 | 1996-12-31 | Shin-Etsu Handotai Co., Ltd. | Apparatus for polishing wafers |
| JP5143151B2 (en) * | 2010-02-01 | 2013-02-13 | 富士紡ホールディングス株式会社 | Polishing method |
| CN101934495A (en) * | 2010-07-30 | 2011-01-05 | 清华大学 | Embedded retaining ring for chemical mechanical polishing |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014147969A1 (en) | 2014-09-25 |
| JP2014184511A (en) | 2014-10-02 |
| SG11201507321WA (en) | 2015-10-29 |
| TWI577501B (en) | 2017-04-11 |
| KR102058923B1 (en) | 2019-12-24 |
| JP5821883B2 (en) | 2015-11-24 |
| DE112014001031T5 (en) | 2015-12-17 |
| KR20150133714A (en) | 2015-11-30 |
| CN105102189A (en) | 2015-11-25 |
| US20160008947A1 (en) | 2016-01-14 |
| TW201505761A (en) | 2015-02-16 |
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