JP2008093811A - Polishing head and polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a polishing head furnished with a backing pad and a template from which the template is hardly peeled off in polishing a workpiece, etc. <P>SOLUTION: This polishing head has a carrier 15 of at least a disc type and to hold a back surface of the workpiece W, the backing pad 12 stuck to a lower surface part of the carrier and to hold the workpiece on a workpiece holding surface of the carrier and the ring type template 13 arranged on a peripheral part of the lower surface part of the carrier and to surround the edge part of the workpiece and polishes the workpiece by holding the workpiece on the workpiece holding surface of the carrier and sliding a surface of the workpiece on the abrasive cloth stuck to a surface plate. The template is arranged adjacent to the packing pad and is stuck the lower surface part of the carrier not through the packing pad. The polishing device is furnished with this polishing head. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a polishing head for holding a workpiece when polishing the surface of the workpiece, and a polishing apparatus including the same, and in particular, a polishing head including both a backing pad and a template, and polishing including the same. Relates to the device.

As a device for polishing the surface of a workpiece such as a silicon wafer, there are a single-side polishing device for polishing a wafer one side at a time and a double-side polishing device for polishing both surfaces simultaneously.
As shown in FIG. 7, for example, a general single-side polishing apparatus includes a surface plate 93 to which a polishing cloth 94 is attached, an abrasive supply mechanism 96, a polishing head 92, and the like. In such a polishing apparatus 91, the workpiece W is held by the polishing head 92, the polishing agent 95 is supplied from the polishing agent supply mechanism 96 onto the polishing cloth 94, and the surface plate 93 and the polishing head 92 are respectively rotated to rotate the workpiece. Polishing is performed by bringing the surface of W into sliding contact with the polishing cloth 94.

As a method for holding the work on the polishing head, a method of sticking the work to a flat disk-shaped plate through an adhesive such as wax, a method of sticking water with a soft pad (backing pad), a method of vacuum adsorbing, etc. There is.
Further, a template surrounding the edge portion of the workpiece may be provided so that the workpiece does not come off the holding surface of the polishing head.

  When the workpiece is held on the polishing head having both the backing pad and the template in this way, generally, a structure in which the template and the backing pad are integrated is called a template assembly that is commercially available, and the workpiece of the polishing head is held. This is performed by adhering to the holding surface (for example, see Patent Document 1).

An example of such a template assembly is shown in FIG.
In the template assembly 84, an annular template 83 is bonded to the outer periphery of a circular backing pad 82 with an adhesive, double-sided tape, or the like. Further, glass epoxy resin (GEP) or the like is generally used as a template material.
An example of the carrier of the polishing head to which such a template assembly 84 is bonded is shown in FIG. The backing pad 82 side of the template assembly 84 is bonded to the carrier 85 with an adhesive or a double-sided tape.

  When such a template assembly 84 is bonded to the lower surface of the carrier 85 constituting the polishing head and the workpiece W is polished, there is a problem that the template 83 is peeled off during polishing of the workpiece. Such a problem of peeling off the template is particularly noticeable when polishing with a high pressing force and at a high speed in order to increase productivity when polishing a workpiece with a rubber chuck carrier, and increasing the polishing load. There was a problem that I could not.

JP 2000-296462 A

  Therefore, the present invention has been made in view of such problems, and provides a polishing head having both a backing pad and a template, in which the template is difficult to peel off from the polishing head during workpiece polishing. Main purpose.

  The present invention has been made in order to solve the above-described problem, and is at least a disc shape, and is attached to a lower surface portion of the carrier and a carrier for holding the back surface of the workpiece, and the workpiece is attached to the carrier. A backing pad that is held on the work holding surface; and an annular template that is disposed around the lower surface of the carrier and surrounds the edge of the work, and holds the work on the work holding surface of the carrier. A polishing head for polishing the surface of the workpiece by sliding in contact with a polishing cloth affixed on a surface plate, wherein the template is disposed adjacent to the backing pad, without passing through the backing pad. A polishing head is provided, which is bonded to a lower surface portion of the carrier.

  If such a polishing head is disposed so as to be adjacent to the backing pad and is bonded to the lower surface of the carrier without going through the backing pad, the adhesion strength of the template to the polishing head can be increased. it can. Further, the load applied to the backing pad during workpiece polishing is not directly transmitted to the template. As a result, when the workpiece is polished using such a polishing head, the template can be prevented from peeling off from the polishing head.

  In this case, it is preferable that the carrier has a rigid film bonded to the work holding surface, and the backing pad and the template are preferably bonded to the rigid film (Claim 2). The material of the rigid film is preferably PET (Claim 3).

  Thus, the carrier has a rigid film such as PET bonded to the work holding surface. If the backing pad and the template are bonded to the rigid film, the adhesion of the template can be further improved. it can. As a result, peeling of the template from the polishing head can be more effectively suppressed.

The workpiece may be a silicon single crystal wafer.
As described above, when the workpiece is a silicon single crystal wafer whose diameter has been remarkably increased in recent years, the polishing head according to the present invention can suppress peeling of the template from the polishing head during workpiece polishing.

Further, the material of the template is preferably a material whose friction coefficient with the polishing cloth is within ± 25% of the friction coefficient between the polishing cloth and the workpiece at least up to the maximum relative speed. .
Thus, if the material of the template is a material whose friction coefficient with the polishing cloth is within ± 25% of the friction coefficient between the polishing cloth and the workpiece at least up to the maximum relative speed, during polishing of the workpiece, A substantially equal load is applied to the workpiece and the template, and stable polishing can be performed. As a result, template peeling can be more effectively suppressed.

In this case, the material of the template can be polyimide (Claim 6).
Thus, if the template material is polyimide, particularly when the workpiece is a silicon single crystal wafer, the friction coefficient between the workpiece and the polishing cloth applied to the template can be made substantially the same. Moreover, polyimide is excellent in wear resistance, and the life of the template can be extended.

  Further, the carrier has a rubber film on at least the work holding surface, and has a space portion sealed on the opposite side of the rubber film to the work holding surface, and the pressure of the space portion is controlled by a pressure adjusting mechanism. A rubber chuck carrier that adjusts the shape of the workpiece holding surface by changing it is preferable.

  In this way, if the carrier is a rubber chuck carrier that adjusts the shape of the workpiece holding surface by changing the pressure in the space, the shape of the workpiece will be deteriorated even when a highly flat double-side polished wafer is used as the workpiece. Without this, secondary polishing and finish polishing of the surface can be performed. As a result, a highly flat wafer can be processed.

  Furthermore, in the present invention, a polishing apparatus for use in polishing the surface of a workpiece, comprising at least an abrasive cloth affixed on a surface plate, and an abrasive for supplying the abrasive onto the abrasive cloth A polishing apparatus comprising the polishing head according to the present invention as a supply mechanism and a polishing head for holding the workpiece is provided (claim 8).

  As described above, when the workpiece is polished using the polishing apparatus provided with the polishing head according to the present invention, the polishing can be performed after increasing the adhesive strength of the template to the polishing head. Further, the load applied to the backing pad during workpiece polishing is not directly transmitted to the template. As a result, when the workpiece is polished using such a polishing apparatus, the template can be prevented from peeling from the polishing head.

  If the polishing head according to the present invention is used to polish a workpiece, the polishing head having both a backing pad and a template can be used to suppress polishing of the template even under high pressing force and high speed polishing conditions. It can be carried out. As a result, productivity can be improved in the workpiece polishing process.

Hereinafter, the present invention will be described in more detail.
As described above, when the workpiece is polished by bonding the template assembly to the lower surface of the carrier of the polishing head, there is a problem that the template is partially peeled off during polishing of the workpiece. For this reason, there is a problem that the pressure (pressing force) for pressing the workpiece against the polishing cloth cannot be increased to a certain degree.
In order to solve such a problem, the present inventors have intensively studied a method for suppressing the separation of the template from the lower surface of the polishing head during the polishing of the workpiece.

  Among them, the inventors have shown that when the template is adhered to the carrier of the polishing head via the backing pad, as in the case of using a commercially available template assembly, the adhesive strength between the template and the backing pad. Therefore, it was found that the template easily peeled off when the workpiece was polished with a high pressing force. In addition, due to the difference between the frictional force that the workpiece receives during polishing and the frictional force that the template receives, a non-uniform load is applied to the backing pad to which the template is bonded, and the adhesive strength of the template that is bonded to the backing pad is low. Thus, it has been found that the template is easily peeled off from the backing pad.

  Therefore, the present inventors have further conducted diligent experiments and examinations, and arranged not to adhere the template to the backing pad, but to be adjacent to the backing pad, and directly adhere to the carrier without going through the backing pad. Thus, the inventors have conceived that the template can be prevented from peeling during polishing, and the present invention has been completed.

Hereinafter, the polishing head and the polishing apparatus according to the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited thereto.
FIG. 1 shows an example (first aspect) of a polishing head according to the present invention. The polishing head 11 is disposed so as to be adjacent to the carrier 15 having a flat disk-like bottom surface, the backing pad 12 attached to the carrier 15, and the backing pad 12. 15 has a template 13 which is directly bonded to the lower surface portion of 15. The backing pad 12 and the template 13 are bonded to the lower surface portion of the carrier 15 with an adhesive, a double-sided tape, etc., but these adhesives, the double-sided tape, etc. are not shown in the drawing. In this specification, “the lower surface portion of the carrier” refers to the lowermost surface of the carrier structure at that time and does not necessarily coincide with the “workpiece holding surface of the carrier”. is not.

For the carrier 15, a material that has high rigidity and does not cause metal contamination of the workpiece W, for example, a ceramic circular plate such as alumina can be used, and the present invention is applied if the lower surface is flat. Various types such as a rubber chuck carrier, which will be described in detail later, can be used.
In addition, the lower surface portion of the carrier 15 adheres the backing pad 12 and the template 13, and therefore has a diameter equal to or larger than the outer diameter of the template 13.

  The backing pad 12 attached to the lower surface portion of the carrier 15 includes water and attaches the work W, and holds the work W on the work holding surface of the carrier 15. The backing pad 12 can be made of foamed polyurethane, for example. By providing such a backing pad 12 and containing water, the workpiece W can be reliably held by the surface tension of the water contained in the backing pad 12.

A template 13 is bonded to the periphery of the lower surface of the carrier 15 so as to be adjacent to the periphery of the backing pad 12. The template 13 is for holding the edge portion of the workpiece W, and is bonded so as to protrude downward along the outer peripheral portion of the lower surface portion of the carrier 15. However, the template 13 holds the edge portion of the workpiece W and prevents the workpiece W from coming off the carrier 15 during polishing, while pressing the polishing cloth 18 affixed on the surface plate 17 as much as possible in the final polishing step or the like. Do not make it thick. For example, if used for polishing a normal silicon single crystal wafer having a thickness of about 0.8 mm, the template 13 may protrude from the backing pad 12 within a range of about 0.4 to 0.7 mm. . However, particularly when the workpiece W is polished with a high pressing force, the template 13 may come into contact with and be pressed against the polishing pad 18 by compression of the backing pad 12 or the polishing pad 18. In addition, in the primary polishing or secondary polishing process before the above-described finish polishing, a template that is almost the same as or slightly thicker than the workpiece (for example, a silicon single crystal wafer having a diameter of 300 mm is used for the purpose of suppressing the outer periphery sagging of the workpiece. In this case, a template with a workpiece polishing target thickness of about 775 to 825 μm with respect to 775 μm is used, and the template is simultaneously polished during workpiece polishing. The effect of the present invention can be obtained when the present invention is applied to any of the above cases, but particularly when the thickness of the template is substantially the same as or slightly thicker than the workpiece, the frictional force between the template and the polishing cloth is increased. Since the template is easily peeled off, the effect of the present invention is more remarkable.
Further, since the template 13 is for holding the edge portion of the workpiece W and preventing it from being removed during polishing, the ring width does not need to be particularly thick, and is usually about 0.3 to 3 mm. Just do it.

  It is assumed that the backing pad 12 and the template 13 are independent so that there is no load propagation due to polishing directly, that is, there is no load propagation due to polishing other than through the carrier 15. However, it is not particularly necessary to provide a gap between the backing pad 12 and the template 13, and they may be in contact with each other.

  By configuring the polishing head 11 in this way, the template 13 is directly bonded to the carrier 15 without the backing pad 12 being interposed. When the polishing head 11 is used to polish the workpiece W, the template 13 is bonded to the carrier 15 so that the adhesive strength is strong. As described above, the template 13 is independent of the backing pad 12 and the polishing load. Therefore, the load transmitted to the backing pad 12 due to the frictional force on the workpiece W does not directly affect the bonding surface of the template 13 with the carrier 15, so that the peeling of the template 13 from the carrier 15 is suppressed. can do.

FIG. 2 shows a second embodiment of the polishing head according to the present invention.
In the polishing head 21, in addition to the configuration of the polishing head 11 of FIG. 1, the rigid film 22 is bonded to the work holding surface of the carrier 25 with an adhesive, a double-sided tape or the like, and the lower surface portion of the carrier 25 is formed. . Accordingly, the backing pad 12 and the template 13 bonded to the lower surface portion of the polishing head 21 are bonded to the rigid film 22.

For the rigid film 22, various polymer materials such as PET (polyethylene terephthalate) can be employed.
By configuring the polishing head 21 in this way, the template 13 is bonded to the rigid film 22, and the rigid film 22 is bonded to the work holding surface of the carrier as a whole, so that the adhesive strength of the template 13 to the carrier is increased. It can be further increased and the peeling of the template 13 from the carrier can be more effectively suppressed.

Hereinafter, a case where the carrier is a rubber chuck carrier will be described as a case where the present invention can be particularly preferably applied.
FIG. 3 shows a third embodiment of the polishing head according to the present invention.
The polishing head 31 has a rubber film (elastic film) 36 on the work holding surface as a carrier 35 and a space 39 sealed on the opposite side of the rubber film. The pressure is changed so that the shape and pressing force of the work holding surface can be adjusted. The space 39 is formed, for example, by configuring the carrier 35 with a rubber film 36, a rigid ring body 37 such as SUS (stainless steel), and a back plate 38 that closes the carrier 35 at the top.
A pressure adjusting through hole 41 communicating with the pressure adjusting mechanism 40 is provided in the upper center of the carrier 35.

  The backing pad 12 is bonded to the workpiece holding surface of the carrier 35 as in the first embodiment, and the template 13 is bonded to the backing pad 12 adjacent to the backing pad 12 without the backing pad 12 interposed therebetween.

  The rubber chuck carrier 35 only needs to have a pressure adjusting space at least on the side opposite to the work holding surface of the rubber film. In addition to the configuration shown in FIG. The present invention can be applied.

  When the carrier is a rubber chuck carrier, the effect of the present invention that suppresses the template 13 from being peeled off from the polishing head can be obtained by the above structure alone, as in the first aspect, but the carrier is a rubber chuck. In the case of a carrier, the shape change of the workpiece holding surface during polishing of the workpiece due to high pressing force is larger than when the workpiece holding surface is a rigid body such as ceramic. As shown in FIG. 4, it is particularly preferable to provide a rigid film on the work holding surface of the carrier.

FIG. 4 shows a head body 51 having a rubber chuck carrier 55 in which a rigid film 52 is bonded to a work holding surface as a fourth aspect of the polishing head according to the present invention.
The basic effect of adhering the rigid film 52 to the work holding surface of the carrier 55 is the same as that described in the second embodiment. However, when the carrier is a rubber chuck carrier, the template 13 is adhered. The effect of increasing the strength is particularly great, and the peeling of the template 13 during workpiece polishing can be more effectively suppressed.

  The template 13 is preferably made of a material whose friction coefficient with the polishing pad 18 is close to the polishing coefficient between the workpiece W and the polishing pad 18. In this way, a load due to polishing is less likely to be applied to the template 13, and peeling of the template 13 can be more effectively suppressed. Specifically, a material whose friction coefficient with the polishing cloth 18 is within ± 25% of the friction coefficient between the polishing cloth 18 and the workpiece W at least up to the maximum relative speed may be used. In addition, since it does not contaminate the workpiece W and does not cause scratches or indentations, it is softer than the workpiece and is not easily worn even if it is in sliding contact with the polishing pad 18 during polishing, and has high wear resistance. Is preferred.

  When selecting a preferable material for the template 13 for use in polishing a silicon single crystal wafer, the following experiment was conducted, and a glass epoxy resin (GEP) generally employed in a commercially available template assembly, and The friction coefficient of the acrylonitrile / butadiene / styrene resin (ABS) or polyimide resin (PI), which is considered to have high wear resistance, with the polishing cloth was measured.

(Experiment 1)
A polishing head 51 was constructed as shown in FIG. However, as the material of the template 13, the above three kinds of plastics were sequentially replaced.
The surface plate 17 was rotated in a state where the workpiece W was not held by the carrier 55 and the template 13 was pressed against the polishing pad 18, and the friction coefficient was measured. However, the polishing load was 20 kPa, the rotation speed of the surface plate 17 was changed, and the relative speed between the template 13 and the surface plate 17 was changed from 0 m / min to 120 m / min.
In addition, the friction coefficient was measured in the same manner as the measurement of the template 13 except that the template 13 was excluded from the polishing head 51 of FIG. 4 and the workpiece W was a silicon single crystal wafer.

The results obtained in this way are shown in FIG. When the template 13 is polyimide, the friction coefficient is very close to that of the silicon single crystal wafer at all measurement speeds.
For this reason, when a silicon single crystal wafer is polished as the workpiece W, the template 13 is preferably made of polyimide.

  The wear rate when various plastics were used as the template 13 was actually measured as follows.

(Experiment 2)
In the same manner as in Experiment 1, the wear rate of the template 13 was measured when the polishing load was 30 kPa and the platen rotation speed was 29 rpm.
As a result, the polyimide was 0.3 μm per hour and the ABS resin was 0.1 μm per hour, whereas the glass epoxy was 5.8 μm per hour.

  As described above, polyimide is remarkably high in wear as compared with glass epoxy that has been generally used in the related art. Therefore, this is also suitable as a material for the template 13 when polishing a silicon single crystal wafer.

FIG. 5 shows an outline of a polishing apparatus 61 provided with the polishing head 11. In addition to the polishing head 11, the polishing apparatus 61 includes a polishing cloth 18 affixed on the surface plate 17 and an abrasive supply mechanism 66 for supplying the polishing agent 65 onto the polishing cloth 18.
In order to polish the workpiece W using the polishing apparatus 61, first, the workpiece W is attached to the backing pad 12 soaked with water, the back surface of the workpiece W is held by the carrier 15, and the edge portion of the workpiece W is fixed. Hold with template 13.

  Then, the polishing agent 65 is supplied from the polishing agent supply mechanism 66 onto the polishing pad 18, and the work W is brought into sliding contact with the polishing pad 18 while rotating the polishing head 11 and the surface plate 17 in predetermined directions. The surface of the workpiece W can be polished by pressing the workpiece W held on the carrier 15 with a predetermined pressing force while rotating the workpiece W against the polishing pad 18 on the surface plate 17.

When the workpiece W is polished using the polishing apparatus 61 including such a polishing head 11, the template 13 is not directly bonded to the backing pad 12 but directly bonded to the lower surface portion of the carrier 15. Therefore, peeling of the template 13 from the carrier 15 can be suppressed.
Naturally, the same effect can be obtained by using the polishing head 11 shown in FIG. 5 as the polishing heads 21, 31, 51 shown in FIG. 2-4.

Examples of the present invention and comparative examples will be described below.
(Example 1)
A polishing head 31 having the configuration shown in FIG. 3 was produced as follows. First, a rubber film 36 was attached to the outer periphery of a ring body 37 made of SUS, the upper part of which was closed by a back plate 38, to form a rubber chuck carrier 35. The backing pad 12 was adhered to the work holding surface (rubber film) of the rubber chuck carrier 35 with a double-sided tape, and the annular template 13 was adhered to the periphery of the backing pad 12 with the double-sided tape. The template 13 was made of polyimide.

  Using the polishing apparatus provided with the polishing head 31 as described above, a silicon single crystal wafer having a diameter of 300 mm and a thickness of 775 μm was polished as the workpiece W as follows. Note that the silicon single crystal wafer used was subjected to primary polishing on both surfaces in advance, and the edge portion was also polished. In addition, a platen having a diameter of 800 mm was used as the surface plate 17, and a commonly used one was used as the polishing pad 18.

  During polishing, an alkaline solution containing colloidal silica was used as the polishing agent, and the polishing head 31 and the surface plate 17 were rotated at 31 rpm and 29 rpm, respectively. The polishing load (pressing force) of the workpiece W was 10, 15, 20, 25, and 30 kPa. The polishing time was 10 minutes.

  As a result, the template 13 peeled off when the polishing load was 25 kPa or more.

(Example 2)
A silicon single crystal wafer was polished in the same manner as in Example 1 using a polishing head 51 having a rubber chuck carrier 55 to which a PET rigid film 52 was bonded as shown in FIG.
Even when the polishing load was 30 kPa, the template 13 did not peel off during polishing.

(Comparative example)
In the polishing head 31 shown in FIG. 3, instead of the backing pad 12 and the template 13, a commercially available template assembly 84 in which the template 83 is bonded to the backing pad 82 as shown in FIG. The silicon single crystal wafer was polished in the same manner as in Example 1 while being adhered to the rubber film of the chuck carrier 35.
As a result, the template peeled off when the polishing load was 20 kPa or more.

  From the above results, in the case of Examples 1 and 2 having the structure of the polishing head according to the present invention, the template 13 is less likely to be peeled off than in the past even with a high pressing force of 20 kPa or more. Obtained. In particular, in the polishing apparatus of Example 2 in which the rigid film 52 was bonded to the work holding surface of the carrier 13, the effect of the present invention was remarkable.

  The present invention is not limited to the above embodiment. The above embodiment is merely an example, and the present invention has the same configuration as that of the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

For example, the polishing head according to the present invention is not limited to the embodiment shown in FIGS. 1-4. For example, the shape of the carrier may be designed as appropriate.
Further, the configuration of the polishing apparatus is not limited to that shown in FIG. 5, and for example, a polishing apparatus including a plurality of polishing heads according to the present invention may be used.

It is a schematic sectional drawing which shows the 1st aspect of the grinding | polishing head which concerns on this invention. It is a schematic sectional drawing which shows the 2nd aspect of the grinding | polishing head which concerns on this invention. It is a schematic sectional drawing which shows the 3rd aspect of the grinding | polishing head which concerns on this invention. It is a schematic sectional drawing which shows the 4th aspect of the grinding | polishing head which concerns on this invention. It is a schematic structure figure showing an example of a polisher provided with a polish head concerning the present invention. (A) is a schematic sectional drawing which shows the conventional template assembly, (b) is a schematic sectional drawing which shows the grinding | polishing head provided with this template assembly. It is a schematic block diagram which shows an example of a single-side polish apparatus. It is the graph which showed the friction coefficient between the silicon single crystal wafer and the polishing cloth of various template materials.

Explanation of symbols

11, 21, 31, 51 ... polishing head,
12 ... backing pad, 13 ... template,
15, 25 ... carrier, 35, 55 ... carrier (rubber chuck carrier),
17 ... surface plate, 18 ... polishing cloth,
22, 52 ... Rigid film,
36 ... Rubber film 37 ... Ring body 38 ... Back plate 39 ... Space part,
40 ... Pressure adjusting mechanism, 41 ... Through hole,
61 ... Polishing device, 65 ... Abrasive, 66 ... Abrasive supply mechanism,
W ... Work.

Claims (8)

at least,
A disk-shaped carrier for holding the back side of the workpiece;
A backing pad that is attached to the lower surface of the carrier and holds the work on the work holding surface of the carrier;
An annular template disposed around the lower surface of the carrier and surrounding the edge of the workpiece, holding the workpiece on the workpiece holding surface of the carrier, and placing the workpiece surface on a surface plate A polishing head that is slidably brought into contact with an attached polishing cloth for polishing,
The polishing head, wherein the template is disposed so as to be adjacent to the backing pad, and is bonded to the lower surface portion of the carrier without the backing pad.   2. The polishing head according to claim 1, wherein a rigid film is bonded to the work holding surface of the carrier, and the backing pad and the template are bonded to the rigid film.   The polishing head according to claim 2, wherein the material of the rigid film is PET.   The polishing head according to any one of claims 1 to 3, wherein the workpiece is a silicon single crystal wafer.   The material of the template is a material whose friction coefficient with the polishing cloth is within ± 25% of the friction coefficient between the polishing cloth and the workpiece at least up to the maximum relative speed. Item 5. The polishing head according to any one of items 4 to 4.   The polishing head according to claim 5, wherein a material of the template is polyimide.   The carrier has a rubber film on at least the work holding surface, and has a sealed space on the opposite side of the rubber film from the work holding surface, and the pressure of the space is changed by a pressure adjustment mechanism. The polishing head according to claim 1, wherein the polishing head is a rubber chuck carrier that adjusts the shape of the workpiece holding surface.   A polishing apparatus for use in polishing the surface of a workpiece, comprising at least an abrasive cloth affixed on a surface plate, an abrasive supply mechanism for supplying an abrasive onto the abrasive cloth, and the workpiece A polishing apparatus comprising the polishing head according to any one of claims 1 to 7 as a polishing head for holding the surface.

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