WO2019058871A1 - Polishing head and method for manufacturing polishing head - Google Patents

Polishing head and method for manufacturing polishing head Download PDF

Info

Publication number
WO2019058871A1
WO2019058871A1 PCT/JP2018/031333 JP2018031333W WO2019058871A1 WO 2019058871 A1 WO2019058871 A1 WO 2019058871A1 JP 2018031333 W JP2018031333 W JP 2018031333W WO 2019058871 A1 WO2019058871 A1 WO 2019058871A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
head
template
adhesive
polishing head
Prior art date
Application number
PCT/JP2018/031333
Other languages
French (fr)
Japanese (ja)
Inventor
浩貴 伝田
小林　義和
優二 川浦
辰男 榎本
Original Assignee
信越半導体株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導体株式会社 filed Critical 信越半導体株式会社
Publication of WO2019058871A1 publication Critical patent/WO2019058871A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a polishing head and a method of manufacturing the polishing head.
  • the polishing of a workpiece such as a semiconductor wafer (simply referred to as a wafer) includes a platen on which a polishing cloth (polishing cloth) is attached, an abrasive supply mechanism for supplying an abrasive (polishing slurry) onto the polishing cloth, and the work It is performed using the polishing apparatus comprised from the polishing head etc. which hold
  • the polishing head has a configuration in which a template (template assembly) in which a backing pad and a guide material made of resin or the like are integrated is attached. Then, when the work is polished, a template is attached to the head body of the polishing head, and the work is wetted on the backing pad surface of the template for polishing. That is, a load is applied to the polishing head in a state where the work is held by water bonding to the template, and the polishing agent is supplied onto the polishing cloth from the polishing agent supply mechanism, and the surface of the work is rotated while the platen and the polishing head are respectively rotated. The work is polished by bringing it into sliding contact with the polishing cloth (see, for example, Patent Document 1 and Patent Document 2).
  • the DIC defect is a convex defect appearing on the workpiece surface which can be observed with a differential interference contrast microscope.
  • the present invention aims to provide a polishing head capable of reducing DIC at the end of template life, and to provide a method of manufacturing such a polishing head.
  • the present invention is a polishing head for holding the back surface of a work and for polishing the surface of the work in sliding contact with a polishing cloth attached to a surface plate, comprising: a head body; And a template for holding the work when polishing the work, wherein the template is adhered to the lower surface peripheral portion of the head main body via an adhesive, and the bonding surface of the head main body with the template
  • the present invention provides a polishing head characterized in that is roughened.
  • the bonding area between the head body and the adhesive becomes large, and the adhesive is less likely to be eluted.
  • the adhesive can be prevented from adhering to the workpiece during polishing of the workpiece, and DIC defects generated in the workpiece can be reduced.
  • a portion of the lower surface peripheral portion of the head main body, which is adhered to the template is made of resin or metal.
  • the present invention can be applied whether the portion of the head body bonded to the template is made of resin or metal.
  • the said adhesive material is an adhesive material adhering to the double-sided tape which comprises the said template.
  • the adhesive is a rubber or acrylic adhesive.
  • the adhesive surface of the head body with the template is roughened. It is particularly preferred to surface.
  • a retainer ring for holding the template in contact with the outer periphery of the work
  • a backing pad for holding the back surface of the work
  • a hot melt for bonding the retainer ring and the backing pad
  • the double-sided tape may be made of a double-sided tape adhered to the lower surface peripheral portion of the head main body, and the double-sided tape may be made of a substrate made of polyethylene terephthalate and an adhesive attached to both sides of the substrate.
  • the present invention is a method of manufacturing a polishing head which holds the back surface of a workpiece and slides the surface of the workpiece in sliding contact with a polishing cloth attached to a surface plate, and the lower surface peripheral portion of the head main body And roughening the workpiece, and bonding the template for holding the workpiece to the peripheral edge of the bottom surface of the roughened head body through an adhesive.
  • a method of manufacturing a polishing head is provided.
  • the roughening treatment by these methods can easily obtain a rough surface.
  • a portion of the lower surface peripheral portion of the head main body to be bonded to the template be made of resin or metal.
  • the present invention can be applied whether the portion of the head body to be bonded to the template is made of resin or metal.
  • the bonding area between the head body and the adhesive increases, and the adhesive is less likely to be eluted during polishing of the work.
  • the adhesive can be prevented from adhering to the workpiece during polishing of the workpiece, and DIC defects generated in the workpiece can be reduced.
  • the reduction effect of the DIC defect is remarkable at the end of life of the template.
  • such a polishing head can be manufactured by a simple method.
  • the adhesive for example, the adhesive of double-sided tape
  • the adhesive which constitutes the template elutes as the template life progresses, which causes the DIC defect.
  • the present inventors examined whether it could not improve the DIC defect by suppressing the elution of the adhesive (glue). As a result, it has been found that the occurrence of DIC defects can be suppressed by using a polishing head in which the bonding surface of the head body with the template is roughened. It is considered that this is because the bonding area between the head body and the adhesive can be expanded, and the adhesive can be less likely to be eluted.
  • the present inventors completed the present invention.
  • the polishing head according to the present invention holds a back surface of a work and polishes the surface of the work in sliding contact with a polishing cloth attached to a surface plate.
  • the polishing head also includes a head body and a template for holding the workpiece when polishing the workpiece.
  • this template is bonded to the lower surface peripheral edge portion of the head main body via an adhesive. Furthermore, the bonding surface of the head body to the template is roughened.
  • polishing head of the present invention will be described with reference to FIGS. 1 and 2.
  • a part (peripheral part) 11 of the head main body has a rough surface (rough surface) 12.
  • the rough surface 12 is a surface on which the peripheral edge portion 11 of the head body adheres to the template.
  • FIG. 2 shows a specific example of bonding between the peripheral portion 11 of the head main body and the template 40.
  • the peripheral portion 11 of the head body is bonded to the template 40 with an adhesive 23.
  • the rough surface 12 of the peripheral portion 11 of the head main body has a large bonding area with the adhesive 23, which can prevent elution of the adhesive 23 during polishing.
  • the peripheral portion 11 of the head main body shown in FIGS. 1 and 2 can be made of resin or metal.
  • the template 40 has a role of holding the workpiece W when pressing the workpiece W against the polishing pad 81 as shown in FIG.
  • FIG. 2 shows a configuration including a retainer ring 37 held in contact with the outer peripheral portion of the workpiece W and a backing pad 33 for holding the back surface of the workpiece W.
  • the retainer ring 37 and the backing pad 33 are bonded by the hot melt 35.
  • the retainer ring 37 can preferably employ glass epoxy resin.
  • the backing pad 33 can be made of a material such as an ester-based polyurethane.
  • the hot melt 35 can be made of a urethane adhesive.
  • the backing pad 33 is bonded to the lower surface peripheral edge portion of the head main body using a double-sided tape 20 via a backing pad base material (made of polyethylene terephthalate or the like) 31.
  • the double-sided tape 20 can be made of, for example, a base material 21 made of polyethylene terephthalate and adhesives 22 and 23 attached to both sides of the base material 21.
  • the adhesive for bonding the template 40 and the lower surface peripheral portion of the head main body can be the adhesive 23 attached to the double-sided adhesive tape 20 constituting the template 40.
  • the lower surface peripheral portion of the head main body and the template 40 can be easily bonded.
  • the present invention can be particularly preferably applied to the case where the lower surface peripheral edge portion of the head main body and the template 40 are bonded in such a manner.
  • the material of the adhesive material 23 is a rubber-type or an acryl-type adhesive material, it is not limited to this.
  • FIG. 3 shows an example of a polishing apparatus equipped with the polishing head 60 of the present invention.
  • the polishing apparatus 90 comprises a polishing head 60.
  • the polishing head 60 comprises at least a head body 61 and a template 40 bonded to the head body 61 via an adhesive.
  • the peripheral edge portion 11 of the head main body 61 has a rough surface on the bonding surface with the template as described above, but in FIG. 3 the rough surface is omitted for the sake of easy viewing.
  • FIG. 3 shows an example of a polishing apparatus equipped with the polishing head 60 of the present invention.
  • the polishing apparatus 90 comprises a polishing head 60.
  • the polishing head 60 comprises at least a head body 61 and a template 40 bonded to the head body 61 via an adhesive.
  • the peripheral edge portion 11 of the head main body 61 has a rough surface on the bonding surface with the template as described above, but in FIG. 3 the rough surface is omitted for the sake of easy viewing.
  • FIG. 3 shows an example
  • the structure of the template 40 shown in FIG. 2 is abbreviate
  • the head main body 61 various known ones can be used.
  • a head main body of a rubber chuck type of an air pressure system can be suitably used.
  • the polishing apparatus 90 shown in FIG. 3 is used when the surface of the workpiece W is polished.
  • the polishing apparatus 90 further includes a surface plate 83 to which the polishing pad 81 is attached, and an abrasive supply mechanism 85 for supplying the polishing agent 87 onto the polishing pad 81. Can be equipped.
  • the workpiece W is polished using such a polishing apparatus 90. That is, the work W is pressed against the polishing pad 81 on the surface plate 83 by the polishing head 60 in a state where the work is held by the template 40 constituting the polishing head 60.
  • the polishing agent 87 is supplied from the polishing agent supply mechanism 85, and the platen 83 and the polishing head 60 are rotated. The workpiece W is thus polished.
  • the bonding area is wide, and the adhesive 23 is hardly eluted.
  • FIG. 6 shows a part (peripheral edge) 111 of a conventional head main body. That is, an example of the head main body in which the bonding surface with the template is not roughened is shown.
  • the configuration of the template 140 is the same as that of FIG. 2 and is composed of a retainer ring 137, a hot melt 135, a backing pad 133, a backing pad substrate (PET etc.) 131, and a double-sided tape 120.
  • Adhesives 122 and 123 adhere to both sides of a substrate (PET or the like) 121 in the double-sided tape 120.
  • the adhesive material 123 is eluted (adhesive material 125).
  • the adhesive 127 may be present also on the polishing pad 181 and may also be present between the work W and the polishing pad 181.
  • the polishing rate is reduced only at that portion, and as shown in FIG. It is thought that it will appear as a defect. That is, the adhesive used when bonding the head body and the template constituting the polishing head is resistant to the alkali of the abrasive and is hard to be polished. The portion that has not been polished (the portion where the polishing rate has become slow) remains as protrusions after the workpiece is cleaned and is counted as a DIC defect.
  • the polishing head 60 according to the present invention is manufactured by the steps of: roughening the lower surface peripheral portion of the head body; and bonding the template to the lower surface peripheral portion of the roughened head body via an adhesive. can do.
  • the material of the portion to be roughened is preferably made of resin or metal as described above.
  • This surface roughening is preferably performed by sand blasting, filing, buffing, or polishing with a wire brush.
  • the roughening treatment by these methods can easily obtain a rough surface.
  • the method of the surface roughening treatment is not particularly limited as long as the surface of the portion of the lower surface peripheral portion of the head main body to be bonded to the template can be roughened.
  • Example 1 As shown below, a part of the configuration is shown in FIGS. 1 and 2 and the polishing head 60 shown in FIG. 3 was manufactured.
  • the surface of the lower surface peripheral portion 11 to be adhered to the template was subjected to a surface roughening treatment by sand blast (see FIGS. 1 and 2). This sandblasting was performed using ceramic-based particles # 220.
  • Ra was 0.87 ⁇ m.
  • the template 40 was adhered to the head body 61 to manufacture a polishing head 60.
  • a polishing head a part of which was shown in FIG. 6, was manufactured as follows. That is, at the peripheral edge portion 111 of the head main body for constituting the polishing head, the template was bonded without roughening on the bonding surface with the template 140, and the polishing head was manufactured. Before bonding, the surface roughness of the bonding surface of the head body to the template was measured, and Ra was 0.08 ⁇ m.
  • FIG. 4 shows the occurrence of DIC defects associated with the head life (from the beginning of life to the end of life) of Example 1 and Comparative Example 1.
  • the horizontal axis is head life (time).
  • the vertical axis is the number of DIC defects generated divided by the number of polished wafers, and is the number of DIC defects generated per workpiece.
  • the DIC defect increased at the end of the life, but in the polishing head 60 using the sandblasted head body 61 of Example 1, the occurrence of the DIC defect was suppressed.
  • the DIC defect in Comparative Example 1 was about 20 nm in height and about 300 ⁇ m in width.
  • Example 2 Comparative Example 2
  • the polishing head 60 (Example 2) using the head main body 61 which has been subjected to the same surface roughening treatment as that of Example 1 and the head not particularly subjected to the surface roughening treatment
  • a polishing head (comparative example 2) using the main body was manufactured.
  • the polishing head 60 of Example 2 was attached to a polishing apparatus different from the polishing apparatus used in Example 1 and Comparative Example 1, and the occurrence of DIC defects was measured.
  • the polishing head of Comparative Example 2 was attached to the same polishing apparatus as that of Example 2, and the occurrence of DIC defects was measured. The transition of the occurrence status of DIC defects measured in this way was compared.
  • Example 2 The generation
  • the normal polishing head of Comparative Example 2 increased DIC defects at the end of life, but the polishing head 60 using the sandblasted head body 61 of Example 2 suppressed the occurrence of DIC defects.
  • the present invention is not limited to the above embodiment.
  • the above embodiment is an exemplification, and it has substantially the same configuration as the technical idea described in the claims of the present invention, and any one having the same function and effect can be used. It is included in the technical scope of the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention provides a polishing head for performing polishing by holding a rear surface of a workpiece and bringing a top surface of the workpiece into sliding contact with a polishing cloth affixed to a platen, characterized in that: the polishing head is provided with a head body and a template which holds the workpiece when the workpiece is being polished; the template is bonded to a lower surface peripheral edge portion of the head body with an adhesive interposed therebetween; and the surface of the head body that is bonded to the template is roughened. By this means, the present invention provides a polishing head with which it is possible to reduce differential interference contrast (DIC) toward the end of the template life.

Description

研磨ヘッド及び研磨ヘッドの製造方法Polishing head and method of manufacturing polishing head
　本発明は、研磨ヘッド及び研磨ヘッドの製造方法に関する。 The present invention relates to a polishing head and a method of manufacturing the polishing head.
　半導体ウェーハ（単にウェーハともいう）等のワークの研磨は、研磨布（研磨クロス）が貼り付けられた定盤と、研磨布上に研磨材（研磨スラリー）を供給する研磨剤供給機構と、ワークを保持する研磨ヘッド等から構成された研磨装置を用いて行われる。 The polishing of a workpiece such as a semiconductor wafer (simply referred to as a wafer) includes a platen on which a polishing cloth (polishing cloth) is attached, an abrasive supply mechanism for supplying an abrasive (polishing slurry) onto the polishing cloth, and the work It is performed using the polishing apparatus comprised from the polishing head etc. which hold | maintain.
　研磨ヘッドは、バッキングパッドと樹脂等からなるガイド材が一体と成ったテンプレート（テンプレートアセンブリ）が貼り付けられた構成となっている。そして、ワークの研磨をする際には、研磨ヘッドのヘッド本体にテンプレートを貼り付け、そのテンプレートのバッキングパッド面にワークを水張りし、研磨を行っている。すなわち、テンプレートにワークを水貼りで保持させた状態で研磨ヘッドに荷重を加え、研磨剤供給機構から研磨布上に研磨剤を供給するとともに、定盤と研磨ヘッドをそれぞれ回転させながらワークの表面を研磨布に摺接させることによりワークを研磨する（例えば、特許文献１、特許文献２参照）。 The polishing head has a configuration in which a template (template assembly) in which a backing pad and a guide material made of resin or the like are integrated is attached. Then, when the work is polished, a template is attached to the head body of the polishing head, and the work is wetted on the backing pad surface of the template for polishing. That is, a load is applied to the polishing head in a state where the work is held by water bonding to the template, and the polishing agent is supplied onto the polishing cloth from the polishing agent supply mechanism, and the surface of the work is rotated while the platen and the polishing head are respectively rotated. The work is polished by bringing it into sliding contact with the polishing cloth (see, for example, Patent Document 1 and Patent Document 2).
特開２００１－３４５２９７号公報JP 2001-345297 A 特開２００９－１６０７０６号公報JP, 2009-160706, A
　従来、複数のワークの研磨を行っていくうちに、テンプレートのライフ進行に伴い、ＤＩＣ（Ｄｉｆｆｅｒｅｎｔｉａｌ　Ｉｎｔｅｒｆｅｒｅｎｃｅ　Ｃｏｎｔｒａｓｔ、差分干渉コントラスト）欠陥と呼ばれる欠陥が研磨後のワークの表面に生じやすくなるという問題があった。ここで、ＤＩＣ欠陥とは、差分干渉コントラスト顕微鏡で観察できる、ワーク表面上に現れる凸状の欠陥である。 Conventionally, while polishing a plurality of workpieces, there is a problem that a defect called a DIC (Differential Interference Contrast) defect is likely to be generated on the surface of the workpiece after polishing as the template life progresses. The Here, the DIC defect is a convex defect appearing on the workpiece surface which can be observed with a differential interference contrast microscope.
　上述の問題点に鑑み、本発明は、テンプレートライフ末期のＤＩＣを低減させることができる、研磨ヘッドを提供すること、及びそのような研磨ヘッドの製造方法を提供することを目的とする。 In view of the above-described problems, the present invention aims to provide a polishing head capable of reducing DIC at the end of template life, and to provide a method of manufacturing such a polishing head.
　上記目的を達成するために、本発明は、ワークの裏面を保持し、定盤上に貼り付けられた研磨布に前記ワークの表面を摺接して研磨する研磨ヘッドであって、ヘッド本体と、前記ワークを研磨する際に前記ワークを保持するテンプレートとを具備し、前記テンプレートが、前記ヘッド本体の下面周縁部に接着材を介して接着されており、前記ヘッド本体の前記テンプレートとの接着面が粗面化されているものであることを特徴とする研磨ヘッドを提供する。 In order to achieve the above object, the present invention is a polishing head for holding the back surface of a work and for polishing the surface of the work in sliding contact with a polishing cloth attached to a surface plate, comprising: a head body; And a template for holding the work when polishing the work, wherein the template is adhered to the lower surface peripheral portion of the head main body via an adhesive, and the bonding surface of the head main body with the template The present invention provides a polishing head characterized in that is roughened.
　このような研磨ヘッドでは、ヘッド本体と接着材との接着面積が広くなり、接着材が溶出しにくくなると考えられる。これにより、ワークの研磨中に接着材がワークに付着することを防止することができ、ワークに生じるＤＩＣ欠陥を低減することができる。 In such a polishing head, it is considered that the bonding area between the head body and the adhesive becomes large, and the adhesive is less likely to be eluted. Thus, the adhesive can be prevented from adhering to the workpiece during polishing of the workpiece, and DIC defects generated in the workpiece can be reduced.
　この場合、前記ヘッド本体の下面周縁部のうち、前記テンプレートと接着されている部分が樹脂又は金属からなるものであることが好ましい。 In this case, it is preferable that a portion of the lower surface peripheral portion of the head main body, which is adhered to the template, is made of resin or metal.
　本発明は、ヘッド本体のテンプレートと接着されている部分が樹脂からなるものであっても、金属からなるものであっても適用することができる。 The present invention can be applied whether the portion of the head body bonded to the template is made of resin or metal.
　また、前記接着材が、前記テンプレートを構成する両面テープに付着している接着材であることが好ましい。また、前記接着材がゴム系又はアクリル系の接着材であることが好ましい。 Moreover, it is preferable that the said adhesive material is an adhesive material adhering to the double-sided tape which comprises the said template. Preferably, the adhesive is a rubber or acrylic adhesive.
　このように、接着材として両面テープに付着している接着材を用いる場合や、ゴム系又はアクリル系の接着材である場合に、本発明のように、ヘッド本体のテンプレートとの接着面を粗面化することが特に好適である。 As described above, in the case of using an adhesive attached to a double-sided tape as an adhesive, or in the case of a rubber-based or acrylic-based adhesive, as in the present invention, the adhesive surface of the head body with the template is roughened. It is particularly preferred to surface.
　また、前記テンプレートを、前記ワークの外周部に当接して保持するリテーナリングと、前記ワークの裏面を保持するバッキングパッドと、前記リテーナリングと前記バッキングパッドを接着するホットメルトと、前記バッキングパッドを前記ヘッド本体の下面周縁部に接着する両面テープとからなり、前記両面テープが、ポリエチレンテレフタラートからなる基材と、前記基材の両面に付着した接着材とからなるものとすることができる。 Further, a retainer ring for holding the template in contact with the outer periphery of the work, a backing pad for holding the back surface of the work, a hot melt for bonding the retainer ring and the backing pad, and the backing pad The double-sided tape may be made of a double-sided tape adhered to the lower surface peripheral portion of the head main body, and the double-sided tape may be made of a substrate made of polyethylene terephthalate and an adhesive attached to both sides of the substrate.
　このような構成を有するテンプレートを用いた研磨ヘッドにおいて、本発明のように、ヘッド本体のテンプレートとの接着面を粗面化することが特に好適である。 In the polishing head using a template having such a configuration, as in the present invention, it is particularly preferable to roughen the bonding surface of the head body with the template.
　また、本発明は、ワークの裏面を保持し、定盤上に貼り付けられた研磨布に前記ワークの表面を摺接して研磨する研磨ヘッドを製造する方法であって、ヘッド本体の下面周縁部を粗面化する工程と、前記ワークを研磨する際に該ワークを保持するテンプレートを、前記粗面化したヘッド本体の下面周縁部に、接着材を介して接着させる工程とを有することを特徴とする研磨ヘッドの製造方法を提供する。 Further, the present invention is a method of manufacturing a polishing head which holds the back surface of a workpiece and slides the surface of the workpiece in sliding contact with a polishing cloth attached to a surface plate, and the lower surface peripheral portion of the head main body And roughening the workpiece, and bonding the template for holding the workpiece to the peripheral edge of the bottom surface of the roughened head body through an adhesive. Provided is a method of manufacturing a polishing head.
　このような研磨ヘッドの製造方法であれば、ワークの研磨中に接着材がワークに付着することを防止することができ、ワークに生じるＤＩＣ欠陥を低減することができる研磨ヘッドを製造することができる。 With such a method of manufacturing a polishing head, it is possible to prevent the adhesive from adhering to the workpiece during polishing of the workpiece, and to manufacture a polishing head capable of reducing DIC defects generated in the workpiece. it can.
　このとき、前記粗面化をサンドブラスト、やすりがけ、バフ研磨、又はワイヤブラシによる研磨によって行うことが好ましい。 At this time, it is preferable to carry out the surface roughening by sandblasting, filing, buffing, or polishing with a wire brush.
　これらの手法による粗面化処理は、簡便に粗面を得ることができる。 The roughening treatment by these methods can easily obtain a rough surface.
　また、前記ヘッド本体の下面周縁部のうち、前記テンプレートと接着する部分を樹脂又は金属からなるものとすることが好ましい。 Further, it is preferable that a portion of the lower surface peripheral portion of the head main body to be bonded to the template be made of resin or metal.
　本発明は、ヘッド本体のテンプレートと接着する部分が樹脂からなるものであっても、金属からなるものであっても適用することができる。 The present invention can be applied whether the portion of the head body to be bonded to the template is made of resin or metal.
　本発明の研磨ヘッドでは、ヘッド本体と接着材との接着面積が広くなり、ワークの研磨中に接着材が溶出しにくくなる。これにより、ワークの研磨中に接着材がワークに付着することを防止することができ、ワークに生じるＤＩＣ欠陥を低減することができる。特に、ＤＩＣ欠陥の低減効果は、テンプレートのライフ末期に効果が顕著である。また、本発明の研磨ヘッドの製造方法では、そのような研磨ヘッドを簡便な方法で製造することができる。 In the polishing head according to the present invention, the bonding area between the head body and the adhesive increases, and the adhesive is less likely to be eluted during polishing of the work. Thus, the adhesive can be prevented from adhering to the workpiece during polishing of the workpiece, and DIC defects generated in the workpiece can be reduced. In particular, the reduction effect of the DIC defect is remarkable at the end of life of the template. Moreover, in the method of manufacturing a polishing head of the present invention, such a polishing head can be manufactured by a simple method.
本発明のヘッド本体の周縁部の一例を示す概略断面図である。It is a schematic sectional drawing which shows an example of the peripheral part of the head main body of this invention. 本発明の研磨ヘッドの一例の一部を示す概略断面図である。It is a schematic sectional drawing which shows a part of example of the polishing head of this invention. 本発明の研磨ヘッドを具備する、研磨装置の一例を示す概略図である。It is the schematic which shows an example of a grinding | polishing apparatus which comprises the grinding | polishing head of this invention. 実施例１と比較例１の結果を示すグラフである。It is a graph which shows the result of Example 1 and Comparative Example 1. 実施例２と比較例２の結果を示すグラフである。It is a graph which shows the result of Example 2 and Comparative Example 2. 従来の研磨ヘッドの一例の一部を示す概略断面図である。It is a schematic sectional drawing which shows a part of example of the conventional polishing head. ＤＩＣ欠陥が生じるメカニズムを説明するための概略断面図である。It is a schematic sectional drawing for demonstrating the mechanism in which a DIC defect arises.
　本発明者らの従来の知見によると、テンプレートライフ進行に伴い、テンプレートを構成する接着材（例えば、両面テープの糊）が溶出して、それがＤＩＣ欠陥の原因になっていると考えられていた。本発明者らは、この接着材（糊）の溶出を抑制して、ＤＩＣ欠陥の改善をできないか検討した。その結果、ヘッド本体におけるテンプレートとの接着面が粗面化されているものを研磨ヘッドに用いることにより、ＤＩＣ欠陥の発生を抑制することができることを見出した。これは、ヘッド本体と接着材の接着面積を広げることができ、接着材が溶出しにくくすることができることによるものと考えられる。このようにして本発明者らは、本発明を完成させた。 According to the prior findings of the present inventors, it is considered that the adhesive (for example, the adhesive of double-sided tape) which constitutes the template elutes as the template life progresses, which causes the DIC defect. The The present inventors examined whether it could not improve the DIC defect by suppressing the elution of the adhesive (glue). As a result, it has been found that the occurrence of DIC defects can be suppressed by using a polishing head in which the bonding surface of the head body with the template is roughened. It is considered that this is because the bonding area between the head body and the adhesive can be expanded, and the adhesive can be less likely to be eluted. Thus, the present inventors completed the present invention.
　以下、本発明について、図を参照しながら詳細に説明するが、本発明はこれに限定されるものではない。 Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto.
　本発明の研磨ヘッドは、ワークの裏面を保持し、定盤上に貼り付けられた研磨布にワークの表面を摺接して研磨するものである。また、この研磨ヘッドは、ヘッド本体と、ワークを研磨する際にワークを保持するテンプレートとを具備する。また、このテンプレートは、ヘッド本体の下面周縁部に接着材を介して接着されている。さらに、ヘッド本体のテンプレートとの接着面が粗面化されている。 The polishing head according to the present invention holds a back surface of a work and polishes the surface of the work in sliding contact with a polishing cloth attached to a surface plate. The polishing head also includes a head body and a template for holding the workpiece when polishing the workpiece. In addition, this template is bonded to the lower surface peripheral edge portion of the head main body via an adhesive. Furthermore, the bonding surface of the head body to the template is roughened.
　図１及び図２を参照して、本発明の研磨ヘッドについて説明する。 The polishing head of the present invention will be described with reference to FIGS. 1 and 2.
　図１に示したように、ヘッド本体の一部（周縁部）１１は、粗面（粗面化面）１２を有している。粗面１２は、ヘッド本体の周縁部１１がテンプレートと接着する面である。図２には、ヘッド本体の周縁部１１とテンプレート４０の接着の具体例を示している。ヘッド本体の周縁部１１は、テンプレート４０と接着材２３で接着される。図２に示したように、ヘッド本体の周縁部１１の粗面１２は接着材２３との接着面積が広く、これにより、研磨中の接着材２３の溶出を防止することができる。図１、２に示したヘッド本体の周縁部１１は樹脂又は金属からなるものとすることができる。テンプレート４０は、図２に示したように、ワークＷを研磨布８１に押圧する際にワークＷを保持する役目を有する。 As shown in FIG. 1, a part (peripheral part) 11 of the head main body has a rough surface (rough surface) 12. The rough surface 12 is a surface on which the peripheral edge portion 11 of the head body adheres to the template. FIG. 2 shows a specific example of bonding between the peripheral portion 11 of the head main body and the template 40. The peripheral portion 11 of the head body is bonded to the template 40 with an adhesive 23. As shown in FIG. 2, the rough surface 12 of the peripheral portion 11 of the head main body has a large bonding area with the adhesive 23, which can prevent elution of the adhesive 23 during polishing. The peripheral portion 11 of the head main body shown in FIGS. 1 and 2 can be made of resin or metal. The template 40 has a role of holding the workpiece W when pressing the workpiece W against the polishing pad 81 as shown in FIG.
　図２には、テンプレート４０の具体例として、ワークＷの外周部に当接して保持するリテーナリング３７とワークＷの裏面を保持するバッキングパッド３３とを具備する構成を示している。この例では、リテーナリング３７とバッキングパッド３３はホットメルト３５で接着される。リテーナリング３７はガラスエポキシ樹脂を好適に採用することができる。バッキングパッド３３は、エステル系ポリウレタン等の材質を使用することができる。また、ホットメルト３５は、ウレタン系接着材とすることができる。また、バッキングパッド３３はバッキングパッド用基材（ポリエチレンテレフタラート製等）３１を介して、ヘッド本体の下面周縁部に両面テープ２０を用いて接着される。両面テープ２０は、例えばポリエチレンテレフタラートからなる基材２１と、基材２１の両面に付着した接着材２２、２３とからなるものとすることができる。 As a specific example of the template 40, FIG. 2 shows a configuration including a retainer ring 37 held in contact with the outer peripheral portion of the workpiece W and a backing pad 33 for holding the back surface of the workpiece W. In this example, the retainer ring 37 and the backing pad 33 are bonded by the hot melt 35. The retainer ring 37 can preferably employ glass epoxy resin. The backing pad 33 can be made of a material such as an ester-based polyurethane. The hot melt 35 can be made of a urethane adhesive. The backing pad 33 is bonded to the lower surface peripheral edge portion of the head main body using a double-sided tape 20 via a backing pad base material (made of polyethylene terephthalate or the like) 31. The double-sided tape 20 can be made of, for example, a base material 21 made of polyethylene terephthalate and adhesives 22 and 23 attached to both sides of the base material 21.
　本発明では、ヘッド本体の下面周縁部とテンプレート４０を接着する接着材を、テンプレート４０を構成する両面テープ２０に付着している接着材２３とすることができる。これによりヘッド本体の下面周縁部とテンプレート４０とを容易に接着することができる。また、本発明は、このような態様でヘッド本体の下面周縁部とテンプレート４０が接着される場合に特に好ましく適用することができる。また、接着材２３の材質は、ゴム系又はアクリル系の接着材であることが好ましいが、これに限定されない。 In the present invention, the adhesive for bonding the template 40 and the lower surface peripheral portion of the head main body can be the adhesive 23 attached to the double-sided adhesive tape 20 constituting the template 40. Thus, the lower surface peripheral portion of the head main body and the template 40 can be easily bonded. Further, the present invention can be particularly preferably applied to the case where the lower surface peripheral edge portion of the head main body and the template 40 are bonded in such a manner. Moreover, although it is preferable that the material of the adhesive material 23 is a rubber-type or an acryl-type adhesive material, it is not limited to this.
　図２に示したヘッド本体の一部（周縁部）１１は、研磨ヘッドを構成するヘッド本体の一部を構成するものとして、一体化したものであってもよく、リング状の別部品としてヘッド本体の一部を構成するものであってもよい。図３に本発明の研磨ヘッド６０を具備する、研磨装置の一例を示した。研磨装置９０は、研磨ヘッド６０を具備する。研磨ヘッド６０は、少なくともヘッド本体６１と、ヘッド本体６１に接着材を介して接着されたテンプレート４０を具備する。ヘッド本体６１の周縁部１１は、上記のように、テンプレートとの接着面に粗面を有するが、図３では見やすさのため粗面を省略している。また、図３では、図２に示したテンプレート４０の構造を省略して示している。ヘッド本体６１は、公知の種々のものを用いることができ、例えば、エアー加圧方式のラバーチャック型のヘッド本体を好適に用いることができる。 A part (peripheral edge part) 11 of the head main body shown in FIG. 2 may be integrated as a part of the head main body constituting the polishing head, or may be integrated as a separate part in a ring shape. It may constitute a part of the main body. FIG. 3 shows an example of a polishing apparatus equipped with the polishing head 60 of the present invention. The polishing apparatus 90 comprises a polishing head 60. The polishing head 60 comprises at least a head body 61 and a template 40 bonded to the head body 61 via an adhesive. The peripheral edge portion 11 of the head main body 61 has a rough surface on the bonding surface with the template as described above, but in FIG. 3 the rough surface is omitted for the sake of easy viewing. Moreover, in FIG. 3, the structure of the template 40 shown in FIG. 2 is abbreviate | omitted and shown. As the head main body 61, various known ones can be used. For example, a head main body of a rubber chuck type of an air pressure system can be suitably used.
　また、図３に示した研磨装置９０は、ワークＷの表面を研磨する際に使用するものである。研磨装置９０は、ワークＷを保持するための研磨ヘッド６０の他、研磨布８１が貼り付けられた定盤８３と、研磨布８１上に研磨剤８７を供給するための研磨剤供給機構８５とを具備することができる。 The polishing apparatus 90 shown in FIG. 3 is used when the surface of the workpiece W is polished. In addition to the polishing head 60 for holding the work W, the polishing apparatus 90 further includes a surface plate 83 to which the polishing pad 81 is attached, and an abrasive supply mechanism 85 for supplying the polishing agent 87 onto the polishing pad 81. Can be equipped.
　ワークＷを研磨する際には、このような研磨装置９０を用いてワークＷを研磨する。すなわち、研磨ヘッド６０を構成するテンプレート４０によりワークを保持した状態で研磨ヘッド６０によりワークＷを定盤８３上の研磨布８１に押しつける。これとともに、研磨剤供給機構８５から研磨剤８７を供給し、定盤８３及び研磨ヘッド６０を回転させる。これによりワークＷが研磨される。このとき、図２に示したように、テンプレート４０はヘッド本体６１の下面周縁部の粗面化面１２と接着されているため、接着面積が広く、接着材２３が溶出しにくい。 When the workpiece W is polished, the workpiece W is polished using such a polishing apparatus 90. That is, the work W is pressed against the polishing pad 81 on the surface plate 83 by the polishing head 60 in a state where the work is held by the template 40 constituting the polishing head 60. At the same time, the polishing agent 87 is supplied from the polishing agent supply mechanism 85, and the platen 83 and the polishing head 60 are rotated. The workpiece W is thus polished. At this time, as shown in FIG. 2, since the template 40 is bonded to the roughened surface 12 of the lower surface peripheral portion of the head main body 61, the bonding area is wide, and the adhesive 23 is hardly eluted.
　これに対し、図６に、従来のヘッド本体の一部（周縁部）１１１を示した。すなわち、テンプレートとの接着面が粗面化されていないヘッド本体の例を示した。テンプレート１４０の構成は、図２と同様であり、リテーナリング１３７、ホットメルト１３５、バッキングパッド１３３、バッキングパッド用基材（ＰＥＴ等）１３１、両面テープ１２０からなる。両面テープ１２０は基材（ＰＥＴ等）１２１の両面に接着材１２２及び１２３が付着している。この場合、ヘッド本体の周縁部１１１において、テンプレート１４０との接着面が粗面化されていないため、接着材１２３が溶出すると考えられる（接着材１２５）。これにより、接着材１２７が研磨布１８１上にも存在することがあり、ワークＷと研磨布１８１の間にも存在することがあると考えられる。 On the other hand, FIG. 6 shows a part (peripheral edge) 111 of a conventional head main body. That is, an example of the head main body in which the bonding surface with the template is not roughened is shown. The configuration of the template 140 is the same as that of FIG. 2 and is composed of a retainer ring 137, a hot melt 135, a backing pad 133, a backing pad substrate (PET etc.) 131, and a double-sided tape 120. Adhesives 122 and 123 adhere to both sides of a substrate (PET or the like) 121 in the double-sided tape 120. In this case, since the bonding surface with the template 140 is not roughened at the peripheral edge portion 111 of the head main body, it is considered that the adhesive material 123 is eluted (adhesive material 125). Thus, it is considered that the adhesive 127 may be present also on the polishing pad 181 and may also be present between the work W and the polishing pad 181.
　図７（ａ）に示したように、このようにワークＷと研磨布１８１の間に接着材１２７が存在すると、その部分だけ研磨速度が遅くなり、図７（ｂ）に示したようにＤＩＣ欠陥として現れてしまうと考えられる。すなわち、研磨ヘッドを構成するヘッド本体とテンプレートを接着する際に用いられる接着材は、研磨材のアルカリに強く、研磨されにくい。研磨されなかった部分（研磨速度が遅くなった部分）は、ワーク洗浄後に突起として残り、ＤＩＣ欠陥としてカウントされる。 As shown in FIG. 7A, when the adhesive 127 is present between the workpiece W and the polishing pad 181 as described above, the polishing rate is reduced only at that portion, and as shown in FIG. It is thought that it will appear as a defect. That is, the adhesive used when bonding the head body and the template constituting the polishing head is resistant to the alkali of the abrasive and is hard to be polished. The portion that has not been polished (the portion where the polishing rate has become slow) remains as protrusions after the workpiece is cleaned and is counted as a DIC defect.
　上記の本発明の研磨ヘッド６０は、ヘッド本体の下面周縁部を粗面化する工程と、該粗面化したヘッド本体の下面周縁部に、接着材を介してテンプレートを接着させる工程とによって製造することができる。ヘッド本体の下面周縁部のうち、粗面化を行う部分の材質は、上記のように樹脂又は金属からなるものが好適である。この粗面化は、サンドブラスト、やすりがけ、バフ研磨、又はワイヤブラシによる研磨によって行うことが好ましい。これらの手法による粗面化処理は、簡便に粗面を得ることができる。ただし、ヘッド本体の下面周縁部のうち、テンプレートと接着する部分の表面を粗面化できれば、粗面化処理の手法は特に限定されない。 The polishing head 60 according to the present invention is manufactured by the steps of: roughening the lower surface peripheral portion of the head body; and bonding the template to the lower surface peripheral portion of the roughened head body via an adhesive. can do. Of the lower surface peripheral portion of the head main body, the material of the portion to be roughened is preferably made of resin or metal as described above. This surface roughening is preferably performed by sand blasting, filing, buffing, or polishing with a wire brush. The roughening treatment by these methods can easily obtain a rough surface. However, the method of the surface roughening treatment is not particularly limited as long as the surface of the portion of the lower surface peripheral portion of the head main body to be bonded to the template can be roughened.
　以下、実施例及び比較例を示して本発明をより具体的に説明するが、本発明はこれらに限定されるものではない。 EXAMPLES The present invention will be more specifically described below with reference to examples and comparative examples, but the present invention is not limited to these.
（実施例１）
　以下のように、図１、２に構成の一部を示し、図３中に示した研磨ヘッド６０を製造した。まず、研磨ヘッドを構成するためのヘッド本体６１において、下面周縁部１１のうちテンプレートと接着させる面に対して、サンドブラストにより粗面化加工処理を行った（図１、２参照）。このサンドブラスト加工は、セラミック系粒子＃２２０を用いて行った。この実施例１におけるヘッド本体の粗面化面１２の表面粗さを測定したところ、Ｒａが０．８７μｍであった。このヘッド本体６１にテンプレート４０を接着させ、研磨ヘッド６０を製造した。 Example 1
As shown below, a part of the configuration is shown in FIGS. 1 and 2 and the polishing head 60 shown in FIG. 3 was manufactured. First, in the head main body 61 for constituting the polishing head, the surface of the lower surface peripheral portion 11 to be adhered to the template was subjected to a surface roughening treatment by sand blast (see FIGS. 1 and 2). This sandblasting was performed using ceramic-based particles # 220. When the surface roughness of the roughened surface 12 of the head main body in this Example 1 was measured, Ra was 0.87 μm. The template 40 was adhered to the head body 61 to manufacture a polishing head 60.
（比較例１）
　以下のように、図６に構成の一部を示した研磨ヘッドを製造した。すなわち、研磨ヘッドを構成するためのヘッド本体の周縁部１１１において、テンプレート１４０との接着面に対して特に粗面化を行うことなくテンプレートを接着させ、研磨ヘッドを製造した。接着前に、ヘッド本体のテンプレートとの接着面の表面粗さを測定したところＲａが０．０８μｍであった。 (Comparative example 1)
A polishing head, a part of which was shown in FIG. 6, was manufactured as follows. That is, at the peripheral edge portion 111 of the head main body for constituting the polishing head, the template was bonded without roughening on the bonding surface with the template 140, and the polishing head was manufactured. Before bonding, the surface roughness of the bonding surface of the head body to the template was measured, and Ra was 0.08 μm.
（実施例１、比較例１の研磨ヘッドを用いた研磨結果）
　研磨装置に、実施例１の研磨ヘッドを取り付け、ＤＩＣ欠陥の発生状況を測定した。また、実施例１と同一の研磨装置に比較例１の研磨ヘッドを取り付け、ＤＩＣ欠陥の発生状況を測定した。このようにして測定した両者のＤＩＣ欠陥の発生状況の推移を比較した。 (Polishing results using the polishing head of Example 1 and Comparative Example 1)
The polishing head of Example 1 was attached to a polishing apparatus, and the occurrence of DIC defects was measured. Further, the polishing head of Comparative Example 1 was attached to the same polishing apparatus as that of Example 1, and the occurrence of DIC defects was measured. The transition of the occurrence status of DIC defects measured in this way was compared.
　図４に、実施例１及び比較例１のヘッドライフ（ライフ初期からライフ末期まで）に伴うＤＩＣ欠陥の発生状況を示した。横軸はヘッドライフ（時間）である。縦軸はＤＩＣ欠陥の発生個数を研磨枚数で割ったものであり、ワーク１枚あたりのＤＩＣ欠陥発生個数である。比較例１の研磨ヘッドはライフ末期でＤＩＣ欠陥が増加したが、実施例１のサンドブラスト加工をしたヘッド本体６１を用いた研磨ヘッド６０では、ＤＩＣ欠陥の発生は抑えられていた。比較例１におけるＤＩＣ欠陥は、高さ２０ｎｍ程度、幅３００μｍ程度であった。 FIG. 4 shows the occurrence of DIC defects associated with the head life (from the beginning of life to the end of life) of Example 1 and Comparative Example 1. The horizontal axis is head life (time). The vertical axis is the number of DIC defects generated divided by the number of polished wafers, and is the number of DIC defects generated per workpiece. In the polishing head of Comparative Example 1, the DIC defect increased at the end of the life, but in the polishing head 60 using the sandblasted head body 61 of Example 1, the occurrence of the DIC defect was suppressed. The DIC defect in Comparative Example 1 was about 20 nm in height and about 300 μm in width.
（実施例２、比較例２）
　実施例１、比較例１とは別に、実施例１と同様の粗面化処理を行ったヘッド本体６１を用いた研磨ヘッド６０（実施例２）、及び特に粗面化処理を行わなかったヘッド本体を用いた研磨ヘッド（比較例２）を製造した。次に、実施例１、比較例１で用いた研磨装置とは別の研磨装置に、実施例２の研磨ヘッド６０を取り付け、ＤＩＣ欠陥の発生状況を測定した。また、実施例２と同一の研磨装置に比較例２の研磨ヘッドを取り付け、ＤＩＣ欠陥の発生状況を測定した。このようにして測定した両者のＤＩＣ欠陥の発生状況の推移を比較した。 (Example 2, Comparative Example 2)
Apart from Example 1 and Comparative Example 1, the polishing head 60 (Example 2) using the head main body 61 which has been subjected to the same surface roughening treatment as that of Example 1 and the head not particularly subjected to the surface roughening treatment A polishing head (comparative example 2) using the main body was manufactured. Next, the polishing head 60 of Example 2 was attached to a polishing apparatus different from the polishing apparatus used in Example 1 and Comparative Example 1, and the occurrence of DIC defects was measured. Further, the polishing head of Comparative Example 2 was attached to the same polishing apparatus as that of Example 2, and the occurrence of DIC defects was measured. The transition of the occurrence status of DIC defects measured in this way was compared.
　図５に、実施例２及び比較例２のヘッドライフ（ライフ初期からライフ末期まで）に伴うＤＩＣ欠陥の発生状況を示した。比較例２の通常の研磨ヘッドはライフ末期でＤＩＣ欠陥が増加したが、実施例２のサンドブラスト加工をしたヘッド本体６１を用いた研磨ヘッド６０では、ＤＩＣ欠陥の発生は抑えられていた。 The generation | occurrence | production condition of the DIC defect accompanying the head life (from life initial stage to life end stage) of Example 2 and Comparative Example 2 was shown in FIG. The normal polishing head of Comparative Example 2 increased DIC defects at the end of life, but the polishing head 60 using the sandblasted head body 61 of Example 2 suppressed the occurrence of DIC defects.
　なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は、例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 The present invention is not limited to the above embodiment. The above embodiment is an exemplification, and it has substantially the same configuration as the technical idea described in the claims of the present invention, and any one having the same function and effect can be used. It is included in the technical scope of the invention.

Claims (8)

  1. 　ワークの裏面を保持し、定盤上に貼り付けられた研磨布に前記ワークの表面を摺接して研磨する研磨ヘッドであって、
    　ヘッド本体と、
    　前記ワークを研磨する際に前記ワークを保持するテンプレートと
    　を具備し、
    　前記テンプレートが、前記ヘッド本体の下面周縁部に接着材を介して接着されており、
    　前記ヘッド本体の前記テンプレートとの接着面が粗面化されているものであることを特徴とする研磨ヘッド。     A polishing head for holding the back surface of a workpiece and for polishing the surface of the workpiece in sliding contact with a polishing cloth attached to a surface plate,
    Head body,
    And a template for holding the work when polishing the work.
    The template is bonded to the lower surface peripheral portion of the head main body through an adhesive.
    A polishing head characterized in that a bonding surface of the head body with the template is roughened.
  2. 　前記ヘッド本体の下面周縁部のうち、前記テンプレートと接着されている部分が樹脂又は金属からなるものであることを特徴とする請求項１に記載の研磨ヘッド。 The polishing head according to claim 1, wherein a portion of the lower surface peripheral portion of the head main body, which is adhered to the template, is made of resin or metal.
  3. 　前記接着材が、前記テンプレートを構成する両面テープに付着している接着材であることを特徴とする請求項１又は請求項２に記載の研磨ヘッド。 The polishing head according to claim 1 or 2, wherein the adhesive is an adhesive attached to a double-sided tape constituting the template.
  4. 　前記接着材がゴム系又はアクリル系の接着材であることを特徴とする請求項３に記載の研磨ヘッド。 The polishing head according to claim 3, wherein the adhesive is a rubber-based or acrylic adhesive.
  5. 　前記テンプレートが、
    　前記ワークの外周部に当接して保持するリテーナリングと、
    　前記ワークの裏面を保持するバッキングパッドと、
    　前記リテーナリングと前記バッキングパッドを接着するホットメルトと、
    　前記バッキングパッドを前記ヘッド本体の下面周縁部に接着する両面テープと
    　からなり、
    　前記両面テープが、ポリエチレンテレフタラートからなる基材と、前記基材の両面に付着した接着材とからなるものであることを特徴とする請求項１から請求項４のいずれか１項に記載の研磨ヘッド。     The template is
    A retainer ring held in contact with the outer peripheral portion of the work;
    A backing pad for holding the back side of the work;
    Hot melt bonding the retaining ring and the backing pad;
    And a double-sided tape for bonding the backing pad to the lower surface peripheral portion of the head body.
    The said double-sided tape consists of a base material which consists of polyethylene terephthalate, and an adhesive attached to both sides of the base material. Polishing head.
  6. 　ワークの裏面を保持し、定盤上に貼り付けられた研磨布に前記ワークの表面を摺接して研磨する研磨ヘッドを製造する方法であって、
    　ヘッド本体の下面周縁部を粗面化する工程と、
    　前記ワークを研磨する際に該ワークを保持するテンプレートを、前記粗面化したヘッド本体の下面周縁部に、接着材を介して接着させる工程と
    　を有することを特徴とする研磨ヘッドの製造方法。     A method of manufacturing a polishing head, which holds a back surface of a work and slides the surface of the work in sliding contact with a polishing cloth attached to a surface plate,
    Roughening the lower surface peripheral portion of the head body;
    Bonding the template for holding the work to the peripheral edge of the lower surface of the roughened head body through the adhesive when the work is polished.
  7. 　前記粗面化をサンドブラスト、やすりがけ、バフ研磨、又はワイヤブラシによる研磨によって行うことを特徴とする請求項６に記載の研磨ヘッドの製造方法。 The method of manufacturing a polishing head according to claim 6, wherein the surface roughening is performed by sand blasting, sanding, buffing, or polishing with a wire brush.
  8. 　前記ヘッド本体の下面周縁部のうち、前記テンプレートと接着する部分を樹脂又は金属からなるものとすることを特徴とする請求項６又は請求項７に記載の研磨ヘッドの製造方法。 8. The method for manufacturing a polishing head according to claim 6, wherein a portion of the lower surface peripheral portion of the head main body to be bonded to the template is made of resin or metal.
PCT/JP2018/031333 2017-09-22 2018-08-24 Polishing head and method for manufacturing polishing head WO2019058871A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017182954A JP2019058955A (en) 2017-09-22 2017-09-22 Polishing head and manufacturing method of the same
JP2017-182954 2017-09-22

Publications (1)

Publication Number Publication Date
WO2019058871A1 true WO2019058871A1 (en) 2019-03-28

Family

ID=65810267

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/031333 WO2019058871A1 (en) 2017-09-22 2018-08-24 Polishing head and method for manufacturing polishing head

Country Status (3)

Country Link
JP (1) JP2019058955A (en)
TW (1) TW201914745A (en)
WO (1) WO2019058871A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809626B1 (en) 2020-04-08 2021-01-06 信越半導体株式会社 DIC defect shape measurement method and polishing method for silicon wafers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310057U (en) * 1986-07-07 1988-01-22
JPH0251057U (en) * 1988-10-03 1990-04-10
JP2001287157A (en) * 2000-04-07 2001-10-16 Sumitomo Metal Ind Ltd Device and method for sample polishing
JP2006128271A (en) * 2004-10-27 2006-05-18 Shin Etsu Handotai Co Ltd Work holding plate, method of manufacturing semiconductor wafer and polishing method
JP2014233815A (en) * 2013-06-04 2014-12-15 信越半導体株式会社 Manufacturing method of polishing head and polishing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310057U (en) * 1986-07-07 1988-01-22
JPH0251057U (en) * 1988-10-03 1990-04-10
JP2001287157A (en) * 2000-04-07 2001-10-16 Sumitomo Metal Ind Ltd Device and method for sample polishing
JP2006128271A (en) * 2004-10-27 2006-05-18 Shin Etsu Handotai Co Ltd Work holding plate, method of manufacturing semiconductor wafer and polishing method
JP2014233815A (en) * 2013-06-04 2014-12-15 信越半導体株式会社 Manufacturing method of polishing head and polishing device

Also Published As

Publication number Publication date
JP2019058955A (en) 2019-04-18
TW201914745A (en) 2019-04-16

Similar Documents

Publication Publication Date Title
JP4374370B2 (en) Polishing head and polishing apparatus
KR100842473B1 (en) Wafer manufacturing method, polishing apparatus, and wafer
TWI421934B (en) Method for polishing a semiconductor wafer
JP6401319B2 (en) Polishing equipment
CN107210210B (en) Suction chuck, chamfer polishing device, and chamfer polishing method for silicon wafer
TW201200294A (en) Polishing head and polishing device
CN103702798A (en) Polishing head, polishing device, and workpiece polishing method
JP2007012918A (en) Polishing head
JP5145131B2 (en) Manufacturing method of polishing head
WO2019058871A1 (en) Polishing head and method for manufacturing polishing head
JP2008093811A (en) Polishing head and polishing device
JP2005224892A (en) Polishing method
JP6604472B2 (en) Polishing pad
JP2018069352A (en) Polishing head and polishing device
JPH11188590A (en) Edge polishing device
JP6439963B2 (en) Holding tool and manufacturing method thereof
JP2016049606A (en) Polishing device
CN216913288U (en) Self-adaptive polishing sheet
JP2015205389A (en) Polishing pad and polishing device
JP2008053376A (en) Cmp pad
JP5655584B2 (en) Semiconductor device manufacturing method and polishing sheet
JP2006055964A (en) Smoothing tool
JP2007030073A (en) Polisher, polishing tool and manufacturing method of polisher
JP2008103568A (en) Polishing head, polishing device, and workpiece removal method
JP2001054858A (en) Glass board surface processing method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18858950

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18858950

Country of ref document: EP

Kind code of ref document: A1