US20170252893A1 - Polishing machine work piece holder - Google Patents
Polishing machine work piece holder Download PDFInfo
- Publication number
- US20170252893A1 US20170252893A1 US15/447,825 US201715447825A US2017252893A1 US 20170252893 A1 US20170252893 A1 US 20170252893A1 US 201715447825 A US201715447825 A US 201715447825A US 2017252893 A1 US2017252893 A1 US 2017252893A1
- Authority
- US
- United States
- Prior art keywords
- work piece
- piece holder
- frame
- polymer film
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Definitions
- the present invention is directed to the field of polishing machines, including but not limited to a polishing machine work piece holder.
- Polishing machines utilize work piece holders to hold and support flat work pieces, sometimes referred to as wafers, such as silicon wafers that are used in the electronics industry.
- a work piece holder for use in a polishing machine.
- the work piece holder has a frame composed of a thermoset material and/or a thermoplastic material.
- the frame has at least one cavity for receiving and supporting a work piece to be polished in the polishing machine.
- a polymer film is permanently affixed in the at least one cavity.
- a work piece holder for use in a polishing machine.
- the work piece holder having a frame composed of a thermoset material and/or a thermoplastic material.
- the frame has at least one cavity for receiving and supporting a work piece to be polished in the polishing machine.
- a polymer film is permanently affixed in the at least one cavity.
- the frame includes a first frame portion and a second frame portion, the first frame portion having at least one through opening formed therein.
- An advantage of exemplary embodiments is that the work piece holders permit preparation of work pieces having improved precision, as well as having improved service lives.
- FIG. 1 is a work piece holder according to an embodiment of the disclosure.
- FIG. 2 is a section view taken along line 2 - 2 in FIG. 1 .
- FIG. 3 is an exploded view of the work piece holder of FIG. 1 .
- FIG. 4 is a section view taken along line 2 - 2 in FIG. 1 .
- FIG. 5 is an exploded view of the work piece holder of FIG. 4 .
- a flat template or work piece holder 10 includes a frame 11 that is releasably secured to a carrier 12 by an adhesive layer 14 .
- Work piece holder 10 can be composed of a thermoset material and/or a thermoplastic material.
- a thermoset material can be bonded to and/or surrounded by a thermoplastic material or vice versa to maximize the performance of work piece holder 10 .
- Frame 11 of work piece holder 10 has a plurality of openings 16 , such as counterbored openings extending partially through work piece holder 10 to a surface 19 .
- Surfaces 19 of counterbored openings 16 have a depth 17 .
- Each opening 16 and corresponding surface 19 defines a cavity 23 .
- work piece holder 10 includes a shim or a pad or film layer or film, such as a polymer film 18 having an adhesive layer 21 for permanently affixing polymer film 18 to a corresponding surface 19 of counterbored opening 16 .
- a work piece 20 ( FIG. 1 ) is releasably adhered to polymer film 18 , such that work piece 20 is releasably secured to and supported by cavity 23 ( FIG. 3 ).
- the combined thickness of adhesive layer 21 , polymer film 18 , and work piece 20 exceeds the thickness of depth 17 of cavity 23 of work piece holder 10 .
- Carrier 12 is adapted to rotate around bearing 22 on spindle 24 for purposes of polishing the exposed surface protruding beyond the adjacent exposed major face of work piece holder 10 .
- frame 11 is composed of a thermoset epoxy and/or thermoplastic material(s).
- frame 11 is visually transparent, permitting an operator to confirm work pieces 20 are mounted properly in their respective cavities 23 prior to operating the polishing machine. This ability to visually confirm proper work piece mounting is not possible with conventional work piece holders.
- visually transparent is intended to indicate a material property of a component sufficiently permitting light to pass through, such that in response to the component being interposed in-line between a vantage point of an observer and an object, the component is viewable by an observer through the component.
- the term “visually transparent” is intended to include components that are fully visually transparent, partially transparent or translucent or combination thereof
- a flat template or work piece holder 100 is similar to work piece holder 10 , except as discussed.
- Work piece holder 100 includes a frame portion 110 that is releasably secured to a carrier 12 by an adhesive layer 14 .
- Work piece holder 100 can be composed of a thermoset material and/or a thermoplastic material. In one embodiment, a thermoset material can be bonded to and/or surrounded by a thermoplastic material or vice versa to maximize the performance of work piece holder 100 .
- Frame portion 110 of work piece holder 100 is permanently secured to frame portion 112 by an adhesive layer 114 .
- Frame portion 112 has a plurality of openings 16 extending therethrough.
- openings 16 Upon assembly of frame portions 110 , 112 with adhesive layer 114 , openings 16 have a closed end corresponding to the facing surface of frame portion 110 .
- Each opening 16 and corresponding facing surface of frame portion 110 i.e., the closed end of opening 16 , defines a cavity 23 , such as a counterbored cavity having a depth 17 .
- work piece holder 100 includes a shim or a pad or film layer or film, such as polymer film 18 having an adhesive layer 21 for permanently affixing polymer film 18 to a corresponding facing surface of frame portion 110 of counterbored opening 16 .
- a work piece 20 ( FIG. 4 ) is releasably adhered to polymer film 18 , such that work piece 20 is releasably secured to and supported by cavity 23 of frame portions 110 , 112 .
- the combined thickness of adhesive layer 21 , polymer film 18 , and work piece 20 exceeds the thickness of depth 17 of cavity 23 of work piece holder 100 .
- Carrier 12 is adapted to rotate around bearing 22 on spindle 24 for purposes of polishing the exposed surface protruding beyond the adjacent exposed major face of work piece holder 100 .
- An advantage of this construction is to provide a very tightly controlled cavity depth which provides improved polishing consistency between all work pieces being processed in the work piece holder at one time and in each polishing machine cycle.
- polymer films examples include thermoplastic polymers polyaryletherketone (PAEK), polyetheretherketone (PEEK), and polyvinylchloride (PVC), as well as an exemplary thermoset polymer G10.
- PAEK polyaryletherketone
- PEEK polyetheretherketone
- PVC polyvinylchloride
- An additional advantage of using polymer film is that different polymer films can be provided with corresponding work piece holders, resulting in the ability to tailor the work piece holder to provide compatibility with different work piece materials and their corresponding chemical agents which are typically part of the polishing process, including both acidic working or operating environments (e.g., pH ⁇ 5) as well as basic working or operating environments (e.g., pH>9), including, for example, potassium permanganate (KMnO 4 ).
- acidic working or operating environments e.g., pH ⁇ 5
- basic working or operating environments e.g., pH>9
- the polymer layer can have specific or predetermined thermal, chemical resistance, and physical compliance properties required for a tightly controlled, high quality end-user specific polishing process. Additionally, use of polymer film results in elimination of back staining that can occur during use of Polyurethane® or Felt-based materials during the polishing process.
- the polymer layer can be produced by skiving, extruding or casting.
- Pad porosity is primarily concerned with the open volume of the pad which must be filled to create a seal sufficient to control slurry intrusion. Slurry intrusion eventually creates back staining, which can be difficult to remove, and is undesirable for workpieces being processed.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
- The present invention is directed to the field of polishing machines, including but not limited to a polishing machine work piece holder.
- Polishing machines utilize work piece holders to hold and support flat work pieces, sometimes referred to as wafers, such as silicon wafers that are used in the electronics industry.
- There is a need for work piece holders that permit production of work pieces having improved precision, as well as having improved service lives.
- In one embodiment, a work piece holder is provided for use in a polishing machine. The work piece holder has a frame composed of a thermoset material and/or a thermoplastic material. The frame has at least one cavity for receiving and supporting a work piece to be polished in the polishing machine. A polymer film is permanently affixed in the at least one cavity.
- In another embodiment, a work piece holder is provided for use in a polishing machine. The work piece holder having a frame composed of a thermoset material and/or a thermoplastic material. The frame has at least one cavity for receiving and supporting a work piece to be polished in the polishing machine. A polymer film is permanently affixed in the at least one cavity. The frame includes a first frame portion and a second frame portion, the first frame portion having at least one through opening formed therein.
- An advantage of exemplary embodiments is that the work piece holders permit preparation of work pieces having improved precision, as well as having improved service lives.
- Other features and advantages of the present invention will be apparent from the following more detailed description, taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention.
-
FIG. 1 is a work piece holder according to an embodiment of the disclosure. -
FIG. 2 is a section view taken along line 2-2 inFIG. 1 . -
FIG. 3 is an exploded view of the work piece holder ofFIG. 1 . -
FIG. 4 is a section view taken along line 2-2 inFIG. 1 . -
FIG. 5 is an exploded view of the work piece holder ofFIG. 4 . - Wherever possible, the same reference numbers will be used throughout the drawings to represent the same parts.
- Referring to
FIGS. 1-3 , a flat template orwork piece holder 10 includes aframe 11 that is releasably secured to acarrier 12 by anadhesive layer 14.Work piece holder 10 can be composed of a thermoset material and/or a thermoplastic material. In one embodiment, a thermoset material can be bonded to and/or surrounded by a thermoplastic material or vice versa to maximize the performance ofwork piece holder 10.Frame 11 ofwork piece holder 10 has a plurality ofopenings 16, such as counterbored openings extending partially throughwork piece holder 10 to asurface 19.Surfaces 19 ofcounterbored openings 16 have adepth 17. Eachopening 16 andcorresponding surface 19 defines acavity 23. - As further shown in
FIG. 2 ,work piece holder 10 includes a shim or a pad or film layer or film, such as apolymer film 18 having anadhesive layer 21 for permanently affixingpolymer film 18 to acorresponding surface 19 ofcounterbored opening 16. A work piece 20 (FIG. 1 ) is releasably adhered topolymer film 18, such thatwork piece 20 is releasably secured to and supported by cavity 23 (FIG. 3 ). The combined thickness ofadhesive layer 21,polymer film 18, andwork piece 20 exceeds the thickness ofdepth 17 ofcavity 23 ofwork piece holder 10. As a result,work piece 20 protrudes beyond the adjacent exposed major face ofwork piece holder 10.Carrier 12 is adapted to rotate around bearing 22 onspindle 24 for purposes of polishing the exposed surface protruding beyond the adjacent exposed major face ofwork piece holder 10. - As a result of this work piece holder arrangement, in which polymer film is permanently affixed to the work piece holder, the holding and support of the work piece is improved.
- In one embodiment,
frame 11 is composed of a thermoset epoxy and/or thermoplastic material(s). In one embodiment,frame 11 is visually transparent, permitting an operator to confirmwork pieces 20 are mounted properly in theirrespective cavities 23 prior to operating the polishing machine. This ability to visually confirm proper work piece mounting is not possible with conventional work piece holders. - As utilized herein, “visually transparent” is intended to indicate a material property of a component sufficiently permitting light to pass through, such that in response to the component being interposed in-line between a vantage point of an observer and an object, the component is viewable by an observer through the component. The term “visually transparent” is intended to include components that are fully visually transparent, partially transparent or translucent or combination thereof
- Referring to
FIGS. 4 and 5 , a flat template orwork piece holder 100 is similar towork piece holder 10, except as discussed.Work piece holder 100 includes aframe portion 110 that is releasably secured to acarrier 12 by anadhesive layer 14.Work piece holder 100 can be composed of a thermoset material and/or a thermoplastic material. In one embodiment, a thermoset material can be bonded to and/or surrounded by a thermoplastic material or vice versa to maximize the performance ofwork piece holder 100.Frame portion 110 ofwork piece holder 100 is permanently secured toframe portion 112 by anadhesive layer 114.Frame portion 112 has a plurality ofopenings 16 extending therethrough. Upon assembly of 110, 112 withframe portions adhesive layer 114,openings 16 have a closed end corresponding to the facing surface offrame portion 110. Each opening 16 and corresponding facing surface offrame portion 110, i.e., the closed end ofopening 16, defines acavity 23, such as a counterbored cavity having adepth 17. - As further shown in
FIG. 5 ,work piece holder 100 includes a shim or a pad or film layer or film, such aspolymer film 18 having anadhesive layer 21 for permanently affixingpolymer film 18 to a corresponding facing surface offrame portion 110 ofcounterbored opening 16. A work piece 20 (FIG. 4 ) is releasably adhered topolymer film 18, such thatwork piece 20 is releasably secured to and supported bycavity 23 of 110, 112. As shown inframe portions FIG. 4 , the combined thickness ofadhesive layer 21,polymer film 18, andwork piece 20 exceeds the thickness ofdepth 17 ofcavity 23 ofwork piece holder 100. As a result,work piece 20 protrudes beyond the adjacent exposed major face ofwork piece holder 100.Carrier 12 is adapted to rotate around bearing 22 onspindle 24 for purposes of polishing the exposed surface protruding beyond the adjacent exposed major face ofwork piece holder 100. - An advantage of this construction is to provide a very tightly controlled cavity depth which provides improved polishing consistency between all work pieces being processed in the work piece holder at one time and in each polishing machine cycle.
- Examples of polymer films include thermoplastic polymers polyaryletherketone (PAEK), polyetheretherketone (PEEK), and polyvinylchloride (PVC), as well as an exemplary thermoset polymer G10.
- An additional advantage of using polymer film, is that different polymer films can be provided with corresponding work piece holders, resulting in the ability to tailor the work piece holder to provide compatibility with different work piece materials and their corresponding chemical agents which are typically part of the polishing process, including both acidic working or operating environments (e.g., pH<5) as well as basic working or operating environments (e.g., pH>9), including, for example, potassium permanganate (KMnO4).
- Use of polymer film permanently affixed in the cavity of a work piece holder provides improved work piece quality and extended service life generally between a factor of approximately two and approximately five times, due to chemical resistance of the chemical agents used. In other words, not only can more tightly controlled flatness tolerances be achieved, but these more tightly controlled flatness tolerances can be achieved for increased durations before corrective measures (i.e., maintenance) are required.
- In exemplary embodiments, the polymer layer can have specific or predetermined thermal, chemical resistance, and physical compliance properties required for a tightly controlled, high quality end-user specific polishing process. Additionally, use of polymer film results in elimination of back staining that can occur during use of Polyurethane® or Felt-based materials during the polishing process.
- In exemplary embodiments, the polymer layer can be produced by skiving, extruding or casting.
- It has been found that providing work piece holders having permanently affixed polymer layers or films provided to users having polishing machinery results in tighter pocket depth tolerances, as compared to depth tolerances that are achieved from work piece holders having field installed and inserted pads, which can introduce operator-induced dimensional variations.
- Additional benefits associated with the use of polymer film materials is that the population of materials, sometimes referred to as pad materials or pads, can be incorporated into a “fixed” template or work piece holder without having to be concerned with pad porosity versus adhesive volume, which can impact variation between work piece holder cavities and overall work piece quality achieved in the polishing process. Pad porosity is primarily concerned with the open volume of the pad which must be filled to create a seal sufficient to control slurry intrusion. Slurry intrusion eventually creates back staining, which can be difficult to remove, and is undesirable for workpieces being processed.
- While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (13)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/447,825 US20170252893A1 (en) | 2016-03-03 | 2017-03-02 | Polishing machine work piece holder |
| US15/825,365 US10556317B2 (en) | 2016-03-03 | 2017-11-29 | Polishing machine wafer holder |
| CN201711240271.4A CN108527155B (en) | 2016-03-03 | 2017-11-30 | Wafer holder of polishing machine |
| JP2017230713A JP6649933B2 (en) | 2016-03-03 | 2017-11-30 | Wafer holder for polishing machine |
| TW106141917A TWI670143B (en) | 2016-03-03 | 2017-11-30 | Polishing machine wafer holder |
| US16/718,800 US11759910B1 (en) | 2016-03-03 | 2019-12-18 | Method of manufacturing wafer holder |
| JP2020004965A JP7105817B2 (en) | 2016-03-03 | 2020-01-16 | Wafer holder for polishing machine and method for manufacturing wafer holder |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662303215P | 2016-03-03 | 2016-03-03 | |
| US15/447,825 US20170252893A1 (en) | 2016-03-03 | 2017-03-02 | Polishing machine work piece holder |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/825,365 Continuation-In-Part US10556317B2 (en) | 2016-03-03 | 2017-11-29 | Polishing machine wafer holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20170252893A1 true US20170252893A1 (en) | 2017-09-07 |
Family
ID=59723171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/447,825 Pending US20170252893A1 (en) | 2016-03-03 | 2017-03-02 | Polishing machine work piece holder |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20170252893A1 (en) |
| JP (2) | JP6649933B2 (en) |
| TW (1) | TWI670143B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112405326A (en) * | 2020-10-20 | 2021-02-26 | 上海中欣晶圆半导体科技有限公司 | Method for detecting thickness of grinding carrier and ensuring uniform thickness of grinding carrier |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7205423B2 (en) * | 2018-12-17 | 2023-01-17 | Agc株式会社 | Film body for holding glass substrate and method for polishing glass substrate |
| CN115070619B (en) * | 2022-08-18 | 2023-08-22 | 苏州燎塬半导体有限公司 | Antimonide grinding and polishing clamp and antimonide wafer grinding and polishing method |
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| US5769692A (en) * | 1996-12-23 | 1998-06-23 | Lsi Logic Corporation | On the use of non-spherical carriers for substrate chemi-mechanical polishing |
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- 2017-03-02 US US15/447,825 patent/US20170252893A1/en active Pending
- 2017-11-30 TW TW106141917A patent/TWI670143B/en active
- 2017-11-30 JP JP2017230713A patent/JP6649933B2/en active Active
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2020
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| US4512113A (en) * | 1982-09-23 | 1985-04-23 | Budinger William D | Workpiece holder for polishing operation |
| US5769692A (en) * | 1996-12-23 | 1998-06-23 | Lsi Logic Corporation | On the use of non-spherical carriers for substrate chemi-mechanical polishing |
| US5882245A (en) * | 1997-02-28 | 1999-03-16 | Advanced Ceramics Research, Inc. | Polymer carrier gears for polishing of flat objects |
| US7140956B1 (en) * | 2000-03-31 | 2006-11-28 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| US7008310B2 (en) * | 2001-08-01 | 2006-03-07 | Entegris, Inc. | Wafer carrier wear indicator |
| US20030109208A1 (en) * | 2001-12-07 | 2003-06-12 | Engdahl Erik H. | Low friction gimbaled substrate holder for CMP apparatus |
| US6859984B2 (en) * | 2002-09-05 | 2005-03-01 | Vermon | Method for providing a matrix array ultrasonic transducer with an integrated interconnection means |
| US20080318493A1 (en) * | 2004-08-02 | 2008-12-25 | Showa Denko K.K. | Method of Manufacturing Polishing Carrier and Silicon Substrate for Magnetic Recording Medium, and Silicon Substrate for Magnetic Recording Medium |
| US20100048105A1 (en) * | 2006-11-21 | 2010-02-25 | 3M Innovative Properties Company | Lapping Carrier and Method |
| US9539695B2 (en) * | 2007-10-17 | 2017-01-10 | Siltronic Ag | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers |
| US20110256813A1 (en) * | 2008-12-31 | 2011-10-20 | Fletcher Timothy D | Coated carrier for lapping and methods of making and using |
| US20120270478A1 (en) * | 2010-03-12 | 2012-10-25 | Duescher Wayne O | Wafer pads for fixed-spindle floating-platen lapping |
| US20170259397A1 (en) * | 2014-09-10 | 2017-09-14 | Maruishi Sangyo Co., Ltd. | Holding pad |
| US20160101502A1 (en) * | 2014-10-13 | 2016-04-14 | Sunedison Semiconductor Limited (Uen201334164H) | Center flex single side polishing head having recess and cap |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112405326A (en) * | 2020-10-20 | 2021-02-26 | 上海中欣晶圆半导体科技有限公司 | Method for detecting thickness of grinding carrier and ensuring uniform thickness of grinding carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7105817B2 (en) | 2022-07-25 |
| TWI670143B (en) | 2019-09-01 |
| JP2020097107A (en) | 2020-06-25 |
| JP2018144222A (en) | 2018-09-20 |
| JP6649933B2 (en) | 2020-02-19 |
| TW201841714A (en) | 2018-12-01 |
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