TWI388487B - A cutting unit for the cutting device, a cutting device having the unit, and a cutting method using the unit - Google Patents

Description

Transfer unit for cutting device, cutting device having the same, and cutting method using the same

The present invention relates to a cutting device for manufacturing a flat display panel, and more particularly to a transfer unit for a cutting device for cutting a mother panel for a flat display panel, a cutting device having the same, and the use of the same The method of cutting the unit.

In general, a flat display panel for displaying an image such as a liquid crystal display uses a large panel, that is, a mother board, and each of them is manufactured in a plurality. Specifically, the flat display panel includes a facing upper substrate and a lower substrate. The upper substrate and the lower substrate are formed separately through the other mother boards (the mother board for the upper substrate and the mother board for the lower substrate). The mother board for the upper substrate and the mother board for the lower substrate are separated into a plurality of unit areas. An upper unit cell formed by forming a thin film layer of the upper substrate is formed in each unit region of the mother substrate for the upper substrate. A lower unit cell formed by forming a thin film layer of the lower substrate is formed in each unit region of the mother substrate for the lower substrate.

Each of the mother substrate for forming the upper layer of the thin film layer and the mother substrate for the lower substrate are bonded to each other, and the unit area of the mother substrate for the upper substrate and the unit region of the mother substrate for the lower substrate are aligned with each other. The opposing unit cell and the upper unit cell form a unit cell, and a unit cell constitutes a flat display panel. A plurality of mother boards which are combined with each other are cut into unit cells, whereby a plurality of flat display panels are manufactured.

Thus, in order to manufacture a large number of flat display panels using a large mother board, it is necessary to cut the two mother boards that have been combined into a single unit cell cutting process. The cutting process has a method of cutting with a laser beam and a method of using a scribe wheel. The method of cutting the mother board by the cutting wheel is such that after the cutting wheel contacts the mother board, it is moved along the line to cut and a cutting line formed by a groove of a predetermined depth is formed on the surface of the mother board. A method of cutting a mother board by a laser beam is to form a cutting line by irradiating a laser beam on a mother board along a line to cut.

At the end of the cutting process, the cutting process of the mother board needs to be divided along the cutting line. In general, the breaking process places the cutting bar on the mother board on which the cutting line is formed, and presses the cutting rod on the mother board to apply a physical impact to the mother board. In the mother board, the cracks are spread along the cutting line by such physical impact, and are separated by unit cells. The substrate which has been separated by the unit cell, that is, the unit substrate is transferred to the outside.

Thus, the rupture process is such that a portion of the unit cell is not formed, that is, the cullet portion is separated from the portion in which the unit cell is formed. However, as the utilization efficiency of the mother board is increased and the size of the flat display panel is gradually increased, the interval between adjacent unit cells tends to be gradually narrowed. In particular, each unit cell has a sealing agent that bonds the two mother plates disposed above/below. Since the joint composition of the sealant and the width of the cullet portion are reduced, a rupture phenomenon in which the cullet portion and the unit cell portion are not cut off from each other occurs.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Korean Patent Publication No. 2005-0029970

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-0003388

An object of the present invention is to provide a transfer unit for a cutting device which can improve cutting efficiency.

Further, it is an object of the present invention to provide a cutting device which can improve cutting efficiency.

Furthermore, it is an object of the present invention to provide a cutting method using the above cutting device.

A transfer unit for a cutting device that achieves one of the objects of the present invention is composed of a main body portion and at least two receiving portions.

The receiving portion is provided on the back surface of the main body portion, and the object to be cut in which the cutting line is formed is separated along the cutting line, and the specific portion is received and transferred from the object to be cut.

Each receiving unit includes an adsorption unit and a pressurization unit. The adsorption unit vacuum-adsorbs the upper surface of the object to be cut. The pressurizing portion is provided adjacent to the adsorption portion, and when the cutting object is separated from the cutting line, the cullet region of the object to be cut that is not received by the adsorption unit is directed to The adsorption direction of the adsorption unit is pressurized in the opposite direction.

Further, the cutting device for achieving the above-described object of the present invention is constituted by a scribe line portion and a rupture portion.

The scribe line portion forms a dicing line on the surface of the combination of the mother sheets in order to cut the mother board combination to form a plurality of unit panels of the respective flat display panels. The breaking portion includes a transfer unit that cuts the mother board assembly in which the cutting line has been formed along the cutting line, separates and picks up the unit panel, and transfers and transfers each unit panel.

Specifically, the transfer unit includes a body portion and at least two receiving portions.

The receiving portion is provided on the back surface of the main body portion, and includes an adsorption portion and a pressurizing portion. The adsorption unit vacuum-adsorbs the upper surface of the above-mentioned mother board assembly. The pressurizing portion is provided adjacent to the adsorption portion, and when the master plate is combined with the cutting line to separate the cutting line, the cullet region of the mother board which is located outside the unit cell region forming the unit panel is combined And pressurizing in the opposite direction to the adsorption direction of the adsorption unit.

Further, the cutting method for achieving one of the above-described objects of the present invention is as follows.

First, in order to cut the mother board combination, a plurality of unit panels of the flat display panel are separately formed, and a cut line is formed on the surface of the mother board combination. The mother board combination on which the aforementioned cutting line has been formed is cut along the aforementioned cutting line, and the unit panel is received from the above-described mother board combination and taken out to the outside.

According to the present invention, the transfer unit performs the breaking process of the object to be cut and receives the portion to be received from the object to be cut, so that the fracture efficiency and productivity can be improved.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. In the present embodiment, a mother board for a liquid crystal display is described as an example of the object to be cut, and the technical idea of the present invention is not limited thereto, and other types of objects may be used instead.

The first figure shows a plan view of a combination of mother boards for a liquid crystal display, the second figure is a cutaway view taken along the cutting line I-I' of the first figure, and the third figure shows a perspective view of the liquid crystal display.

Referring to the first and second figures, the motherboard assembly 100 for cutting an object includes first and second motherboards 110, 120, and the first and second motherboards 110, 120 are joined to each other to form a majority unit. Cell UC. Each unit cell UC forms a liquid crystal display, and the plurality of unit cells UC are arranged in a matrix form. Each unit cell UC may include an array layer 130 formed on the first motherboard 110, a color filter layer 140 formed on the second motherboard 120, and a liquid crystal layer 150 separated from the array layer 130. The liquid crystal layer 150 is filled between the array layer 130 and the color filter layer 140, and the sealing agent 160 is filled between the color filter layer 140 and the color filter layer 140. The sealing agent 160 surrounds the liquid crystal layer 150 to bond the first and second mother boards 110 and 120 to each other.

The mother board assembly 100 is cut by the unit cell UC, and the unit panel formed by separating the mother unit assembly 100 from the unit cell UC is provided as shown in the third figure. Liquid crystal display DP. In the liquid crystal display device DP, the upper substrate DP2 is cut smaller than the lower substrate DP1, and the source-side end portion and the gate-side end portion of the lower substrate DP1 are exposed to the outside. The source driving portion of the output source signal is coupled to the end portion of the lower substrate DP1 on the source side, and the gate driving portion of the output gate signal is coupled to the end portion on the gate side.

In this embodiment, the end portion of the liquid crystal display DP on the gate side and the end on the source side are exposed, and only the end portion on the source side may be exposed.

Hereinafter, a substrate cutting system in which the mother board assembly 100 is cut by each unit cell UC will be specifically described with reference to the drawings.

The fourth drawing schematically shows a drawing of a substrate cutting system according to an embodiment of the present invention, and the fifth drawing schematically shows a side view of the scribe line shown in the fourth figure.

Referring to the first and fourth figures, the substrate cutting system 500 may include the mounting portion 200, the scribe line portion 300, and the rupture portion 400.

The mounting unit 200 mounts the motherboard assembly 100 transferred from the outside, and the motherboard assembly 100 transferred to the mounting unit 200 is transferred to the scribe unit 300.

Referring to the fourth and fifth figures, the scribe line 300 may include a first support member 310 that is safely delivered to the motherboard assembly 100, and a scribe unit 320 that forms a cutting line in the motherboard assembly 100.

The first supporting member 310 may include two first rotating rollers 311 and 312 that are separated from each other, and a first conveyor belt 313 that connects the first rotating rollers 311 and 312. The first rotating rollers 311 and 312 are arranged in parallel with the ground and rotated about the central axis. In this way, the first conveyor belt 313 is rotated. The mother board assembly 100 transferred by the mounting unit 200 is conveyed to the first conveyor belt 313 so as to face the first conveyor belt 313, and the mother board assembly 100 is moved by the rotation of the first conveyor belt 313. In the horizontal direction.

The scribing unit 320 is disposed on the upper portion of the first support member 310. The scribing unit 320 may include a head portion 321 , a cutting wheel 322 , and an axle 323 connecting the head portion 321 and the cutting wheel 322 . The cutting wheel 322 is disposed under the head portion 321, and the head portion 321 is moved in a horizontal direction in a single direction while pressurizing the cutting wheel 322 in the vertical direction. The cutting wheel 322 is rotated by the horizontal movement of the head portion 321. The aforementioned cutting wheel 322 has a shape that is nearly as close to a circular plate. The cutting wheel 322 is rotated while the outer peripheral surface thereof is in contact with the mother board assembly 100, and the mother board assembly 100 is etched at a predetermined depth. When the cutting wheel 322 rotates, the head portion 321 moves in a direction opposite to the direction in which the mother board assembly 100 is transferred. According to this, the cutting wheel 322 etches the surface of the mother board assembly 100 while moving along the line to cut (not shown) of the mother board assembly 100, and forms the cutting line SL in the mother board assembly 100. .

The cutting wheel 322 is coupled to the head portion 321 via the wheel shaft 323, and one end portion of the wheel shaft 323 is inserted into a coupling hole formed in a central portion of the cutting wheel 322. When the cutting wheel 322 rotates, the aforementioned axle 323 becomes the rotation axis of the cutting wheel 322.

In this embodiment, the scribing unit 300 includes the scribing unit 320, and the mother board assembly 100 is scribed by the cutting wheel 322. The scribing unit may be provided with a scribing unit, and the main board may be combined by a laser beam. 100 is crossed.

The mother board assembly 100 in which the scribing process is completed in the scribing portion 300 is transferred to the fracture portion 400. The breaking portion 400 cuts the mother board assembly 100 for each unit cell UC (see the first drawing), and separates the mother board assembly 100 into unit panels formed by separating the unit cells UC, that is, The liquid crystal display DP is moved to the outside.

The sixth drawing schematically shows a side view of the fracture portion shown in the fourth figure.

Referring to the sixth figure, the breaking portion 400 may include a second supporting member 410, which is safely delivered to the motherboard assembly 100, and a transfer unit 420, which is cut and received according to each unit cell UC (refer to the first figure). The aforementioned motherboard combination 100.

Specifically, the second supporting member 410 may include two second rotating rollers 411 and 412 that are separated from each other, and a second conveyor belt 413 that connects the second rotating rollers 411 and 412. The second rotating rollers 411 and 412 are arranged in parallel with the ground and rotated about the central axis. In this way, the second conveyor belt 413 is rotated. The mother board assembly 100 transferred by the mounting unit 200 and the first conveyor belt 413 are opposed to the first conveyor belt 413, and the motherboard assembly 100 is moved by the rotation of the second conveyor belt 413. horizontal direction.

The transfer unit 420 is disposed at an upper portion of the second support member 410. The transfer unit 420 cuts the mother board assembly 100 along the cutting line SL, and receives and transfers the unit panel (liquid crystal display DP) separated from the mother board assembly 100 to the outside.

Hereinafter, the configuration of the transfer unit 420 will be specifically described with reference to the drawings.

7 is a perspective view showing the transfer unit 420 shown in the sixth figure, the eighth view is a plan view showing the transfer unit 420 shown in the seventh figure, and the ninth is a view showing the adsorption portion and the pressurization shown in the eighth figure. Side view of the positional relationship between the parts.

Referring to the sixth and seventh figures, the transfer unit 420 may include a body portion 421, a plurality of receiving portions 422, 423, 424, and 425, and a moving shaft 426.

Specifically, the main body portion 421 has a rear surface that faces the second conveyor belt 413 and has a shape that is nearly square. Here, the shape of the body portion 421 is not limited, and various alternatives are possible.

First to fourth insertion holes 421a, 421b, 421c, and 421d are provided on the back surface of the main body portion 421. The first to fourth insertion holes 421a, 421b, 421c, and 421d are formed adjacent to the four corners of the back surface of the main body portion 421, and are respectively extended from the adjacent corner of the main body portion 421 to the center of the main body portion 421. unit. Therefore, each of the insertion holes 421a, 421b, 421c, and 421d has a long hole shape.

The plurality of receiving portions 422, 423, 424, and 425 are inserted into the first to fourth insertion holes 421a, 421b, 421c, and 421d, respectively. In this embodiment, the transfer unit 420 includes four receiving units 422, 423, 424, and 425, and the number of the receiving units is responsive to the size and reception efficiency of the unit cell UC (see the first figure). Increasingly or decreasingly, the transfer unit 420 includes at least two receiving portions disposed in a diagonal direction of the main body portion 421.

Further, the number of the insertion holes 421a, 421b, 421c, and 421d is increased or decreased depending on the number of the receiving portions 422, 423, 424, and 425, and the insertion holes 421a, 421b, 421c, and 421d are provided with The number of the receiving units 422, 423, 424, and 425 is the same.

The plurality of receiving units 422, 423, 424, and 425 are configured by the first to fourth receiving units 422, 423, 424, and 425, and the first to fourth receiving units 422, 423, 424, and 425 are The first to fourth insertion holes 421a, 421b, 421c, and 421d correspond to the first to fourth insertion holes 421a. Each of the receiving portions 422, 423, 424, and 425 is inserted into the corresponding insertion holes 421a, 421b, 421c, and 421d. According to an example of the present invention, the first receiving unit 422 is inserted into the first insertion hole 421a, the second receiving unit 423 is inserted into the second insertion hole 421b, and the third receiving unit 424 is inserted into the third insertion hole 421. The hole 421c is inserted, and the fourth receiving portion 425 is inserted into the fourth insertion hole 421d.

Each of the receiving portions 422, 423, 424, and 425 is movable along the longitudinal direction of the corresponding insertion holes 421a, 421b, 421c, and 421d. In this way, the transfer unit 420 can adjust the positions of the first to fourth receiving portions 422, 423, 424, and 425 in accordance with the size of the unit cell UC.

The first to fourth receiving portions 422, 423, 424, and 425 may include adsorption portions 422a, 423a, 424a, and 425a, and pressurizing portions 422b, 423b, 424b, and 425b, and the first to fourth receiving portions 422, 423, 424, and 425 have the same configuration.

In this embodiment, the adsorption portions 422a, 423a, 424a, and 425a of the first to fourth receiving portions 422, 423, 424, and 425 have the same configuration, and the pressurizing portions 422b, 423b, 424b, and 425b are also Have the same composition. Therefore, in the following description of the respective configurations of the first to fourth receiving units 422, 423, 424, and 425, the adsorption unit 422a and the pressurizing unit 422b of the first receiving unit 422 will be described as an example. .

Referring to the seventh and eighth figures, the adsorption portion 422a of the first receiving portion 422 may include the vacuum body portion 41 and the vacuum tube 42. The vacuum body portion 41 has a vacuum region formed therein, and the lower surface thereof is in contact with the surface of the mother board assembly 100 at the time of the breaking process. A plurality of adsorption holes 41a are formed under the vacuum body portion 41. As an example of the present invention, the vacuum body portion 41 has a funnel shape that gradually widens from the upper portion to the lower portion.

The upper end portion of the vacuum body portion 41 is coupled to the vacuum tube 42. The vacuum tube 42 of the first receiving portion 422 is inserted into the first insertion hole 421a, and is provided to be movable along the longitudinal direction of the first insertion hole 421a. The vacuum tube 42 is coupled to the vacuum pump 430 via a vacuum line VL. A part of the vacuum line VL is inserted into the inside of the main body portion 421, and is coupled to the adsorption portions 422a, 423a, 424a, and 425a of the respective receiving portions 422, 423, 424, and 425. As a result, each of the adsorption portions 422a, 423a, 424a, and 425a passes through the vacuum pump 430 to bring the inside into a vacuum state. In the breaking process, the upper surface of the mother board assembly 100 is adsorbed on the lower surface of the vacuum body portion 41 by the vacuum pressure supplied to the adsorption holes 41a.

The pressurizing portion 422b of the first receiving portion 422 is provided outside the adsorption portion 422a of the first receiving portion 422, and is disposed closer to the first receiving portion 422 than the adsorption portion 422a. The angle of the aforementioned body portion 421.

The pressurizing portion 422b may include: first and second pushers 43, 44 for contacting the upper surface of the motherboard assembly 100 during the breaking process; and a support shaft 45 inserted into the first insertion hole 421a By.

The first and second pushers 43, 44 have a plate shape, and the ends are coupled to each other. The connection angle θ1 of the first and second thrusters 43 and 44 is substantially the same as the angle θ2 of the unit cell UC (see FIG. 8), and the first and second thrusters 43 and 44 that are connected to each other The shape, that is, the shape of the surface in contact with the mother board assembly 100 is a hook shape which is substantially the same as the angular shape of the unit cell UC.

The first and second pushers 43, 44 are coupled to the support shaft 45. The support shaft 45 of the first receiving portion 422 is inserted into the first insertion hole 421a and is provided to be movable along the longitudinal direction of the first insertion hole 421a.

Referring to the seventh and ninth drawings, the lower end portions of the first and second pushers 43, 44 are located below the back surface of the adsorption portion 422a. Here, since the pressurizing portion 422b is formed of an elastic material, the support shaft 45 is bent outward when the breaking process is performed. In this manner, in the breaking process, the first and second pushers 43 and 44 do not affect the contact between the adsorption portion 422a and the upper surface of the mother board assembly 100 even if it is located below the mother board assembly 100 side.

In the rupture process, the adsorption portions 422a, 423a, 424a, and 425a are disposed in a region (unit cell region) UCA in which the unit cell UC is to be received from the mother board assembly 100. On the other hand, the pressurizing portions 422b, 423b, 424b, and 425b are located outside the region where the unit cell UC is formed, that is, in the cullet region. The adsorption portions 422a, 423a, 424a, and 425a are adsorbed to the upper side by the adsorption of the mother board assembly 100. At this time, the pressurizing portions 422b, 423b, 424b, and 425b press the mother board assembly 100 downward.

As described above, the suction portions 422a, 423a, 424a, and 425a and the pressurizing portions 422b, 423b, 424b, and 425b are different from each other in the direction in which the force of the mother board assembly 100 is different from each other, so that the mother board assembly 100 is easily formed. The cullet area is cut off from the unit cell area UCA. In this way, the transfer unit 420 can prevent the breakage of the motherboard assembly 100 and improve the yield of the product.

On the other hand, the aforementioned moving shaft 426 is coupled to the upper portion of the aforementioned body portion 421. The moving shaft 426 moves the main body portion 421, whereby the unit panel DP adsorbed to the first to fourth receiving portions 422, 423, 424, and 425 is transferred to the outside.

Referring again to the sixth drawing, the fracture portion 400 may include a crushing portion 440 which breaks the cullet produced in the cutting process of the mother board assembly 100. The crushing portion 440 is provided on one side of the second supporting member 410. The crushing unit 440 includes a plurality of transfer rollers 441 that transfer the cullet, and a plurality of crush bars 442 that are provided on the upper portion of the transfer roller 441. Each of the crushing bars 442 is located in a space corresponding to the two adjacent transfer rollers 441 which are separated from each other, and the cullet on the transfer roller 441 is pressurized and broken.

Hereinafter, the process of cutting the mother board assembly 100 by the substrate cutting system 500 will be specifically described with reference to the drawings.

The tenth diagram shows a flow chart of the process of cutting the mother board assembly 100 using the substrate cutting system shown in the fourth figure.

Referring to the fourth and tenth diagrams, first, the mother board assembly 100 in which a plurality of unit cells UC are formed is mounted on the mounting unit 200 (step S110).

Next, the mother board assembly 100 that has been transferred to the mounting unit 200 is transferred to the scribing unit 300, and the scribing process of the motherboard assembly 100 is performed (step S120).

The eleventh drawing schematically shows a process flow chart for the process of scribing the mother board assembly 100 by the scribing unit 320 shown in the fifth figure.

The foregoing scribing process will be specifically described below with reference to FIG. First, the mother board assembly 100 is disposed on the first support member 310, and the scribing unit 320 is disposed on the upper portion of the motherboard assembly 100. At this time, the scribing unit 320 is disposed adjacent to the mother board assembly 100 such that the cutting wheel 322 of the scribing unit 320 is in contact with the upper surface of the motherboard assembly 100.

Next, while the cutting wheel 322 is pressed against the mother board assembly 100 side, it is moved in the horizontal direction along a line to cut (not shown), and the upper surface of the mother board assembly 100 is etched to a predetermined level. depth. Here, the outer peripheral surface of the cutter wheel 322 has a zigzag shape. The cutting wheel 322 is formed by rotating and rotating the outer peripheral surface of the zigzag shape in contact with the mother board assembly 100, and etching the mother board assembly 100 at a predetermined depth. The surface of the combination 100 forms a cutting line SL.

Referring again to the fourth and tenth drawings, the motherboard assembly 100 that completes the cutting process is transferred to the fracture portion 400, and the fracture portion 400 receives each unit panel DP from the motherboard assembly 100, and holds the unit panel from the same. The DP breaks the cullet (step S130).

Next, the breaking portion 400 transfers the received unit panel DP to the outside, and breaks the cullet generated in the above-described breaking process (step S140).

Hereinafter, the process of receiving the unit panel DP from the mother board assembly 100 while the transfer unit 420 of the breaking portion 400 is received, and separating the cullet will be specifically described with reference to the drawings.

The twelfth and thirteenth drawings schematically show a process flow chart of the process in which the transfer unit 420 shown in the seventh figure separates the unit cell UC from the mother board assembly 100, and the fourteenth figure shows the twelfth figure. A plan view of the state in which the transfer unit 420 is shown safely delivered to the motherboard assembly 100. The fourteenth diagram omits the display of the above-described transfer unit 420 in order to more clearly show the positional relationship between the first to fourth receiving portions 422, 423, 424, and 425 of the transfer unit 420 and the unit cell UC of the above-described motherboard assembly 100. The body portion 421.

Referring to the twelfth and thirteenth drawings, the motherboard assembly 100 that completes the scribing process is safely fed to the second conveyor belt 413 of the second support member 410, and the transfer unit 420 is disposed in the aforementioned motherboard assembly 100. Upper part.

Next, the first to fourth receiving portions 422, 423, 424, and 425 of the transfer unit 420 are brought into close contact with the upper surface of the motherboard assembly 100. In this manner, the upper surface of the mother board assembly 100 is adsorbed by the adsorption portions 422a, 423a, 424a, and 425a of the first to fourth receiving portions 422, 423, 424, and 425, and the pressurizing portions 422b, 423b, and 424b, The 425b is bent outward, and the upper surface of the aforementioned mother board assembly 100 is pressed downward.

As shown in FIG. 14, during the rupture process, the adsorption portions 422a, 423a, 424a, and 425a of the first to fourth receiving portions 422, 423, 424, and 425 are located in a unit cell in which the unit cell UC is formed. In the region UCA, the pressurizing portions 422b, 423b, 424b, and 425b are located outside the unit cell region UCA, that is, in the cullet region CA, with the dicing line SL as a boundary.

At the time of the breaking process, the surface in contact with the mother board assembly 100 of the pressurizing portions 422b, 423b, 424b, and 425b is disposed in a portion where the two cutting lines SL are in contact with each other, and is viewed in plan to become the two cuts. The contact portions of the line SL are disposed in substantially the same hook shape.

Next, the moving shaft 426 raises the body portion 421 to the upper side. The adsorption portions 422a, 423a, 424a, and 425a are moved to the upper side in a state in which the mother board assembly 100 is adsorbed. On the other hand, the pressurizing portions 422b, 423b, 424b, and 425b continue to move when the adsorption portions 422a, 423a, 424a, and 425a move to a degree corresponding to the difference between the adsorption portions 422a, 423a, 424a, and 425a. The aforementioned mother board assembly 100 is pressed downward. In this manner, the mother board assembly 100 is transferred to the outside by the unit cell region UCA adsorbed to the adsorption portions 422a, 423a, 424a, 425a and the cullet region CA, and the unit panel DP is separated. It is adsorbed to the adsorption portions 422a, 423a, 424a, and 425a.

In this way, the transfer unit 420 can simultaneously perform the breaking process and the receiving of the unit panel DP, and can completely separate the cullet from the unit panel DP. In this way, the substrate cutting system 500 can prevent breakage defects and improve the yield and productivity of the product.

Fig. 15 is a perspective view showing a transfer unit according to another embodiment of the present invention, wherein a sixteenth view is a perspective view showing a pressurizing portion shown in Fig. fifteenth, and a seventeenth view is a cut showing a sixteenth view; Section II-II' section.

Referring to the fifteenth and sixteenth views, the transfer unit 450 may include a body portion 421, a plurality of receiving portions 451, 452, 453, 454, and a moving shaft 426. The main body portion 421 and the moving shaft 426 are the same as those of the main body portion 421 and the moving shaft 426 of the transfer unit 450 shown in FIG. 7, and the same reference numerals will be given to the reference numerals, and the detailed description thereof will be omitted.

The plurality of receiving portions 451, 452, 453, and 454 are provided on the back surface of the main body portion 421, and the unit panel DP is separated and transferred from the mother board assembly 100. In this embodiment, the transfer unit 450 includes four receiving units 451, 452, 453, and 454, and the number of the receiving units 451, 452, 453, and 454 can be increased or decreased. Here, the transfer unit 450 includes at least two receiving units that are arranged in the diagonal direction.

The plurality of receiving units 451, 452, 453, and 454 are configured by the first to fourth receiving units 451, 452, 453, and 454, and the first to fourth receiving units 451, 452, 453, and 454 are provided with adsorption. Portions 422a, 423a, 424a, and 425a and pressurizing portions 451a, 452a, 453a, and 454a. In this embodiment, the adsorption portions 422a, 423a, 424a, and 425a are the same as the adsorption portions 422a, 423a, 424a, and 425a shown in the seventh embodiment. Therefore, the reference device symbols are collectively described, and a detailed description thereof will be omitted. .

Each of the receiving portions 451, 452, 453, and 454 includes one adsorption portion 422a, 423a, 424a, and 425a and one pressure portion 451a, 452a, 453a, and 454a. In this embodiment, since the pressurizing portions 451a, 452a, 453a, and 454a have the same configuration, the pressurizing portion 451a of the first receiving portion 451 will be described as an example.

Referring to FIGS. 16 and 17, the pressurizing portion 451a of the first receiving portion 451 includes the first and second pushers 51 and 52, the support shaft 53 and the pressurizing adjusting portion 54. The shape and connection relationship of the first and second pushers 51, 52, and the connection relationship between the first and second pushers 51, 52 and the support shaft 53 are the same as those of the transfer unit 420 shown in FIG. Therefore, a detailed description is omitted.

One end portion of the support shaft 53 is coupled to the pressure adjustment portion 54, and the pressure adjustment portion 54 is inserted into the first insertion hole 421a of the main body portion 421 (see FIG. 15). The pressurizing adjustment portion 54 is provided to be movable along the longitudinal direction of the first insertion hole 421a.

The pressurizing adjustment portion 54 may include a case 54a and a spring 54b built in the case 54a. One end portion of the support shaft 53 is inserted into the case 54a to be coupled to one end portion of the spring 54b. The other end of the spring 54b is fixed to the inner wall of the case 54a.

The lower end portions of the first and second pushers 51 and 52 are located below the back surface of the adsorption unit 422a, and the length of the pressurizing portion 451a is adjusted by the spring 54b during the breaking process. According to this configuration, even if the lower end portions of the first and second pushers 51 and 52 are located below the back surface of the adsorption unit 422a, the length of the pressurizing portion 451a can be adjusted by the spring 54b, so that the above-described effects are not affected. The adsorption portion 422a and the upper surface of the mother board assembly 100 are in close contact with each other. Further, at the time of the breaking process, the pressurizing portion 451a presses the upper surface of the mother board assembly 100 downward by the elastic force of the spring 54b.

The present invention has been described above with reference to the embodiments, and it is understood that the present invention may be variously modified without departing from the spirit and scope of the invention as described in the appended claims. And is an alternative. In addition, the performance of the elements of the schema is exaggerated for a clearer understanding.

100. . . Motherboard combination

110. . . First motherboard

120. . . Second motherboard

130. . . Array layer

140. . . Color filter layer

150. . . Liquid crystal layer

160. . . Sealing agent

200. . . Mounting department

300. . . Dashing

310. . . First support member

311, 312. . . First rotating roller

313. . . First conveyor belt

320. . . Line unit

321. . . head

322. . . Cutting wheel

323. . . axle

400. . . Fracture

410. . . Second support member

411, 412. . . Second rotating roller

413. . . Second conveyor belt

420. . . Transfer unit

421. . . Body part

422, 423, 424, 425. . . Receiving department

426. . . Moving axis

421a, 421b, 421c, 421d. . . Insertion hole

422a, 423a, 424a, 425a. . . Adsorption section

41. . . Vacuum body

42. . . Vacuum tube

422b, 423b, 424b, 425b. . . Pressurizing part

43, 44. . . First and second thrusters

45. . . Support shaft

430. . . Vacuum pump

440. . . Fragmentation

441. . . Transfer wheel

442. . . Broken rod

500. . . Substrate cutting system

UC. . . Unit cell

DP. . . LCD Monitor

DP1. . . Lower substrate

DP2. . . Upper substrate

SL. . . Cutting line

The first figure shows a perspective view of a motherboard combination for a liquid crystal display panel.

The second drawing is a cross-sectional view taken along the cutting line I-I' of the first figure.

The third figure shows a perspective view of the liquid crystal display panel.

The fourth drawing schematically shows a pattern of a substrate cutting system according to an embodiment of the present invention.

The fifth drawing schematically shows a side view of the scribe line shown in the fourth figure.

The sixth drawing schematically shows a side view of the fracture portion shown in the fourth figure.

The seventh figure shows a perspective view of the transfer unit shown in the sixth figure.

The eighth figure shows a plan view of the transfer unit shown in the seventh figure.

The ninth drawing is a side view showing the positional relationship between the adsorption portion and the pressurizing portion shown in the eighth diagram.

The tenth figure is a flow chart showing the process of cutting the mother board combination using the substrate cutting system shown in the fourth figure.

The eleventh drawing schematically shows a process flow chart of the process of scribing the motherboard combination by the scribing unit shown in the fifth figure.

The twelfth diagram schematically shows a process flow chart of the process in which the transfer unit shown in the seventh figure separates the unit cell from the mother board combination.

The thirteenth drawing schematically shows a process flow chart of a process in which the transfer unit shown in the seventh figure separates the unit cell from the mother board combination.

Fig. 14 is a plan view showing a state in which the transfer unit shown in Fig. 12 is safely delivered to the mother board assembly.

Fig. 15 is a perspective view showing a transfer unit according to another embodiment of the present invention.

Fig. 16 is a perspective view showing the pressurizing portion shown in Fig. 15.

Figure 17 is a cross-sectional view taken along line II-II' of Figure 16.

420. . . Transfer unit

421. . . Body part

422, 423, 424, 425. . . Receiving department

426. . . Moving axis

421a, 421b, 421c, 421d. . . Insertion hole

422a, 423a, 424a, 425a. . . Adsorption section

41. . . Vacuum body

42. . . Vacuum tube

422b, 423b, 424b, 425b. . . Pressurizing part

43, 44. . . First and second thrusters

45. . . Support shaft

426. . . Moving axis

Claims (18)

A transfer unit for a cutting device includes: a main body portion; and at least two receiving portions provided on a back surface of the main body portion, wherein the at least two receiving portions cause the cutting object having the cutting line formed along After the separation line is separated, the specific portion is received and transferred from the object to be cut, and each of the receiving portions includes an adsorption portion that vacuum-adsorbs the upper surface of the object to be cut, and a pressurizing portion that is adjacent to the adsorption portion. Further, when the cutting object is separated along the cutting line, the cullet region of the object to be cut which is not received by the adsorption unit is moved toward the adsorption direction of the adsorption unit. Pressurize in the opposite direction. The transfer unit for a cutting device according to the first aspect of the invention, wherein the receiving unit is configured such that at least two receiving portions are arranged in a diagonal direction. The transfer unit for a cutting device according to the second aspect of the invention, wherein, in the breaking process, a surface of the pressurizing portion that is in contact with the object to be cut is disposed in a portion where the two cutting lines are in contact with each other, and In plan view, it has substantially the same shape as the contact portion of the two cutting lines. The transfer unit for a cutting device according to the second aspect of the invention, wherein the pressurizing portion has a hook shape on a surface in contact with the object to be cut. The transfer unit for a cutting device according to the first aspect of the invention, wherein the lower end portion of the pressurizing portion is located at a ratio of the object to be cut The back surface of the adsorption portion that is in close contact is further below. The transfer unit for a cutting device according to claim 5, wherein the pressurizing portion is made of an elastic material. The transfer unit for a cutting device according to claim 5, wherein the pressurizing unit includes a pusher for pressurizing the object to be cut, and a spring to adjust the pusher. The vertical position, as well as the support shaft, connects the aforementioned thruster with the aforementioned spring. The transfer unit for a cutting device according to claim 1, further comprising a moving shaft coupled to an upper portion of the main body portion and changing a vertical position and a horizontal position of the main body portion. A transfer unit for a cutting device includes: a main body portion; and at least two receiving portions disposed on a back surface of the main body portion, and the mother board assembly in which the cutting line has been formed is cut along the cutting line, And separating it into a plurality of unit panels each forming a flat display panel, and picking up and transferring each unit panel, and each receiving portion includes: an adsorption portion for vacuum-adsorbing the above-mentioned motherboard combination; and a pressurizing portion, Provided adjacent to the adsorption portion, and when the master plate assembly is separated along the cutting line, the cullet region of the mother board in which the unit cell region of the unit panel is formed is formed The adsorption direction of the adsorption unit is pressurized in the opposite direction. The transfer unit for a cutting device according to claim 9, wherein the receiving portion is configured such that at least two receiving portions are disposed at opposite sides of each other Line direction. The transfer unit for a cutting device according to claim 10, wherein, in the breaking process, a surface of the pressurizing portion that is in contact with the mother plate has a shape substantially the same as a corner of the unit cell region. . The transfer unit for a cutting device according to claim 10, wherein the surface of the pressurizing portion that is in contact with the mother board has a hook shape. The transfer unit for a cutting device according to claim 9, wherein a lower end portion of the pressurizing portion is located below a rear surface of the adsorption portion that is in close contact with the mother plate. The transfer unit for a cutting device according to claim 13, wherein the pressurizing portion is made of an elastic material. The transfer unit for a cutting device according to claim 13, wherein the pressurizing portion includes: a pusher that presses the combination of the motherboard when the breaking process is performed; and a spring that adjusts the propeller a vertical position; and a support shaft connecting the pusher and the spring. The transfer unit for a cutting device according to claim 9, further comprising a moving shaft coupled to an upper portion of the main body portion and changing a vertical position and a horizontal position of the main body portion. A cutting device comprising: a scribe line portion for forming a plurality of unit panels each forming a flat display panel in order to cut a mother board assembly, and forming a cutting line on a surface of the mother board assembly; and a breaking portion With a transfer unit, the transfer unit will have been formed The mother board combination of the cutting line is cut along the cutting line, and separated according to the unit panel, and picked up and transferred to each unit panel, and the transfer unit includes: a body portion; and at least two receiving portions are disposed in the foregoing Further, each of the receiving portions of the main body portion includes: an adsorption portion that vacuum-adsorbs the upper surface of the mother board assembly; and a pressurizing portion that is disposed adjacent to the adsorption portion, and the mother board assembly is formed along the cutting portion In the rupture process of the line separation, the cullet region of the combination of the mother plates located on the outer side of the unit cell region forming the unit panel is pressurized in the opposite direction to the adsorption direction of the adsorption portion. The cutting device of claim 17, wherein the breaking portion further comprises: a supporting member for safely conveying the combination of the motherboard; and a crushing portion located on one side of the supporting member at the unit panel After the combination of the mother boards is separated, the residual cullet is broken, and the transfer unit is disposed on the upper portion of the support member.