JP2004354836A - Method of cutting off glass substrate and device therefor - Google Patents

Method of cutting off glass substrate and device therefor Download PDF

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Publication number
JP2004354836A
JP2004354836A JP2003154326A JP2003154326A JP2004354836A JP 2004354836 A JP2004354836 A JP 2004354836A JP 2003154326 A JP2003154326 A JP 2003154326A JP 2003154326 A JP2003154326 A JP 2003154326A JP 2004354836 A JP2004354836 A JP 2004354836A
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Japan
Prior art keywords
glass substrate
along
cutting
glass
liquid crystal
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JP2003154326A
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Japanese (ja)
Inventor
Akihiko Ide
明彦 井出
Shigeru Kurata
繁 倉田
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP2003154326A priority Critical patent/JP2004354836A/en
Publication of JP2004354836A publication Critical patent/JP2004354836A/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting off glass substrate by which a glass substrate is properly and easily cut off without producing a crack and which thereby contribute to an improved yield of a product consisting of the glass substrate such as a liquid crystal device, and to provide a device for the method. <P>SOLUTION: A glass substrate joined body W constructed by joining a pair of glass substrates S1, S2, is placed on a spherical supporting head 1 while turning the surface of the glass substrate S1 upward on which notched grooves d are formed along cutting off lines for respective liquid crystal cells, and is covered with a sufficiently flexible presser sheet 3. Air inside a space surrounded by the pressing sheet 3, the surface 1a of the supporting head, etc. and containing the glass substrate joined body W is discharged through an exhaust pipe 1b. Consequently, the glass substrate coupled body W is brought into tight contact with the spherical surface 1a of the supporting head. Then the glass substrate S1 is cut off along the notched grooves d. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
この発明は、ガラス基板の分断方法とその分断装置に関する。
【０００２】
【従来の技術】
従来の液晶素子の製造においては、通常、複数個の液晶素子を採取可能な大きさの一対のガラス基板をシール材を介して接合した後、複数個の液晶セル（液晶素子の液晶注入前の状態）に分断する。
【０００３】
この液晶セル分断工程においては、まず、接合された一対のガラス基板対の何れか一方のガラス基板の外面に、予め設定されている分断線に沿ってスクライブカッター等により切り欠き溝を形成する。次に、そのガラス基板対を切り欠き溝を形成した面を表にして支持台に載置し、真空吸着等の方法により支持台表面に保持する。この状態でブレイクスキージにより分断線上を叩き、表側ガラス基板を切り欠き溝に沿って分断する。この後、ガラス基板対を裏返して他方のガラス基板に対しても上述のガラス基板の分断工程を実施する。これにより、ガラス基板対が複数個の液晶セルに分離され、複数個の液晶セルが一括して得られる（例えば特許文献１）。
【０００４】
【特許文献１】
特開２００１−１８１９８号公報（第４頁、図１）
【０００５】
【発明が解決しようとする課題】
上述したガラス基板の分断方法による場合、ガラス基板をブレイクスキージで叩くから、その際の衝撃で分断された単位ガラス基板同士が当接し、ガラス基板の一部が欠ける不良品が発生する。
【０００６】
また、ガラス基板を吸着保持して分断する場合、ガラス基板が載置される支持台表面の真空吸引穴が存在する部分と存在しない部分とでは、ブレイクスキージで叩いたときの圧力の加わり方が異なるため、分断された単位ガラス基板の分断面（端面）の状態が不均一になり、製品品質を悪化させるという問題がある。
【０００７】
本発明は、欠けがを発生したり分断面が不均一になることなくガラス基板を適正且つ容易に分断でき、液晶素子等のガラス基板からなる製品の歩留まり向上に寄与するガラス基板の分断方法とその装置を提供することを課題とする。
【０００８】
【課題を解決するための手段】
本発明のガラス基板分断方法は、請求項１に記載のように、ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板の分断方法であって、一方の主面に予め前記分断線に沿って切り欠き溝が形成されたガラス基板を、該切り欠き溝が形成された主面を上にして所定位置に保持する工程と、前記一方の主面が凸面となり他方の主面が凹面となるように、前記ガラス基板を湾曲させて前記分断線に沿って分断する工程とを、有することを特徴とするものである。
【０００９】
本発明のガラス基板分断方法によれば、一方の表面に切り欠き溝を形成したガラス基板を切り欠き溝が開くように湾曲させることにより、ブレイクスキージ等でガラス基板を叩くことなく容易に所定の分断線に沿ってガラス基板を分断することができる。その結果、欠け等の分断不良を発生させず良好にガラス基板を分断することができ、液晶素子等のガラス基板を分断して製造する製品の歩留まりを向上させることが可能となる。
【００１０】
本発明のガラス基板分断方法は、請求項２に記載のように、ガラス基板間に液晶を封入した液晶セルの製造方法に好適であり、これにより、ガラス基板の適正な分断が厳しく要求される高精細液晶素子も歩留まり良く製造することができる。
【００１１】
また、本発明のガラス基板分断方法においては、請求項３に記載のように、ガラス基板を負圧に基づく大気圧により湾曲させることが好ましく、これにより、機械的衝撃を与えることなく緩やかにガラス基板全体を支持面に沿って均一に湾曲させることができ、その結果、欠けの発生をより確実に防止することが可能となる。
【００１２】
本発明のガラス基板分断装置は、請求項４に記載のように、ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板分断装置であって、一方の主面に前記分断線に沿って予め切り欠き溝が形成されたガラス基板がその一方の主面を上にして載置される表面が、湾曲した凸面をなす支持台と、前記ガラス基板を前記支持台の湾曲した凸面に沿わせて湾曲させると共に保持する強制保持手段とを、有することを特徴とする。
【００１３】
本ガラス基板分断装置によれば、緩やかな湾曲面をなす支持台表面に沿ってガラス基板を強制湾曲させるから、ガラス基板全体に均等に曲げ応力が作用し、欠けの発生が顕著に抑制される。
【００１４】
また、本発明に係わる他のガラス基板分断装置は、請求項５に記載のように、ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板分断装置であって、一方の主面に分断線に沿って予め切り欠き溝が形成されたガラス基板が載置される弾性支持板を備えた支持台と、前記ガラス基板を前記弾性支持板上に保持する強制保持手段と、前記弾性支持板をガラス基板側に突出させてガラス基板を湾曲させる突き出し手段とを、有することを特徴とする。
【００１５】
本ガラス基板分断装置によれば、突き出し手段を弾性支持板を介してガラス基板に押し当てるから、突き出し手段の衝撃が弾性支持板により和らげられ、欠けを発生させることなくガラス基板を湾曲させて分断することができる。
【００１６】
上述した本発明のガラス基板分断装置においては、請求項６に記載のように、前記強制保持手段を、前記ガラス基板全体からその周囲近傍の前記支持台表面にわたる範囲をカバーできる大きさのフレキシブルな押えシートと、この押えシートと前記支持台表面とで囲まれる前記ガラス基板を収容した空間内の空気を排出する排気手段とで、構成することが好ましく、これにより、ガラス基板全体を支持台の支持面上に柔軟に保持すると共にその湾曲した支持面に沿って迅速且つ緩やかに湾曲させることができる。その結果、欠けの発生をより確実に防止できると共に短時間で能率良くガラス基板を適正に分断することができる。
【００１７】
更に、本発明に係わる他のガラス基板分断装置は、請求項７に記載のように、ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板分断装置であって、一方の主面に分断線に沿って予め切り欠き溝が形成されたガラス基板が載置される支持台と、前記ガラス基板全体からその周囲近傍の前記支持台表面にわたる範囲をカバーできる大きさのフレキシブルな押えシートと、この押えシートと前記支持台表面とで囲まれる前記ガラス基板を収容した空間内の空気を排出する排気手段と、前記押えシートを介した大気圧により前記支持台表面に保持されたガラス基板に対し、前記切り欠き溝を拡大させる応力を作用させて前記分断線に沿って破断させる破断手段とを、有することを特徴とするものである。
【００１８】
本ガラス基板分断装置によれば、ガラス基板を保持する支持面に空気吸引用の穴を設ける必要がなくなり、支持面に空気吸引用の穴がある場合に吸引穴の部分とそれ以外の部分とで分断の際の支持状態が相違することによりガラス基板の割れ方が不均一となる不具合が解消される。
【００１９】
【発明の実施の形態】
本発明の第１実施形態としての液晶セル分断装置について、図１に基づき説明する。なお、図１は本例の液晶セル分断装置の全体構成を示す模式的断面図である。
【００２０】
図１に示すように、本例の液晶セル分断装置は、個々の液晶セルに分断される前のガラス基板接合体Ｗが載置される支持ヘッド１と、この支持ヘッド１が設置された支持台２及びガラス基板接合体Ｗを支持ヘッド１の表面に押え付ける押えシート３とから成る。
【００２１】
ガラス基板接合体Ｗは、一対のガラス基板Ｓ１ 、Ｓ２ が各液晶セル領域毎に配置された枠状シール材（不図示）により所定の間隙を保って接合されて成り、各ガラス基板Ｓ１ 、Ｓ２ の対向面には、各液晶セル領域毎に透明電極や配向膜が積層されている。このガラス基板接合体Ｗにおける一方のガラス基板Ｓ１ の他方のガラス基板Ｓ２ に対向する面とは反対側の外面には、前工程のスクライブ工程で各液晶セル領域を区画する分断線に沿って切り欠き溝ｄが刻設されている。
【００２２】
支持ヘッド１は、球の周面部を切り取った欠球状をなしており、そのガラス基板接合体Ｗを支持する表面１ａは球面をなしている。
【００２３】
この支持ヘッド１とこれが設置されている支持台２にわたり、排気路１ｂ、２ａが形成されている。
【００２４】
支持ヘッド１に設けられている複数の排気路１ｂは、支持ヘッド１の周辺部全周にわたり所定の間隔で均等に配設されており、各排気路１ｂの一方の先端は支持ヘッド１の表面１ａにそれぞれ開口している。
【００２５】
支持台２の内部に形成されている排気路２ａは、本管２ａ１ とこれから分岐した複数の支管２ａ２ からなる。本管２ａ１ の支持台２から延出させた端部は、図示しない真空ポンプに接続されている。複数の支管路２ａ２ は、それぞれ、これらに対応させて支持ヘッド１に設けられている複数の排気路１ｂに連通接続されている。
【００２６】
支持ヘッド１に支持されたガラス基板接合体Ｗには、押えシート３が被装される。押えシート３は、支持ヘッド１の表面１ａ全体とその周辺の支持台２表面をカバーできる大きさを備えている。この押えシート３は、フレキシブルなフィルムシート基材の少なくとも一方の表面に微細な凹凸が形成されてなる。この微細な凹凸は、基材シート表面にＰＥＴ（ポリエチレンテレフタレート）等の硬めの樹脂材料をコーティングするか、或いは、細かいメッシュを貼り付ける等の方法により、容易に形成可能である。また、この場合の押えシート３のフレキシブル度としては、ガラス基板接合体Ｗの仰向けた表面に負圧としての大気圧で押圧された際にその表面に沿って密着できると共に、ガラス基板接合体Ｗの変形に密着したまま追従して変形する程度にフレキシブルであることが要求される。
【００２７】
上述のようなフレキシブル度を備え一方の表面が微細な凹凸面をなす押えシート３は、その微細な凹凸面の表面をガラス基板接合体Ｗの前記分断線に沿って切り欠き溝が形成されたガラス基板の表面に接するように被装される。これにより、押えシート３とガラス基板接合体Ｗ表面とが密着せず、ガラス基板接合体Ｗを微動可能な状態で押えシート３により保持できる。
【００２８】
次に、本液晶セル分断装置によるガラス基板分断工程について説明する。
まず、前工程のスクライブ工程で一方のガラス基板の表面に分断線に沿って切り欠き溝ｄが刻設されたガラス基板接合体Ｗを、その切り欠き溝ｄが形成された面を仰向けにして支持ヘッド１上に載置する。このとき、ガラス基板接合体Ｗの位置合せは、支持ヘッド１の表面が球面であるから、その中心部が支持ヘッド１の頂点に位置するように置くだけでよく、極めて簡単である。
【００２９】
次いで、押えシート３をガラス基板接合体Ｗに被装する。この場合も、押えシート３の中心部とガラス基板接合体Ｗの中心部を合せるだけの簡単な位置合せでよい。これにより、図１に示すように、ガラス基板接合体Ｗとこれを支持する支持ヘッド１全体及び支持ヘッド１の周囲近傍の支持台２表面とが押えシート３により覆われた状態となる。
【００３０】
次に、上述の状態下において、図示しない真空ポンプを作動させ、押えシート３で覆われた空間内の空気を、各排気路１ｂから支管路２ａ２ と本管路２ａ１ を通じて排出する
【００３１】
これにより、押えシート３で覆われた空間内が真空化され、ガラス基板接合体Ｗに対して大気圧が押えシート３を介し押圧力として作用し、図２に示されるように、ガラス基板接合体Ｗが支持ヘッド１の球面１ａに均等に押し付けられ、ガラス基板接合体Ｗにその仰向けた表面を凸面とし支持される裏面を凹面とする曲げ応力が作用する。その結果、ガラス基板接合体Ｗの切り欠き溝ｄが拡大され、ガラス基板Ｓ１ がそれら切り欠き溝ｄに沿って分断される。
【００３２】
この分断の際、ガラス基板接合体Ｗ全体に対し、排気と共に徐々に曲げ応力が均等に作用するから、分断面が切り欠き溝ｄに正確に沿って形成され、また、ガラス基板接合体Ｗは押えシート３により微動可能に保持された状態で分断されるから、分断された（割れた）瞬間に分断面同士が衝突して欠ける不具合も解消される。よって、ガラス基板Ｓ１ が欠けを発生させることなく適正に分断される。
【００３３】
この後、ガラス基板接合体Ｗは、図示しない反転装置により表裏反転された後、未だ分断されていないガラス基板Ｓ２ に分断線に沿って切り欠き溝が刻設され、再度、切り欠き溝が形成された面を上にして支持ヘッド１上に載置される。そして、上述の分断プロセスと同様のプロセスを経ることにより、個々の液晶セルに適正に分離され、複数の液晶セルが一括して得られる。
【００３４】
次に、本発明の第２実施形態としての液晶セル分断装置について、図３の模式的断面図に基づき説明する。
【００３５】
本例の液晶セル分断装置は、個々の液晶セルに分断される前のガラス基板接合体Ｗが載置される弾性支持板４と、この弾性支持板４が設置された支持台５、ガラス基板接合体Ｗを弾性支持板４の表面に押え付ける押えシート６、及び前記弾性支持板４にガラス基板接合体Ｗが載置された表面とは反対側の裏面から当接させて弾性支持板４をガラス基板接合体Ｗ側に突出させる突き出し装置７とから成る。
【００３６】
ガラス基板接合体Ｗは、第１実施形態の場合と同様に形成されており、一方のガラス基板Ｓ１ の外面には、前工程のスクライブ工程で各液晶セル領域を区画する分断線に沿って切り欠き溝ｄが刻設されている。
【００３７】
弾性支持板４は、硬質ゴム等の可撓性を備えた弾性材からなる。この弾性支持板４が設置される支持台５には、ピット５ａがガラス基板接合体Ｗの平面形状に対応した直方体状に凹設されており、そのピット５ａの開口部全体に弾性支持板４が架設され、ピット５ａが閉じられている。すなわち、弾性支持板４がピット５ａの蓋となっている。
【００３８】
支持台５には、本管５ｂ１ とこれから分岐した複数の支管５ｂ２ とからなる排気管５ｂが内設されている。本管５ｂ１ は、支持台５の底部においてピット５ａを適度な間隔をおいて取り囲む大きさの矩形枠状に配管され、この枠状配管部から外部へ突出させた配管の端部は、図示しない真空ポンプに連通接続されている。複数の支管５ｂ２ は、それぞれ、ピット５ａの周囲近傍に均等に配設され、一端を本管５ｂ１ の枠状配管部に連通接続し、他端を支持台５のピット５ａ周囲近傍表面に開口させてある。なお、各支管５ｂ２ の開口が弾性支持板４で覆われないように、各支管５ｂ２ の配設位置と弾性支持板４の大きさが設定されている。
【００３９】
弾性支持板４に載置されたガラス基板接合体Ｗには、第１実施形態と同様に同じ材質の押えシート６が被装される。すなわち、この押えシート６は、弾性支持板４全体とその周辺近傍の支持台２表面を充分にカバーできる大きさを備え、フレキシブルなフィルムシート基材の少なくとも一方の表面に微細な凹凸が形成されてなる。そして、第１実施形態における押えシート３と同様に、ガラス基板接合体Ｗの仰向けた表面に負圧としての大気圧で押圧された際にその表面に沿って密着できると共に、ガラス基板接合体Ｗの変形に密着したまま追従して変形する程度にフレキシブルであることが要求される。
【００４０】
ピット５ａ内には、弾性支持板４に当接しこの弾性支持板４をこれに密着保持させたガラス基板接合体Ｗと共に湾曲させる突き出し装置７が配設されている。この突き出し装置７は、先端が球面をなす突き当てヘッド７ａを有し、所定のストロークで弾性支持板４に対して垂直方向に往復異動可能に設けられている。また、この突き出し装置７は、ピット５ａ内を底面に沿って所定のコースに沿って走行可能に設けられている。
【００４１】
次に、本液晶セル分断装置によるガラス基板分断工程について説明する。
まず、前工程のスクライブ工程で一方のガラス基板の表面に分断線に沿って切り欠き溝ｄが刻設されたガラス基板接合体Ｗを、その切り欠き溝ｄが形成された面を仰向けにして弾性支持板４上に載置する。
【００４２】
次いで、押えシート６をガラス基板接合体Ｗに被装する。このとき、押えシート６の周縁部が排気用支管５ｂ２ の開口を塞がないように被装する。これにより、ガラス基板接合体Ｗ全体とこれを支持する弾性支持板４及び弾性支持板４の周囲近傍の支持台２表面とが押えシート６により覆われた状態となる。
【００４３】
次に、上述の状態下において、図示しない真空ポンプを作動させ、押えシート６で覆われた空間内の空気を、各支管５ｂ２ と本管５ｂ１ を通じて排出する
これにより、図３に示されるように、押えシート６で覆われた空間内が真空化されて押えシート６の内側凹凸面がガラス基板接合体Ｗの仰向け面に均一に接し、ガラス基板接合体Ｗに対して大気圧が押えシート６を介し押圧力として作用する。これにより、ガラス基板接合体Ｗが弾性支持板４上に微動可能に保持された状態となる。
【００４４】
上述の状態下において、突き出し装置７を作動させ、その突き当てヘッド７ａ先端を弾性支持板４の切り欠き溝ｄが形成されている分断線上の位置に当接させ所定量突き出させる。これにより、弾性支持板４と共にこれに保持されたガラス基板接合体Ｗの被突き当て部分が湾曲し、この部分に形成されている切り欠き溝ｄが拡大され、ガラス基板Ｓ１ が切り欠き溝ｄに沿って分断面が欠けることなく適正に分断される。この場合も、ガラス基板接合体Ｗは押えシート６により微動可能に保持された状態で分断されるから、分断された（割れた）際に分断面同士が衝突して欠ける不具合も解消される。
この後、ガラス基板接合体Ｗは、図示しない反転装置により表裏反転された後、未だ分断されていないガラス基板Ｓ２ に分断線に沿って切り欠き溝が刻設され、再度、切り欠き溝が形成された面を仰向けにして弾性支持板４上に載置される。そして、上述の分断プロセスと同様のプロセスを経ることにより、個々の液晶セルに適正に分離され、複数の液晶セルが一括して得られる。
【００４５】
なお、本発明の液晶セル分断装置は、上記実施形態に限定されるものではない例えば、本発明は、液晶セルの製造工程におけるガラス基板接合体のようなガラス基板対を分断するためだけでなく、他のフラット・パネル・ディスプレイ用の単板のガラス基板の分断にも、好適に用いることができる。
【００４６】
更に、第１実施形態における支持ヘッド１の表面の湾曲形状は、球面に限らず、円周面でも楕円周面でもよい。
【００４７】
【発明の効果】
本発明のガラス基板分断方法によれば、一方の表面に切り欠き溝を形成したガラス基板を切り欠き溝が開くように湾曲させるから、ブレイクスキージ等でガラス基板を叩くことなく容易に所定の分断線に沿ってガラス基板を分断することができる。その結果、欠け等の分断不良を発生させず良好にガラス基板を分断することができ、液晶素子等のガラス基板からなる製品の歩留まりを向上させることが可能となる。
【００４８】
また、本発明のガラス基板分断方法は、請求項２に記載のように、ガラス基板間に液晶を封入した液晶セルの製造に適用することにより、ガラス基板の適正な分断が厳しく要求される高精細液晶素子も歩留まり良く製造することができる。
【００４９】
さらに、本発明のガラス基板分断方法においては、請求項３に記載のように、ガラス基板を負圧に基づく大気圧により湾曲させることにより、機械的衝撃を与えることなく緩やかにガラス基板全体を支持面に沿って均一に湾曲させることができ、その結果、欠けの発生をより確実に防止することが可能となる。
【００５０】
一方、本発明のガラス基板分断装置によれば、緩やかな湾曲面をなす支持台表面に沿ってガラス基板を強制湾曲させるから、ガラス基板全体に均等に曲げ応力が作用し、欠けの発生が顕著に抑制される。
【００５１】
また、本発明の他のガラス基板分断装置によれば、突き出し手段を弾性支持板を介してガラス基板に押し当てる構成としたから、突き出し手段の衝撃が弾性支持板により和らげられ、ガラス基板を湾曲させて欠けを発生させることなく適正に分断することができる。
【００５２】
上述した本発明の双方のガラス基板分断装置においては、請求項６に記載のように、前記強制保持手段を、分断すべきガラス基板全体からその周囲近傍の支持台表面にわたる範囲をカバーできる大きさのフレキシブルな押えシートと、この押えシートと前記支持台表面とで囲まれる前記ガラス基板を収容した空間内の空気を排出する排気手段とで、構成することにより、ガラス基板全体を支持台の支持面上に柔軟に保持すると共にその湾曲した支持面に沿って迅速且つ緩やかに湾曲させることができる。その結果、欠けの発生をより確実に防止できると共に短時間で能率良くガラス基板を適正に分断することができる。
【００５３】
さらに、本発明の更に他のガラス基板分断装置によれば、ガラス基板を保持する支持面に空気吸引用の穴を設ける必要がなくなり、支持面に空気吸引用の穴がある場合に吸引穴の部分とそれ以外の部分とで分断の際の支持状態が相違することによりガラス基板の割れ方が不均一となる不具合が解消される。
【図面の簡単な説明】
【図１】本発明の第１実施形態としてのガラス基板分断装置示す分解斜視図で、分断開始前の状態を示している。
【図２】本発明の第１実施形態としてのガラス基板分断装置示す分解斜視図で、ガラス基板を分断する状態を示している。
【図３】本発明の第２実施形態としてのガラス基板分断装置示す分解斜視図で、ガラス基板を分断する状態を示している。
【符号の説明】
１…支持ヘッド
２、５…支持台
３、６…押えシート
４…弾性支持板
７…突き出し装置
Ｗ…ガラス基板接合体
Ｓ１ 、Ｓ２ …ガラス基板
ｄ…切り欠き溝[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a glass substrate cutting method and a glass substrate cutting apparatus.
[0002]
[Prior art]
In the production of a conventional liquid crystal element, usually, a pair of glass substrates large enough to collect a plurality of liquid crystal elements are bonded via a sealing material, and then a plurality of liquid crystal cells (before the liquid crystal element is filled with liquid crystal). State).
[0003]
In the liquid crystal cell dividing step, first, a notch groove is formed on an outer surface of one of the paired glass substrate pairs along a dividing line set by a scribe cutter or the like. Next, the glass substrate pair is placed on a support table with the cutout groove formed face up, and held on the support table surface by a method such as vacuum suction. In this state, the breaking glass is used to strike the dividing line to break the front glass substrate along the cutout groove. Thereafter, the glass substrate pair is turned over, and the above-described glass substrate dividing step is performed on the other glass substrate. As a result, the glass substrate pair is separated into a plurality of liquid crystal cells, and a plurality of liquid crystal cells are collectively obtained (for example, Patent Document 1).
[0004]
[Patent Document 1]
JP 2001-18198A (page 4, FIG. 1)
[0005]
[Problems to be solved by the invention]
In the case of the glass substrate cutting method described above, since the glass substrate is hit with a break squeegee, the unit glass substrates separated by the impact at that time come into contact with each other, and a defective product in which a part of the glass substrate is missing occurs.
[0006]
In addition, when the glass substrate is sucked and held and divided, the pressure applied when hit with a break squeegee is different between a portion where the vacuum suction hole is present and a portion where the vacuum suction hole is not present on the surface of the support base on which the glass substrate is placed. Due to the difference, the state of the cross section (end face) of the divided unit glass substrate becomes non-uniform, and there is a problem that the product quality is deteriorated.
[0007]
The present invention provides a glass substrate cutting method that can appropriately and easily divide a glass substrate without causing chipping or non-uniform cross section, and contributing to an improvement in the yield of products made of glass substrates such as liquid crystal elements. It is an object to provide such an apparatus.
[0008]
[Means for Solving the Problems]
The glass substrate cutting method of the present invention, as described in claim 1, is a glass substrate cutting method for obtaining a plurality of unit glass substrates by dividing the glass substrate along a predetermined dividing line. Holding a glass substrate in which a notch groove is formed on the main surface in advance along the dividing line, at a predetermined position with the main surface with the notch groove formed upward, and the one main surface is a convex surface And bending the glass substrate along the dividing line so that the other main surface becomes concave.
[0009]
According to the glass substrate cutting method of the present invention, by bending a glass substrate having a notch groove formed on one surface so that the notch groove is opened, it is possible to easily perform a predetermined process without hitting the glass substrate with a break squeegee or the like. The glass substrate can be cut along the cutting lines. As a result, it is possible to satisfactorily divide the glass substrate without causing division failure such as chipping, and to improve the yield of products manufactured by dividing the glass substrate such as a liquid crystal element.
[0010]
The glass substrate cutting method of the present invention is suitable for a method of manufacturing a liquid crystal cell in which liquid crystal is sealed between glass substrates, as described in claim 2, and accordingly, appropriate cutting of the glass substrate is strictly required. High-definition liquid crystal elements can be manufactured with high yield.
[0011]
Further, in the glass substrate cutting method of the present invention, it is preferable that the glass substrate is curved by the atmospheric pressure based on the negative pressure as described in claim 3, whereby the glass substrate is gently bent without giving a mechanical shock. The entire substrate can be uniformly curved along the support surface, and as a result, the occurrence of chipping can be more reliably prevented.
[0012]
The glass substrate cutting apparatus according to the present invention is a glass substrate cutting apparatus that divides a glass substrate along a predetermined dividing line to obtain a plurality of unit glass substrates. A surface on which a glass substrate, on which a notch groove is formed in advance along the dividing line on the surface, is placed with one main surface thereof facing upwards, a support base forming a curved convex surface, and the glass substrate is supported. Forcibly holding means for bending and holding along the curved convex surface of the table.
[0013]
According to the present glass substrate cutting apparatus, since the glass substrate is forcibly bent along the surface of the support base having a gentle curved surface, bending stress acts uniformly on the entire glass substrate, and the occurrence of chipping is significantly suppressed. .
[0014]
Further, another glass substrate cutting apparatus according to the present invention is a glass substrate cutting apparatus that obtains a plurality of unit glass substrates by dividing a glass substrate along a predetermined dividing line. A support base provided with an elastic support plate on which a glass substrate in which a notch groove is formed in advance on one main surface along a dividing line is placed; and a forcible holding the glass substrate on the elastic support plate. It is characterized by having holding means, and projecting means for projecting the elastic support plate toward the glass substrate to bend the glass substrate.
[0015]
According to the present glass substrate cutting device, since the projecting means is pressed against the glass substrate via the elastic support plate, the impact of the projecting means is relieved by the elastic support plate, and the glass substrate is curved and cut without causing chipping. can do.
[0016]
In the above-described glass substrate cutting device of the present invention, as described in claim 6, the forcible holding means is flexible enough to cover a range from the entire glass substrate to the surface of the support base near its periphery. It is preferable that the holding sheet and an exhaust unit that discharges air in a space containing the glass substrate surrounded by the holding sheet and the surface of the support stand be configured. It can be held flexibly on the support surface and be quickly and gently curved along the curved support surface. As a result, the occurrence of chipping can be more reliably prevented, and the glass substrate can be appropriately divided efficiently in a short time.
[0017]
Further, another glass substrate cutting apparatus according to the present invention is a glass substrate cutting apparatus for obtaining a plurality of unit glass substrates by dividing a glass substrate along a predetermined dividing line. A support base on which a glass substrate in which a notch groove is formed in advance on one main surface along a dividing line is placed, and a size capable of covering a range from the entire glass substrate to the surface of the support base near the periphery thereof. A flexible holding sheet, exhaust means for discharging air in a space containing the glass substrate surrounded by the holding sheet and the surface of the support base, and a surface of the support base by atmospheric pressure through the holding sheet. And a breaking means for applying a stress for enlarging the notch groove to the glass substrate held in the section so as to break the glass substrate along the dividing line.
[0018]
According to the present glass substrate cutting apparatus, it is not necessary to provide a hole for air suction on the support surface holding the glass substrate, and when there is a hole for air suction on the support surface, the suction hole part and the other parts are removed. This eliminates the problem that the glass substrate is broken in a non-uniform manner due to the difference in the support state at the time of division.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
A liquid crystal cell cutting device according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view showing the entire configuration of the liquid crystal cell cutting device of the present embodiment.
[0020]
As shown in FIG. 1, the liquid crystal cell cutting device of the present embodiment includes a support head 1 on which a glass substrate joined body W before being separated into individual liquid crystal cells is mounted, and a support head on which the support head 1 is installed. It comprises a table 2 and a pressing sheet 3 for pressing the glass substrate joined body W against the surface of the support head 1.
[0021]
The glass substrate joined body W is formed by joining a pair of glass substrates S1 and S2 with a predetermined gap kept therebetween by a frame-shaped sealing material (not shown) arranged for each liquid crystal cell region. , Transparent electrodes and alignment films are laminated for each liquid crystal cell region. An outer surface of the glass substrate assembly W opposite to the surface of the one glass substrate S1 opposite to the other glass substrate S2 is cut along a dividing line that divides each liquid crystal cell region in a scribe process of a previous process. A notch d is formed.
[0022]
The support head 1 has a spherical shape in which the peripheral surface of the sphere is cut out, and the surface 1a supporting the glass substrate joined body W has a spherical surface.
[0023]
Exhaust passages 1b and 2a are formed over the support head 1 and the support base 2 on which the support head 1 is installed.
[0024]
The plurality of exhaust passages 1b provided in the support head 1 are uniformly arranged at predetermined intervals over the entire periphery of the peripheral portion of the support head 1, and one end of each exhaust passage 1b is provided on the surface of the support head 1. 1a.
[0025]
The exhaust passage 2a formed inside the support base 2 includes a main pipe 2a1 and a plurality of branch pipes 2a2 branched from the main pipe 2a1. The end of the main pipe 2a1 extending from the support table 2 is connected to a vacuum pump (not shown). The plurality of branch passages 2a2 are respectively connected to a plurality of exhaust passages 1b provided in the support head 1 so as to correspond thereto.
[0026]
The holding sheet 3 is mounted on the glass substrate joined body W supported by the support head 1. The pressing sheet 3 has a size capable of covering the entire surface 1a of the support head 1 and the surface of the support table 2 around the surface 1a. The pressing sheet 3 has fine irregularities formed on at least one surface of a flexible film sheet substrate. The fine irregularities can be easily formed by coating the surface of the base sheet with a hard resin material such as PET (polyethylene terephthalate), or by attaching a fine mesh. In this case, the degree of flexibility of the pressing sheet 3 is such that when pressed against the surface of the glass substrate bonded body W facing upward at atmospheric pressure as a negative pressure, the glass sheet bonded body W It is required to be flexible enough to follow and deform while closely contacting the deformation.
[0027]
The pressing sheet 3 having the above-described flexibility and having one surface forming a fine uneven surface has a cutout groove formed on the surface of the fine uneven surface along the dividing line of the glass substrate joined body W. It is provided so as to be in contact with the surface of the glass substrate. Thereby, the holding sheet 3 and the surface of the glass substrate joined body W do not adhere to each other, and the glass substrate joined body W can be held by the holding sheet 3 in a state in which it can be finely moved.
[0028]
Next, a glass substrate cutting step by the present liquid crystal cell cutting apparatus will be described.
First, the glass substrate joined body W in which the notch d is cut along the dividing line on the surface of one of the glass substrates in the scribing step of the previous step, the surface on which the notch d is formed is turned upside down. It is placed on the support head 1. At this time, the alignment of the glass substrate joined body W is extremely simple, since the surface of the support head 1 is spherical, it is only necessary to place the center part of the support head 1 at the apex of the support head 1.
[0029]
Next, the pressing sheet 3 is mounted on the glass substrate joined body W. In this case as well, a simple alignment may be sufficient in which the center of the holding sheet 3 and the center of the glass substrate assembly W are aligned. As a result, as shown in FIG. 1, the glass substrate joined body W, the entire support head 1 supporting the same, and the surface of the support base 2 near the periphery of the support head 1 are covered with the pressing sheet 3.
[0030]
Next, in the above-described state, a vacuum pump (not shown) is operated to discharge air in the space covered by the presser sheet 3 from each exhaust path 1b through the branch pipe 2a2 and the main pipe 2a1.
As a result, the space covered by the press sheet 3 is evacuated, and the atmospheric pressure acts on the glass substrate joined body W via the press sheet 3 as a pressing force, and as shown in FIG. The body W is evenly pressed against the spherical surface 1a of the support head 1, and a bending stress acts on the glass substrate joined body W such that the surface facing upward is a convex surface and the supported back surface is a concave surface. As a result, the notch groove d of the glass substrate joined body W is enlarged, and the glass substrate S1 is cut along the notch groove d.
[0032]
At the time of this division, since the bending stress gradually and uniformly acts on the whole glass substrate joined body W together with the exhaust, the divided section is formed exactly along the cutout groove d, and the glass substrate joined body W Since it is divided while being held by the presser sheet 3 so as to be finely movable, the problem that the divided sections collide with each other at the moment of division (broken) and chipped is also eliminated. Therefore, the glass substrate S1 is properly divided without causing chipping.
[0033]
After that, the glass substrate joined body W is turned upside down by a reversing device (not shown), and then a notch groove is cut along the dividing line in the glass substrate S2 which has not been cut, and the notch groove is formed again. It is placed on the support head 1 with the cut surface facing up. Then, through the same process as the above-described dividing process, the liquid crystal cells are properly separated into individual liquid crystal cells, and a plurality of liquid crystal cells are obtained collectively.
[0034]
Next, a liquid crystal cell cutting device according to a second embodiment of the present invention will be described with reference to the schematic sectional view of FIG.
[0035]
The liquid crystal cell cutting device of this example includes an elastic support plate 4 on which a glass substrate joined body W before being divided into individual liquid crystal cells is mounted, a support table 5 on which the elastic support plate 4 is installed, and a glass substrate. A pressing sheet 6 for pressing the joined body W against the surface of the elastic support plate 4, and an elastic support plate 4 which is brought into contact with the elastic support plate 4 from the back surface opposite to the surface on which the glass substrate joined body W is placed. And a protruding device 7 for protruding toward the glass substrate joined body W side.
[0036]
The glass substrate joined body W is formed in the same manner as in the first embodiment, and the outer surface of one glass substrate S1 is cut along the dividing line that divides each liquid crystal cell region in the previous scribe step. A notch d is formed.
[0037]
The elastic support plate 4 is made of a flexible elastic material such as hard rubber. A pit 5a is formed in a rectangular parallelepiped shape corresponding to the planar shape of the glass substrate joined body W on the support base 5 on which the elastic support plate 4 is installed, and the elastic support plate 4 is formed over the entire opening of the pit 5a. And the pit 5a is closed. That is, the elastic support plate 4 serves as a lid of the pit 5a.
[0038]
An exhaust pipe 5b including a main pipe 5b1 and a plurality of branch pipes 5b2 branched from the main pipe 5b is provided in the support base 5. The main pipe 5b1 is piped into a rectangular frame having a size surrounding the pit 5a at an appropriate interval at the bottom of the support base 5, and an end of the pipe protruding outside from the frame-shaped pipe is not shown. It is connected to a vacuum pump. Each of the plurality of branch pipes 5b2 is evenly disposed near the periphery of the pit 5a, one end of which is connected to the frame-shaped piping portion of the main pipe 5b1, and the other end is opened to the surface of the support 5 near the pit 5a. It is. The position of each branch pipe 5b2 and the size of the elastic support plate 4 are set so that the opening of each branch pipe 5b2 is not covered with the elastic support plate 4.
[0039]
A press sheet 6 made of the same material is mounted on the glass substrate joined body W placed on the elastic support plate 4 as in the first embodiment. That is, the pressing sheet 6 is large enough to cover the entire elastic support plate 4 and the surface of the support base 2 in the vicinity of the periphery thereof, and fine irregularities are formed on at least one surface of the flexible film sheet substrate. It becomes. Then, similarly to the holding sheet 3 in the first embodiment, when pressed against the supine surface of the glass substrate joined body W by the atmospheric pressure as a negative pressure, the glass substrate joined body W can be adhered along the surface and the glass substrate joined body W It is required to be flexible enough to follow and deform while closely contacting the deformation.
[0040]
In the pit 5a, there is provided a projecting device 7 which is in contact with the elastic support plate 4 and curves the elastic support plate 4 together with the glass substrate joined body W held in close contact therewith. The ejecting device 7 has an abutting head 7 a having a spherical tip, and is provided so as to be reciprocally movable in a vertical direction with respect to the elastic support plate 4 by a predetermined stroke. The projecting device 7 is provided so as to be able to travel along a predetermined course along the bottom surface in the pit 5a.
[0041]
Next, a glass substrate cutting step by the present liquid crystal cell cutting apparatus will be described.
First, the glass substrate joined body W in which the notch d is cut along the dividing line on the surface of one of the glass substrates in the scribing step of the previous step, the surface on which the notch d is formed is turned upside down. It is placed on the elastic support plate 4.
[0042]
Next, the pressing sheet 6 is mounted on the glass substrate joined body W. At this time, the presser sheet 6 is covered so that the peripheral edge of the presser sheet 6 does not block the opening of the exhaust pipe 5b2. As a result, the entire glass substrate joined body W, the elastic support plate 4 supporting the same, and the surface of the support base 2 near the periphery of the elastic support plate 4 are covered with the pressing sheet 6.
[0043]
Next, in the above-described state, a vacuum pump (not shown) is operated to discharge air in the space covered with the presser sheet 6 through each of the branch pipes 5b2 and the main pipe 5b1, whereby the air is discharged as shown in FIG. The space covered by the holding sheet 6 is evacuated so that the inner uneven surface of the holding sheet 6 uniformly contacts the supine surface of the glass substrate joined body W, and the atmospheric pressure is applied to the glass substrate joined body W by the atmospheric pressure. Acts as a pressing force via Thereby, the glass substrate joined body W is held on the elastic support plate 4 so as to be finely movable.
[0044]
In the above state, the ejecting device 7 is operated, and the tip of the abutting head 7a is brought into contact with a position on the dividing line where the cutout groove d of the elastic support plate 4 is formed, and is ejected by a predetermined amount. As a result, the abutted portion of the glass substrate joined body W held by the elastic support plate 4 and the elastic support plate 4 is curved, the cutout groove d formed in this portion is enlarged, and the glass substrate S1 is cut out of the cutout groove d. Is properly divided along the section without chipping. Also in this case, since the glass substrate joined body W is divided while being held by the presser sheet 6 so as to be finely movable, the problem that the divided sections collide with each other when the pieces are divided (broken) and chipped is also eliminated.
After that, the glass substrate joined body W is turned upside down by a reversing device (not shown), and then a notch groove is cut along the dividing line in the glass substrate S2 which has not been cut, and the notch groove is formed again. It is placed on the elastic support plate 4 with its surface turned on its back. Then, through the same process as the above-described dividing process, the liquid crystal cells are properly separated into individual liquid crystal cells, and a plurality of liquid crystal cells are obtained collectively.
[0045]
The liquid crystal cell cutting device of the present invention is not limited to the above embodiment.For example, the present invention is not only for cutting a glass substrate pair such as a glass substrate joined body in a liquid crystal cell manufacturing process, It can also be suitably used for cutting other single-panel glass substrates for flat panel displays.
[0046]
Further, the curved shape of the surface of the support head 1 in the first embodiment is not limited to a spherical surface, and may be a circular surface or an elliptical surface.
[0047]
【The invention's effect】
According to the glass substrate cutting method of the present invention, a glass substrate having a cutout groove formed on one surface is curved so as to open the cutout groove, so that the glass substrate can be easily cut by a predetermined amount without hitting the glass substrate with a break squeegee or the like. The glass substrate can be divided along the disconnection. As a result, the glass substrate can be satisfactorily divided without causing division failure such as chipping, and the yield of products formed of the glass substrate such as a liquid crystal element can be improved.
[0048]
Further, the glass substrate cutting method of the present invention is applied to the production of a liquid crystal cell in which a liquid crystal is sealed between glass substrates, as described in claim 2, so that appropriate cutting of the glass substrate is strictly required. A fine liquid crystal element can also be manufactured with high yield.
[0049]
Furthermore, in the glass substrate cutting method of the present invention, as described in claim 3, the glass substrate is curved by the atmospheric pressure based on the negative pressure, thereby gently supporting the entire glass substrate without giving a mechanical shock. It can be curved uniformly along the surface, and as a result, it is possible to more reliably prevent the occurrence of chipping.
[0050]
On the other hand, according to the glass substrate cutting device of the present invention, since the glass substrate is forcibly bent along the surface of the support base forming a gentle curved surface, bending stress acts uniformly on the entire glass substrate, and the occurrence of chipping is remarkable. Is suppressed.
[0051]
Further, according to another glass substrate cutting apparatus of the present invention, since the projecting means is configured to be pressed against the glass substrate via the elastic support plate, the impact of the projecting means is reduced by the elastic support plate, and the glass substrate is bent. By doing so, it is possible to properly cut without causing chipping.
[0052]
In the above two glass substrate cutting apparatuses of the present invention, as described in claim 6, the size of the forcible holding means can cover the range from the entire glass substrate to be cut to the surface of the support base near the periphery thereof. A flexible holding sheet, and exhaust means for exhausting air in a space containing the glass substrate surrounded by the holding sheet and the surface of the support base, thereby supporting the entire glass substrate on the support base. It can be held flexibly on a surface and bend quickly and gently along its curved support surface. As a result, the occurrence of chipping can be more reliably prevented, and the glass substrate can be appropriately divided efficiently in a short time.
[0053]
Furthermore, according to still another glass substrate cutting apparatus of the present invention, it is not necessary to provide a hole for air suction on the support surface holding the glass substrate. The problem that the glass substrate breaks non-uniformly due to the difference in the support state at the time of division between the part and the other part is solved.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing a glass substrate cutting device according to a first embodiment of the present invention, showing a state before the start of cutting.
FIG. 2 is an exploded perspective view showing a glass substrate cutting device as a first embodiment of the present invention, showing a state in which the glass substrate is cut.
FIG. 3 is an exploded perspective view showing a glass substrate cutting device according to a second embodiment of the present invention, showing a state in which the glass substrate is cut.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Support heads 2, 5 ... Support bases 3, 6 ... Holding sheet 4 ... Elastic support plate 7 ... Projecting device W ... Glass substrate joined body S1, S2 ... Glass substrate d ... Notch groove

Claims (7)

ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板の分断方法であって、
一方の主面に予め前記分断線に沿って切り欠き溝が形成されたガラス基板を、該切り欠き溝が形成された主面を上にして所定位置に保持する工程と、
前記一方の主面が凸面となり、他方の主面が凹面となるように、前記ガラス基板を湾曲させて前記分断線に沿って分断する工程とを、
有することを特徴とするガラス基板分断方法。A glass substrate dividing method for dividing a glass substrate along a predetermined dividing line to obtain a plurality of unit glass substrates,
A step of holding a glass substrate on which a notch groove is formed in advance on one main surface along the dividing line, at a predetermined position with the main surface on which the notch groove is formed up,
A step of dividing the glass substrate along the dividing line by curving the glass substrate so that the one main surface becomes a convex surface and the other main surface becomes a concave surface.
A method for cutting a glass substrate, comprising: 前記ガラス基板は、一対のガラス基板を接合しこれらガラス基板間に液晶を封入する空間を形成した液晶セルの、一方のガラス基板であることを特徴とする請求項１に記載のガラス基板分断方法。The glass substrate cutting method according to claim 1, wherein the glass substrate is one glass substrate of a liquid crystal cell in which a pair of glass substrates are joined and a space for enclosing liquid crystal is formed between the glass substrates. . 前記ガラス基板は、大気圧により湾曲せしめられることを特徴とする請求項１又は２に記載のガラス基板分断方法。The method according to claim 1, wherein the glass substrate is curved by atmospheric pressure. ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板分断装置であって、
一方の主面に前記分断線に沿って予め切り欠き溝が形成されたガラス基板がその一方の主面を上にして載置される表面が、湾曲した凸面をなす支持台と、
前記ガラス基板を前記支持台の湾曲した凸面に沿わせて湾曲させると共に保持する強制保持手段とを、
有することを特徴とするガラス基板分断装置。A glass substrate cutting apparatus that cuts a glass substrate along a predetermined cutting line to obtain a plurality of unit glass substrates,
A surface on which a glass substrate on which a notch groove is formed in advance along the dividing line on one main surface is placed with one main surface thereof facing upwards, and a support base forming a curved convex surface,
Forcibly holding means for holding the glass substrate while curving it along the curved convex surface of the support table,
A glass substrate cutting device, comprising: ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板分断装置であって、
一方の主面に分断線に沿って予め切り欠き溝が形成されたガラス基板が載置される弾性支持板を備えた支持台と、
前記ガラス基板を前記弾性支持板上に保持する強制保持手段と、
前記弾性支持板を前記ガラス基板側に突出させてガラス基板を湾曲させる突き出し手段とを、
有することを特徴とするガラス基板分断装置。A glass substrate cutting apparatus that cuts a glass substrate along a predetermined cutting line to obtain a plurality of unit glass substrates,
A support base having an elastic support plate on which a glass substrate on which a notch groove is formed in advance along a dividing line on one main surface is placed;
Forced holding means for holding the glass substrate on the elastic support plate,
Projection means for projecting the elastic support plate toward the glass substrate and bending the glass substrate.
A glass substrate cutting device, comprising: 前記強制保持手段は、前記ガラス基板全体からその周囲近傍の前記支持台表面にわたる範囲をカバーできる大きさのフレキシブルな押えシートと、この押えシートと前記支持台表面とで囲まれる前記ガラス基板を収容した空間内の空気を排出する排気手段とからなることを特徴とする請求項４又は請求項５に記載のガラス基板分断装置。The forcible holding means accommodates a flexible pressing sheet large enough to cover a range from the entire glass substrate to the surface of the supporting table near the periphery thereof, and the glass substrate surrounded by the pressing sheet and the surface of the supporting table. The glass substrate cutting apparatus according to claim 4 or 5, further comprising an exhaust means for discharging air in the space defined. ガラス基板を所定の分断線に沿って分断し、複数個の単位ガラス基板を得るガラス基板分断装置であって、
一方の主面に分断線に沿って予め切り欠き溝が形成されたガラス基板が載置される支持台と、
前記ガラス基板全体からその周囲近傍の前記支持台表面にわたる範囲をカバーできる大きさのフレキシブルな押えシートと
この押えシートと前記支持台表面とで囲まれる前記ガラス基板を収容した空間内の空気を排出する排気手段と、
前記押えシートを介した大気圧により前記支持台表面に保持されたガラス基板に対し、前記切り欠き溝を拡大させる応力を作用させて前記分断線に沿って破断させる破断手段とを、
有することを特徴とするガラス基板分断装置。A glass substrate cutting apparatus that cuts a glass substrate along a predetermined cutting line to obtain a plurality of unit glass substrates,
A support base on which a glass substrate on which a notch groove is formed in advance along a dividing line on one main surface is placed,
A flexible pressing sheet large enough to cover a range from the entire glass substrate to the surface of the support table near the periphery thereof, and exhausting air in a space containing the glass substrate surrounded by the pressing sheet and the surface of the support table. Exhaust means,
On the glass substrate held on the surface of the support table by the atmospheric pressure via the pressing sheet, a breaking means for applying a stress for enlarging the cutout groove to break along the dividing line,
A glass substrate cutting device, comprising:
JP2003154326A 2003-05-30 2003-05-30 Method of cutting off glass substrate and device therefor Pending JP2004354836A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007022876A (en) * 2005-07-20 2007-02-01 Seiko Epson Corp Substrate dividing method and substrate dividing apparatus
KR100761477B1 (en) * 2005-01-20 2007-09-27 삼성전자주식회사 Scribing method and apparatus of liquid crystal panei, method for fabricating liquid crystal panel
CN103803788A (en) * 2014-02-22 2014-05-21 蚌埠中建材信息显示材料有限公司 Buoyancy supporting device for transversely cutting ultra-thin plate glass
WO2018193583A1 (en) * 2017-04-20 2018-10-25 堺ディスプレイプロダクト株式会社 Scribing device and scribing method
CN109790059A (en) * 2016-10-05 2019-05-21 日本电气硝子株式会社 The manufacturing method and glass resin laminated body of glass resin laminated body
CN111247479A (en) * 2017-10-20 2020-06-05 弗莱克因艾伯勒有限公司 Curved display and sensor device
CN115157140A (en) * 2022-07-05 2022-10-11 业成科技（成都）有限公司 Attaching jig

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100761477B1 (en) * 2005-01-20 2007-09-27 삼성전자주식회사 Scribing method and apparatus of liquid crystal panei, method for fabricating liquid crystal panel
US7504273B2 (en) 2005-01-20 2009-03-17 Samsung Electronics Co., Ltd. Scribing method and apparatus of liquid crystal panel, method for fabricating liquid crystal panel
JP2007022876A (en) * 2005-07-20 2007-02-01 Seiko Epson Corp Substrate dividing method and substrate dividing apparatus
JP4552791B2 (en) * 2005-07-20 2010-09-29 セイコーエプソン株式会社 Substrate division method
CN103803788A (en) * 2014-02-22 2014-05-21 蚌埠中建材信息显示材料有限公司 Buoyancy supporting device for transversely cutting ultra-thin plate glass
CN103803788B (en) * 2014-02-22 2016-06-01 蚌埠中建材信息显示材料有限公司 A kind of buoyancy jacking device for ultra-thin flat glass crosscut
CN109790059B (en) * 2016-10-05 2021-11-16 日本电气硝子株式会社 Method for producing glass resin laminate, and glass resin laminate
CN109790059A (en) * 2016-10-05 2019-05-21 日本电气硝子株式会社 The manufacturing method and glass resin laminated body of glass resin laminated body
WO2018193583A1 (en) * 2017-04-20 2018-10-25 堺ディスプレイプロダクト株式会社 Scribing device and scribing method
CN111247479A (en) * 2017-10-20 2020-06-05 弗莱克因艾伯勒有限公司 Curved display and sensor device
CN111247479B (en) * 2017-10-20 2023-11-14 弗莱克英纳宝技术有限公司 Curved display and sensor device
CN115157140A (en) * 2022-07-05 2022-10-11 业成科技（成都）有限公司 Attaching jig
CN115157140B (en) * 2022-07-05 2023-12-05 业成科技（成都）有限公司 Attaching jig

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