KR20110059121A - Substrate transferring unit and method of transfering substrate using the same - Google Patents

Abstract

PURPOSE: A substrate conveyor unit and a substrate conveying method using the same are provided to minimize the deflection of a substrate by minimizing the structure of a substrate conveyor unit for the inclined conveyance of a substrate. CONSTITUTION: A substrate conveyor unit(200) contains: a stage(210) on which a substrate puts; and a conveyor member floating the substrate put on the stage in the air and conveying to be inclined. The conveyor member contains: injection holes provided to the stage to jet gas to the bottom of the substrate in the inclined direction; a gas supply member supplying gas to the injection holes and including a gas supply source, gas lines connecting the gas supply source with the injection holes, and a valve controlling the opening and closing degree of the gas lines; and a controller controlling the operation of the gas supply member to increase gradually the injection quantity of gas jetted from the injection holes in the vertical direction to the conveying direction of the substrate.

Description

Substrate transfer unit and substrate transfer method using same {SUBSTRATE TRANSFERRING UNIT AND METHOD OF TRANSFERING SUBSTRATE USING THE SAME}

The present invention relates to a substrate transfer unit for transferring a substrate used in the manufacture of a flat panel display element, and a method for transferring the substrate using the same.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. This information processing apparatus has a display device for displaying the operated information. Until now, the CRT monitor has been mainly used as a display device, but recently, with the rapid development of semiconductor technology, the use of a flat panel display device that is light and occupies a small space is rapidly increasing.

Various processes are performed to manufacture the flat panel display apparatus, and the substrate used in the flat panel display apparatus is transferred to the chamber where the respective processes are performed through the transfer unit.

The conventional substrate transfer unit includes transfer shafts arranged side by side and rotated, and rollers installed on respective transfer shafts and in contact with the lower surface of the transfer substrate, and the transfer shafts are arranged to be inclined for inclined conveyance of the substrate. .

By the way, the conventional substrate transfer unit has a complicated structure using an up / down cylinder or the like for tilting and conveying the substrate, and since the substrate is supported by a limited number of rollers, deflection of the substrate occurs. Have.

The present invention is to provide a substrate transfer unit capable of tilting and conveying a substrate in a simplified structure and a substrate transfer method using the same.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a substrate transfer unit according to an embodiment of the present invention, the substrate is placed; And a conveying member configured to incline and convey the substrate placed on the stage in an inclined manner.

According to an embodiment of the present disclosure, the transfer member may include a plurality of injection holes provided in the stage to inject gas in an inclined direction to a lower surface of the substrate; A gas supply member supplying gas to the injection holes; And a controller configured to control an operation of the gas supply member to gradually increase an injection amount of the gas injected from the injection holes along a direction perpendicular to the transfer direction of the substrate.

According to an embodiment of the invention, the gas supply member, a gas supply source; Gas lines connecting the gas source and the injection holes; And valves for adjusting an opening and closing degree of the gas lines, wherein the controller may control the operation of the valves to adjust the injection amount of the gas injected from the injection holes.

According to an embodiment of the present invention, the plurality of injection holes are provided in the stage to form a plurality of rows, the injection holes provided in the same row are connected to the same gas line, and the injection holes provided in different rows are different gas It is connected to the line, each of the gas line may be provided with the valve.

According to an embodiment of the present invention, the plurality of injection holes are provided in the stage to form a plurality of grouped rows, and the injection holes provided in the same group are connected to the same gas line and provided in different groups. The injection holes are connected to the different gas lines, and each of the gas lines may be provided with the valve.

According to an embodiment of the present disclosure, the transfer member may further include a plurality of vacuum suction holes provided in the stage to apply a negative pressure to a lower surface of the substrate.

According to an embodiment of the present disclosure, the chuck member may further include a chuck member installed at the stage and configured to chuck / unchuck the first side of the substrate placed on the stage.

According to an embodiment of the present disclosure, the chuck member may include: grippers disposed in a line along the transfer direction of the substrate and chucking upper and lower surfaces of the first side of the substrate; And hinge parts rotatably coupling the grippers to the stage.

According to an embodiment of the present disclosure, each of the grippers may include: an adsorption unit configured to vacuum-adsorb a lower surface of the first side of the substrate; And a pressing part hinged to the adsorption part and pressurizing an upper surface of the first side of the substrate.

According to an embodiment of the present disclosure, guide rollers may be further provided on the stage to guide the movement of the first side of the substrate.

In order to achieve the above object, a substrate transfer method according to an embodiment of the present invention, a method for transferring a substrate, comprising: loading a substrate on a stage; And linearly conveying the substrate placed on the stage by inclined levitation.

According to an embodiment of the present invention, the substrate is levitation is linearly conveyed by the gas injected in the direction inclined from the stage to the lower surface of the substrate, the injection amount of the gas so that the substrate is inclined the transfer direction of the substrate It may increase gradually along the direction perpendicular to.

According to an embodiment of the present disclosure, the method may further include applying a negative pressure to the lower surface of the substrate.

According to an embodiment of the present invention, in a state where the first side of the substrate is fixed, the substrate is inclined to levitation so that the second side of the substrate facing the first side is positioned higher than the first side, The substrate may be linearly transferred while the first side is released.

According to an embodiment of the present invention, the first side of the substrate may be linearly moved while being guided by a guide roller.

According to the present invention, the structure of the substrate transfer unit for substrate tilt conveyance can be simplified.

And according to the present invention, it is possible to minimize the deflection of the substrate generated during the inclined conveyance of the substrate.

Hereinafter, a substrate transfer unit and a substrate transfer method using the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

(Example)

1 is a view showing a substrate processing apparatus equipped with a substrate transfer unit according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing apparatus 10 includes process chambers 100, 100 ′, 100 ″ and substrate transfer units 200, 200 ′, 200 ″.

The process chambers 100, 100 ′, 100 ″ provide a space for the substrate S processing process. The substrate transfer units 200, 200 ′, 200 ″ are installed in the process chambers 100, 100 ′, 100 ″, respectively. The substrate transfer unit 200, 200 ′, 200 ″ transfers the substrate S in one direction between the process chambers 100, 100 ′, 100 ″ or within the process chambers 100, 100 ′, 100 ″.

The process chambers 100, 100 ', 100 "have a generally rectangular parallelepiped shape and are disposed adjacent to each other. One sidewall of the process chambers 100, 100', 100" has a substrate S formed by the process chambers 100, 100 ', 100 ". Inflow inlets 110a and 110a "are provided, and opposite sidewalls thereof are provided with outlets 110b and 110b 'through which the substrate S flows out from the process chambers 100, 100' and 100".

In each process chamber 100, 100 ′, 100 ″, a predetermined process is performed on the substrate S. A cleaning process may be performed in the first process chamber 100 disposed at the center of the process chambers 100, 100 ′, 100 ″. Can be. The cleaning member 300 is installed in the first process chamber 100, and the cleaning member 300 supplies the cleaning liquid to the substrate S transferred by the substrate transfer unit 200 to clean the substrate. The etching process may be performed in the second process chamber 100 ′ disposed in front of the first process chamber 100, and the drying process may be performed in the process chamber 100 ″ disposed behind the first process chamber 100. This can be done.

2 is a plan view of the substrate transfer unit 200 of FIG. 1, and FIG. 3 is a side view of the substrate transfer unit 200 of FIG. 1. 4 is a side view of the chuck member 220 of FIG. 2, FIG. 5 is a cross-sectional view taken along the line AA ′ of FIG. 2, and FIG. 6 is a cross-sectional view taken along the line BB ′ of FIG. 2. 7 is a view showing a modification of the gas supply member.

2 to 7, the substrate transfer unit 200 includes a stage 210, a chuck member 220, a transfer member 240, and a guide roller 280. Here, the first direction I is the conveying direction of the substrate S, and the second direction II is the direction perpendicular to the first direction I on the plane when the substrate conveying unit 200 is viewed from above. .

The stage 210 may be provided as a cube having a quadrangular plane. The stage 210 lies horizontally on the top surface of the base 212. The substrate S is loaded on top of the base 212 in the first direction I and lies on the top surface of the base 212.

The chuck member 220 includes a plurality of grippers 222 and hinge parts 226. The grippers 222 are disposed in a line in one edge region of the center line along the first direction I of the upper surface of the stage 210 and are rotatably coupled to the stage 210 by the hinge parts 226. The hinge parts 226 are arranged so that the rotational center axis faces the first direction (I).

Each gripper 222 has an adsorption part 223 and a pressurizing part 225. The adsorption part 223 vacuum-absorbs the lower surface of the first side of the substrate S placed on the stage 210. The first side is the edge region of the substrate adjacent the grippers 222. The adsorption part 223 may be provided in a plate shape. On the upper surface of the adsorption part 223, as shown in FIG. 4, a plurality of vacuum suction holes 224 are formed. A vacuum pump (not shown) is connected to the vacuum suction holes 224 by a vacuum line (not shown). A negative pressure is formed between the lower surface of the first side of the substrate S and the suction part 223 by the suction force of the vacuum pump (not shown), and the lower surface of the first side of the substrate S is absorbed by the negative pressure ( 223 is adsorbed and fixed. The pressing unit 225 may be provided in a cramped shape and is hinged rotatably to the adsorption unit 223. The hinge axis of the pressing portion 225 faces the first direction (I). The pressing unit 225 is rotated by a driver (not shown) to press the upper surface of the first side of the substrate S adsorbed by the adsorption unit 223. The negative pressure formed by the suction unit 223 and the pressing force of the pressing unit 225 are released when the substrate is transferred.

The transfer member 240 inclines and lifts the substrate placed on the stage 210 in the first direction (I). As shown in FIGS. 5 and 6, the transfer member 240 includes injection holes 242, vacuum suction holes 244, a gas supply member 250, and a controller 270.

The stage 210 is formed with a plurality of injection holes 242 for injecting gas into the lower surface of the substrate. The plurality of injection holes 242 are formed to form a plurality of rows on the plane of the stage 210. The injection holes 242 are formed to be inclined in the first direction I with respect to the bottom surface of the substrate. Since the gas is injected obliquely in the first direction (I) through the injection holes 242, the gas simultaneously acts on the lower surface of the substrate a force to lift the substrate upward and a force to transfer the substrate in the first direction (I). Let's do it.

The gas supply member 250 supplies gas to the injection holes 242. The gas supply member 250 includes a gas source 252, gas lines 254-1, 254-2, and valves 256. Gas lines 254-1 and 254-2 connect the injection holes 242 and the gas source 252.

One end of the main gas line 254-1 is connected to the gas source 252, and the other end of the main gas line 254-1 has a number of branch lines 254-corresponding to the number of rows of the injection holes 242. Branches to 2). Branch lines 254-2 are connected to the injection holes 242. In this case, the injection holes 242 provided in the same row are connected to the same branch line 254-2, and the injection holes 242 provided in different rows are connected to the different branch line 254-2. Each branch line 254-2 is provided with a valve 256 for adjusting the opening and closing degree of the branch line 254-2. On the main gas line 254-1, a pump 258 is provided which provides the flow pressure.

On the other hand, as shown in FIG. 7, the rows of injection holes 242 may be divided into several groups, and the injection holes 242 provided in the same group are connected to the same gas line 254-2, and different Injection holes 242 provided in the group may be connected to different gas lines 254-2. Specifically, one end of the main branch line 254-1 is connected to the gas source 252, and the other end of the main gas line 254-1 has a first number of numbers corresponding to the number of groups of injection holes 242. It may be branched to branch lines 254-2. Valves 256 are respectively provided on the first branch lines 254-2. The first branch lines 254-2 are branched into a number of second branch lines 254-3 corresponding to the number of rows of the injection holes 242 included in each group, and the second branch lines 254 254-3 is connected to the injection holes 242.

The controller 270 controls the valves so that the injection amount of the gas injected from the injection holes 242 gradually increases along the direction perpendicular to the transfer direction (first direction I) of the substrate (second direction II). 256 to control the opening and closing operation. Specifically, the controller 270 controls the opening and closing operations of the valves 256 to increase the injection amount of the gas from the first side of the substrate toward the second side of the substrate in the second direction II. The substrate is then inclined such that the second side is positioned higher than the first side. Here, the second side is the substrate edge region at a position symmetrical with the first side with respect to the center line along the first direction (I) of the substrate.

In addition, a plurality of vacuum suction holes 244 are formed in the stage 210 to apply a negative pressure to the lower surface of the substrate S. The vacuum suction holes 244 may apply a negative pressure to the lower surface of the substrate to limit the height of the substrate supported by the transfer member 240.

Meanwhile, the guide roller 280 may be disposed between the grippers 222 on the stage 210. The guide roller 280 guides the movement of the lower end of the substrate, ie, the first side of the substrate, which is inclined to be lifted and lifted.

Referring to the process of transferring the substrate using the substrate transfer unit having the above configuration as follows. 8A to 8D are views illustrating a process of transferring a substrate by the substrate transfer unit.

First, the substrate S is loaded onto the stage 210, and the first side of the substrate S is placed on the adsorption portion 223 of the gripper 222. The adsorption part 223 vacuum-absorbs the lower surface of the 1st side part of the board | substrate S. (FIG. 8A).

The pressing unit 225 of the gripper 222 is rotated by a driver (not shown) to press the upper surface of the first side of the substrate S adsorbed by the suction unit 223 (FIG. 8B).

Gas is injected from the injection holes 242 of the stage 210. The gas is injected so that the injection amount gradually increases along the direction (second direction (II)) perpendicular to the transport direction (first direction (I)) of the substrate. The gripper 222 and the substrate fixed to the gripper 222 rotate about the hinge portion 226, and the substrate is inclined to be levitation (FIG. 8C).

The pressing portion 225 of the gripper 222 is rotated by a driver (not shown) to release the pressing force applied to the upper surface of the first side of the substrate S. The adsorption part 223 releases the sound pressure which acts on the lower surface of the 1st side part of the board | substrate S. As shown in FIG. At the same time, a negative pressure is applied to the lower surface of the substrate through the vacuum suction holes 244 of the stage 210. When a negative pressure is applied to the lower surface of the substrate by the vacuum suction holes 244, the levitation substrate can be stably maintained in an inclined state. At this time, since the gas injected from the injection holes 242 flows in the direction inclined in the first direction I with respect to the lower surface of the substrate, the substrate is transferred in the first direction I in an inclined airborne state. And the transfer of the board | substrate is guided by the guide roller 280. (FIG. 8D)

With the above structure, the substrate can be tilted and conveyed to the substrate transfer unit having a structure that is simplified compared with the conventional substrate transfer unit.

In addition, since the entire surface of the lower surface of the substrate is supported by a gas, it is possible to minimize the deflection of the substrate that may occur during the inclined conveyance of the substrate in the conventional substrate transfer unit.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

The drawings described below are for illustrative purposes only and are not intended to limit the scope of the invention.

1 is a view showing a substrate processing apparatus equipped with a substrate transfer unit according to an embodiment of the present invention.

2 is a plan view of the substrate transfer unit of FIG. 1.

3 is a side view of the substrate transfer unit of FIG. 1.

4 is a side view of the chuck member of FIG. 2.

5 is a cross-sectional view taken along line AA ′ of FIG. 2.

6 is a cross-sectional view taken along line BB ′ of FIG. 2.

7 is a view showing a modification of the gas supply member.

8A to 8D are views illustrating a process of transferring a substrate by the substrate transfer unit.

<Description of Symbols for Main Parts of Drawings>

200: substrate transfer unit 210: stage

220: chuck member 240: transfer member

242: injection hole 244: vacuum suction hole

250: gas supply member 270: control unit

280: guide roller

Claims (15)

A stage on which the substrate is placed; And And a transfer member for lifting and transporting the substrate placed on the stage inclinedly. The method of claim 1, The transfer member, A plurality of injection holes provided in the stage to inject gas in an inclined direction to the lower surface of the substrate; A gas supply member supplying gas to the injection holes; And And a control unit for controlling the operation of the gas supply member to gradually increase the injection amount of the gas injected from the injection holes along a direction perpendicular to the transfer direction of the substrate. The method of claim 2, The gas supply member, Gas source; Gas lines connecting the gas source and the injection holes; And Valves for controlling the opening and closing degree of the gas lines, The control unit controls the operation of the valves substrate transfer unit, characterized in that for adjusting the injection amount of the gas injected from the injection holes. The method of claim 3, wherein The plurality of injection holes are provided in the stage to form a plurality of rows, The injection holes provided in the same row are connected to the same gas line, The injection holes provided in different rows are connected to the different gas lines, And the valve is provided in each of the gas lines. The method of claim 3, wherein The plurality of injection holes are provided in the stage to form a plurality of grouped rows, The injection holes provided in the same group are connected to the same gas line, The injection holes provided in different groups are connected to different gas lines, And the valve is provided in each of the gas lines. 6. The method according to any one of claims 1 to 5, The transfer member, And a plurality of vacuum suction holes provided in the stage to apply a negative pressure to the lower surface of the substrate. The method of claim 6, And a chuck member mounted to the stage, the chuck member chucking / unchucking a first side of the substrate placed on the stage. The method of claim 7, wherein The chuck member, Grippers disposed in a line along the transfer direction of the substrate and chucking the upper and lower surfaces of the first side of the substrate; And And hinge parts rotatably coupling the grippers to the stage. The method of claim 8, Each of the grippers, An adsorption unit for vacuum adsorption of the lower surface of the first side of the substrate; And And a pressing portion hinged to the suction portion and pressing the upper surface of the first side portion of the substrate. The method of claim 7, wherein And guide rollers mounted to the stage to guide movement of the first side of the substrate. In the method of transferring the substrate, Loading the substrate onto the stage; And And transporting the substrate placed on the stage by inclined levitation in a straight line. 11. The method of claim 10, The substrate is levitation by the gas injected in a direction inclined from the stage to the lower surface of the substrate is linearly transferred, And the injection amount of the gas is gradually increased along the direction perpendicular to the transfer direction of the substrate so that the substrate is inclined. 13. The method of claim 12, And applying a negative pressure to a lower surface of the substrate. The method according to any one of claims 11 to 13, In a state in which the first side of the substrate is fixed, the substrate is inclined to levitation so that the second side of the substrate facing the first side is positioned higher than the first side, and the first side is released. The substrate transfer method, characterized in that for straight transfer of the substrate. The method of claim 14, And the first side portion of the substrate is linearly moved while being guided by a guide roller.

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