JP2008024574A - Method of cutting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting a substrate by which occurrence of flaws or chips on the cutting surface side in the cutting of the glass substrate is suppressed and the strength of the glass substrate is kept high. <P>SOLUTION: The method of cutting the substrate for dividing a glass-made mother substrate 100 into a first and a second substrate 110, 120 includes a step for forming a scribing groove 101 on one surface of the mother substrate 100 using a cutter 200 and a step for dividing the mother substrate 100 into the first and second substrate 110, 120 along the scribing groove 101 by pressing one or another surface of the mother substrate along the scribing groove 101 using a pressing member 300. In the dividing step, one of the first or the second substrate 110, 120 side is fixed and another side is not fixed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate cutting method, for example, a substrate cutting method for dividing a glass mother substrate into first and second substrates.

In the manufacturing process of a liquid crystal display device, there is a step of dividing a substrate in which an electrode is formed on a transparent substrate for each cell. In this substrate cutting process, for example, a scribe and break method is used.
Here, a conventional scribing and breaking method for cutting a substrate will be described with reference to the drawings. FIG. 3 is a diagram showing a conventional method for cutting a substrate.

  As shown in FIG. 3A, first, a scribe groove 101 is formed on the first surface 100 a of the glass mother substrate 100 by the cutter 200. Next, as shown in FIG. 3B, the second surface 100 b of the mother substrate 100 is pressed in the direction of arrow D using a rubber pressing member 300 along the scribe groove 101. As a result, as shown in FIG. 3C, the mother substrate 100 is divided into the first and second substrates 110 and 120 along the scribe groove 101. Then, as shown in FIG. 3D, the pressing member 300 is moved in the direction of arrow E, and the pressing member 300 is separated from the mother substrate 100.

In this way, the mother substrate 100 is divided along the scribe grooves 101 into the first and second substrates 110 and 120.
Patent Document 1 discloses a technique in which a scribing and break cutting method is applied to cutting a light-transmitting substrate of a liquid crystal display panel.
JP 2001-255504 A

  Here, as shown in FIG. 3D, when the pressing member 300 is separated from the mother substrate 100, the cut surface sides of the divided first and second substrates 110 and 120 collide with each other, and the first In addition, there is a problem in that the cut surface of the second substrate 110 and 120 and the corners on the cut surface side of the first and second substrates 110 and 120 may be scratched or chipped to reduce the strength of the glass substrate. It was.

  The present invention has been made to solve such problems, and can suppress the generation of scratches and chips generated on the cut surface side when the glass substrate is cut, and can maintain the strength of the glass substrate at a high level. An object of the present invention is to provide a cutting method.

A substrate cutting method according to the present invention is a substrate cutting method for dividing a glass mother substrate into first and second substrates, and forming a scribe groove on one surface of the mother substrate; A step of pressing one or the other surface of the mother substrate along the scribe groove with a pressing member to divide the mother substrate into the first and second substrates along the scribe groove. Then, one of the first and second substrate sides of the mother substrate is fixed, and the mother substrate is divided without fixing the other.
By adopting such a method, it is possible to suppress the generation of scratches and chips generated on the cut surface side when the glass substrate is cut, and the strength of the glass substrate can be maintained high.

  Here, in the dividing step, the mother substrate is placed on a table having an adsorption mechanism, and either the first or second substrate side of the mother substrate is adsorbed using the adsorption mechanism. Thus, the mother board is divided without fixing the other on the table. Thereby, a mother board | substrate can be divided | segmented systematically in the state which fixed to either the 1st or 2nd board | substrate side of the mother board | substrate stably on the table.

  Further, in the dividing step, the mother substrate is divided without fixing the side having the larger area among the first or second substrate side of the mother substrate and fixing the side having the smaller area. Accordingly, the mother substrate can be accurately divided into the first and second substrates in a state where the wide range of the mother substrate is more stably fixed on the table.

  According to the present invention, it is possible to suppress the generation of scratches and chips on the cut surface side when cutting the glass substrate, and to maintain the strength of the glass substrate high.

BEST MODE FOR CARRYING OUT THE INVENTION
A substrate cutting method according to an embodiment of the present invention will be described with reference to the drawings. 1 and 2 are diagrams showing a substrate cutting method according to an embodiment of the present invention.
FIGS. 1 and 2 specifically show a substrate cutting method for dividing the glass mother substrate 100 into first and second substrates 110 and 120.

  As shown in FIG. 1A, first, a scribe groove 101 is formed by a cutter 200 on a first surface 100 a of a glass mother substrate 100. Here, the mother substrate 100 is a mother substrate for taking a plurality of electrode substrates used for a liquid crystal display panel, for example. Examples of the cutter 200 that forms the scribe groove include a wheel cutter, a diamond cutter, and a laser cutter. As the mother substrate 100, an ITO heater or a touch switch may be formed, or a display panel composed of two substrates may be formed. That is, it may be a bonded substrate as well as a single substrate.

  Next, as shown in FIG. 1B, the mother substrate 100 is placed on a table 400 having a suction mechanism 401, and the second surface 100 b of the mother substrate 100 is moved along the scribe groove 101. The rubber pressing member 300 is used for pressing in the direction of arrow A. As a result, as shown in FIG. 2C, the mother substrate 100 is divided into the first and second substrates 110 and 120 along the scribe groove 101. Although it has been described that the second surface 100 b of the mother substrate 100 is pressed, the first surface 100 a of the mother substrate 100 may be pressed by the pressing member 300.

At this time, either the first or second substrate 110 side of the mother substrate 100 is fixed, and the mother substrate 100 is divided without fixing the other.
Here, the first substrate 110 side of the mother substrate 100 is fixed to the table 400 by adsorbing the first substrate 110 side of the mother substrate 100 by the adsorption mechanism 401 of the table. By doing so, the mother substrate 100 can be accurately divided into the first and second substrates 110 and 120 while the first substrate 110 side of the mother substrate 100 is stably fixed on the table 400.

  Further, among the first or second substrates 110 and 120 side of the mother substrate 100, the first substrate 110 side having a larger area is fixed, and the second substrate 120 side having a smaller area is not fixed, and the mother substrate 100 is fixed. It is preferable to divide 100. By doing so, the mother substrate 100 can be accurately divided into the first and second substrates 110 and 120 in a state where the wide range of the mother substrate 100 is stably fixed on the table 400.

  Then, as illustrated in FIG. 2D, the pressing member 300 is moved in the direction of arrow B, and the pressing member 300 is separated from the mother substrate 100. In this way, the mother substrate 100 is divided along the scribe grooves 101 into the first and second substrates 110 and 120.

  At this time, as shown in FIG. 2D, since the first substrate 110 side of the mother substrate 100 is fixed on the table 400, the pressing member 300 is moved as shown in FIG. When separating from the mother substrate 100, the cut surfaces of the divided first and second substrates 110 and 120 do not collide with each other, and the second substrate 120 moves in the direction of arrow C due to the impact of breakage. In particular, the second substrate 120 can be easily moved by disposing the air blowing mechanism in the table area where the second substrate 120 is placed. That is, it is preferable to reduce the friction between the table 400 and the second substrate 120 to facilitate movement.

  By adopting such a method, it is possible to suppress the occurrence of scratches and chips on the cut surface side when the glass substrate is cut, and to maintain the strength of the glass substrate high. That is, as in the technique shown in FIG. 3, the cut surfaces of the first and second substrates 110 and 120 and the corners on the cut surface side of the first and second substrates 110 and 120 are scratched or chipped. It does not occur and the strength of the glass substrate is not reduced.

Example.
Form a scribe groove on the glass substrate with a wheel cutter, place the glass substrate on the table, and fix the glass substrate on the table by adsorbing the larger area with the scribe groove as a boundary, On the side having a small area, air was blown out from the table, and the glass substrate was pressed by a pressing member to divide the glass substrate. At this time, the cut surfaces of the two substrates after being divided did not collide with each other, and the cut surfaces and the corners on the cut surface side were not damaged or chipped.

The above description is for explaining the embodiment of the present invention, and the present invention is not limited to the above embodiment. Moreover, those skilled in the art can easily change, add, and convert each element of the above embodiment within the scope of the present invention.
In the description of the above embodiment, it is assumed that one glass substrate is cut, but the present invention is also applied to cutting two glass substrates bonded together with an adhesive like a liquid crystal display panel. can do.

It is a figure which shows the cutting method of the board | substrate which concerns on embodiment of this invention. It is a figure which shows the cutting method of the board | substrate which concerns on embodiment of this invention. It is a figure which shows the conventional cutting method of a board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Mother board | substrate 101 Scribe groove | channel 110 1st board | substrate 120 2nd board | substrate 300 Press member 400 Table 401 Adsorption mechanism

Claims (3)

A substrate cutting method for dividing a glass mother substrate into first and second substrates,
Forming a scribe groove on one surface of the mother substrate;
Pressing one or the other surface of the mother substrate along the scribe groove with a pressing member, and dividing the mother substrate into first and second substrates along the scribe groove. ,
In the step of dividing, the mother substrate is divided without fixing one of the first and second substrates of the mother substrate and fixing the other. Cutting method.   In the dividing step, the mother substrate is placed on a table having an adsorption mechanism, and either the first or second substrate side of the mother substrate is adsorbed using the adsorption mechanism. The substrate cutting method according to claim 1, wherein the mother substrate is divided while being fixed on the table without fixing the other.   The dividing step includes: dividing the mother substrate by fixing the larger area of the first or second substrate side of the mother substrate and not fixing the smaller area side. A method for cutting a substrate as described.

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