CN100546004C - The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility - Google Patents
The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility Download PDFInfo
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- CN100546004C CN100546004C CNB2005800459717A CN200580045971A CN100546004C CN 100546004 C CN100546004 C CN 100546004C CN B2005800459717 A CNB2005800459717 A CN B2005800459717A CN 200580045971 A CN200580045971 A CN 200580045971A CN 100546004 C CN100546004 C CN 100546004C
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Abstract
The invention provides a kind of when blocking the workpiece that is carved with division line, can preventing at the back side of workpiece because of the method for cutting of the chipping workpiece of friction.The method for cutting of workpiece of the present invention (5) comprising: the workpiece bonding process pastes the back side of workpiece (5) on the telescopic thin slice (9); The thin slice stretching process, stretching is pasted with the thin slice (9) of workpiece (5); And workpiece blocks operation, under the state of stretching thin slice (9), makes division line (5c) arrive the back side of workpiece (5).Because under the effect of the tensile force of thin slice (9), the intercepted while workpiece of workpiece (5) (5) is drawn back, thereby the friction of intercepted workpiece (5) reduces, and can prevent chipping overleaf.And by applying tensile force to workpiece (5), therefore blocking of tensile force auxiliary work-piece can block workpiece (5) with littler power.
Description
Technical field
The present invention relates to block the method for cutting of workpiece of the workpiece that constitutes by fragile materials such as semiconductor wafer, glass and the chalker of device, line and method for cutting and band break-in facility.
Background technology
As being cut into the method for regulation shape, adopted workpiece sent on the rotating blade and with it to be cut into the cutting method of square shape by the workpiece that fragile materials such as semiconductor wafer, glass constitute.In this cutting method, the part that is admitted to rotating blade in the workpiece is all removed.
In recent years, replace cutting method, adopt a kind of carve line on by the surface of chalker at workpiece after, make crackle block the method for cutting (for example, refer to Patent Document in 1 [0001]～[0004]) of workpiece along groove development by cutting device.
Figure 29 shows the schematic diagram of traditional method for cutting.In this method for cutting, workpiece 2 is placed between two supporting point 1a, the 1b, and between last direction supporting point 1a, 1b, exert pressure with blocking 3.Pressure applies from the opposition side of the side that is carved with division line.By between supporting point 1a, 1b, exerting pressure, produce bending moment on the workpiece 2, by this bending moment, produce tensile stress in the part that is carved with division line.By this tensile stress, the crackle of division line develops (among this Figure 29, development from the top down) from the surface to the back side.In case crackle arrives the back side of workpiece, workpiece is just blocked.
But for traditional method for cutting shown in Figure 29, when blocking, intercepted two workpiece rub each other at the back side of workpiece, thus the back side chipping (lacking tiny phenomenon) of the workpiece of can be in the drawings representing with A portion.In addition, if increase the plus-pressure that blocks head, also can cause the workpiece distortion.
As the technology that addresses the above problem, as shown in figure 30, in patent documentation 2, disclose " a kind of method; this method will engage a pair of glass substrate S1; the glass substrate conjugant W that S2 forms places on the spherical supporting head 71; and make wherein be formed with the groove of the notch along the transversal of each liquid crystal cell glass substrate S1 surface up; on this glass substrate conjugant W, cover soft enough compacting thin slice 73; and discharge air in the space that holds glass substrate conjugant W that surrounds with compacting the thin slice 73 and surperficial 71a of supporting head etc. by blast pipe 71b, thereby on the 71a of the supporting head that glass substrate conjugant W is close to be sphere surface, block glass substrate S1 along the groove of the notch thus " (referring to Patent Document 2 claim 1).
Patent documentation 1: the Japanese documentation spy opens flat 9-202635 communique;
Patent documentation 2: the Japanese documentation spy opens the 2004-354836 communique.
Summary of the invention
But, with regard to the method for cutting of record in the patent documentation 2, owing on glass substrate conjugant W, cover compacting thin slice 73, thereby the groove of the notch d of the elastic force of this compacting thin slice 73 obstruction glass substrate S1 opens.Therefore, still have the truncation surface friction of glass substrate S1 and a chipping possibility.In addition, if dismantle compacting thin slice 73, final intercepted glass substrate conjugant W will be at random, thereby the processing of glass substrate conjugant W also becomes very difficult.
Therefore, the objective of the invention is to, provide a kind of when blocking the workpiece that is carved with division line, can prevent at the truncation surface of workpiece method for cutting and device because of the chipping workpiece of friction.
In order to address the above problem, the method for cutting of the first aspect of the invention workpiece that to be a kind of workpiece (5) that the surface is carved with division line block along division line (5c), it is characterized in that, comprising: the workpiece bonding process pastes the back side of described workpiece (5) on the telescopic thin slice (9); The thin slice stretching process, stretching is pasted with the described thin slice (9) of described workpiece (5); And workpiece blocks operation, under the state of described thin slice (9) that stretches, makes described division line (5c) arrive the back side of described workpiece; Intercepted described workpiece (5) separates by the tensile force of described thin slice (9).
According to the present invention, owing to drawn back at intercepted while workpiece, thereby the friction minimizing each other of intercepted workpiece, can prevent chipping overleaf.In addition, by applying tensile force to workpiece, therefore blocking of tensile force auxiliary work-piece can block workpiece with less power.And, because workpiece is pasted on the thin slice, thereby after blocking workpiece, intercepted workpiece neither can at randomly can not rub yet.Thus, the processing of workpiece becomes easy.
Second aspect present invention is the method for cutting of the described workpiece of above-mentioned first aspect, it is characterized in that, block in the operation at described workpiece, under the state of described thin slice (9) that stretches, make described workpiece (5) bending so that surface one side of described workpiece (5) becomes the mode in the crooked outside, make described division line (5c) arrive the back side of described workpiece (5) thus.
According to the present invention, by also using bending moment and tensile force, even if thicker workpiece also can block under not chipping situation.
Third aspect present invention is above-mentioned first or the method for cutting of the described workpiece of second aspect, it is characterized in that, in described thin slice stretching process, behind the described thin slice (9) that stretches, frame parts (12) sticked on described thin slice (9) is gone up and vacate the gap around described workpiece (5), thus with the tension lock of described thin slice (9) in described frame parts (12).
According to the present invention, after stretched part,, also can continue to provide tensile force to workpiece even if removed tensile force.
The cutting device of the fourth aspect present invention workpiece that to be a kind of workpiece (5) that the surface is carved with division line block along division line (5c), it is characterized in that, comprise: thin slice draw unit (10,11,14a, 14b), the telescopic thin slice (9) that stretches and paste with the back side of described workpiece (5); Block unit (16) with workpiece, under the state of described thin slice (9) that stretches, make described workpiece (5) bending, make described division line (5c) arrive the back side of described workpiece (5) thus so that the surface of described workpiece (5) becomes the mode in the crooked outside; Wherein, intercepted described workpiece (5) separates by the tensile force of described thin slice (9).
According to the present invention, drawn back at intercepted while workpiece, thereby the friction minimizing each other of intercepted workpiece, can prevent chipping overleaf.In addition, by also using bending moment and tensile force, even if thicker workpiece also can block under not chipping situation.And, because workpiece is pasted on the thin slice, thereby after blocking workpiece, intercepted workpiece neither can at randomly can not rub yet.Thus, the processing of workpiece becomes easy.
Fifth aspect present invention is that a kind of one side carves the workpiece of workpiece (5) is blocked in division line (5c) on one side along division line (5c) line and method for cutting on the surface of workpiece (5), it is characterized in that, comprise: the workpiece bonding process pastes workpiece (5) on the telescopic thin slice (9); The thin slice stretching process, stretching is pasted with the described thin slice (9) of described workpiece (5); And workpiece blocks operation, under the state of described thin slice (9) that stretches, engraves division line (5c) to the surface of described workpiece (5), and makes the division line (5c) on the surface of described workpiece (5) arrive the back side of described workpiece (5); Wherein, intercepted described workpiece (5) separates by the tensile force of described thin slice (9).
According to the present invention, owing to drawn back at intercepted while workpiece, thereby the friction minimizing each other of intercepted workpiece, can prevent chipping overleaf.In addition, by applying tensile force to workpiece, therefore blocking of tensile force auxiliary work-piece can be blocked when workpiece is rule.And, because workpiece is pasted on the thin slice, thereby after blocking workpiece, intercepted workpiece neither can at randomly can not rub yet.Thus, the processing of workpiece becomes easy.
Sixth aspect present invention is that a kind of one side carves division line (5c) and on one side blocks the cutting device of the band line function of workpiece (5) along division line on the surface of workpiece (5), it is characterized in that, comprise: thin slice draw unit (22), stretching is pasted with the telescopic thin slice (9) of described workpiece (5); And workpiece blocks unit (20), under the state of described thin slice (9) that stretches, engrave division line (5c) to the surface of described workpiece (5), and make the division line (5c) on the surface of described workpiece (5) arrive the back side of described workpiece (5), block described workpiece (5) thus; Wherein, intercepted described workpiece (5) separates by the tensile force of described thin slice (9).
According to the present invention, owing to drawn back at intercepted while workpiece, thereby the friction minimizing each other of intercepted workpiece, can prevent chipping overleaf.In addition, by applying tensile force to workpiece, therefore blocking of tensile force auxiliary work-piece can be blocked when workpiece is rule.And, because workpiece is pasted on the thin slice, thereby after blocking workpiece, intercepted workpiece neither can at randomly can not rub yet.Thus, the processing of workpiece becomes easy.
The method for cutting of the seventh aspect present invention workpiece (51) that to be a kind of workpiece (51) that the surface is carved with division line (52) block along division line (52), it is characterized in that, comprise: the workpiece bonding process pastes the back side of described workpiece (51) on the thin slice (53); And workpiece blocks operation, described thin slice (53) clung to block on the platform (55,65), and making described workpiece (51) bending so that the surface of described workpiece (51) becomes the mode in the crooked outside, described workpiece (51) is blocked at the back side that makes the described division line (52) on the surface of described workpiece (51) arrive described workpiece (51) thus.
According to the present invention because thin slice is positioned at the back side one side of workpiece, thereby thereby thin slice can not hinder the division line expansion workpiece of surface of the work one side to be rived.Therefore, can prevent because of the truncation surface friction of workpiece chipping.And by workpiece is pasted on the thin slice, the workpiece after blocking can be not at random yet.
Eighth aspect present invention is the method for cutting of the described workpiece in above-mentioned the 7th aspect, it is characterized in that, described workpiece blocks operation and comprises: strip blocks operation, make the described workpiece (51) that is carved with many division lines (52) in length and breadth block platform (55) bending, described workpiece (51) is cut into a plurality of strips along semi-cylindrical; Relative rotation operation after described strip blocks operation, makes from described and blocks described thin slice (53) that platform (55) withdraws from respect to the described platform (55) that blocks, and revolves relatively to turn 90 degrees in the plane that comprises described thin slice (53); And small pieces block operation, and to block platform (55) crooked once more along described to make the described workpiece (51) that is cut into strip, thereby described workpiece (51) is cut into a plurality of small pieces.
According to the present invention, the workpiece that is carved with division line in length and breadth can be divided into small pieces under not chipping situation.In addition, owing to use the semi-cylindrical platform that blocks to block workpiece by two operations, thereby compare with the occasion that platform blocks workpiece by an operation of blocking of using spherical shape, when along block platform when crooked power along division line be difficult to work, the truncation surface of workpiece can not rub yet.
Ninth aspect present invention is the above-mentioned the 7th or the method for cutting of the described workpiece of eight aspect, it is characterized in that, block in the operation at described workpiece, utilize the adsorption hole (56,66) that attracts air, the described thin slice (53) that will be pasted with described workpiece (51) is adsorbed onto described blocking on the platform (55,65), makes described workpiece (51) block platform (55,65) bending along described thus.
According to the present invention,, can make workpiece along blocking the platform bending by attracting air from adsorption hole.
Tenth aspect present invention is the above-mentioned the 7th or the method for cutting of the described workpiece of eight aspect, it is characterized in that, block in the operation at described workpiece, on the direction vertical with the plane that comprises described thin slice (53) with respect to described thin slice (53) and the described platform (55,65) that blocks that relatively moves, thereby the described platform (55,65) that blocks is pressed on the described thin slice (53) of pasting described workpiece (51), makes described workpiece (51) block platform (55,65) bending thus along described.
According to the present invention, be pressed onto by the thin slice that will paste workpiece and block on the platform, can make workpiece along blocking the platform bending.And, owing to before blocking workpiece, apply tensile force to workpiece, thereby the workpiece that blocks when workpiece is blocked will separate each other.Thereby the truncation surface of workpiece can not rub.
The cutting device of the present invention the tenth workpiece that to be a kind of workpiece (51) that the surface is carved with division line (52) on the one hand block along division line (52) is characterized in that, comprising: block platform (55,65), be used to make described workpiece (51) bending; And thin slice is close to unit (56,66,64), make the thin slice (53) at the back side of having pasted described workpiece (51) cling to described blocking on the platform (55,65), thereby make described workpiece (51) bending so that the surface of described workpiece (51) becomes the mode in the crooked outside; Wherein, described workpiece (51) is blocked at the back side that makes the described division line (52) on the surface of described workpiece (51) arrive described workpiece (51).
According to the present invention because thin slice is positioned at the back side one side of workpiece, thereby thereby thin slice can not hinder the division line expansion workpiece of surface of the work one side to be rived.Therefore, can prevent because of the truncation surface friction of workpiece chipping.And by workpiece is pasted on the thin slice, the workpiece after blocking can be not at random yet.
The present invention the 12 aspect is the cutting device of the described workpiece of above-mentioned the tenth one side, it is characterized in that, the described unit (56,66) of being close to has a plurality of adsorption holes (56,66) that attract air, described a plurality of adsorption hole (56,66) has difference of height ground from the described high position of blocking platform (55,65) to low position and arranges, by adsorbing described thin slice (53), make described workpiece (51) cling to described blocking on the platform (55,65) by described adsorption hole (56,66).
According to the present invention, can successively workpiece be clung to low position from the high position of blocking platform and block on the platform.Because workpiece blocks to low position successively from high position, thereby can prevent owing to the truncation surface friction of workpiece chipping.
The present invention the 13 aspect is the cutting device of the described workpiece in above-mentioned the 12 aspect, it is characterized in that, the described unit of being close to also comprises a plurality of electromagnetically operated valves (63), and described a plurality of electromagnetically operated valves (63) make high position to the described adsorption hole (56,66) on the lower position attract air in turn.
According to the present invention, can reliably workpiece be clung to low position from the high position of workpiece and block on the platform.
The present invention the 14 aspect is the above-mentioned the tenth cutting device of described workpiece on the one hand, it is characterized in that the described unit of being close to comprises: thin slice fixed station (64), and block platform (55,65) and dispose across described, be used to keep the end of described thin slice (53); Dipper crowding gear, on the direction vertical with the plane that comprises described thin slice (53) with respect to described thin slice fixed station (64) and the described platform (55,65) that blocks that relatively moves; Wherein, by the described platform (55,65) that blocks is pressed on the described thin slice (53) of pasting described workpiece (51), make described workpiece (51) block platform (55,65) bending along described.
According to the present invention, be pressed onto by the thin slice that will paste workpiece and block on the platform, can make workpiece along blocking the platform bending.And, owing to before blocking workpiece, apply tensile force to workpiece, thereby the workpiece that blocks when workpiece is blocked will separate each other.Thereby the truncation surface of workpiece can not rub.
The present invention the 15 aspect is the cutting device of the described workpiece of either side in above-mentioned the 11 to the 14 aspect, it is characterized in that, described cutting device makes the described workpiece (51) that is carved with a plurality of division lines in length and breadth block platform (55) bending along semi-cylindrical, described workpiece (51) is cut into a plurality of strips, then, make from described and block described thin slice (53) that platform (55) withdraws from respect to the described platform (55) that blocks, in the plane that comprises described thin slice (53), revolve relatively and turn 90 degrees, then, to block platform (55) crooked once more along described to make the described workpiece (51) that is cut into strip, and described workpiece (51) is cut into a plurality of small pieces.
According to the present invention, the workpiece that is carved with division line in length and breadth can be divided into small pieces under not chipping situation.In addition, owing to use the semi-cylindrical platform that blocks to block workpiece by two operations, thereby compare with the occasion that platform blocks workpiece by an operation of blocking of using spherical shape, when along block platform when crooked power along division line be difficult to work, the truncation surface of workpiece can not rub yet.
The invention effect
According to first aspect to the 15 aspects of above invention, when blocking the workpiece that is carved with division line, can prevent at the truncation surface of workpiece chipping because of friction.
Description of drawings
Fig. 1 is the schematic diagram of the method for cutting of the workpiece in the first embodiment of the invention.
Fig. 2 is the figure that the bending stress that is caused by bending moment is shown.
Fig. 3 is the schematic diagram of the method for cutting of the workpiece in the second embodiment of the invention.
Fig. 4 is to use thin slice to apply the ideograph of the method for tensile force to workpiece.
Fig. 5 is the stereogram that the cutting device in the first embodiment of the invention is shown.
Fig. 6 illustrates the stereogram that is used for applying to workpiece the pulling force applying mechanism of tensile force.
Fig. 7 is the schematic diagram ((A) among the figure shows the situation of the cutting device that uses present embodiment, and (B) among the figure shows the situation of using traditional cutting device as a comparative example) of the crackle that produces by cutting device.
Fig. 8 is the stereogram that the chalker of the band break-in facility in the second embodiment of the invention is shown.
Fig. 9 is the figure ((A) among the figure is vertical view, and (B) among the figure is end view) of chalker that the band break-in facility of above-mentioned Fig. 8 is shown.
Figure 10 is the schematic diagram ((A) among the figure shows the situation of the chalker that uses present embodiment, and (B) among the figure shows the situation of using traditional chalker as a comparative example) of the crackle that produces of the chalker by the band break-in facility of above-mentioned Fig. 8.
Figure 11 is the stereogram that the chalker of the band break-in facility in the third embodiment of the invention is shown.
Figure 12 is the schematic diagram ((A) among the figure shows the situation of the chalker of the band break-in facility of using present embodiment, and (B) among the figure shows the situation of using traditional chalker as a comparative example) of the crackle that produces of the chalker by the band break-in facility of above-mentioned Figure 11.
Figure 13 is the schematic diagram of expander tool outward appearance.
Figure 14 is the photo that the thin slice extended state that obtains by the trial-production instrument is shown.
Figure 15 is the photo that the silicon wafer under the extended mode blocks.
Figure 16 is the figure that blocks (D-650) that intersection line part is shown.
Figure 17 is the figure that the face proterties (D-675) of the workpiece after blocking is shown.
Figure 18 is the stereogram that the cutting device in the four embodiment of the invention is shown.
Figure 19 is the sectional view ((A) among the figure shows the state before the curved workpieces, and (B) among the figure shows the state behind the curved workpieces) that the state on the thin slice that workpiece is pasted is shown.
Figure 20 is the vertical view that half round post is blocked platform.
Figure 21 is the upward view that blocks platform shown in Figure 20.
Figure 22 is illustrated in the stereogram that workpiece is sticked on the example of the following telescopic thin slice that stretches of state on the thin slice.
Figure 23 illustrates the vertical view that is formed at other examples that block the adsorption hole on the platform.
Figure 24 illustrates the stereogram that will block the example that platform fences up with chest.
Figure 25 is illustrated in the stereogram that attracts to be provided with on the path example of electromagnetically operated valve.
Figure 26 is the stereogram ((A) among the figure shows and push away the preceding state of thin slice, and (B) among the figure shows the state that pushes away thin slice) that the cutting device in the fifth embodiment of the invention is shown.
Figure 27 is the end view that blocks platform that spherical shape is shown.
Figure 28 is the vertical view that blocks platform that spherical shape is shown.
Figure 29 is the schematic diagram of traditional method for cutting.
Figure 30 is the sectional view ((A) among the figure shows the state before the absorption workpiece, and (B) among the figure shows the state behind the absorption workpiece) that traditional cutting device is shown.
Label declaration
5... workpiece
5c... division line
5d... crackle
9... thin slice
10, the expander tool (thin slice draw unit) that constitutes by fixation side and mobile side of 11...
The pulling force applying mechanism that 14a, 14b... are made of platform (thin slice draw unit)
12... ring (frame parts)
16... block head (workpiece blocks the unit)
20... scribe head (workpiece blocks the unit)
22... anchor clamps (thin slice draw unit)
P... tensile force
M... bending moment
51... workpiece
52... division line
53... thin slice
55,65... blocks platform
56,66... adsorption hole (thin slice is close to the unit)
63... electromagnetically operated valve
64... thin slice fixed station (thin slice is close to the unit)
Embodiment
Fig. 1 shows the schematic diagram of the method for cutting of the workpiece in the first embodiment of the invention.Use chalker on the surface of sheet-like workpieces such as semiconductor wafer or glass, to carve division line in advance.The thin plate disk (wheel) most advanced and sophisticated or that rotate freely that chalker is sharp-pointed with the top is pressed on the surface of workpiece as cutter, and along the surperficial mobile cutter of workpiece, carves division line on the surface of workpiece thus.
After the surface to workpiece engraves division line, workpiece 5 is placed on the cutting device.Cutting device applies bending moment to workpiece 5, becomes the crooked outside so that be carved with a side 5a of division line.Specifically, workpiece 5 is placed between two supporting point 6a, the 6b (workbench), exert pressure from the workpiece 5 between last direction supporting point 6a, the 6b with blocking 7.Pressure applies from the opposition side of the side 5a that is carved with division line.By between supporting point 6a, 6b, exerting pressure, produce bending moment on the workpiece 5, by this bending moment, in the tensile stress of the part generation of being carved with division line as bending stress.By tensile stress, crackle develops (among this Fig. 1, development from bottom to top) from the surface to the back side.
When workpiece 5 applies bending moment, apply tensile force P to workpiece 5 towards the direction vertical with division line.By applying tensile force P to workpiece 5, workpiece 5 was drawn back in the intercepted while, and therefore the friction each other of intercepted workpiece 5 reduces, and it is chipping to be suppressed at the back side (with the opposite side of line side).In addition, by applying tensile force P to workpiece 5, tensile force P is also auxiliary to block workpiece, and therefore, can be enough littler 7 the plus-pressure of blocking blocks workpiece 5.
Just can block under the situation of workpiece 5 only applying tensile force, not apply bending moment sometimes to workpiece 5 to workpiece 5.In addition, when when workpiece 5 applies bending moment, also can substitute and block 7 and use and block roller, can also on workbench, form the projection of linearly extension, and the suction device that attracts workpiece is set in the projection both sides of workbench, then with the part of projection as the summit curved workpieces.
Fig. 2 shows the bending stress that is caused by bending moment.If,, can on workpiece, produce bending stress σ then by bending moment M to workpiece 5 effect bending moment M.The distribution of bending stress σ has produced tensile stress at the downside of neutral axis 5e as shown in the figure, has produced compression stress at upside.The stress in compression sigma that produces at workpiece 5 upsides is to cause workpiece 5 that the reason of friction takes place.Even if the tensile force P that applies to workpiece less than stress in compression sigma, also owing to can draw back workpiece 5 when blocking, therefore, can reduce the friction of workpiece 5.In addition,, then can on workpiece 5, not produce compression stress, therefore can eliminate the reason that causes workpiece 5 frictions if the tensile force P of workpiece 5 is increased to by bending moment M more than the stress in compression sigma that the upside of workpiece 5 produces.
Fig. 3 is the schematic diagram of the method for cutting of the workpiece in the second embodiment of the invention.In this embodiment, Yi Bian engrave division line to the surface of workpiece 5, Yi Bian apply tensile force P towards the direction vertical with division line to workpiece 5, workpiece 5 blocked thus.That is, in this embodiment, carry out simultaneously engraving the crossed process of division line and the operation of blocking of blocking workpiece to workpiece 5.
By on one side engraving division line to workpiece 5, to workpiece 5 apply tensile force P on one side, crackle 5d is to the thickness direction of workpiece (in Fig. 3 from the top down) development.In case crackle 5d arrives back side 5b, workpiece 5 is just blocked.In addition, by applying tensile force to workpiece 5, workpiece was drawn back in the intercepted while, and therefore, the friction of intercepted workpiece 5 reduces, thereby the back side 5b that can be suppressed at workpiece 5 is chipping.
When the thickness of workpiece 5 is thicker, only apply tensile force sometimes to workpiece 5, crackle is can not develop on the 5b of the back side.At this moment, when applying tensile force, also apply bending moment, become the crooked outside so that be carved with a side 5a of division line to workpiece 5.
Fig. 4 shows the schematic diagram that uses thin slice 9 to apply the method for tensile force to workpiece 5.At first, shown in Fig. 4 (A), workpiece 5 is pasted on the telescopic thin slice 9.Given viscosity to thin slice 9 in advance.The two ends of thin slice 9 are clipped on the expander tool as the thin slice draw unit, and this expander tool for example constitutes by fixation side 10 with respect to fixation side 10 mobilizable movable sides 11.Under the state that workpiece 5 is sticked on the thin slice 9, the movable side 11 of mobile expander tool applies tensile force (pulling force) to thin slice 9 thus to the direction stretching thin slice 9 of regulation.An example to directions X stretched part 5 has been shown in this example, but has not been confined to directions X, also can stretch to directions X and this both direction of Y direction vertical with directions X.
Then, shown in Fig. 4 (B), at the ring of around workpiece 5, pasting under the state that keeps pulling force as frame parts 12, and the thin slice in cutting ring 12 outsides.The state of the thin slice in cutting ring 12 outsides has been shown in Fig. 4 (C).Leaving the gap around the workpiece 5 and between encircling 12, pulling force is locked in workpiece 5 and encircles on the thin slice 9 between 12.On the other hand, owing to workpiece 5 was attached to before applying pulling force on the thin slice 9, thereby pulling force can not be applied to the part of having pasted workpiece 5 in the thin slice 9.
Then, the workpiece 5 that has applied pulling force is transported to the chalker of cutting device or band break-in facility, and as Fig. 4 (D) shown in, with cutting device or be with the chalker of break-in facility to block workpiece 5.Owing to applied pulling force to workpiece 5, thereby workpiece 5 is drawn back each other when blocking, thereby between workpiece 5, is produced the gap.At last, wait the viscosity that removes thin slice 9, peel off workpiece 5 from thin slice 9 by the UV irradiation.
As mentioned above, utilize thin slice 9 can be advantageously applied in the little semiconductor wafer of the size of workpiece 5 to the method that workpiece 5 applies pulling force.
To realizing that above-mentioned method for cutting and the cutting device that blocks the workpiece 5 of principle describes.Fig. 5 shows the cutting device in the first embodiment of the invention.On the workbench 23 of cutting device so that to be carved with the surface of the workpiece 5 of division line 5c be that the mode of downside has been placed workpiece 5.Directly over division line 5c, disposed as what workpiece blocked the unit and bar-shapedly blocked 16 to what the direction of division line 5c was extended.Cutting device is pushed above workpiece 5 and is blocked 16, thereby so that is carved with the mode curved workpieces 5 that a side of division line becomes the outside.
(workpiece bonding process/thin slice stretching process)
The back side of the surface being carved with the workpiece 5 of division line 5c pastes on the telescopic thin slice 9.Then, stretching is pasted with the thin slice 9 of workpiece 5, applying tensile force P to workpiece 5.Fig. 6 shows as the pulling force applying mechanism that is used for applying to workpiece 5 the thin slice draw unit of tensile force.Workpiece 5 is pasted on the thin slice 9, and wait by vacuum plant thin slice 9 is fixed on a pair of platform 14a, the 14b.Afterwards, make both sides' platform 14a, 14b move the thin slice 9 that stretches in the opposite direction.Both sides' platform 14a, 14b were moved round about, also can fix a side platform 14a and only move residue one side's platform 14b.In addition, also can as shown in Figure 9 workpiece 5 be pasted on the thin slice 9, then by the anchor clamps 22 of the clamping thin slice 9 two ends thin slice 9 that stretches.In addition, only the directions X to workpiece has applied tensile force, but two groups of pulling force applying mechanisms also can be set and apply tensile force to orthogonal directions X and Y direction.Certainly, also can use ring shown in Figure 4 12.
(workpiece blocks operation)
As shown in Figure 5, under the state of stretching thin slice 9, block 16 so that surface one side of workpiece 5 becomes the mode curved workpieces 5 in the crooked outside by what block the unit as workpiece.Then, by curved workpieces 5, make the back side of the division line 5c arrival workpiece 5 on workpiece 5 surfaces.Fig. 7 (A) shows the crackle 5d that produces on the workpiece 5.Owing to can make crackle 5d development, thereby apply little plus-pressure and just can block workpiece 5 from blocking 16 by apply tensile force P to workpiece 5.In addition, after blocking, workpiece 5 is separated from one another, and it is chipping therefore can to suppress the edge of work, and can block under the situation that truncation surface is not applied unnecessary load (injury).Fig. 7 (B) shows not to workpiece 5 and applies comparative example under the situation of tensile force.Do not applying under the situation of tensile force to workpiece 5, owing to do not discharge the place in the horizontal direction, thereby when pushing to workpiece 5 when blocking 16, A portion that can be overleaf is chipping, and the truncation surface of workpiece 5 is also because friction and damaged.When workpiece is thin, do not apply bending moment M, only just can block by tensile force P.What at this moment, do not need to apply bending moment M blocks 16.
Fig. 8 and Fig. 9 show the chalker of the band break-in facility in the second embodiment of the invention.Fig. 8 shows the stereogram of the chalker of band break-in facility, and Fig. 9 (A) shows the vertical view of the chalker of band break-in facility, and Fig. 9 (B) shows the end view of the chalker of band break-in facility.The chalker of described band break-in facility carries out crossed process and block operation simultaneously, and comprises: the platform 18 of holding workpieces 5, have and be used for and the blocking 20 (workpiece blocks the unit) and make and block a travel mechanism that 20 straight lines move 21 of the cutter 19 of workpiece 5 butts.For example be provided with vibrators such as magnetostrictive vibrator or piezoelectric element blocking in 20.Make the magnetostrictive vibrator vibration by electric current, and make cutter 19 vibrations by this vibrator from reflector.When cutter 19 vibrations, owing to apply impulsive force to workpiece 5 from cutter 19, thereby crackle will be to the thickness direction development of workpiece 5.Making and blocking 20 travel mechanism that move 21 is known travel mechanisms such as ball screw mechanism.In case cutter 9 mobile and the workpiece butt will carve division line 5c on the surface of workpiece 5.
(workpiece bonding process/thin slice stretching process)
The back side of the surface being carved with the workpiece 5 of division line 5c pastes on the telescopic thin slice 9.Then, stretching is pasted with the thin slice 9 of workpiece 5, applying tensile force P to workpiece 5.That is, as shown in Figure 9, workpiece 5 is pasted on the thin slice 9, then by the anchor clamps 22 of the clamping thin slice 9 two ends thin slice 9 that stretches.Certainly, also can substitute anchor clamps 22 and use pulling force applying mechanism stretching thin slice 9 shown in Figure 6.
(workpiece blocks operation)
As shown in Figure 8, under the state of stretching thin slice 9,20 carve division line 5c by block blocking of unit as workpiece, and make workpiece 5 lip-deep division line 5c arrive the back side of workpiece 5 on the surface of workpiece 5.Figure 10 (A) shows the crackle 5d that is produced.By applying tensile force P to workpiece 5, can make by blocking the vertical crack 5d that a cutter 19 of 20 produces to further develop, finally also can cut off fully.By applying tensile force P,, also can form very big vertical crack 5d even if the load that cutter 19 applies is little to workpiece 5.In addition, because the release place that can create vertical crack 5d, thereby can not apply unnecessary load (damage) to truncation surface yet.Figure 10 (B) shows not to workpiece 5 and applies comparative example under the situation of tensile force P.Do not applying under the situation of tensile force to workpiece 5, because vertical crack 5d is difficult to development, and does not have the release place of vertical crack 5d, thereby the truncation surface of workpiece 5 can be subjected to unnecessary load (damage).If the load that increases cutter 19 in order to form long vertical crack 5d then also has big load to be applied on the truncation surface, thereby can reduce the quality and the breakdown strength of blocking goods.
Figure 11 shows the chalker of the band break-in facility in the third embodiment of the invention.The characteristics of present embodiment are also to apply bending moment M to workpiece except the chalker of the band break-in facility of above-mentioned second execution mode.Apply bending moment M so that be carved with the side of division line 5c and become the mode of curved outside.If the thickness of workpiece 5 is thicker, then only be difficult to block workpiece by applying tensile force P.Therefore, easily block workpiece by also applying bending moment M to workpiece 5.The mode that applies bending moment to workpiece can adopt: the mode that applies bending moment by 3 bendings; With the division line is the boundary, with the mode of a workbench in a pair of workbench of maintenance workpiece with respect to another workbench inclination predetermined angular; Perhaps be the boundary, with the mode of a clamping device in a pair of clamping device of maintenance workpiece with respect to another clamping device inclination predetermined angular with the division line.Therefore identical in the chalker of scribe head 20, travel mechanism 21 and above-mentioned second execution mode be marked with identical label and omit its explanation.
The crackle that Figure 12 (A) produces when showing the chalker of the band break-in facility of using the 3rd execution mode.By apply tensile force P and bending moment M to workpiece 5, the vertical crack 5d that produces by chalker is further developed, finally can cut off fully.Figure 12 (B) shows less than the comparative example under the situation that applies tensile force P and bending moment M to workpiece 5.Do not applying under the situation of tensile force and bending moment to workpiece 5, because vertical crack 5d is difficult to development, and does not have the release place of vertical crack 5d, thereby the truncation surface of workpiece 5 can be subjected to unnecessary load (damage).If the load that increases cutter 19 in order to form long vertical crack then has big load to be applied on the truncation surface, thereby can reduce the quality and the breakdown strength of blocking goods.
Embodiment
(1) device summary
In order to investigate the expansion effect, only manufactured experimently the test instrument (Figure 13) of extension mechanism.Its apparent size is 410mm * 450mm.In this test instrument, can be only apply pulling force to workpiece towards directions X and towards the compound direction of X-Y direction.The clamping of thin slice fixedly realizes by the assemblage zone frid and with bolt.Can clamp the gamut of thin slice by this slotted plate.Use the bolt of " extension section " among the figure to regulate pulling force while watching scale.
(2) be suitable for the summary of the thin slice expanded
Employed dicing tape is D-650 and the expansion adhesive tape D-675 (Lin Deke (lintec) is corporate system (Adwill), and width is 300mm, and thickness is 80 μ m) that uses when cutting silicon usually.These adhesive tapes are cut into suitable length to be used.
Expansion effect when (3) blocking wafer
Silicon wafer pasted that dicing tape (D-675) is gone up and respectively to X, the Y direction 15mm that stretched.When only to thin slice draw direction (directions X) stretched part, fold (Figure 14 (a)) has appearred, but simultaneously also when vertical direction is expanded same distance, fold disappeared (Figure 14 (b)) on thin slice draw direction (directions X) and vertical direction (Y direction).
When blocking (riving with hand) workpiece, gap (Figure 15) has appearred in the position of blocking.The gap is about 340 μ m.The gap that occurs when blocking shows the tendency that enlarges gradually along with the process of time, through after a few hours, when blocking other position again, can confirm that the gap has narrowed down than previous A/F.
(4) situation of the workpiece of intersection line
Investigated the effect of expansion with the workpiece of intersection line.Extended range is 15mm.(Figure 16) broken away from division line when blocking (riving with hand) along directions X, and the gap occurred at disconnect position.In addition, in the crisscross gap that equally also occurred, and its width is wideer than the width of first disconnect position.Can think that the order of expansion is influential.When unloading ring from thin slice and placing a few hours, gap constrictions, but not complete obiteration.
(5) situation of dicing tape D-675
The material of dicing tape is changed into the D-675 of expansion usefulness and carried out the expansion truncation test.The extended range of X, Y direction is 20mm.The result who blocks, the pulling force on the both direction all discharges at disconnect position, thereby the gap occurred.The width in the gap that is caused by draw direction is the same with previous D-650 adhesive tape, broadens on directions X, narrows down slightly on the Y direction.The vertical crack that is caused by line is more shallow, and the influence of manually blocking is big, and the situation that therefore breaks away from the groove position reduces.When the groove position is successfully blocked, block with can being straight line, do not find big crackedly at edge part, and the surface of the work after blocking is not found adhere to (Figure 17) of particulate.Owing to rive, so though the divisional plane proterties is not talkative good, perpendicularity roughly be we can say well with hand.
(6) sum up
The result that will obtain in this test is summarized as follows.
Confirmed that the dicing tape of use also can fully be expanded in the past.
When blocking workpiece, produced the gap at disconnect position.
When intersecting expansion, by stretching order (X, Y), variation has taken place in the size of pulling force, but the effect of expansion occurred in all directions.
Because just blocking back and transporting not phase mutual friction between the workpiece in the process, thereby can be not chipping, adhering to of particulate on silicon face, do not found.
Owing to can expect in scribe test, also can obtaining to expand effect fully, thereby think and to realize high-quality blocking.
Below, the cutting device of four embodiment of the invention is described.Figure 18 to Figure 21 shows the cutting device in the four embodiment of the invention.As shown in figure 18, on lamellar semiconductor wafer, carved the division line 52 of lattice-shaped in advance in length and breadth as workpiece 51 by scriber.For example, be pressed on the surface of workpiece by pyramidal structure that the top is sharp-pointed (tip) or the thin plate disk (wheel) that rotates freely, and move these instruments, carve division line 52 on the surface of workpiece 51 along the surface of workpiece 51.When along workpiece 51 Move tools, also can make Workpiece vibration.
(workpiece bonding process)
After the surface to workpiece 51 engraves division line 52, shown in Figure 19 (A), the side that is carved with division line 52 of workpiece 51 as a surperficial side, is pasted the back side of workpiece 51 on the thin slice 53.Thin slice 53 uses the resin flake with viscosity.For example use and paste the transporting of strip semiconductor wafer when transporting with the identical thin slice of thin slice.The cutting device of the 4th execution mode is different with the cutting device of first execution mode, and both oriented workpiece 53 applies the situation of tensile force, and situation about not applying is also arranged.
As shown in figure 18, the workpiece 51 that pastes on the thin slice 53 is placed in middle high blocking on the platform 55 with thin slice 53 as the back side one side.Block platform 55 and be half-cylindrical, have a plurality of adsorption holes 56 of being close to the unit as thin slice in its surface.Adsorption hole 56 links to each other with attraction path 57, attracts path 57 final by an attraction mouth 58.In this Figure 18, omitted the adsorption hole 56 that blocks platform 55 middle bodies, but in fact be provided with a plurality of described adsorption holes 56 along the circumferencial direction that blocks platform 55.The vacuum pump that does not illustrate among the figure is connected and attracts on the mouth 58, from attracting mouthful 58 attraction air.
Figure 20 shows the vertical view that half round post is blocked platform 55, and Figure 21 shows its back view.A plurality of adsorption holes 56 are arranged on the highest (more than the line h1) that blocks platform 55, and in addition, not only in the highest portion of blocking platform 55, also (line h2) is provided with difference of height and arranges multiple row towards low position from the highest portion.In Figure 20, one of transverse direction is classified the adsorption hole 56 of equal height as.W1 among the figure, W2 show the flat shape of the round piece that varies in size.Adsorption hole 56 avoid workpiece 51 around or workpiece 51 following and arranging so that only attract thin slice 53.In addition, the row of the adsorption hole on the lower position 56 have been arranged more adsorption hole 56 than the row on the high position.These adsorption holes 56 link to each other with attraction groove 59 on being formed at the back side of blocking platform 55.As shown in figure 21, attract groove 59 to extend, and finally be connected with attracting mouth 58 to longitudinal direction and transverse direction.Block platform 55 and be placed on the base frame with flat surfaces that does not illustrate among the figure, the surface of base frame and the space of blocking between the attraction groove 59 of platform have constituted the passage that attracts air.
(workpiece blocks operation)
The thin slice 53 that will be pasted with workpiece 51 place block on the platform 55 after, if from attracting mouthfuls 58 to attract air, then attract air with attracting mouthful 58 adsorption holes that link to each other 56, thereby thin slice 53 quilts are clung to and are blocked on the platform 55.Thin slice 53 and the distance of blocking between the platform 55 are narrow more, the easy more decline of pressure, therefore, thin slice 53 very naturally according to from the high position of blocking platform 55 to the order of low position, promptly cling to the both end sides order and block on the platform 55 from the central portion of workpiece 51.When thin slice 53 clings to when blocking on the platform 55, stick on workpiece 51 on the thin slice 53 also shown in Figure 19 (B), along blocking platform 55 and becoming the mode bending in the crooked outside with division line 52.So, on workpiece 51, produce bending moment, in the side generation tensile stress that is carved with division line 52 of workpiece 51.By this tensile stress, crackle 54 develops to the back side from the surface of workpiece 51, thereby workpiece 51 is blocked.Here, along the stage of blocking platform 55 bendings, workpiece 51 is blocked at workpiece 51.Thus, workpiece 51 is blocked (with Figure 18, block from the highest portion of blocking platform 55 of semicolumn and appear and develop along division line 52 to the left and right) gradually from central portion towards both end sides.
Is in order to make crackle 54 easily to the causes of workpiece 51 development as shown in Figure 19 with thin slice 53 as the back side one side of workpiece 51.If thin slice 53 is pasted surface one side of workpiece 51, then thin slice 53 can hinder the opening of groove of division line 52 by its elastic force, therefore is difficult to disconnect.In addition, owing to will block platform 55 and make half round post, and the division line 52 of disposing workpiece 51 abreast with the center line 55a that blocks platform, stress works on the normal direction of the workpiece 51 of bending.Therefore, can prevent because the section friction of workpiece 51 and chipping.
Above blocking in the operation, 51 of workpiece along the longitudinal with horizontal division line 52 in vertically, promptly only blocked along the division line 52 parallel with the center line 55a that blocks platform 55.In the stage of blocking end on a direction in the direction in length and breadth, workpiece 51 is cut into strip (strip blocks operation) on thin slice 53.Then, remove the absorption of adsorption hole 56, thin slice 53 is withdrawn from from blocking platform 55.Then, the either party who makes thin slice 53 or block platform 55 on the plane that comprises thin slice 53, for example turn 90 degrees (rotating operation relatively) in the horizontal plane inward turning.So one side's of the residue in the direction division line 52 is parallel with the center line 55a that blocks platform 55 in length and breadth.Then, attract air from adsorption hole 56 once more, make the workpiece 51 that is cut into strip crooked once more, thereby workpiece 51 is cut into a plurality of small pieces (small pieces block operation) along blocking platform 55.Be divided into by workpiece being blocked operation that strip blocks operation and small pieces block operation, the workpiece 51 that can will be carved with division line under the cracked situation that does not take place in length and breadth is cut into small pieces.
Figure 22 shows the example of the telescopic thin slice 53 that stretches under the state that workpiece 51 is sticked on the thin slice 53.When blocking workpiece 51, if apply tensile force, then drawn back each other at workpiece 51 intercepted while workpiece 51 to workpiece 51, the gap appears between workpiece 51, therefore can further prevent to contact between the truncation surface of workpiece 51.Thereby, as shown in figure 22, before blocking workpiece 51, also can under the state that workpiece 51 is sticked on the thin slice 53, apply tensile force to telescopic thin slice 53.Specifically, will stretch to directions X and Y direction around the thin slice 53, thereby thin slice 53 is applied tensile force (pulling force t) to directions X and Y direction.Under the situation that keeps this pulling force t, around workpiece 51, paste frame parts 60.Vacating at interval around the workpiece 51 and between the frame parts 60, thereby pulling force is locked in the thin slice 53 on every side that is exposed to workpiece 51.When workpiece 51 applies tensile force, adsorption hole 56 preferably avoid workpiece 51 below be configured on the position that only attracts thin slice 53.This be because, if below workpiece 51 configuration adsorption hole 56, then be to want the workpiece that blocks to be drawn back each other originally, but because the absorption of adsorption hole 56, workpiece 51 but becomes each other and is difficult to separate by the tensile force of thin slice 53.
There was not the cutting device that the semiconductor wafer that is carved with division line 52 in length and breadth can be cut into small pieces in the past.This is because in the stage that workpiece 51 is processed into strip, remaining division line 52 is not point-blank arranged.In utilizing the blocking of blade, aligning is integral, and the position relation between division line 52 and blade and the bed knife requires certain precision, therefore, when workpiece 51 being revolved when turning 90 degrees, can not be by the division line roll setting, thus can not cut into pieces.But, in the present embodiment, no matter block in the operation, still turning 90 degrees the small pieces that are cut into small pieces and block in the operation revolving at the strip that workpiece 51 easily is cut into strip, division line 52 does not need to be positioned on the straight line.Therefore, can be cut into small pieces.
Figure 23 shows other examples that are formed at the adsorption hole 56 that blocks on the platform 55.In this example, on the surface of blocking platform 55, formed the groove 61 that extends to the direction parallel with the center line 55a that blocks platform 55.Adsorption hole 56 links to each other with groove 61, and the adsorption hole 56 of row constitutes one group by groove 61.If divide into groups, then can on the centerline direction that blocks platform 55, adsorb workpiece 51 equably with 61 pairs of adsorption holes 56 of groove.In addition, as shown in figure 24, in order further to strengthen thin slice 53 to the absorption of blocking platform 55, surrounding what block platform 55 with chest 62 also is effective on every side.
Figure 25 shows for the adsorption hole 56 that makes high position to lower position place attracts air successively at the example that attracts to be provided with on the path 57 electromagnetically operated valve 63.A plurality of adsorption holes 56 have been arranged from the extreme higher position lower position to the left and right of central authorities.In addition, be provided with a plurality of attractions path 57 according to the height of adsorption hole 56, and at an adsorption hole 56 that attracts to have connected on the path 57 equal height.Attract to be provided with electromagnetically operated valve 63 on the path 57 at each.According to opening electromagnetically operated valve 63 to the order in the attraction path 57 that is connected with the adsorption hole 56 at lower position place from the attraction path 57 that is connected with the adsorption hole 56 of high position.For example, in this Figure 25, by 1,2,3 ..., 7 etc. order opens electromagnetically operated valve 63.If electromagnetically operated valve 63 is set, block on the platform 55 even then can workpiece 51 be clung to from the visual laterally also very clearly definite order of the central portion of workpiece 51.
Figure 26 shows the cutting device in the fifth embodiment of the invention.In this embodiment, constituted with thin slice fixed station 14 and thin slice dipper crowding gear and thin slice 53 is clung to the thin slice that blocks on the platform 55 be close to the unit.That is, shown in Figure 26 (A), dispose a pair of thin slice fixed station 14 across blocking platform 55, and clamp the both ends of thin slice 53 with thin slice fixed station 14.Then, shown in Figure 26 (B), will block platform 55 from promoting towards thin slice 53 down, block on the platform 55 thereby thin slice 53 is close to by dipper crowding gear.Dipper crowding gear can use known single shaft such as ball screw travel mechanism.Because blocking platform 55 is to relatively move for the mobile of thin slice 53, block platform 55 so replace promoting, also can press down thin slice fixed station 14.
According to the cutting device of this 5th execution mode,, also thin slice 53 can be clung to and block on the platform 55 even adsorption hole 56 is not set blocking platform 55.And, when with blocking when pushing away thin slice 53 on the platform 55, have tensile force naturally and act on thin slice 53, therefore can prevent the truncation surface friction each other of intercepted workpiece 51.
Figure 27 and Figure 28 show other examples that block platform 65.Figure 27 shows the end view that blocks platform 65, and Figure 28 shows the end view that blocks platform 65.When workpiece 51 is divided into small pieces once, can as this example, will block the part that platform 65 forms sphere.At this moment, in the vertical view that blocks platform shown in Figure 28, the highest the C that adsorption hole 66 is arranged in to block platform 65 is on the concentric circles at center.And adsorption hole 66 links to each other with attracting path 67, attracts path 67 to attract mouth 68 by one.If attract air from adsorption hole 66, then can in turn workpiece 51 be clung to outer circumferential side and block on the platform 65 from the central portion of workpiece 51.
The invention is not restricted to above-mentioned execution mode, can in the scope that does not change aim of the present invention, carry out various changes.For example, workpiece can also the alternative semiconductors wafer and is used thin glass substrate.In addition, in the workpiece bonding process, both can after engraving division line, workpiece be pasted on the thin slice, also can after pasting workpiece on the thin slice, engrave division line to workpiece to workpiece.In addition, the semi-cylindrical platform that blocks also can be a semi-cylindrical shaped.
Application documents of the present invention are based on the Japanese Patent Application 2005-373460 of the Japanese Patent Application 2005-000554 of application on January 5th, 2005, the Japanese Patent Application 2005-146551 of application on May 19th, 2005, application on December 26th, 2005.This content all is included in here.
Claims (12)
1. the method for cutting of a workpiece, the workpiece that the surface is carved with division line blocks along division line, it is characterized in that, comprising:
The workpiece bonding process pastes the back side of described workpiece on the telescopic thin slice;
The thin slice stretching process, stretching by the thin slice draw unit is pasted with the described thin slice of described workpiece;
Frame parts is pasted operation, under the state of the described thin slice that stretched by described thin slice draw unit, stick on frame parts on the described thin slice and around described workpiece, vacate the gap, thereby with the tension lock of described thin slice in described frame parts; And
Workpiece blocks operation, under the state of tension lock in described frame parts with described thin slice, makes described division line arrive the back side of described workpiece;
Wherein, intercepted described workpiece separates by the tensile force of described thin slice.
2, the method for cutting of workpiece as claimed in claim 1, it is characterized in that, block in the operation at described workpiece, under the state of described thin slice that stretches, make described workpiece bending so that surface one side of described workpiece becomes the mode in the crooked outside, make described division line arrive the back side of described workpiece thus.
3, a kind of cutting device of workpiece, the workpiece that the surface is carved with division line blocks along division line, it is characterized in that, comprising:
Frame parts under the state of the telescopic thin slice pasted with the back side of described workpiece that stretches by the thin slice draw unit, sticks on the described thin slice and vacate the gap around described workpiece; With
Workpiece blocks the unit, under the state of tension lock in described frame parts with described thin slice, makes described division line arrive the back side of described workpiece;
Wherein, intercepted described workpiece separates by the tensile force of described thin slice.
4, a kind of line of workpiece and method for cutting, on the surface of workpiece carve division line and on one side along division line block workpiece on one side, it is characterized in that, comprising:
The workpiece bonding process pastes workpiece on the telescopic thin slice;
The thin slice stretching process, stretching is pasted with the described thin slice of described workpiece; And
Workpiece blocks operation, under the state of described thin slice that stretches, engraves division line to the surface of described workpiece, makes the described division line on the surface of described workpiece arrive the back side of described workpiece simultaneously;
Wherein, intercepted described workpiece separates by the tensile force of described thin slice.
5, a kind of chalker with break-in facility, on the surface of workpiece carve division line and on one side along division line block workpiece on one side, it is characterized in that, comprising:
The thin slice draw unit, stretching is pasted with the telescopic thin slice of described workpiece; And
Workpiece blocks the unit, under the state of described thin slice that stretches, engraves division line to the surface of described workpiece, makes the described division line on the surface of described workpiece arrive the back side of described workpiece simultaneously, blocks described workpiece thus;
Wherein, intercepted described workpiece separates by the tensile force of described thin slice.
6, a kind of method for cutting of workpiece, the workpiece that the surface is carved with division line blocks along division line, it is characterized in that, comprising:
The workpiece bonding process pastes the back side of described workpiece on the thin slice; And
Workpiece blocks operation, described thin slice is clung to block on the platform, and make described workpiece bending so that the surface of described workpiece becomes the mode in the crooked outside, makes the described division line on the surface of described workpiece arrive the back side of described workpiece and block described workpiece thus,
Described workpiece blocks operation and comprises:
Strip blocks operation, makes the described workpiece that is carved with many division lines in length and breadth block the platform bending along described, and described workpiece is cut into a plurality of strips;
Relative rotation operation after described strip blocks operation, makes from described and blocks described thin slice that platform withdraws from respect to the described platform that blocks, and revolves relatively to turn 90 degrees in comprising the plane of described thin slice; And
Small pieces block operation, and to block platform crooked once more along described to make the described workpiece that is cut into strip, and described workpiece is cut into a plurality of small pieces.
7, the method for cutting of workpiece as claimed in claim 6, it is characterized in that, block in the operation, utilize the adsorption hole that attracts air at described workpiece, the described chip sorption that is pasted with described workpiece is blocked on the platform to described, make described workpiece block the platform bending thus along described.
8, the method for cutting of workpiece as claimed in claim 6, it is characterized in that, block in the operation at described workpiece, on the direction vertical with the plane that comprises described thin slice, with respect to the described thin slice described platform that blocks that relatively moves, thereby the described platform that blocks is pressed on the described thin slice of pasting described workpiece, makes described workpiece block the platform bending thus along described.
9, a kind of cutting device of workpiece, the workpiece that the surface is carved with division line blocks along division line, it is characterized in that, comprising:
Block platform, be used to make described workpiece bending; And
Thin slice is close to the unit, makes the thin slice at the back side of having pasted described workpiece cling to described blocking on the platform, makes described workpiece bending so that the surface of described workpiece becomes the mode in the crooked outside;
Make the described division line on the surface of described workpiece arrive the back side of described workpiece and block described workpiece, and
Make the described workpiece that is carved with many division lines in length and breadth block the platform bending along described, described workpiece is cut into a plurality of strips, then, make from described and block described thin slice that platform withdraws from respect to the described platform that blocks, in comprising the plane of described thin slice, revolve relatively and turn 90 degrees, then, to block platform crooked once more along described to make the described workpiece that is cut into strip, and described workpiece is cut into a plurality of small pieces.
10, the cutting device of workpiece as claimed in claim 9 is characterized in that,
The described unit of being close to has a plurality of adsorption holes that attract air, and described a plurality of adsorption holes have difference of height ground from the described high position of blocking platform to low position to be arranged,
By adsorbing described thin slice, make described workpiece cling to described blocking on the platform by described adsorption hole.
11, the cutting device of workpiece as claimed in claim 10 is characterized in that, the described unit of being close to also comprises a plurality of electromagnetically operated valves, and described a plurality of electromagnetically operated valves make high position to the described adsorption hole on the lower position attract air in turn.
12, the cutting device of workpiece as claimed in claim 9 is characterized in that,
The described unit of being close to comprises:
The thin slice fixed station blocks platform and disposes across described, is used to keep the end of described thin slice; With
Dipper crowding gear, on the direction vertical with the plane that comprises described thin slice with respect to the described thin slice fixed station described platform that blocks that relatively moves;
Be pressed to described blocking on the platform by the described thin slice that will paste described workpiece, make described workpiece block the platform bending along described.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP000554/2005 | 2005-01-05 | ||
| JP2005000554 | 2005-01-05 | ||
| JP146551/2005 | 2005-05-19 | ||
| JP373460/2005 | 2005-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101099228A CN101099228A (en) | 2008-01-02 |
| CN100546004C true CN100546004C (en) | 2009-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800459717A Active CN100546004C (en) | 2005-01-05 | 2005-12-27 | The chalker of the method for cutting of workpiece and device, line and method for cutting and band break-in facility |
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| CN (1) | CN100546004C (en) |
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