TWI734272B - Method of controlling scribing apparatus - Google Patents

Method of controlling scribing apparatus Download PDF

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Publication number
TWI734272B
TWI734272B TW108143101A TW108143101A TWI734272B TW I734272 B TWI734272 B TW I734272B TW 108143101 A TW108143101 A TW 108143101A TW 108143101 A TW108143101 A TW 108143101A TW I734272 B TWI734272 B TW I734272B
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Taiwan
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cutter wheel
substrate
support roller
initial position
setting
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TW108143101A
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Chinese (zh)
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TW202106641A (en
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張喜童
金光洙
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韓商塔工程有限公司
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position

Abstract

A method of controlling a scribing apparatus may include disposing a substrate having a first surface and a second surface on a stage with an end portion of the substrate protruding from the stage; setting a position of a roller contacting the first surface of a supporting portion of the substrate supported on the stage as an initial position of the roller; corresponding to the end portion of the substrate, positioning the roller at the initial position; and corresponding to the end portion of the substrate, setting a position of a cutting wheel contacting the second surface of the substrate and moving until the roller contacting the first surface of the substrate as an initial position of the cutting wheel.

Description

劃線裝置的控制方法 Control method of marking device

本發明涉及在基板形成劃線的劃線裝置的控制方法。 The present invention relates to a control method of a scribing device that forms a scribing line on a substrate.

一般而言，在用於平板顯示器的液晶顯示面板、有機電致發光顯示器面板、無機電致發光顯示器面板、透射投影基板、反射投影基板等的製造中，使用從玻璃之類脆性玻璃面板(以下，稱為“基板”)切割成預定尺寸的單位玻璃面板(以下，稱為“單位基板”)。 Generally speaking, in the manufacture of liquid crystal display panels, organic electroluminescence display panels, inorganic electroluminescence display panels, transmissive projection substrates, reflective projection substrates, etc. for flat panel displays, brittle glass panels such as glass (below , Referred to as "substrate") is cut into a predetermined size unit glass panel (hereinafter referred to as "unit substrate").

將基板切割成單位基板的工藝包括在將由金剛石之類材料構成的刀輪加壓於基板的狀態下使刀輪及/或基板沿切割計畫線移動而在基板上形成劃線的劃線工藝。 The process of cutting the substrate into unit substrates includes a scribing process in which the cutter wheel and/or the substrate are moved along the cutting plan line while the cutter wheel made of a material such as diamond is pressed on the substrate to form a scribing line on the substrate. .

另外，基板切割工藝包括在基板的端部形成劃線之後從基板的端部分離端材的工藝。 In addition, the substrate cutting process includes a process of separating the end material from the end of the substrate after forming a scribe line at the end of the substrate.

在基板的端部形成劃線的工藝包括：以使基板的端部從工作台凸出的方式將基板載置到工作台的步驟；在從工作台凸出的基板的端部的第一面及第二面分別加壓支承輥及刀輪的步驟；使支承輥及刀輪移動或使基板移動而在基板的端部沿切割計畫線形成劃線的步驟。 The process of forming a scribing line on the end of the substrate includes: placing the substrate on the worktable in such a way that the end of the substrate protrudes from the worktable; on the first surface of the end of the substrate protruding from the worktable The step of pressing the support roller and the knife wheel on the second surface respectively; the step of moving the support roller and the knife wheel or moving the substrate to form a scribe line along the cutting plan line at the end of the substrate.

在基板的端部形成劃線的步驟之前，執行設定支承輥對基板的端部的第一面的初始位置(初始高度)的過程，執行設定刀輪對基板的端部的第二面的初始位置(初始高度)的過程。 Before the step of forming the scribing line on the end of the substrate, perform the process of setting the initial position (initial height) of the support roller on the first surface of the end of the substrate, and perform the initial setting of the cutter wheel on the second surface of the end of the substrate. Position (initial height) process.

但是，基板的端部未被工作台支承而從工作台凸出，因此，由於基板的端部因重力變形等各種原因，基板的端部的第一面及第二面的位置發生變動。另外，在支承輥接觸於基板的端部的第一面時，由於因支承輥施加的力，基板的端部彎曲，同時基板的端部的第一面位置發生變動。另外，在刀輪接觸於基板的端部的第二面時，由於因刀輪施加的力，基板的端部彎曲，同時基板的端部的第二面的位置發生變動。 However, the end of the substrate is not supported by the table and protrudes from the table. Therefore, due to various reasons such as deformation of the end of the substrate due to gravity, the positions of the first surface and the second surface of the end of the substrate fluctuate. In addition, when the support roller contacts the first surface of the end of the substrate, the end of the substrate bends due to the force applied by the support roller, and the position of the first surface of the end of the substrate fluctuates. In addition, when the cutter wheel contacts the second surface of the end of the substrate, the end of the substrate bends due to the force applied by the cutter wheel, and the position of the second surface of the end of the substrate fluctuates.

如此，由於基板端部的第一面及第二面的位置變動，支承輥及刀輪接觸於基板端部的位置發生變動，因此存在無法準確設定支承輥的初始位置及刀輪的初始位置的問題。 As such, due to changes in the positions of the first surface and the second surface of the substrate end, the position of the support roller and the cutter wheel in contact with the substrate end changes. Therefore, it is impossible to accurately set the initial position of the support roller and the initial position of the cutter wheel. problem.

本發明的目的在於提供一種能夠準確設定支承輥及刀輪對基板的端部的初始位置的劃線裝置的控制方法。 The object of the present invention is to provide a control method of a scribing device capable of accurately setting the initial position of the support roller and the cutter wheel to the end of the substrate.

用於達到上述目的的本發明的實施例提供一種劃線裝置的控制方法，劃線裝置的控制方法可包括以下步驟：以使具有第一面及第二面的基板的端部從工作台凸出的方式，將基板載置於工作台；將支承輥接觸支承在工作台上的基板的支承部的第一面時的支承輥的位置設定為支承輥的初始位置；在基板的端部，使支承輥位於初始位置；以及在基板的端部，將使刀輪接觸於基板的第二面並移動而基板的第一面接觸於支承輥時的刀輪的位置設定為刀輪的初始位置。 The embodiment of the present invention for achieving the above object provides a control method of a scribing device. The control method of the scribing device may include the following steps: so that the end of the substrate having the first surface and the second surface protrudes from the table In the way out, the substrate is placed on the workbench; the position of the support roller when the support roller contacts the first surface of the support part of the substrate supported on the workbench is set as the initial position of the support roller; at the end of the substrate, Position the support roller at the initial position; and at the end of the substrate, set the position of the cutter wheel when the cutter wheel contacts the second surface of the substrate and moves and the first surface of the substrate contacts the support roller as the initial position of the cutter wheel .

另外，本發明的實施例提供一種劃線裝置的控制方法，劃線裝置可包括：工作台，供安裝具有第一面及第二面的基板的第二面；支承輥，以與基板的第一面相對的方式設置；以及刀輪，以與基板的第二面相對的方式設置，在從工作台凸出的基板的端部形成劃線，劃線裝置的控制方法包括以下步驟：設定支承輥對第一面的初始位置；以及設定刀輪對第二面的初始位置，設定支承輥的初始位置的步驟包括以下步驟：在支承在工作台上的基板的支承部，使支承輥以與第一面相對的方式定位；使支承輥朝向第一面移動；以及將支承輥接觸於第一面時的支承輥的位置設定為支承輥的初始位置。 In addition, an embodiment of the present invention provides a method for controlling a scribing device. The scribing device may include: a worktable for mounting a second surface of a substrate having a first surface and a second surface; and a supporting roller to interact with the second surface of the substrate. And the cutter wheel, which is arranged opposite to the second surface of the substrate, and forms a scribing line on the end of the substrate protruding from the worktable. The control method of the scribing device includes the following steps: setting the support The initial position of the roller pair on the first surface; and setting the initial position of the cutter wheel on the second surface. The step of setting the initial position of the support roller includes the following steps: in the support portion of the substrate supported on the worktable, the support roller is Positioning such that the first surface faces each other; moving the support roller toward the first surface; and setting the position of the support roller when the support roller is in contact with the first surface as the initial position of the support roller.

在此，設定刀輪的初始位置的步驟可包括以下步驟：在基板的端部，使支承輥位於初始位置；使刀輪以與支承輥相對的方式定位；使刀輪朝向第二面移動；以及將刀輪接觸於第二面並移動從而支承輥接觸於第一面時的刀輪的位置設定為刀輪的初始位置。 Here, the step of setting the initial position of the cutter wheel may include the following steps: at the end of the substrate, the support roller is located at the initial position; the cutter wheel is positioned opposite to the support roller; the cutter wheel is moved toward the second surface; And the position of the cutter wheel when the cutter wheel is moved in contact with the second surface and the support roller is in contact with the first surface is set as the initial position of the cutter wheel.

另外，本發明的實施例提供一種劃線裝置的控制方法，劃線裝置可包括：工作台，供安裝具有第一面及第二面的基板的第二面；刀輪，以與基板的第一面相對的方式設置；以及支承輥，以與基板的第二面相對的方式設置，在從工作台凸出的基板的端部形成劃線，劃線裝置的控制方法包括以下步驟：設定刀輪對第一面的初始位置；以及設定支承輥對第二面的初始位置，設定刀輪的初始位置的步驟包括以下步驟：在支承在工作台上的基板的支承部，使刀輪以與第一面相對的方式定位；使刀輪朝向第一面移動；以及將刀輪接觸於第一面時的刀輪的位置設定為刀輪的初始位置。 In addition, an embodiment of the present invention provides a method for controlling a scribing device. The scribing device may include: a workbench for mounting a second surface of a substrate with a first surface and a second surface; a cutter wheel to interact with the second surface of the substrate And the supporting roller is arranged opposite to the second surface of the substrate to form a scribing line on the end of the substrate protruding from the worktable. The control method of the scribing device includes the following steps: setting the knife The initial position of the first surface of the wheel set; and the setting of the initial position of the support roller to the second surface. The step of setting the initial position of the cutter wheel includes the following steps: in the support part of the substrate supported on the worktable, the cutter wheel is Positioning in a way that the first surface is opposite; moving the cutter wheel toward the first surface; and setting the position of the cutter wheel when the cutter wheel contacts the first surface as the initial position of the cutter wheel.

在此，設定支承輥的初始位置的步驟可包括以下步驟：在基板的端部，使刀輪位於初始位置；使支承輥以與刀輪相對的方式定位；使支承輥 朝向第二面移動；以及將支承輥接觸於第二面並移動從而刀輪接觸於第一面時的支承輥的位置設定為支承輥的初始位置。 Here, the step of setting the initial position of the support roller may include the following steps: at the end of the substrate, the cutter wheel is positioned at the initial position; the support roller is positioned opposite to the cutter wheel; the support roller Moving toward the second surface; and setting the position of the support roller when the support roller contacts the second surface and moves so that the cutter wheel contacts the first surface as the initial position of the support roller.

另外，本發明的實施例提供一種劃線裝置的控制方法，劃線裝置可包括：工作台，供安裝具有第一面及第二面的基板的第二面；第一刀輪，以與基板的第一面相對的方式設置；以及第二刀輪，以與基板的第二面相對的方式設置，在從工作台凸出的基板的端部形成劃線，劃線裝置的控制方法包括以下步驟：設定第一刀輪對第一面的初始位置；以及設定第二刀輪第二面的初始位置，設定第一刀輪的初始位置的步驟包括以下步驟：在支承在工作台上的基板的支承部，使第一刀輪以與第一面相對的方式定位；使第一刀輪朝向第一面移動；以及將第一刀輪接觸於第一面時的第一刀輪的位置設定為第一刀輪的初始位置。 In addition, an embodiment of the present invention provides a method for controlling a scribing device. The scribing device may include: a workbench for mounting a second surface of a substrate having a first surface and a second surface; and a first cutter wheel to interact with the substrate And the second cutter wheel, which is arranged opposite to the second surface of the substrate, forms a scribing line at the end of the substrate protruding from the worktable. The control method of the scribing device includes the following Step: Set the initial position of the first cutter wheel to the first surface; and set the initial position of the second surface of the second cutter wheel. The step of setting the initial position of the first cutter wheel includes the following steps: The supporting part of the first cutter wheel is positioned opposite to the first surface; the first cutter wheel is moved toward the first surface; and the position of the first cutter wheel is set when the first cutter wheel is in contact with the first surface It is the initial position of the first cutter wheel.

在此，設定第二刀輪的初始位置的步驟可包括以下步驟：在基板的端部，使第一刀輪位於初始位置；使第二刀輪以與第一刀輪相對的方式定位；使第二刀輪朝向第二面移動；以及將第二刀輪接觸於第二面並移動從而第一刀輪接觸於第一面時的第二刀輪的位置設定為第二刀輪的初始位置。 Here, the step of setting the initial position of the second cutter wheel may include the following steps: at the end of the base plate, the first cutter wheel is located at the initial position; the second cutter wheel is positioned opposite to the first cutter wheel; The second cutter wheel moves toward the second surface; and the second cutter wheel is in contact with the second surface and moved so that the position of the second cutter wheel when the first cutter wheel contacts the first surface is set as the initial position of the second cutter wheel .

另外，本發明的實施例提供一種劃線裝置的控制方法，劃線裝置可包括：工作台，供安裝具有第一面及第二面的基板的第二面；第一刀輪及第一支承輥，以與基板的第一面相對的方式設置；以及第二刀輪第二支承輥，以與基板的第二面相對的方式設置，在從工作台凸出的基板的端部形成劃線，劃線裝置的控制方法包括以下步驟：設定第一刀輪對第一面的初始位置；設定第一支承輥對第一面的初始位置；設定第二刀輪對第二面的初始位置；以及設定第二支承輥對第二面的初始位置；設定第一刀輪的初始位置的步驟包括以下 步驟：在支承在工作台上的基板的支承部，使第一刀輪以與第一面相對的方式定位；使第一刀輪朝向第一面移動；以及將第一刀輪接觸於第一面時的第一刀輪的位置設定為第一刀輪的初始位置。 In addition, an embodiment of the present invention provides a method for controlling a scribing device. The scribing device may include: a workbench for mounting the second surface of the substrate with the first surface and the second surface; the first cutter wheel and the first support The roller is arranged to face the first surface of the substrate; and the second cutter wheel and the second support roller are arranged to face the second surface of the substrate, forming a scribe line at the end of the substrate protruding from the workbench The control method of the scribing device includes the following steps: setting the initial position of the first cutter wheel to the first surface; setting the initial position of the first support roller to the first surface; setting the initial position of the second cutter wheel to the second surface; And setting the initial position of the second support roller to the second surface; the steps of setting the initial position of the first cutter wheel include the following Steps: at the support portion of the substrate supported on the workbench, position the first cutter wheel in a manner opposite to the first surface; move the first cutter wheel toward the first surface; and contact the first cutter wheel to the first surface The position of the first cutter wheel during the noodle setting is set as the initial position of the first cutter wheel.

在此，設定第二刀輪的初始位置的步驟可包括以下步驟：在基板的端部，使第一刀輪位於初始位置；使第二刀輪以與第一刀輪相對的方式定位；使第二刀輪朝向第二面移動；以及將第二刀輪接觸於第二面並移動從而第一刀輪接觸於第一面時的第二刀輪的位置設定為第二刀輪的初始位置。 Here, the step of setting the initial position of the second cutter wheel may include the following steps: at the end of the base plate, the first cutter wheel is located at the initial position; the second cutter wheel is positioned opposite to the first cutter wheel; The second cutter wheel moves toward the second surface; and the second cutter wheel is in contact with the second surface and moved so that the position of the second cutter wheel when the first cutter wheel contacts the first surface is set as the initial position of the second cutter wheel .

另外，設定第二支承輥的初始位置的步驟可包括以下步驟：在基板的端部，使第一刀輪位於初始位置；使第二支承輥以與第一刀輪相對的方式定位；使第二支承輥朝向第二面移動；以及將第二支承輥接觸於第二面並移動從而第一刀輪接觸於第一面時的第二支承輥的位置設定為第二支承輥的初始位置。 In addition, the step of setting the initial position of the second support roller may include the following steps: at the end of the substrate, the first cutter wheel is located at the initial position; the second support roller is positioned opposite to the first cutter wheel; The two supporting rollers move toward the second surface; and the second supporting roller is contacted to the second surface and moved so that the position of the second supporting roller when the first cutter wheel contacts the first surface is set as the initial position of the second supporting roller.

另外，設定第一支承輥的初始位置的步驟可包括以下步驟：在支承在工作台上的基板的支承部，使第一支承輥以與第一面相對的方式定位；使第一支承輥朝向第一面移動；以及將第一支承輥接觸於第一面時的第一支承輥的位置設定為第一支承輥的初始位置。 In addition, the step of setting the initial position of the first supporting roller may include the following steps: positioning the first supporting roller in a manner opposite to the first surface at the supporting portion of the substrate supported on the worktable; and directing the first supporting roller to face The first surface moves; and the position of the first support roller when the first support roller is in contact with the first surface is set as the initial position of the first support roller.

另外，設定第二刀輪的初始位置的步驟可包括以下步驟：在基板的端部，使第一支承輥位於初始位置；使第二刀輪以與第一支承輥相對的方式定位；使第二刀輪朝向第二面移動；以及將第二刀輪接觸於第二面並移動從而第一支承輥接觸於第一面時的第二刀輪的位置設定為第二刀輪的初始位置。 In addition, the step of setting the initial position of the second cutter wheel may include the following steps: at the end of the substrate, the first support roller is located at the initial position; the second cutter wheel is positioned opposite to the first support roller; The second cutter wheel moves toward the second surface; and the second cutter wheel is contacted to the second surface and moved so that the position of the second cutter wheel when the first support roller contacts the first surface is set as the initial position of the second cutter wheel.

另外，設定第二支承輥的初始位置的步驟可包括以下步驟：在基板的端部，使第一支承輥位於初始位置；使第二支承輥以與第一支承輥相對 的方式定位；使第二支承輥朝向第二面移動；以及將第二支承輥接觸於第二面並移動從而第一支承輥接觸於第一面時的第二支承輥的位置設定為第二支承輥的初始位置。 In addition, the step of setting the initial position of the second support roller may include the following steps: at the end of the substrate, the first support roller is located at the initial position; the second support roller is opposite to the first support roller Move the second support roller toward the second surface; and move the second support roller in contact with the second surface so that the position of the second support roller when the first support roller contacts the first surface is set to the second The initial position of the support roller.

根據本發明的實施例，能夠準確設定支承輥及刀輪對基板的端部的初始位置的劃線方法，從而能夠在基板的端部精密地形成劃線。 According to the embodiment of the present invention, it is possible to accurately set the scribing method of the initial position of the support roller and the cutter wheel on the end of the substrate, so that the scribing can be precisely formed on the end of the substrate.

10:工作台 10: Workbench

30:劃線單元 30: Scribing unit

31:第一工作導件 31: The first working guide

32:第二工作導件 32: The second working guide

33:支承架 33: Support frame

50:控制單元 50: control unit

70:第一頭 70: first head

71:第一刀輪升降部 71: The first knife wheel lifting part

711:第一刀輪 711: first knife wheel

72:支承輥升降部 72: Support roller lifting part

721:支承輥 721: back-up roller

73:第一刀輪驅動部 73: The first cutter wheel drive

74:支承輥驅動部 74: Support roller drive

741:馬達 741: Motor

742:扭矩測量儀 742: Torque measuring instrument

75:第一滑動組件 75: The first sliding component

80:第二頭 80: second head

81:刀輪升降部 81: Knife wheel lifting part

811:刀輪 811: knife wheel

82:第二支承輥升降部 82: The second support roller lifting part

821:第二支承輥 821: The second backup roll

83:刀輪驅動部 83: Knife Wheel Drive

831:馬達 831: Motor

832:扭矩測量儀 832: Torque measuring instrument

84:第二支承輥驅動部 84: The second support roller drive

85:第二滑動組件 85: second sliding component

89:連接部件 89: connecting parts

S:基板 S: substrate

S1:端部 S1: End

S2:支承部 S2: Support

圖1是概要示出本發明的實施例的劃線裝置的側視圖。 Fig. 1 is a side view schematically showing a scribing device according to an embodiment of the present invention.

圖2是概要示出本發明的實施例的劃線裝置的主視圖。 Fig. 2 is a front view schematically showing the scribing device according to the embodiment of the present invention.

圖3是本發明的實施例的劃線裝置的控制框圖。 Fig. 3 is a control block diagram of the scribing device according to the embodiment of the present invention.

圖4至圖7是依次示出本發明的實施例的劃線裝置的控制方法的圖。 4 to 7 are diagrams sequentially showing the control method of the scribing device according to the embodiment of the present invention.

圖8是概要示出本發明的實施例的劃線裝置的其它例的圖。 Fig. 8 is a diagram schematically showing another example of the scribing device according to the embodiment of the present invention.

圖9是概要示出本發明的實施例的劃線裝置的另外其它例的圖。 Fig. 9 is a diagram schematically showing still another example of the scribing device according to the embodiment of the present invention.

圖10是概要示出本發明的實施例的劃線裝置的另外其它例的圖。 Fig. 10 is a diagram schematically showing still another example of the scribing device according to the embodiment of the present invention.

以下，參照附圖，對本發明的實施例的劃線裝置的控制方法進行說明。 Hereinafter, the control method of the scribing device according to the embodiment of the present invention will be described with reference to the drawings.

如圖1及圖2所示，將與放置基板S的X-Y平面垂直的方向定義為Z軸方向。並且，將與Z軸方向正交的方向定義為X軸方向及Y軸方向。 As shown in FIGS. 1 and 2, the direction perpendicular to the X-Y plane on which the substrate S is placed is defined as the Z axis direction. In addition, the direction orthogonal to the Z-axis direction is defined as the X-axis direction and the Y-axis direction.

如圖1至圖3所示，本發明的實施例的劃線裝置可以包括：支承基板S的工作台10；以在基板S的端部S1形成劃線的方式構成的劃線單元30；以及控制劃線裝置的構成要件的動作的控制單元50。 As shown in FIGS. 1 to 3, the scribing device of the embodiment of the present invention may include: a worktable 10 supporting a substrate S; a scribing unit 30 configured to form a scribing line on the end S1 of the substrate S; and The control unit 50 controls the operation of the constituent elements of the scribing device.

工作台10可以具備與氣體供給源連接而噴射氣體的氣體噴射孔。因此，當基板S載置於工作台10上時，從氣體噴射孔朝向基板S的底面噴射氣體，由此能夠使基板S上浮。另外，工作台10可以具備與真空源連接而抽吸氣體的氣體抽吸孔。因此，當基板S載置於工作台10上時，從氣體抽吸孔抽吸氣體，由此，能夠使基板S牢固地吸附於工作台10。 The table 10 may be provided with a gas injection hole that is connected to a gas supply source to inject gas. Therefore, when the substrate S is placed on the table 10, the gas is injected from the gas injection hole toward the bottom surface of the substrate S, whereby the substrate S can be floated. In addition, the table 10 may be provided with a gas suction hole that is connected to a vacuum source to suck gas. Therefore, when the substrate S is placed on the table 10, gas is sucked from the gas suction hole, whereby the substrate S can be firmly adsorbed to the table 10.

基板S具有第一面及第二面，基板S的第二面安裝於工作台10。以使基板S的端部S1從工作台10凸出的方式，基板S載置於工作台10。因此，若基板S載置於工作台10，則基板S具有從工作台10凸出的端部S1和被工作台10支承的支承部S2。 The substrate S has a first surface and a second surface, and the second surface of the substrate S is mounted on the table 10. The substrate S is placed on the table 10 so that the end S1 of the substrate S protrudes from the table 10. Therefore, if the substrate S is placed on the table 10, the substrate S has an end S1 protruding from the table 10 and a support portion S2 supported by the table 10.

在以使基板S的端部S1從工作台10凸出的方式基板S載置於工作台10的狀態下，劃線單元30以在基板S的端部S1形成劃線的方式構成。 In a state where the substrate S is placed on the table 10 such that the end S1 of the substrate S protrudes from the table 10, the scribing unit 30 is configured to form a scribing line on the end S1 of the substrate S.

劃線單元30可以包括：沿X軸方向延伸的第一工作導件31；與第一工作導件31通過支承架33連接並沿Y軸方向延伸的第二工作導件32；在第一工作導件31以能夠沿X軸方向移動的方式設置的第一頭70及第二頭80；使第一頭70順著第一工作導件31沿X軸方向移動的第一滑動組件75；以及使第二頭80順著第一工作導件31沿X軸方向移動的第二滑動組件85。 The scribing unit 30 may include: a first working guide 31 extending in the X-axis direction; a second working guide 32 connected to the first working guide 31 through a support frame 33 and extending in the Y-axis direction; A first head 70 and a second head 80 in which the guide 31 is movable in the X-axis direction; a first sliding assembly 75 that makes the first head 70 move in the X-axis direction along the first working guide 31; and The second sliding assembly 85 moves the second head 80 along the X axis direction along the first working guide 31.

在支承架33與第二工作導件32之間設置有在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆機構之類直線移動機構，通過這種直線移動機構，第一工作導件31沿Y軸方向移動。 Between the support frame 33 and the second working guide 32, a linear movement mechanism such as an actuator that works under air pressure or hydraulic pressure, a linear motor that works under electromagnetic interaction, or a ball screw mechanism is provided, through which linear movement Mechanism, the first working guide 31 moves along the Y-axis direction.

第一滑動組件75及第二滑動組件85可以連接於第一工作導件31。第一滑動組件75及第二滑動組件85順著第一工作導件31單獨移動。 The first sliding component 75 and the second sliding component 85 can be connected to the first working guide 31. The first sliding component 75 and the second sliding component 85 move independently along the first working guide 31.

在第一滑動組件75與第一工作導件31之間設置有在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆機構之類直線移動機構，通過這種直線移動機構，第一滑動組件75沿X軸方向移動。 Between the first sliding assembly 75 and the first working guide 31, a linear movement mechanism such as an actuator working under air pressure or hydraulic pressure, a linear motor working under electromagnetic interaction, or a ball screw mechanism is provided. The linear movement mechanism, the first sliding assembly 75 moves along the X-axis direction.

同樣，在第二滑動組件85與第一工作導件31設置有在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆機構之類直線移動機構，通過這種直線移動機構，第二滑動組件85沿X軸方向移動。 Similarly, the second sliding assembly 85 and the first working guide 31 are provided with a linear movement mechanism such as an actuator that works under air pressure or hydraulic pressure, a linear motor that works under electromagnetic interaction, or a ball screw mechanism. With a linear movement mechanism, the second sliding assembly 85 moves along the X-axis direction.

第一頭70和第二頭80可以以工作台10置於彼此之間的方式在Z軸方向上彼此相對佈置。第一頭70可以直接連接於第一滑動組件75。第二頭80可以通過連接部件89連接於第二滑動組件85。由此，第二頭80可以以工作台10置於彼此之間的方式與第一頭70相對佈置。 The first head 70 and the second head 80 may be arranged opposite to each other in the Z-axis direction in such a manner that the table 10 is placed between each other. The first head 70 may be directly connected to the first sliding assembly 75. The second head 80 may be connected to the second sliding assembly 85 through a connecting member 89. Thus, the second head 80 can be arranged opposite to the first head 70 in such a manner that the worktable 10 is placed between each other.

第一頭70可以包括：具備支承輥721的支承輥升降部72；以及以使支承輥升降部72相對於基板S沿Z軸方向移動的方式構成的支承輥驅動部74。 The first head 70 may include: a support roller lifting unit 72 provided with a support roller 721; and a support roller driving unit 74 configured to move the support roller lifting unit 72 in the Z-axis direction relative to the substrate S.

第二頭80可以包括：具備刀輪811的刀輪升降部81；以及以使刀輪升降部81相對於基板S沿Z軸方向移動的方式構成的刀輪驅動部83。 The second head 80 may include: a cutter wheel elevating portion 81 provided with a cutter wheel 811;

支承輥721與刀輪811以基板S置於彼此之間在Z軸方向上的方式彼此相對佈置。支承輥721構成為接觸於基板S的第一面，刀輪811構成為接觸於基板S的第二面。 The support roller 721 and the cutter wheel 811 are arranged opposite to each other in such a manner that the substrate S is placed between each other in the Z-axis direction. The support roller 721 is configured to be in contact with the first surface of the substrate S, and the cutter wheel 811 is configured to be in contact with the second surface of the substrate S.

隨著支承輥升降部72通過支承輥驅動部74朝向基板S移動，能夠使支承輥721加壓於基板S。 As the support roller lifting unit 72 moves toward the substrate S by the support roller driving unit 74, the support roller 721 can be pressed against the substrate S.

隨著刀輪升降部81通過刀輪驅動部83朝向基板S移動，能夠使刀輪811加壓於基板S。根據刀輪811對基板S加壓的程度，能夠調節刀輪811對基板S的切削深度。 As the cutter wheel elevating portion 81 moves toward the substrate S by the cutter wheel driving portion 83, the cutter wheel 811 can be pressed against the substrate S. According to the degree to which the cutter wheel 811 presses the substrate S, the cutting depth of the cutter wheel 811 against the substrate S can be adjusted.

例如，支承輥驅動部74及刀輪驅動部83可以由在氣壓或液壓下工作的致動器、在電磁相互作用下工作的線性馬達或滾珠螺杆機構之類直線移動機構構成。 For example, the support roller driving part 74 and the cutter wheel driving part 83 may be constituted by a linear movement mechanism such as an actuator operating under air pressure or hydraulic pressure, a linear motor operating under electromagnetic interaction, or a ball screw mechanism.

具體地，支承輥驅動部74及/或刀輪驅動部83可以由滾珠螺杆機構構成。在此情況下，支承輥驅動部74及/或刀輪驅動部83可以分別包括滾珠螺杆和與滾珠螺杆連接的馬達741、831。另外，在馬達741、831可以連接測量馬達741、831的扭矩的扭矩測量儀742、832。扭矩測量儀742、832可以使用與馬達741、831的軸連接而測量馬達741、831的扭矩的公知的扭矩測量儀。 Specifically, the support roller drive portion 74 and/or the cutter wheel drive portion 83 may be constituted by a ball screw mechanism. In this case, the support roller drive portion 74 and/or the cutter wheel drive portion 83 may respectively include a ball screw and motors 741 and 831 connected to the ball screw. In addition, torque meters 742 and 832 that measure the torque of the motors 741 and 831 can be connected to the motors 741 and 831. As the torque meters 742 and 832, a known torque meter that is connected to the shafts of the motors 741 and 831 to measure the torque of the motors 741 and 831 can be used.

如圖3所示，控制單元50與扭矩測量儀742、832及馬達741、831連接，能夠基於通過扭矩測量儀742、832測量的扭矩(變化)控制馬達741、831。 As shown in FIG. 3, the control unit 50 is connected to the torque meters 742 and 832 and the motors 741 and 831, and can control the motors 741 and 831 based on the torque (change) measured by the torque meters 742 and 832.

另外，控制單元50能夠使用扭矩測量儀742、832計量馬達741、831的扭矩變化，基於所計量的扭矩變化，能夠檢測支承輥721及刀輪811是否接觸到基板S。另外，控制單元50基於通過扭矩測量儀742、832所計量的馬達741、831的扭矩變化，能夠檢測支承輥721及刀輪811對基板S加壓的程度(加壓力)。 In addition, the control unit 50 can measure the torque changes of the motors 741 and 831 using the torque measuring instruments 742 and 832, and can detect whether the support roller 721 and the cutter wheel 811 are in contact with the substrate S based on the measured torque changes. In addition, the control unit 50 can detect the degree to which the support roller 721 and the cutter wheel 811 press the substrate S (pressurizing force) based on the torque changes of the motors 741 and 831 measured by the torque meters 742 and 832.

作為其它例，雖未圖示，在支承輥驅動部74及/或刀輪驅動部83由致動器或線性馬達構成的情況下，支承輥驅動部74及/或刀輪驅動部83可以還具備直線尺規。能夠使用直線尺規來計量支承輥升降部72及/或刀輪升降部81的位移及移動量，基於所計量的位移及移動量，能夠檢測支承輥721及/或刀輪811的當前位置。 As another example, although not shown, in the case where the support roller drive section 74 and/or the cutter wheel drive section 83 is constituted by an actuator or a linear motor, the support roller drive section 74 and/or the cutter wheel drive section 83 may also With straight ruler. A linear ruler can be used to measure the displacement and movement amount of the support roller lifting portion 72 and/or the cutter wheel lifting portion 81, and based on the measured displacement and movement amount, the current position of the support roller 721 and/or the cutter wheel 811 can be detected.

作為其它例，雖未圖示，在工作台10的一側可以設置相機。能夠通過相機對工作台10、支承輥721及/或刀輪811進行攝像，能夠根據所攝像的圖像檢測工作台10、支承輥721及/或刀輪811的當前位置。 As another example, although not shown, a camera may be installed on one side of the workbench 10. The table 10, the support roller 721, and/or the cutter wheel 811 can be captured by a camera, and the current position of the table 10, the support roller 721, and/or the cutter wheel 811 can be detected based on the captured image.

根據這種結構，在刀輪811加壓於基板S的端部S1且支承輥721支承基板S的端部S1的狀態下，第一頭70及第二頭80針對基板S沿X軸方向相對移動，由此能夠在基板S的端部S1形成劃線。此時，支承輥721支承刀輪811對基板S的端部S1加壓的力。 According to this structure, in a state where the cutter wheel 811 is pressed against the end S1 of the substrate S and the support roller 721 supports the end S1 of the substrate S, the first head 70 and the second head 80 face the substrate S in the X-axis direction. By moving, it is possible to form a scribe line at the end S1 of the substrate S. At this time, the support roller 721 supports the force of the cutter wheel 811 to press the end S1 of the substrate S.

另一方面，於在基板S的端部S1形成劃線的過程之前，執行對支承輥721對基板S的端部S1的初始位置(Z軸方向上的位置，高度)及刀輪811對基板S的端部S1的初始位置(Z軸方向上的位置，高度)進行設定的過程。 On the other hand, before the process of forming the scribing line on the end S1 of the substrate S, the initial position (position in the Z-axis direction, height) of the end S1 of the substrate S by the support roller 721 and the cutter wheel 811 against the substrate are performed. The initial position (position in the Z-axis direction, height) of the end S1 of S is set.

支承輥721對基板S的端部S1的初始位置通過支承輥721接觸於基板S的端部S1的第一面的過程來執行。另外，刀輪811對基板S的端部S1的初始位置通過刀輪811接觸於基板S的端部S1的第二面過程來執行。但是，在這種過程中，由於基板S的端部S1在重力作用下變形等各種原因，基板S的端部S1的第一面及第二面的位置發生變動。另外，在支承輥721接觸於基板S的端部S1的第一面時，由於因支承輥721施加的力，基板S的端部S1彎曲，同時基板S的端部S1的第一面的位置發生變動。另外，在刀輪811接觸於基板S的端部S1的第二面時，由於因刀輪811施加的力，基板S的端部S1彎曲，同時基板S的端部S1的第二面的位置發生變動。 The initial position of the support roller 721 with respect to the end S1 of the substrate S is performed by a process in which the support roller 721 contacts the first surface of the end S1 of the substrate S. In addition, the initial position of the cutter wheel 811 with respect to the end S1 of the substrate S is performed by the process of the cutter wheel 811 contacting the second surface of the end S1 of the substrate S. However, in this process, due to various reasons such as deformation of the end portion S1 of the substrate S due to gravity, the positions of the first surface and the second surface of the end portion S1 of the substrate S change. In addition, when the support roller 721 is in contact with the first surface of the end S1 of the substrate S, the end S1 of the substrate S bends due to the force applied by the support roller 721, and the position of the first surface of the end S1 of the substrate S Changes. In addition, when the cutter wheel 811 contacts the second surface of the end S1 of the substrate S, the end S1 of the substrate S bends due to the force applied by the cutter wheel 811, and the position of the second surface of the end S1 of the substrate S Changes.

因此，難以準確設定支承輥721的初始位置及刀輪811的初始位置。 Therefore, it is difficult to accurately set the initial position of the support roller 721 and the initial position of the cutter wheel 811.

本發明的目的在於解決這種問題，如圖4至圖7所示，本發明的實施例的劃線裝置的控制方法可以包括：設定支承輥721對基板S的端部S1中的第一面的初始位置的步驟；以及設定刀輪811對基板S的端部S1中的第二面的初始位置的步驟。 The purpose of the present invention is to solve this problem. As shown in FIGS. 4 to 7, the control method of the scribing device according to the embodiment of the present invention may include: setting the support roller 721 to the first surface of the end S1 of the substrate S And the step of setting the initial position of the cutter wheel 811 on the second surface of the end S1 of the substrate S.

如圖4及圖5所示，設定支承輥721的初始位置的步驟在以使基板S的端部S1從工作台10凸出的方式基板S載置於工作台10的狀態下執行。 As shown in FIGS. 4 and 5, the step of setting the initial position of the support roller 721 is performed in a state where the substrate S is placed on the table 10 such that the end S1 of the substrate S protrudes from the table 10.

設定支承輥721的初始位置的步驟可以包括：使支承輥721以與支承在工作台10上的基板S的支承部S2中的第一面相對的方式定位的步驟(參照圖4)；使支承輥721朝向基板S的支承部S2中的第一面移動的步驟；以及將當支承輥721接觸於基板S的支承部S2中的第一面時的支承輥721的位置設定為支承輥721的初始位置的步驟(參照圖5)。 The step of setting the initial position of the support roller 721 may include the step of positioning the support roller 721 in a manner opposed to the first surface of the support portion S2 of the substrate S supported on the table 10 (refer to FIG. 4); The step of moving the roller 721 toward the first surface in the support portion S2 of the substrate S; and setting the position of the support roller 721 when the support roller 721 is in contact with the first surface in the support portion S2 of the substrate S to the position of the support roller 721 Steps of initial position (refer to Figure 5).

在此，基板S的支承部S2是基板S接觸於工作台10的一部分。基板S的支承部S2中與支承輥721的接觸的部分可以是實際不用於產品而切割掉的部分(虛擬)。 Here, the support portion S2 of the substrate S is a part of the substrate S in contact with the table 10. The portion of the support portion S2 of the substrate S that is in contact with the support roller 721 may be a portion (virtual) that is not actually used for products but is cut away.

如此，支承輥721與支承在工作台10上的基板S的支承部S2中的第一面接觸，因此即使支承輥721接觸於基板S的支承部S2中的第一面，基板S也不變形。因此，可以將支承輥721朝向基板S的支承部S2中的第一面移動而接觸於基板S的支承部S2中的第一面時的支承輥721的位置設定為支承輥721的初始位置。 In this way, the support roller 721 is in contact with the first surface in the support portion S2 of the substrate S supported on the table 10, so even if the support roller 721 contacts the first surface in the support portion S2 of the substrate S, the substrate S is not deformed . Therefore, the position of the support roller 721 when the support roller 721 moves toward the first surface in the support portion S2 of the substrate S and contacts the first surface in the support portion S2 of the substrate S can be set as the initial position of the support roller 721.

在此，控制單元50通過扭矩測量儀742檢測支承輥驅動部74的馬達741的扭矩是否增加而超過預先確定的基準扭矩。並且，若支承輥驅動部74的馬達741的扭矩超過基準扭矩，則控制單元50可以判斷為支承輥721接觸於基 板S的支承部S2中的第一面。預定的基準扭矩可表示為當支承輥721或刀輪811與基板的表面以預定的加壓力接觸時扭矩測量儀742或832所量測到的扭矩。因此，若當前的扭矩(扭矩測量儀742或832當前所測得的)等於或大於基準扭矩，則可判斷支承輥721或刀輪811與基板的表面以預定的加壓力接觸。 Here, the control unit 50 uses the torque meter 742 to detect whether the torque of the motor 741 of the support roller drive portion 74 has increased and exceeds a predetermined reference torque. In addition, if the torque of the motor 741 of the support roller drive portion 74 exceeds the reference torque, the control unit 50 can determine that the support roller 721 is in contact with the base. The first surface of the support portion S2 of the plate S. The predetermined reference torque may be expressed as the torque measured by the torque measuring instrument 742 or 832 when the support roller 721 or the cutter wheel 811 is in contact with the surface of the substrate at a predetermined pressure. Therefore, if the current torque (currently measured by the torque measuring instrument 742 or 832) is equal to or greater than the reference torque, it can be determined that the support roller 721 or the cutter wheel 811 is in contact with the surface of the substrate with a predetermined pressure.

作為其它例，雖未圖示，在支承輥驅動部74具備直線尺規的結構的情況下，當通過直線尺規檢測出支承輥721的位置在變化過程中停止變化時，控制單元50可以判斷為支承輥721接觸於基板S的支承部S2中的第一面。 As another example, although not shown, in the case where the support roller drive portion 74 has a linear ruler, the control unit 50 can determine when the position of the support roller 721 stops changing during the change process when the linear ruler detects The support roller 721 is in contact with the first surface of the support portion S2 of the substrate S.

作為再其它例，雖未圖示，可以通過相機拍攝支承輥721及基板S，控制單元50可以根據所攝像的圖像判斷支承輥721是否接觸於基板S的支承部S2中的第一面。 As yet another example, although not shown, the support roller 721 and the substrate S can be photographed by a camera, and the control unit 50 can determine whether the support roller 721 is in contact with the first surface of the support portion S2 of the substrate S based on the captured image.

如圖6及圖7所示，設定刀輪811的初始位置的步驟可以包括：使支承輥721以在基板S的端部S1與基板S的第一面相對的方式定位的步驟；使支承輥721在基板S的端部S1位於初始位置的步驟(參照圖6)；使刀輪811以與支承輥721相對的方式定位的步驟；使刀輪811朝向基板S的第二面移動的步驟；以及將刀輪811接觸於第二面並移動從而支承輥721以預先設定的加壓力接觸於基板S的第一面時的刀輪811的位置設定為刀輪811的初始位置的步驟(參照圖7)。 As shown in FIGS. 6 and 7, the step of setting the initial position of the cutter wheel 811 may include the step of positioning the support roller 721 in such a way that the end S1 of the substrate S is opposite to the first surface of the substrate S; Step 721 is in the initial position at the end S1 of the substrate S (refer to FIG. 6); the step of positioning the cutter wheel 811 opposite to the supporting roller 721; the step of moving the cutter wheel 811 toward the second surface of the substrate S; And the step of setting the position of the cutter wheel 811 when the cutter wheel 811 is in contact with the second surface and moved so that the support roller 721 contacts the first surface of the substrate S with a preset pressing force as the initial position of the cutter wheel 811 (refer to FIG. 7).

若在基板S的端部S1，支承輥721位於初始位置，則支承輥721能夠以比預先設定的加壓力小的加壓力接觸於基板S的第一面。另外，根據情況，當基板S的端部S1在重力作用下變形時，支承輥721可以不接觸於基板S的第一面。 If the support roller 721 is at the initial position at the end portion S1 of the substrate S, the support roller 721 can contact the first surface of the substrate S with a pressing force smaller than a preset pressing force. In addition, according to circumstances, when the end S1 of the substrate S is deformed under the action of gravity, the support roller 721 may not contact the first surface of the substrate S.

並且，如圖6所示，若在基板S的端部S1，支承輥721位於初始位置，則刀輪811在以與支承輥721相對的方式定位之後，朝向基板S的第二面移動。 Furthermore, as shown in FIG. 6, if the support roller 721 is at the initial position at the end S1 of the substrate S, the cutter wheel 811 moves toward the second surface of the substrate S after being positioned so as to face the support roller 721.

因此，如圖7所示，刀輪811在接觸於基板S的第二面之後移動，基板S的第一面以預先設定的加壓力接觸於支承輥721。即，刀輪811以預先設定的加壓力接觸於基板S的第二面，支承輥721以預先設定的加壓力接觸於基板S的第一面。此時，控制單元50可以將刀輪811以預先設定的加壓力接觸於基板S的第二面且支承輥721以預先設定的加壓力接觸於基板S的第一面時的刀輪811的位置設定為刀輪811的初始位置。 Therefore, as shown in FIG. 7, the cutter wheel 811 moves after contacting the second surface of the substrate S, and the first surface of the substrate S contacts the support roller 721 with a preset pressing force. That is, the cutter wheel 811 contacts the second surface of the substrate S with a preset pressing force, and the support roller 721 contacts the first surface of the substrate S with a preset pressing force. At this time, the control unit 50 can contact the cutter wheel 811 with a preset pressing force to the second surface of the substrate S and the support roller 721 to contact the first surface of the substrate S with a preset pressing force at the position of the cutter wheel 811 It is set to the initial position of the cutter wheel 811.

在此，控制單元50通過扭矩測量儀832檢測刀輪驅動部83的馬達831的扭矩是否增加而超過預先設定的基準扭矩。並且，若刀輪驅動部83的馬達831的扭矩超過基準扭矩，則控制單元50可以判斷為刀輪811以預先設定的加壓力接觸於基板S的第二面且支承輥721以預先設定的加壓力接觸於基板S的第一面。 Here, the control unit 50 uses the torque meter 832 to detect whether the torque of the motor 831 of the cutter wheel drive unit 83 has increased and exceeds a preset reference torque. In addition, if the torque of the motor 831 of the cutter wheel drive unit 83 exceeds the reference torque, the control unit 50 can determine that the cutter wheel 811 is in contact with the second surface of the substrate S with a preset pressing force and the support roller 721 is applied with a preset pressing force. The pressure contacts the first surface of the substrate S.

作為其它例，雖未圖示，在刀輪驅動部83具備直線尺規的結構的情況下，當通過直線尺規檢測出刀輪811的位置在變化過程中停止變化時，控制單元50可以判斷為刀輪811以預先設定的加壓力接觸於基板S的第二面且支承輥721以預先設定的加壓力接觸於基板S的第一面。 As another example, although not shown, in the case where the cutter wheel drive portion 83 has a linear ruler, when the position of the cutter wheel 811 is detected by the linear ruler that the position of the cutter wheel 811 stops changing during the change, the control unit 50 can determine The cutter wheel 811 contacts the second surface of the substrate S with a preset pressing force, and the support roller 721 contacts the first surface of the substrate S with a preset pressing force.

作為再其它例，雖未圖示，可以通過相機拍攝支承輥721、刀輪811及基板S，控制單元50可以根據所攝像的圖像判斷刀輪811是否以預先設定的加壓力接觸於基板S的第二面以及支承輥721是否以預先設定的加壓力接觸於基板S的第一面。 As yet another example, although not shown, the support roller 721, the cutter wheel 811, and the substrate S can be photographed by a camera, and the control unit 50 can determine whether the cutter wheel 811 is in contact with the substrate S with a preset pressing force based on the captured image. Whether the second surface of the substrate S and the support roller 721 are in contact with the first surface of the substrate S with a preset pressing force.

根據本發明的實施例的劃線裝置的控制方法，通過使支承輥721接觸於支承在工作台10上的基板S的支承部S2的過程來設定支承輥721的初始位置。因此，在設定支承輥721的初始位置的過程中，由於基板S不因支承輥721所施加的力而變形，因此能夠更準確地設定支承輥721的初始位置。另外，在使支承輥721在基板S的端部S1位於初始位置的狀態下，使刀輪811以與支承輥721相對的方式定位並使刀輪811朝向支承輥721移動，支承輥721及刀輪811以預先設定的加壓力接觸於基板S的端部S1，通過此過程設定刀輪811的初始位置。因此，在設定刀輪811的初始位置的過程中，由於基板S不因刀輪811所施加的力而變形，因此能夠更準確地設定刀輪811的初始位置。 According to the control method of the scribing device of the embodiment of the present invention, the initial position of the support roller 721 is set by the process of bringing the support roller 721 into contact with the support portion S2 of the substrate S supported on the table 10. Therefore, in the process of setting the initial position of the support roller 721, since the substrate S is not deformed by the force applied by the support roller 721, the initial position of the support roller 721 can be set more accurately. In addition, with the support roller 721 in the initial position at the end S1 of the substrate S, the cutter wheel 811 is positioned so as to face the support roller 721 and the cutter wheel 811 is moved toward the support roller 721, the support roller 721 and the knife The wheel 811 contacts the end S1 of the base plate S with a preset pressing force, and the initial position of the cutter wheel 811 is set through this process. Therefore, in the process of setting the initial position of the cutter wheel 811, since the substrate S is not deformed by the force applied by the cutter wheel 811, the initial position of the cutter wheel 811 can be set more accurately.

圖8是概要示出本發明的實施例的劃線裝置的其它例的圖。 Fig. 8 is a diagram schematically showing another example of the scribing device according to the embodiment of the present invention.

如圖8所示，刀輪811可以與基板S的第一面相對佈置，支承輥721可以與基板S的第二面相對佈置。 As shown in FIG. 8, the cutter wheel 811 may be arranged opposite to the first surface of the substrate S, and the supporting roller 721 may be arranged opposite to the second surface of the substrate S.

在圖8所示的實施例中，可以先執行在基板S的支承部S2設定刀輪811的初始位置的步驟之後，執行在基板S的端部S1以刀輪811的初始位置為基準設定支承輥721的初始位置的步驟。 In the embodiment shown in FIG. 8, after the step of setting the initial position of the cutter wheel 811 at the support portion S2 of the substrate S, the end S1 of the substrate S may be set to support the cutter wheel 811 based on the initial position of the cutter wheel 811. Step of initial position of roller 721.

圖9是概要示出本發明的實施例的劃線裝置的其它例的圖。 Fig. 9 is a diagram schematically showing another example of the scribing device according to the embodiment of the present invention.

如圖9所示，第一頭70具備第一刀輪711及第一支承輥721，第二頭80具備第二刀輪811及第二支承輥821。 As shown in FIG. 9, the first head 70 includes a first cutter wheel 711 and a first support roller 721, and the second head 80 includes a second cutter wheel 811 and a second support roller 821.

第一刀輪711通過第一刀輪升降部71與第一刀輪驅動部73連接。第一支承輥721通過第一支承輥升降部72與第一支承輥驅動部74連接。第二刀輪811通過第二刀輪升降部81與第二刀輪驅動部83連接。第二支承輥821通過第二支承輥升降部82與第二支承輥驅動部84連接。 The first cutter wheel 711 is connected to the first cutter wheel driving portion 73 through the first cutter wheel lifting portion 71. The first support roller 721 is connected to the first support roller driving portion 74 through the first support roller lifting portion 72. The second cutter wheel 811 is connected to the second cutter wheel driving portion 83 through the second cutter wheel lifting portion 81. The second support roller 821 is connected to the second support roller driving portion 84 through the second support roller lifting portion 82.

在圖9所示的實施例中，在第一刀輪711與第二支承輥821以彼此相對的方式定位且第二刀輪811與第一支承輥721以彼此相對的方式定位的狀態下，執行在基板S的端部S1形成劃線的過程。 In the embodiment shown in FIG. 9, in a state where the first cutter wheel 711 and the second support roller 821 are positioned opposite to each other, and the second cutter wheel 811 and the first support roller 721 are positioned opposite to each other, A process of forming a scribing line at the end S1 of the substrate S is performed.

可以先執行在基板S的支承部S2設定第一支承輥721的初始位置的步驟之後，執行在基板S的端部S1以第一支承輥721的初始位置為基準設定第二刀輪811的初始位置以及設定第二支承輥721的初始位置的步驟。 After the step of setting the initial position of the first support roller 721 on the support portion S2 of the substrate S, the initial position of the second cutter wheel 811 can be set at the end S1 of the substrate S based on the initial position of the first support roller 721. Position and step of setting the initial position of the second support roller 721.

作為其它例，可以先執行在基板S的支承部S2設定第一刀輪711的初始位置的步驟之後，執行在基板S的端部S1以第一刀輪711的初始位置為基準設定第二刀輪811的初始位置及設定第二支承輥721的初始位置的步驟。 As another example, after the step of setting the initial position of the first cutter wheel 711 at the support portion S2 of the substrate S, the second cutter setting at the end S1 of the substrate S based on the initial position of the first cutter wheel 711 may be performed. The initial position of the wheel 811 and the step of setting the initial position of the second support roller 721.

圖10是概要示出本發明的實施例的劃線裝置的另外其它例的圖。 Fig. 10 is a diagram schematically showing still another example of the scribing device according to the embodiment of the present invention.

如圖10所示，第一頭70具備第一刀輪711，第二頭80具備第二刀輪811。 As shown in FIG. 10, the first head 70 includes a first cutter wheel 711, and the second head 80 includes a second cutter wheel 811.

第一刀輪711通過第一刀輪升降部71與第一刀輪驅動部73連接。第二刀輪811通過第二刀輪升降部81與第二刀輪驅動部83連接。 The first cutter wheel 711 is connected to the first cutter wheel driving portion 73 through the first cutter wheel lifting portion 71. The second cutter wheel 811 is connected to the second cutter wheel driving portion 83 through the second cutter wheel lifting portion 81.

在圖10所示的實施例中，在第一刀輪711與第二刀輪811以彼此相對的方式定位的狀態下，執行在基板S的端部S1形成劃線的過程。 In the embodiment shown in FIG. 10, in a state where the first cutter wheel 711 and the second cutter wheel 811 are positioned opposite to each other, the process of forming a scribing line on the end S1 of the substrate S is performed.

在圖10所示的實施例中，可以先執行在基板S的支承部S2設定第一刀輪711的初始位置的步驟之後，執行在基板S的端部S1以第一刀輪711的初始位置為基準設定第二刀輪811的初始位置的步驟。 In the embodiment shown in FIG. 10, after the step of setting the initial position of the first cutter wheel 711 at the support portion S2 of the substrate S, the initial position of the first cutter wheel 711 may be set at the end S1 of the substrate S. A step of setting the initial position of the second cutter wheel 811 as a reference.

例示性說明了本發明的優選實施例，在本發明的範圍並不限定於這種特定實施例，可以在申請專利範圍中所記載的範疇內進行適當變更。 The preferred embodiments of the present invention are illustratively described, and the scope of the present invention is not limited to such specific embodiments, and may be appropriately changed within the scope described in the scope of the patent application.

10:工作台 10: Workbench

30:劃線單元 30: Scribing unit

31:第一工作導件 31: The first working guide

70:第一頭 70: first head

72:支承輥升降部 72: Support roller lifting part

721:支承輥 721: back-up roller

74:支承輥驅動部 74: Support roller drive

741:馬達 741: Motor

742:扭矩測量儀 742: Torque measuring instrument

75:第一滑動組件 75: The first sliding component

80:第二頭 80: second head

81:刀輪升降部 81: Knife wheel lifting part

811:刀輪 811: knife wheel

83:刀輪驅動部 83: Knife Wheel Drive

831:馬達 831: Motor

832:扭矩測量儀 832: Torque measuring instrument

85:第二滑動組件 85: second sliding component

89:連接部件 89: connecting parts

S:基板 S: substrate

Claims (13)

一種劃線裝置的控制方法，包括以下步驟：以使具有第一面及第二面的基板的端部從工作台凸出的方式，將所述基板載置於所述工作台；將支承輥接觸支承在所述工作台上的所述基板的支承部的所述第一面時的所述支承輥的位置設定為所述支承輥的初始位置；在所述基板的端部，使所述支承輥位於初始位置；以及在所述基板的端部，將使刀輪接觸於所述基板的第二面並移動而基板的第一面接觸於所述支承輥時的所述刀輪的位置設定為所述刀輪的初始位置。 A control method of a scribing device includes the following steps: placing the substrate on the work table in such a way that the end of the substrate having the first surface and the second surface protrudes from the work table; and placing a support roller The position of the support roller when contacting the first surface of the support portion of the substrate supported on the table is set to the initial position of the support roller; at the end of the substrate, the The support roller is located at the initial position; and at the end of the substrate, the position of the cutter wheel when the cutter wheel contacts the second surface of the substrate and moves and the first surface of the substrate contacts the support roller Set as the initial position of the cutter wheel. 一種劃線裝置的控制方法，所述劃線裝置包括：工作台，供安裝具有第一面及第二面的基板的第二面；支承輥，以與所述基板的第一面相對的方式設置；以及刀輪，以與所述基板的所述第二面相對的方式設置，在從所述工作台凸出的所述基板的端部形成劃線，所述劃線裝置的控制方法包括以下步驟：設定所述支承輥對所述第一面的初始位置；以及設定所述刀輪對所述第二面的初始位置，設定所述支承輥的初始位置的步驟包括以下步驟：在支承在所述工作台上的所述基板的支承部，使所述支承輥以與所述第一面相對的方式定位；使所述支承輥朝向所述第一面移動；以及將所述支承輥接觸於所述第一面時的所述支承輥的位置設定為所述支承輥的初始位置。 A control method of a scribing device, the scribing device comprising: a workbench for mounting a second surface of a substrate having a first surface and a second surface; and a supporting roller in a manner opposite to the first surface of the substrate And a cutter wheel, arranged in a manner opposite to the second surface of the substrate, forming a scribing line at the end of the substrate protruding from the workbench, the control method of the scribing device includes The following steps: setting the initial position of the support roller to the first surface; and setting the initial position of the cutter wheel to the second surface. The step of setting the initial position of the support roller includes the following steps: On the support portion of the substrate on the worktable, the support roller is positioned so as to be opposite to the first surface; the support roller is moved toward the first surface; and the support roller The position of the support roller when it is in contact with the first surface is set as the initial position of the support roller. 如請求項2所述的劃線裝置的控制方法，其中設定所述刀輪的初始位置的步驟包括以下步驟：在所述基板的端部，使所述支承輥位於初始位置；使所述刀輪以與所述支承輥相對的方式定位；使所述刀輪朝向所述第二面移動；以及將所述刀輪接觸於所述第二面並移動從而所述支承輥接觸於所述第一面時的所述刀輪的位置設定為所述刀輪的初始位置。 The control method of the scribing device according to claim 2, wherein the step of setting the initial position of the cutter wheel includes the following steps: at the end of the substrate, the support roller is located at the initial position; The wheel is positioned opposite to the support roller; the cutter wheel is moved toward the second surface; and the cutter wheel is contacted to the second surface and moved so that the support roller contacts the first surface. The position of the cutter wheel on one side is set as the initial position of the cutter wheel. 一種劃線裝置的控制方法，所述劃線裝置包括：工作台，供安裝具有第一面及第二面的基板的第二面；刀輪，以與所述基板的第一面相對的方式設置；以及支承輥，以與所述基板的所述第二面相對的方式設置，在從所述工作台凸出的所述基板的端部形成劃線，所述劃線裝置的控制方法包括以下步驟：設定所述刀輪對所述第一面的初始位置；以及設定所述支承輥對所述第二面的初始位置，設定所述刀輪的初始位置的步驟包括以下步驟：在支承在所述工作台上的所述基板的支承部，使所述刀輪以與所述第一面相對的方式定位；使所述刀輪朝向所述第一面移動；以及將所述刀輪接觸於所述第一面時的所述刀輪的位置設定為所述刀輪的初始位置。 A control method of a scribing device, the scribing device comprising: a workbench for mounting a second surface of a substrate having a first surface and a second surface; a cutter wheel in a manner opposite to the first surface of the substrate And a support roller, arranged in a manner opposite to the second surface of the substrate, forming a scribing line at the end of the substrate protruding from the worktable, the control method of the scribing device includes The following steps: setting the initial position of the cutter wheel on the first surface; and setting the initial position of the support roller on the second surface. The step of setting the initial position of the cutter wheel includes the following steps: On the support portion of the substrate on the workbench, the cutter wheel is positioned opposite to the first surface; the cutter wheel is moved toward the first surface; and the cutter wheel The position of the cutter wheel when it contacts the first surface is set as the initial position of the cutter wheel. 如請求項4所述的劃線裝置的控制方法，其中設定所述支承輥的初始位置的步驟包括以下步驟： 在所述基板的端部，使所述刀輪位於初始位置；使所述支承輥以與所述刀輪相對的方式定位；使所述支承輥朝向所述第二面移動；以及將所述支承輥接觸於所述第二面並移動從而所述刀輪接觸於所述第一面時的所述支承輥的位置設定為所述支承輥的初始位置。 The control method of the scribing device according to claim 4, wherein the step of setting the initial position of the support roller includes the following steps: At the end of the substrate, position the cutter wheel at the initial position; position the support roller opposite to the cutter wheel; move the support roller toward the second surface; and move the The position of the support roller when the support roller contacts the second surface and moves so that the cutter wheel contacts the first surface is set as the initial position of the support roller. 一種劃線裝置的控制方法，所述劃線裝置包括：工作台，供安裝具有第一面及第二面的基板的第二面；第一刀輪，以與所述基板的第一面相對的方式設置；以及第二刀輪，以與所述基板的所述第二面相對的方式設置，在從所述工作台凸出的所述基板的端部形成劃線，所述劃線裝置的控制方法包括以下步驟：設定所述第一刀輪對所述第一面的初始位置；以及設定所述第二刀輪對所述第二面的初始位置，設定所述第一刀輪的初始位置的步驟包括以下步驟：在支承在所述工作台上的所述基板的支承部，使所述第一刀輪以與所述第一面相對的方式定位；使所述第一刀輪朝向所述第一面移動；以及將所述第一刀輪接觸於所述第一面時的所述第一刀輪的位置設定為所述第一刀輪的初始位置。 A method for controlling a scribing device, the scribing device comprising: a workbench for mounting a second surface of a substrate having a first surface and a second surface; and a first cutter wheel opposite to the first surface of the substrate And a second cutter wheel, arranged in a manner opposite to the second surface of the substrate, forming a scribing line at the end of the substrate protruding from the workbench, the scribing device The control method includes the following steps: setting the initial position of the first cutter wheel on the first surface; and setting the initial position of the second cutter wheel on the second surface, and setting the initial position of the first cutter wheel The initial position step includes the following steps: in the support portion of the substrate supported on the workbench, the first cutter wheel is positioned opposite to the first surface; the first cutter wheel is positioned opposite to the first surface; Moving toward the first surface; and setting the position of the first cutter wheel when the first cutter wheel is in contact with the first surface as the initial position of the first cutter wheel. 如請求項6所述的劃線裝置的控制方法，其中設定所述第二刀輪的初始位置的步驟包括以下步驟：在所述基板的端部，使所述第一刀輪位於初始位置；使所述第二刀輪以與所述第一刀輪相對的方式定位； 使所述第二刀輪朝向所述第二面移動；以及將所述第二刀輪接觸於所述第二面並移動從而所述第一刀輪接觸於所述第一面時的所述第二刀輪的位置設定為所述第二刀輪的初始位置。 The control method of the scribing device according to claim 6, wherein the step of setting the initial position of the second cutter wheel includes the following steps: at the end of the substrate, the first cutter wheel is located at the initial position; Positioning the second cutter wheel in a manner opposite to the first cutter wheel; Moving the second cutter wheel toward the second surface; and when the second cutter wheel contacts the second surface and moves so that the first cutter wheel contacts the first surface The position of the second cutter wheel is set as the initial position of the second cutter wheel. 一種劃線裝置的控制方法，所述劃線裝置包括：工作台，供安裝具有第一面及第二面的基板的第二面；第一刀輪及第一支承輥，以與所述基板的第一面相對的方式設置；以及第二刀輪及第二支承輥，以與所述基板的所述第二面相對的方式設置，所述劃線裝置用以在從所述工作台凸出的所述基板的端部形成劃線，所述劃線裝置的控制方法包括以下步驟：設定所述第一刀輪對所述第一面的初始位置；設定所述第一支承輥對所述第一面的初始位置；設定所述第二刀輪對所述第二面的初始位置；以及設定所述第二支承輥對所述第二面的初始位置；設定所述第一刀輪的初始位置的步驟包括以下步驟：在支承在所述工作台上的所述基板的支承部，使所述第一刀輪以與所述第一面相對的方式定位；使所述第一刀輪朝向所述第一面移動；以及將所述第一刀輪接觸於所述第一面時的所述第一刀輪的位置設定為所述第一刀輪的初始位置。 A control method of a scribing device, the scribing device comprising: a workbench for mounting a second surface of a substrate having a first surface and a second surface; a first cutter wheel and a first supporting roller to interact with the substrate And the second cutter wheel and the second supporting roller are arranged opposite to the second surface of the substrate, and the scribing device is used to protrude from the worktable The end of the substrate is drawn out to form a scribing line, and the control method of the scribing device includes the following steps: setting the initial position of the first cutter wheel to the first surface; setting the first support roller to the first surface; The initial position of the first surface; setting the initial position of the second cutter wheel to the second surface; and setting the initial position of the second support roller to the second surface; setting the first cutter wheel The step of initial position includes the following steps: in the support portion of the substrate supported on the workbench, the first cutter wheel is positioned opposite to the first surface; the first cutter The wheel moves toward the first surface; and the position of the first cutter wheel when the first cutter wheel contacts the first surface is set as the initial position of the first cutter wheel. 如請求項8所述的劃線裝置的控制方法，其中設定所述第二刀輪的初始位置的步驟包括以下步驟：在所述基板的端部，使所述第一刀輪位於初始位置；使所述第二刀輪以與所述第一刀輪相對的方式定位； 使所述第二刀輪朝向所述第二面移動；以及將所述第二刀輪接觸於所述第二面並移動從而所述第一刀輪接觸於所述第一面時的所述第二刀輪的位置設定為所述第二刀輪的初始位置。 The control method of the scribing device according to claim 8, wherein the step of setting the initial position of the second cutter wheel includes the following steps: at the end of the substrate, the first cutter wheel is located at the initial position; Positioning the second cutter wheel in a manner opposite to the first cutter wheel; Moving the second cutter wheel toward the second surface; and when the second cutter wheel contacts the second surface and moves so that the first cutter wheel contacts the first surface The position of the second cutter wheel is set as the initial position of the second cutter wheel. 如請求項8所述的劃線裝置的控制方法，其中設定所述第二支承輥的初始位置的步驟包括以下步驟：在所述基板的端部，使所述第一刀輪位於初始位置；使所述第二支承輥以與所述第一刀輪相對的方式定位；使所述第二支承輥朝向所述第二面移動；以及將所述第二支承輥接觸於所述第二面並移動從而所述第一刀輪接觸於所述第一面時的所述第二支承輥的位置設定為所述第二支承輥的初始位置。 The control method of the scribing device according to claim 8, wherein the step of setting the initial position of the second support roller includes the following steps: at the end of the substrate, the first cutter wheel is located at the initial position; Positioning the second support roller in a manner opposed to the first cutter wheel; moving the second support roller toward the second surface; and contacting the second support roller to the second surface And move so that the position of the second support roller when the first cutter wheel contacts the first surface is set to the initial position of the second support roller. 如請求項8所述的劃線裝置的控制方法，其中設定所述第一支承輥的初始位置的步驟包括以下步驟：在支承在所述工作台上的所述基板的支承部，使所述第一支承輥以與所述第一面相對的方式定位；使所述第一支承輥朝向所述第一面移動；以及將所述第一支承輥接觸於所述第一面時的所述第一支承輥的位置設定為所述第一支承輥的初始位置。 The control method of the scribing device according to claim 8, wherein the step of setting the initial position of the first support roller includes the following steps: in the support portion of the substrate supported on the worktable, the The first support roller is positioned so as to be opposite to the first surface; the first support roller is moved toward the first surface; and the first support roller is in contact with the first surface. The position of the first support roller is set to the initial position of the first support roller. 如請求項11所述的劃線裝置的控制方法，其中設定所述第二刀輪的初始位置的步驟包括以下步驟：在所述基板的端部，使所述第一支承輥位於初始位置；使所述第二刀輪以與所述第一支承輥相對的方式定位；使所述第二刀輪朝向所述第二面移動；以及 將所述第二刀輪接觸於所述第二面並移動從而所述第一支承輥接觸於所述第一面時的所述第二刀輪的位置設定為所述第二刀輪的初始位置。 The control method of the scribing device according to claim 11, wherein the step of setting the initial position of the second cutter wheel includes the following steps: at the end of the substrate, the first supporting roller is located at the initial position; Positioning the second cutter wheel to be opposite to the first support roller; moving the second cutter wheel toward the second surface; and The position of the second cutter wheel when the second cutter wheel contacts the second surface and moves so that the first support roller contacts the first surface is set as the initial position of the second cutter wheel Location. 如請求項11所述的劃線裝置的控制方法，其中設定所述第二支承輥的初始位置的步驟包括以下步驟：在所述基板的端部，使所述第一支承輥位於初始位置；使所述第二支承輥以與所述第一支承輥相對的方式定位；使所述第二支承輥朝向所述第二面移動；以及將所述第二支承輥接觸於所述第二面並移動從而所述第一支承輥接觸於所述第一面時的所述第二支承輥的位置設定為所述第二支承輥的初始位置。 The control method of the scribing device according to claim 11, wherein the step of setting the initial position of the second support roller includes the following steps: at the end of the substrate, the first support roller is located at the initial position; Positioning the second support roller in a manner opposed to the first support roller; moving the second support roller toward the second surface; and contacting the second support roller to the second surface And move so that the position of the second support roller when the first support roller is in contact with the first surface is set to the initial position of the second support roller.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009157440A1 (en) * 2008-06-25 2009-12-30 三星ダイヤモンド工業株式会社 Scribing apparatus
TW201501897A (en) * 2013-07-08 2015-01-16 Mitsuboshi Diamond Ind Co Ltd Processing device of laminated substrate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100637590B1 (en) * 2005-07-08 2006-10-23 주식회사 탑 엔지니어링 Apparatus for cutting glass substrates in manufacturing process of flat type displayer
KR100777983B1 (en) * 2005-12-29 2007-11-21 주식회사 탑 엔지니어링 Apparatus for Cutting Substrate
JP6022862B2 (en) * 2012-05-08 2016-11-09 株式会社不二製作所 Hard brittle substrate cutting method and cutting device
JP2014080334A (en) * 2012-10-17 2014-05-08 Mitsuboshi Diamond Industrial Co Ltd Substrate dividing device
ES2898703T3 (en) * 2015-06-10 2022-03-08 Bando Kiko Co Glass plate cutting, method for placing the cut glass plate, and device therefor
CN106746557B (en) * 2016-12-23 2020-11-17 京东方科技集团股份有限公司 Cutting system and cutting method
JP6410157B2 (en) * 2017-02-28 2018-10-24 三星ダイヤモンド工業株式会社 Bonded substrate processing equipment
JP6891561B2 (en) * 2017-03-16 2021-06-18 日本電気硝子株式会社 Glass plate manufacturing method and manufacturing equipment
KR102027136B1 (en) * 2017-09-27 2019-10-01 주식회사 탑 엔지니어링 Scribing apparatus
JP6967276B2 (en) * 2017-12-28 2021-11-17 三星ダイヤモンド工業株式会社 Break device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009157440A1 (en) * 2008-06-25 2009-12-30 三星ダイヤモンド工業株式会社 Scribing apparatus
TW201501897A (en) * 2013-07-08 2015-01-16 Mitsuboshi Diamond Ind Co Ltd Processing device of laminated substrate

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