TW201501897A - Processing device of laminated substrate - Google Patents

Abstract

The present invention provides a processing device of laminated substrate to indeed remove the terminal material portion covering the terminal region with good efficiency. A processing device of laminated substrate is disclosed; said laminated substrate is made by laminating the first substrate G1 and the second substrate G2 to form the laminated substrate M; also, a marking line S3 for forming the terminal region T is formed in the portion near at least one edge of the first substrate G1. Said processing device removes the terminal material portion E covering the terminal region T along the marking line S3; it also comprises: a conveyer 11 to carry and convey the laminated substrate M; and a propping connection body 12 propping and connecting the surface of the terminal material portion E of the laminated substrate conveyed by the conveyer 11, and being able to move forward and backward. The conveyer 11 conveys the terminal material portion E of the laminated substrate to the location near the propping connection body 12, and, at the state that the propping connection body 12 props against/connect to the terminal material portion E, conveys the rest portion of the laminated substrate toward the direction away from the propping connection body 12 for removing the terminal material portion E.

Description

Processing device for bonding substrates

The present invention relates to a processing apparatus for obtaining a bonded substrate of a plurality of unit substrates by dividing a bonded substrate obtained by bonding a brittle material substrate. More specifically, the present invention relates to a processing apparatus for a bonded substrate in which a terminal substrate for external connection is formed around a unit substrate when a unit substrate is obtained from a self-bonding substrate. The processing apparatus of the present invention is used for processing a unit display panel or the like such as a liquid crystal display panel.

In the manufacture of a liquid crystal display panel, two large-area glass substrates are used, a color filter CF (Color Filter) is formed on one substrate, and a thin film transistor TFT (Thin Film Transistor) for driving liquid crystal is formed on the other substrate. Terminal area for external connections. Then, after the two substrates are bonded together and sealed with liquid crystal to form a mother substrate, the panels are divided into unit display units.

Usually, in the step of dividing the mother substrate into a unit display panel, a breaking method using a cutter wheel is utilized. In this case, first, for each of the two substrates (the CF side substrate and the TFT side substrate) constituting the mother substrate, the cutter wheel is pressed against the predetermined breaking position and moved relative to each other, thereby scribing the respective substrates. Slotting). Then, the mother substrate is divided by applying a force so as to be bent along the scribe line, thereby completely dividing the mother substrate into individual unit display panels. Then, the transfer unit is transferred to the unit display panel by the transfer robot to the subsequent step.

A substrate processing system (substrate breaking system) or a substrate processing method for efficiently processing the above-described series of substrate processing on the upper and lower surfaces simultaneously has been disclosed (see Patent Document 1 and Patent Document 2). According to these documents, both sides of the mother substrate are simultaneously scribed from the upper and lower sides by a pair of upper and lower cutter wheels, and then the two sides are simultaneously divided by the steam breaking mechanism or the roller breaking mechanism to be divided into unit display panels. . The unit display panel thus obtained is taken out one by one and sent to the subsequent steps.

The mother substrate is formed by laminating a first substrate (CF side substrate) on the side where the color filter is formed, and a second substrate (TFT side substrate) on the side where the TFT and the terminal region are formed, with a sealing material interposed therebetween.

Since the terminal region is a region where the signal line is connected between the TFT and the external device, it is necessary to expose the terminal region. Therefore, when the mother substrate is divided into unit display panels, the portion of the first substrate (CF side substrate) facing the terminal region is divided along the outer end of the terminal region (that is, the periphery of the unit display panel). Broken, and the width (terminal width) required to mount the signal line from the side end outside the terminal area is cut off as an end material.

9 is a plan view showing an example of a substrate layout of a mother substrate for a liquid crystal display panel. In the figure, a total of eight unit display panels U are disposed on the mother substrate M. Further, Fig. 9(a) shows a case where the terminal region T of the unit display panel U cut out from the mother substrate M is formed on one of the four sides, and Fig. 9(b) shows the case where it is formed on both sides, Fig. 9(c) ) indicates the situation formed on three sides.

Moreover, FIG. 10 is a view (top view, front view, right side view) of the terminal region T formed on the unit display panel U cut out from the mother substrate M of FIG. 10(a) shows a unit display panel U in which the terminal region T is formed on one of the terminals, and FIG. 10(b) shows the unit display panel U in which the terminal region T is formed on both terminals, and FIG. 10(c) shows The terminal region T is formed on the unit display panel U of the three terminals of three sides. Further, a terminal area is formed on the four-terminal four-terminal display panel. The number of sides forming the terminal region is selected in accordance with the number of pixels included in the unit display panel U.

When the mother substrate is divided, as shown in FIG. 11, two kinds of cut surfaces are formed in the vicinity of the boundary between the adjacent unit display panels U1, U2.

One of the first substrate G1 is aligned with the end surface of the second substrate G2 to cut the (completely cut) cutting surface of the two substrates, and the cutting surface is referred to as a full-cut surface Ca. The entire cut surface Ca is a surface that completely separates the unit display panel U1 from the unit display panel U2.

The other type is to cut the cut surface of the first substrate G1 only at a position separated from the entire cut surface Ca by the terminal width W, and is referred to as a terminal cut surface Cb. The terminal cut surface Cb is a cut surface that is cut in order to expose the terminal region T. Further, the first substrate G1 between the entire cut surface Ca and the terminal cut surface Cb generates the end portion E.

The scribing process of the above-described entire cut surface Ca and the terminal cut surface Cb is usually performed as follows.

As shown in Fig. 12 (a), the cutter wheel K1 is pressed against the position of the entire cutting plane Ca on the side of the first substrate G1, and the cutter wheel K2 is pressed against the position of the entire cutting plane Ca on the side of the second substrate G2. One scoring process.

Then, as shown in FIG. 12(b), the cutter wheel K1 is pressed against the terminal cutting surface Cb to be processed, and the backup roller K3 (roller having a flat surface) is pressed against the cutter wheel K1. The position of the surface of the second substrate G2 is subjected to a second scribe process. In the second scribing process, the groove of the scribe line of the terminal cutting surface Cb is machined to a depth at which the first substrate G1 is completely separated.

Thereafter, as shown in FIG. 12(c), the mother substrate is sent to a breaking device (not shown), and is cut off from the entire cutting surface Ca, and then, by suctioning a suction disk or the like (not shown). The terminal portion E is removed from the substrate and removed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication WO2005/087458

[Patent Document 2] International Publication WO2002/057192

In recent years, from the viewpoint of effectively utilizing materials and reducing the thickness of the liquid crystal display device, it is required to further reduce the thickness of the mother substrate on the basis of the present, and specifically, the first substrate G1 and the first substrate are required. The thickness of the two substrates G2 is about 0.05 to 0.2 mm. Further, the width of the terminal region formed on the unit display panel is required, that is, the terminal width is narrowed, and specifically, it is required to be reduced to about 1 to 2 mm.

When the width of the terminal is narrowed to 1 to 2 mm, as shown in Fig. 12(c), when the end portion E is cut out to the side of the terminal cut surface Cb, it is not used for adsorbing the suction disk. The area of the end material portion E cannot be removed. Moreover, it is also difficult to grasp and pull away by means of a chuck or the like. Further, when the thickness of the first substrate and the second substrate is reduced to 0.05 to 0.2 mm, an adhesive force is generated between the substrates, and removal of the terminal portion becomes more difficult.

Accordingly, the present invention has been made in view of the above circumstances, and an object thereof is to provide a processing apparatus which can efficiently and reliably remove a bonded substrate covering an end portion of a terminal region.

In order to achieve the above object, the present invention adopts the following technical means. That is, the present invention is a processing apparatus for bonding a substrate, wherein the bonded substrate is formed by bonding a first substrate and a second substrate, and a terminal region is formed in a portion of the first substrate adjacent to at least one side portion. For scribing, the processing device removes the end material portion covering the terminal region along the scribe line, and includes: a conveyor that mounts and transports the bonded substrate; and a contact body that abuts on the transporting The surface of the end plate portion of the bonded substrate that is conveyed by the machine is movable forward and backward. The transport mechanism transports the end material portion of the bonded substrate to a position near the contact body, and the contact body After abutting against the end material portion, the remaining portion of the bonded substrate is conveyed away from the contact body while the abutting body is in contact with each other.

Since the present invention has the above configuration, the abutting body is gently pressed against When the surface of the end portion of the terminal region is covered, the bonded substrate is moved away from the bonded substrate by the conveyor, and the end portion can be surely pulled away and removed. Therefore, even if the end portion of the area for narrowing the area for adsorption by the adsorption disk cannot be secured as before, the end portion can be surely removed from the bonded substrate, and the occurrence of defective products can be remarkably suppressed. Moreover, in the present invention, since the bonded material is removed by the contact of the contact body, the end portion is removed, and therefore, even if the respective substrates of the bonded substrate are formed of a relatively thin material of 0.05 to 0.2 mm, When the adhesion between the substrates is generated, the end portion can be easily peeled off.

In the above aspect of the invention, it is preferable that the contact body abuts against the end material portion in a state in which at least the one side portion of the bonded substrate is in a lowered posture.

Thereby, the end material portion which is brought into contact with the contact body and peeled off can be naturally dropped by its own weight and accumulated underneath, whereby the disposal of the peeled end material portion can be facilitated.

1‧‧‧ scoring device

2a‧‧‧Conveyor

2b‧‧‧Conveyor

3a‧‧‧Upper cutter wheel

3b‧‧‧ lower cutter wheel

4‧‧‧Scratch

5‧‧‧ beams

6‧‧‧Support

7‧‧‧Parts

8‧‧‧Support roller

10‧‧‧End material removal mechanism (terminal area processing device)

11‧‧‧Conveyor

12‧‧‧Resistance

13‧‧‧ Lifting mechanism

14‧‧‧ beams

15‧‧‧Conveyor

15a‧‧‧ wheel body

Ca‧‧‧section

Cb‧‧‧ terminal cutting surface

G1‧‧‧First substrate (CF side substrate)

G2‧‧‧Second substrate (TFT side substrate)

E‧‧‧End material section

K1‧‧‧ cutter wheel

K2‧‧‧ cutter wheel

K3‧‧‧Support Roller

L‧‧‧scribed line

M‧‧‧ mother substrate

M1‧‧‧Band substrate

Scribing in the direction of S1‧‧‧Y

S2‧‧‧X direction marking

S3‧‧‧Drawing of terminal area

T‧‧‧Terminal area

U‧‧‧unit display panel

U1‧‧‧ unit display panel

U2‧‧‧ unit display panel

W‧‧‧ terminal width

Fig. 1 is a schematic plan view showing an example of a scribing device used in the present invention.

Fig. 2 is an explanatory view of the main part of the scribing device of Fig. 1 as before.

3(a) to (f) are plan views showing the steps of cutting out the unit display panel from the mother substrate.

Fig. 4 is a cross-sectional view showing an example of a breaking device used in the present invention.

Fig. 5 is a front view showing a step of scribing a terminal region of a unit display panel.

6(a) to 6(c) are explanatory views showing the end material removing mechanism of the present invention and the operation thereof.

7(a) to 7(c) are explanatory views showing another embodiment of the end material removing mechanism.

8(a) to 8(d) are explanatory views showing still another embodiment of the end material removing mechanism.

9(a) to 9(c) are plan views showing an example of a substrate layout of a mother substrate.

10(a) to 10(c) are explanatory views showing an example of formation of a terminal region formed on a unit display panel.

Figure 11 is a cross-sectional view showing a portion of a terminal region formed between adjacent unit display panels Figure.

12(a) to (c) are cross-sectional views showing the processing steps of the terminal region.

An embodiment of a processing apparatus for a bonded substrate of the present invention will be described based on the drawings. The processing apparatus of the present invention is used with a scoring apparatus and a breaking apparatus. That is, the mother substrate to be processed is separated into individual unit substrates by the scribing device and the breaking device, and then the step of processing the terminal regions is performed, and the processing device of the present invention is used as the end material removing mechanism at this time (ie, Terminal area processing device). Further, the substrate transfer device between the devices of the scribing device, the breaking device, and the end material removing device (terminal region processing device) is not particularly shown, and can be carried out by using a commercially available transport mechanism of the conveyor.

The mother substrate M to be processed of the present invention has a substrate structure in which a first substrate (CF side substrate) and a second substrate (TFT side substrate) are bonded together. Here, the case where the unit display panel U is arranged in two rows in the X direction and four rows in the Y direction are cut out from the unit display panel U as shown in FIG. 3( a ), and the unit display panel U is cut out. One of the four peripherals of the unit display panel U that has been cut out is processed for the external connection terminal region T. Further, the imaginary line L shown by the two-dot chain line in Fig. 3 indicates the scribed line, and the XY direction in the present specification is as shown in the drawing.

1 and 2 schematically show a scribing device for forming a scribe line on the mother substrate M.

The scribing device 1 includes a pair of conveyors 2a and 2b before and after transporting the mother substrate M in the Y direction from the substrate loading side toward the substrate carrying-out side, and performs scribing processing in the middle of substrate transfer between the conveyors 2a and 2b.

The upper cutter wheel 3a and the lower cutter wheel 3b are disposed between the conveyors 2a and 2b before and after the front and rear sides of the conveyors 2a and 2b. Each of the cutter wheels 3a and 3b is held by the scribing heads 4 and 4, and is configured to be movable up and down so as to be pressed against the mother substrate M by the set pressing force, and is configured to be pressed against the surface of the mother substrate M while being pressed along the surface. The beams 5, 5 are rolled in the X direction of Fig. 1. Further, when the terminal region is formed by scoring, the backup roller is used. 8 (refer to FIG. 5) is substituted for the lower cutter wheel 3b, and will be described later.

For the mother substrate M, scribing and breaking are performed in the following order.

First, with respect to the mother substrate M shown in Fig. 3(a), the scribes of all the scribe lines L along the Y direction are performed by the cutter wheels 3a, 3b above and below the scribing device 1 as described above, thereby As shown in FIG. 3(b), a scribe line S1 for dividing is formed on the substrate M. After that, the mother substrate M is sent to the breaking device, and is cut off from the scribe line S1, thereby cutting out the rectangular strip-shaped substrate in which four unit display panels U are arranged in series as shown in FIG. 3(c). M1.

The breaking device used in the present invention can be used as known. For example, as shown in FIG. 4, the left and right pair of support parts 6 and 6 are supported by the strip substrate M1 from the lower surface via the scribe line S1, and the breaking rod 7 is lowered from the upper side toward the scribe line S1; The substrate M1 is divided by bending the breaking rod 7 against the scribe line S1 to perform cutting.

Then, the cut strip substrate M1 was rotated by 90 degrees on a horizontal plane. The rotation operation of the substrate is performed by a turntable (not shown), but it can also be performed manually. Then, the scribes of all the scribe lines L along the X direction are performed by the upper and lower cutter wheels 3a, 3b. Thereby, as shown in FIG. 3(d), the scribe line S2 for dividing is processed in the upper direction (X direction) of the strip substrate M1. Thereafter, the strip substrate M1 is sent to the breaking device in the same manner as described above, and as shown in FIG. 3(e), the unit display panel U is separated from the scribe line S2.

Thereafter, the unit display panel U is sent to the scribing device for forming the terminal region, and as shown in FIG. 3(f), the divided terminal region T is processed on the first substrate G1 (refer to FIG. 5) (the end portion) E) the line S3. The scribing line S3 is processed at a position close to one of the four peripherals of the unit display panel U, for example, a position 2 mm from the periphery.

In the processing, the unit display panel U is placed on the conveyor such that the upper side is the first substrate G1 (CF side substrate) and the lower side is the second substrate G2 (TFT side substrate) as shown in FIG. 2a, 2b. Then, the upper cutter wheel 3a is lowered to process the scribing line S3 on the surface of the first substrate G1. At this time, the lower surface (the second substrate G2 side) of the unit display panel U facing the upper cutter wheel 3a is supported by the support roller 8 having a flat peripheral surface. The support roller 8 is previously set in the scribe The lower cross member 5 of the device 1. The groove (crack) of the processed scribe line S3 is such that only the first substrate G1 is completely separated, or only a part of the thickness is left.

The unit display panel U on which the scribe line S3 is processed is subsequently removed to cover the end portion E of the terminal region T, and is sent to the end material removing mechanism 10 (terminal region processing device) shown in Fig. 6 .

The end material removing mechanism 10 includes a conveyor 11 that mounts and transports the unit display panel U, and a contact body 12 that is disposed above the conveyor 11 and that moves up and down in the vertical direction. The conveyor 11 can also use the conveyor 2b of one of the above scoring devices. The control conveyor 11 and the contact body 12 perform the following operations which are set in advance by a control device (not shown).

The abutting body 12 is formed of a plate material extending in the extending direction of the scribe line S3, and is supported by the beam 14 via a lifting mechanism 13 such as a hydraulic cylinder. Further, when the abutting body 12 is lowered, the surface of the end portion E of the unit display panel U can be gently pressed. The adjustment of the pressing force can be performed by adjusting the lifting stroke of the lifting mechanism 13.

In the end material removing mechanism 10, as shown in Fig. 6(a), the unit display panel U is placed such that the side portion including the end portion E is the rear end side in the traveling direction and the end portion E is placed upward. The conveyor 11 is transferred in the direction of the arrow.

When the end portion E of the unit display panel U is sent to the lower side of the abutting body 12, as shown in FIG. 6(b), the conveyor 11 is stopped, the abutting body 12 is lowered and gently pressed against the end portion E. The surface.

When the conveyor 11 is driven again in the above state and the unit display panel U is moved in the same direction as the arrow in the previous state, since the end portion E is pressed against the upper surface by the abutting body 12, as shown in Fig. 6(c) It is shown that the end portion E is pulled away from the scribe line S3 of the divided end portion E and remains on the conveyor 11. In this case, since the groove of the scribe line S3 is processed in a state where the first substrate G1 is completely separated or only a part of the first substrate G1 is completely cut in the previous step, the end portion E can be easily pulled away from the scribe line S3.

The unit display panel U after removing the end portion E is transported as a product to the next step Then, the end portion E remaining on the conveyor 11 is conveyed to the end of the conveyor 11 as the conveyor 11 travels, and is dropped, collected in a terminal box or the like, and discarded. Further, the abutting body 12 returns to its original position and stands by.

Further, in the above embodiment, the conveyor 11 is temporarily stopped when the abutting body 12 is pressed against the surface of the end portion E, but the abutting body 12 is favorably pressed against the end portion as long as it is moving. E, it is not necessary to stop the conveyor.

Figure 7 shows another embodiment of the end material removal mechanism 10. In this embodiment, as shown in FIG. 7(a), the unit display panel U is placed on the conveyor 11 in a state in which one side portion including the end material portion E is directed toward the leading end side in the traveling direction. Further, similarly to the previous embodiment, when the end portion E of the unit display panel U is sent to the lower side of the abutting body 12, as shown in Fig. 7(b), the conveyor 11 is stopped, and the abutting body 12 is lowered. And gently pressed against the surface of the end portion E.

In this state, the conveyor 11 is reversely driven to move the unit display panel U in the opposite direction (leftward direction in the drawing) from the previous embodiment. Thereby, as shown in FIG. 7(c), the end portion E is pulled away from the scribe line S3 and left on the conveyor 11. The unit display panel U after the removal of the end portion E is transported as a product to the next step, and the end portion E remaining on the conveyor 11 is conveyed to the end of the conveyor 11 as the conveyor 11 travels, and is collected. Discard in a terminal box or the like. Further, the abutting body 12 returns to the original position and stands by.

Fig. 8 is a view showing still another embodiment in which the end portion E is removed by causing one side portion of the unit display panel U including the end portion E to be lowered downward.

In this embodiment, as shown in FIG. 8(a), the unit display panel U is placed in a state where one side of the end portion E of the unit display panel U is located at the forefront and the end portion E is directed upward. It is placed on the conveyor 15 and transferred to the end of the conveyor 15. If one of the side portions including the end portion E is located slightly above the wheel body 15a of the conveyor 15, the unit display panel U will hang down as shown in Fig. 8(b) due to its own weight. Furthermore, a unit display panel formed of a material having a thickness that does not hang down by its own weight is from this embodiment. except.

Then, as shown in FIG. 8(c), the conveyor 15 is stopped at a position where one side of the unit display panel U is lowered, and the abutting body 12 is gently pressed against the surface of the end portion E. The abutting body 12 has the same structure as the abutting body described in the previous embodiment, and is provided at a position that can be pressed against the surface of the end portion E when the one side portion is in a downward posture.

In a state where the abutting body 12 is pressed against the end portion E in the above manner, as shown in FIG. 8(d), the conveyor 15 is reversed so that the unit display panel U is in the opposite direction to that of FIG. 8(a). mobile. At this time, since the end portion E is pressed against the upper surface by the abutting body 12, the end portion E is pulled away from the scribe line S3 and naturally falls downward. The unit display panel U after removing the end portion E is transported as a product to the next step. Further, the abutting body 12 returns to the original position and stands by.

As described above, in the present invention, the end unit can be moved in a direction away from the surface of the end portion E of the terminal portion T by gently pressing the abutting body 12, and the end material can be moved. The portion E is removed from the unit display panel U and removed. Therefore, the end portion E can be surely removed from the unit display panel U even if the end portion of the width of 1 to 2 mm which is narrow for the area to be adsorbed by the adsorption disk cannot be secured as before.

In the above embodiment, the unit display panel of one terminal has been described. However, in the case of the unit display panel of two terminals, three terminals and four terminals, the terminal region forming step and the end portion portion are required. The removal step can be performed for the number of terminal regions.

The present invention has been described with reference to the preferred embodiments of the present invention. However, the present invention is not limited thereto, and may be appropriately modified or changed without departing from the spirit and scope of the invention.

[Industrial availability]

The substrate processing apparatus of the present invention can be used to process terminals including at least one side of the periphery The unit display panel of the area section.

10‧‧‧End material removal mechanism (terminal area processing device)

11‧‧‧Conveyor

12‧‧‧Resistance

13‧‧‧ Lifting mechanism

14‧‧‧ beams

G1‧‧‧First substrate (CF side substrate)

G2‧‧‧Second substrate (TFT side substrate)

E‧‧‧End material section

S3‧‧‧Drawing of terminal area

T‧‧‧Terminal area

U‧‧‧unit display panel

Claims (2)

A processing apparatus for bonding a substrate, wherein the bonding substrate is formed by bonding a first substrate and a second substrate, and a scribe line for dividing a terminal region is formed in a portion of the first substrate adjacent to at least one side, and the processing is performed. The device removes the end portion covering the terminal region along the scribe line, and includes: a conveyor that mounts and transports the bonded substrate; and a contact body that is brought into contact with the conveyor The surface of the end plate portion of the bonded substrate is movable forward and backward; the transport mechanism transports the end material portion of the bonded substrate to a position in the vicinity of the contact body, and the abutting body abuts on the end After the material portion, the remaining portion of the bonded substrate is conveyed away from the contact body while the abutting body is in contact with each other. A processing apparatus for a bonded substrate according to claim 1, wherein the contact body is brought into contact with the end material portion in a state in which at least the one side portion of the bonded substrate is suspended.