JP4820886B2 - Substrate processing equipment - Google Patents

Description

  The present invention relates to a substrate processing apparatus having a function of marking on a substrate with a laser beam.

  In Patent Document 1, a marking unit that performs marking with a laser beam on the surface of a flat workpiece, and a reversing processing unit that carries in and reverses the workpiece with marking on one side from the marking unit, and then carries it out to the marking unit. However, a laser marking device provided in the same casing is disclosed. As an example of this laser marking device, a laser marker, a workpiece holding unit that receives and holds a workpiece in the marking unit, and a reciprocating movement of the workpiece holding unit between a position facing the laser marker and the reversing processing unit A moving mechanism is disclosed. In this laser marking device, a workpiece holding portion that receives a workpiece is first positioned so as to face the laser marker, and marking is performed on one side of the workpiece. When marking is completed, the work holding unit is moved toward the reversing processing unit while holding the work, and the work is carried out to the reversing processing unit.

JP 2006-7293 A (paragraph numbers 0010 and 0014)

  In general, in the substrate manufacturing process, it is preferable that the time required for each process (tact time) is short. For this reason, there is a need for an apparatus that can perform the process of marking on a substrate with laser light in a shorter time.

One embodiment of the present invention is a substrate processing apparatus, which includes a substrate reversing unit and a marking unit. The substrate reversing unit supports the substrate so that the first and second surfaces of the substrate are exposed, and rotates the substrate by 180 degrees about the rotation axis, thereby allowing the first and second surfaces of the substrate to be exposed. It is a unit which can make each of them face upward. Marking unit, above the substrate reversing unit, which from the axis of rotation of the substrate reversing unit is fixed to at least spaced position rotating radius. This marking unit performs marking on the substrate by two-dimensionally scanning a laser beam whose focal length can be adjusted. For example, the substrate reversing unit may reverse the substrate by rotating the substrate by 180 degrees in the same direction, that is, 360 degrees, and by rotating (reversing) the substrate by 180 degrees forward and backward. The substrate may be reversed.

The substrate processing apparatus is a above the substrate reversing unit, at least spaced positions a turning radius from the rotational axis of the substrate reversing unit, adjustable marking unit focal length are arranged. According to this substrate processing apparatus, the marking size (spot size) can be made almost uniform at any position on the substrate as long as the region can be irradiated with laser light (laser light scanning range). For this reason, it is not necessary to relatively move the substrate and the marking unit in the two-dimensional direction during the marking process. Furthermore, in this substrate processing apparatus, the substrate reversing unit and the marking unit are opposed to each other with at least a rotation radius. For this reason, if a board | substrate is reversed below a marking unit, it can mark on both surfaces of a board | substrate accurately.

That is, in this substrate processing apparatus, after marking one surface of the substrate, the substrate is not moved in the horizontal direction to be transferred to the reversing mechanism, and the portion to be marked on the substrate is relatively moved to the marking unit. The substrate can be reversed by the substrate reversing device below the marking unit and marked on the other surface of the substrate without being moved in the two-dimensional direction by the XY table so as to be downward. Therefore, according to this substrate processing apparatus, it is not necessary to reciprocate the substrate between the marking unit and the reversal processing unit by the moving mechanism, and it is possible to omit moving the substrate two-dimensionally with the XY table during the marking process. . For this reason, the tact time required for marking can be shortened.

Further, in this substrate processing apparatus, the substrate reversing unit and the marking unit are arranged in the vertical direction (vertical direction). For this reason, the size in the horizontal direction can be reduced. Therefore, the area for installing the substrate processing apparatus can be reduced, and the substrate processing apparatus can be more easily and flexibly incorporated into a line for manufacturing the substrate.

In this substrate processing apparatus, the substrate reversing unit includes two pairs of belt conveyors that support edges facing each other along the rotation axis of each of the first and second surfaces of the substrate, and upper and lower portions of the two pairs of belt conveyors. A pair of support members that respectively support a pair of belt conveyors and face each other along a rotation axis; and a motor attached to each of the pair of support members; A motor for driving each belt conveyor, and a plurality of slide shafts that connect the pair of support members so that the distance between the pair of support members along the rotation axis at positions away from the belt conveyor can be adjusted . When the plurality of slide shafts are within a rotation radius with respect to the rotation axis of the substrate reversing unit, and each of the first and second surfaces of the substrate is directed upward at a position 180 degrees symmetrical about the rotation axis The marking unit is disposed outside the scanning range of the laser beam. The belt conveyor can be used for sliding the substrate when, for example, it is desired to perform a marking process in a wider range than the scanning range of the laser beam.

  The substrate to be marked can be of various sizes. According to this substrate processing apparatus, the distance between the belt conveyors can be adjusted by adjusting the distance along the rotation axis of the pair of support members facing each other along the rotation axis. For this reason, a board | substrate can be hold | gripped with the belt conveyor adjusted according to the size of a board | substrate, and it can mark on both surfaces of a board | substrate.

Further, in this substrate processing apparatus, the plurality of slide shafts are within a rotation radius with respect to the rotation axis of the substrate reversing unit, and when the first and second surfaces of the substrate are directed upward, It arrange | positions so that it may become out of the scanning range of a laser beam. For this reason, it does not interfere with the marking unit when the substrate is reversed, and does not interfere with the laser light during the marking process.

Further, in this case, the substrate reversing unit is rotated by a rotation drive unit that rotates one support member of the pair of support members around the rotation axis of the substrate reversing unit. The other support member of the pair of support members rotates following the one support member via the slide shaft. Therefore, a drive shaft for rotating the support members in conjunction with each other is not necessary, and the pair of support members can be rotated in synchronization with the slide shaft that does not obstruct marking. For this reason, an apparatus can be collected further compactly.

Further, the belt conveyor 2 pairs of substrate reversing unit extends around the rotation axis of the substrate reversing unit to respective ends of the turning radius, the two pairs of belt conveyors substrate reversing unit substrate can for loading and unloading the Preferably there is. The belt conveyor of the substrate reversing unit is extended by extending the belt conveyor to each end of the rotation radius around the rotation axis of the substrate reversing unit (extending the belt conveyor from end to end along the diameter of rotation of the substrate reversing unit). Can be used not only to hold the substrate when reversing, but also to carry the substrate into and out of the apparatus.

In another aspect of the present invention, the substrate is supported so that the first and second surfaces of the substrate are exposed, and the substrate reversing unit is configured to rotate the substrate about the rotation axis, and above the substrate reversing unit. In this method, the substrate is marked by a device having a marking unit that is disposed at least at a rotational radius from the rotation axis of the substrate reversing unit and that emits laser light. The method includes the following steps.
(A1) Loading (loading) the substrate into the substrate reversing unit (step of loading the substrate).
(A2) With the substrate held by the substrate reversing unit, one of the first and second surfaces of the substrate faces upward to face the marking unit (step of facing one surface to the marking unit) .
(A3) A laser beam capable of adjusting the focal length is irradiated from the marking unit while holding the substrate on the substrate reversing unit, and the laser beam is two-dimensionally scanned on one surface of the substrate, thereby causing one surface of the substrate to be scanned. Marking (marking on one side).
(A4) With the substrate held by the substrate reversing unit, the other one of the first and second surfaces of the substrate faces upward to face the marking unit (step of facing the other surface to the marking unit). .
(A5) A laser beam capable of adjusting the focal length is irradiated from the marking unit in a state where the substrate is held on the substrate reversing unit, and the other surface of the substrate is scanned two-dimensionally by the laser beam on the other surface of the substrate. Marking (the process of marking on the other side).
(A6) Unloading the substrate from the substrate inversion unit (step of unloading the substrate).

  According to this method, the process of marking on the substrate with a laser beam can be performed in a shorter time than before.

When the substrate reversing unit includes two pairs of belt conveyors that support the left and right edges of the first and second surfaces of the substrate facing each other along the rotation axis, the method further includes the following steps: It is preferable to contain.
(B1) Following the marking on one surface (step (a3)), the substrate is moved by two pairs of belt conveyors so that the unprocessed area on one surface of the substrate falls within the laser beam scanning range. (Step of moving the substrate so that the unprocessed area on one surface falls within the scanning range of the laser beam).
(B2) After moving the substrate so that the unprocessed area on one surface falls within the laser beam scanning range (step (b1)), the unprocessed area on one surface of the substrate is marked with the laser beam. (Marking the untreated area on one side).
(B3) Following the marking on the other surface (step (a5)), the substrate is moved by two pairs of belt conveyors so that the unprocessed area on the other surface of the substrate falls within the laser beam scanning range. (The step of moving the substrate so that the unprocessed area on the other surface falls within the scanning range of the laser beam).
(B4) After moving the substrate so that the unprocessed area on the other side falls within the laser beam scanning range (step (b3)), the unprocessed area on the other side of the substrate is marked with the laser beam. (Marking the untreated area on the other side).

That is, still another aspect of the present invention is a substrate reversing unit that supports a substrate so that the first and second surfaces of the substrate are exposed, and rotates the substrate about a rotation axis. a substrate reversing unit comprising two pairs of belt conveyors supporting the first and second surfaces edge of each of the right and left, above the substrate reversing unit, disposed at least apart position the rotation radius from the axis of rotation of the substrate reversing unit In this method, the substrate is marked with an apparatus having a marking unit that emits laser light. The method includes the following steps.
(C1) Loading (loading) the substrate into the substrate reversing unit (step of loading the substrate).
(C2) One surface of the first and second surfaces of the substrate is faced upward to face the marking unit (step of facing one surface to the marking unit).
(C3) Marking on one surface of the substrate by irradiating laser light capable of adjusting the focal length from the marking unit and scanning the laser light on one surface of the substrate in two dimensions (marking on one surface) Process).
(C4) The substrate is moved by two pairs of belt conveyors so that the unprocessed area on one side of the substrate falls within the scanning range of the laser beam (the unprocessed area on one side enters the scanning range of the laser beam. The step of moving the substrate so that.
(C5) Marking an unprocessed region on one surface of the substrate with a laser beam (a step of marking an unprocessed region on one surface).
(C6) The other surface of the first and second surfaces of the substrate is faced upward to face the marking unit (step of facing the other surface to the marking unit).
(C7) Marking the other surface of the substrate by marking the other surface of the substrate by irradiating a laser beam whose focal length can be adjusted from the marking unit and scanning the other surface of the substrate with the laser beam (marking on the other surface) Process).
(C8) The substrate is moved by two pairs of belt conveyors so that the unprocessed area on the other surface of the substrate falls within the laser beam scanning range (the unprocessed area on the other surface enters the laser beam scanning range. The step of moving the substrate so that.
(C9) Marking an unprocessed area on the other surface of the substrate with a laser beam (a step of marking an unprocessed area on the other surface).
(C10) Unloading the substrate from the substrate reversing unit (step of unloading the substrate).

  According to this method, it is possible to mark a range wider than the scanning range of the laser light.

The front view which shows the substrate processing apparatus concerning one Embodiment of this invention. The right view which shows the substrate processing apparatus of FIG. Sectional drawing cut | disconnected and shown partially along the III-III line in FIG. The flowchart for demonstrating an example of the marking method of this invention. The flowchart for demonstrating the other example of the marking method of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a substrate processing apparatus according to an embodiment of the present invention (a direction orthogonal to a direction A in which a substrate is loaded / unloaded). FIG. 2 is a right side view of the substrate processing apparatus of FIG. FIG. 3 shows a cross-sectional view partially cut along the line III-III in FIG. In FIGS. 1 and 3, the region indicated by the alternate long and short dash line X indicates a region where the laser beam can be irradiated (laser beam scanning range). 2 and 3, the region indicated by the alternate long and short dash line Y indicates the rotation range of the substrate rotation unit (specifically, the support member) provided in the substrate processing apparatus.

  The substrate processing apparatus 1 of this example is an apparatus having a function of marking on a substrate 90 with a laser beam. For example, characters and bars on the substrate 90 (surface: surface, first surface, and second surface). It is used when printing codes and the like. Moreover, the substrate processing apparatus 1 of this example can be used not only for surface processing but also for cutting processing such as drilling and cutting for a relatively thin substrate 90.

  The substrate processing apparatus 1 includes a substrate rotating unit 2, a marking unit 3, and a control unit 4 for controlling them. The substrate rotation unit 2 supports the substrate 90 so that the first surface (front surface, right side) and the second surface (back surface, reverse side) of the substrate 90 are exposed, and the substrate 90 is centered on the rotation shaft 5. Is a unit that can turn the front and back surfaces of the substrate 90 upward. The marking unit 3 is a unit that marks the first surface and the second surface of the substrate 90 by two-dimensionally scanning a laser beam whose focal length can be adjusted. The marking unit 3 is disposed above the substrate rotation unit 2 and at a position at least spaced from the rotation axis 5 of the substrate rotation unit 2. That is, the marking unit 3 is disposed outside the rotation range Y of the substrate rotation unit 2. In addition, the substrate rotation unit 2 of this example is for reversing the substrate 90 by rotating (reversing) the substrate 90 forward and backward by 180 degrees, for example. Hereinafter, the substrate rotating unit 2 is referred to as a substrate reversing unit.

  Specifically, the substrate reversing unit 2 supports the edges of the front surface 91 and the back surface 92 of the substrate 90 facing each other along the rotation axis 5, that is, the left and right edges 93La, 93Lb, 93Ra, and 93Rb in FIG. A pair of belt conveyors 11La, 11Lb, 11Ra, and 11Rb, a motor 12L for driving the belt conveyors 11La and 11Lb in synchronization, and a motor 12R for driving the belt conveyors 11Ra and 11Rb in synchronization are provided. The substrate reversing unit 2 is further positioned on the right side with a pair of upper and lower belt conveyors (ie, a pair of belt conveyors 11La and 11Lb located on the left side) of the two pairs of belt conveyors 11La, 11Lb, 11Ra and 11Rb. A pair of left and right support members (support plates, frames) 13L and 13R for supporting the pair of belt conveyors 11Ra and 11Rb) are provided. The substrate reversing unit 2 further includes a plurality of slide shafts 14a that connect the pair of support members 13L and 13R so that the distance along the rotation axis 5 of the support members 13L and 13R, that is, the left and right widths can be adjusted. , 14b, 14c and 14d. The substrate reversing unit 2 includes a rotation driving unit (reversing driving unit) 15 that rotates one support member 13R of the pair of support members 13L and 13R about the rotation shaft 5.

  Of the four belt conveyors 11La, 11Lb, 11Ra, and 11Rb of the substrate reversing unit 2, the belt conveyors 11La and 11Lb support the left edges 93La and 93Lb of the substrate 90 so as to be sandwiched therebetween. Further, the belt conveyors 11Ra and 11Rb support the right edges 93Ra and 93Rb of the substrate 90 so as to be sandwiched therebetween. Therefore, the substrate 90 is supported in a stable state by these belt conveyors 11La to 11Rb even when the front surface 91 faces upward or the back surface 92 faces upward. Furthermore, also when the board | substrate 90 reverse | inverts (turns 180 degree | times), the board | substrate 90 is supported in the stable state by these belt conveyors 11La-11Rb. Further, these belt conveyors 11La to 11Rb only support the edge of the substrate 90, and the surface (area) of the substrate 90 that requires laser marking is not interfered with the belt conveyors 11La to 11Rb.

  The two support members (frames) 13 </ b> L and 13 </ b> R have a symmetric shape and are disposed so as to face each other along the rotation axis 5. In this example, the two support members 13L and 13R are each within the rotation radius region Y of the substrate reversing unit 2 and have a size that does not interfere with the marking unit 3 when rotated. The shape and size have a portion protruding outside the scanning range X of the laser beam. The two upper and lower belt conveyors 11La and 11Lb corresponding to the left edge of the substrate 90 are supported by a support member 13L located on the left side. The two upper and lower belt conveyors 11Ra and 11Rb corresponding to the right edge of the substrate 90 are supported by a support member 13R located on the right side.

  The two support members 13L and 13R extend to the periphery of the rotation radius region Y, and the four belt conveyors 11La, 11Lb, 11Ra, and 11Rb each have a rotation radius around the rotation shaft 5. Each edge extends to the vicinity of the boundary portion of the region Y. These belt conveyors 11La, 11Lb, 11Ra, and 11Rb not only support the substrate 90 when rotating or marking with a laser, but also carry the substrate 90 into the apparatus 1, that is, the substrate reversing unit 2 (loading). ) And a conveying means for carrying out (unloading) from the apparatus 1.

  An arrow A in FIG. 3 indicates the direction of loading and unloading of the substrate 90. In this substrate processing apparatus 1, the substrate 90 is loaded from one side (in this example, the front side in FIG. 1 and the right side in FIGS. 2 and 3), marked on the front surface 91 and the back surface 92, and then loaded on one side. To unload. The substrate 90 may have the back surface 92 on top, or may be further inverted so that the front surface 91 is on top. The substrate 90 may be loaded from the other side (the back side in FIG. 1 and the left side in FIGS. 2 and 3) and unloaded in the same direction (the other side). Then, the substrate 90 may be moved in one direction so as to unload to the other.

  Furthermore, these belt conveyors 11La, 11Lb, 11Ra, and 11Rb slide the substrate 90 (for example, in the depth direction of FIG. 1, FIGS. 2 and 3) when it is desired to perform marking processing in a range wider than the scanning range X of the laser beam. Can be made to slide along the left and right directions. For example, when the size of the substrate 90 is 200 × 400 mm and the irradiation range of the marking unit 3 is 300 mm square, the 300 × 200 mm square of the substrate 90 is first scanned by the marking unit 3 to record information. Thereafter, the left and right belt conveyors 11La, 11Lb, 11Ra, and 11Rb move about 100 mm, and the remaining area of the substrate 90 is scanned by the marking unit 3 to record information.

  The left and right and upper and lower belt conveyors 11La, 11Lb and 11Ra, 11Rb are rotated in synchronization by the motors 12L and 12R, and can move without skewing the substrate 90. These belt conveyors 11La, 11Lb, 11Ra, and 11Rb can be driven by one motor, and can also be driven by different motors.

  The two left and right support members 13L and 13R have a plurality of, in this example, four slide shafts 14a, 14b, 14c, and 14d along the slide shafts 14a to 14d so that the left and right widths thereof can be adjusted. Are connected to slide. In the example shown in FIG. 1, the right support member 13R is installed at the limit of the scanning range X of the laser beam, and the left support member 13L is slid to absorb the difference in the width of the substrate 90. The positions of the left and right support members 13L and 13R can be controlled so that the substrate 90 is set to the center of the scanning range X of the laser beam.

  Specifically, the four slide shafts 14a pass through two rotationally symmetrical positions of the portions of the four support members 13L and 13R that protrude outside the scanning range X of the laser beam of the marking unit 3. , 14b, 14c, and 14d are provided. Therefore, the four slide shafts 14 a, 14 b, 14 c and 14 d are arranged so as to be symmetric with respect to the rotation shaft 5. The four slide shafts 14a, 14b, 14c, and 14d are positions that fall within the range Y of the radius of rotation of the substrate reversing unit 2, and each of the front surface 91 and the rear surface 92 of the substrate 90 faces upward. The marking unit 3 is disposed at a position outside the scanning range X of the laser beam.

  The left and right ends of the slide shafts 14a, 14b, 14c and 14d are fixed to the left and right outer frames 16L and 16R. The right outer frame 16R is connected to the drive unit 15 mounted on the support base 18 by a shaft 18a. The left outer frame 16L is rotatably supported by a bearing 17b mounted on the support base 17 via a shaft 17a. Therefore, when the drive unit 15 rotates the outer frame 16R around the rotation shaft 5 by an actuator such as a motor or a cylinder, the support members 13L and 13R supported by the outer frames 16R and 16L, and further the support members 13L and 13R. The substrate 90 supported by the substrate rotates about the rotation shaft 5.

  In the substrate reversing unit 2, the distance between the belt conveyors 11La and 11Lb and the belt conveyors 11Ra and 11Rb can be adjusted by adjusting the distance (left and right width) along the rotation axis 5 of the support members 13L and 13R. it can. For this reason, even if the size of the substrate 90 to be marked changes, it can be adjusted to the width of the substrate 90 to be processed. Further, the position can be adjusted by moving the substrate 90 in the direction of the belt conveyor by the belt conveyors 11La to 11Rb. Therefore, when the substrate 90 has a planar rectangular shape, typically, in the substrate reversing unit 2, it is desirable to hold the edge of the long side of the substrate 90 by the belt conveyors 11La to 11Rb.

  In the substrate reversing unit 2 of this example, the right outer frame 16R is rotated around the rotating shaft 5 by the drive unit 15 via the shaft 18a. As a result, the right support member 13R rotates, and the left support member 13L rotates in synchronization with the right support member 13R via the four slide shafts 14a, 14b, 14c, and 14d. By arranging the four slide shafts 14a, 14b, 14c, and 14d symmetrically with respect to the rotation shaft 5, the support members 13R and 13L including the substrate 90 can be reversed in a well-balanced manner. Therefore, it is not necessary to separately provide a drive shaft for rotating the left and right support members 13L and 13R in synchronization, and the substrate reversing unit 2 can be compactly assembled.

  The marking unit 3 disposed above the substrate reversing unit 2 performs marking on the substrate 90 by two-dimensional scanning with laser light. The marking unit 3 has a focal length function for adjusting the distance to the laser spot. The focal length can be adjusted by controlling the beam diameter of the laser light, for example. Therefore, for example, a character, a figure, or the like can be printed or processed by focusing the laser beam without moving the marking unit 3 and the substrate 90 relative to any place on a plane of 300 mm square. . Therefore, the substrate reversing unit 2 can mark a desired place on the substrate 90 without having a function as an XY table for moving the substrate 90 in a two-dimensional direction.

  As such a marking unit 3, for example, a laser processing data generation device disclosed in Japanese Patent Application Laid-Open No. 2008-68309 can be used. The marking unit 3 is not limited to this as long as the marking unit 3 can be marked on the substrate 90 by two-dimensional scanning with a laser beam whose focal length can be adjusted.

  The control unit 4 includes resources such as a microcomputer that can execute a program, and controls the entire apparatus 1 including the substrate reversing unit 2 and the marking unit 3 according to a predetermined program. The control unit 4 includes a load / unload function 21, a marking function 22, a substrate inversion function 23, and a substrate feed function 24, which are realized by hardware resources such as a microcomputer and software resources.

  The load / unload function 21 is a function for loading and unloading the substrate 90 on the apparatus 1 by the belt conveyors 11La to 11Rb. The substrate reversing function 23 is a function for reversing the substrate 90 by the substrate reversing unit 2. The marking function 22 is a function of marking on the substrate 90 by the marking unit 3. The substrate feed function 24 refers to the belt conveyor 11La so that after the substrate 90 has been subjected to the marking process and there is an unprocessed area on the surface of the substrate 90, the unprocessed area falls within the laser beam scanning range X. This is a function of moving the substrate 90 by ~ 11Rb.

  FIG. 4 shows a flowchart for explaining an example of the marking method of the present invention. FIG. 4 shows an example of a movement for marking a desired position on both sides of the substrate 90 using the substrate processing apparatus 1.

  Prior to the processing, at least one of the support members 13L and 13R is moved along the slide shafts 14a to 14d, and the interval between the support members 13L and 13R is set to an interval corresponding to the width of the substrate 90. In step 101, the substrate 90 is loaded into the substrate reversing unit 2 using the belt conveyors 11La to 11Rb with one of the front surface and the back surface of the substrate 90 (referred to as the front surface in this example) facing upward. ) Then, the first surface (for example, the surface) 91 of the substrate 90 is opposed to the marking unit 3.

  Next, in step 102, the substrate 90 is held (supported) by the substrate reversing unit 2, and the laser light capable of adjusting the focal length is irradiated from the marking unit 3, and the surface 91 of the substrate 90 is two-dimensionally irradiated with the laser light. By scanning, a desired mark is formed on the surface of the substrate 90 (marking).

  In step 103, the substrate 90 is reversed by the substrate reversing unit 2. As a result, the second surface (back surface in this example) 92 of the substrate 90 faces upward, and the back surface 92 faces the marking unit 3. In step 104, the substrate 90 is held (supported) by the substrate reversing unit 2, and the laser light capable of adjusting the focal length is irradiated from the marking unit 3, and the back surface 92 of the substrate 90 is two-dimensionally scanned by the laser light. Thus, a desired mark is formed on the back surface 92 of the substrate 90 (marking).

  In step 105, the substrate 90 is unloaded from the substrate inversion unit 2 using the belt conveyors 11La to 11Rb. In step 106, if there is a substrate 90 that needs to be processed next, the process returns to step 101. If there is no substrate 90 that requires processing, the processing ends.

  FIG. 5 shows a flowchart for explaining another example of the marking method of the present invention. Even when the portion (area) of the substrate 90 that needs to be marked is larger than the scanning range X of the laser beam, it is possible to mark the desired positions on both sides of the substrate 90.

  Similar to the above, prior to processing, the interval between the support members 13L and 13R is set to an interval corresponding to the width of the substrate 90. In step 111, as in step 101, the substrate 90 is loaded (loaded) into the substrate reversing unit 2. Then, one surface (surface in this example) of the substrate 90 is opposed to the marking unit 3.

  Next, in step 112, similarly to step 102, an area corresponding to the scanning range X of the laser beam on the surface of the substrate 90 is marked. Subsequently, in step 113, the substrate 90 is moved (sent) by the belt conveyors 11La to 11Rb so that the unprocessed area on the surface of the substrate 90 enters the scanning range X of the laser beam. In step 114, an unprocessed area on the surface of the substrate 90 is marked.

  In step 115, the substrate 90 is reversed by the substrate reversing unit 2. As a result, the other surface of the substrate 90, in this example, the back surface faces upward, and the back surface faces the marking unit 3. In step 116, as in step 104, the region corresponding to the scanning range X of the laser beam on the back surface of the substrate 90 is marked. Subsequently, in step 117, the substrate 90 is moved (sent) by the belt conveyors 11La to 11Rb so that the unprocessed area on the back surface of the substrate 90 enters the scanning range X of the laser beam. In step 118, the unprocessed area on the back surface of the substrate 90 is marked.

  In step 119, similarly to step 105, the substrate 90 is unloaded from the substrate reversing unit 2 using the belt conveyors 11La to 11Rb. In step 120, if there is a substrate 90 that needs to be processed next, the process returns to step 111. If there is no substrate 90 that requires processing, the processing ends.

  As described above, according to the substrate processing apparatus 1 and the marking method using the same, the substrate 90 can be inverted below the marking unit 3, so that it is possible to omit the time for translation in order to invert the substrate 90. For this reason, the time required for the marking process can be shortened.

  Moreover, according to the substrate processing apparatus 1, the substrate rotation unit 2 and the marking unit 3 can be arranged in the vertical direction (vertical direction). Therefore, the size in the horizontal direction can be reduced to the same size as the substrate 90 or slightly larger. Therefore, the substrate processing apparatus 1 has a small installation area and can be easily incorporated into a substrate production line.

  Further, even if the substrate processing apparatus 1 is compact, the left and right widths of the support members 13L and 13R are adjusted by the slide shafts 14a to 14d arranged so as to avoid interference with the laser beam, or the belt conveyor 11La. A mark can be formed in two stages by sending the substrate 90 by ~ 11Rb. Therefore, the substrate processing apparatus 1 can satisfactorily form marks on the substrates 90 having different lengths and widths in a short time.

  Further, according to the substrate processing apparatus 1, the belt conveyors 11La, 11Lb, 11Ra, and 11Rb each extend to the respective ends of the rotation radius around the rotation axis 5 of the substrate rotation unit 2, and therefore these belt conveyors. The substrate 90 can be loaded into the apparatus 1 or unloaded from the apparatus 1 using 11La, 11Lb, 11Ra, and 11Rb. According to this substrate processing apparatus 1, a conveying means for loading and unloading the substrate 90 may be separately prepared. Typically, however, in addition to the belt conveyors 11La, 11Lb, 11Ra, and 11Rb, No transport means for loading and unloading 90 is required.

  The substrate processing apparatus of the present invention is an apparatus having a function of marking (applying a mark) on a substrate with a laser beam, and may perform only marking, or other than marking on a substrate with a laser beam or the like. A function for performing other processing may be included.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate inversion unit (substrate rotation unit), 3 Marking unit 11La, 11Lb, 11Ra, 11Rb Belt conveyor 13L, 13R Support member 14a, 14b, 14c, 14d Slide shaft 15 Rotation drive unit

Claims (5)

The substrate is supported so that the first and second surfaces of the substrate are exposed, respectively, and the substrate is rotated 180 degrees about the rotation axis so that each of the first and second surfaces of the substrate is moved upward. A substrate reversing unit that can be directed to
Above the substrate reversing unit, from the axis of rotation of the substrate reversing unit, the substrate reversing unit is a marking unit that is fixed to at least spaced positions a turning radius needed to reverse while holding the substrate, A marking unit that performs marking on the substrate by two-dimensionally scanning a laser beam with adjustable focal length ;
The substrate reversing unit is
Two pairs of belt conveyors that support edges of each of the first and second surfaces of the substrate facing each other along the rotation axis;
A pair of support members that respectively support a pair of upper and lower belt conveyors of the two pairs of belt conveyors and face each other along the rotation axis;
A motor attached to each of the pair of support members, each driving a left and right belt conveyor of the two pairs of belt conveyors;
A plurality of slide shafts that connect the pair of support members so that the distance between the pair of support members along the rotation shaft at positions away from the belt conveyor can be adjusted;
The plurality of slide shafts are located within the rotation radius with respect to the rotation axis, and are directed upward at the first and second surfaces of the substrate at positions 180 degrees symmetrical about the rotation axis. A substrate processing apparatus disposed so as to be out of a scanning range of the laser beam of the marking unit when laid . 2. The substrate reversing unit according to claim 1 , further comprising: a rotation drive unit that rotates one support member of the pair of support members about the rotation axis. The other support member is a substrate processing apparatus that rotates following the one support member via the plurality of slide shafts. 3. The substrate reversing unit according to claim 1 , wherein the two pairs of belt conveyors of the substrate reversing unit extend to respective ends of the rotation radius with the rotation axis as a center. A substrate processing apparatus capable of loading and unloading the substrate. First and second surfaces of the substrate to support the substrate to expose each said substrate, and the substrate reversing unit rotating 180 degrees about an axis of rotation, above the substrate reversing unit, the substrate inverting A method of marking the substrate by an apparatus having a marking unit that is fixed at least at a position away from the rotation axis of the unit and that irradiates a laser beam.
The substrate reversing unit includes two pairs of belt conveyors that support edges facing each other along the rotation axis of each of the first and second surfaces of the substrate, and one pair of upper and lower pairs of the two pairs of belt conveyors. A pair of support members that respectively support the belt conveyors and face each other along the rotation axis, and a motor attached to each of the pair of support members, the left and right of the two pairs of belt conveyors And a plurality of slide shafts that connect the pair of support members so that the distance between the pair of support members along the rotation axis can be adjusted at a position away from the belt conveyor. The plurality of slide shafts are within the rotation radius with respect to the rotation axis and are symmetric with respect to the first and second surfaces of the substrate at positions 180 degrees around the rotation axis. Les wherein are arranged so as to be outside the scanning range of the laser beam of the marking unit when allowed suited upwardly,
The method is
Carrying the substrate into the substrate reversing unit;
With the substrate reversing unit holding the substrate, facing one of the first and second surfaces of the substrate upward and facing the marking unit;
By irradiating a laser beam whose focal length can be adjusted from the marking unit while holding the substrate on the substrate reversing unit, the laser beam is two-dimensionally scanned on the one surface of the substrate, thereby Marking the one side;
Holding the substrate in the substrate reversing unit , facing the marking unit with the other one of the first and second surfaces of the substrate facing upward,
By irradiating the laser light from the marking unit while holding the substrate on the substrate reversing unit, and causing the laser light to be two-dimensionally scanned on the other surface of the substrate, the other surface of the substrate is scanned. Marking,
Unloading the substrate from the substrate reversing unit. In claim 4,
Following the marking on the one surface, moving the substrate by the two pairs of belt conveyors such that an unprocessed area of the one surface of the substrate falls within the scanning range of the laser beam;
Marking the unprocessed area of the one surface of the substrate with the laser beam;
Following the marking on the other side, moving the substrate by the two pairs of belt conveyors so that the unprocessed area of the other side of the substrate falls within the scanning range of the laser beam;
Marking the unprocessed area of the other surface of the substrate with the laser light.

Images