JP3463282B2 - Laser processing apparatus and processing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus and a processing method, and more particularly to a laser processing apparatus capable of laser processing a surface of an object to be processed which is larger than an area which can be irradiated by scanning a laser beam. Regarding processing method.

[0002]

2. Description of the Related Art Conventionally, when a laser beam is used to perforate a green sheet (ceramic sheet before sintering), the green sheet wound on a roll is cut and cut.
It was placed on the Y stage. A hole is drilled by irradiating the surface of the green sheet placed on the XY stage with a laser beam. By swinging the optical axis of the laser beam using a galvano scanner, it is possible to irradiate the laser beam on a partial region of the surface of the green sheet. When the processing within the scannable area with the galvano scanner is completed, by driving the XY stage,
Laser processing in the unprocessed area can be performed.

[0003]

There is a demand for a technique for performing laser processing in a state of being wound on a roll without cutting a green sheet. Generally, TAB (Tape Automat)
When making a hole in a film carrier tape used in the ed bonding method, the processing is performed without cutting the tape wound on a roll. Hereinafter, a method for punching a film carrier tape will be described.

First, the film carrier tape fed from the roll is adsorbed and fixed on the XY stage. X
By driving the Y stage, it is possible to perform punching at a desired position on the film carrier tape. Since the film carrier tape is highly flexible, the XY stage can be moved in the length direction and the width direction of the tape while the roll is fixed.

However, the green sheet is less flexible than the film carrier tape. In particular, the green sheet has low flexibility in the width direction. For this reason,
It is difficult to move the XY stage in the width direction of the green sheet with the green sheet unrolled from the roll adsorbed on the XY stage.

An object of the present invention is to provide a laser processing apparatus and a processing method capable of performing laser processing in a state in which a sheet having low flexibility is fed from a roll without being cut.

[0007]

According to one aspect of the present invention, there is provided a stage for holding an object to be processed such that its surface is parallel to the XY plane, and for translating the object in the X direction. At least two condensing optical systems for condensing a laser beam on the surface of the object to be processed held on the stage, wherein An irradiable area is defined, and each of the focusing optical systems irradiates the laser beam to an arbitrary position within the irradiable area corresponding to the focusing optical system by shaking the optical axis of the laser beam. And the two irradiable regions corresponding to the two condensing optical systems are
Laser processing apparatus having a converging optical system that is disposed at a first distance in the direction and is in contact with each other in the Y direction, or is disposed at a second distance that is shorter than the first distance. Will be provided.

Since at least two irradiable areas are in contact with each other in the Y direction or are arranged apart from each other by a second distance shorter than the first distance, it is possible to move the workpiece in the Y direction. , It is possible to process a region that cannot be processed in one irradiation possible region in the Y direction.

According to another aspect of the present invention, the object to be processed is held so that its surface is parallel to the XY plane, and the first condensing optical system is provided in a partial region of the surface of the object to be processed. A first step of performing laser processing by irradiating a laser beam using a system, a second step of translationally moving the object to be processed in the X direction, and a region laser-processed in the first step,
Laser processing having a third step of performing laser processing by irradiating a laser beam with a second condensing optical system different from the first condensing optical system in a region adjacent to or close to the Y direction. A method is provided.

It is possible to process a large area in the Y direction that cannot be processed by only one condensing optical system without moving the object to be processed in the Y direction.

According to another aspect of the present invention, an XY stage capable of holding an object to be processed on a movable portion and moving the movable portion in a two-dimensional direction parallel to an XY plane, and the movable portion. A laser optical system for condensing a laser beam on the surface of the object to be processed held above, and a roll attached to the movable part of the XY stage, around which a band-shaped object is wound, with its rotation axis as the center. There is provided a laser processing apparatus having a supply roll which is rotatably held and a winding roll which is attached to a movable part of the XY stage and winds up a laser-processed object.

Since the roll around which the object to be processed is placed on the moving part of the XY stage, the object to be processed can be moved in the Y direction without being deformed in the width direction. . Thereby, a large area can be processed in the Y direction.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser processing apparatus according to a first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows a schematic view of a laser processing apparatus according to the first embodiment. A table 2 capable of translating the movable portion 2a in a one-dimensional direction is mounted on the base 1. The vacuum chuck 3 is attached on the movable portion 2a. The vacuum chuck 3 adsorbs and fixes the green sheet 10a on its upper surface. Vacuum chuck 3
An XY orthogonal coordinate system in which a plane parallel to the suction surface of is the XY plane and the moving direction of the movable portion 2a is the X axis is introduced.

The green sheet 10 is fed from the supply roll 11. The central axis (rotational axis) of the supply roll 11 is
It is parallel to the Y axis. The green sheet 10 fed from the supply roll 11 is guided to the suction surface of the vacuum chuck 3 via the rollers 12 and 13. The green sheet that has passed over the suction surface is wound around the winding roll 16 via the rollers 14 and 15. When the green sheet 10 is wound up, the moving direction of the green sheet 10a on the suction surface is defined as the positive X direction. The central axis (rotational axis) of the winding roll 16 is also parallel to the Y axis. The rollers 13 and 14 are attached to the movable portion 2a. The supply roll 11, the rollers 12, 15 and the winding roll 16 are attached to the base 1.

The rollers 13 and 14 feed the green sheet 10a between them in the X direction and adjust the tension applied to the green sheet 10a. Roller 12
Between 13 and 13 and between rollers 14 and 15
The green sheet 10 is loose. Because of this slack,
With the green sheet 10 adsorbed to the vacuum chuck 3, the movable portion 2a can be freely translated in a certain range in the X direction.

The laser optical system 20A is provided on the surface of the green sheet 10a fixed on the suction surface of the vacuum chuck 3.
Two pulse laser beams are irradiated at the same time. Similarly,
Another laser optical system 20B is applied to the surface of the green sheet 10a fixed on the suction surface of the vacuum chuck 3 at the same time.
The book is irradiated with a pulsed laser beam. The configuration of the laser optical system 20A will be described below. Laser optical system 20B
Since the configuration of is similar to the configuration of the laser optical system 20A,
The description is omitted.

A pulsed laser beam is emitted from the laser light source 21. The laser light source 21 is, for example, a CO ₂ gas laser oscillator, and emits a laser beam in the infrared region.
As the laser light source 21, a laser light source in the ultraviolet region that emits a harmonic of an Nd: YAG laser may be used.

The pulsed laser beam emitted from the laser light source 21 is relay lens 22, folding mirror 23,
The light enters the half mirror 26 through the mask 24 and the relay lens 25. The mask 24 shapes the beam cross section of the laser beam. The pulse laser beam reflected by the half mirror 26 is incident on the galvano scanner 28, and the pulse laser beam transmitted by the half mirror 26 is reflected by the folding mirror 27 and is incident on another galvano scanner 29. The Galvano scanners 28 and 29 swing the optical axis of the laser beam in the two-dimensional direction.

The laser beam whose optical axis is swung by the galvano scanner 28 is converged by the condensing optical system 30 and scanned within a certain area on the surface of the green sheet 10a. The laser beam whose optical axis is swung by the galvano scanner 29 is converged by the condensing optical system 31 and scans another area on the surface of the green sheet 10a. The condensing optical systems 30 and 31 are composed of, for example, fθ lenses. 2 of laser optical system 20B
One condensing optical system scans in another area on the surface of the green sheet 10a.

The position detector 60 is the green sheet 10a.
The position of a predetermined hole is detected from among the plurality of holes formed in. The galvano scanner controller 61 uses the position detector 60.
Galvano scanner 2 based on the position information detected by
The two galvano scanners 8 and 29 and the laser optical system 20B are driven.

FIG. 2A shows the arrangement in the XY plane of the region where the laser beam can be irradiated by each condensing optical system. The condensing optical systems 30 and 31 of the laser optical system 20A irradiate a laser beam to arbitrary points in the laser irradiable regions 35a and 35b, respectively. The two focusing optical systems of the laser optical system 20B irradiate the laser beam to arbitrary points in the laser irradiable regions 35c and 35d, respectively.

The irradiable regions 35a to 35d are arranged at a distance from each other in the X direction. Also,
Regarding the Y direction, the irradiation areas 35a that have been moved in parallel are arranged so that the irradiation areas 35a and 35b are in contact with each other, that is, when the irradiation area 35a is translated in the X direction.
Are arranged in contact with the irradiation region 35b. The same applies to the positional relationship of the irradiation regions 35b to 35d in the Y direction.

FIG. 2B shows the positional relationship between the condensing optical system 30 and the irradiation possible area 35a in the XY plane. The use of the vicinity of the peripheral portion of the fθ lens forming the condensing optical system 30 causes various aberrations to increase, and therefore it is not preferable to use the vicinity of the peripheral portion of the fθ lens. Therefore, the irradiable area 35a is preferably a square area excluding the vicinity of the peripheral portion of the condensing optical system 30.

Since the condensing optical system 30 protrudes from the irradiation area 35a, the irradiation area 35 shown in FIG.
It is not possible to arrange a and 35b so that they contact each other. By arranging the irradiable regions 35a and 35b apart from each other in the X direction, they can be arranged so that they contact each other in the Y direction. Alternatively, as compared with the case where the irradiation-enabled regions 35a and 35b are arranged so that the positions in the X direction are the same, the distance between the two in the Y direction can be narrowed.

Next, a method of making a hole in the green sheet by using the laser processing apparatus shown in FIGS. 1 and 2 will be described.

First, the green sheet 10 fed from the supply roll 11 is adsorbed and fixed on the adsorption surface of the vacuum chuck 3. The surface of the green sheet 10a fixed on the suction surface of the vacuum chuck 3 is irradiated with a laser beam by the laser optical systems 20A and 20B to perform punching. By swinging the optical axis of the laser beam with the Galvano scanners 28, 29, etc., it is possible to make a hole at a predetermined position in the irradiation possible areas 35a to 35d shown in FIG.

The movable portion 2a is moved in the positive direction of the X direction by the length of each of the irradiable regions 35a to 35d in the X direction. Drilling is performed by performing laser irradiation. By repeatedly performing the laser irradiation and the movement of the movable portion 2a, it is possible to perform the boring process at an arbitrary position within a region of a certain length continuous in the X direction.

Irradiable areas 35a to 35d are continuously arranged in the Y direction without any gap. Therefore, it is possible to make a hole at an arbitrary position in the Y direction without moving the movable portion 2a in the Y direction. Since the movable portion 2a does not move in the Y direction, the green sheet 1
It is possible to process a sheet having poor flexibility in the width direction as in No. 0.

The irradiable areas 35a to 35d are Y
When they are arranged with a certain gap in the direction, it is possible to process a region other than the strip-shaped region parallel to the X direction corresponding to the gap. Irradiable area 35a
Since ~ 35d are arranged at a certain distance in the X direction, the band-shaped region that cannot be processed can be narrowed.

After the movable part 2a is moved, the green sheet 10 is fed out from the supply roll 11 by a predetermined length so that the slack amount of the green sheet 10 becomes appropriate, and the green sheet 10 is wound on the winding roll 16. Wind up 10 for a predetermined length.

When the drilling is performed up to the region fixed near the negative end of the vacuum chuck 3 in the X direction, the suction of the green sheet 10a is released. X the movable part 2a
The negative direction of the green sheet 10a again.
Adsorb and fix.

As shown in FIG. 3, the green sheet 10a
Irradiable region 35a ₀ processed before releasing the adsorption of
The position of the specific hole 36a inside is detected. This position detection is performed by the position detector 60 shown in FIG.

Laser processing in the next irradiable area 35a ₁ is performed with reference to the position of the specific hole 36a. Specifically, the position information detected by the position detector 60 is sent to the galvano scanner controller 61. The galvano scanner controller 61 controls the galvano scanner 2 based on the position information.
8 and 29 are driven.

Even when the green sheet 10a is de-adsorbed and the green sheet 10a is displaced during re-adsorption, the position of the hole processed before the adsorption is used as a reference,
Since the processing is performed after the re-sucking, it is possible to prevent the relative positions of the holes from being displaced.

Next, with reference to FIG. 4, a laser processing apparatus according to a second embodiment of the present invention will be described.

FIG. 4 shows a schematic view of a laser processing apparatus according to the second embodiment. An XY stage 71 is attached on the base 70. The XY stage 71 is a movable part 71.
It is possible to translate a in the XY plane. Moving part 7
A vacuum chuck 72, a supply roll 73, rollers 74 and 75, and a take-up roll 76 are mounted on the la 1a. The green sheet 10 is delivered from the supply roll 73 and is supplied onto the vacuum chuck 72 via the roller 74. Green sheet 1 that has passed over the vacuum chuck 72
0 is wound around the winding roll 76 via the roller 75. The central axes (rotational axes) of the supply roll 73, the rollers 74 and 75, and the winding roll 76 are parallel to the Y direction.

The laser optical system 20C includes a vacuum chuck 72.
The laser beam is applied to a predetermined area on the surface of the green sheet 10 fixed on the suction surface of the. Laser optical system 2
0C is the laser optical system 20A shown in FIG. 1 to the half mirror 26, the galvano scanner 28, and the condensing optical system 30.
Is the same as the one without.

In the first embodiment, the supply roll 11 and the take-up roll 16 are attached to the base 1, but in the case of the second embodiment, the supply roll 73 and the take-up roll 76.
Is attached to the movable portion 71a. Therefore, the green sheet 10 attracted to the vacuum chuck 72 is
It can be moved freely on the Y plane.

In the case of the second embodiment, since the green sheet 10 can be moved also in the Y direction, it is possible to arrange the irradiable area in the Y sheet in an arbitrary position without continuously arranging it in the Y direction. Irradiation with a laser beam is possible.

The present invention has been described above with reference to the embodiments.
The present invention is not limited to these. For example, it will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

[0042]

As described above, according to the present invention,
Even if the sheet has poor flexibility in the width direction, it is possible to perform laser processing in a state of being unrolled from the roll without being cut into short pieces. Therefore, the processed sheet can be wound into a roll again.

[Brief description of drawings]

FIG. 1 is a schematic view of a laser processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view showing an arrangement of laser irradiable regions of the laser processing apparatus according to the first embodiment, and a plan view showing a positional relationship between the laser irradiable regions and a focusing optical system.

FIG. 3 is a plan view of a processing portion for explaining a method of positioning a laser irradiable region when performing laser processing using the laser processing apparatus according to the first embodiment.

FIG. 4 is a schematic view of a laser processing apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

1,70 base 2 stages 3,72 Vacuum chuck 10, 10a green sheet 11,73 supply roll 12, 13, 14, 15, 74, 75 rollers 16,76 Winding roll 20A, 20B, 20C laser optical system 21 Laser light source 22, 25 relay lens 23, 27 folding mirror 24 mask 26 half mirror 28, 29 Galvo Scanner 30, 31 Condensing optical system 35a to 35d Laser beam irradiable region 36a Specific hole 60 position detector 61 Galvano Scanner Controller 71 XY stage

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI B23K 101: 16 B23K 101: 16 (58) Fields investigated (Int.Cl. ⁷ , DB name) B23K 26/00-26/42 B28B 11/00-11/12 B28D 5/00 H05K 3/00

Claims (7)

(57) [Claims] 1. A stage for holding a processing object such that its surface is parallel to the XY plane and translating the processing object in the X direction, and a processing object held on the stage. Of at least two condensing optical systems for condensing a laser beam on the surface of the object, each of the condensing optical systems defining an irradiable region within the surface of the object to be processed. By swinging the optical axis of the laser beam by each of the optical systems, the laser beam can be irradiated to an arbitrary position within the irradiation possible area corresponding to the condensing optical system. Corresponding two irradiable regions are arranged apart from each other by a first distance in the X direction, and are in contact with each other in the Y direction, or separated by a second distance shorter than the first distance. Laser with focusing optics Engineering equipment. 2. The laser processing apparatus according to claim 1, wherein the stage adsorbs the object to be processed and restrains the position of the object to be processed in the Y direction. 3. A processing roll, in which a processing target is wound and is held so that its rotation axis is parallel to the Y direction, and a processing roll is arranged and processed such that the rotation axis is parallel to the Y direction. The laser processing apparatus according to claim 1, further comprising a winding roll that winds up the object. 4. An object to be processed is held so that its surface is parallel to the XY plane, and a laser beam is emitted within a partial region of the surface of the object to be processed using a first focusing optical system. A first step of performing laser processing by irradiating, a second step of translating the object to be processed in the X direction, and an area adjacent to or close to the area laser-processed in the first step in the Y direction. And a third step of performing laser processing by irradiating a laser beam with a second condensing optical system different from the first condensing optical system. 5. The method further comprises a step of fixing the object to be processed to a stage before the first step, and in the second step, the stage is moved in the positive direction of the X direction, A fourth step of moving the object to be processed in the X direction and further releasing the fixation of the object to the stage after the third step; and the stage to the object in the X direction with respect to the object to be processed. The fifth step of moving the workpiece in the negative direction, the sixth step of fixing the workpiece to the stage, and the seventh step of moving the stage in the positive direction of the X direction. The laser processing method according to claim 4, wherein after the step, the procedure is repeated from the first step. 6. The first step further detects the position of the mark machined before releasing the fixation of the object to be machined in the immediately preceding fourth step, and laser machining is performed with the position of the mark as a reference. The laser processing method according to claim 5, which is performed. 7. An XY stage capable of holding an object to be processed on a movable part and moving the movable part in a two-dimensional direction parallel to an XY plane; and an object to be processed held on the movable part. A laser optical system that focuses a laser beam on the surface of an object, and a supply roll that is attached to a movable part of the XY stage and that holds a roll around which a band-shaped object is wound so as to be rotatable about its rotation axis. And a take-up roll that is attached to a movable part of the XY stage and takes up a laser-processed object.