JP2007008995A - Method for producing penetrated hole-formed adhesive sheet and apparatus for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing a penetrated hole-formed adhesive sheet, by which the penetrated holes can surely be formed in the adhesive sheet, and all the penetrated holes can improve the appearance of the adhesive sheet, and to provide an apparatus for producing the adhesive sheet. <P>SOLUTION: This method for producing the penetrated hole-formed adhesive sheet 1, comprising irradiating laser beams on the adhesive sheet 1p (adhesive sheet before the formation of the penetrated holes) prepared by laminating an adhesive layer 12 to a substrate 11 to form the penetrated holes 13 in the adhesive sheet 1p, is characterized by making spaces (for example, the suction holes 21A of a support 2A constituting a suction stage of a suction apparatus 3) having depths of ≥150μm to be made to exist on the surface opposite to a laser beam entrance surface in the whole laser beam-irradiated portion of the adhesive sheet 1p on the irradiation of the laser beams. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for producing a pressure-sensitive adhesive sheet having a through-hole that can prevent or remove air pockets and blisters.

  When the pressure-sensitive adhesive sheet is manually attached to the adherend, air can be trapped between the adherend and the pressure-sensitive adhesive surface, which may impair the appearance of the pressure-sensitive adhesive sheet. Such air pockets are likely to occur particularly when the area of the adhesive sheet is large.

  In addition, resin materials such as acrylic resin, ABS resin, polystyrene resin, and polycarbonate resin may generate gas either by heating or not by heating. When an adhesive sheet is affixed, blisters (bulges) are generated in the adhesive sheet by the gas generated from the adherend.

In order to solve the above problems, Patent Document 1 proposes a pressure-sensitive adhesive sheet in which through holes having a hole diameter of 0.1 to 300 μm are formed at a hole density of 30 to 50,000 holes / 100 cm ² . . According to this pressure-sensitive adhesive sheet, it is possible to prevent air accumulation or blistering of the pressure-sensitive adhesive sheet by drawing air or gas on the pressure-sensitive adhesive side from the through hole to the surface side of the pressure-sensitive adhesive sheet.

  Laser drilling may be used to form the through holes in the pressure-sensitive adhesive sheet. As laser drilling, for example, a multi-layer printed circuit board is generally known. However, in the laser drilling process for a multilayer printed circuit board or the like, since not all layers are normally penetrated, the stage used in the laser drilling process is not considered for the formation of the through hole. Therefore, if a stage as described above is used to form a through hole in an adhesive sheet, the peripheral part of the through hole is damaged by laser light reflection or heat storage on the stage, and an adhesive sheet with a good appearance cannot be obtained. In many cases, a through hole may not be formed.

In Patent Documents 2 and 3, a work is placed on a perforated stage and the work is irradiated with a laser beam while being sucked from a hole in the perforated stage, or a work is placed on a plurality of rollers arranged in parallel. A method of irradiating a workpiece with laser light while sucking from the gaps between the rollers is disclosed, and Patent Document 4 discloses that a fibrous body such as paper is placed on a perforated stage. And a method of irradiating the workpiece with laser light while sucking from the hole of the perforated stage.
International Publication No. 2004/061031 Pamphlet JP-A-8-187586 Japanese Patent Laid-Open No. 2003-164988 Japanese Patent Laid-Open No. 11-267866

  However, even the laser drilling in Patent Document 2 and Patent Document 3 does not completely solve the problems such as laser light reflection and heat storage as described above. It was difficult to improve the appearance of the pressure-sensitive adhesive sheet for the through holes. Further, in the laser drilling process in Patent Document 4, there is a problem that a decomposed product of the fibrous body irradiated with laser light adheres to the peripheral edge portion of the through hole of the adhesive sheet, and an adhesive sheet having a good appearance cannot be obtained. there were.

  The present invention has been made in view of such circumstances, and it is possible to reliably form through holes in the pressure-sensitive adhesive sheet and to improve the appearance of the pressure-sensitive adhesive sheet for all the through-holes. It aims at providing the manufacturing method and manufacturing apparatus of a formation adhesive sheet.

  In order to achieve the above object, first, the present invention provides a through-hole-forming pressure-sensitive adhesive sheet that forms a through-hole in the pressure-sensitive adhesive sheet by irradiating the pressure-sensitive adhesive sheet having at least a base material and a pressure-sensitive adhesive layer with laser light. In the manufacturing method of the above, at the time of laser light irradiation, a space having a depth of 150 μm or more exists on the surface opposite to the laser light incident surface in all portions of the adhesive sheet irradiated with the laser light. A method for producing a formed pressure-sensitive adhesive sheet is provided (claim 1). In this specification, “sheet” includes the concept of film and tape, and “film” includes the concept of sheet and tape.

  In the above invention (invention 1), the presence of a space having a depth of 150 μm or more on the surface opposite to the laser light incident surface of the adhesive sheet ensures that the laser light penetrates the adhesive sheet and reliably forms a through hole. The peripheral portion of the through hole is thermally deformed or melted (hereinafter referred to as “thermal deformation or the like”) by reflecting the laser beam on the surface of the support or storing the heat of the laser beam between the adhesive sheet and the support. It is possible to prevent all the through holes from deteriorating the appearance of the pressure-sensitive adhesive sheet. In addition, the “support” in the present specification refers to the one that supports the adhesive sheet from the opposite surface of the laser light incident surface at the time of laser light irradiation, and may constitute the suction portion of the suction device, It may be placed on the suction part of the suction device, or may be provided regardless of the suction device.

  In the said invention (invention 1), it is preferable to perform attraction | suction from the surface opposite to the laser beam incident surface of the said adhesive sheet at the time of laser beam irradiation (invention 2). According to this invention (invention 2), the heat storage of the laser beam heat between the pressure-sensitive adhesive sheet and the support can be further suppressed, and the pressure-sensitive adhesive layer generated by the laser beam irradiation and the decomposition product of the substrate (Debris) can be removed by suction, and the debris can be effectively prevented from adhering to the peripheral edge portion of the through-hole on the pressure-sensitive adhesive sheet surface.

  In the above inventions (inventions 1 and 2), on the support in which holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions of the adhesive sheet irradiated with the laser beam. You may make it perform laser beam irradiation with respect to the said adhesive sheet (Claim 3).

  In the said invention (invention 3), the said support body may comprise the adsorption | suction part of an attraction | suction apparatus, and the said hole of 150 micrometers or more in depth may become the attraction | suction hole of the attraction | suction apparatus (invention 4). According to this invention (Claim 4), a support separate from the suction device is not required.

  In the above inventions (inventions 1 and 2), continuous voids having holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions of the adhesive sheet irradiated with the laser beam. You may make it perform laser beam irradiation with respect to the said adhesive sheet on the porous support body which has (Claim 5). In this case, it is preferable that the porous support is located on the suction portion of the suction device, and the pressure-sensitive adhesive sheet is sucked through the porous support (Claim 6).

  According to the above invention (invention 5), heat easily escapes from the porous support, and it is possible to effectively prevent the heat of the laser light from being stored between the adhesive sheet and the suction portion of the suction device. In particular, according to the above invention (invention 6), the entire pressure-sensitive adhesive sheet can be sucked to securely fix the pressure-sensitive adhesive sheet, and the accuracy of the through-holes can be increased, and it is generated by laser light irradiation. The debris removability of the pressure-sensitive adhesive sheet can be remarkably improved, and the debris can be extremely effectively prevented from adhering to the peripheral edge portion of the through hole on the pressure-sensitive adhesive sheet surface.

  In the above inventions (Inventions 1 and 2), a roll-like support in which holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions of the adhesive sheet irradiated with the laser beam. You may make it perform laser beam irradiation with respect to the said adhesive sheet on a body (Claim 7).

  In the said invention (invention 7), it is preferable that the said groove | channel is formed in the said roll-shaped support body along the circumferential direction (invention 8). According to this invention (invention 8), high precision is not required for the timing of laser beam irradiation, compared to the case where the grooves are formed in the axial direction of the roll-shaped support.

  In the above inventions (Inventions 7 and 8), the roll-shaped support may have a cylindrical shape having a plurality of suction holes and capable of being sucked from the inside (Invention 9).

  In the said invention (inventions 7-9), the said roll-shaped support body is installed in multiple numbers, and it conveys the said adhesive sheet closely_contact | adhered to the said several roll-shaped support body, The said roll-shaped support sheet of the said adhesive sheet You may make it perform laser beam irradiation with respect to the contact | adherence part vicinity with a support body (Claim 10). According to this invention (invention 10), the through-holes can be formed continuously, and the through-holes can be formed at portions where the adhesive sheet does not shake in the vertical direction. It will be expensive.

  2ndly this invention is an adhesive sheet support body which supports the adhesive sheet by which a laser beam is irradiated and a through-hole is formed in the opposite surface side of the laser beam incident surface of the said adhesive sheet, Comprising: The said adhesive sheet A pressure-sensitive adhesive sheet support is provided in which holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions irradiated with laser light (claim 11).

  In the said invention (invention 11), the said adhesive sheet support body may become flat form (invention 12). In this case, the flat pressure-sensitive adhesive sheet support may constitute a suction portion of a suction device, and the hole having a depth of 150 μm or more may be a suction hole of the suction device.

  Moreover, in the said invention (invention 11), the said adhesive sheet support body may consist of a porous body which has a continuous space | gap (invention 14), and may be roll shape (invention 15). ).

  In the said invention (invention 15), it is preferable that the said groove | channel is formed in the said roll-shaped adhesive sheet support body along the circumferential direction (invention 16).

  In the above inventions (Inventions 15 and 16), the roll-shaped pressure-sensitive adhesive sheet support may have a cylindrical shape having a plurality of suction holes and capable of being sucked from the inside (Invention 17).

  3rdly, this invention provides the suction device which equips the said adhesive sheet support body (Claims 13 and 17) as an adsorption | suction part, and can perform suction from the said suction hole (Claim 18).

  4thly, this invention is the said roll-shaped adhesive sheet support body (Claims 15-17), and the said roll so that an adhesive sheet can be closely_contact | adhered to the said several roll-shaped adhesive sheet support body. A suction conveyance device provided between the pressure-sensitive adhesive sheet supports, and a laser light irradiation device capable of irradiating the vicinity of the adhesion portion between the pressure-sensitive adhesive sheet and the roll-shaped support. A through-hole-forming pressure-sensitive adhesive sheet manufacturing apparatus is provided (claim 19).

  According to the present invention, reflection of laser light, heat storage, and the like on the support of the pressure-sensitive adhesive sheet are prevented, and through holes are reliably formed in the pressure-sensitive adhesive sheet, and the appearance of the pressure-sensitive adhesive sheet is improved for all the through-holes. be able to.

Hereinafter, embodiments of the present invention will be described.
[First Embodiment]
FIG. 1 is a cross-sectional view showing an apparatus for producing a through-hole-formed pressure-sensitive adhesive sheet according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing a pressure-sensitive adhesive sheet support in the same embodiment.

  In the present embodiment, as shown in FIG. 1, an adhesive sheet 1 p (adhesive sheet before through-hole formation) formed by laminating a base material 11 and an adhesive layer 12 constitutes the suction stage of the suction device 3. The adhesive sheet 1p is placed on the support 2A, and the adhesive sheet 1p is sucked from the laser light irradiation device R while sucking the adhesive sheet 1p by the suction device 3, and penetrates the adhesive layer 12 and the substrate 11. A plurality of through-holes 13 are formed to form a through-hole-forming pressure-sensitive adhesive sheet 1 (hereinafter sometimes referred to as “pressure-sensitive adhesive sheet 1”).

  The material of the base material 11 is not particularly limited as long as the through hole 13 can be formed by laser processing. For example, a resin film, a metal film, a resin film on which a metal is deposited, paper, those materials A laminated body etc. are mentioned. When the base material 11 consists of a resin film, the base material 11 may be opaque or transparent, but generally the through-hole 13 is less noticeable when the base material 11 is opaque.

  Examples of the resin film include polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyvinyl chloride, polystyrene, polyurethane, polycarbonate, polyamide, polyimide, polymethyl methacrylate, polybutene, polybutadiene, and polymethylpentene. , Ethylene vinyl acetate copolymer, ethylene (meth) acrylic acid copolymer, ethylene (meth) acrylic acid ester copolymer, ABS resin, olefin-based, urethane-based, ester-based and styrene-based thermoplastic elastomer resin, ionomer A film made of a resin such as a resin, a foamed film, or a laminated film thereof can be used. A commercially available resin film may be used, or a resin film formed by a casting method or the like using process materials may be used. Further, as the paper, for example, high-quality paper, glassine paper, coated paper, laminated paper and the like can be used.

  The thickness of the substrate 11 is usually 1 to 500 μm, preferably about 3 to 300 μm, but can be appropriately changed depending on the use of the through-hole forming pressure-sensitive adhesive sheet 1.

  The type of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 12 is not particularly limited as long as it is a material that can form the through-hole 13 as described above, and is acrylic, polyester-based, polyurethane-based, rubber-based, silicone, or the like. Any of a system etc. may be sufficient. The pressure-sensitive adhesive may be any of an emulsion type, a solvent type, or a solventless type, and may be a crosslinked type or a non-crosslinked type. Furthermore, the pressure-sensitive adhesive may be either a strong-viscosity type with strong adhesive strength, a weak-viscosity type with weak adhesive strength, or a re-peeling type capable of repeating adhesion and peeling.

  The thickness of the pressure-sensitive adhesive layer 12 is usually 1 to 300 μm, preferably about 5 to 100 μm, but can be appropriately changed depending on the use of the through-hole forming pressure-sensitive adhesive sheet 1.

  The cross-sectional shape of the through hole 13 is not particularly limited, but the hole diameter of the through hole 13 in the base material 11 and the pressure-sensitive adhesive layer 12 is preferably 0.1 to 300 μm, particularly 0.1 to 150 μm. Preferably there is. If the hole diameter of the through hole 13 is less than 0.1 μm, it is difficult for air or gas to escape from the through hole 13, and if the hole diameter of the through hole 13 exceeds 300 μm, the through hole 13 becomes conspicuous.

  Moreover, depending on the conditions of the base material 11, the through hole 13 has a hole diameter of 42 μm or less on the surface of the base material 11 and a hole diameter including a melted portion (dross) by the laser around the through hole 13 depending on the conditions of the base material 11. Cannot be seen with the naked eye (the presence of the through-hole 13 cannot be recognized with the naked eye), so that the penetration on the surface of the base material 11 is required particularly when the appearance of the pressure-sensitive adhesive sheet 1 is required to be invisible. It is preferable that the upper limit of the hole diameter of the hole 13 is 42 μm and the upper limit of the hole diameter including dross around the through hole 13 is 50 μm.

  The hole diameter of the through-hole 13 may be constant in the thickness direction of the pressure-sensitive adhesive sheet 1 or may change in the thickness direction of the pressure-sensitive adhesive sheet 1, but the hole diameter of the through-hole 13 is the thickness of the pressure-sensitive adhesive sheet 1. When changing in the vertical direction, it is preferable that the thickness gradually decreases from the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer 12 to the surface of the base material 11. Thus, when the hole diameter of the through-hole 13 changes, the through-hole 13 becomes inconspicuous on the surface of the base material 11, and the external appearance of the adhesive sheet 1 can be kept favorable.

  When the through-hole 13 is formed by laser processing, the through-hole 13 often has a tapered taper. Therefore, the through-hole 13 having the above-described shape is formed from the adhesive surface side of the adhesive layer 12 as shown in FIG. It can be formed by irradiation with laser light.

The hole density of the through holes 13 is preferably 30 to 50,000 / 100 cm ² , and more preferably 100 to 10,000 / 100 cm ² . When the hole density of the through holes 13 is less than 30/100 cm ² , air or gas is difficult to escape, and when the hole density of the through holes 13 exceeds 50,000 / 100 cm ² , the mechanical strength of the pressure-sensitive adhesive sheet 1 is increased. May decrease.

  As shown in FIG. 2, the support 2A in the present embodiment has a substantially flat plate shape, and is formed with a plurality of suction holes 21A penetrating the support 2A in the thickness direction. The support 2 </ b> A constitutes a suction stage corresponding to the upper wall portion of the suction box 31 in the suction device 3.

  21 A of suction holes of 2 A of support bodies in this embodiment are formed in the position corresponding to all the parts irradiated with a laser beam in the adhesive sheet 1p. Since the support 2A has such a configuration, a space exists below the surface opposite to the laser light incident surface (the surface of the base material 11) in the pressure-sensitive adhesive sheet 1p. In addition, the through hole 13 can be reliably formed through the base material 11, and the laser beam is reflected on the surface of the support 2A or the heat of the laser beam is generated between the adhesive sheet 1 and the support 2A. It can prevent about all the through-holes 13 that the peripheral part of the through-hole 13 carries out a heat deformation etc. by heat storage, and the external appearance of the adhesive sheet 1 deteriorates. In particular, in the present embodiment, since suction is performed from the suction hole 21A of the support 2A, heat storage as described above hardly occurs, and a decomposition product (debris) of the pressure-sensitive adhesive layer 12 and the base material 11 generated by laser light irradiation. Is removed by suction, and the debris is effectively prevented from adhering to the peripheral edge portion of the through hole 13 on the surface of the base material 11.

  The diameter of the suction hole 21A is preferably 1 × Dt to 50 × Dt, particularly 1 × Dt to 30 ×, where Dt is a hole diameter (hole diameter including dross) on the surface of the base material 11 of the through hole 13. Dt is preferred. If the hole diameter of the suction hole 21A is less than 1 × Dt, problems such as laser light reflection and heat storage may occur, and if the hole diameter of the suction hole 21A exceeds 50 × Dt, the peripheral portion of the through hole 13 becomes the suction hole. There is a risk of deformation to become convex toward the space portion side of 21A.

  The thickness of the support 2A or the height of the suction box 31 is particularly limited as long as there is a space having a depth of 150 μm or more below the surface opposite to the laser light incident surface (surface of the base material 11) in the adhesive sheet 1p. Is not to be done.

  The material of the support 2A is not particularly limited as long as it does not adversely affect the pressure-sensitive adhesive sheet 1p when irradiated with laser light. For example, aluminum or aluminum alloy, aluminum or aluminum alloy with anodized aluminum, aluminum, steel, In addition to various metal materials such as steel, stainless steel, and copper with hard chrome plating and galvanization on the surface, or metal materials that have been plated, alumina, zirconia, silicon carbide, silicon nitride, steatite, forsterite, A composite material such as ceramics (non-metallic inorganic material) such as mullite and a double-sided copper-coated glass epoxy substrate can be used.

  Since the pressure-sensitive adhesive sheet 1p is placed on the support 2A and sucked by the suction device 3 to increase the flatness, by performing laser processing in that state, the through-hole 13 can be formed with high accuracy. Is possible. The suction force by the suction device 3 is not particularly limited as long as the adhesive sheet 1p can be sucked and fixed on the support 2A and the debris can be sucked and removed.

Kind of laser beam irradiation device R is not particularly limited, for example, carbon dioxide (CO ₂₎ laser, TEA-CO ₂ laser, YAG laser, UV-YAG laser, excimer laser, semiconductor laser, YVO ₄ laser, A YLF laser, a femtosecond laser, or the like can be used.

  In the present embodiment, when forming the plurality of through holes 13 in the pressure-sensitive adhesive sheet 1p, the laser beam irradiation device R may be moved, or the support 2A (suction device 3) may be moved. Even in this case, it is necessary to move the laser light so that the irradiation position coincides with the position of the suction hole 21A of the support 2A.

  Note that a release material may be laminated on the pressure-sensitive adhesive layer 12 as desired, but it is preferable that the release material is peeled off from the pressure-sensitive adhesive layer 12 at the time of laser light irradiation. When laser light is irradiated from the release material side in a state where the release material is laminated on the adhesive layer 12, depending on the material of the release material, dross formed at the periphery of the opening of the through hole 13 of the release material may be In this case, the accuracy of the hole diameter and hole density of the through holes 13 formed in the pressure-sensitive adhesive sheet 1 is lowered. Moreover, if the opening part of the through-hole 13 of the adhesive layer 12 spreads, the internal space of the through-hole 13 will become large, and after sticking the adhesive sheet 1 to a to-be-adhered body, in the air in the through-hole 13, and the through-hole 13 There is a possibility that the water or the like entered may have some influence on the surface of the pressure-sensitive adhesive sheet 1.

  On the other hand, as shown in FIG. 1, if the adhesive layer 12 is directly irradiated with laser light, the opening of the through hole 13 of the adhesive layer 12 does not expand, and the accuracy of the hole diameter and the hole density is high. Through holes 13 having a small internal space can be formed. In addition, in the laser light irradiation to the adhesive layer 12, by not interposing the release material, the laser light irradiation time can be shortened or the output energy of the laser can be reduced. If the output energy of the laser is small, the thermal effect on the pressure-sensitive adhesive layer 12 and the substrate 11 is small, and it is possible to form a well-shaped through-hole 13 with little thermal deformation or the like. In addition, after forming the through-hole 13, you may affix a peeling material on the adhesive layer 12 again.

  In the through-hole-formed pressure-sensitive adhesive sheet 1 obtained as described above, for all the through-holes 13, thermal deformation of the peripheral portion of the through-hole 13 on the surface of the base material 11 due to laser light reflection, heat storage, etc. Since debris adhesion to the peripheral edge portion of the through-hole 13 on the surface is prevented, the appearance of the pressure-sensitive adhesive sheet 1 becomes very good.

  Moreover, in the said through-hole formation adhesive sheet 1, since the through-hole 13 is formed reliably, the gas generate | occur | produced from the air between a to-be-adhered body and the adhesive surface of the adhesive layer 12, or a to-be-adhered body is The through hole 13 can be smoothly removed to the outside of the surface of the base material 11, so that air pockets and blisters can be easily prevented or removed.

[Second Embodiment]
FIG. 3 is a cross-sectional view showing an apparatus for producing a through hole forming pressure-sensitive adhesive sheet according to the second embodiment of the present invention, and FIG. 4 is a perspective view showing a pressure-sensitive adhesive sheet support in the same embodiment.

  In the present embodiment, as shown in FIG. 3, the pressure-sensitive adhesive sheet 1 p formed by laminating the base material 11 and the pressure-sensitive adhesive layer 12 is placed on the porous support 4 provided on the suction stage 2 </ b> B of the suction device 3. The pressure-sensitive adhesive sheet 1p is irradiated with laser light from the laser light irradiation device R while sucking the pressure-sensitive adhesive sheet 1p through the porous support 4 by the suction device 3, and the pressure-sensitive adhesive layer 12 and the substrate A plurality of through holes 13 penetrating the material 11 are formed to form the through hole forming pressure-sensitive adhesive sheet 1.

  Since the base material 11, the pressure-sensitive adhesive layer 12, and the through-hole 13 are the same as those in the first embodiment, description thereof is omitted here (the same applies to the following embodiments).

  The porous support 4 in the present embodiment is made of a porous material having continuous voids, has a sheet shape as shown in FIG. 4, and penetrates the porous support 4 in the thickness direction. A plurality of through holes 41 are formed.

  By sucking the adhesive sheet 1p by the suction device 3 through such a porous support 4, the entire adhesive sheet 1p is sucked to securely fix the adhesive sheet 1p, and the accuracy of the through holes 13 is higher. And the suction removal property of the debris of the pressure-sensitive adhesive layer 12 and the base material 11 generated by the laser light irradiation can be remarkably improved, and the debris is the peripheral portion of the through hole 13 on the surface of the base material 11 It can prevent very effectively that it adheres to. Further, it is possible to effectively prevent the heat of the laser light from being stored between the adhesive sheet 1p and the suction stage 2B.

  Examples of the material constituting the porous support 4 include paper, nonwoven fabric, woven fabric, and the like, in addition to a resin sheet having open cells made of polyolefin such as polyethylene and polypropylene, polyurethane, polyacryl, polyester, polyvinyl chloride, and the like. The fiber assembly can be used. Among them, it is preferable to use a resin sheet having open cells, which has high flatness and excellent heat resistance.

  The end surface portion 42 of the porous support 4 is preferably processed so that the air permeability is low. Thereby, since the air suction | attraction amount from the end surface part 42 of the porous support body 4 reduces, the suction of the adhesive sheet 1p can be performed more efficiently. Such processing is performed by applying a resin or the like to the end face portion 42 of the porous support 4, or when the porous support 4 is made of a thermoplastic resin, the end face portion 42 of the porous support 4. Can be carried out by thermally melting and crushing open cells.

  The through holes 41 of the porous support 4 in the present embodiment are formed at positions corresponding to all portions of the adhesive sheet 1p that are irradiated with laser light. Since the porous support 4 has such a configuration, the laser beam penetrating the pressure-sensitive adhesive layer 12 and the base material 11 hits the porous support 4 and the debris of the porous support 4 by the laser beam irradiation penetrates. It can prevent about all the through-holes 13 that it adheres to the peripheral part of the hole 13, and the external appearance of the adhesive sheet 1 deteriorates.

  The hole diameter of the through hole 41 is preferably 1 × Dt to 50 × Dt, particularly 1 × Dt to 30 ×, where Dt is the hole diameter (hole diameter including dross) on the surface of the base material 11 of the through hole 13. Dt is preferred. If the hole diameter of the through hole 41 is less than 1 × Dt, debris of the porous support 4 due to laser light irradiation may adhere to the peripheral edge of the through hole 13, and the hole diameter of the through hole 41 exceeds 50 × Dt. Then, there is a possibility that the peripheral portion of the through hole 13 is deformed so as to be convex toward the space portion side of the through hole 41.

  The thickness of the porous support 4 is preferably 150 μm or more. Since the porous support 4 has such a thickness, the height of the through hole 41 formed in the porous support 4 is also 150 μm or more, and the surface opposite to the laser light incident surface (the surface of the base material 11) in the adhesive sheet 1p. ), A space having a depth of 150 μm or more exists. Thereby, even if the laser beam is reflected on the surface of the suction stage 2B, the surface of the substrate 11 is not damaged, and the heat of the laser beam can be stored between the adhesive sheet 1p and the suction stage 2B. It is suppressed. Therefore, it is possible to prevent the peripheral portion of the through-hole 13 on the surface of the base material 11 from being thermally deformed and the appearance of the adhesive sheet 1 from being deteriorated.

  A particularly preferable thickness of the porous support 4 is 150 to 3000 μm. If the thickness of the porous support 4 is too thick, the variation in thickness becomes large, and it may be difficult to obtain a through hole having a desired hole diameter.

  The porous support 4 is placed on the suction stage 2 </ b> B of the suction box 31 in the suction device 3. A plurality of suction holes 21B penetrating the suction stage 2B in the thickness direction are formed in the suction stage 2B. In the present embodiment, the porous support described above is provided between the adhesive sheet 1p and the suction stage 2B. 4 is interposed, the suction holes 21B of the suction stage 2B do not need to be formed at positions corresponding to all the portions of the adhesive sheet 1p that are irradiated with the laser light. Therefore, the suction stage 2B does not need to be dedicated to the through-hole-forming pressure-sensitive adhesive sheet 1, and an existing one can be used as the suction device 3.

  In the through-hole-formed pressure-sensitive adhesive sheet 1 obtained as described above, for all the through-holes 13, thermal deformation of the peripheral portion of the through-hole 13 on the surface of the base material 11 due to laser light reflection, heat storage, etc. Since debris adhesion to the peripheral edge portion of the through-hole 13 on the surface is prevented, the appearance of the pressure-sensitive adhesive sheet 1 becomes very good. Moreover, in the said through-hole formation adhesive sheet 1, since the through-hole 13 is formed reliably, the gas generate | occur | produced from the air between a to-be-adhered body and the adhesive surface of the adhesive layer 12, or a to-be-adhered body is The through hole 13 can be smoothly removed to the outside of the surface of the base material 11, so that air pockets and blisters can be easily prevented or removed.

  Instead of the porous support 4, a non-porous support made of the same material as that of the support 2A in the first embodiment can be used.

  In this case, the surface of the adsorption stage 2B (surface on the nonporous support side) or the back surface of the nonporous support (surface on the adsorption stage 2B side) is preferably a rough surface. Since the surface of the adsorption stage 2B or the back surface of the non-porous support body is thus rough, the position of the suction holes of the non-porous support body and the position of the suction holes of the adsorption stage 2B do not match. However, it is possible to suck from the suction holes of the non-porous support through the interface between the adsorption stage 2B and the non-porous support. Specifically, the surface roughness (Ra) of the back surface of the adsorption stage 2B or the non-porous support is preferably 0.05 to 5 μm, and particularly preferably 0.1 to 3 μm.

[Third Embodiment]
FIG. 5 is a perspective view showing an adhesive sheet support according to the third embodiment of the present invention.
As shown in FIG. 5, the support 2C according to the present embodiment has a flat plate shape, and grooves 22C are formed in a lattice pattern on the surface side of the support 2C. The adhesive sheet 1p is placed on the support 2C and irradiated with laser light, but the grooves 22C are formed at positions corresponding to all portions of the adhesive sheet 1p irradiated with laser light. Further, the depth of the groove 22C is preferably 150 μm or more.

  When the support 2C has the above-described configuration, a space having a depth of 150 μm or more exists below the surface opposite to the laser light incident surface (the surface of the base material 11) in the adhesive sheet 1p. Thereby, the laser beam can penetrate the pressure-sensitive adhesive layer 12 and the base material 11 to form the through hole 13 with certainty, and the laser beam is not reflected on the surface of the support 2C, and the bottom surface of the groove 22C. Even if the light is reflected, the surface of the base material 11 is not damaged, and further, the heat of the laser light is suppressed from being stored between the adhesive sheet 1p and the support 2C. Therefore, it can prevent about the through-hole 13 that the peripheral part of the through-hole 13 in the base material 11 surface heat-deforms etc., and the external appearance of the adhesive sheet 1 deteriorates.

  A particularly preferable depth of the groove 22C is 300 μm or more. Further, the width of the groove 22C is preferably 1 × Dt to 50 × Dt, particularly 1 × Dt to 30 when the hole diameter (hole diameter including dross) of the through hole 13 on the surface of the base material 11 is Dt. XDt is preferred. If the width of the groove 22C is less than 1 × Dt, problems such as laser light reflection and heat storage may occur. If the width of the groove 22C exceeds 50 × Dt, the peripheral portion of the through hole 13 is the space of the groove 22C. There is a risk of deformation so as to be convex on the part side.

  As the material of the support 2C, the same material as the material of the support 2A in the first embodiment or the material of the porous support 4 in the second embodiment can be used.

  Here, at the time of laser processing, when the support 2C is made of a non-porous material, suction is preferably performed from the side end opening of the groove 22C in the support 2C, and the support 2C is made of a porous material. In this case, it is preferable to perform suction from the back side of the support 2C. By performing such suction, the above heat storage is less likely to occur, and the debris of the pressure-sensitive adhesive layer 12 and the base material 11 generated by the laser light irradiation is sucked and removed, so that the debris becomes the base material 11. It is suppressed that it adheres to the peripheral part of the through-hole 13 in the surface.

  Instead of the support 2C, a support 2D as shown in FIG. 6 can be used. A groove 22D similar to the support 2C is formed in the support 2D, and a plurality of suction holes 21D penetrating from the bottom surface of the groove 22D to the back surface of the support 2D are formed. The hole diameter of the suction hole 21D is not particularly limited as long as suction is possible. Such a support 2D can constitute an adsorption stage in the suction device, like the support 2A in the first embodiment.

  According to the support 2D, the heat storage as described above is less likely to occur regardless of the position of the pressure-sensitive adhesive sheet 1p in the plane direction, and the pressure-sensitive adhesive layer 12 and the base material 11 generated by laser light irradiation are less likely to occur. Debris can be effectively removed by suction.

[Fourth Embodiment]
FIG. 7 is a cross-sectional view showing an apparatus for producing a through-hole-formed pressure-sensitive adhesive sheet according to the fourth embodiment of the present invention, and FIG. 8 is a perspective view showing a pressure-sensitive adhesive sheet support in the same embodiment. These are the enlarged views of the groove part vicinity of the adhesive sheet support body in the embodiment.

  As shown in FIG. 7, the through-hole-forming pressure-sensitive adhesive sheet manufacturing apparatus according to the present embodiment includes a plurality of roll-shaped supports 5E and a suction conveyance device (suction belt) 7 provided between the supports 5E. And a laser beam irradiation device R provided above the support 5E. In this embodiment, as shown in FIG. 7 and FIG. 9, a long pressure-sensitive adhesive sheet 1 p formed by laminating a base material 11 and a pressure-sensitive adhesive layer 12 is sucked downward by a suction conveyance device 7 to form a roll. The adhesive layer 12 and the base material are conveyed while being in close contact with the upper outer peripheral surface of the support 5E and irradiating a laser beam from the laser light irradiation device R to the vicinity of the contact portion of the adhesive sheet 1p with the support 5E. A plurality of through-holes 13 penetrating through 11 are formed to form a through-hole forming pressure-sensitive adhesive sheet 1.

  As shown in FIG. 8, the roll-shaped support body 5E has a cylindrical shape as a whole. A plurality of grooves 52E are formed along the circumferential direction of the roll-shaped support body 5E, and as shown in FIGS. 8 and 9, suction that penetrates from the bottom surface of the groove 52E to the inner wall of the support body 5E. A plurality of holes 51E are formed.

  The said groove | channel 52E is formed in the position corresponding to all the parts irradiated with a laser beam in the adhesive sheet 1p. The depth of the groove 52E is preferably 150 μm or more.

  When the support 5E has the above-described configuration, a space having a depth of 150 μm or more exists below the surface opposite to the laser light incident surface (the surface of the base material 11) in the adhesive sheet 1p. As a result, the laser beam can surely pass through the adhesive layer 12 and the base material 11 to form the through hole 13, and the laser beam is not reflected by the surface of the support 5E, and the bottom surface of the groove 52E. Even if the light is reflected, the surface of the base material 11 is not damaged, and further, the heat of the laser light is suppressed from being stored between the adhesive sheet 1p and the support 5E. Therefore, it can prevent about the through-hole 13 that the peripheral part of the through-hole 13 in the base material 11 surface heat-deforms etc., and the external appearance of the adhesive sheet 1 deteriorates. In particular, in the present embodiment, since the suction is performed from the suction hole 51E of the support 5E, the heat storage as described above hardly occurs, and the adhesive layer 12 and the debris of the base material 11 generated by the laser light irradiation are sucked and removed. Thus, the debris is effectively prevented from adhering to the peripheral edge portion of the through hole 13 on the surface of the base material 11.

  A particularly preferable depth of the groove 52E is 300 μm or more. The width of the groove 52E is preferably 1 × Dt to 50 × Dt, particularly 1 × Dt to 30 when the hole diameter (hole diameter including dross) on the surface of the base material 11 of the through hole 13 is Dt. XDt is preferred. If the width of the groove 52E is less than 1 × Dt, problems such as laser light reflection and heat storage may occur, and if the width of the groove 52E exceeds 50 × Dt, the peripheral portion of the through hole 13 is the space of the groove 52E. There is a risk of deformation so as to be convex on the part side.

  On the other hand, the hole diameter of the suction hole 51E is not particularly limited as long as suction is possible, and may be smaller than the width of the groove 52E as shown in FIGS. 8 and 9, or the support shown in FIG. Like the 5F suction hole 51F, it may be larger than the width of the groove 52F.

  It is possible to obtain the same effect as described above by providing only the suction hole 51E without providing the groove 52E in the support 5E and irradiating the adhesive sheet 1p positioned on the suction hole 51E with laser light. However, in that case, high accuracy is required for the rotation angle of the support 5E (position of the suction hole 51E) and the timing of laser beam irradiation.

  The diameter of the support 5E is not particularly limited, but is usually about 2.5 to 30 cm in radius, and preferably about 3 to 25 cm in radius.

  As a material of the support 5E, the same material as that of the support 2A in the first embodiment can be used.

  In the present embodiment, the core body 6 is provided in the support body 5E so that the upper portion is cut out in a fan shape when viewed from the side to form the suction portion 61, and the support body 5E rotates around the core body 6 To do. By sucking from the suction portion 61 of the core body 6, the adhesive sheet 1 p is sucked through the suction hole 51 </ b> E located at the upper part of the support body 5 </ b> E, and coupled with suction by the suction transport device 7, the upper outer periphery of the support body 5 </ b> E The adhesive sheet 1p is in close contact with the surface.

  It is preferable that the laser beam irradiation position with respect to the adhesive sheet 1p is in the vicinity of the contact portion of the adhesive sheet 1p that is in close contact with the support 5E as described above. By irradiating such a position with laser light, the adhesive sheet 1p does not shake in the vertical direction, and the through hole 13 can be formed with high accuracy.

  In this embodiment, when forming the several through-hole 13 in the adhesive sheet 1p, it is common to move the laser beam irradiation apparatus R to the axial direction of the support body 5E. In the present embodiment, there are a plurality of laser light irradiation devices R. However, the laser light irradiation position of each laser light irradiation device R is not particularly limited, and may be divided in the longitudinal direction of the adhesive sheet 1p. It may be divided in the short direction of the adhesive sheet 1p, or may be divided in both the longitudinal direction and the short direction of the adhesive sheet 1p.

  Like this embodiment, the through-hole formation adhesive sheet 1 is made very efficient by continuously forming the through-holes 13 on the long adhesive sheet 1p using a plurality of laser light irradiation devices R. Can be manufactured well.

  In the through-hole-formed pressure-sensitive adhesive sheet 1 obtained as described above, for all the through-holes 13, thermal deformation of the peripheral portion of the through-hole 13 on the surface of the base material 11 due to laser light reflection, heat storage, etc. Since debris is prevented from adhering to the peripheral edge of the through hole 13 on the surface, the appearance of the through hole forming pressure-sensitive adhesive sheet 1 becomes very good. Moreover, in the said through-hole formation adhesive sheet 1, since the through-hole 13 is formed reliably, the gas generate | occur | produced from the air between a to-be-adhered body and the adhesive surface of the adhesive layer 12, or a to-be-adhered body is The through hole 13 can be smoothly removed to the outside of the surface of the base material 11, so that air pockets and blisters can be easily prevented or removed.

  In place of the roll-shaped support 5E, a roll-shaped support 5G as shown in FIG. 11 can also be used. A groove 52G similar to that of the support 5E is formed in the support 5G, but no suction hole is formed. Even when such a support 5G is used, since the thermal deformation of the peripheral portion of the through hole 13 on the surface of the base material 11 due to laser light reflection, heat storage, etc. is prevented for all the through holes 13, the appearance of the pressure-sensitive adhesive sheet 1 Will be good.

  Moreover, in the said embodiment, the suction conveyance apparatus 7 is an effective means when irradiating a laser beam directly with respect to the adhesive layer 12 of the adhesive sheet 1p which has not laminated | stacked the peeling material, In this case, an adhesive is used. The through holes 13 of the layer 12 do not have the above-described problems due to the release material. However, instead of the suction conveyance device 7, a rotary roll made of a material to which the adhesive layer 12 is difficult to stick may be provided on the adhesive layer 12 side (opposite side of the support 5E with the adhesive sheet 1p interposed), When a release material is laminated on the pressure-sensitive adhesive layer 12, a normal rotating roll may be provided on the pressure-sensitive adhesive layer 12 side.

[Other Embodiments]
The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, the groove 22C of the support body 2C shown in FIG. 5 or the groove 22D of the support body 2D shown in FIG. 6 may be formed so as to extend only in one direction instead of the lattice shape. The diameter of the suction hole 21D of the body 2D may be larger than the width of the groove 22D (see FIG. 10).

  EXAMPLES Hereinafter, although an Example etc. demonstrate this invention further more concretely, the scope of the present invention is not limited to these Examples etc.

[Preparation of adhesive sheet]
25 parts by mass of ethyl acetate is blended with 100 parts by mass of an acrylic pressure-sensitive adhesive (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., Coponil N-2147, solid content: 35% by mass), and then an isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., 1 part by mass of Coronate L) was mixed and sufficiently stirred to obtain a pressure-sensitive adhesive coating agent.

  After drying the pressure-sensitive adhesive coating agent on the release-treated surface of a release material (Lintec Corp., FPM-11, thickness: 175 μm), which is laminated with polyethylene on both sides of fine paper and coated with a silicone release agent on one side The film was coated with a knife coater so as to have a thickness of 30 μm, and dried at 90 ° C. for 1 minute. A black opaque base material (thickness: 100 μm) made of polyvinyl chloride was pressure-bonded to the pressure-sensitive adhesive layer thus formed, and this was used as a pressure-sensitive adhesive sheet.

[Example 1]
As a support for the pressure-sensitive adhesive sheet, a double-sided copper-coated glass epoxy substrate (manufactured by Hitachi Chemical Co., Ltd., FR-4, thickness 1.6 mm) with 0.3 mmφ through-holes formed at a 2 mm pitch is prepared and suctioned. It mounted on the adsorption | suction stage of the suction box in an apparatus (refer FIG. 3). The suction stage was made of an aluminum alloy having a thickness of 10 mm with an alumite formed on the surface and a surface roughness (Ra) of 0.7 μm, and suction holes of 3 mmφ were formed at a pitch of 20 mm.

The pressure-sensitive adhesive sheet from which the release material had been peeled was placed on the support with the pressure-sensitive adhesive layer facing upward. Then, while sucking the adhesive sheet with the suction device, YB-HCS03 manufactured by Matsushita Industrial Equipment Co., Ltd. was used as a laser processing machine, and the CO ₂ laser was irradiated from the adhesive layer side to the adhesive sheet. At this time, the irradiation position of the laser beam was set to a position corresponding to the through hole of the support. That is, the hole density of the through holes was 2500/100 cm ² .

  Thus, the hole diameter in the base-material surface of the through-hole of the through-hole formation adhesive sheet obtained (the hole diameter which does not contain dross, the hole diameter containing dross) and the hole diameter in an adhesive surface were measured. The results are shown in Table 1.

[Example 2]
As a support for the pressure-sensitive adhesive sheet, a porous sheet made of ultra-high molecular weight polyethylene (manufactured by Nitto Denko Corporation, Sunmap LC, thickness 2 mm) with 0.3 mmφ through-holes formed at a 2 mm pitch, A through-hole-forming pressure-sensitive adhesive sheet was produced in the same manner as in Example 1. The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

Example 3
A suction device similar to that of Example 1 was prepared except that the suction hole diameter in the suction stage was 0.5 mmφ and the pitch was 2 mm. Then, the pressure-sensitive adhesive sheet from which the release material had been peeled was placed directly on the suction stage of the suction device with the pressure-sensitive adhesive layer facing upward, and laser processing was performed in the same manner as in Example 1. However, the irradiation position of the laser beam was a position corresponding to the suction hole of the suction stage. That is, the hole density of the through holes was 2500/100 cm ² . The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

Example 4
As a support for the pressure-sensitive adhesive sheet, a porous sheet made of ultrahigh molecular weight polyethylene (manufactured by Nitto Denko Corporation, Sunmap LC, thickness 2 mm) is formed in a grid of grooves with a width of 0.5 mm and a depth of 0.2 mm at a pitch of 2 mm A through-hole-forming pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 using what was formed in the above. However, the irradiation position of the laser light was a position corresponding to the groove of the support, and the hole density of the through holes was 2500/100 cm ² . The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

Example 5
As a support for the adhesive sheet, double-sided copper-coated glass epoxy substrate (manufactured by Hitachi Chemical Co., Ltd., FR-4, thickness 1.6 mm), 0.5 mm wide and 0.5 mm deep grooves in a 2 mm pitch grid A through-hole-forming pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 using a sheet having 0.3 mmφ through-holes formed at a 4 mm pitch on the bottom surface of the groove corresponding to the lattice intersection. The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

Example 6
As a support for the pressure-sensitive adhesive sheet, a plurality of rolls (300 mmφ) made of an aluminum alloy were prepared by forming a plurality of grooves having a width of 0.5 mm and a depth of 0.5 mm at a pitch of 2 mm in the circumferential direction (see FIG. 11). And the suction conveyance apparatus which can be conveyed between these support bodies, attracting | sucking an adhesive sheet below was installed (refer FIG. 7).

The pressure-sensitive adhesive sheet from which the release material has been peeled is conveyed using the suction conveyance device while being in close contact with the upper outer peripheral surface of the support with the pressure-sensitive adhesive layer facing upward, and the adhesive sheet is in contact with the support. In the same manner as in Example 1, the CO ₂ laser was irradiated. At this time, the irradiation position of the laser light was a position corresponding to the groove of the support, and the hole density of the through holes was 2500/100 cm ² . The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

Example 7
As a support for the pressure-sensitive adhesive sheet, a plurality of 0.4 mmφ suction holes are formed at a pitch of 10 mm in the circumferential direction on the bottom surface of the roll groove in Example 6 (see FIG. 8), and laser processing is performed while suctioning from the suction holes. A through-hole forming pressure-sensitive adhesive sheet was produced in the same manner as Example 6 except for the above. The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

[Comparative Example 1]
As a support for the pressure-sensitive adhesive sheet, a double-sided copper-coated glass epoxy substrate (Hitachi Kasei Kogyo Co., Ltd., FR-4, thickness 1.6 mm) without through-holes is used, and the suction is not performed. Thus, a through-hole forming pressure-sensitive adhesive sheet was produced. The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

[Comparative Example 2]
On the suction stage of the suction device used in Example 1, stacked copy paper (Fuji Xerox Office Supply Co., Ltd., C ² color / monochrome and paper, thickness 85 .mu.m), and the adhesive sheet in this order as a support of the adhesive sheet Placed. Then, suction and laser light irradiation were performed in the same manner as in Example 1 to produce a through-hole forming pressure-sensitive adhesive sheet. However, the irradiation position of the laser beam did not correspond to the position of the through hole of the suction stage. The hole diameter of the through hole of the obtained through hole forming pressure-sensitive adhesive sheet was measured in the same manner as in Example 1. The results are shown in Table 1.

[Test example]
The pressure-sensitive adhesive sheets obtained in Examples and Comparative Examples were subjected to an air retention disappearance test, a hole visibility test, and a debris adhesion test as follows. The results are shown in Table 1.

  Air reservoir disappearance test: A through-hole-formed adhesive sheet cut to 50 mm × 50 mm was attached to a melamine coated plate so as to form a circular air reservoir having a diameter of about 15 mm, and the adhesive sheet was pressure-bonded with a squeegee. As a result, the case where the air pocket disappeared is represented by ◯, and the case where the air pool remained is represented by x.

  Hole visibility inspection: A through-hole-formed adhesive sheet cut to 30 mm x 30 mm is attached to a white melamine-coated plate, and through-holes are visible on the surface of the through-hole-formed adhesive sheet (substrate surface) with the naked eye under an indoor fluorescent lamp Inspected whether or not. The distance from the eyes to the through hole forming adhesive sheet was about 30 cm, and the angle at which the through hole forming adhesive sheet was viewed was variously changed. As a result, the case where the through-hole was not visible is indicated by ◯, and the case where the through-hole was visible is indicated by ×.

  Debris adhesion inspection: On the surface (base material surface) of the through-hole forming pressure-sensitive adhesive sheet cut to 30 mm × 30 mm, whether or not debris adhered to the periphery of the through-hole was examined with the naked eye under an indoor fluorescent lamp. As a result, the case where the whitish material was not attached is indicated by ◯, the case where the whitish material is slightly attached is indicated by Δ, and the case where the whitish material is continuously attached is indicated by ×.

  As is apparent from Table 1, the pressure-sensitive adhesive sheets obtained in the examples have an excellent appearance because air pockets can be easily removed and through-holes cannot be seen with the naked eye on the pressure-sensitive adhesive sheet surface.

  In general, the present invention is a case where air pockets or blisters are likely to occur in the pressure-sensitive adhesive sheet, for example, when the pressure-sensitive adhesive sheet has a large area, or when gas is generated from the adherend, etc. This is useful for the production of pressure-sensitive adhesive sheets that are required to be extremely good.

It is sectional drawing which shows the manufacturing apparatus of the through-hole formation adhesive sheet which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the adhesive sheet support body in the same embodiment. It is sectional drawing which shows the manufacturing apparatus of the through-hole formation adhesive sheet which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows the adhesive sheet support body in the same embodiment. It is a perspective view which shows the adhesive sheet support body which concerns on the 3rd Embodiment of this invention. It is a perspective view which shows the adhesive sheet support body which concerns on other embodiment of this invention. It is sectional drawing which shows the manufacturing apparatus of the through-hole formation adhesive sheet which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the adhesive sheet support body in the same embodiment. It is an enlarged view of the groove part vicinity of the adhesive sheet support body in the embodiment. It is an enlarged view which shows the groove | channel and suction hole of the adhesive sheet support body which concern on other embodiment of this invention. It is a perspective view which shows the adhesive sheet support body which concerns on another embodiment of this invention.

Explanation of symbols

1p ... Adhesive sheet (before through-hole formation)
DESCRIPTION OF SYMBOLS 1 ... Through-hole formation adhesive sheet 11 ... Base material 12 ... Adhesive layer 13 ... Through-hole 2A, 2C, 2D, 5E, 5F, 5G ... Support body 21A, 21D, 51E, 51F ... Suction hole 22C, 22D, 52E, 52F, 52G ... groove 2B ... suction stage (suction part)
21B ... Suction hole 3 ... Suction device 31 ... Suction box 4 ... Porous support 41 ... Through hole 42 ... End face part 6 ... Core body 61 ... Suction part 7 ... Suction conveyance device R ... Laser light irradiation device

Claims (19)

In the method for producing a through-hole-forming pressure-sensitive adhesive sheet that forms a through-hole in the pressure-sensitive adhesive sheet by irradiating a laser beam to the pressure-sensitive adhesive sheet having at least a base material and a pressure-sensitive adhesive layer,
Manufacturing of a through-hole-formed pressure-sensitive adhesive sheet characterized in that a space having a depth of 150 μm or more exists on the surface opposite to the laser light incident surface in all portions of the pressure-sensitive adhesive sheet irradiated with the laser light during laser light irradiation. Method.   The method for producing a through-hole-formed pressure-sensitive adhesive sheet according to claim 1, wherein suction is performed from the surface opposite to the laser light incident surface of the pressure-sensitive adhesive sheet during laser light irradiation.   Laser light irradiation is performed on the pressure-sensitive adhesive sheet on the support in which holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions of the pressure-sensitive adhesive sheet irradiated with the laser light. The manufacturing method of the through-hole formation adhesive sheet of Claim 1 or 2 characterized by the above-mentioned.   The said support body comprises the adsorption | suction part of a suction device, and the said hole of 150 micrometers or more is a suction hole of the said suction device, The manufacture of the through-hole formation adhesive sheet of Claim 3 characterized by the above-mentioned. Method.   In the pressure-sensitive adhesive sheet on a porous support having continuous voids, holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all the portions of the pressure-sensitive adhesive sheet irradiated with the laser light. On the other hand, laser beam irradiation is performed, The manufacturing method of the through-hole formation adhesive sheet of Claim 1 or 2 characterized by the above-mentioned.   The through-hole-forming adhesive according to claim 5, wherein the porous support is located on an adsorption portion of a suction device, and sucks the adhesive sheet through the porous support. Sheet manufacturing method.   Laser light is applied to the pressure-sensitive adhesive sheet on the roll-shaped support member in which holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions irradiated with the laser light of the pressure-sensitive adhesive sheet. Irradiation is performed, The manufacturing method of the through-hole formation adhesive sheet of Claim 1 or 2 characterized by the above-mentioned.   The method for producing a through-hole-forming pressure-sensitive adhesive sheet according to claim 7, wherein the groove is formed in the roll-shaped support body along a circumferential direction.   The method for producing a through-hole-forming pressure-sensitive adhesive sheet according to claim 7 or 8, wherein the roll-shaped support has a plurality of suction holes and has a cylindrical shape that can be sucked from the inside.   A plurality of the roll-shaped supports are installed, and the pressure-sensitive adhesive sheet is conveyed while being in close contact with the plurality of roll-shaped supports, and the laser is applied to the vicinity of the contact portion of the pressure-sensitive adhesive sheet with the roll-shaped support. Light irradiation is performed, The manufacturing method of the through-hole formation adhesive sheet in any one of Claims 7-9 characterized by the above-mentioned. A pressure-sensitive adhesive sheet support that supports a pressure-sensitive adhesive sheet that is irradiated with laser light to form a through-hole, on the opposite side of the laser light incident surface of the pressure-sensitive adhesive sheet,
A pressure-sensitive adhesive sheet support, wherein holes and / or grooves having a depth of 150 μm or more are formed at positions corresponding to all portions of the pressure-sensitive adhesive sheet irradiated with the laser beam.   The pressure-sensitive adhesive sheet support according to claim 11, wherein the pressure-sensitive adhesive sheet support has a flat plate shape.   The pressure-sensitive adhesive sheet according to claim 12, wherein the plate-shaped pressure-sensitive adhesive sheet support constitutes a suction portion of a suction device, and the holes having a depth of 150 µm or more serve as suction holes of the suction device. Support.   The pressure-sensitive adhesive sheet support according to claim 11, wherein the pressure-sensitive adhesive sheet support comprises a porous body having continuous voids.   The pressure-sensitive adhesive sheet support according to claim 11, wherein the pressure-sensitive adhesive sheet support has a roll shape.   The pressure-sensitive adhesive sheet support according to claim 15, wherein the groove is formed along the circumferential direction of the roll-shaped pressure-sensitive adhesive sheet support.   The pressure-sensitive adhesive sheet support according to claim 15 or 16, wherein the roll-shaped pressure-sensitive adhesive sheet support has a plurality of suction holes and has a cylindrical shape that can be sucked from the inside.   A suction device comprising the pressure-sensitive adhesive sheet support according to claim 13 or 17 as a suction portion and capable of performing suction from the suction hole. A plurality of roll-shaped pressure-sensitive adhesive sheet supports according to any one of claims 15 to 17,
A suction conveyance device provided between the roll-shaped pressure-sensitive adhesive sheet supports so that the pressure-sensitive adhesive sheet can be adhered to the plurality of roll-shaped pressure-sensitive adhesive sheet supports;
A through-hole-formed pressure-sensitive adhesive sheet manufacturing apparatus comprising: a laser light irradiation device capable of irradiating laser light to the vicinity of a close contact portion between the pressure-sensitive adhesive sheet and the roll-shaped support.

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