JP2006001951A - Adhesive sheet and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for producing an adhesive sheet in which air pockets or blisters can be prevented or removed by forming through-holes independently in a base material and an adhesive layer. <P>SOLUTION: A resin composition containing a resin which composes a base material 2 is coated on a process material 1, and the resin composition is foamed to form through-holes 21 by the foaming on the base material 2 to be formed into a film. Then, a primer layer 3 and an adhesive layer 4 are formed on the back side of the base material 2, and the gas from the through-holes 21 in the base material 2 is moved to the outside of the adhesive layer 4 to form through-holes 41 in the adhesive layer 4. Lastly, a release material 6 is optionally laminated to form an adhesive sheet 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an adhesive sheet capable of preventing or removing air pockets and blisters, and a method for producing such an adhesive sheet.

  When the pressure-sensitive adhesive sheet is manually attached to the adherend, air can be trapped between the adherend and the pressure-sensitive adhesive surface, which may impair the appearance of the pressure-sensitive adhesive sheet. Such air pockets are likely to occur particularly when the area of the adhesive sheet is large.

  In order to eliminate problems with the appearance of the pressure-sensitive adhesive sheet due to air accumulation, the pressure-sensitive adhesive sheet can be replaced with another pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet can be peeled off and re-attached, or a puncture can be made in the swollen part of the pressure-sensitive adhesive sheet Or evacuating the air. However, when the adhesive sheet is replaced, not only labor is required, but also the cost increases, and when the adhesive sheet is reapplied, the adhesive sheet is torn, the surface is wrinkled, the adhesive In many cases, problems such as a decrease in performance occur. On the other hand, the method of making a hole with a needle impairs the appearance of the pressure-sensitive adhesive sheet.

  In order to prevent the accumulation of air, there is a method of applying water after applying water to the adherend or adhesive surface in advance, but adhesive sheets with large dimensions such as glass scattering prevention films, decorative films, marking films, etc. to be attached to windows It takes a lot of time and effort to put on. Also. Although there is a method for preventing the occurrence of air pockets by sticking using a machine instead of manual work, mechanical sticking may not be applied depending on the use of the adhesive sheet or the site / shape of the adherend.

  On the other hand, resin materials such as acrylic resin, ABS resin, polystyrene resin, and polycarbonate resin may generate gas when heated or not heated. When an adhesive sheet is affixed, blisters (bulges) are generated in the adhesive sheet by the gas generated from the adherend.

In order to solve the above problems, Patent Document 1 and Patent Document 2 propose a pressure-sensitive adhesive sheet in which a base material and a pressure-sensitive adhesive layer are provided with through holes penetrating them. In this pressure-sensitive adhesive sheet, air or gas is removed from the through-hole to prevent air accumulation or blistering in the pressure-sensitive adhesive sheet.
Japanese Patent Laid-Open No. 2-107682 Japanese Utility Model Publication No. 4-100235

  In the pressure-sensitive adhesive sheet, the substrate and the pressure-sensitive adhesive layer were punched using a blade mold and a hole mold or punched using a heating needle to form a through hole. A method of forming through holes separately for each of the base material and the pressure-sensitive adhesive layer has not been known.

  The present invention relates to a pressure-sensitive adhesive sheet capable of preventing or removing air pockets and blisters obtained by separately forming through-holes for a base material and a pressure-sensitive adhesive layer, a method for producing such a pressure-sensitive adhesive sheet, and a method for producing the pressure-sensitive adhesive sheet It aims at providing the laminated body which can be used for.

  In order to achieve the above object, first, the present invention includes a base material and a pressure-sensitive adhesive layer laminated on the base material, and has a plurality of through-holes penetrating or penetrating the base material and the pressure-sensitive adhesive layer. The pressure-sensitive adhesive sheet is formed, and the through hole of the pressure-sensitive adhesive layer is formed to have a predetermined diameter when gas from the through-hole of the base material passes through the pressure-sensitive adhesive layer. A pressure-sensitive adhesive sheet is provided (claim 1).

  In the present specification, the “through-hole that can penetrate” refers to a through-hole that actually penetrates by pressure-bonding the pressure-sensitive adhesive sheet or by the pressure of the generated gas, etc., even though it does not normally penetrate. .

  Here, the substrate may be a single layer or a plurality of layers. Moreover, the through-hole may be formed in the adhesive sheet at random, and may be formed in the predetermined position of the adhesive sheet. In this specification, “sheet” includes the concept of film, and “film” includes the concept of sheet.

  The pressure-sensitive adhesive sheet according to the present invention (invention 1) can be obtained by forming through holes separately for each of the base material and the pressure-sensitive adhesive layer.

In the above invention (claim 1), the diameter of the through hole in the substrate and the adhesive layer is 0.1 to 1000 [mu] m, the pore density is preferably 30～50,000 pieces / 100 cm ² (according Item 2). According to this invention (invention 2), a pressure-sensitive adhesive sheet is obtained that is excellent in air detachability and can ensure sufficient adhesive force.

  2ndly, this invention consists of a base material and the gas barrier material laminated | stacked on the surface side of the said base material, and the laminated body by which the through-hole which penetrates the said base material or can penetrate is formed in the said base material The adhesive layer is formed on the back side of the base material in the laminate, and the thickness of the adhesive layer is increased by moving the gas from the through hole of the base material to the outside of the adhesive layer. A method for producing a pressure-sensitive adhesive sheet is provided, wherein a plurality of through-holes penetrating in the vertical direction are formed in the pressure-sensitive adhesive layer so as to have a predetermined diameter.

  3rdly, this invention consists of a base material and the gas barrier material laminated | stacked on the surface side of the said base material, and the laminated body by which the through-hole which penetrates the said base material or can penetrate is formed in the said base material And forming a primer layer having a through hole at a position corresponding to the through hole of the substrate or a primer layer not having the through hole on the back surface side of the substrate in the laminate, and While forming the pressure-sensitive adhesive layer, by moving the gas from the through-hole of the base material to the outside of the pressure-sensitive adhesive layer, the through-hole penetrating the pressure-sensitive adhesive layer in the thickness direction has a predetermined diameter Thus, a method for producing a pressure-sensitive adhesive sheet is provided, wherein a plurality of the pressure-sensitive adhesive layers are formed on the pressure-sensitive adhesive layer.

  According to the said invention (invention 3 and 4), a base material and an adhesive layer can form a through-hole separately, respectively, and the adhesive sheet which can prevent or remove an air pocket and a blister can be obtained. In particular, according to the latter invention (invention 4), it is possible to improve the adhesion between the substrate and the pressure-sensitive adhesive layer, and to prevent the solvent in the pressure-sensitive adhesive layer from adversely affecting the substrate. Can do.

The invention in (Claim 3, 4), and 0.1~1000μm the diameter of the through hole of the substrate, preferably the pore density and 30～50,000 pieces / 100 cm ² (Claim 5) .

  Moreover, in the said invention (inventions 3-5), while apply | coating the resin composition containing resin which comprises a base material on a gas barrier material, the said resin composition is made to foam, and the base material formed into a film is used. The laminate may be produced by forming a through hole by foaming (Claim 6), or a base material on which a gas barrier material is laminated is subjected to drilling, and the base material penetrates the base material. The gas barrier material may form the laminated body by forming a hole that does not pass through (Claim 8), or form a through hole that penetrates the base material by drilling the base material. Then, the laminate may be produced by laminating the base material on which the through holes are formed and the gas barrier material (claim 9).

  In the said invention (invention 6), it is preferable that the said resin composition contains a foaming agent (invention 7). By using the foaming agent in this way, it is easy to control the formation of through holes.

  Moreover, in the said invention (invention 8 and 9), it is preferable that the said drilling process is a laser processing (invention 10). According to laser processing, it is possible to easily form a fine through-hole having a good air escape property at a predetermined position with a desired hole density. However, the formation method of the through hole is not limited to this, and may be formed by, for example, a water jet, a micro drill, a precision press, a hot needle, a molten hole, or the like.

  4thly this invention is equipped with the base material and the gas barrier material laminated | stacked on the surface side of the said base material, and the said base material is formed with two or more through-holes which can penetrate or penetrate the said base material. A laminate for producing a featured PSA sheet is provided (claim 11). According to such a laminated body, a through-hole can be formed in an adhesive layer by moving the gas from the through-hole of a base material to the outer side of an adhesive layer.

  According to the present invention, a pressure-sensitive adhesive sheet can be obtained in which through holes are formed separately for each of the base material and the pressure-sensitive adhesive layer to prevent or remove air pockets and blisters.

Hereinafter, embodiments of the present invention will be described.
[First Embodiment]
Drawing 1 is a sectional view showing the manufacturing method of the adhesive sheet concerning a 1st embodiment of the present invention.

  In the present embodiment, first, as shown in FIGS. 1A to 1B, a resin composition containing a resin constituting the base material 2 is applied onto the process material 1 as a gas barrier material. Then, the resin composition is foamed, and through holes 21 are formed in the base material 2 to be formed.

  As the process material 1, as long as it has gas barrier properties, is excellent in releasability from the base material 2, and has smoothness or surface roughness that can impart desired smoothness to the surface of the base material 1, It is not particularly limited.

  As such a process material 1, for example, a silicone-based, polyester-based, acrylic-based, alkyd-based, urethane-based, or fluorine-based release agent is applied to one side of a film made of a resin such as polyethylene terephthalate, polypropylene, or polyethylene. A gas barrier layer was formed by resin coating or laminating on various paper and nonwoven fabrics such as high-quality paper and glassine paper, and a release agent layer was formed on the gas barrier layer. Things can be used. The thickness of the process material 1 is usually about 10 to 200 μm, preferably about 25 to 150 μm.

  Examples of the resin constituting the substrate 2 include resins such as polyvinyl chloride, poly (meth) acrylate, polyurethane, polyester, polyolefin, polyamide, halogenated polyamide, polyimide, polycarbonate, polyvinyl alcohol, and cellulose triacetate.

  Here, foaming of the resin composition can be performed by a foaming agent dispersion method, a gas mixing method, a water / solvent volatilization method, a chemical reaction method, or the like, and among them, the foaming agent dispersion method is preferable. In this case, the resin composition contains at least a foaming agent and usually a solvent in addition to the resin constituting the substrate 2, and other desired additives such as ultraviolet absorbers and plasticizers as necessary. , A colorant, a heat stabilizer, a filler and the like may be contained.

  Examples of the foaming agent include one or two types of organic foaming agents such as azobisisobutyronitrile, azodicarbonamide, and benzenesulfonylhydrazide, inorganic foaming agents such as sodium bicarbonate and ammonium carbonate, and microcapsules. The above can be used.

  The particle size of the foaming agent is preferably from 0.1 to 2000 μm, particularly preferably from 0.5 to 1500 μm. By using a foaming agent having such a particle size, the size (diameter) of the through hole 21 formed in the substrate 2 can be set within a preferable range described later.

  The content of the foaming agent in the resin composition is preferably 0.1 to 50 parts by weight, particularly 1 to 10 parts by weight, based on 100 parts by weight of the solid content of the resin constituting the substrate 2. Is preferred. By setting the content of the foaming agent in this way, the hole density of the through holes 21 formed in the substrate 2 can be set within a preferable range described later.

  The viscosity of the resin composition is preferably 100 to 20,000 mPa · s at a B-type viscometer 6 rpm. When the viscosity of the resin composition is outside the above range, the through hole 21 is hardly formed even if the foaming agent is foamed.

  The resin composition may be applied by a conventional method, for example, using a coating machine such as a roll coater, knife coater, roll knife coater, air knife coater, die coater, bar coater, gravure coater, curtain coater, etc. be able to.

  The base material 2 is formed by drying the resin composition applied on the process material 1. At this time, the foaming agent is foamed by heating the resin composition, and the through hole 21 is formed in the base material 2. Is done. Heating is preferably performed in two stages. In the first stage, the resin composition is dried to some extent by heating at a temperature lower than the foaming temperature of the foaming agent. In the second stage, the temperature is higher than the foaming temperature of the foaming agent. Heat to foam the foaming agent. By performing the heating in two stages in this way, it is easy to form the through hole 21 having a good shape.

  The thickness of the base material 2 formed as described above is preferably 1 to 500 μm, and particularly preferably 3 to 300 μm.

Moreover, it is preferable that the diameter of the through-hole 21 formed in the base material 2 is 0.1-2000 micrometers, and it is especially preferable that it is 10-1500 micrometers. The pore density of the through holes 21 is preferably from 30～100,000 pieces / 100 cm ^2, it is preferred particularly 100 to 50,000 pieces / 100 cm ^2. By setting the diameter and the hole density of the through-holes 21 within the above ranges, the pressure-sensitive adhesive layer formed in the latter stage has good air detachability and can secure a sufficient adhesive force.

  Here, when the hole diameter on the surface of the base material 2 of the through hole 21 is 40 μm or less, the hole itself (internal space of the through hole 21) may be invisible to the naked eye. When it is required that the through-hole 21 is not visible, the upper limit of the diameter of the through-hole 21 on the surface of the substrate 2 is preferably 40 μm.

  In the holes formed in the base material 2 by foaming of the foaming agent, there is a resin thin film (bubble film) on the surface side of the base material 2 (contact surface side with the process material 1). There are some that do not penetrate completely, but there are also those that actually penetrate the base material 2 due to the bubble film being broken by pressure bonding of the adhesive sheet or the pressure of the generated gas, etc. 21.

  Since the through-hole 21 of the base material 2 in this embodiment is formed by foaming of the resin composition, it is randomly formed on the base material 2.

  In the present embodiment, next, as shown in FIG. 1C, a primer is applied on the base material 2 so that a through hole 31 is formed at a position corresponding to the through hole 21 of the base material 2. Layer 3 is formed.

  Specifically, by moving the air present in the through hole 21 of the base material 2 to the outside of the primer layer 3, a through hole 31 having a predetermined diameter is formed in the primer layer 3, or the base material 2 is penetrated. A primer is applied so that the primer layer 3 is not formed in the hole 21.

  The movement of the air present in the through holes 21 of the base material 2 to the outside of the primer layer 3 can be performed by, for example, heating the base material 2 on which the primer layer 3 is formed. By this heating, the air existing in the through-hole 21 of the base material 2 expands and leaves the primer layer 3 to the outside. Since the process material 1 having gas barrier properties is laminated on the surface side of the base material 2, the expanded air in the through hole 21 moves only to the primer layer 3 side. In this way, the portion of the primer layer 3 through which air has passed becomes the through hole 31 of the primer layer 3. The diameter and hole density of the through-holes 31 formed in the primer layer 3 are approximately the same as the diameter and hole density of the through-holes 21 of the substrate 2.

  Even when a through hole 31 having a diameter smaller than a predetermined diameter (diameter: 0.1 μm) is formed at a position corresponding to the through hole 21 of the substrate 2 when the primer is applied, as described above. By allowing the gas from the through hole 21 of the base material 2 to pass through, the diameter of the through hole 31 of the primer layer 3 can be expanded to substantially the same size as the diameter of the through hole 21 of the base material 2.

  Examples of the primer include polyester, polyurethane, polyvinyl chloride, polyvinylidene chloride, chlorinated polyolefin, acrylic resin, epoxy resin, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, aminoethylated resin, and the like. Can be used.

  The thickness of the primer layer 3 is preferably 0.05 to 5 μm, and particularly preferably 0.1 to 3 μm.

  In order to form the primer layer 3, a coating agent containing the material constituting the primer layer 3 and, if desired, a solvent is prepared, and a roll coater, a knife coater, a roll knife coater, an air knife coater, a die coater, and a bar coater are prepared. What is necessary is just to apply | coat on the base material 2 with coating machines, such as a gravure coater and a curtain coater.

  Here, the viscosity of the primer coating agent is preferably 3000 mPa · s or less at 6 rpm with a B-type viscometer, and particularly preferably 1 to 1500 mPa · s. If the viscosity of the primer coating agent is too high, gas movement in the primer layer 3 described above may be hindered. Even if the through hole 31 is formed in the primer layer 3, the periphery of the opening of the through hole 31 rises. The surface smoothness of the primer layer 3 may be lowered.

  By forming the primer layer 3 as described above, the adhesiveness with the pressure-sensitive adhesive layer can be improved, and the solvent in the pressure-sensitive adhesive layer can be prevented from adversely affecting the substrate 2.

  Subsequently, as shown in FIG.1 (d), an adhesive is apply | coated on the said primer layer 3, and the adhesive layer 4 (undried state) is formed. The type of the pressure-sensitive adhesive is not particularly limited as long as it is a material that can form the through-hole 41 in the pressure-sensitive adhesive layer 4, and may be any of acrylic, polyester, polyurethane, rubber, silicone, and the like. May be. Further, the pressure-sensitive adhesive may be any of an emulsion type, a solvent type or a solventless type, and may be any of a crosslinking type such as thermal crosslinking or ionizing radiation crosslinking or a non-crosslinked type.

  The thickness (when dried) of the pressure-sensitive adhesive layer 4 is preferably 1 to 300 μm, and particularly preferably 3 to 100 μm, but can be appropriately changed according to the use of the pressure-sensitive adhesive sheet.

  In order to form the pressure-sensitive adhesive layer 4, a coating agent containing the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4 and, if desired, a solvent is prepared, and a roll coater, knife coater, roll knife coater, air knife coater, die coater is prepared. What is necessary is just to apply | coat on the primer layer 3 with coating machines, such as a bar coater, a gravure coater, and a curtain coater.

  Here, the viscosity of the pressure-sensitive adhesive coating agent is preferably 20,000 mPa · s or less, particularly preferably 200 to 5000 mPa · s at 6 rpm. If the viscosity of the pressure-sensitive adhesive coating agent is too high, there is a risk of hindering the movement of gas in the pressure-sensitive adhesive described later, and even if the through-hole 41 is formed in the pressure-sensitive adhesive layer 4, the periphery of the opening of the through-hole 41 The surface smoothness of the pressure-sensitive adhesive layer 4 may be lowered.

  In FIG. 1 (d), in the pressure-sensitive adhesive layer 4, the diameter of the through-hole 21 of the substrate 2 is in some positions corresponding to the through-hole 21 of the substrate 2 (and the through-hole 31 of the primer layer 3). Although the through-hole 41p which has a smaller diameter is formed, this through-hole 41p does not need to be formed at the time of application | coating of an adhesive, and is all over the position corresponding to the through-hole 21 of the base material 2. It may be formed.

  Subsequently, as shown in FIG. 1 (e), the air present in the through-hole 21 of the substrate 2 and the through-hole 31 of the primer layer 3 is moved to the outside of the pressure-sensitive adhesive layer 4. A through hole 41 is formed in Thereby, the through-hole 5 which penetrates the base material 2, the primer layer 3, and the adhesive layer 4 which consists of the through-hole 21 of the base material 2, the through-hole 31 of the primer layer 3, and the through-hole 41 of the adhesive layer 4 is formed. Is done.

  The movement (rise) of the gas in the pressure-sensitive adhesive may be naturally performed by gas buoyancy, or is performed by heating the substrate 2 on which the pressure-sensitive adhesive layer 4 is formed and drying the pressure-sensitive adhesive layer 4. You may let them. When the gas moves through the pressure-sensitive adhesive, the gas exits from the pressure-sensitive adhesive layer 4 while retreating the pressure-sensitive adhesive, so that the portion through which the gas has passed becomes the through hole 41 of the pressure-sensitive adhesive layer 4.

  When the base material 2 on which the pressure-sensitive adhesive layer 4 is formed is heated, the air present in the through-hole 21 of the base material 2 and the through-hole 31 of the primer layer 3 expands, and the amount of gas that moves through the pressure-sensitive adhesive layer 4 increases. Therefore, the through hole 41 can be formed more efficiently. By changing the heating temperature, heating pattern, etc., the size (diameter) of the through-hole 41 formed in the pressure-sensitive adhesive layer 4 can be controlled. The heating temperature is preferably in the range of room temperature to 150 ° C.

  Since the process material 1 having gas barrier properties is laminated on the surface side of the base material 2, the expanded air in the through hole 21 of the base material 2 and the through hole 31 of the primer layer 3 is the pressure-sensitive adhesive layer. The through hole 41 can be efficiently formed by moving only to the 4 side.

  The diameter and hole density of the through holes 41 formed in the pressure-sensitive adhesive layer 4 are preferably substantially the same as the diameter and hole density of the through holes 21 of the base material 2, but are different within the following range. Also good. That is, the diameter of the through hole 41 is preferably 0.1 to 2000 μm, and particularly preferably 0.5 to 1500 μm. If the diameter of the through hole 41 is less than 0.1 μm, the gas is difficult to pass through the through hole 41, and if the diameter of the through hole 41 exceeds 2000 μm, the adhesive force of the pressure-sensitive adhesive layer 4 may be reduced.

Pore density of the through holes 41 is preferably from 30～100,000 pieces / 100 cm ^2, it is preferred particularly 100 to 50,000 pieces / 100 cm ^2. When the hole density of the through holes 41 is less than 30/100 cm ² , the gas is difficult to escape, and when the hole density of the through holes 41 exceeds 100,000 / 100 cm ² , the adhesive strength of the pressure-sensitive adhesive layer 4 decreases. There is a fear.

  The ratio of the hole density between the through-hole 41 of the pressure-sensitive adhesive layer 4 and the through-hole 21 of the base material 2 (the hole density of the through-hole 41 of the pressure-sensitive adhesive layer 4 / the hole density of the through-hole 21 of the base material 2) is 0. It is preferably 3 to 1, particularly preferably 0.6 to 1, and most preferably 1. When the ratio of the hole density between the through hole 41 of the pressure-sensitive adhesive layer 4 and the through hole 21 of the base material 2 is less than 0.3, the air escape performance expected from the hole density of the through hole 21 of the base material 2 is sufficient. May not be obtained.

  The diameter of the through hole 41p formed in the adhesive layer 4 at the time of application of the adhesive (smaller than the diameter of the through hole 21 of the base material 2) is from the through hole 21 of the base material 2 as described above. By passing the gas, it can be enlarged to a desired size.

  Finally, as needed, as shown in FIG.1 (f), the peeling material 6 is laminated | stacked on the adhesive surface of the adhesive layer 4, and it is set as the adhesive sheet 7 of this embodiment. The pressure-sensitive adhesive sheet 7 is formed by laminating a process material 1, a base material 2, a primer layer 3, a pressure-sensitive adhesive layer 4, and a release material 6, and the base material 2, the primer layer 3 and the pressure-sensitive adhesive layer 4. Through-holes 5 are formed at random.

  The process material 1 is usually peeled off from the substrate 2 after the manufacture of the pressure-sensitive adhesive sheet 7 or before the pressure-sensitive adhesive sheet 7 is pasted, and the release material 6 is peeled off from the pressure-sensitive adhesive layer 4 when the pressure-sensitive adhesive sheet 7 is used. The

  In the above embodiment, the pressure-sensitive adhesive layer 4 is formed after forming the through-hole 31 in the primer layer 3, but the present invention is not limited to this, and the primer layer without forming the through-hole 31. 3 (primer layer 3 is in an undried state), and then the pressure-sensitive adhesive layer 4 is formed, and then the air present in the through-holes 21 of the substrate 2 is moved to the outside of the pressure-sensitive adhesive layer 4 to thereby form the primer. The through holes 31 and 41 having a predetermined diameter may be formed in the layer 3 and the pressure-sensitive adhesive layer 4.

  In addition, the primer layer 3 may be omitted in the pressure-sensitive adhesive sheet 7, and in that case, the back surface of the base material 2 is irradiated with an electron beam or subjected to a corona discharge treatment to modify the surface to thereby improve the pressure-sensitive adhesive. The adhesion with the layer 4 may be increased.

[Second Embodiment]
FIG. 2 is a cross-sectional view showing a method for producing an adhesive sheet according to the second embodiment of the present invention.

  In this embodiment, first, as shown to Fig.2 (a)-(b), the protective sheet 8 as a gas barrier material is stuck on the surface side of 2 A of base materials.

  Examples of the material of the base 2A in the present embodiment include a resin film, a metal film, a resin film on which a metal is deposited, paper, a nonwoven fabric, and a laminate thereof.

  Examples of the resin film include polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyvinyl chloride, polystyrene, polyurethane, polycarbonate, polyamide, polyimide, polymethyl methacrylate, polybutene, polybutadiene, and polymethylpentene. , Ethylene vinyl acetate copolymer, ethylene (meth) acrylic acid copolymer, ethylene (meth) acrylic ester copolymer, ABS resin, ionomer resin; polyolefin, polyurethane, polystyrene, polyvinyl chloride, polyester, etc. A film made of a resin such as a thermoplastic elastomer, a foamed film, or a laminated film thereof can be used. These resin films may contain various additives such as an inorganic filler, an organic filler, and an ultraviolet absorber.

  Further, as the paper, for example, high-quality paper, glassine paper, coated paper, laminated paper and the like can be used.

  Note that a decorative layer may be formed on the surface of the material by, for example, a method such as printing, printing, application of a paint, transfer from a transfer sheet, vapor deposition, sputtering, or the like. An undercoat layer such as an easy adhesion coat or a gloss adjustment coat may be formed, or a top coat layer such as a hard coat or a contamination prevention coat may be formed. In addition, the decorative layer, undercoat layer, or topcoat layer may be formed on the entire surface of the material, or may be partially formed.

  The thickness of the substrate 2A is usually 1 to 500 μm, preferably about 3 to 300 μm, but can be appropriately changed according to the intended use of the pressure-sensitive adhesive sheet.

  The protective sheet 8 is not particularly limited as long as it can be attached to and peeled from the substrate 2A and has a gas barrier property. Examples of such a protective sheet 8 include, for example, those in which a releasable pressure-sensitive adhesive layer is formed on one side of a film made of a resin such as polyethylene terephthalate, polypropylene, and polyethylene, various types of paper such as high-quality paper and glassine paper, and non-woven fabrics. A gas barrier layer formed by resin coating or laminating, and a re-peelable pressure-sensitive adhesive layer formed on the gas barrier layer can be used. The thickness of the protective sheet 8 is usually about 10 to 200 μm, preferably about 25 to 150 μm.

  Next, as shown in FIG.2 (c), the base material 2A which stuck the protective sheet 8 is drilled, and the through-hole 21 is formed only in the base material 2A. In this manufacturing method, the through-hole 21 is formed in the base material 2A by laser processing which irradiates a laser from the back surface side (protection sheet 8 non-sticking side) of the base material 2A. According to laser processing, the through-hole 21 having a desired diameter can be easily formed at a desired position (a position where air release properties are desired) of the substrate 2A with a desired hole density. However, the present invention is not limited to laser processing, and the through hole 21 may be formed in the substrate 2A by a hole, a hot needle, a micro drill, a precision press, a water jet, or the like.

The type of laser used for laser processing is not particularly limited. For example, carbon dioxide (CO ₂ ) laser, TEA-CO ₂ laser, YAG laser, UV-YAG laser, excimer laser, semiconductor laser, YVO ₄ laser A YLF laser or the like can be used.

The diameter of the through hole 21 formed in the substrate 2A is preferably 0.1 to 2000 μm, and particularly preferably 10 to 1500 μm. Further, the pore density of the through holes 21 is preferably from 30～100,000 pieces / 100 cm ^2, it is preferred particularly 100 to 50,000 pieces / 100 cm ^2. By setting the diameter and the hole density of the through-holes 21 within the above ranges, the pressure-sensitive adhesive layer formed in the latter stage has good air detachability and can secure a sufficient adhesive force.

  Here, if the hole diameter of the through hole 21 on the surface of the base material 2A is 40 μm or less, the hole itself (internal space of the through hole 21) may be invisible to the naked eye. When it is required that the through hole 21 is not visible, it is preferable that the upper limit of the hole diameter of the through hole 21 on the surface of the substrate 2A is 40 μm.

  In this embodiment, laser processing is performed from the back surface side of the substrate 2A. However, when the through hole 21 is formed by laser processing, the through hole 21 often has a tapered taper. The hole diameter is smaller on the surface side of the base material 2A than on the back surface side of the base material 2A. Therefore, the through holes 21 are less noticeable on the surface of the pressure-sensitive adhesive sheet, and the appearance of the pressure-sensitive adhesive sheet can be kept good. .

  Further, when the through hole 21 is formed by laser processing, a melt by heat, so-called dross, may be formed at the periphery of the opening of the through hole 21, but the protective sheet 8 is laminated on the surface of the substrate 2 </ b> A. By being done, dross becomes difficult to form in the base material 2A, and the external appearance of an adhesive sheet can be kept better.

  Next, in the same manner as the pressure-sensitive adhesive sheet manufacturing method according to the first embodiment described above, as shown in FIGS. 2D to 2F, the pressure-sensitive adhesive layer 4 is formed on the back surface of the substrate 2A. The through hole 41 is formed in the pressure-sensitive adhesive layer 4. Thereby, the through-hole 5 which penetrates the base material 2A and the adhesive layer 4 which consists of the through-hole 21 of the base material 2A and the through-hole 41 of the adhesive layer 4 is formed. And the peeling material 6 is laminated | stacked on the adhesive surface of the adhesive layer 4 as needed, and it is set as the adhesive sheet 7A of this embodiment. This pressure-sensitive adhesive sheet 7A is formed by laminating a protective sheet 8, a base material 2A, a pressure-sensitive adhesive layer 4, and a release material 6, and a through hole 5 penetrating the base material 2A and the pressure-sensitive adhesive layer 4 is in a predetermined position. Are formed with a predetermined hole density.

  The protective sheet 8 is usually peeled off from the base material 2A after the production of the pressure-sensitive adhesive sheet 7 or before the pressure-sensitive adhesive sheet 7 is pasted, and the release material 6 is peeled off from the pressure-sensitive adhesive layer 4 when the pressure-sensitive adhesive sheet 7 is used. The

  In the above embodiment, the base material 2A to which the protective sheet 8 has been attached has been punched. Before the adhesive layer 4 is formed after the base material 2A is punched. The protective sheet 8 may be attached to the substrate, and the process material 1 and the substrate 2 in the first embodiment may be used instead of the protective sheet 8 and the substrate 2A. Furthermore, also in this embodiment, the primer layer 3 may be provided between the base material 2 and the adhesive layer 4 as in the first embodiment, and the back surface of the base material 2A is irradiated with an electron beam or corona. The surface may be modified or the adhesiveness with the pressure-sensitive adhesive layer 4 may be improved by performing a discharge treatment.

[Use of adhesive sheet]
When the pressure-sensitive adhesive sheets 7 and 7A are attached to the adherend, the process material 1 or the protective sheet 8 is peeled off from the base material 2 and the release material 6 is peeled off from the pressure-sensitive adhesive layer 4 to expose the pressure-sensitive adhesive layer 4. The pressure-sensitive adhesive sheets 7 and 7A are pressed against the adherend so that the pressure-sensitive adhesive surface is in close contact with the adherend. At this time, air between the adherend and the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer 4 escapes from the through-hole 5 formed in the pressure-sensitive adhesive sheets 7 and 7A to the outside of the surface of the base material 2 and 2A. It is difficult for air to be caught between the pressure-sensitive adhesive surface and air accumulation is prevented. Even if air is entrained and an air pool is formed, the air is re-bonded to the peripheral area of the air reservoir including the air reservoir or the air reservoir so that the air can be removed from the through holes 5 of the adhesive sheets 7 and 7A. The air pool disappears through the outside of the surfaces of the materials 2 and 2A. Such removal of air pockets is possible even after a long time has elapsed since the adhesive sheets 7 and 7A were attached.

  Moreover, even if gas is generated from the adherend after the adhesive sheets 7 and 7A are attached to the adherend, the gas escapes from the through holes 5 of the adhesive sheets 7 and 7A to the outside of the surfaces of the base materials 2 and 2A. Therefore, it is prevented that blisters are generated in the pressure-sensitive adhesive sheets 7 and 7A.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  EXAMPLES Hereinafter, although an Example etc. demonstrate this invention further more concretely, the scope of the present invention is not limited to these Examples etc.

[Example 1]
100 parts by weight of a vinyl chloride resin, 2.5 parts by weight of an ultraviolet absorber (benzotriazole), 25 parts by weight of a polyester plasticizer (Adekasizer PN260, manufactured by Asahi Denka Kogyo Co., Ltd.), and a phthalate ester plasticizer ( 10 parts by weight of Chisso Corporation, DOP, 20 parts by weight of colorant (Daiichi Seika Kogyo Co., Ltd., VTSK9311 Black), 3 parts by weight of thermal stabilizer (Ba / Zn), and 25 parts by weight of solvent (butyl cellosolve) And 25 parts by weight of a solvent (manufactured by Gordo Solvent Co., Supersol # 1500) and 6 parts by weight of a foaming agent (azodicarbonamide, manufactured by Eiwa Chemical Industries, Ltd., FE-788, particle size: about 10 μm), The substrate coating agent (viscosity: 4000 mPa · s) was used. The viscosity of the coating agent is a value measured with a B-type viscometer at 6 rpm (hereinafter the same).

As a process material, a polyethylene terephthalate film (manufactured by Teijin DuPont Films, U4Z-50, thickness: 50 μm) prepared on one side was prepared. The coating material for the base material was applied to the surface of the process material with a knife coater so that the thickness after drying was 50 μm, and then dried at 140 ° C. for 1 minute and further at 190 ° C. for 2 minutes to give a black opaque A base material was formed. At this time, through holes having a diameter of 10 to 40 μm on the substrate surface side (process material side) and a diameter of 10 to 200 μm on the substrate back side are formed at a hole density of about 40,000 / 100 cm ² on the substrate. It was done. In addition, the diameter of the through hole was measured using a scanning electron microscope (manufactured by Hitachi, Ltd., model S-2360N) (hereinafter the same).

The back side of the substrate is coated with a knife coater so that the adhesive layer (viscosity: 2000 mPa · s) of acrylic solvent-based pressure-sensitive adhesive (Pintech) is about 15 μm after drying the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer was formed by coating on (the side having no process material) and heated at 90 ° C. for 1 minute to dry the pressure-sensitive adhesive layer. As a result, through-holes having a diameter of 10 to 250 μm were formed in the pressure-sensitive adhesive layer at a hole density of about 40,000 holes / 100 cm ² .

  And the peeling treatment surface of the release material (the Lintec company make, PET3811) which peeled the single side | surface of the polyethylene terephthalate sheet | seat with the silicone type release agent was piled up on the said adhesive layer, and this was used as the adhesive sheet.

[Example 2]
100 parts by weight of a polycarbonate-based urethane resin (manufactured by Dainichi Seika Kogyo Co., Ltd., Resamine 8820), 20 parts by weight of a colorant (manufactured by Dainichi Seika Kogyo Co., Ltd., VTSK9311 Black), and a foaming agent (azodicarbonamide, produced by Eiwa Kasei Kogyo Co., Ltd.) , FE-788, particle size: about 10 μm) and 6 parts by weight were mixed to obtain a base coating agent (viscosity: 4000 mPa · s).

The base material having the same process material as that of Example 1 was applied to the surface of the release treatment with a knife coater so that the thickness after drying was 50 μm, and dried at 130 ° C. for 2 minutes to obtain a black opaque base material. Formed. At this time, through holes having a diameter of 10 to 40 μm on the substrate surface side (process material side) and a diameter of 30 to 300 μm on the substrate back side are formed at a hole density of about 20,000 / 100 cm ² on the substrate. It was done.

Next, a primer coating agent in which 100 parts by weight of a polyurethane resin (Daiichi Kogyo Seiyaku Co., Ltd., Superflex 107M) as a primer and 170 parts by weight of a solvent in which isopropyl alcohol and water are mixed at a weight ratio of 70: 100 are mixed ( Viscosity: 20 mPa · s) is applied to the back surface of the substrate with a knife coater so that the thickness after drying is about 1 μm, and a primer layer is formed, and the primer layer is heated at 60 ° C. for 1 minute. Dried. As a result, through holes having a diameter of 30 to 300 μm were formed in the primer layer with a hole density of about 20,000 holes / 100 cm ² .

The same acrylic solvent-type pressure-sensitive adhesive as in Example 1 was applied onto the primer layer with a knife coater so that the thickness after drying of the pressure-sensitive adhesive layer was about 15 μm, and a pressure-sensitive adhesive layer was formed at 90 ° C. For 1 minute to dry the pressure-sensitive adhesive layer. As a result, through-holes having a diameter of 20 to 350 μm were formed in the pressure-sensitive adhesive layer at a hole density of about 20,000 holes / 100 cm ² .

  And the peeling process surface of the same peeling material as Example 1 was piled up and bonded to the said adhesive layer, and this was made into the adhesive sheet.

Example 3
A base material coating agent was prepared in the same manner as in Example 1 except that the foaming agent was not added, and the thickness after drying the base material coating agent on the release treatment surface of the same process material as in Example 1 was 50 μm. Was applied by a knife coater and dried at 140 ° C. for 1 minute and further at 190 ° C. for 2 minutes to form a black opaque substrate.

The obtained laminate (process material + base material) is irradiated with a CO ₂ laser from the back side of the base material (side without the process material), the depth is 52 to 70 μm, and the base surface side (process material side) Through holes having a diameter of about 30 μm and a diameter of about 70 μm on the back side of the substrate were formed at a hole density of 2500/100 cm ² .

The same acrylic solvent-type pressure-sensitive adhesive as in Example 1 was applied to the back surface of the substrate with a knife coater so that the thickness of the pressure-sensitive adhesive layer after drying was about 15 μm to form a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer was dried by heating at 0 ° C. for 1 minute. As a result, through-holes having a diameter of 60 to 150 μm were formed in the pressure-sensitive adhesive layer at a hole density of about 2500/100 cm ² .

  And the peeling process surface of the same peeling material as Example 1 was piled up and bonded to the said adhesive layer, and this was made into the adhesive sheet.

Example 4
A black opaque vinyl chloride film (manufactured by Lintec, FP M5071 black, thickness: 50 μm) as a substrate is irradiated with a CO ₂ laser, and through holes having a diameter of 30 to 40 μm are 2500 holes / 100 cm ² . Formed in density. A re-peelable protective sheet (manufactured by Panac, HT25SCBA, thickness: 28 μm) was laminated on the surface side of the substrate.

The same acrylic solvent-type pressure-sensitive adhesive as in Example 1 was applied to the back surface of the substrate with a knife coater so that the thickness of the pressure-sensitive adhesive layer after drying was about 15 μm to form a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer was dried by heating at 0 ° C. for 1 minute. As a result, through-holes having a diameter of 35 to 80 μm were formed in the pressure-sensitive adhesive layer at a hole density of about 2500/100 cm ² .

  And the peeling process surface of the same peeling material as Example 1 was piled up and bonded to the said adhesive layer, and this was made into the adhesive sheet.

[Comparative Example 1]
A base material was formed and an adhesive sheet was prepared in the same manner as in Example 1 except that the foaming agent was not added to the base material coating agent used in Example 1. No through-hole was formed in the pressure-sensitive adhesive layer in this pressure-sensitive adhesive sheet.

[Comparative Example 2]
A pressure-sensitive adhesive sheet was produced in the same manner as in Example 4 except that the through holes were not formed in the base material used in Example 4. No through-hole was formed in the pressure-sensitive adhesive layer in this pressure-sensitive adhesive sheet.

[Test example]
About the adhesive sheet obtained by the Example and the comparative example, the air clogging disappearance test was done as follows.

  Air retention disappearance test: A 70 mm × 70 mm melamine coating plate having a partial spherical recess having a diameter of 15 mm and a maximum depth of 1 mm, obtained by cutting a process material or a protective sheet and a release material, which is cut into 50 mm × 50 mm The pressure-sensitive adhesive sheet was pressure-bonded with a squeegee to confirm whether the air pocket could be removed. As a result, the pressure-sensitive adhesive sheet follows the concave portion of the melamine-coated plate and the air pocket is removed, and the pressure-sensitive adhesive sheet does not follow the concave portion of the melamine-coated plate and the air pocket is not removed (the air pocket is (Including those remaining even if small) is represented by x.

The results of each test are shown in Table 1.

  As is clear from Table 1, air pockets could be easily removed from the pressure-sensitive adhesive sheets obtained in the examples.

  The present invention can be preferably applied to a pressure-sensitive adhesive sheet that easily generates air pockets or blisters and requires a good appearance and sufficient adhesive force.

It is sectional drawing which shows the manufacturing method of the adhesive sheet which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the adhesive sheet which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

1 ... Process material (gas barrier material)
DESCRIPTION OF SYMBOLS 2,2A ... Base material 3 ... Primer layer 4 ... Adhesive layer 21, 31, 41, 5 ... Through-hole 6 ... Release material 7, 7A ... Adhesive sheet 8 ... Protective sheet (gas barrier material)

Claims (11)

A pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer laminated on the base material, wherein a plurality of through-holes penetrating or penetrating the base material and the pressure-sensitive adhesive layer are formed,
The pressure-sensitive adhesive sheet is characterized in that the through-hole of the pressure-sensitive adhesive layer is formed to have a predetermined diameter when gas from the through-hole of the base material passes through the pressure-sensitive adhesive layer. ^2. The pressure-sensitive adhesive sheet according to claim 1, wherein a diameter of the through hole in the base material and the pressure-sensitive adhesive layer is 0.1 to 1000 μm, and a hole density is 30 to 50,000 / 100 cm ² . A laminate comprising a base material and a gas barrier material laminated on the surface side of the base material, wherein a plurality of through-holes that penetrate or penetrate the base material are formed in the base material,
A pressure-sensitive adhesive layer is formed on the back surface side of the base material in the laminate, and gas from the through hole of the base material is moved to the outside of the pressure-sensitive adhesive layer, thereby penetrating the pressure-sensitive adhesive layer in the thickness direction. A method for producing a pressure-sensitive adhesive sheet, comprising forming a plurality of through-holes in the pressure-sensitive adhesive layer so as to have a predetermined diameter. A laminate comprising a base material and a gas barrier material laminated on the surface side of the base material, wherein a plurality of through-holes that penetrate or penetrate the base material are formed in the base material,
On the back side of the base material in the laminate, a primer layer having or not having a through hole at a position corresponding to the through hole of the base material is formed.
While forming the pressure-sensitive adhesive layer on the primer layer and moving the gas from the through-hole of the base material to the outside of the pressure-sensitive adhesive layer, through-holes penetrating the pressure-sensitive adhesive layer in the thickness direction, A method for producing a pressure-sensitive adhesive sheet, comprising forming a plurality of the pressure-sensitive adhesive layers so as to have a predetermined diameter. Method of producing a pressure-sensitive adhesive sheet according to claim 3 or 4 the diameter of the through hole of the base and 0.1 to 1000 [mu] m, the pore density, characterized in that the 30～50,000 pieces / 100 cm ^2.   By applying a resin composition containing a resin constituting the base material on the gas barrier material, foaming the resin composition, and forming through holes by foaming in the base material to be formed, the laminate is obtained. The method for producing a pressure-sensitive adhesive sheet according to any one of claims 3 to 5, wherein the pressure-sensitive adhesive sheet is produced.   The method for producing a pressure-sensitive adhesive sheet according to claim 6, wherein the resin composition contains a foaming agent.   4. The laminate is produced by forming a hole in a base material laminated with a gas barrier material, and forming a hole that penetrates the base material but does not penetrate the gas barrier material. The manufacturing method of the adhesive sheet in any one of -5.   Forming the through-hole through the base material by forming a hole in the base material, and then laminating the base material on which the through-hole has been formed and the gas barrier material to produce the laminate. The manufacturing method of the adhesive sheet in any one of Claims 3-5 characterized by the above-mentioned.   The pressure-sensitive adhesive sheet manufacturing method according to claim 8 or 9, wherein the drilling is laser processing. For producing a pressure-sensitive adhesive sheet, comprising a base material and a gas barrier material laminated on the surface side of the base material, wherein a plurality of through-holes penetrating or penetrating the base material are formed in the base material Laminated body.

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