JP2012126581A - Method for dividing laminated substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dividing method for a laminated substrate giving necessary cut face strength on a divided face while shortening the total process.SOLUTION: The division method uses a first ungrooved cutter wheel and a second predetermined grooved cutter wheel. The method comprises: (a) a step to scribe the second substrate to full-cut with the second cutter wheel in the first direction and, at the same time, scribe the first substrate with the first cutter wheel in the first direction; (b) a step to form a plurality of strip substrates by breaking treatment; (c) a step to perform full-cut scribing of the second substrate of each strip substrate with the second cutter wheel in the second direction and, at the same time, scribe the first substrate with the first cutter wheel in the second direction; and (d) a step to divide the product into unit substrates by breaking treatment.

Description

  The present invention relates to a cutting method for cutting a bonded substrate using a cutter wheel (also referred to as a scribing wheel).

  FIG. 7 is a cross-sectional view of a laminated glass substrate used for manufacturing a liquid crystal panel. In a manufacturing process of a liquid crystal panel or the like, a large-area mother substrate M in which two thin glass substrates G1 and G2 (a first substrate G1 on the front side and a second substrate G2 on the back side) are bonded together with an adhesive 11 is used. Manufacturing a product from such a mother substrate M includes a process of dividing the unit substrate U as a product unit.

As a process for dividing each unit substrate U, a method using cross scribing is known. That is, as shown in FIG. 8, with respect to the first substrate G1 surface of the mother substrate M, and a scribe line S ₁ in the X direction with a cutter wheel, and then, scribe lines Y direction crossing the X direction S Cross scribe to form ₂ . In this way, after forming a plurality of scribe lines intersecting in the XY direction in a lattice shape, the mother substrate M is inverted, sent to the break device, and pressed by the break bar from the second substrate G2 side. The substrate G1 is bent along each scribe line. Thereby, the first substrate G1 is broken for each unit substrate U. At this time, since the second substrate G2 is not yet divided, the broken first substrate G1 is fixed to the second substrate G2 by the adhesive 11 and is not separated for each unit substrate U.

Subsequently, as shown in FIG. 9, the X-direction scribe line S ₃ is similarly formed on the second substrate G 2, and then the Y-direction scribe line S ₄ is formed. The second substrate G2 is broken by being sent to the breaking device. At this time, the mother substrate M is separated for each unit substrate U.
In this way, when the bonded substrate is divided, cross scribing and breaking are performed on each of the first substrate G1 and the second substrate G2.

  As a cutter wheel for forming a scribe line on the mother substrate M, a cutter wheel 1a having a smooth cutting edge ridge line portion 2 as shown in FIG. 10 (referred to as a normal cutter wheel 1a) and a cutting edge ridge line portion as shown in FIG. A cutter wheel 1b (referred to as a grooved cutter wheel 1b) is used in which a notch 3 (groove) is provided in 2 to make it difficult to slide with respect to the substrate and to improve permeability (see Patent Document 1).

  The former normal cutter wheel 1a grinds both sides of the cutting edge ridge line portion with a grindstone in order to form inclined surfaces on both sides of the cutting edge ridge line portion. The slanted surface is formed with irregularities of grinding streaks, but is fine and usually has a centerline average roughness Ra of the edge of the cutting edge of less than 0.4 μm (the centerline average roughness is “JIS B 0601-1982”). It is one of the parameters representing the surface roughness of industrial products specified in the above). Thus, the cutting edge of the normal cutter wheel 1a has a very smooth ridgeline surface.

  The latter grooved cutter wheel 1b is specifically an “APIO (registered trademark)” cutter wheel manufactured by Samsung Diamond Industrial Co., Ltd. This grooved cutter wheel is characterized in that the circumferential length of the notch (groove) is shorter than the circumferential length of the protrusion (the length of the ridge line between two adjacent notches). For example, in “APIO” having a wheel outer diameter of 3 mm, the depth of the notch is about 1 μm, and the circumferential length of the notch is about 4 to 14 μm (therefore, the circumferential length of the protruding portion is 14 μm or more). .

  When the bonded substrate is cut by a cutting method involving a breaking process after the scribing process, the circumferential length of the normal cutter wheel 1a (hereinafter abbreviated as N-type wheel 1a) or the notch is larger than the circumferential length of the protrusion. One of the shortened “APIO” cutter wheels (hereinafter abbreviated as A-type wheel 1b) is used.

  The characteristics of the scribing process by the N-type wheel 1a and the A-type wheel 1b will be described. Since the N-type wheel 1a has a smooth finish on the edge of the cutting edge, the groove surface of the scribe line formed on the substrate is superior in that the end face strength is much more scratch-free than that formed by the A-type wheel 1b. Scribing is possible. On the other hand, the permeability (depth of the kerf) of the scribe line to be formed and the separability after the scribe line is formed are inferior to those of the A-type wheel 1b. Therefore, when cross scribing is performed in the X direction and the Y direction orthogonal to each other, an “intersection jump” phenomenon may occur in which a scribe line cannot be formed at the intersection.

  On the other hand, since the A-type wheel 1b has a notch formed in the edge of the cutting edge, the scribe line has better permeability than the N-type wheel 1a, and the depth of the formed groove is N-type wheel 1a. This makes it possible to perform a scribing process that is less deep and is less likely to slip on the substrate, and is less likely to cause “intersection jump” at the intersection when cross-scribing.

On the other hand, as a kind of grooved cutter wheel, in addition to the “APIO” cutter wheel shown in FIG. 11, for the purpose of performing scribe with higher penetration than this, as shown in FIG. A grooved cutter wheel 1c (for example, “Penett (registered trademark)” cutter wheel manufactured by Samsung Diamond Industrial Co., Ltd.) in which the circumferential length of the notch is longer than the circumferential length of the protruding portion is also manufactured. The “Penett” cutter wheel of the type in which the circumferential length of the notch is longer than the circumferential length of the protrusion (hereinafter abbreviated as “P-type wheel 1c”) increases the impact of the protrusion on the substrate and forms a deep vertical crack. (See Patent Document 1).
This type is a highly penetrating cutter wheel that can be completely divided (full cut processing) by allowing the cracks to penetrate into the back surface in the scribe process.

Therefore, there is known a cutting method in which a highly penetrating P-type wheel 1c is used to divide the first substrate and the second substrate suddenly and completely in a scribe process in the first direction and the second direction.
FIG. 13 and FIG. 14 are diagrams showing a processing procedure for dividing by performing scribing to be a full cut using the P-type wheel 1c.

First, the first substrate G1 surface of the mother substrate M, performs scribe as a full cut line B ₁ in the X direction in the P-type wheel 1c, then to the second substrate G2 surface of inverting the substrate performs scribe as a full cut line B ₂ in the X direction. Thus, without performing the breaking step, is divided along the full cut line B _1, B ₂ in the X direction, a plurality of strip-shaped substrate Mx is cut out.
Then, with respect to the strip-shaped substrate Mx, sequentially performs a scribe as a full cut line B ₃ along the Y direction crossing the X direction on the first substrate G1, then strip substrate Mx inverts the second substrate on G2 in sequentially performed scribe as a full cut line B ₄ along the Y direction. Thus, is divided along the Y direction of the full-cut line B _3, B _4, is divided into a plurality of unit substrates U. As described above, by adopting the full cut processing by the P-type wheel 1c, the breaking process becomes unnecessary, which is excellent in that the process can be shortened.

International Publication Number WO2007 / 004700

The cutting process using the P-type wheel 1c in which the circumferential length of the notch of the edge of the cutting edge is longer than the circumferential length of the protruding portion allows full cutting due to the large impact of impact on the substrate by the protruding area. However, on the other hand, a large impact impact causes the end face strength of the bonded substrate to deteriorate.
For this reason, when liquid crystal or the like is sealed in the unit substrate U divided by the P-type wheel 1c, the end face strength is weak, so that a problem such as occurrence of liquid crystal leakage may occur and the yield may be reduced.

  Moreover, in the division | segmentation by the P-type wheel by the procedure demonstrated in FIG. 13, FIG. 14, the board | substrate reversal had to be repeated twice, and the operation | work by the incidental equipment which turns over a board | substrate at the time of each reversal or a manual operation was needed. In particular, the first reversal needs to be reversed at a stroke before the entire mother substrate M before being processed into the strip-shaped substrate Mx, so that the work becomes more difficult as the substrate area increases.

  Therefore, the present invention not only reduces the number of times of the breaking process, but also shortens the process by completely inverting the substrate as compared with the cutting method in which cross scribing is performed. An object of the present invention is to provide a cutting method that can give the end face strength necessary for a product when divided into two.

In order to achieve the above object, the present invention takes the following technical means. That is, the method for dividing a bonded substrate according to the present invention includes dividing the bonded substrate in which the first substrate and the second substrate are bonded into a first direction and a second direction intersecting each other, thereby the substrate. Is a method of dividing a bonded substrate by dividing each unit substrate, wherein a first cutter wheel (N-type wheel) having no notch on the edge of the blade edge and notches and protrusions are alternately formed on the edge of the edge. A second cutter wheel (P-type wheel) in which the circumferential length of the notch is longer than the circumferential length of the protrusion is used. A 1st cutter wheel and a 2nd cutter wheel are arrange | positioned so that a bonding board | substrate may be pinched | interposed up and down, and it processes in the following procedures.
(A) The scribing is performed by the second cutter wheel along the first direction of the second substrate, and at the same time, the scribing is performed by the first cutter wheel along the first direction of the first substrate.
(B) Next, a break process is performed along the first direction of the first substrate to form a plurality of strip-shaped substrates in which the unit substrates are arranged in a line.
(C) Next, simultaneously with the second cutter wheel scribe along the second direction of the second substrate of each strip-shaped substrate, simultaneously with the first cutter wheel along the second direction of the first substrate. Do a scribe.
(D) Next, a break process is performed along the second direction of the first substrate of each of the strip-shaped substrates to divide each unit substrate.

According to this invention, about the 2nd board | substrate, the scribe process which becomes a full cut is performed in a 1st direction and a 2nd direction using a 2nd cutter wheel. About a 1st board | substrate, a scribe process of a finite depth is performed in a 1st direction and a 2nd direction using a 1st cutter wheel, and a break process is performed subsequently. Therefore, both the first substrate and the second substrate need only be processed in the X direction and Y direction of the substrate with the same type (N-type or P-type) cutter wheel, so that it is not necessary to invert the substrate. Also for the breaking process, since only the first substrate needs to be performed, there is no need to reverse the substrate.
And the unit substrate finally cut out is not strong on the end surface because the second cutter wheel is used for the four sides on the second substrate side, but the four sides on the first substrate side that are scribed by the first cutter wheel. The end face strength is increased.
Therefore, when viewed as a bonded substrate, each of the four sides includes end faces with weak end faces and strong end faces, and there is no end face formed only with weak end faces on all four sides, so average end face strength is ensured. The
Furthermore, according to the present invention, since no cross scribing is performed, the intersection skip phenomenon does not occur.

In the said invention, when the board thickness of a board | substrate differs, it is preferable to arrange | position the board | substrate side with thick board thickness as a 2nd board | substrate.
Thereby, the board | substrate with a thick board | plate thickness performs the scribing used as a full cut with a 2nd cutter wheel (P-type wheel). A thicker substrate is more resistant to mechanical scribing than a thin substrate, so it is more desirable to perform processing on the thicker substrate with the second cutter wheel, where a strong load is impacted. .

It is a top view which shows an example of the cutting system used when implementing the cutting method of this invention. It is a perspective view which shows the scribing apparatus which is a part of the cutting system of FIG. It is a perspective view which shows the breaking apparatus which is a part of the parting system of FIG. It is a figure which shows the processing procedure by the cutting method of this invention, and the processing state in each process. FIG. 5 is a diagram illustrating a processing procedure and a processing state in each step following FIG. 4. It is a schematic diagram which shows the state of the end surface of the unit board | substrate cut | disconnected using the cutting method by this invention. It is sectional drawing of the bonding glass substrate used for manufacture of a liquid crystal panel. It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the shape of a normal cutter wheel (N type wheel). It is a figure which shows the shape of a cutter wheel with a groove | channel (A type wheel). It is a figure which shows the shape of a cutter wheel with a groove | channel (P type wheel). It is a figure which shows the processing procedure of the conventional bonded substrate board. It is a figure which shows the processing procedure of the conventional bonded substrate board.

  The details of the method for dividing a bonded substrate according to the present invention will be described in detail with reference to the drawings. Note that the embodiment described below is merely an example, and it is needless to say that various aspects can be taken without departing from the spirit of the present invention.

(Configuration of the cutting system)
FIG. 1 is a schematic plan view showing an embodiment of a cutting system MT used in carrying out the substrate cutting method of the present invention.
The mother substrate M to be processed is formed by bonding two glass substrates G1 and G2 so that unit substrates (unit structures) to be a liquid crystal panel are arranged in a grid in the XY direction (plane direction) of the substrate. In addition, a product can be obtained by dividing the mother plate M into unit substrates.

  The cutting system MT is roughly classified into a first line 100 for processing the X direction (first direction) of the mother substrate M, and a Y direction (second direction) of the mother substrate M, that is, a strip-shaped substrate Mx described later. The second line 200 for processing the Y direction and the transfer mechanism 400 for transferring the strip-shaped substrate Mx from the first line 100 to the second line 200.

For convenience of explanation, an xyz coordinate system is defined for the cutting system MT as shown in FIG. That is, the X direction (first direction) of the mother substrate M coincides with the x direction of the xyz coordinate system of the cutting system MT at the processing start position (first table 101 described later) of the cutting system MT, and the Y direction ( It is assumed that the second direction) matches the y direction. Further, the y direction coincides with the substrate transport direction of the cutting system MT.
The mother substrate M is placed so that the upper side (front side) is the second substrate G2 and the lower side (back side) is the first substrate G1.

First, the first line 100 will be described. In the first line 100, a first table 101, a scribe device 102, a second table 103, a break device 104, and a third table 105 are arranged in series in this order.
A pair of conveyor belts 106 that are independently driven are attached to the first table 101, the second table 103, and the third table 105, and the mother board M is sequentially supported in the y direction while being supported thereon. It is supposed to be. It should be noted that a gap having a width that does not interfere with the conveyance of the substrate is formed between the adjacent conveyor belts 106 at the positions of the scribing device 102 and the breaking device 104, so that the scribing process and the breaking process are performed in this gap. It is.

FIG. 2 is a perspective view showing the structure of the scribing apparatus 102 (the scribing apparatus 202 described later has the same structure except that the width in the x direction is different). For convenience of explanation in FIG. 2, the illustration of the conveyor belt 106 is omitted, and only the positions of the tables 101 and 103 are shown by a one-dot chain line so that the back side can be shown.
The scribing device 102 is arranged at the boundary between the first table 101 and the second table 103, and when the mother substrate M is transported to a position where it can be processed, a P-type wheel for performing a scribing process that becomes a full cut. 111P (see FIG. 12) is arranged on the upper side of the machining site, and an N-type wheel 112N (see FIG. 10) for scribing to form a groove of a finite depth is arranged to face the lower side of the machining site. It is.
The P-type wheel 111P is arranged on the upper side of the processing part and the N-type wheel 112N is arranged on the lower side, because the break bar 131 is lowered from the top during the break process described later, This is because it is easier to break than to raise and break.

  As the P-type wheel 111P and the N-type wheel 112N, those having appropriate wheel diameters are used depending on the board thickness. In general, the wheel diameter needs to increase the pressing load at the time of cutting as the thickness of the substrate to be scribed increases, and therefore the wheel diameter is determined according to the thickness of the substrate to be scribed. When the board thickness is the same, the diameter may be the same, and when the board thickness is different, the thicker wheel diameter may be larger than the thinner wheel diameter.

  The P-type wheel 111P is attached to the support body 113 (scribing head) and the N-type wheel 112N is attached to the support body 114 (scribing head) so as to be vertically movable, and the pressing load during scribing can be adjusted. is there. The supports 113 and 114 are attached to be movable along the guides 117 of the upper and lower guide bars 116 horizontally bridged in the x direction by the support pillars 115 on both sides, and are moved in the x direction by driving the motor 118. It is.

  In addition, a camera 120 is provided on each of a pair of pedestals 119 that can move in the x direction and the y direction. The pedestal 119 moves along the guide 122 extending in the x direction on the support base 121. The camera 120 can automatically adjust the focus of imaging by moving up and down, and an image captured by the camera 120 is displayed on the monitor 123.

  An alignment mark (not shown) for specifying the position is provided on the surface of the mother substrate M placed on the conveyor belt 106 (see FIG. 1) on the tables 101 and 102. Is taken to adjust the position of the mother board M. Specifically, the alignment mark on the surface of the mother board M supported by the conveyor belt 106 is imaged by the camera 120 and the position of the alignment mark is specified. Based on the position of the specified alignment mark, a positional deviation and a direction deviation at the time of placing the surface of the mother substrate M are detected by image processing. As a result, at the time of scribing (and full-cut scribing) with respect to the mother substrate M, the scribing start position is finely adjusted in the y direction with respect to the positional deviation. For the direction deviation, a scribe line is formed by a linear interpolation operation combining a scribe operation in the x direction and the y direction. Specifically, the direction adjustment is performed by linking the movement in the y direction by the conveyor belt 106 and the movement in the x direction by driving the motor 118.

  FIG. 3 is a perspective view showing the structure of the breaking device 104 (the scribing device 204 described later has the same structure except that the width in the X direction is different). In FIG. 3, for convenience of explanation, the illustration of the conveyor belt 106 is omitted, and only the positions of the tables 103 and 105 are shown by a one-dot chain line. Furthermore, since the camera for specifying the position by the alignment mark and the support mechanism thereof are the same as the structure described in FIG. 2, a part of the description is omitted by giving the same reference numerals.

The break device 104 is arranged at the boundary between the second table 103 and the third table 105. When the mother substrate M is transported, the break bar 131 above the substrate is lowered to press the substrate surface. It is. A V-shaped groove is formed on the lower surface of the break bar 131, and when pressing the mother board M on which a scribe line along the X direction of the board is pressed, the V-shape is not touched. It is possible to press while avoiding the groove.
The break bar 131 is provided with a piston 132 for vertical driving at the center, and guide rods 133 are provided on both sides. Also, one end of the piston 132 is fixed to a pedestal 135 that is horizontally bridged in the x direction by the support pillars 134 on both sides, and the left and right guide rods 133 are configured to pass through the holes 136. Thereby, when the piston 132 moves the break bar 131 up and down, the break bar 131 does not run sideways.

  Here, a series of operations of the first line 100 will be described with reference to FIG. The mother substrate M placed on the first table 101 is transported to the scribing device 102 and subjected to simultaneous upper and lower scribing (upper full cut) in the X direction (first direction) of the substrate. It is carried out. Further, it is transported from the second table 103 to the break device 104 and subjected to a break process, and the strip-shaped substrate Mx in which unit substrates are arranged in a line in the x direction is carried out to the third table 105.

  Next, the transfer mechanism 400 will be described. The transfer mechanism 400 performs a process of transferring the strip-shaped substrate Mx, which has been processed by the first line 100 and carried out to the third table 105, to the second line 200.

The transfer mechanism 400 includes a fourth table 403, an arm 404, and an arm driving device 405.
The fourth table 403 is provided so as to extend the third table 105 in the y direction, and the conveyor belt 106 is also provided on the fourth table 403 so that the conveyor belt 106 of the third table 105 is extended. The strip-shaped substrate Mx is transported to a preset delivery position in relation to the turning angle (90 degrees).

The arm 404 includes a rod-shaped arm main body 404 a and a suction pad 404 b to which the strip-shaped substrate Mx can be attached and detached by a vacuum suction mechanism (not shown), and is controlled by an arm driving device 405. One end of the arm main body 404a is supported by the arm driving device 405 so as to perform vertical movement (z movement) and swivel movement.
The turning motion is rotated 90 degrees from the delivery position of the fourth table 403, and the strip-like substrate Mx sucked by the suction pad 404b is placed on the fifth table 201 of the second line 200 described later. is there.

A series of operations of the transfer mechanism 400 will be described. When the strip-shaped substrate Mx is transported to a preset delivery position on the fourth table 403, the arm 404 descends from above the strip-shaped substrate Mx with the suction pad 404b downward (-z movement). Adsorbed on the upper surface of the strip-shaped substrate Mx.
The arm 404 ascends while adsorbing the strip-shaped substrate Mx (+ z movement), and then turns 90 degrees toward the fifth table 201 of the second line 200. Then, after stopping the turning when it comes to the upper side of the fifth table 201, it is lowered (-z movement), the strip-like substrate Mx is placed on the conveyor belt 106 of the fifth table 201, the suction is released, and again. Wait until the next transport at the raised position.
With the above operation, the transfer of the strip-shaped substrate Mx to the second line 200 side is completed.

  At the processing start position of the second line 200 (fifth table 201), the strip-shaped substrate Mx has been rotated 90 degrees from when it was placed on the first line 100, so the Y-direction ( (The second direction) coincides with the x direction of the xyz coordinate system.

Next, the second line 200 will be described. In the second line 200, a fifth table 201, a scribe device 202, a sixth table 203, a break device 204, and a seventh table 205 are arranged in this order in series.
A pair of conveyor belts 106 that are independently driven are attached to the fifth table 201, the sixth table 203, and the seventh table 205, so that the strip-shaped substrates Mx are sequentially conveyed. It should be noted that a gap having a width that does not hinder the conveyance of the substrate is formed between adjacent conveyor belts at the positions of the scribing device 202 and the breaking device 204, so that the scribing process and the breaking process are performed in this gap. It is.

  The scribing device 202 and the breaking device 204 have the same basic structure as the scribing device 102 and the breaking device 104 described in FIG. 2 and FIG. 3 except for the width (dimension in the x direction). Refer to The description other than each table 201, 203, 205 is omitted by using the same reference numerals.

  In the second line 200, the strip-shaped substrate Mx placed on the fifth table 201 is transported to the scribing device 202, and the upper and lower simultaneous scribing processing (the upper side is full cut) in the Y direction of the strip-shaped substrate Mx is performed. It is carried out to the sixth table 203. Furthermore, the breaker 204 is transported from the sixth table 203 to perform a break process, and the unit substrate U is unloaded to the seventh table 205.

(Processing procedure)
Next, a bonded substrate processing procedure using the entire cutting system MT described above will be described with reference to the drawings. 4 and 5 are diagrams showing a processing procedure according to the cutting method of the present invention and a processing state in each step.
First, the mother substrate M is placed on the first table 101 of the first line 100 with the second substrate G2 side up and the X direction (first direction) of the substrate coincides with the x direction. .

Then, conveying the scribing apparatus 102, the second substrate G2 to form a full-cut line _{B 1} by P-type wheel 111P, scribe line _{S 1} at the same time the first substrate G1 of finite depth by N-type wheel 112N And are carried out to the second table 103. As a result, as shown in FIG. 4 (a), the second substrate G2 full cut line B ₁ is formed, a state in which the scribe line S ₁ of the finite depth is formed in the first substrate G1.

Subsequently, the mother substrate M is transported from the second table 103 to the breaker 104, and as shown in FIG. 4B, the first substrate G1 is broken from the second substrate G2 side by the pressure by the break bar and is fully cut. and line _{B 2,} is carried out to the third table 105. As a result, the strip-shaped substrate Mx is formed.
Then, the strip-shaped substrate Mx is transferred by the transfer mechanism 400 to the fifth table 201 of the second line 200 via the delivery position of the fourth table 403. At this time, the strip-shaped substrate Mx is mounted on the fifth table 201 of the second line 200 with the second substrate G2 side facing upward, and the Y direction (second direction) coincides with the x direction. Placed.

Then, by conveying a strip substrate Mx scribe device 202, the second substrate G2 to form a full-cut line _{B 3} by P-type wheel 111P, finite depth by N-type wheel 112N in the first substrate G1 at the same time The scribe line S ₃ is formed and carried out to the sixth table 203. As a result, as shown in FIG. 5 (a), the second substrate G2 full cutting line B ₃ is formed, a state in which the scribe line S ₃ finite depth is formed in the first substrate G1.

Subsequently, the strip-shaped substrate Mx is transported from the sixth table 203 to the breaking device 204, and as shown in FIG. 5B, the first substrate G1 is broken by the pressing by the break bar from the second substrate G2 side to be full. a cut line _{B 4,} is carried out to the seventh table 205. As a result, the unit substrates U are divided into pieces.

  FIG. 6 is a schematic diagram showing the state of the end face strength of the unit substrate U separated by the above-described procedure. Since the second substrate G2 is fully cut by the P-type wheel 111P and the first substrate is scribed by the N-type wheel 112N, the end surface strength E1 of the first substrate is strong and the end surfaces of the four sides are both The end surface strength E2 is weaker than that. For each section, the end face strength is averaged by the strong end face strength and the weak end face strength.

In the present embodiment, the scribe lines and full cut lines formed on the upper and lower substrates G1 and G2 are all end faces on the same plane, but stepped surfaces are formed for the formation of terminal areas for electrical connection with the outside. Even in the case of the end face where the slab is formed, the present invention can be applied as it is only by increasing the number of scribes formed during the processing.
Further, although the present embodiment is intended for a mother substrate in which two sheets of glass are bonded together, it can also be used in a bonded substrate made of a brittle material other than a glass substrate.

  The scribing method of the present invention can be used when a bonded substrate such as a glass substrate is cut.

M bonded substrate (mother substrate)
Mx Strip substrate G1 First substrate G2 Second substrate E1 Strong end surface strength E2 Weak end surface strength B ₁ Full cut line S in the first direction (X direction) of the second substrate S ₁ First direction (X direction) of the first substrate scribe line B ₂ first direction of the first substrate full cut line B ₃ of the second substrate a second direction a full-cut line S ₃ first substrate of the second direction (Y direction) of the (X-direction) (Y-direction) Scribe line B ₄ Full cut line 100 in the second direction (Y direction) of the first substrate 100 First line 200 Second line 400 Transfer mechanism 102 Scribe device (up and down simultaneous scribe)
104 Break device 111P Cutter wheel with groove (P-type wheel)
112N Normal cutter wheel (N-type wheel)
202 Scribe device (up and down simultaneous scribe)
204 Break device

Claims (2)

Dividing the bonded substrate by dividing the bonded substrate into unit substrates by dividing the bonded substrate in which the first substrate and the second substrate are bonded into a first direction and a second direction intersecting each other. A method,
The first cutter wheel with no notch on the edge of the blade edge,
Using the second cutter wheel in which notches and protrusions are alternately formed on the edge of the blade edge, and the circumferential length of the notches is longer than the circumferential length of the protrusions,
Place the first cutter wheel and the second cutter wheel so as to face each other across the bonded substrate,
(A) At the same time as scribing with a second cutter wheel along the first direction of the second substrate, and performing a scribing with the first cutter wheel along the first direction of the first substrate,
(B) Next, a break process is performed along the first direction of the first substrate to form a plurality of strip-shaped substrates in which the unit substrates are arranged in a line,
(C) Next, simultaneously with the second cutter wheel scribe along the second direction of the second substrate of each strip-shaped substrate, simultaneously with the first cutter wheel along the second direction of the first substrate. Scribe,
(D) Next, a method for dividing a bonded substrate, wherein a break treatment is performed along the second direction of the first substrate of each of the strip-shaped substrates to divide each unit substrate. The method for dividing a bonded substrate according to claim 1, wherein when the first substrate and the second substrate have different plate thicknesses, the thick substrate side is disposed as the second substrate.

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