JP4641599B2 - Material application method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a material application method and apparatus for applying an adhesive material to a circuit board.
[0002]
[Prior art]
FIG. 5 shows a conventional material application apparatus for applying an adhesive material for adhering a plurality of electronic components connected to a circuit pattern of a circuit board to the substrate surface. The material application apparatus 1 includes an application unit 3 supported by an X-direction robot 2 and driven in the X direction, a circuit board setting unit 4 that conveys and positions a circuit board, and a controller 5 that controls the operation of each unit. It has. The application unit 3 rotates a plurality of syringes 8 that supply the material 6 to the application nozzle 7, a recognition camera 9 that has illumination, a mechanism that moves the application nozzle 7 and the syringe 8 up and down in the Z direction, and the application nozzle 7. Mechanism. The circuit board setting unit 4 includes a discarding tape 10 for discarding the material 6 and circuit board conveying means 12 for conveying the circuit board 11 in the X direction, and is supported on the Y table 13. The circuit board 11 can be positioned in the XY directions with respect to the coating nozzle 1. Reference numeral 14 denotes a board position correcting mark provided on the circuit board 11.
[0003]
When the material 6 is applied to the circuit board 11 by such a material application apparatus 1, as shown in the flowchart of FIG. 6, first, the circuit board 11 is conveyed by the circuit board conveying means 12 in # 21, and # The position is adjusted in the XY direction at 22 and supported.
[0004]
In step # 23, it is determined whether or not the position correction of the circuit board 11 is to be performed. When the determination result is “execute”, the recognition camera 9 recognizes the board position correction mark 14 of the circuit board 11 in # 24, and the position correction of the circuit board 11 is performed in # 25. If the determination result of # 23 is “not implemented”, steps # 24 and # 25 are omitted.
[0005]
Next, in # 26, it is determined whether or not to confirm discarding recognition. When the determination result is “execute”, in step # 27, after the recognition operation by the recognition camera 9, the application nozzle 3 moves to the designated application position on the tape 10 by the application unit 3 and the circuit board leveling unit 4. 7 is positioned and the material 6 is applied on the scraping tape 10. In step # 28, the recognition camera 9 is discarded and positioned on the tape 10, and it is confirmed by recognizing the coating diameter whether or not the material 6 has a preset coating amount. Then, the set value of the coating amount is corrected as necessary. If the determination result of # 26 is “not implemented”, the steps # 27 and # 28 are omitted.
[0006]
Next, in # 29, the application nozzle 7 is positioned at a specified application position on the circuit board 11 by the application unit 3 and the circuit board setting unit 4, and the application nozzle 7 is lowered by a preset lowering amount. Apply material.
[0007]
In step # 30, it is determined whether application has been performed on all application positions on the circuit board 11. If the determination result is “not implemented”, the process returns to # 29 to perform the material application operation. If the determination result of # 30 is “Implemented”, the material application operation is completed at # 31.
[0008]
[Problems to be solved by the invention]
However, in order to judge the suitability of the material application amount, it is necessary to apply the material once to all application positions on the circuit board and visually recognize the application diameter as described above. Therefore, it is actually impossible to reliably determine whether it is appropriate or not.
[0009]
In addition, it is necessary to confirm whether or not a required amount of material has been applied to a predetermined application position by recognizing the material applied to the circuit board, and the recognition confirmation is performed on all of the application positions. It must be done after the application is complete.
[0010]
The present invention solves the above-mentioned problems, and can recognize the coating diameter obtained by the set material coating amount without performing a trial coating, and all the suitability of the coating diameter of the material coated on the circuit board is determined. So that it can be confirmed by the time the application to the planned application position is completed.
[0011]
[Means for Solving the Problems]
In order to solve the above problems, the present invention according to claim 1 is configured such that each electronic component is connected when an adhesive material for bonding a plurality of electronic components connected to the circuit pattern of the circuit board to the substrate surface is applied. A pair of circuit patterns and a material application position set between the pair of circuit patterns are imaged and displayed as an image, and the material application diameter is set by the material application amount set for the material application position displayed on the image. It is calculated and displayed as a material application scheduled area, and whether or not the set value of the material application amount is appropriate is determined by determining whether or not the material application area has a predetermined range size that does not overlap the pair of circuit patterns on the display image. It is characterized by discriminating.
[0012]
By doing so, it is possible to confirm the necessary material application diameter and hence the material application amount by simulation without actually applying the adhesive material. Therefore, it is possible to increase the coating efficiency and correct the set value and finely adjust the material coating means to obtain the optimum material coating diameter and material coating amount, so that the adhesive material covers the circuit pattern. It is possible to prevent poor connection of electronic components due to the above.
[0015]
According to a second aspect of the present invention, there is provided a material coating apparatus for performing the material coating method according to the first aspect, wherein an adhesive material for bonding a plurality of electronic components connected to the circuit pattern of the circuit board to the substrate surface is applied. In doing so, a pair of circuit patterns to which each electronic component is connected, the coordinates of the material application position set between the pair of circuit patterns, and the material application amount set for each material application position are stored. The material application means is controlled so as to apply the adhesive material based on the stored set value, and the application position confirmation command is issued from the control means for issuing an application position confirmation command for confirming the status of each material application position. Calculation means for calculating the material application diameter from the set value of the material application amount for the issued material application position and outputting the data, and the material application position for which an application position confirmation command is issued from the control means And an image pickup means for picking up an image before the material application and outputting the data, and a material application position and a circuit pattern picked up by the image pickup means, and displaying the image at the material application position displayed as an image Image display means for displaying a material application planned area based on the material application diameter output from the calculation means, and whether or not the material application area has a predetermined range size that does not overlap the pair of circuit patterns on the display image The control means can determine whether the material application amount is appropriate or not.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
FIG. 1 shows a flowchart for explaining a material application method according to an embodiment of the present invention. Since the basic configuration of the material coating apparatus for carrying out this material coating method is almost the same as that of the conventional device described above with reference to FIG. 5, detailed description thereof will be omitted with the aid of FIG.
[0017]
However, the controller 5 not only has a function as a control unit that stores the set material application position and the material application amount and controls the operations of the application unit 3 and the circuit board regulation unit 4 as in the conventional case. A function of calculating a material application diameter corresponding to the stored material application amount and outputting data is provided. No discard tape is disposed on the circuit board setting portion 4.
[0018]
Hereinafter, a flow of applying an adhesive material for bonding a plurality of electronic components connected to the circuit pattern of the circuit board to the substrate surface will be described based on the flowchart of FIG.
In # 1, the controller 5 is taught the coordinates of the circuit board 11 whose position has been adjusted and the coordinates of the circuit pattern to which each electronic component is connected. It also teaches a material application position set in the vicinity of the circuit pattern for each electronic component and a material application amount set for each material application position. Furthermore, an operation program for applying a material is taught.
[0019]
In # 2, it is determined whether or not to perform application position confirmation. If the result of # 2 is “execute”, the application position check is executed in # 3, a simulation check is performed to determine whether an appropriate application amount is obtained for each circuit pattern, and fine adjustment of the part data is executed. .
[0020]
That is, the recognition camera 9 is positioned, the material application position (indicated by the material 6) is imaged together with the corresponding circuit patterns 15 and 16, data is output, and an image is displayed on the monitor 17 as shown in FIG. Reference numerals 15a and 16a denote images of the circuit patterns 15 and 16, and 18 denotes an electronic component to be connected. Further, a material application diameter corresponding to the material application amount set for the material application position is calculated and displayed as a material application scheduled area 19 at the material application position on the image.
[0021]
Then, on the image, it is determined whether or not the position and size of the material application scheduled region 19 with respect to the circuit patterns 15a and 16a are appropriate. Appropriate when the material application planned area 19 is in a predetermined range of position and size that does not overlap the circuit patterns 15a and 16a as indicated by the solid line. If the position and size exceed a predetermined range close to the circuit patterns 15a and 16a as indicated by the lines, the determination is negative. The set values of the material application position and the material application amount are finely adjusted according to the determination result. The application position is confirmed for all material application positions.
[0022]
When the result of # 2 is “do not execute” and after finishing fine adjustment at # 3, the operation program is executed at # 4 to apply the adhesive material to the circuit board 11. In step # 5, it is determined whether or not the application operation is to be performed until the end of the program.
[0023]
If the result of # 5 is “execute”, it is determined whether or not the application position check is executed in # 6. If the result of # 5 is “not implemented”, the temporary application operation is stopped in # 7, and it is determined whether or not the application position check is executed in # 8. When the result of # 8 is “do not execute”, the application operation is continued at # 9 and the process returns to # 5.
[0024]
When the result of # 6 is “execute” and when the result of # 8 is “execute”, the application position confirmation is executed at # 10. That is, the recognition camera 9 is positioned, the material application position where the adhesive material 6 is applied is imaged together with the corresponding circuit patterns 15 and 16, data is output, and the image is displayed on the monitor 17 as shown in FIG. In addition, a material application scheduled area 19 based on the previously applied material application diameter is displayed at the material application position on the image.
[0025]
In step # 11, it is determined whether the material application amount is appropriate for each circuit pattern. That is, the material application scheduled area 19 and the actual adhesive material application area 20 are compared on the image of FIG. It is appropriate if the deviation (position, size) of the adhesive material application region 20 with respect to the material application scheduled region 19 is within a predetermined range as indicated by a solid line, and it is not acceptable if it exceeds the predetermined range as indicated by a virtual line. The case where the adhesive material application region 20 overlaps the circuit patterns 15a and 16a is no.
[0026]
For the material application position where the result of # 11 is “No”, fine adjustment of the part data relating to the material application position and the material application amount is performed at # 12, and the operation program is executed at # 13 to execute the material with insufficient application amount. The adhesive material is applied again to the application position.
[0027]
When the result of # 6 is “do not execute”, when the result of # 11 is “appropriate”, and after applying the adhesive material again at # 13, the material application operation is completed at # 14.
[0028]
By doing in this way, it can be checked whether the material application diameter and material application quantity required for the connection to a circuit pattern can be obtained, without actually apply | coating the adhesive material 6. FIG. In addition, it is possible to confirm whether or not the application with the predetermined material application diameter and the material application amount is completed before the application of the adhesive material for all electronic components is completed.
[0029]
In the above-described embodiment, the material application diameter and the material application amount are confirmed before and after application. However, when the material application diameter and the material application amount are not confirmed before application, operations # 2 to # 3 are performed. Can be omitted. When the material application diameters are made equal at all the material application positions, the operations # 2 to # 3 may be performed only for one material application position or only for several material application positions.
[0030]
The determination in the application position confirmation in # 3 and the determination in # 11 may be performed by the operator or may be automatically performed by the controller 5.
[0031]
【The invention's effect】
As described above, according to the present invention, for the adhesive material related to the circuit pattern to which the electronic component is connected, the material application diameter is calculated from the set value of the material application amount, and the image is displayed together with the circuit pattern as the material application scheduled area. By doing so, the suitability of the material application position, the material application diameter, and the material application amount can be confirmed without actually applying the adhesive material. Therefore, the coating efficiency can be improved as compared with the conventional case where the visual confirmation is performed, and the connection failure of the electronic component can be prevented by finely adjusting the material coating means.
[0032]
In addition, for the adhesive material related to a predetermined circuit pattern for connecting electronic components, the material application diameter is calculated from the set value of the material application amount, and the image is displayed together with the actually applied adhesive material as the material application scheduled area. Thus, it is possible to confirm whether or not the application can be performed with the necessary material application diameter and material application amount even before the application for all electronic components is completed. Therefore, by finely adjusting the material application means and performing reapplication, it is possible to prevent poor connection of electronic components, and early removal of an excessively applied circuit board is also possible.
[Brief description of the drawings]
FIG. 1 is a flowchart for explaining a material application method according to an embodiment of the present invention. FIG. 2 is an explanatory view showing application position imaging in the material application method of FIG. 1. FIG. FIG. 4 is an explanatory view showing application position confirmation after application in the material application method of FIG. 1. FIG. 5 is an explanatory view showing the structure of a conventional material application apparatus. Flow chart explaining material application method [Explanation of symbols]
3 Coating part 4 Circuit board regulating part 5 Controller 6 Adhesive material 9 Recognition camera
11 Circuit board
15,16 circuit pattern
15a, 16a Circuit pattern image
17 Monitor
19 Material application area
20 Material application area

Claims (2)

When applying an adhesive material for bonding a plurality of electronic components connected to the circuit pattern of the circuit board to the substrate surface,
A pair of circuit patterns to which each electronic component is connected and the material application position set between the pair of circuit patterns are imaged and displayed, and the material application set for the material application position displayed as an image is displayed. Calculate the material application diameter from the amount and display it as the material application planned area.
A material coating method comprising: discriminating whether or not the set value of the material coating amount is appropriate by determining whether or not the material coating region has a predetermined range size that does not overlap the pair of circuit patterns on a display image. A material application device for applying an adhesive material for bonding a plurality of electronic components connected to a circuit pattern of a circuit board to a substrate surface,
A pair of circuit patterns to which each electronic component is connected, the coordinates of the material application position set between the pair of circuit patterns, and the material application amount set for each material application position are stored and stored. Control means for applying the adhesive material based on the set value, and a control means for issuing an application position confirmation command for confirming the status of each material application position;
A calculation means for calculating a material application diameter from a set value of a material application amount for a material application position for which an application position confirmation command has been issued by the control means, and outputting data,
Imaging means for imaging the material application position and the corresponding circuit pattern for which an application position confirmation command has been issued by the control means and outputting the data before material application;
An image display for displaying a material application position and a circuit pattern imaged by the imaging means and a material application planned area based on the material application diameter output from the arithmetic means at the material application position displayed as an image Means and
Material, wherein the material application region on the display image is distinguishably configuration the appropriateness of the material coating amount by said control means whether or not the magnitude of the predetermined range does not overlap with the pair of circuit patterns is determined Coating device.

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