JPH1197829A - Adjustment of application quantity for bond for adhering electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automatically adjust an application quantity of bond without causing inconvenience an operator comparing a calculated trial application quantity with a target one and discriminate determining whether the deviation of the trial application quantity from the target application quantity is within an allowable error. SOLUTION: First, the operator inputs a target application quantity (step 1). Next, a syringe is moved onto a trial application stage and bond is applied for trial (step 2). Then, the bond applied for the trial is observed by a camera (step 3), and then a controlling section calculates the applied quantity and compares it with the target application quantity (step 4). After that, it is determined whether the difference between the trial application quantity and the target quantity is within allowable error (step 5). If it is so, parameters such as the target application quantity and the present application quantity are reported to the operator (step 6). Then, the operator determines the application conditions (steps 7, 8). If it is not, the parameters to be given to the syringe are changed automatically (step 9).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting a coating amount of a bond for bonding electronic parts using a bond coating head.

[0002]

2. Description of the Related Art A bond for bonding an electronic component to a substrate is generally applied using a bond application head. The bond application head consists of a syringe that stores the bond and a nozzle that is attached to the lower part of the syringe. By applying gas pressure to the bond in the syringe, the bond is discharged from the lower end of the nozzle and applied to the substrate. It is supposed to.

[0003] The amount of the bond applied depends mainly on the magnitude of the gas pressure applied to the syringe and the length of the gas pressure application time. Therefore, before applying the bond to the substrate using the bond applying head, the amount of the applied bond is adjusted. Conventionally, this adjustment is performed using a bond application head to test-apply the bond, the operator observes the size of the test-applied bond, and adjusts the magnitude of the gas pressure applied to the syringe and the gas pressure application time according to the observation result. I was doing it.

[0004]

However, the conventional method requires a great deal of labor and labor, and is prone to individual errors by the operator.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for adjusting the amount of a bond for bonding electronic parts, which can automatically adjust the amount of the bond with minimum effort of an operator's hand. .

[0006]

SUMMARY OF THE INVENTION According to the present invention, there is provided a method for adjusting a coating amount of a bond for bonding an electronic component, comprising the steps of: operating an input unit to register a target coating amount in a storage unit; Applying a bond from the nozzle and applying a test from the nozzle, a step of recognizing the test applied bond by the recognition unit and calculating the size of the test application amount by the application amount calculation unit, and a step of calculating the calculated test. A step of comparing the applied amount with the target applied amount and determining whether the difference is within an allowable error by a determination unit; and, if the difference is not within the allowable error, a magnitude of a gas pressure applied to a syringe of the bond applying head. The above process was repeated by changing the duration of the gas pressure and / or gas pressure application.

According to this configuration, the amount of the bond applied can be automatically and accurately adjusted without bothering the operator.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an apparatus for applying a bond according to an embodiment of the present invention, FIG. 2 is a block diagram of the control system, and FIG. 3 is a flowchart of an operation for adjusting the amount of application of the bond.

First, the structure of a bond applying apparatus will be described with reference to FIG. Reference numeral 10 denotes a moving table, which comprises an X table 11 and a Y table 12 which are orthogonal to each other. A bond application head (hereinafter, referred to as “head”) 13 is mounted below the Y table 12, and a holder 14 is mounted on the head 13. The syringe 1 in which the bond 3 is stored is exchangeably mounted on the holder 14. The pressure means 1 is connected to the syringe 1 via a tube 15.
6 are connected. 17 is a valve attached to the pressurizing means 16. When the valve 17 is opened, gas pressure is applied to the inside of the syringe 1, and the bond 3 is discharged from the nozzle 2.

The substrate 4 is placed on a table 18. When the X table 11 and the Y table 12 are driven, the syringe 1 moves horizontally with respect to the substrate 4 in the X direction and the Y direction, and moves to a target point. Also the head 13
The holder 1 is driven by the up-down moving means built in the
4 moves up and down, and the syringe 1 performs a lowering / upward operation on the substrate 4 to apply the bond 3.

A trial application stage 20 for bonds is provided on the side of the table 18. Trial application stage 20
A light source 21 is provided below and a camera 22 is provided above. The bond 3 is colored, such as red or yellow, and the test application stage 20 is transparent. Therefore, the bond 3 is applied to the trial application stage 20, the light source 21 is turned on, the camera 22 as a recognition unit recognizes the bond 3, and the amount of the bond applied is measured from the size of the silhouette image obtained by the camera 22. can do. Note that the camera 22 may be provided on the head 13 side to recognize the bond 3 from above, and the bond 3 may be trial-coated on a corner of the substrate 4 or the like.

Next, the control system will be described with reference to FIG. Reference numeral 30 denotes a control unit such as a CPU. The pressure unit 16 and the valve 17 are connected to the control unit 30. The head 13 is controlled by a control unit 30 via a head driving unit 31.
The camera 22 is connected to the image recognition unit 3.
2 is connected to the control unit 30. Control unit 3
The storage unit 33 is connected to 0. The storage unit 33 stores program data, operation data calculated by the control unit 30, and the like. Numeral 34 denotes an alarm element such as a buzzer, and 35
Denotes a display unit, and 36 denotes an input unit such as a keyboard and a mouse, and inputs necessary data and the like to the control unit 30.

This bond coating apparatus has the above-described configuration. Next, a method of adjusting the bond coating amount will be described with reference to the flowchart of FIG. In FIG. 1, the substrate 4
Prior to the application of the bond 3, a test application of the bond 3 is performed as follows. That is, first, the operator operates the input unit 36 to input a target application amount (step 1). The target application amount is set by the size (diameter, area, etc.) of the applied bond, and the target application amount input by the diameter, area, or the like is registered in the storage unit 33.

Next, the syringe 1 is moved above the trial coating stage 20, gas pressure is applied to the bond 3 in the syringe 1 for a predetermined time by the pressurizing means 16, and the bond 3 is discharged from the nozzle 2 to release the test coating stage. Then, a test coating is performed on Step 20 (Step 2). The magnitude of the gas pressure and the gas pressure application time are parameters of the target application amount. The camera 3 observes the test-applied bond 3 (step 3), and based on the image data, the controller 30 calculates the amount of the bond 3 to be applied and compares it with the target applied amount (step 4). As described above, the control unit 30 functions as an application amount calculation unit and a determination unit.

In step 5, it is determined whether or not the difference between the target application amount and the test application amount is within an allowable error (for example, 10%). If OK, the target application amount, the current application amount, and the gas amount are displayed on the display unit 35. The parameters such as pressure are displayed, and the notification element 34 is driven to notify the operator (step 6). Then, the operator checks the contents of the display unit 35,
If OK, the application conditions such as the magnitude of the gas pressure and the gas pressure application time are determined (steps 7 and 8).

If NG is determined in step 5, parameters such as the magnitude of the gas pressure applied to the syringe 1 and the gas pressure application time are automatically changed (step 9). This parameter may be changed by changing only one of the magnitude of the gas pressure or the gas pressure application time, or by changing both. Then, returning to step 2, the above operation is repeated. This repetitive operation is performed by
It is repeated until it becomes ES. The change amount of the parameter is determined at regular intervals or based on a correction formula stored in the storage unit 33 in advance. The correction formula is for each bond,
In some cases, the parameters are set for each nozzle. In this case, the bond and the type of the nozzle are input before step 1 and the parameters are changed using the corresponding correction formula.

In the present embodiment, the operator's visual recognition process is incorporated in steps 6 and 7. However, steps 6 and 7 are eliminated, and if it is OK in step 5, the process may proceed to step 8 as it is. Good thing. However, incorporating an operator's visual recognition process as in the present embodiment can prevent an error from occurring.

[0018]

According to the present invention, it is possible to quickly and accurately adjust bond application conditions for obtaining a target application amount by light work.

[Brief description of the drawings]

FIG. 1 is a perspective view of a bond application device according to an embodiment of the present invention.

FIG. 2 is a block diagram of a control system of the bond applying apparatus according to the embodiment of the present invention;

FIG. 3 is a flowchart of a bond application amount adjusting operation of the bond application apparatus according to the embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Syringe 2 Nozzle 3 Bond 4 Substrate 10 Moving table 16 Pressurizing means 20 Trial application stage 22 Camera 30 Control part

Claims (1)

[Claims] A step of operating an input unit to register a target application amount in a storage unit; a step of applying a gas pressure to a syringe of a bond application head to discharge a bond from a nozzle to perform a test application; The step of recognizing the bond that has been recognized by the recognizing unit and calculating the size of the test application amount by the application amount calculating unit, and comparing the calculated amount of the test application amount with the target application amount. And the step of determining whether or not it is, if the error is not within the tolerance, the magnitude of the gas pressure applied to the syringe of the bond application head and or the gas pressure application time is changed and the above steps are repeated, Method for adjusting the amount of electronic component bonding bonds to be applied.