JP2024008161A - Bump forming device, bump forming method, solder ball repair device, and solder ball repair method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device of which the reliability is improved in ultrafine solder bump formation and a bump forming method.

SOLUTION: In a bump forming device, a solder ball 24 is loaded on an electrode pad formed on a substrate 215 and a bump is formed on the electrode pad by fusing the solder ball 24. The device comprises: a plasma unit 306 for irradiating the electrode pad with plasma which removes an oxide film of the electrode pad; first flux application means for coating the electrode pad, from which the oxide film is removed by the plasma unit, with a first flux; solder ball loading means for loading the solder ball 24 on the electrode pad which is coated with the flux by the first flux application means; second flux application means for coating the loaded solder ball with a second flux; and a laser unit 305 for fusing the solder ball 24 which is coated with the flux by the second flux application means.

SELECTED DRAWING: Figure 19

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a bump forming apparatus and a bump forming method for mounting solder balls on a substrate in the electrode manufacturing process of a package substrate used in a semiconductor device, and to inspecting the formed electrode and repairing a defective part. ) A solder ball repair device and a solder ball repair method.

BACKGROUND OF THE INVENTION In recent years, bump formation technology using solder has been used for electrical connection of semiconductor devices. For example, there is a cream solder printing method in which solder bump electrodes with a diameter of 80 to 100 μm are formed at a pitch of 150 to 180 μm by printing cream solder on the electrodes of a substrate using a high-precision screen printing device and reflowing the solder.

In addition, with the miniaturization of electrodes due to the miniaturization and higher performance of semiconductor devices, solder balls are transferred into a jig with highly precisely machined micro holes, aligned at a predetermined pitch, mounted directly on the board, and then reflowed. There is a ball transfer method in which solder bump electrodes are formed by doing this.

In such background technology, Japanese Patent Laid-Open No. 2000-049183 (Patent Document 1) discloses that solder balls are supplied from an air nozzle onto a mask, and while the mask is rocked and vibrated, predetermined openings are filled with solder balls. Furthermore, a method is disclosed in which the material is filled by translational movement of a brush or squeegee and then heated. However, not all solder balls may be correctly mounted at each bump forming position, and in some cases, mounting defects may occur.

Therefore, in Japanese Unexamined Patent Publication No. 2003-309139 (Patent Document 2), a solder ball repair device is installed, and after sucking and removing defective solder balls with a pipe member, new good solder balls are adsorbed onto the pipe member. A technique has been disclosed in which the tube member is transported and remounted on the defective part, and a laser beam irradiation unit irradiates laser light from inside the tube member to melt the solder balls and temporarily fix them.

In addition, Japanese Patent Laid-Open No. 2008-288515 (Patent Document 3) and Japanese Patent Laid-Open No. 2009-177015 (Patent Document 4) disclose that the state of a board on which solder balls are printed is inspected, and repairs are made according to the defective state. A solder ball printing apparatus is disclosed that includes an inspection/repair section.

Furthermore, Japanese Patent Laid-Open No. 2010-010565 (Patent Document 5) describes a repair method that inspects the state of solder balls mounted on electrode pads of a substrate and supplies solder balls to electrode pads where defects are detected. A solder ball inspection and repair device with a dispenser is disclosed.

Alternatively, there are methods that heat the underball, such as Japanese Patent No. 3173338 (Patent Document 6), Japanese Patent No. 3822834 (Patent Document 7), and Japanese Patent No. 5098648 (Patent Document 8), which use plasma to remove the oxide film. There is Japanese Patent Application Publication No. 2015-103688 (Patent Document 9) as a method, and Japanese Patent Application Publication No. 2003-309139 (Patent Document 10) as a method in which heating and melting is performed using a laser.

Furthermore, Japanese Patent Laid-Open No. 2002-76043 (Patent Document 11) discloses a method in which heating is performed by a laser beam in addition to gas spraying.
Further, a laser processing machine that can change the spot diameter and Rayleigh length at the focal position with a simple configuration is disclosed in International Publication No. 2012/157355 (Patent Document 12).

Japanese Patent Application Publication No. 2000-049183 Japanese Patent Application Publication No. 2003-309139 Japanese Patent Application Publication No. 2008-288515 Japanese Patent Application Publication No. 2009-177015 Japanese Patent Application Publication No. 2010-010565 Patent No. 3173338 Patent No. 3822834 Patent No. 5098648 JP2015-103688A Japanese Patent Application Publication No. 2003-309139 Japanese Patent Application Publication No. 2002-76043 International Publication No. 2012/157355

Currently, 5G (fifth generation mobile communication system) compatible technology has begun to be put into practical use. Furthermore, the diameter of the solder balls used for forming bump electrodes is becoming smaller, from 70 to 80 μm to 30 to 50 μm or less. As semiconductor devices used in 5G become smaller, faster, and have larger capacities, bump electrodes become ultra-fine. Even when reflow is performed using the technology and equipment disclosed in the above-mentioned patent documents, solder Problems with wettability and intermetallic compound (IMC) layers have led to problems such as soldering defects and cracks, reduced reliability of solder joint interfaces, and defects in solder bump electrodes.

In the technique disclosed in Patent Document 2, there is a high probability that the amount of residual flux will be small after repair, and if solder wettability is poor during reflow, soldering to the electrode pad part will be difficult when the solder ball melts. Incomplete wetting may occur.

Furthermore, in the solder ball inspection and repair devices for solder ball printing apparatuses disclosed in Patent Documents 3 to 5, and in the techniques disclosed in Patent Documents 6 to 10, re-inspection is performed after reflow, the solder balls are mounted, When repair is performed, even if flux is applied to the newly resupplied solder balls, the electrode pads are damaged (affected) by the oxidation effect of the previous reflow process, so the solder cannot be soldered. There is a high probability that bonding defects will occur. Moreover, compared to normal soldering, problems may occur in soldering reliability.

In addition, regarding the use of redox gas in the bump forming apparatus disclosed in Patent Document 11, the surface of the electrode must be cleaned in advance before the process of discharging molten solder droplets onto the pad, or the redox gas Although it has been disclosed that bumps are formed by rapid heating with a laser beam along with spraying, in this case, oxidation-reduction cannot be performed while molten solder droplets are being discharged, so there is a problem with soldering reliability. could have occurred.

Furthermore, regarding the laser processing machine disclosed in Patent Document 12, it is necessary to change the laser spot diameter and Rayleigh length depending on the type of workpiece, the equipment is expensive, there are multiple adjustment points, and there are issues such as maintenance. There was a possibility that it would come.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an apparatus that inspects bump defects occurring on electrode pads of a substrate, resupplies and repairs solder balls to defective electrode portions, and performs soldering. Another object of the present invention is to provide a highly reliable repair soldering device and method for repairing and soldering defective parts of bump electrodes after reflow in extremely fine solder bumps. Another object of the present invention is to provide a highly reliable soldering device and method for forming ultra-fine solder bumps.

In order to solve the above problems, the bump forming apparatus of the present invention mounts a solder ball on an electrode pad formed on a substrate, and forms a bump on the electrode pad by melting the solder ball. In the apparatus, a plasma irradiation unit irradiates the electrode pad with plasma to remove an oxide film on the electrode pad, and a first unit that applies a first flux to the electrode pad from which the oxide film has been removed by the plasma irradiation unit. a flux applying means; a solder ball mounting means for mounting a solder ball on the electrode pad to which flux has been applied by the first flux applying means; and applying the first flux to the solder ball mounted by the solder ball mounting means. a second flux applying means for applying a second flux having a lower viscosity than the flux applied by the second flux applying means; and a solder ball melting means for melting the solder ball to which the flux has been applied by the second flux applying means. It is characterized by

Further, in the bump forming method of the present invention, a solder ball is mounted on an electrode pad formed on a substrate, and a bump is formed on the electrode pad by melting the solder ball. The oxide film of the electrode pad is removed by irradiating plasma onto the electrode pad formed on the electrode pad, and a first flux is applied to the electrode pad from which the oxide film has been removed, and a repair dispenser adsorbs the solder ball. The solder ball is mounted on the electrode pad coated with the first flux, a second flux having a lower viscosity than the first flux is applied from above to the solder ball mounted on the electrode pad, and then , the solder ball coated with the second flux is melted to form a bump on the electrode pad.

Further, the solder ball repair device of the present invention inspects the condition of solder bumps formed on the electrode pads of the substrate, and supplies and melts solder balls to the electrode pads where defects are detected. a plasma irradiation means for irradiating an electrode pad with plasma to remove an oxide film on the electrode pad; a first flux application means for applying a first flux to the electrode pad from which the oxide film has been removed by the plasma irradiation means; , a solder ball mounting means for mounting a solder ball on the electrode pad to which flux has been applied by the first flux application means; and a solder ball mounted by the solder ball mounting means is coated with flux by the first flux application means. It is characterized by comprising a second flux applying means for applying a second flux having a lower viscosity than the flux, and a solder ball melting means for melting the solder balls to which flux has been applied by the second flux applying means. do.

Further, the solder ball repair method of the present invention includes inspecting the state of solder bumps formed on electrode pads of a substrate, and supplying and melting solder balls to electrode pads in which a defect has been detected. Repair by irradiating the electrode pad formed on the substrate with plasma to remove the oxide film of the electrode pad, applying a first flux to the electrode pad from which the oxide film has been removed, and adsorbing the solder ball. The solder ball is mounted on the electrode pad coated with the first flux using a dispenser, and a second flux having a lower viscosity than the first flux is applied from above to the solder ball mounted on the electrode pad. Then, the solder ball coated with the second flux is melted to form a bump on the electrode pad.

Further, the bump forming apparatus of the present invention has one end sealed with a light transmitting member that transmits laser light, and has a gas supply port for supplying gas for generating plasma on the side, and the bump forming device has a gas supply port for supplying gas for generating plasma to the side. A gas guide path formed in a straight line that guides the gas to irradiate the solder balls mounted on the substrate, and a part of the gas distribution path from the gas guide path to the solder balls are surrounded, and the gas is guided to the solder balls mounted on the substrate. a plasma generating means for applying a high voltage/high frequency power source to turn the gas into plasma, and transmitting the generated laser light through the light transmitting member and through the gas distribution path and the central portion of the plasma generation region to the solder ball. and a laser generating means for irradiating the solder ball, the oxide film of the solder ball is removed by the plasma, and the solder ball is melted by the laser beam to form a bump.
Another bump forming apparatus of the present invention is a bump forming apparatus that supplies solder balls onto electrode pads formed on a substrate and melts the solder balls to form bumps. A plasma unit that irradiates a specific solder ball with plasma to remove the oxide film of the solder ball, and a laser unit that irradiates the specific solder ball with a laser to melt the solder ball. A unit fixing member fixed so that the irradiation direction irradiates the specific solder ball, and a driving means for positioning and driving the unit fixing member so that the irradiation direction of each unit irradiates the specific solder ball. It is characterized by

Furthermore, the solder ball repair device of the present invention irradiates a laser onto a solder ball supplied onto an electrode pad formed on a substrate, melts the solder ball, and forms a solder bump on the electrode pad. The apparatus is characterized by comprising a depth of focus adjustment means (focus adjustment mechanism) that adjusts the amount of defocus so that the irradiation diameter of the laser becomes approximately 2.4 times to approximately 3.1 times the diameter of the solder ball. shall be.

Further, another solder ball repair device of the present invention includes a plasma generation device that irradiates plasma onto the solder ball supplied onto an electrode pad formed on the substrate to remove an oxide film on the solder ball. , plasma irradiation is performed temporally prior to laser irradiation, the irradiation times overlap with each other, and the plasma is irradiated onto the solder ball by the plasma generator, thereby forming an oxide film on the solder ball. At the same time, the solder ball is irradiated with the laser by the laser generator to melt the solder ball and form a solder bump on the electrode pad.
Further, another solder ball repair device of the present invention includes a laser output measuring means for measuring and inspecting the output value and focal diameter of the laser, and a laser output target value, a laser focal target diameter, and conditions of the target workpiece in advance. The present invention is characterized by comprising a recipe storage means for storing the recipe, and a laser control means for correcting the laser output, focus, and defocus amount using control amount information corresponding to the conditions of the target workpiece from the recipe storage means.

According to the present invention, it is possible to provide an apparatus that inspects bump defects occurring on electrode pads of a substrate, resupplies and repairs solder balls to defective electrode portions, and performs soldering. Furthermore, it is possible to provide a highly reliable repair soldering apparatus and method for repairing and soldering defective parts of bump electrodes after reflow in ultrafine solder bumps. Furthermore, it is possible to provide a highly reliable soldering device and method for forming ultra-fine solder bumps.
Note that problems, configurations, and effects other than those described above will be made clear through the description of the examples.

FIG. 3 is a schematic diagram showing flux printing and solder ball mounting/printing steps. It is a schematic diagram explaining the process from flux printing to solder ball inspection repair. 3 is a flowchart showing a process of bump formation. FIG. 2 is a side view showing the overall structure of the solder ball supply head. FIG. 3 is a schematic diagram illustrating solder ball mounting and printing operations. FIG. 3 is a plan view showing an example of the state of the board after solder balls are mounted and printed. FIG. 3 is a schematic diagram showing typical examples of defects after solder ball mounting and printing. FIG. 2 is a schematic diagram illustrating repair work after solder ball mounting and printing. FIG. 1 is a plan view illustrating a schematic configuration of an inspection repair device. FIG. 2 is a side view showing the configuration of a repair dispenser. FIG. 3 is an enlarged view illustrating a solder ball adsorption/separation operation at the tip of the repair dispenser. 1 is an external view showing a plasma laser repair system that is an embodiment of the present invention. It is an explanatory view explaining a plasma laser repair device. It is an explanatory view explaining a plasma laser repair head part. It is a flow chart showing plasma laser repair operation. FIG. 3 is an explanatory diagram illustrating a plasma laser head section of Example 2. FIG. 7 is an explanatory diagram illustrating the principle of a plasma laser head section of Example 2. FIG. 3 is an explanatory diagram illustrating the configuration of a plasma laser head section of Example 2. FIG. 7 is an explanatory diagram illustrating pulse irradiation in Example 2. It is a flowchart which shows another plasma laser repair operation. It is a top view explaining the schematic structure of another plasma laser repair apparatus. FIG. 3 is a side view showing the configuration of a first flux pin transfer unit. It is an explanatory view explaining the operation of applying the first flux. FIG. 3 is a side view showing the configuration of a second flux pin transfer unit. It is an explanatory view explaining the operation of applying the second flux. FIG. 22 is a plan view illustrating a schematic configuration of a modification of the plasma laser repair apparatus of FIG. 21. FIG. FIG. 27 is a plan view illustrating a schematic configuration of a modified example of the plasma laser repair apparatus of FIG. 26. FIG. 27 is a plan view illustrating a schematic configuration of still another modification of the plasma laser repair apparatus of FIG. 26. FIG. FIG. 7 is an enlarged view of a composite holding section arranged corresponding to each of the composite operation sections. FIG. 7 is a perspective view showing another embodiment. 31 is a partially enlarged view of FIG. 30. FIG. 32 is a partially enlarged view of FIGS. 30 and 31. FIG. It is a figure showing the definition of defocus amount (DF). It is a figure which shows the laser output distribution in the spot cross section at the time of a focus. FIG. 3 is a diagram comparing output distributions in cross sections of each laser spot. It is a figure explaining one example of bump formation. 3 is a diagram showing a focus adjustment operation of the laser unit 205. FIG. 3 is a diagram showing a flowchart of a focus adjustment operation of the laser unit 205. FIG. 6 is a diagram showing a laser output adjustment operation of the laser unit 205. FIG. 3 is a diagram showing a flowchart of a laser output adjustment operation of the laser unit 205. FIG. 5 is a diagram showing a defocus amount adjustment operation of the laser unit 205. FIG. 5 is a diagram showing a flowchart of a defocus amount adjustment operation of the laser unit 205. FIG. It is a figure showing the contents of a recipe storage part.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of apparatuses and methods according to embodiments of the present invention will be described below with reference to the drawings.

Figure 1 shows an overview of the flux printing and solder ball mounting/printing processes.
As shown in FIG. 1(a), first, a predetermined amount of flux 23 is transferred onto the electrode pads 22 of the substrate 21 by screen printing. In this embodiment, a metal screen manufactured by an additive method is used for the screen 20 so as to ensure high pattern position accuracy. As the squeegee 3, any of a square squeegee, a sword squeegee, and a flat squeegee may be used. First, conditions such as the screen gap, printing pressure, and squeegee speed are set according to the viscosity and thixotropy of the flux 23. Then, flux printing is executed under the set conditions.

If the amount of printed flux 23 is small, there is a possibility that the solder balls cannot be attached onto the electrode pads 22 when filling the solder balls. It also causes poor solder wetting during reflow, making it impossible to form bumps with a beautiful shape, resulting in poor bump height and insufficient solder connection strength.

On the other hand, if the amount of flux is too large and excess flux adheres to the screen openings during solder ball loading and printing, the solder balls will adhere to the screen openings and the solder balls will not be able to be transferred onto the board. . In this way, flux printing is a very important factor in maintaining quality in solder ball mounting.

Next, as shown in FIG. 1(b), solder balls 24 are mounted and printed on the electrode pads 22 of the substrate 21 on which the flux 23 is printed. In this embodiment, solder balls with a diameter of about 30 μm are used. Note that as bump electrodes become extremely fine due to the miniaturization, speeding up, and large capacity of semiconductor devices, solder balls are also becoming extremely small in size, with a diameter of 25 μm to 30 μm. As the screen 20b used for mounting the solder balls 24, a metal screen manufactured by an additive method is used to ensure high pattern position accuracy.

The screen 20b is made of a magnetic material such as nickel. Thereby, the screen 20b is magnetically attracted by the magnet 10s provided on the stage 10, and the gap between the substrate 21 and the screen 20b can be reduced to zero. Therefore, it is possible to prevent the solder balls 24 from slipping between the substrate 21 and the screen 20b and producing surplus balls.

In addition, minute pillars 20a made of resin or metal are provided on the back surface of the screen 20b. This constitutes an escape section in case the flux 23 bleeds. Therefore, when the substrate 21 on which the flux 23 is printed is brought into close contact with the screen 20b, it is possible to prevent the flux 23 from smearing into the openings of the screen.

Positioning marks (not shown) are provided at four corners of the substrate 21. The positioning mark on the substrate 21 and the positioning mark (not shown) on the screen 20b side are visually recognized by the camera 15f (see FIG. 2) and aligned with high precision. This makes it possible to supply the solder balls 24 onto predetermined electrode pads 22 with high precision.

The slit-like body 63 shown on the screen 20b is one element constituting a filling unit (see FIG. 4) for supplying solder balls. By moving the filling unit in the direction of the arrow 60V while swinging the slit-like body 63, the solder balls 24 are pushed and rolled and are successively filled into the openings 20d of the screen 20b.

FIG. 2 is a schematic diagram showing an embodiment of the process from flux printing to solder ball inspection and repair.
The apparatus shown in FIG. 2 is constructed by integrating a flux printing section 101, a solder ball mounting/printing section 103, and an inspection/repair section 104. Each part is connected by a belt conveyor 25, and the substrate is conveyed by the belt conveyor 25. The flux printing section 101 and the solder ball mounting/printing section 103 are provided with a table 10f and a table 10b for working. The tables 10f and 10b are moved up and down to transfer and receive substrates. The table 10f and the table 10b are configured to be movable also in the horizontal direction (XYθ directions). Further, the screen 20, the screen 20b, and the substrate can be aligned by capturing images of alignment marks (not shown) on the screen 20, the screen 20b, and the substrate using the cameras 15f and 15b. The board that has passed through the inspection/repair section 104 is sent to the next step, a reflow section (not shown), where the mounted solder balls are melted by heating and soldered onto the electrode pads, forming bumps. It turns out.

FIG. 3 shows a flowchart of the bump forming process in this example.
First, the board is carried into the flux printing department (STEP 1). After that, a predetermined amount of flux is printed on the electrode pad (STEP 2). Next, the screen opening status after flux printing is inspected (STEP 3). If the inspection result is NG (defective), the screen is automatically cleaned using a printing plate cleaning device provided in the printing device, and flux is supplied and replenished as necessary. In addition, the board that is rejected is kept on standby on a conveyor for the subsequent process with an NG signal and discharged out of the line so that the process after solder ball printing is not performed. Magazines may be discharged all at once by using an inline NG substrate stocker or the like. After the NG substrate is cleaned in a process outside the line, it can be used again for flux printing (STEP 4).

Solder balls are mounted and printed on non-defective boards (STEP 5). When the solder ball loading and printing are completed, before the plate is separated, the filling status of the solder balls in the screen openings is inspected from above the screen (STEP 6). As a result, if there is a portion that is insufficiently filled, the solder ball mounting/printing operation is performed again (STEP 7). Thereby, the filling rate of solder balls can be improved.

If the inspection in STEP 6 is OK, the plate is separated (STEP 8), and the mounting status of the solder balls is inspected using an inspection/repair device (STEP 9). If the inspection of the solder ball loading status is NG, flux is supplied and then solder balls are supplied again to the defective electrode pad portion (STEP 10). If the mounting status is inspected and the result is OK, the solder balls are melted in a reflow device (not shown) arranged in the next step (STEP 11), and the solder bumps are completed.

FIG. 4 is a side view showing the overall structure of the solder ball supply head, and is a diagram showing the configuration of the solder ball supply head (filling unit) for mounting solder balls on the substrate in the solder ball mounting/printing section. be.

The solder ball supply head 60 includes a ball case that stores the solder balls 24 in a space formed by a casing 61, a lid 64, and a shive-like body 62, and a slit-shaped space provided at a space below the shive-like body 62. body 63. The shive body 62 is formed of an extremely thin metal plate having openings such as a mesh opening or a continuous rectangular slit so as to match the diameter of the solder ball 24 to be supplied. A slit-like body 63 is disposed below the shive-like body 62, and the slit-like body 63 is configured to make surface contact with the screen 20b.

Furthermore, the print head elevating mechanism 4 provided above the lid 64 allows fine adjustment of the degree of contact and the gap between the slit-shaped body 63 and the screen 20b. The slit-like body 63 is formed of an extremely thin metal plate made of a magnetic material. By using a magnetic material, the slit-shaped body 63 can be attracted to the screen 20b formed of the magnetic material by the magnetic force from the stage 10 provided with a magnet. The slit-like body 63 has, for example, a mesh-like opening or a continuous rectangular slit portion so as to match the diameter of the target solder ball 24 and the size of the opening 20d of the screen 20b.

Further, the solder ball supply head 60 includes a horizontal vibration mechanism that horizontally vibrates a shib-shaped body 62 provided in the ball case. The horizontal vibration mechanism was constructed by attaching a vibrating means 65 to a member formed parallel to the side surface of the ball case, and providing a support member 70 to which the vibrating member was attached on the upper surface of the lid 64. With this configuration, the shive-shaped body 62 can be vibrated by vibrating the ball case from the side surface thereof using the vibrating means 65. By vibrating the shib-like body 62, the slit-shaped opening provided in the shive-like body 62 can be opened larger than the diameter of the solder ball 24. As a result, the solder balls 24 housed in the ball case fall from the slit portion of the shive-like body 62 onto the slit-like body 63. The number of solder balls 24 dropped onto the slit-shaped body 63, that is, the supply amount of solder balls 24 can be adjusted by controlling the vibration energy by the vibration means 65.

The vibration excitation means 65 uses an air rotary vibrator, and its frequency can be controlled by finely adjusting the compressed air pressure through digital control. Alternatively, the frequency may be varied by controlling the compressed air flow rate. The vibration means 65 causes the shib-shaped body 62 and the ball case to vibrate the solder balls 24 housed in the ball case, thereby canceling out and dispersing the suction force due to the van des Waals force acting between the solder balls 24. Due to the dispersion effect, it is possible to prevent the solder ball supply amount from changing due to the influence of the material of the solder balls 24 or the temperature and humidity in the production environment. Therefore, adjustments can be made taking production efficiency into consideration.

Alternatively, the ball supply head 60 is provided with a horizontal swing mechanism for swinging the ball case in the horizontal direction. The horizontal swing mechanism is constructed as follows. A linear guide 67 is provided on the upper part of the support member 70, and a filling head support member 71 is provided with a linear rail so that the linear guide 67 can move. This filling head support member 71 is provided with a driving motor 68, and an eccentric cam 66 is attached to the shaft of this driving motor 68. When the eccentric cam 66 rotates, the support member 70 moves (swings) in the horizontal direction. The filling head support member 71 is supported by the motor support member 2 and is configured not to move in the left-right direction with respect to the motor support member 2.

That is, the horizontal swinging mechanism provides a swinging motion to the slit-shaped body 63 in the horizontal direction with an arbitrary stroke amount by rotating the eccentric cam 66 with the drive motor 68. Since the slit-shaped body 63 swings while being attracted to the screen 20b by magnetic force, it is possible to reliably roll the solder ball 24 without leaving any gap between the slit-shaped body 63 and the screen 20b. . Moreover, the opening size of the slit-shaped body 63 allows efficient filling operation while reliably replenishing the opening of the slit-shaped body 63 with solder balls 24. The cycle speed of the screen 20b and the swinging operation can be arbitrarily varied by controlling the speed of the drive motor 68, and the filling tact of the solder balls 24 can be set in consideration of line balance. Alternatively, the filling rate can be controlled by adjusting the cycle speed suitable for the type of material of the underball 24, the opening of the screen 20b, and the environmental conditions.

Further, the solder ball supply head 60 is provided with a spatula-shaped body 69. After the solder balls 24 are supplied onto the substrate 21 by the solder ball supply head 60, when the screen 20b is separated from the surface of the substrate 21, that is, when the plate separation is performed and the solder balls are transferred onto the substrate, the solder balls 24 are supplied onto the plate surface of the screen 20b. If there are any remaining solder balls 24 in the screen 20b, the solder balls 24 will fall onto the substrate 21 through the opening 20d of the screen 20b, causing excessive solder balls to be supplied. Therefore, in this embodiment, the spatula-shaped body 69 is provided at approximately the same height as the slit-shaped body 63 at a distance from the ball case in the direction in which the solder ball supply head 60 moves. The tip of the spatula-shaped body 69 is polished to be extremely thin and highly flat, and prevents the solder balls 24 from protruding outside the solder ball supply head 60 while being in close contact with the screen 20b.

In addition, since the spatula-shaped body 69 is made of a magnetic material and sticks closely to the screen 20b by magnetic force like the slit-shaped body 63, it is possible to prevent the solder balls 24 from protruding to the outside of the solder ball supply head 60. Note that the spatula-shaped body 69 may be provided over the entire outer peripheral area of the ball case. The spatula-shaped body 69 can minimize the amount of balls remaining on the plate surface of the screen 20b.
However, the influence of balls remaining due to minute displacements of the plate surface of the screen 20b can still be considered. Therefore, in this embodiment, in order to further reduce defects caused by excess solder balls, the solder ball supply head 60 is provided with an air blowing mechanism 75 for forming an air curtain.

That is, a blower mechanism 75 is provided on the motor support member 2 that supports the print head elevating mechanism 4 to form an air curtain around the filling unit. The blower mechanism 75 is configured to be supplied with compressed air from a compressed air supply source (not shown). When the blowing mechanism 75 is used, when the solder ball supply head 60 moves toward the end surface of the substrate, the protruding solder balls are pushed and rolled toward the moving direction of the solder ball supply head 60 by compressed air. Therefore, it is possible to prevent solder balls from remaining on the printing plate.

Next, the operation of mounting and printing solder balls on a board will be explained.
FIG. 5 is a schematic diagram illustrating the solder ball mounting and printing operation. The solder ball supply head 60 and the sweeper 130 are mainly used for the solder ball mounting and printing operations.

First, as shown in (1), the solder ball supply head 60 vibrates the ball case using a horizontal vibration mechanism while moving in the longitudinal direction of the substrate 21, and fills the opening of the screen 20b with solder balls. In addition, as shown in (2), the solder ball supply head 60 also uses the swinging operation by the horizontal swinging mechanism to roll the solder balls and reliably fill the openings while moving the solder balls in the horizontal direction (in the direction of arrow A). ).

When the solder ball filling operation into the screen opening is completed, the solder ball supply head 60 rises as shown by arrow B in (3). Thereafter, it moves in the longitudinal direction above the substrate 21 as shown by arrow C in (4), and when it returns to its original position, it descends to a position where it touches the screen 20b as shown by arrow D and stops.

Next, the sweep operation by the sweeper 130 will be explained.
The sweeper 130 is for collecting solder balls that are unintentionally left on the screen after the filling operation. As shown in FIG. 5, a plurality of squeegees 131 are formed at the bottom of the sweeper 130. The squeegee 131 is attached at a certain angle in a direction opposite to the moving direction of the sweeper 130 (details are not shown). By moving the squeegee 131 over the screen and stroking its surface, solder balls on the screen can be swept and collected like a broom.

When the filling operation by the solder ball supply head 60 is completed, the sweeper 130 moves in the horizontal direction shown by the arrow E while being in contact with the screen 20b, as shown in (5). That is, the plurality of squeegees 131 attached to the bottom of the sweeper 130 move horizontally along the upper surface of the screen 20b. At this time, the solder balls remaining on the screen 20b are swept up and dropped into the open openings of the screen 20b. As a result, it is possible to eliminate ball-less defects as shown in FIGS. 6 and 7, which will be described later. Furthermore, all the solder balls on the screen 20b are swept away, so that no surplus solder balls remain on the screen 20b.

When the sweeper 130 moves to the vicinity of the end of the screen 20b where the opening is present, the sweeper 130 rises once as shown by an arrow F. Thereafter, as shown by arrow G in (6), it returns above the substrate 21 in the longitudinal direction, and as shown by arrow H, it descends to the position where it contacts the screen 20b again. After that, the same sweep operation is repeated. This sweeping operation is performed several times until the solder balls on the screen 20b are completely wiped out. Further, depending on the case, as shown by arrow I in (7), a sweep operation limited to a portion of the screen 20b may be continuously executed while moving to another portion.

By the above-described sweeping operation, it is possible to fill all vacant openings with solder balls, thereby making it possible to eliminate defects without balls. Moreover, since all the surplus solder balls on the screen 20b are finally swept away, it is possible to prevent the surplus solder balls from entering the openings of the screen 20b when the screen 20b is separated from the substrate 21. Therefore, double ball defects as shown in FIGS. 6 and 7, which will be described later, can be eliminated.

FIG. 6 shows an example of how the solder balls are filled on the board after the solder balls are mounted and printed.
When the substrate 21 is imaged with a camera, a state as shown in (a) can be observed when all the electrode parts are well filled with solder balls. (b) shows a state where some of the solder balls are incompletely filled (no ball defect). (c) shows a double ball state in which solder balls are attracted to each other and a state in which surplus solder balls protrude from the electrode portion.

FIG. 7 shows typical examples of defects after solder ball mounting and printing. As shown in FIG. 7, examples of poor solder ball filling include "no ball state" where no solder balls are filled, "double ball state" where adjacent solder balls overlap, and "double ball state" where solder balls overlap. One example of this is the state of a "misaligned ball" that is deviated from the flux application position of the electrode section.

If the substrate is sent to the subsequent process (reflow process) under these conditions, a rejected product will be produced. Therefore, by inspecting the filling status on the substrate and retrying the mounting/printing operation using the filling unit (solder ball supply head), it becomes possible to correct a defective product into a non-defective product. This detection can be done by pattern matching that compares it with a non-defective model. After mounting and printing the solder balls, a line sensor camera (not shown) attached to the filling unit performs batch recognition in area units. If it is not successful, the solder ball mounting and printing are performed again. If it passes, a plate separation operation is performed and the substrate is discharged to a subsequent process.

FIG. 8 is a diagram illustrating the solder ball mounting, post-printing inspection, and repair work in the repair section.
In the inspection/repair department, after the solder ball mounting and printing are completed, the filling status on the board is checked using a CCD (Charge Coupled Device) camera. Then, when a defect is detected, the position coordinates of the defective location are determined. In the case of defects such as double balls, misaligned balls, and excessive balls, as shown in (1), the suction vacuum suction nozzle 86, which is a removal dispenser, moves to the position of the defective solder ball 24x. Then, the defective solder balls 24x are vacuum-adsorbed and moved to a defective ball disposal station (not shown). At the defective ball disposal station, the balls are dropped into a disposal box 83 (see FIG. 9) and discarded by shutting off the vacuum.

If an electrode pad part to which solder balls 24 are not supplied is detected, or if a defective solder ball is removed by the vacuum suction nozzle 86, as shown in (2), a normal solder ball stored in the solder ball storage part 84 is removed. The repairing dispenser 87 is used to adsorb the solder ball 24 by negative pressure. Then, as shown in (3), the repair dispenser 87 that has absorbed the normal solder ball 24 moves from the solder ball storage section 84 to the flux supply section 85. As shown in (4), the repair dispenser 87 that has adsorbed the solder ball 24 is moved to the flux 23 stored in the flux supply section 85 to immerse the solder ball 24 in the flux 23 (or immerse the solder ball 24 in the flux 23). 24), the flux 23 is added to the solder ball 24. Thereafter, as shown in (5), the repair dispenser 87 that has absorbed the solder ball 24 is moved to the location on the board where the defect was located. Finally, as shown in (6), solder balls 24 are supplied to the defective portion. The repair work is completed by the steps (1) to (6) above.

In the above process, a method can also be implemented in which the removing dispenser can also be used as a flux supplying dispenser to supply flux to the defective portion after removing the defective solder ball. In this case, when supplying new solder balls, there is no need to perform a step of applying flux.

Note that if defective balls such as misaligned balls are removed in the above-mentioned inspection, it is possible to repair the defect by replenishing normal solder balls at the correct position in the above-mentioned repair work.

FIG. 9 is a diagram illustrating a schematic configuration of the inspection/repair device, and is a plan view of the inspection/repair section viewed from above as one independent device.
As shown in FIG. 9, when the substrate 21 to be inspected is carried in from the carry-in conveyor 81, it is transferred onto the inspection section conveyor 82 and conveyed in the direction of arrow J. A gate-shaped frame 80 is provided above the inspection section conveyor 82. A line sensor 79 is arranged on the carry-in conveyor 81 side of the gate-shaped frame 80 in a direction perpendicular to the substrate conveyance direction (arrow J direction). This line sensor 79 detects the state of the solder ball 24 printed on the electrode pad 22 on the substrate 21. Note that here, although the line sensor 79 is provided as a solder ball state detector, an imaging camera is provided and moves in the longitudinal direction of the gate-shaped frame 80 to image the state of the solder balls and detect defects. It may be configured to detect.

A solder ball storage section 84 that stores normal solder balls and a flux supply section 85 are provided on one leg side that supports the gate-shaped frame 80. Further, a waste box 83 is provided on the other leg side. A vacuum suction nozzle 86, which is a removal dispenser for suctioning and removing defective solder balls, and a repair dispenser 87, for repairing defects on the board, are mounted on the gate-shaped frame 80 in a horizontal direction (arrow) by a linear motor. K direction).

The inspection section conveyor 82 is configured to be able to reciprocate in the direction of arrow J and in the opposite direction, and can align the defect position with the repair dispenser 87 or the vacuum suction nozzle 86 depending on the defect position of the board 21. It is configured so that it can be done. The board 21 that has been inspected and repaired is carried out by a carry-out conveyor 88 and sent to a reflow apparatus. With the above-described configuration, inspection and repair can be performed by the operation described in FIG. 8.

FIG. 10 is a side view showing the configuration of a repair dispenser as a solder ball mounting means, and FIG. 11 is an enlarged view illustrating a solder ball adsorption/separation operation at the tip of the repair dispenser.
As shown in FIG. 10, the repair dispenser 87 is formed with a suction nozzle 90 made of, for example, plastic to hold and move the solder ball (however, the material is not limited to plastic). . The suction nozzle 90 is tapered upward from a tip 98. That is, the suction nozzle 90 has a shape in which the width increases from the tip end 98 toward the base end 99. A through hole 92 is formed in the suction nozzle 90 .

As shown in FIG. 11, the through hole 92 is also formed in an upwardly tapered shape (though not as sharply as the shape of the suction nozzle 90). That is, the through hole 92 is formed to be thicker toward the top and thinner toward the bottom. In detail, the through hole 92 is formed so that the inner diameter of the open end 92a provided at the lower end of the through hole 92 is approximately the same as the outer diameter of the shaft 91, which will be described later. Negative pressure is applied to the internal space of the through hole 92 by a negative pressure applying mechanism (not shown).

The suction nozzle 90 is fixed to a nozzle support frame 94 with bolts or the like. The nozzle support frame 94 is connected to a drive section 96. Therefore, the suction nozzle 90 can freely move in the vertical direction together with the drive section 96.

A mandrel 91 is inserted and held in a through hole 92 in the suction nozzle 90 via a sealing member (not shown). The mandrel 91 is, for example, a cylindrical metal rod with a diameter of approximately 10 μm, and is made of a material that has high strength and is difficult to be charged (however, the shape (diameter) and material of the mandrel 91 are not limited to the above, and may be similar to that of the solder ball 24. (preferably smaller than the diameter). Except for the opening end 92a of the through hole 92, the outer diameter of the mandrel 91 is smaller than the inner diameter of the through hole 92, and the mandrel 91 can freely move up and down in the axial direction of the suction nozzle 90. An upper end 91a of the mandrel 91 is fixed to a support member 93. The support member 93 is connected to a motor 95 and can freely move in the vertical direction together with the shaft 91.

Since the support member 93 and the drive section 96 are connected via the linear rail 97, the support member 93 and the drive section 96 can each move up and down independently. That is, the shaft 91 attached to the support member 93 and the suction nozzle 90 connected to the drive section 96 can each independently move up and down.

In this way, the above-mentioned support member 93, nozzle support frame 94, motor 95, drive section 96, linear rail 97, etc. constitute a drive mechanism.

When the support member 93 is lowered or the suction nozzle 90 is raised, the lower end surface of the support member 93 and the upper end surface of the suction nozzle 90 come into contact as shown in FIG. 10(b). In this contact state, the lower end 91b of the mandrel 91 projects downward from the tip 98 of the suction nozzle 90. In order to realize the above function, the total length A of the mandrel 91 is configured to be longer than the total length B of the suction nozzle 90.

Note that, as shown in an enlarged view in FIG. 11, the tip 98 of the suction nozzle 90 is processed into a tapered groove shape so as to easily hold the solder ball 24. Since the tip 98 of the suction nozzle 90 is machined into the shape of a tapered groove, when the solder ball 24 is vacuum-suctioned, the solder ball 24 fits snugly and well into the tapered groove, and the solder ball 24 is attached to the tip. It becomes difficult to easily come off from the portion 98. In addition, by making the shape of the groove of the tip portion 98 into a spherical shape similar to the shape of the solder ball 24, even better suction can be achieved. However, the shape of the tip portion 98 is not limited to the above.

Next, a description will be given of the solder ball defect repair operation using the repair dispenser configured as described above.

First, the suction nozzle 90 of the repair dispenser 87 sucks a new solder ball 24 (about 30 μm in diameter) to be repaired. At this time, since negative pressure is supplied into the suction nozzle 90 through the through hole 92, the solder ball 24 is vacuum suctioned to the tip 98 of the suction nozzle 90. Although not shown, a structure is provided to prevent negative pressure from leaking from the upper part of the through hole 92 into which the mandrel 91 is inserted. Further, at this time, as shown in FIG. 10(a), the mandrel 91 is retracted inwardly (upwards) from the tip 98 of the suction nozzle 90.

In this suction state, the solder ball 24 is conveyed above the electrode pad 120 at the defective location, and the repair dispenser 87 is lowered toward the electrode pad 120 to remove the flux on the electrode pad 120, as shown in FIG. 11(a). The solder ball 24 is placed inside the solder ball 121.

Next, the motor 95 is driven to lower the mandrel 91 through the through hole 92 of the suction nozzle 90 until the lower end 91b of the mandrel 91 comes into contact with the solder ball 24. As a result, the mandrel 91 presses the solder ball 24 against the electrode pad 120, as shown in FIG. 11(b). As described above, since the outer diameter of the mandrel 91 and the inner diameter of the open end 92a of the through hole 92 are substantially the same, the mandrel 91 closes the open end 92a of the through hole 92 during the movement process of the mandrel 91. Therefore, the gap in the through hole 92 becomes narrow, and even if negative pressure is applied, the resulting vacuum suction (negative pressure) force becomes small, and the solder ball 24 can be freely separated from the suction nozzle 90. .
Therefore, according to the above configuration, there is no need to separately provide a vacuum pump valve for cutting off negative pressure, leading to cost reduction.

Next, with the solder ball 24 pressed against the electrode pad 120 by the mandrel 91 as shown in FIG. 10(b), the suction nozzle 90 is raised to separate it from the solder ball 24 as shown in FIG. 11(b). do.

Finally, the motor 95 is driven to raise the mandrel 91 again and separate it from the solder ball 24. At this time, since the contact area between the mandrel 91 and the solder ball 24 is very small, even if static electricity is generated, it is so small that it can be ignored, so that the mandrel 91 and the solder ball 24 can be separated smoothly without any problem.

As described above, the solder ball inspection and repair device according to the embodiment of the present invention (hereinafter sometimes referred to as a solder ball repair device) includes a shaft 91 that can move up and down in the repair dispenser 87 to inspect the solder balls 24. When supplying the solder ball to the defective part, the mandrel 91 physically presses the solder ball 24 against the electrode pad 120 side while pulling up the suction nozzle 91 to separate it from the solder ball 24, thereby removing the solder ball from the electrode. It can be mounted efficiently and reliably on the pad.

Alternatively, since the above-mentioned functions are achieved with a simple configuration without using expensive equipment such as a laser beam irradiation device for mounting the double ball, it is possible to keep the manufacturing cost of the device low.

Next, a plasma laser repair system that is an embodiment of the present invention will be described. FIG. 12 is an external view showing a plasma laser repair system that is an embodiment of the present invention.
With the miniaturization, higher speed, and larger capacity of semiconductor devices, bump electrodes have become extremely fine. For example, defects in solder bump electrodes are inspected and repaired by the inspection/repair section 104 shown in FIG. Even after reflow, solder ball filling failures may occur, as shown in Figure 7. For example, solder balls may not be filled in a "no-ball state," or adjacent solder balls overlap each other in a "double ball state."'', and ``misaligned ball conditions'' in which the solder ball is displaced from the flux application position of the electrode section may exist.

In these conditions, even if there is only one solder ball filling defect, the product is rejected, so the filling condition on the board is inspected again (second time), and the filling unit (solder ball supply head ), it is possible to repair a defective product to a non-defective product by trying the loading operation again and again. This detection can be done by pattern matching that compares it with a non-defective model.

Therefore, the plasma laser repair system shown in this embodiment re-inspects the board that has passed through the reflow equipment, and re-supplies and re-repairs the defective electrode parts where the bumps that have occurred on the electrode pads of the board are defective. and solder. In such ultra-fine solder bumps, the plasma laser repair system shown in this embodiment is a highly reliable repair soldering device that repairs and solders defective parts of bump electrodes after reflow.

The plasma laser repair system shown in this embodiment is installed in the downstream process of the inspection/repair section 104 shown in FIG. 2 and in the downstream process of the reflow apparatus (not shown). Note that this plasma laser repair system is not limited to being installed in the post-process of the inspection/repair section 104 shown in FIG. 2 or the post-process of the reflow apparatus, but may be installed as a standalone system. For convenience, when this plasma laser repair system is installed as a standalone system, such as off-line, it is referred to as a bump forming device, and the method of forming bumps using this device is referred to as a bump forming method for convenience. Sometimes referred to as The bump forming apparatus mounts a solder ball on each of a plurality of electrode pads formed on a substrate, and forms bumps on the electrode pads by reflowing the solder balls.

In addition, in this embodiment, as an example, it will be explained as being installed in the next step of the reflow section which is located in the subsequent step of the inspection/repair section 104 shown in FIG. At this time, the plasma laser repair system may be installed online or offline. In other words, a board on which a bump electrode with a defective part has been detected after reflow may be distributed online to this plasma laser repair system, and a board with a bump electrode on which a defective part has been detected after reflow may be distributed online to this plasma laser repair system. It may be stocked and distributed offline to this plasma laser repair system. In this embodiment, an offline case will be described.

Note that when the plasma laser repair system is placed in the next process of the reflow section located after the inspection/repair section 104 shown in FIG. Each part may be controlled to simply pass through the system. In this case, the series of devices, so-called production line configuration, can be simplified.

The plasma laser repair system has a loading stage (BF (LD)) that loads the substrate (a substrate with a bump electrode where a defective part has been detected after reflow), and performs inspection and repair work on the substrate after reflow. An inspection/repair unit (IR), a laser repair unit (LR) that fixes (soldering or welding) repaired solder balls to electrode pads, and an unloading stage (BF (ULD)) that unloads the repaired board. , has. The control unit (control unit (hereinafter referred to as CON) or control means) controls the loading stage (BF (LD)), inspection/repair unit (IR), laser repair unit (LR), and unloading stage (BF (ULD)). This is a control unit that controls the entire device to a predetermined state.

Note that the apparatus shown in FIG. 2, that is, the flux printing section 101, the solder ball mounting/printing section 103, and the inspection/repair section 104 are also controlled by a series of control flows as shown in FIG. The control flow and CON may be configured by connecting separate control devices using a dedicated communication means or the like for coordination, or may be configured as an integrated control device. (See FIG. 12 for a block diagram of a series of systems). Of course, the flux printing section 101, solder ball mounting/printing section 103, and inspection/repair section 104 shown in FIG. 2, the reflow section (not shown) arranged in the next step, and the loading stage (BF (LD )), inspection/repair unit (IR), laser repair unit (LR), and unloading stage (BF (ULD)) are configured as a series of systems, so that they are all controlled by one control device. Good too.

The inspection/repair unit (IR) also has the function of a solder ball inspection device that inspects the condition of the solder balls, such as the inspection/repair section 104 shown in FIG. 2, and as a result of inspecting the mounting status of the solder balls, If the inspection of the solder ball loading status is NG (if a defect is detected), after supplying flux to the solder ball, apply a repair dispenser, such as the one shown in Figure 10, to the defective electrode pad. and re-supply the solder balls.

As a basic example, repair work is performed in steps (1) to (6) shown in FIG. Furthermore, as a basic example of the device configuration, the device configurations shown in FIGS. 9 and 10 are applied. At this time, the position data of the resupply of the solder ball is acquired, and this position data is sent to the inspection/repair unit (IR) or the laser repair unit (LR) using a dedicated communication means, etc. You can also collaborate.

Next, a plasma laser repair device, which is a laser repair unit (LR), will be explained using FIG. 13.
The plasma laser repair apparatus includes a plasma laser repair head section 200, an alignment stage 216 on which a substrate 215 is placed, and a stage movement axis 218 that moves the alignment stage 216 in the horizontal direction (XYθ directions). Note that the plasma laser repair head section 200 may be movable in the horizontal direction (XYθ directions). Thereby, the repaired solder ball (solder ball position) can be pinpointed (locally) irradiated with plasma and laser. Note that plasma can also be expressed as emission or radiation, but in this embodiment, both of these terms will be referred to as irradiation.

Then, the plasma laser repair apparatus moves the alignment stage 216 in the horizontal direction (XYθ directions) based on the position data transmitted from the inspection/repair unit (IR). Furthermore, the plasma laser repair head section 200 may also be moved based on this position data.

In addition, in the embodiment, a case will be explained in which the alignment stage 216 is moved in the horizontal direction (XYθ direction), but the plasma laser repair head section 200 is configured to be movable in the X direction and the Y direction, and the alignment stage 216 is moved in the θ direction. It may be configured to be movable. Alternatively, the repair head may be configured to move in the X direction, Y direction, and θ direction relative to the stage on which the substrate 215 is placed.

Next, the plasma laser repair head section 200 will be explained using FIG. 14.
The plasma laser repair head section 200 (which also has the meaning of a bump forming device) moves to the repaired solder ball position, preheats the solder ball in a pinpoint spot, and applies plasma to the solder ball. The oxide film (for example, thickness from several nm to several μm) of the solder ball is removed (oxidation-reduction) by irradiating it with laser (laser light). , reflow locally.

The plasma laser repair head section 200 includes a laser unit (a laser head and a laser generator (meaning a laser irradiation means)) as a laser irradiation means that irradiates the solder ball with a laser beam spot-wise to heat and melt the solder ball. A plasma unit (sometimes referred to as a micro plasma head or a plasma generator (meaning a plasma irradiation means)) 220 serves as a plasma irradiation means that irradiates the solder ball with plasma spot-wise. , a spot heater 210 that preheats a solder ball (a substrate on which the solder ball is placed or an electrode pad (for example, a copper pad)) in a spot manner. It also includes a unit fixing plate 219 that fixes at least the laser unit 205 and the plasma unit 220. The unit fixing plate 219 fixes at least the laser unit 205 and the plasma unit 220 so that the laser irradiation direction and the plasma irradiation direction can match with a specific solder ball mounted thereon. Note that the spot heater 210 may be fixed to the unit fixing plate 219 so that its irradiation direction can be matched with a specific solder ball mounted thereon. The unit fixing plate 219 can have any shape as long as it can fix the laser unit 205, plasma unit 220, and spot heater 210 if necessary, and will be referred to as a unit fixing member below.
In this embodiment, the spot heater 210 using, for example, infrared rays is used to perform spot preheating. You may also use a hot plate.

Further, instead of the spot heater 210, a defocused laser may be used to preheat the periphery of the solder ball. Depending on the setting, the defocus laser can also heat the periphery of the solder ball, and for example, an infrared laser can be used as the defocus laser. Note that the focus when using a defocus laser (laser spot diameter when defocused) is preferably larger than the focus of the laser irradiated from the laser unit 205 (laser spot diameter when just focused).

Further, the laser irradiated from the laser unit 205 is preferably irradiated in a pulsed manner (15 to 25 KHz, eg, microwave). By irradiating the solder ball with laser pulses, the oxide film on the solder ball can be efficiently removed. This is because the oxide film formed on the surface of the solder ball can be effectively cracked by the impact of pulsed laser irradiation and thermoacoustic effect.

Further, the plasma laser repair head section 200 includes an actuator 202 for moving the unit fixing plate 219 in the vertical direction (Z-axis direction), and a motor 201 for driving the actuator 202. As a result, at least the laser unit 205 and the plasma unit 220 can move in the vertical direction to match the laser irradiation direction and the plasma irradiation direction with the mounted solder ball. The actuator 202 is then fixed to the head frame 203.

The plasma unit 220 includes a plasma electrode 213 that applies a high frequency voltage to generate plasma, a plasma antenna 211 to which the high frequency voltage is applied and generates an electric field, a plasma capillary 212 which is a plasma discharge tube into which gas is introduced, and a plasma capillary 212 which is a plasma discharge tube. and a plasma nozzle 214 that injects plasma. Thereby, the solder balls can be irradiated with plasma in spots. In this embodiment, the plasma electrode 213, the plasma antenna 211, the plasma capillary 212, and the plasma nozzle 214 are arranged in a straight line. Note that these arrangements are arbitrary, and there is no limitation as long as the arrangement allows plasma to be irradiated spot-wise onto the solder balls.

Then, a medium gas is used to generate plasma, and in this example, a mixed gas of 97 to 97.5% argon and 3 to 2.5% hydrogen is used as the gas to become the plasma. be done. Note that the types and mixing ratio of these gases are arbitrary, and may be appropriately selected depending on the device configuration or the electrode pad or solder ball to be irradiated. This gas is introduced into the plasma capillary 212 from the plasma electrode 213 side. Note that the plasma unit 220 preferably irradiates the electrode pad and/or the solder ball with plasma containing argon gas. Further, the medium gas is preferably argon gas containing 1 to 4% hydrogen component by weight.

In this case, hydrogen is radicalized and activated, and the oxide film formed on the surface of the solder ball is removed. The principle is that the oxygen in the oxide film and this hydrogen combine, and the oxide film is removed as water vapor.

The laser unit 205 also includes an observation camera 206 that observes the state of the solder ball, a laser light guide port 207 that introduces laser light, a collimating lens 208 that corrects aberrations to obtain parallel light of the laser light, and a collimating lens 208 that corrects aberrations to obtain parallel light of the laser light. and a condensing lens 209 that condenses the laser beam. In this embodiment, the observation camera 206 and the condensing lens 209 are arranged in a straight line, and the linear axes of the laser light guiding port 207 and the collimating lens 208 and the observation camera 206 and the condensing lens 209 are arranged in a straight line. is placed perpendicular to.

That is, the state of the solder ball is observed linearly by the observation camera 206, and the laser beam is refracted by 90 degrees and irradiated onto the solder ball. Thereby, the laser can be irradiated spot-wise onto the solder ball. Note that this device configuration is an example, and there is no limitation to these arrangement configurations. Furthermore, the observation camera 206 is not necessarily essential as part of the device configuration.

Preferably, the linear axis of the plasma unit 220, the linear axis of the laser unit 205, and the axis of the spot heater 210 are concentrated at one point so as to be directed toward one solder ball. In other words, the intersection (focal point) of the plasma irradiation axis of the plasma unit 220 (linear axis of the plasma unit) and the laser irradiation axis of the laser unit 205 (linear axis of the laser unit 205) is approximately at the center of the solder ball. The plasma unit 220 and the laser unit 205 are arranged so that they are at the intersection, and the arrangement position of the substrate is controlled so that the solder ball to be repaired is arranged at the intersection. Of course, the control of the substrate placement position is relative, and the movement of the plasma laser head may be controlled to be at a predetermined position. That is, the placement position of the substrate 215 and the plasma laser unit 230 are such that the plasma irradiation axis (the linear axis of the plasma unit) and the laser irradiation axis of the laser unit 205 (the linear axis of the laser unit 205) It is only necessary to provide a positioning drive means that is relatively positioned so that the intersection point (focal point) with the solder ball (axis) is approximately at the center of the solder ball.

The angle between the laser irradiation axis of the laser unit 205 and the plasma irradiation axis of the plasma unit 220 is not particularly limited, but it may be sufficient as long as the solder ball to be repaired can be irradiated with the laser or plasma, and the angle may be different depending on the device configuration or repair. Although it depends on the condition of the solder ball, it is preferable to adjust the angle between approximately 0 and 180 degrees. In other words, if this angle is 0 degrees, the laser irradiation axis and the plasma irradiation axis are in the same direction, which means, for example, that the laser and plasma are irradiated onto the solder ball from above, and this angle is 180 degrees. In the case of , it means that the laser irradiation axis and the plasma irradiation axis face each other, and, for example, the solder ball is irradiated with the laser and the plasma from the left and right directions, respectively. In this embodiment, the linear axis of the plasma unit 220, the linear axis of the laser unit 205, and the axis of the spot heater 210 each have a predetermined angle with respect to the Z axis. each at an angle of 90°. In other words, the plasma unit and laser unit 205 irradiate the solder ball supplied to the electrode pad with plasma or laser approximately at the center.

Furthermore, it is preferable that the plasma unit 220 and the laser unit 205 irradiate plasma or laser onto approximately the upper half of the solder ball supplied to the electrode pad. That is, it is preferable to irradiate the solder ball with plasma or laser from above.

Note that the linear axis of the plasma unit 220, the linear axis of the laser unit 205, and the axis of the spot heater 210 do not necessarily have to be arranged at a predetermined angle with respect to the Z axis. For example, the linear axis of the laser unit 205 is parallel to the Z-axis (coaxial with the Z-axis), and the linear axis of the plasma unit 220 and the axis of the spot heater 210 are at a predetermined angle with respect to this. It may also be placed. Further, the linear axis of the plasma unit 220 and the axis of the spot heater 210 may also be parallel to the Z axis. Furthermore, the axis of the laser unit 205 and the axis of the plasma unit may be parallel, or these axes may be coaxial.

Furthermore, the plasma laser repair head section 200 includes a substrate height displacement meter 204 that measures the height (GAP height) from the tip (substrate side) of the laser unit 205 to the substrate, and an alignment device that monitors solder ball filling defects on the substrate. A camera 217 may be installed. Note that the substrate height displacement meter 204 and the alignment camera 217 may be fixed to the unit fixing plate 219, and the spot heater 210 may also be fixed to the unit fixing plate 219.

As a result, the substrate 215 placed on the alignment stage 216 and the solder balls placed on the substrate 215 can be irradiated with laser in a spot, irradiated with plasma in a spot, and preheated in a spot. can.

Furthermore, by using the spot heater 210 to preheat in spots, there is no need to preheat the entire substrate, and thermal damage to the substrate can be suppressed. Furthermore, by using the laser unit 205 and irradiating the laser in spots, there is no need to reflow the entire board, and thermal damage to the board and healthy solder balls can be suppressed.

In other words, this embodiment is a solder ball repair device or a bump forming device that includes a laser unit 205 that irradiates a laser to a solder ball and a plasma unit 220 that irradiates a plasma to a solder ball. The balls are irradiated together or simultaneously. Here, irradiation "together" or "simultaneously" includes irradiation with plasma temporally prior to laser irradiation, and means that the irradiation times overlap with each other.

In other words, if you remove the oxide film on the solder ball by irradiating plasma and then irradiating it with laser, the solder ball will have been activated by the plasma, so this time difference will cause the solder to dry before irradiating the laser. An oxide film is formed on the solder ball, but by irradiating both or at the same time, it is possible to suppress the formation of an oxide film on the solder ball. Therefore, the process for removing the oxide film of the solder ball does not necessarily need to be performed in an inert gas atmosphere by filling the process chamber with an inert gas such as nitrogen gas. In this embodiment, the environment in which the plasma laser repair device is installed is an atmospheric environment. Note that this embodiment does not preclude covering the plasma laser repair apparatus and making the covered interior a nitrogen environment.

Note that the plasma laser repair system is controlled by a control unit (CON) so that the plasma from the plasma unit 220 that irradiates the solder ball and the laser from the laser unit that irradiates the solder ball are simultaneously irradiated. The CON also controls irradiation of plasma onto the solder ball prior to irradiation of the laser onto the solder ball supplied by the repair dispenser. Further, this CON controls the solder ball to be preheated by a spot heater 210 that preheats the solder ball prior to plasma irradiation and laser irradiation.

Also, CON is a control unit that controls plasma irradiation by the plasma unit 220 and laser irradiation by the laser unit in bump formation, and the plasma irradiation by the plasma unit 220 and the laser irradiation by the laser unit are simultaneously performed. Control is performed to ensure a time period for irradiation (a time period exists). Furthermore, in bump formation, CON controls the plasma unit 220 to perform plasma irradiation prior to laser irradiation by the laser unit. Furthermore, in bump formation, CON controls the solder ball and its surroundings to be preheated prior to plasma irradiation and laser irradiation.

FIG. 15 shows a flowchart of the plasma laser repair operation. CON appropriately controls each part according to the flowchart of this operation.
First, the substrate 215 is loaded onto the loading stage of the plasma laser repair apparatus (STEP 1). After that, position data is received from the inspection/repair unit (IR) (STEP 2). Then, the substrate 215 is placed on the alignment stage 216 (STEP 3). Based on the received position data, for example, the alignment stage 216 is moved and the substrate 215 is placed at a predetermined position (STEP 4). After that, when the arrangement is completed, the motor 201 is driven and the actuator 202 is moved downward (Z-axis direction) so that the tip of the laser unit 205 is at the set GAP height. Move it (STEP 5). This GAP height is confirmed using the substrate height displacement meter 204 (STEP 6). If there is no problem with this GAP height (if OK), proceed to the next STEP. If there is a problem with this GAP height, move the actuator 202 downward until the tip of the laser unit 205 reaches the set GAP height (gap height), and then adjust the GAP height again. The height is confirmed using the substrate height displacement meter 204.

The GAP height is confirmed with the board height displacement meter 204, and if there is no problem, the spot heater 210 is used to set the solder ball (the board 215 on which the solder ball is placed or the electrode pad) at a spot height of 150, for example. Preheat to ~180℃ (STEP 7). Then, the temperature of the solder ball (the board 215 on which the solder ball is placed and the electrode pad), especially the temperature of the board 215, is checked using a thermometer (not shown) to determine whether the temperature has reached the set temperature. Confirm by (STEP 8). Note that if this temperature has reached the set temperature, proceed to the next STEP. If this temperature has not reached the set temperature, the spot heater 210 continues to preheat. Alternatively, the output of the spot heater 210 is increased to promote temperature rise. Then, it is checked again whether this temperature has reached the set temperature.

Further, the GAP height is confirmed using the substrate height displacement meter 204, and if there is no problem, the plasma unit 220 irradiates the solder ball with plasma in spots (STEP 9). Then, whether or not the solder ball and/or the electrode pad has been oxidized and reduced (the oxide film formed on the surface of the solder ball is removed) is confirmed by, for example, the observation camera 206 (STEP 10). In this case, when the oxide film formed on the surface of the solder ball is removed, the solder ball appears to shine purple. From this, it can also be confirmed that the oxide film has been removed. Note that if the oxidation-reduction has been completed, proceed to the next STEP. If oxidation-reduction is not completed, plasma irradiation is continued. Then, it is confirmed again whether the oxidation-reduction has been completed. Note that this also includes the case where the oxide film of the electrode pad is removed and then the oxide film of the solder ball is removed. Note that if the observation camera 206 is not installed, the time for completion of oxidation-reduction may be set in advance, and the process may proceed to the next STEP based on the set time.

After confirming that the temperature of the substrate 215 has reached the set temperature and that the solder balls have been oxidized and reduced, the laser unit 205 irradiates the solder balls with a laser to reduce the temperature of the solder balls. For example, the temperature is raised to about 250° C. in about 2 seconds to melt the solder ball and fix it (soldering or welding) to the electrode pad (STEP 11). Thereby, solder ball filling defects can be eliminated.
Thereafter, the repaired board 215 with no solder ball filling defects is carried out from the carry-out stage (STEP 12).

In this way, the plasma irradiation timing at which the plasma unit 220 irradiates the solder ball with plasma is earlier than the laser irradiation timing at which the laser unit 205 irradiates the solder ball with the laser, and the plasma irradiates the solder ball with the laser. It is preferable that the irradiation is continued during the irradiation. In other words, it is preferable that there is a time period in which the plasma and the laser are irradiated together or at the same time. Further, the preheating timing at which the spot heater 210 preheats the solder ball is earlier than the laser irradiation timing at which the laser unit 205 irradiates the solder ball with laser, and the preheating is performed while the laser is irradiated. It is preferable that the call continues.

That is, at the same time or at the same time, the solder ball is irradiated with plasma, the solder ball is irradiated with a laser, the oxide film of the solder ball is removed, the solder ball is melted, and the solder ball is soldered to the electrode pad. In addition, at the same time or at the same time, the solder ball is preheated, the solder ball is irradiated with plasma, the solder ball is irradiated with a laser, the oxide film of the solder ball is removed, the solder ball is melted, and the solder ball is soldered to the electrode pad. You may attach it. In other words, together or at the same time means having overlapping time zones.

Alternatively, before installing the solder ball, irradiate the electrode pad with plasma to remove the oxide film on the electrode pad, then install the solder ball, irradiate the solder ball with plasma, and remove the oxide film on the solder ball. At the same time, the solder ball may be irradiated with a laser to melt the solder ball and solder the solder ball to the electrode pad.

As described above, in the solder ball repair method or bump forming method described in this embodiment, the state of the solder bumps formed on the electrode pads of the substrate 215 is inspected by the solder ball inspection process, and defects are detected by the solder ball inspection process. In this method, solder balls are supplied to the repaired electrode pads using a repair dispenser.

In the solder ball repair method or bump forming method, after a repair dispenser supplies a solder ball to an electrode pad where a defect has been detected, the solder ball is irradiated with plasma and a laser to remove the oxide film of the solder ball. At the same time as it is removed, the solder ball is melted to solder the solder ball to the electrode pad. Alternatively, in the solder ball repair method or bump forming method, a repair dispenser irradiates plasma onto an electrode pad where a defect has been detected to remove the oxide film of the electrode pad, and then supplies a solder ball to the electrode pad to remove the solder. The ball is irradiated with plasma and laser to remove the oxide film on the solder ball, melt the solder ball, and fix the solder ball to the electrode pad (soldering or welding).

Note that the bump forming apparatus or the bump forming method can also be thought of as supplying the solder balls 24 onto the electrode pads 22 formed on the substrate 21.

Thereby, bump defects occurring on the electrode pads of the substrate can be inspected, solder balls can be resupplied and repaired to the defective electrode portions, and soldering can be performed. Furthermore, in the case of ultra-fine solder bumps, highly reliable repair soldering can be carried out as repair/soldering to defective parts of bump electrodes after reflow.

As described above, the solder ball repair device or bump forming device described in this embodiment targets the solder balls on the electrode pads 22 of the substrate 215, and the solder bumps formed on the electrode pads 22 of the substrate 215 The device is equipped with a repair dispenser that inspects the condition of the electrode pad and supplies solder balls to the electrode pad where a defect is detected.

The solder ball repair device or the bump forming device includes a plasma unit (plasma generation device) 220 that irradiates plasma onto the solder balls supplied by the repair dispenser to remove the oxide film on the solder balls, and a plasma unit (plasma generator) 220 that irradiates the solder balls supplied by the repair dispenser with plasma to remove the oxide film on the solder balls. a laser unit (laser generator) 205 that irradiates the solder ball and melts the solder ball, and removes the oxide film of the solder ball or at the same time melts the solder ball and forms a solder bump on the electrode pad. solder to the electrode pad).

In addition, the solder ball repair device or bump forming device irradiates plasma onto the electrode pad where a defect has been detected to remove the oxide film, and irradiates the solder ball supplied by a repair dispenser with plasma to remove the solder ball. Equipped with a plasma unit (plasma generator) 220 for removing an oxide film and a laser unit (laser generator) 205 for irradiating a laser beam onto a solder ball to melt the solder ball, oxidation of an electrode pad where a defect has been detected is provided. The film is removed and the oxide film on the solder ball is removed, or at the same time, the solder ball is melted and the solder ball is soldered to the electrode pad (a solder bump is formed on the electrode pad).

Moreover, it is preferable that the laser unit 205 irradiates the upper part of the solder ball supplied to the electrode pad with a laser beam. Further, it is preferable that the laser unit 205 irradiates the laser substantially perpendicularly to the surface of the solder ball supplied to the electrode pad. Further, it is preferable that the laser unit 205 irradiates the laser with a spot diameter suitable for the solder ball diameter, and it is preferable that this spot diameter is approximately the same as the solder ball diameter or smaller than the solder ball diameter.

Further, it is preferable that the plasma unit 220 irradiates the electrode pad with plasma over a wider range than the diameter of the solder ball or the diameter of the electrode pad. Thereby, the oxide film can be removed efficiently.

In the above explanation, removing the oxide film of the solder ball by plasma irradiation or melting the solder ball by laser irradiation at the same time means performing plasma irradiation and laser irradiation simultaneously for the same period and time. , means having at least a period of simultaneous irradiation, or having at least a time period of simultaneous irradiation. Therefore, plasma irradiation may be performed prior to laser irradiation, plasma irradiation may be stopped while laser irradiation is being performed, or vice versa.

Furthermore, even if plasma irradiation and laser irradiation are switched instantaneously or in a short period of time, the difference in removal of the oxide film by plasma irradiation is such a short time that there is no problem with melting by laser irradiation. For example, it means having at least a period of simultaneous irradiation, or having at least a time period of simultaneous irradiation.

Further, the plasma irradiation timing at which the plasma unit 220 irradiates the electrode pad and/or the solder ball with plasma is earlier than the laser irradiation timing at which the laser unit 205 irradiates the solder ball with the laser, and the plasma , while the laser is being irradiated, it is preferable that the irradiation is continued. In other words, it is preferable that there is a time period in which plasma and laser are irradiated simultaneously.
In particular, solder balls that have been irradiated with plasma are easily oxidized because their surfaces are activated, and are oxidized as soon as the plasma irradiation is stopped. Therefore, it is important to irradiate the laser while irradiating the plasma.

In this way, in the solder ball repair apparatus described in this embodiment, the solder balls and/or electrode pads supplied onto the electrode pads of the substrate 215 are irradiated with plasma while the solder balls are irradiated with a laser. .

Furthermore, although the solder ball repair apparatus described in this embodiment is equipped with the spot heater 210, this may not necessarily be necessary depending on the product type, material, etc., and may be omitted. However, if this spot heater 210 is provided and controlled as in the embodiment, the laser output can be made smaller.

According to this embodiment, there is little damage caused by soldering the solder ball onto the electrode pad, and repair and soldering can be carried out efficiently and reliably.
In addition, according to this example, since the laser and plasma are irradiated only to the defective area, the time required for soldering is short, and repairs can be performed with a simple line configuration without using a batch reflow process. Since the process can be completed, it is possible to keep the manufacturing cost of the device low.

In addition, according to this example, only the defective electrode pad part can be repaired and soldered using laser and plasma, so the energy required for re-soldering is small and a large amount of heat is not generated. Therefore, it is possible to provide an energy-saving and environmentally friendly system.
In addition, according to this example, only the defective part can be repaired and soldered using laser and plasma, so the range of re-soldering is narrow and the heat history is not lost on the good parts that have already been reflow soldered. Since no additives are added, reliable repair and soldering is possible.

Next, the plasma laser head section 300 of Example 2 will be described using FIG. 16. In addition, in explaining the second embodiment, the differences from the first embodiment will be explained.

The plasma laser repair head section 300 moves to the solder ball position, preheats the solder ball 24 in a pinpoint spot, and irradiates the solder ball 24 with plasma to remove the oxide film of the solder ball 24. After removing the oxide film, laser is irradiated to locally reflow or form bumps.

The plasma laser repair head section 300 includes a laser unit (laser generator (laser irradiation means)) 305 that irradiates the solder ball 24 with a laser spot to heat and melt the solder ball, and It has a plasma unit (plasma generator (meaning plasma irradiation means)) 306 that irradiates plasma spot-wise to the solder ball 34, and a spot heater 210 that pre-heats the solder ball 34 spot-wise. Further, it has a unit fixing plate 219 that fixes at least the laser unit 305 and the plasma unit 306, and the laser unit 305, the plasma unit 306, and the unit fixing member 219 constitute the plasma laser unit 301.

In the second embodiment, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 are coaxial near the solder ball 24, and the plasma and laser are directed above (directly above) the solder ball 24. Irradiate from Note that the axis of the spot heater 210 is set so as to face one solder ball 24 that is irradiated with plasma or laser. As a result, the laser irradiation axis of the laser unit 305, the plasma irradiation axis of the plasma unit 306, and the axis of the spot heater 210 are concentrated on one solder ball 24.

Next, the principle of the plasma laser head section 300 of Example 2 will be explained using FIG. 17.
In the second embodiment, the laser irradiated from the laser unit 305 is introduced in the horizontal direction, is reflected in the vertical direction by the half mirror 309, and is irradiated onto the solder ball 24 from above the solder ball 24.

Further, in the second embodiment, the plasma irradiated from the plasma unit 306 is also irradiated onto the solder ball 24 from above the solder ball 24 .

The plasma unit 306 uses hollow cathode discharge to generate high-density plasma, and has a plasma electrode 313 to which a high frequency voltage for generating plasma is applied. Note that the high-frequency voltage for generating plasma is supplied from an electrode power source 314 that supplies high-frequency voltage to the plasma electrode 313, and the gas that becomes plasma is supplied from the gas supply section 315, and plasma is generated in the plasma generation region. In particular, in Example 2, the gas is supplied horizontally, in the same direction as the laser introduction direction. In other words, the laser introduction direction and the gas supply direction are the same. Thereby, the plasma laser head section 300 can be made compact.

As described above, in the second embodiment, the laser penetrates the plasma generation region, and the solder ball 24 is irradiated with the plasma and the laser at the same time. Thereby, the solder ball 24 can be efficiently irradiated with the plasma and the laser at the same time.

Furthermore, by making the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 coaxial, there is no need to align the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306. The solder ball 24 can be efficiently irradiated with plasma and laser.

Also in the second embodiment, an observation camera 206 such as a microscope is installed. The observation camera 206 observes the state of the solder ball 24 from above (directly above) through the half mirror 309. However, as a device configuration, the observation camera 206 is not necessarily essential.
Note that when the observation camera 206 is not installed, the half mirror 309 is not installed, the laser unit 305 is installed above (directly above) the solder ball 24, and the laser is irradiated directly onto the solder ball 24. can.

Further, in the second embodiment, a spot heater 210 that preheats the solder ball 34 in spots is used, but a defocused laser is used instead of the spot heater 210 to preheat the periphery of the solder ball. You can put it on.

In particular, when the observation camera 206 is not installed, the defocused laser can be irradiated onto the solder ball 24 from above (directly above) the solder ball 24 through the half mirror 309. That is, the irradiation axis of the defocused laser is made coaxial with the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 in the vicinity of the solder ball 24 . Thereby, the area around the solder ball 24 can be efficiently preheated.

Next, the configuration of the plasma laser head section 300 of Example 2, particularly the configuration of the plasma unit 306, will be described using FIG. 18.
The plasma unit 306 that irradiates the solder ball 24 with plasma in a spot manner uses hollow cathode discharge to generate high-density plasma.

In FIG. 18, a member 330 is a guide path forming member that forms a gas guide path, and is formed into a substantially cylindrical shape. In this member 330, a gas guide path 331 is formed in a straight line in the axial direction by appropriate drilling or the like.

The gas guide path 331 is wide open at the upper end and narrowed at the lower end to form a nozzle shape. A gas supply port 332 is provided on the side of the gas guide path 331, and gas to become plasma is supplied from the gas supply section 315 to the gas guide path 331.
A member 320 is installed at one open end of the gas guide path 331 so as to close this opening. The member 320 is not particularly limited as long as it is a member that seals one end of the gas guide path 331 and transmits laser light, which will be described later, but quartz glass is generally used (hereinafter, the member 320 is a quartz glass plate). ).

An O-ring 321 is sandwiched between the quartz glass plate 320 and a member 330, and a lid body 316 with an open center portion is screwed onto the member 330 above the O-ring 321. As a result, the quartz glass plate 320 is pressed against the O-ring 321 side, and one end of the gas guide path 331 is sealed. (Note that the method is not particularly limited to the screwing method as long as the quartz glass plate 320 is sealed.)
With this configuration, the gas guided from the gas supply section 315 through the gas introduction section 317 and the gas supply port 332 is guided by the gas guide path 331 and is irradiated downward from the nozzle formed at the lower end of the gas guide path 331.

A quartz glass plate 322 is also installed at the open lower end of the gas guide path 331 in the shape of a nozzle. With the same configuration as above, the quartz glass plate 322 placed at the lower end is pressed against the O-ring 323 by the O-ring 323 and the lid 324, and one end of the gas guide path 331 is (except for the first hole to be described).

Plasma electrodes 313 made of tungsten are installed on the upper and lower surfaces of the quartz glass plate 322 installed at the bottom to apply a high frequency voltage that excites gas and generates plasma. An electrode power line for supplying high voltage and high frequency voltage from an electrode power source 314 is connected to the plasma electrode 313.

In the lower quartz glass plate 322, a first hole having a diameter of approximately 0.5 to 0.8 mm is formed, similar to the open tip of the nozzle shaped at the lower end of the gas guide path 331. Further, second holes are also formed in the plasma electrodes 313 installed on the upper and lower surfaces of the lower quartz glass plate 322. The diameter of the second hole is greater than or approximately equal to the diameter of the first hole.

Plasma is generated around the plasma electrode 313 (near the second hole) by supplying a high voltage and high frequency voltage to the plasma electrode 313 from the electrode power supply 314, and this becomes a plasma generation region 318. The generated plasma is then irradiated from the lower opening formed in the lid 324 toward the solder ball 24 located below.
This irradiation can be adjusted by the gas supply pressure from the gas supply section 315. The supply pressure of the gas from the gas supply unit 315 is set to an appropriate pressure so that the solder balls 24 mounted on the substrate do not fly away or move (displace) from the predetermined electrodes due to the gas pressure.
Note that it is desirable that the diameter of the opening at the bottom of the lid 324 be approximately equal to or larger than the diameter of the first hole.

The laser irradiated from the laser unit 305 is introduced in the horizontal direction, reflected in the vertical direction by the half mirror 309, passes through the opening at the top of the lid body 316, and passes through the upper quartz glass plate installed in the member 330. 320 , passes through the gas guide path 331 , the first hole, the second hole, and the opening at the bottom of the lid 324 , and is irradiated onto the solder ball 24 from above the solder ball 24 .

Further, as in Example 1, the gas (medium gas) is preferably argon gas containing 1 to 4% hydrogen component by weight. In this case as well, the gas is excited by the plasma electrode 313, which is a high frequency power source (for example, 5 kV, 50 Hz), and the gas is converted into radicals and turned into plasma.

As a result, the laser irradiation axis of the laser unit 305 and the plasma irradiation axis of the plasma unit 306 become coaxial in the vicinity of the solder ball 24, and the laser penetrates the plasma generation region 318, so that the plasma and the laser simultaneously act on the solder. The ball 24 is irradiated. Thereby, the solder ball 24 can be efficiently irradiated with the plasma and the laser at the same time.

In addition, in Example 2, a plasma generation method that uses hollow cathode discharge to generate high-density plasma was used, but the plasma generation method is not limited to this. For example, the plasma generation method is not limited to this. It may also be configured to be excited by
In addition, in Example 2, a hollow cathode discharge was used and a plasma electrode was provided on the gas outlet side of the gas guide path 331 to generate plasma, but the position of the plasma electrode was limited to the gas outlet side in the example. First, it may be provided in any part of the gas flow path.

As described above, according to the second embodiment, a gas supply port 332 for supplying plasma-generating gas is provided on the side of which one end is sealed with a light-transmitting member (for example, quartz glass plate 320) that transmits laser light. A gas guide path 331 formed in a straight line that guides the gas supplied from the gas supply port 332 to irradiate the solder balls mounted on the substrate, and a distribution path from the gas guide path 331 to the solder balls. A plasma generating means (e.g., plasma electrode 313) surrounds the gas and applies a high-pressure, high-frequency power source to the gas to turn the gas into plasma, and the generated laser light is transmitted through a light-transmitting member to form a gas distribution path and A laser generating means (for example, a laser unit 305) that irradiates the solder ball through the center of the plasma generation area is provided, and the plasma removes the oxide film of the solder ball and the laser beam melts the solder ball to form a bump. An apparatus for forming bumps can be obtained.

Next, laser pulse irradiation to which Example 2 is applied will be described using FIG. 19.
The laser irradiated from the laser unit 305 is preferably irradiated in a pulsed manner (15 to 25 kHz). By irradiating the solder ball 24 with laser in a pulsed manner, the oxide film on the solder ball can be efficiently removed. This is because the oxide film formed on the surface of the solder ball can be effectively cracked by the impact of pulsed laser irradiation and thermoacoustic effect.

As described above, according to the second embodiment, since soldering can be performed using laser and plasma, the soldering range is narrow and highly reliable soldering is possible in forming extremely fine solder bumps.

FIG. 20 is a flowchart showing the operation steps of another embodiment that can more reliably place the solder ball 24 on the defective electrode pad 120 on the substrate 215 and melt it to form a bump. , is a flowchart showing a series of operation steps of the inspection repair unit IR and the laser repair unit LR in FIG. 12.

This embodiment is particularly characterized by STEP9, STEP12, STEP13, STEP14, and STEP16. That is, in STEP 9, the electrode pad 120 is irradiated with plasma to remove the oxide film on the electrode pad 120. In STEP 12, flux is transferred and applied to the electrode pad 120, and in STEP 13, flux 23 is dipped under the solder ball 24. (FIG. 8) Solder balls 24 are mounted on electrode pads 120 in STEP14. Next, in STEP 16, a flux having a lower viscosity than the flux transferred and applied to the electrode pad 120 in STEP 12 is transferred and applied from above onto the solder ball 24 mounted on the electrode pad 120 in STEP 16. Thereafter, the solder ball is melted to form a bump on the electrode pad 120.

Hereinafter, the flux transferred and applied to the electrode pad 120 in STEP 12 will be referred to as the first flux 23a, and will be transferred from above to the solder ball 24 mounted on the electrode pad 120 in STEP 16, and onto the electrode pad 120 in the previous STEP 10. The flux applied with a lower viscosity than the first flux is referred to as a second flux 23b.

In the case of this embodiment, the viscosity of the high-viscosity flux, that is, the first flux 23a, is approximately 100 to 300 cps, preferably 200 cps, and the viscosity of the low-viscosity flux, that is, the second flux 23b, is approximately 20 to 60 cps, preferably. is set at 30 cps. The viscosity of the flux 23 when dipped into the lower part of the solder ball 24 is approximately 100 to 200 cps, preferably 150 cps.

In explaining the operation process of FIG. 20, the schematic configurations of the inspection/repair unit IR and laser repair unit LR that realize this will be explained. FIG. 21 is a top plan view of the inspection/repair unit IR and the laser repair unit LR as one independent device, and the inspection/repair unit IR is roughly the same as FIG. Show parts. That is, as in FIG. 9, when the substrate 215 to be inspected is carried in from the carry-in conveyor 81, it is transferred onto the inspection section conveyor 82 and conveyed in the direction of arrow J. A gate-shaped frame 80 is provided above the inspection section conveyor 82. A line sensor 79 is arranged on the carry-in conveyor 81 side of the gate-shaped frame 80 in a direction perpendicular to the substrate conveyance direction (arrow J direction). This line sensor 79 detects the state of the solder ball 24 printed on the electrode pad 120 on the substrate 215.

Note that here, although the line sensor 79 is provided as a solder ball state detector, an imaging camera is provided and moves in the longitudinal direction of the gate-shaped frame 80 to image the state of the solder balls and detect defects. It may be configured to detect.

The gate-shaped frame 80 is provided with a solder ball storage section 84 that stores normal solder balls. The gate-shaped frame 80 has a new flux supply section 85, a first flux supply section 85a that supplies a first flux 23a with a high viscosity, and a second flux supply section 85a that supplies a second flux with a lower viscosity than this first flux. A second flux supply section 85b that supplies flux 23b is provided. Furthermore, a disposal box 83 is provided for discarding defective solder balls. A vacuum suction nozzle 86, which is a removal dispenser for suctioning and removing defective solder balls, and a repair dispenser 87, for repairing defects on the board, are mounted on the gate-shaped frame 80 in a horizontal direction (arrow) by a linear motor. K direction).

Furthermore, in FIG. 21, the first flux application means newly transfers and applies the first flux 23a stored in the first flux supply section 85a to the electrode pad 120 at the defective location on the portal frame 80. A second flux is applied by transferring the second flux 23b stored in the second flux supply section 85b from above the solder ball 24 mounted on the electrode pad 120. A second flux pin transfer unit 402 is provided as a coating means. The first flux transfer pin unit 401 and the second flux transfer pin unit 402 are also provided movably in the horizontal direction (in the direction of arrow K) by a linear motor.

Here, the solder ball storage section 84, the first flux supply section 85a, and the second flux supply section 85b are connected to the corresponding repair dispenser 87, first flux transfer pin unit 401, and second flux pin transfer unit 402. The repair dispenser 87, the first flux The configuration is such that solder balls and flux can be transferred to and from the transfer pin unit 401 and the second flux pin transfer unit 402.

The inspection section conveyor 82 is configured to be able to reciprocate in the direction of arrow J and the opposite direction, and can align the defect position with the repair dispenser 87 or the vacuum suction nozzle 86 depending on the defect position of the board 215. It is configured so that it can be done. Furthermore, the first flux pin transfer unit 401 and the first flux pin transfer unit 402 are also configured so that the defect position can be aligned with the position where flux is transferred and applied, depending on the defect position of the substrate 215. It has been done.

FIG. 22 is a side view showing the configuration of the first flux pin transfer unit 401, and FIGS. 22(a), 22(b), 22(c), and 22(d) are FIG. 3 is a side view for explaining flux transfer and application operations by the flux pin transfer unit 401 of FIG.

As shown in FIG. 22, the first flux pin transfer unit 401 includes a flux pin 411 that attaches and holds flux to its tip and transfers and applies flux to the electrode pad 120. The flux pin 411 is tapered upward from a tip 412. That is, the flux pin 411 has a shape in which the width increases from the tip end 412 toward the base end 413. Note that the shape of the flux pin 411 does not have to be tapered, but may be, for example, cylindrical and straight, as long as it can transfer flux efficiently.

The flux pin 411 is fixed to a pin support frame 414 with bolts or the like. The pin support frame 414 is connected to a drive section 415. Therefore, the flux pin 411 is configured to be able to freely move in the vertical direction together with the drive section 415. The drive unit 415 is connected to the portal frame 80 so as to be vertically movable.

Next, the operation of transferring and applying the first flux to the electrode pad 120 by the first flux pin transfer unit 401 configured as described above will be described. First, the first flux pin transfer unit 401 is driven to move along the portal frame 80, and the flux pin 411 is conveyed to a position above the first flux supply section 85a. Then, the flux pin 411 is lowered by the drive unit 415, and the tip end 412 of the flux pin 411 is immersed in the first flux 23a stored in the first flux supply unit 85a (FIG. 22(a)). 411 and attaches the first flux 23a to the tip 412 (FIG. 22(b)). Here, the volume to which the flux 23a is deposited is controlled to a predetermined flux pin immersion height by a vertically movable drive unit 415, so that an appropriate amount can be deposited.

Next, the adhered flux 23a is transferred onto the electrode pad 120 at the defective location (FIG. 22(c)), and the flux pin 411 is lowered by the drive unit 415 to move the electrode pad 120 as shown in FIG. 22(d). The first flux 23a is transferred and applied inside the flux 120. Thereafter, the first flux spin transfer unit 401 rises and returns to its initial position.

FIG. 23 is an enlarged view showing the state in which the first flux 23a is applied to the electrode pad 120 of the substrate 215, and FIG. 23(a) shows the state just before applying the first flux 23a to the electrode pad 120. FIG. 23(b) shows a state in which the first flux 23a is applied to the electrode pad 120.

Subsequently, as shown in FIG. 8, the repair dispenser 87 transports the solder ball 24 dipped in the flux 23 above the electrode pad 120 onto which the first flux 23a has been transferred and applied. is lowered in the direction of the electrode pad 120 and the solder ball 24 is placed in the first flux 23a on the electrode pad 120, but since this is the same as in FIGS. 10 and 11, the explanation will be omitted. do. The amount of flux 23 to be dipped and deposited can be determined by controlling the repair dispenser 87 to a predetermined lowering height using a drive unit 96 that can freely move in the vertical direction to deposit an appropriate amount. Can be done.

Next, in the case of this embodiment, the second flux 23b is transferred and applied by the second flux pin transfer unit 402 from above the solder ball 24 placed on the electrode pad 120 by the repair dispenser 87. FIG. 24 is a side view showing the configuration of the second flux pin transfer unit 402, and FIGS. 24(a), 24(b), 24(c), and 24(d) are FIG. 2 is a side view for explaining flux transfer and application operations by the second flux pin transfer unit 402;

This second flux pin transfer unit 402 has the same configuration as the first flux pin transfer unit 401 described above, and FIGS. 24(a), 24(b), 24(c), and 24(d) 7 is a side view for explaining the operation of transferring and applying the second flux 23b from above the solder ball 24 placed on the electrode pad 120 by the second flux pin transfer unit 402. FIG.

As shown in FIG. 24, the second flux pin transfer unit 402 includes a flux pin 421 that attaches and holds flux to its tip and transfers and applies flux to the electrode pad 120. The flux pin 421 is tapered upward from a tip 422. That is, the flux pin 421 has a shape in which the width increases from the tip end 422 toward the base end 423.

The flux pin 421 is fixed to a pin support frame 424 with bolts or the like. The pin support frame 424 is connected to a drive section 425. Therefore, the flux pin 421 is configured to be able to freely move in the vertical direction together with the drive section 425. The drive unit 425 is connected to the portal frame 80 so as to be vertically movable.

The flux pin 421 is fixed to a pin support frame 424 with bolts or the like. The pin support frame 424 is connected to a drive section 425. Therefore, the flux pin 421 is configured to be able to freely move in the vertical direction together with the drive section 425. The drive unit 425 is connected to the portal frame 80 so as to be vertically movable.

The flux pin 421 is fixed to a pin support frame 424 with bolts or the like. The pin support frame 424 is connected to a drive section 425. Therefore, the flux pin 421 is configured to be able to freely move in the vertical direction together with the drive section 425. The drive unit 425 is connected to the portal frame 80 so as to be vertically movable.

FIG. 25 is an enlarged view showing how the second flux 23b is applied from above the solder ball 24 placed on the electrode pad 120 of the substrate 215, and FIG. 25(b) shows a state where the second flux 23b is being applied from above the solder ball 24. FIG.

In the case of this embodiment, since the viscosity of the second flux 23b is lower than that of the first flux 23a as described above, the second flux 23b is applied from above the solder ball 24, and the flux pin 421 is raised. However, since the adhesive force of the first flux 23a exceeds the adhesive force of the second flux 23b, the solder ball 24 remains stably on the electrode pad 120. In addition, the low viscosity of the flux makes it easier to spread, so when the flux is applied (dropped), it can be applied evenly to the surface of the spherical solder ball, suppressing oxidation during soldering. However, it has the advantage of enabling good soldering.

Although not shown, the first flux spin transfer unit 401 and the second flux spin transfer unit 402 transfer the flux pins 411 and 421 every time flux is transferred or every predetermined number of times set in the recipe. A cleaning unit (not shown) for cleaning the tip portions 412, 422 is provided. Generally, the cleaning unit rotates a brush and inserts the tips 412, 422 of the flux pins 411, 421 into the brush. The repair dispenser 87 also has a similar configuration and includes a cleaning unit (not shown) that cleans the tip 98 and the mandrel 91 of the suction nozzle 90.

Furthermore, the first flux pin transfer unit 401 and the second flux pin transfer unit 402 have the same configuration, as is clear from FIGS. 22 and 24. If the takt time of the entire device is required to be shortened, these units may be provided separately, but if the takt time of the device is relatively slow, both units 401 and 402 may be used in common. That is, as an example, when the first flux pin transfer unit 401 is used as the second flux pin transfer unit 402, the first flux 23a is applied as described above by the first flux pin transfer unit 401, and then the first flux 23a is applied as described above. The flux pins 411 of the pin transfer unit 401 are cleaned. Next, the first flux pin transfer unit 401 may be used as the second flux pin transfer unit 402, and the second flux 23b may be applied from above the solder balls 24 as described above.

Furthermore, the first flux pin transfer unit 401 and the second flux pin transfer unit 402 have been described for transferring flux using the flux pins 411 and 421, but this uses an inkjet method, thereby transferring flux in a non-contact manner. Application (dropping) may be used, or other methods such as a jet dispenser method may be used. In short, the application method is not particularly limited as long as it is a flux application means that can apply flux. In addition, especially when applying flux by a non-contact application (dropping) method, a viscosity difference may be created between the first flux 23a and the second flux 23b to give a difference in adhesive strength, Since this is a system, there is no need for such a limitation.

In addition, in the case of this embodiment, the gate-shaped frame 80 includes a plasma laser unit 230 as a laser repair unit LR, which includes a laser unit 205 and a plasma unit 220 shown in FIGS. 13 and 14. It is attached so that it can move in the vertical direction (Z-axis direction) via. It goes without saying that the plasma laser unit 230 may be the plasma laser unit 301 shown in FIG. 16.

Returning to FIG. 20, details of a flowchart showing a series of operating steps of the inspection repair unit IR and the laser repair unit LR will be described. This operation is controlled by the control unit CON (see FIG. 12), and the control unit CON appropriately controls each part according to the flowchart of this operation.
First, the substrate 215 is carried into the loading stage BF (LD) of the system and transported by the inspection section conveyor 82 (STEP 1). After that, position data of the defective part is received from the line sensor 79 (STEP 2). Then, the substrate 215 is placed on the alignment stage 216 (STEP 3). Based on the received position data, the alignment stage 216 is moved to place the substrate 215 at a predetermined position (STEP 4).
After that, when the arrangement is completed, the motor 201 is driven to move the actuator 202 downward (Z-axis direction) (see FIG. 14), and the tips of the laser unit 205 and plasma unit 220 are adjusted to the set GAP height. The movement is controlled so that it becomes (gap height) (STEP 5). This GAP height is confirmed using the substrate height displacement meter 204 (STEP 6). If there is no problem with this GAP height (if OK), proceed to the next step. If there is a problem with this GAP height, move the actuator 202 in the vertical direction to move the tip of the laser unit 205 to the set GAP height, and then try again. The GAP height is confirmed using the board height displacement meter 204.

In the flowchart of FIG. 20 showing this operation, STEP 7, STEP 11, and STEP 15 determine whether the described operation is valid or invalid. This is because settings can be made to enable or disable all settings, and the explanation will be based on the case where all settings are enabled.

The GAP height is confirmed with the substrate height displacement meter 204, and if there is no problem, in the following STEP 8, the plasma unit 220 applies plasma to the electrode pad 120 where a defect has been detected, that is, where no solder ball is mounted. The substrate 215 is moved to a position where it is irradiated with. Then, in STEP 9, the plasma unit 220 irradiates the electrode pad 120 with plasma to remove the oxide on the surface of the electrode pad 120.

Subsequently, in STEP 10, the substrate 215 is moved to a position where the first flux 23a is applied. Since it is effective to apply flux to the electrode pad 120 in STEP 11, the first flux 23a is applied from the first flux supply part 85a to the electrode pad 120 by the first flux transfer pin unit 401 in STEP 12. The first flux 23a is applied by pin transfer (see FIG. 22).

Next, the repair dispenser 87 is activated to vacuum-adsorb the solder ball 24 as shown in FIG. 10, and in STEP 13 the solder ball 24 is dipped in flux 23 as shown in FIG. Place it on the pad 120. In STEP 15, flux application to the solder ball 24 is effective, so in STEP 16, the second flux 23b is applied from the second flux supply part 85b by the second flux transfer pin unit 402, and the second flux 23b is applied to the solder ball 24. The second flux 23b is applied by pin transfer (see FIG. 24). In the following STEP 17, the substrate 215 is moved to a position where the solder balls 24 are melted.

Next, the solder ball 24 is preheated by the spot heater 210 using the plasma laser unit 230 (STEP 18), and the plasma unit 220 irradiates the solder ball 24 with plasma (STEP 19) to remove the oxide film on the solder ball 24 and remove the solder. The solder ball 24 is heated and melted by the laser unit 205 as a ball melting means (STEP 20). As a result, a bump is formed on the electrode pad 120.
In addition, by performing plasma irradiation (STEP 19) during laser irradiation (STEP 20) after applying the second flux 23b, more beautiful soldering is possible due to hydrogen radicals with high oxidation-reduction power. It becomes possible to form bumps with less shape variation and higher coplanarity. The reason is that plasma irradiation prevents the formation of an oxide film even in areas where the flux has evaporated due to laser irradiation, improving the wettability of the bonding surface between the solder and the electrode. Because it can be done.

Note that even if plasma irradiation is performed (STEP 19), applying the second flux 23b can reduce the defective rate and improve productivity. The reason for this is that even if the flak is evenly applied to areas that are not exposed to plasma irradiation due to the spherical balls, the yield rate can be further improved.

Thereafter, the repaired board 215 with no solder ball filling defects is transported to the unloading stage BF (ULD) in STEP 21, and the board 215 is unloaded from the unloading stage BF (ULD) (STEP 22).

In the above embodiments, explanations regarding preheating of the substrate 215, electrode pads 120, and solder balls 24 have been omitted or simplified, but since these are performed in the same manner as in FIG. 15, detailed explanations have been omitted. Further, the timing of preheating the solder ball 24 by the spot heater 210, the timing of irradiating plasma onto the solder ball 24 by the plasma unit 220, and the timing of irradiating the laser onto the solder ball 24 by the laser unit 205 are as described above. Explanation will be omitted.

FIG. 26 shows a modification of the inspection repair unit IR and the laser repair unit LR shown in FIG. 80 are arranged parallel to the conveyor 82. The alignment stage 216 on which the board 215 is mounted is positioned horizontally (X, Y, θ) not only at the position indicated by the dashed line but also at almost the entire solder ball mounting area or electrode pad inspection area according to the board size. It is configured to be movable and positionable. Note that the same reference numerals as in FIG. 21 indicate the same parts.

Here, the solder ball storage section 84, the first flux supply section 85a, and the second flux supply section 85b are connected to the corresponding repair dispenser 87, first flux transfer pin unit 401, and second flux pin transfer unit 402. It is located on the lower side of the board 215, that is, on the side of the alignment stage 216 on which the substrate 215 is mounted, and normally retreats toward the gate-shaped frame 80 side as shown by the arrow (L direction), but moves forward when necessary. 87, the configuration is such that solder balls and flux can be transferred to and from the first flux transfer pin unit 401 and the second flux pin transfer unit 402.

FIG. 27 shows a configuration in which FIG. 26 is further provided with an imaging camera 79a for detecting defects by imaging the state of the solder balls as a state detector of the solder balls on the board 215. In the case of FIG. 26, the camera 79a for imaging is not provided because it is assumed that the position data of the defective part inspected in the previous process is received. However, if an imaging camera 79a is provided as shown in FIG. 27, it becomes possible to reconfirm the position data from the previous process or to independently detect the position data of the defective part.

The loading section 81 includes a preheating section 381 that can preheat the substrate 215 before transferring it to the alignment stage 216, and normally the same temperature setting as the table heater (control No. 13 in FIG. 44) provided in the alignment stage 216 is provided. I do. Since the heat capacity differs depending on the type of board, it is possible to set the temperature individually and optimize the takt time to avoid production waiting time. Further, the unloading section 88 is equipped with a cooling section 388, and the takt time can be optimized so that there is no cooling waiting time for substrates that have a large heat capacity and are difficult to cool down.

FIG. 28 shows still another modification of FIG. 26. The repair dispenser 87 shown in FIG. 10, the first flux pin transfer unit 401 shown in FIG. 22, and the second flux pin transfer unit 402 shown in FIG. 24 are structurally similar. That is, in the repair dispenser 87 shown in FIG. 10, if the mandrel 91 is stopped at the tip of the suction nozzle 90, the first flux pin transfer unit 401 shown in FIG. 22 and the second flux shown in FIG. It has the same configuration as the pin transfer unit 402. Furthermore, as described above, the repair dispenser 87 is equipped with a suction nozzle 90, which can also be used as the vacuum suction nozzle 86 for removing solder balls from defective parts.

Therefore, in FIG. 28, the repair dispenser 87 is used as the first flux pin transfer unit 401, the second flux pin transfer unit 402 shown in FIG. 24, and the vacuum suction nozzle 86, and It is a figure showing arrangement of each part when three sets are provided.

Here, for convenience, when the repair dispenser 87 is used as the first flux pin transfer unit 401, the second flux pin transfer unit 402 shown in FIG. 24, and the vacuum suction nozzle 86, a combined operation is performed. It is called a department. Reference numerals 87a, 87b, and 87c are the composite operation sections, and each of the composite operation sections 87a, 87b, and 87c includes solder ball storage sections 84a, 84b, and 84c, flux supply sections 85a, 85b, and 85c, and a cleaning unit 430a. , 430b, 430c are shown. For example, if the group 87a (87a, 84a, 85a, 430a) is mainly used, the group 87b (87b, 84b, 85b, 430b) or the group 87c (87c, 84c, 85c, 430c) may be used as a spare.

That is, as can be easily understood from the above configuration, one composite operation section 87a corresponds to the solder ball storage section 84a, the first flux supply section 85a, the first flux supply section 85a, and the cleaning unit 430a. If arranged, it is possible to perform everything from adsorption and removal of solder balls, first and second flux transfer, to nozzle cleaning with one combined operation section 87a. Therefore, if multiple sets of these are provided, it is possible to repair multiple defects at the same time, or to reduce setup time by making each set correspond to different sizes of solder balls, giving greater freedom in combinations and applications. will be expensive.

FIG. 29 is an enlarged example showing a composite holding section 450 arranged corresponding to each of the composite operation sections 87a, 87b, and 87c, and FIG. 29(a) shows a solder ball supply section 84a, a flux supply section 85a, An example in which the cleaning unit 430a is held is shown, and FIG. 29(b) shows an example in which a solder ball supply section 84b, a flux supply section 85b, and a cleaning unit 430b are additionally held in dashed lines. Note that this arrangement is arbitrary and the arrangement is free.

As described above, according to this embodiment, the electrode pad 21 is irradiated with plasma to remove the oxide film of the electrode pad 21, the electrode pad 21 is coated with the first flux 23a, and a solder ball is placed on the electrode pad 21. If the solder ball is mounted, the second flux 23b is applied from above the solder ball, and the solder ball is melted, the flux will adhere to the entire solder ball. As a result, solder wettability improves due to the melting of the solder balls, making it possible to form more reliable bumps, contributing to a significant improvement in reliability when forming micro bumps and an improvement in the yield rate.

Next, melting of the solder ball 24 by laser irradiation will be explained. Generally, when melting the solder ball 24 by laser irradiation, it is considered that the laser irradiation means focuses the laser on the center of the solder ball 24 or the surface of the solder ball 24. However, in this case, when focusing on the solder ball 24, the high center output causes deformation and scorching of the solder ball 24, as well as damage to the board 215, and evaporation of flux components deteriorates wettability, resulting in poor soldering. In some cases, it may not be possible to perform soldering with sufficient strength, and good bump formation cannot be expected.

Therefore, the embodiments shown in FIGS. 30, 31, and 32 take this point into consideration. That is, FIG. 30 shows the irradiation state of the laser beam LB by the laser unit 205. The laser beam LB emitted from the laser unit 205 converges at a focal point F indicated by a circle, and after passing this focal point F, it diffuses again.

FIG. 31 is an enlarged side view showing the vicinity of the focal point F of the laser beam LB in FIG. 30. LS1 and LS2 shown in FIG. 31 are the diameters of the laser beam LB in the portion shown in FIG. 32, that is, the laser spot LS. The diameter of the laser spot LS decreases as the laser spots LS1 and LS2 approach the focal point F, and once they pass the focal point F, the diameter increases again.

FIG. 32 is a diagram showing the relationship between the solder ball 24 mounted on the board 215 and the defocus amount of the laser beam LB. shows the case where the solder ball 24 is defocused to the bottom surface (DF=-100), and the solder ball 24 shown further below is defocused to a position where the laser spot LS of the laser beam LB is focused and the spot diameter is expanded. The case where the image is focused is shown.

FIG. 33 shows the definition of defocus amount (DF). The case where the laser focus (just focus) is set at the center of the solder ball is defined as DF=0. When the focus is set below the bottom surface of the solder ball, the amount of defocus becomes negative (DF=-30).
Conversely, if the focus is set above the top surface of the solder ball, the defocus amount will be reported as positive (DF=30).

FIG. 34 shows the power distribution of the laser beam in the cross section of the laser spot when the laser is in focus (just in focus). As shown in the figure, the laser irradiation output curve near the center of the beam spot has a steep shape. In other words, this indicates that the laser irradiation output at the center of the laser spot increases in a pinpoint manner.
The illustrated broken-line circle schematically represents a solder ball. When the defocus amount is zero (DF=0), as shown in the figure, the laser output transmitted to the solder ball is transmitted more strongly as it is closer to the center.

FIG. 35 shows the laser output distribution in the cross section of each laser spot when the laser spot is in focus (just focus: DF=0) and when the defocus amount is set to minus 100 (DF=-100). .
The two are shown on the same scale for easy comparison.

FIG. 36 shows actual values of defocus amounts for various solder balls and bump diameters, and also shows an example of bump formation.
In this embodiment, the defocus amount is set to the position of the solder ball 24 with the laser spot LS shown above. In this way, the entire solder ball 24 can be irradiated with the laser beam LB substantially uniformly, the solder ball 24 can be heated substantially uniformly, the solder ball can be melted more uniformly, and a good bump can be formed. It becomes possible to form. In other words, rather than focusing the laser spot LS on the center of the solder ball 24, the focal point F is removed and the laser spot LS is defocused on the lower surface of the solder ball 24.

That is, the energy density of the laser beam LB becomes higher as the diameter of the laser spot LS becomes smaller. Therefore, the energy density is the highest at the focal point (just focus) position where the irradiation diameter is the smallest, and the laser output increases rapidly as it gets closer to the center of the laser spot LS (FIG. 34). Therefore, the heat transfer volume to the ball is biased toward the center and near the top of the solder ball, and excessive heating occurs in a specific portion, causing unevenness on the solder surface, making it unsuitable for good soldering.
Therefore, if you set the defocus amount to, for example, DF = -100, it will be easier for the heat to be transmitted almost uniformly to the entire solder ball, and the wettability will be more likely to be applied uniformly, allowing for beautiful soldering. (Figure 35).

Although it has been described that the laser spot LS is defocused with respect to the solder ball 24, it is better to make the laser spot LS somewhat larger than the diameter of the solder ball 24 in terms of the relationship with the solder ball diameter.

In this embodiment, in order to defocus the laser spot LS onto the lower surface of the solder ball 24, if the focal point F of the laser beam LB of the laser unit 205 is fixed, the solder ball 24 mounted on the laser unit 205 and the substrate 215 must be All you have to do is make the distance relatively closer or farther away. For this purpose, although not shown, the laser unit 205 has the same configuration as the motor 201 and the actuator 202, as shown in FIG. Just install it. Alternatively, it may be attached to the head frame 203 or the gate frame 80. Alternatively, the alignment stage 216 on which the substrate 215 is mounted may be provided with driving means in the Z direction, that is, the vertical direction, so that the substrate 215 can be configured to move forward and backward in the direction of the laser unit 205. Of course, the laser unit 205 and the alignment stage 216 may be configured to approach or separate from each other.

Further, in the above, the laser spot LS of the laser beam LB irradiated to the solder ball 24 was adjusted by adjusting the distance between the solder ball 24 and the laser unit 205, but by adjusting the condensing lens 209 provided in the laser unit 205. The laser spot LS of the laser beam LB irradiated onto the solder ball 24 may be directly adjusted.
From this point of view, it is sufficient to provide a focus adjustment mechanism that adjusts the focus of the laser beam LB irradiated onto the solder ball 24. In addition, in controlling this focus adjustment mechanism, at least a desirable depth of focus (defocus amount DF) for the diameter of the solder ball 24 is stored in advance in the storage section, and the depth of focus (defocus amount DF) is input by inputting the diameter of the solder ball 24. The focusing mechanism may be operated to adjust the amount DF).

As shown in an example of bump formation shown in Fig. 36, the laser when the defocus amount is set to minus 100 μm (DF=-100) as in the actual example for a solder ball diameter of 60 μm, a bump diameter of 60 μm, and a bump pitch of 70 μm. The spot diameter was 146.6 μm, and the soldering results were good. Further, when the defocus amount was set to minus 300 μm (DF=−300), the laser spot diameter was 190 μm, and the soldering result was good.
That is, when the diameter of the solder ball was 60 μm, good bump formation could be achieved by setting the defocus amount (DF) to a spot diameter of about 2.44 times to about 3.16 times the solder ball diameter. .

As described above, according to this embodiment, in a bump forming apparatus that mounts a solder ball on an electrode provided on a substrate and melts the solder ball to form a bump on the electrode, the solder ball mounted on the electrode a laser irradiation means for irradiating a laser beam; and the laser irradiation means such that the laser spot diameter of the laser beam irradiated from the laser irradiation means matches at least approximately 2.4 times to approximately 3.1 times the diameter of the solder ball. By providing a focus adjusting means for adjusting the focus of the laser beam, in combination with the effect of plasma irradiation, it contributes to providing a highly reliable repair device in inspecting and repairing minute solder balls.

Next, various adjustment operations of the laser unit 205 will be explained.
37 and 38 show the focus adjustment operation of the laser unit 205, FIGS. 39 and 40 show the laser output adjustment operation of the laser unit 205, and FIGS. 41 and 42 show the defocus amount adjustment operation of the laser unit 205.

FIG. 37 is a diagram showing the focus adjustment operation of the laser unit 205. The tip of the laser unit 205 is shown, and 209 is the aforementioned condensing lens. When adjusting the focus of the laser unit 205, the focus is not on the actual product board 215. Dummy plate DP is used for adjustment. The laser unit 205 is controlled and operated by the control unit CON described above. Reference numerals 501 to 505 indicate various control function units that adjust and operate the laser unit 205. Each control function unit is stored as a control program in a storage unit inside the control unit CON, and predetermined operations are performed by the control unit CON. For example, as shown in FIG. 43, the recipe storage unit 501 stores the work name, in this case, information specifying the board to be manufactured, the solder ball diameter, bump diameter, bump pitch, laser output, laser focal diameter, and laser output. Data such as focus amount, laser spot diameter, power meter measurement position, focus confirmation position, plasma output, plasma flow rate, table heater, spot heater, etc. are extracted in advance through testing, and multiple sets of good data are stored as recipes. I'll keep it. In this embodiment, by inputting the solder ball diameter, bump diameter, and bump pitch, a corresponding set of various data is read out from the recipe storage section 501. Although FIG. 43 shows an example in which three sets of recipes are registered, there is no limit to the number of sets, and the number is not limited if used widely. Further, the purpose of use column in FIG. 43 is not actually stored in the storage unit, but is provided for explanation.

The laser control unit 502 determines the laser output of the laser unit 205 based on the recipe selected by inputting the solder ball diameter, bump diameter, and bump pitch. The laser irradiation drive section 503 drives the laser unit 205 to irradiate in a state set by the laser control section 502, and irradiates the laser beam LB. The focus adjustment section 504 adjusts the focus of the laser unit 205 by driving each section according to the flowchart in FIG. That is, in FIG. 38, first, in STEP 1, the stage 216 on which the substrate 215 is mounted is moved, and in the following STEP 2, the spot diameter of the laser beam LB is measured. This spot diameter is determined by measuring the spot diameter with the above-mentioned observation camera 206, and adjusting the focus by vertically controlling the mounting height of the laser unit 205 using the focus adjustment unit 504 so that the diameter becomes the smallest. This focal point is confirmed by the spot diameter confirmation section 505.
Note that the inspection unit 79a may be used instead of the observation camera 206 for checking the spot diameter. Further, although an example has been described in which the attachment height of the laser unit 205 is controlled in the focus adjustment section 504, the focus may be adjusted by adjusting the focal height using the condenser lens 209 of the laser unit 205.

Next, laser output adjustment shown in FIGS. 39 to 40 will be explained. Note that the same reference numerals as those in FIG. 37 indicate the same parts, and the explanation will be omitted. PM is a power meter that measures the output state of the laser beam LB, and has a general configuration that includes a head section for directly applying the laser beam LB and outputs the measured value. In this embodiment, this power meter PM is installed at a predetermined position on the device pedestal 240.
After the laser irradiation drive section 503 irradiates the laser beam LB, the laser output measurement position adjustment section 506 first retracts the alignment stage 216 in STEP 1, as shown in FIG. Raise the power meter PM to the irradiation position. Regarding the raising control of the power meter PM, the position of the power meter PM is controlled so as to be at the laser output measurement position read from the recipe storage unit 501. Subsequently, in STEP 3, the laser output is measured using a power meter PM.

Note that the power meter PM may be installed at a predetermined position on the alignment stage 216. In this case, instead of raising the power meter PM, after moving the alignment stage 216 to a predetermined position, the laser output measurement position adjustment section 506 controls the position of the power meter PM, and the laser output measurement section 507 adjusts the laser output. It may also be measured.

After confirming the measured laser output measurement result in STEP 4, in STEP 5 a recipe No. selected from the work name or solder ball diameter, bump diameter, and bump pitch registered in advance in the recipe storage section 501 is selected. The deviation information with the laser output target value determined by is compared, and in STEP 6, a correction amount is determined from a correction amount table (not shown), and in STEP 7, the laser output is adjusted.

Next, the defocus amount adjustment operation shown in FIGS. 41 and 42 will be described. Here, only the differences from the configuration previously described with reference to FIG. 37 will be explained, and redundant explanation will be omitted. The main difference between FIG. 41 and FIG. 37 is that the focus adjustment unit 504 adjusts the amount of defocus. Therefore, the focus adjustment section 504 in FIG. 37 becomes the depth of focus adjustment section 508 in FIG. 41. The depth of focus adjustment section 508 adjusts the depth of focus according to the procedure shown in FIG. 42 by adjusting the height of the laser unit 205 without changing the minimum spot diameter of the laser beam at the focal point.

That is, as shown in FIG. 42, first, in STEP 1, the alignment stage 216 is retracted, and in the following STEP 2, a defocus amount target is set. This defocus amount target value is determined by a recipe number selected from the work name or solder ball diameter, bump diameter, and bump pitch registered in advance in the recipe storage unit 501 (see FIG. 43). determined by Next, in STEP 3, laser irradiation is performed, and in STEP 4, the laser spot diameter of the laser beam LB is measured by the observation camera 206, and in STEP 5, the measurement result is confirmed. Subsequently, in STEP 6, the deviation information is compared with the target value, the correction amount is determined in STEP 7, and the defocus amount is adjusted in STEP 8.

Note that the frequency and order of the focus adjustment operation, laser output adjustment operation, and defocus amount adjustment operation described above can be changed arbitrarily. It is also possible to fully automate these various operations in series. Furthermore, especially when used for repairing expensive substrates, the frequency of these operations is increased and yield is emphasized, so the priority on takt time may be lowered. When using it for repairing relatively inexpensive boards such as mass-produced types, takt time is prioritized, so changes can be made as infrequently as possible, such as only at the start of work or once a week. , it is possible to set it to increase the production amount. It is also possible to provide a schedule function (not shown) that stores and controls the frequency.
As described above, according to this embodiment, whether the laser irradiation of the plasma laser unit 230 and the defocus amount setting are performed correctly, or the adjustment state of the defocus amount and laser spot diameter are mechanically and optically checked.・By verifying immediately before actual operation whether there are any problems with electrical or other system settings, or whether there are any problems such as a drop in laser output during plasma laser repair operations on expensive boards. It becomes possible to perform laser repair reliably, contributing to the provision of a highly reliable repair device in inspecting and repairing minute solder balls.

In addition, in the embodiment, various set values and target values are stored in advance in the recipe storage unit 501, and by reading these, the settings and operations of each part of the device can be specified, so that the operator can change the settings by changing the board, etc. There is no need to adjust various settings etc. every time, which can significantly reduce the number of work hours. Furthermore, when reading an arbitrary set of recipes from the recipe storage unit 501, an arbitrary set of recipes is selected from the solder ball diameter, bump diameter, and bump pitch. The solder ball diameter, bump diameter, and bump pitch are important elements when configuring a bump forming device and a solder ball repair device, and configuring a recipe based on these is important when configuring this type of delicate device. This is an extremely important element. Although other elements may be added to the solder ball diameter, bump diameter, and bump pitch, it is important to use at least these three elements.

As described above, the bump forming apparatus, the bump forming method, the solder ball repair apparatus, and the solder ball repair method have been described based on the preferred embodiments according to the present embodiment, but the present invention is not limited to the above embodiment. It is not to be interpreted. That is, the present invention can be modified in various ways and implemented in various forms without departing from its spirit and main features.

DESCRIPTION OF SYMBOLS 1... Printing device, 2... Printing head, 3... Squeegee, 4... Motor, 10... Printing table, 15... Camera, 20, 20b... Screen, 20d... Opening, 21... Substrate, 22... Electrode pad, 23... Flux , 24...Solder ball, 60...Solder ball supply head, 79...Line sensor, 79a...Inspection unit (camera & lighting), 80...Gate frame, 81...Carry-in conveyor (carry-in section), 82...Inspection section conveyor, 83... ...Disposal box, 84...Solder ball storage section (solder ball supply section, 85...Flux supply section, 85a...First flux supply section (high viscosity flux supply section (tray A)), 85b...Second flux supply section (Low viscosity flux supply unit (tray B)), 86...Vacuum suction nozzle, 87...Repair dispenser, 87a...Repair dispenser & flux transfer pin unit & vacuum suction nozzle A, 87b...Repair dispenser & flux transfer pin unit & Vacuum suction nozzle B, 87c... Repair dispenser & flux transfer pin unit & Vacuum suction nozzle C, 88... Carrying out conveyor (carrying out part), 90... Suction nozzle, 91... Mandrel, 91a... Upper end, 91b... Lower end, 92... Through hole, 92a... Open end, 93... Support member, 94... Nozzle support frame, 95... Motor, 96... Drive section, 97... Linear rail, 98... Tip, 99... Base end, 120... Electrode Pad, 121...Flux, 130...Sweeper, 131...Squeegee, 200...Plasma laser repair head section, 201...Motor, 202...Actuator, 203...Head frame, 204...Substrate height displacement meter, 205...Laser unit, 206... Observation camera, 207... Laser light guide port, 208... Collimating lens, 209... Condensing lens, 210... Spot heater, 211... Plasma antenna, 212... Plasma capillary, 213... Plasma electrode, 214... Plasma nozzle, 215... Substrate, 216... Alignment stage (inspection stage (XYθ stage)), 217... Alignment camera, 218... Stage movement axis, 219... Unit fixing plate, 220... Plasma unit (plasma generator), 230... Plasma laser unit (laser repair unit ( plasma & laser)), 240... mount, 300... plasma laser head section, 305... laser unit, 306... plasma unit, 309... half mirror, 313... plasma electrode, 314... electrode power supply, 315... gas supply section, 316... Lid body, 317... Gas introduction part, 318... Plasma generation region, 320... Member, quartz glass plate, 321... O ring, 322... Quartz glass plate, 323... O ring, 324... Lid body, 330... Member, 331... Gas guide path, 332... Gas supply port, 381... Preheating section, 388... Cooling section, 401... First flux pin transfer unit (flux transfer pin unit A), 402... Second flux pin transfer unit (flux transfer pin Unit B), 411... Flux pin, 412... Tip part, 413... Base end part, 414... Pin support frame, 415... Drive part, 421... Flux pin, 422... Tip part, 423... Base end part, 424... Pin Support frame, 425... Drive section, 430... Cleaning unit, 450... Composite holding section, 501... Recipe storage section, 502... Laser control section, 503... Laser irradiation drive section, 504... Focus adjustment section, 505... Spot diameter confirmation section , 506...Laser output measurement position adjustment section, 507...Laser output measurement section, 508...Focal depth adjustment section (head height adjustment), 509...Spot diameter confirmation section, LB...Laser light, LS...Laser spot

Claims (9)

A bump forming apparatus that mounts a solder ball on an electrode pad formed on a substrate and melts the solder ball to form a bump on the electrode pad,
plasma irradiation means for irradiating the electrode pad with plasma to remove an oxide film on the electrode pad;
a first flux application means for applying a first flux to the electrode pad from which the oxide film has been removed by the plasma irradiation means;
solder ball mounting means for mounting a solder ball on the electrode pad coated with flux by the first flux coating means;
a second flux application means for applying a second flux to the solder balls mounted by the solder ball mounting means;
A bump forming apparatus comprising: solder ball melting means for melting the solder balls coated with flux by the second flux applying means. In a bump forming method, a solder ball is mounted on an electrode pad formed on a substrate, and a bump is formed on the electrode pad by melting the solder ball.
irradiating the electrode pad formed on the substrate with plasma to remove an oxide film on the electrode pad;
applying a first flux to the electrode pad from which the oxide film has been removed;
mounting the solder ball on the electrode pad coated with the first flux using a repair dispenser that adsorbs the solder ball;
applying a second flux from above to the solder ball mounted on the electrode pad;
A bump forming method characterized in that the solder ball coated with the second flux is then melted to form a bump on the electrode pad. In a solder ball repair device that inspects the condition of solder bumps formed on electrode pads of a substrate, and supplies and melts solder balls to electrode pads where defects are detected,
plasma irradiation means for irradiating the electrode pad with plasma to remove an oxide film on the electrode pad;
a first flux application means for applying a first flux to the electrode pad from which the oxide film has been removed by the plasma irradiation means;
solder ball mounting means for mounting a solder ball on the electrode pad coated with flux by the first flux coating means;
a second flux application means for applying a second flux to the solder balls mounted by the solder ball mounting means;
A solder ball repair device comprising: solder ball melting means for melting the solder ball to which flux has been applied by the second flux application means. In a solder ball repair method, the condition of solder bumps formed on electrode pads of a substrate is inspected, and a solder ball is supplied to and melted on an electrode pad where a defect is detected.
irradiating the electrode pad formed on the substrate with plasma to remove an oxide film on the electrode pad;
applying a first flux to the electrode pad from which the oxide film has been removed;
mounting the solder ball on the electrode pad coated with the first flux using a repair dispenser that adsorbs the solder ball;
applying a second flux from above to the solder ball mounted on the electrode pad;
Thereafter, the solder ball coated with the second flux is melted to form a bump on the electrode pad. A solder ball mounted on a substrate whose one end is sealed with a light-transmitting member that transmits laser light, has a gas supply port on the side for supplying a gas that generates plasma, and which supplies the gas supplied from the gas supply port to the solder ball mounted on the substrate. a gas guide path formed in a straight line to guide the irradiation to the
plasma generating means that surrounds a part of the gas distribution path from the gas guide path to the solder ball and applies a high-pressure, high-frequency power source to the gas to turn the gas into plasma;
comprising a laser generating means for transmitting the generated laser light through the light transmitting member and irradiating the solder ball through the gas flow path and the central part of the plasma generation region;
A bump forming apparatus that removes an oxide film on the solder ball with the plasma and melts the solder ball with the laser beam to form a bump. A bump forming apparatus that supplies solder balls onto electrode pads formed on a substrate and melts the solder balls to form bumps,
A plasma unit that irradiates plasma onto a specific solder ball supplied to an electrode pad to remove an oxide film on the solder ball, and a laser unit that irradiates a laser onto the specific solder ball to melt the solder ball. , a unit fixing member fixed such that the irradiation direction of each unit irradiates the specific solder ball;
A bump forming apparatus comprising: a drive means for positioning and driving the unit fixing member so that the irradiation direction of each unit irradiates the specific solder ball. A solder ball repair device that irradiates a solder ball supplied onto an electrode pad formed on a substrate with a laser to melt the solder ball and form a solder bump on the electrode pad,
A solder, characterized by comprising a depth of focus adjustment means (focus adjustment mechanism) that adjusts a defocus amount so that the irradiation diameter of the laser is approximately 2.4 times to approximately 3.1 times the diameter of the solder ball. Ball repair equipment. The solder ball repair device according to claim 7,
comprising a plasma generating device that irradiates plasma onto the solder balls supplied onto the electrode pads formed on the substrate and removes the oxide film of the solder balls;
Plasma irradiation is performed temporally prior to laser irradiation, the irradiation times overlap with each other, and the plasma is irradiated onto the solder ball by the plasma generator to remove the oxide film of the solder ball. A solder ball repair device characterized in that, at the same time as removing the solder ball, the solder ball is irradiated with the laser by the laser generator to melt the solder ball and form a solder bump on the electrode pad. The solder ball repair device according to claim 7,
A laser output measuring means for measuring and inspecting the output value and focal diameter of the laser, a recipe storage means for storing in advance a laser output target value, a laser focus target diameter, and conditions of the target workpiece, and a target workpiece from the recipe storage means. A solder ball repair device comprising a laser control means for correcting laser output, focus, and defocus amount using control amount information corresponding to workpiece conditions.

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