TW202214058A - Bonding device, repairing device and repairing method - Google Patents

Abstract

This bonding device holds an end surface on the opposite side to an electrode part of each of a plurality of repair LEDs having the soldered electrode part, and electrically bonds, to a repair region designated on a display panel on which a plurality of LEDs have been mounted, each of the repair LEDs on a carrier tape transferred in a longitudinal direction. The bonding device is provided with, on the upstream side in the transfer direction of the carrier tape from a bonding position at which the repair LED is to be bonded to the repair region, a flux applying device which applies a flux on the electrode part of the repair LED.

Description

Jointing device, repairing device and repairing method

The present invention relates to a bonding device for encapsulating electronic parts on a circuit board, in particular to a bonding device that can clean the surface of the soldering material and the surface of the circuit board of the electrode part of the electronic parts after soldering treatment, and eliminates poor electrical connection. Device, repair device and repair method.

The bonding apparatus used in the conventional repair apparatus supplies a new conductive bonding material to the defect occurrence region of the substrate after the defective LEDs detected from the plurality of LEDs arranged on the substrate have been removed, and mounts the new LED on the new LED. On the conductive bonding material, the new conductive bonding material is heated to bond the new LED to the substrate (see, for example, Japanese Patent Laid-Open No. 2020-102616). However, in the above-mentioned conventional bonding apparatus, when the solder material is used as the bonding material, there is a problem that an oxide film is formed on the surface of the solder material, resulting in poor connection between the electrode portion of the new LED and the electrode portion of the substrate. In view of the above-mentioned problems, it has been considered to apply flux to the substrate to remove the oxide film on the surface of the solder material. However, in this case, after connecting a new LED to the substrate, it is necessary to wash and remove the excess flux on the substrate, and there is a problem that the repair process becomes complicated. Therefore, in view of the above-mentioned problems, the present invention aims to provide a bonding device and a repairing device that can clean the surface of the soldering material and the surface of the circuit board of the electrode part of the electronic component after the soldering process, and eliminate the poor electrical connection. and repair methods.

In order to achieve the above object, the bonding device of the present invention electrically bonds the repairing electronic components of the carrier tape body to a designated area on the circuit substrate encapsulated with a plurality of electronic components, and the carrier tape body retains and has a soldering-treated electronic component. The electrode portion of the repairing electronic component is the end face on the opposite side, and is transferred in the long-axis direction; the repairing electronic component is joined to the transfer of the mounting belt at the joining position of the designated area On the upstream side in the direction, a flux application device that applies flux to the electrode portion of the electronic component for repair is provided. Specifically, the bonding apparatus of the present invention is used to bond good electronic components to the area after the defective electronic components have been removed in the circuit substrate encapsulated with a plurality of electronic components, that is, the repaired area; The encapsulation surface of the circuit board is the inner surface of the opposite side; the transfer mechanism is to transfer the carrier tape body in the long axis direction, and the carrier tape system has a plurality of electrode parts with soldered electrode parts side by side in the long axis direction Repair electronic parts, and keep the end face opposite to the electrode part; flux coating device, which is attached to the delivery side of the carrier belt to apply flux to the electrodes of the plurality of repair electronic parts part; an observation device, which is used to observe and align the repaired area of the electronic parts for repair after treatment and the circuit substrate coated with the flux; the lifting mechanism is to raise the pedestal to repair the treated area. An electronic part is crimped on the repair area of the circuit substrate; and a heating device is used to heat and melt the soldering material of the electrode part of the treated electronic part for repair, so as to electrically improve the electrical properties of the treated electronic part for repair bonded to the repaired area of the circuit substrate. Furthermore, the repairing device of the present invention includes an electronic component removing device and a bonding device; the electronic component removing device irradiates a defective electronic component on a circuit board encapsulated with a plurality of electronic components to remove the defective electronic component so as to remove the defective electronic component. The circuit board forms a repair area, and the position coordinates of the repair area are memorized; the bonding device is configured to include: a pedestal for holding the inner surface on the opposite side of the packaging surface of the circuit board; a transfer mechanism for placing the belt The body is transferred in the long-axis direction, and the carrier belt system has a plurality of repaired electronic parts with electrode parts after welding processing side by side in the long-axis direction, and maintains the end face on the opposite side of the electrode part; flux; A coating device is used to apply flux to the electrode parts of the plurality of electronic parts for repair on the delivery side of the carrier belt; an observation device is used to observe the treated electronic parts coated with the flux for repair. The parts are aligned with the repaired area of the circuit substrate; a lifting mechanism is used to raise the pedestal to crimp the processed repaired electronic parts on the repaired area of the circuit substrate; and a heating device is used to make the The welding material of the electrode part of the electronic component for repair after treatment is heated and melted to electrically join the electronic component for repair after treatment in the repair area of the circuit substrate; the pedestal is configured to be connected with the electronic component removal device. The joint devices move between the joint devices, and the repair region is positioned at the joint position between the joint device and the processed repaired electronic part according to the position coordinates of the repair region. Preferably, the repairing device can be configured to be further provided with a point-on-point inspection device, which is powered on the circuit substrate to determine the goodness of the plurality of electronic parts, and can memorize the position coordinates of the defective electronic parts; the pedestal is configured to The point-start inspection device is moved between the electronic part removing device and the bonding device, and the defective electronic part is positioned at the laser light position of the electronic part removing device according to the position coordinates of the defective electronic part, and the repair is performed according to the The position coordinates of the area are used to locate the repair area at the joint position of the joint device and the processed repair electronic part. Further, the repair method of the present invention will perform the following steps: the first step is to hold the inner surface on the pedestal on the opposite side to the packaging surface of the circuit substrate encapsulated with the plurality of electronic components; the second step is to place the mounting tape The body is transported in the long axis direction, and the carrier belt system has a plurality of electronic parts for repair including the electrode parts after the welding process side by side in the long axis direction, and maintains the end face on the opposite side of the electrode part; the third The step is to apply flux on the electrode parts of the plurality of repaired electronic parts; the fourth step is to observe the repaired electronic parts coated with the flux and the circuit substrates that have been removed from defective electrons. The area behind the parts, that is, the repair area, and aligning it; the fifth step is to crimp the treated electronic component for repair on the repaired area of the circuit substrate; and the sixth step is to make the treated repaired area. The soldering material of the electrode part of the electronic component for repair is heated and melted to electrically bond the electronic component for repair after the treatment to the repair area of the circuit board. Preferably, the repair method may perform the following steps before implementing the first step: energizing the circuit substrate to determine the goodness of the plurality of electronic parts, and irradiating the laser light on the defective electronic parts that are determined to be defective, to The defective electronic parts are removed to form the repaired area on the circuit substrate. According to the present invention, since the flux is applied to the electrode portion of the electronic component after the soldering process, when the electronic component is joined to a specific area of the circuit board by heating and melting the solder, the heated Flux is used to clean the debris on the surface of the solder material and the above-mentioned specific area of the circuit board to eliminate the occurrence of poor electrical connection. Moreover, compared with the method of applying flux to the circuit board, it is not necessary to wash and remove the excess flux of the circuit board after connecting the electronic components to the circuit board, so that the bonding operation becomes easier.

Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings. FIG. 1 is a front view showing a schematic configuration of an embodiment of the bonding apparatus of the present invention. The bonding device 1 is used in a repairing device, and mounts a good electronic component in an area (ie, a repaired area) of the circuit board after the defective electronic component has been removed, and is configured to include a pedestal 2 and a transfer mechanism 3 , Flux coating device 4 , observation device 5 , lifting mechanism 6 and heating device 7 . Hereinafter, the case where the electronic component is a micro LED (Light Emitting Diode) (hereinafter abbreviated as "LED") will be described. As shown in FIG. 4 , the pedestal 2 is held by sucking and holding the inner surface of the display panel (circuit board) 9 in which a plurality of LEDs 8 are packaged in an array on the opposite side to the packaging surface on the mounting surface 2a. It moves in the XY plane intersecting the optical axis of the objective lens 10 of the observation device 5 to be described later, moves up and down in the Z direction perpendicular to the XY plane, and rotates (θ) around the central axis of the placement surface 2a. The above-mentioned display panel 9 is provided with LEDs 8 and thin-film transistors that drive the LEDs 8 in the intersecting regions of the plurality of scanning lines and the data lines that are arranged in the intersecting area. flexible substrate. A transfer mechanism 3 is provided above the pedestal 2 . As shown in FIG. 2 , the transfer mechanism 3 transfers the carrier tape body 11 (see FIG. 3 ) such as a UV peeling tape, an adhesive tape, or a thermal peeling tape in the longitudinal direction, and is configured to include a delivery reel 12 , A winding reel 13, a separating reel 14, and a plurality of guide reels 15 are provided, and the mounting belt 11 is provided with a plurality of electrode portions 8a that have been welded by the welding material 34 in parallel in the longitudinal direction. The LED 8A for repairing will hold the end face 8b on the opposite side to the electrode portion 8a. Moreover, as shown in FIG.3(a), the mounting tape 11 is attached with the protective film 16 which protects the electrode part 8a of LED8A for restoration|repair. Moreover, although FIG.3(b) is shown in the long-axis direction of the mounting tape body 11 is provided with the LEDs 8A for restoration which are lined up in a row, the mounting tape body 11 may also be provided with a plurality of side by side in the long-axis direction Column repair with LED8A. Here, the above-mentioned feeding reel 12 intermittently feeds out the carrier tape 11 wound into a roll with the electrode portion 8a of the repairing LED 8A as the outer side, and the drive of the feeding reel motor (not shown) can be controlled, for example. A fixed back tension is applied to the mounting belt 11 . In addition, the above-mentioned take-up reel 13 winds the mounting tape body 11 after peeling the LED 8A for repairing by a fixed amount, and is driven by a take-up reel motor (not shown) to rotate on the winding reel. direction. In addition, the separation reel 14 is rotationally driven by a reel motor (not shown), and is wound by a fixed amount corresponding to the feeding amount of the carrier tape 11 that has been removed from the carrier tape 11 . The protective film 16 after peeling off the repairing LED 8A. Then, the guide reels 5 are used to restrict the two ends parallel to the long axis of the carrier tape body 11 to stably maintain the transfer of the carrier tape body 11 . A flux application device 4 is provided on the delivery side of the mounting belt 11 . The flux application device 4 applies the flux 17 to the electrode portion 8a of the repairing LED 8A after the protective film 16 has been peeled off, and as shown in FIG. , the flux 17 can be sprayed from the nozzle 18 to the electrode portion 8a of the repairing LED 8A. Moreover, the downstream side surface of the conveyance direction of the mounting belt 11 of the flux coating apparatus 4 is provided with the collection|recovery part 19 which collects the flux 17 for the case where the flux is applied excessively. An observation device 5 is provided above the pedestal 2 on the downstream side in the transfer direction of the mounting belt 11 of the above-described flux coating device 4 . The observation device 5, as shown in FIG. 4, observes and aligns the treated repair LED 8B coated with the flux 17 and the repair area 20 of the display panel 9, as shown in FIG. The mounting surface 2a side of the pedestal 2 is provided with the pressing member 21, the objective lens 10, and the observation optical system 22 (refer FIG. 7). The above-mentioned pressing component 21 is formed of a transparent glass component such as quartz. For fixed installation, the processed LED 8B for repairing will be pressed to the repairing area of the display panel 9 through the mounting belt 11 in accordance with the rise of the pedestal 2 . 20. 5, the pressing member 21 has an upper surface 21a on the objective lens 10 side and a lower surface 21b on which the mounting belt 11 slides, and the upper surface 21a is formed with the focal position C of the objective lens 10 as the The lower surface 21b is formed as a curved surface represented by the radius of curvature of the center, and has a central axis intersecting the transfer direction of the mounting tape body 11 as a cylindrical surface. In this case, as shown in FIG. 5 , the light (illumination light) passing through the objective lens 10 will pass through the pressing member 21 and be condensed at the focal position C of the objective lens 10 aligned with the observation surface 23 . Then, the reflected light reflected from the observation surface 23 will form a spherical wave SW, and will pass through the pressing member 21 again and return to the objective lens 10 . FIG. 6 is an explanatory view of the shape of the upper surface 21 a of the pressing member 21 . FIG. 6( a ) illustrates a case where the upper surface 21 a of the pressing member 21 has a curved shape having a curvature corresponding to the spherical wave SW of the reflected light. In this case, as described using FIG. 5 , the wave front of the spherical wave SW does not change on the upper surface 21 a of the pressing member 21 . That is, light is not refracted on the upper surface 21a, so that no aberration occurs. Fig. 6(b) illustrates the shape of the upper surface 21a of the pressing member 21, which is different from the above-mentioned shape, and the upper surface 21a' is the pressing member 21' having a planar shape. When the upper surface 21a' is in a flat shape, light is refracted on the upper surface 21a' to generate aberrations. As a result, the resolution of the optical system is lowered and high-precision positioning is hindered. The shape of the lower surface 21b of the pressing member 21 is preferably flat from an optical viewpoint. However, as long as the ray path difference in the field of view is within the range of the focal depth of the objective lens 10, there is no problem with the curved surface. In this invention, as mentioned above, the lower surface 21b is formed so that it may have the cylindrical surface which crosses the center axis|shaft of the conveyance direction of the mounting tape body 11. The objective lens 10 is disposed above the pressing member 21 . The pair of objective lenses 10 condenses the illumination light on the observation surface 23, and cooperates with the first imaging lens 24 of the observation optical system 22 to be described later to form an image on the end surface 8b (observation surface 23) of the treated repair LED 8B on the observation surface 23. The imaging surface of the first observation camera 25 cooperates with the second imaging lens 26 of the observation optical system 22 to image the repaired region 20 (observation surface 23 ) of the display panel 9 on the imaging surface of the second observation camera 27 . An observation optical system 22 is provided above the objective lens 10 . The observation optical system 22 is used to obtain the image of the end face 8b of the repaired LED 8B and the image of the repaired area 20 of the display panel 9, and the console base 2 is driven in the XY direction and aligned to make the two images Aligned with each other, as shown in FIG. 7, it is configured to include a first light path 28 from the objective lens 10 to the first observation camera 25, a second light path 29 from the objective lens 10 to the second observation camera 27, and The light path 30 of the illumination system illuminates the observation surface 23 through the objective lens 10 . Describing in detail, the observation optical system 22 is provided on the first ray path 28 from the objective lens 10 to the first observation camera 25 as shown in FIG. After that, the end surface 8 b of the repairing LED 8B is imaged on the first imaging lens 24 of the imaging surface of the first observation camera 25 . In addition, among the first ray paths 28 from the objective lens 10 to the first observation camera 25 , the second ray paths 29 are branched by the first half mirror 31 between the objective lens 10 and the first imaging lens 24 . The upper system is provided with a second imaging lens 26 that cooperates with the objective lens 10 to form an image of the repaired region 20 of the display panel 9 on the imaging surface of the second observation camera 27 . In this case, the second imaging lens 26 can move in the direction of the optical axis as the pedestal 2 rises while maintaining the image (best focus) of the repaired region 20 of the display panel 9 . In addition, among the first ray paths 28 from the objective lens 10 to the first observation camera 25, the ray paths branched by the second half-mirror 32 between the objective lens 10 and the first half-mirror 31 (illumination system The light path 30) is provided with an illumination light source 33, which can irradiate visible light on the treated repair LED 8B and the repair area 20 of the display panel 9 through the objective lens 10, the pressing component 21 and the mounting belt 11, and The end surface 8b of the LED 8B for restoration|repair after the process, and the restoration|restoration area 20 of the display panel 9 are observed with the 1st and 2nd observation cameras 25 and 27. The pedestal 2 is provided with a lift mechanism 6 . The elevating mechanism 6 is used to lift and lower the pedestal 2 to press the processed repair LED 8B on the repair area 20 of the display panel 9 and release the crimping. Cylinder etc. A heating device 7 is provided integrally with the observation device 5 described above. The heating device 7 heats and melts the solder material 34 (refer to FIG. 2 ) of the electrode portion 8 a of the treated repair LED 8B to electrically bond the treated repair LED 8B to the repair area 20 of the display panel 9 . The electrode pad can irradiate infrared rays to the treated repairing LED 8B through the objective lens 10 , the pressing member 21 and the mounting belt 11 . Specifically, as shown in FIG. 7 , the heating device 7 is provided with an infrared laser 37 on a light path 36 that will be diverged by the lens 35 , which is connected from the objective lens 10 to the illumination light source 33 . The slopes in the light path 30 of the lighting system have half mirrors. In addition, the reference numeral 38 in FIG. 1 is used to release ions toward the carrier tape 11 on the upstream side in the transfer direction of the carrier tape 11 of the flux coating device 4 to charge the carrier tape 11 after charging. Ionizers for electrostatic neutralization to remove. 7, the reference numeral 39 is a collimating lens for collimating the laser light radiated from the infrared laser 37 and the diameter of which has been enlarged, and the reference numeral 40 is the collimated laser light that is processed in conjunction with the The slot is shaped by the shape of the end face 8b of the repair LED 8B, and the symbol 41 is an imaging lens that cooperates with the objective lens 10 to image the slot on the end face 8b of the repair LED 8B after processing. In addition, the reference numeral 42 is a guide illumination light source for adjusting the light path 36 so that the laser light emitted from the infrared laser 37 can be accurately irradiated on the end face 8b of the repaired LED 8B, and the reference numeral 43 is used to allow The light path to guide the illumination light source 42 diverges from the light path 36 half-mirror. Then, reference numeral 44 is a total reflection mirror for bending the light path by 90°. FIG. 8 is a front view showing the schematic configuration of the first embodiment of the repair apparatus using the joining apparatus 1 of the present invention. In the above-described first embodiment, the LED removing device 45 is provided in parallel with the bonding device 1 . The LED removal device 45 is used to irradiate the defective LEDs 8 of the display panel 9 encapsulated with a plurality of LEDs 8 with laser light to remove the defective LEDs 8 to form the repair area 20 in the display panel 9 , and is configured to include an observation optical system unit 46 and a laser beam. The radiation optical system unit 47 . The above-mentioned observation optical system unit 46 obtains the image of the defective LED 8 of the display panel 9 through the objective lens 48 , and controls the movement of the base 2 according to the image information of the obtained image, so as to locate the above-mentioned defective LED 8 on the objective lens 48 the center of the field of view, and the optical structure is the same as that of the observation optical system 22 of the bonding device 1 . Specifically, the observation optical system unit 46 is configured to include an imaging lens that cooperates with the objective lens 48 to image the defect LED 8 on the imaging surface of the observation camera on the light path from the objective lens 48 to the observation camera. , and an illumination light source is provided on the light path branched by the semi-mirror in the light path from the objective lens 48 toward the imaging lens. In this case, the above-mentioned imaging lens that is fixed may be provided, or the above-mentioned imaging lens that is movable along the optical axis may be provided. With a movable imaging lens, the autofocus function can be realized. The above-mentioned laser optical system unit 47 irradiates laser light on the above-mentioned defective LEDs 8 through the objective lens 48 to sublime the defective LEDs 8 to remove them, and has a device that emits ultraviolet rays (near-ultraviolet or far-ultraviolet), infrared rays or second harmonics. Wave (SHG) of the laser. In this case, a laser with a single wavelength can be individually provided for switching use, and the wavelength of the fundamental wave can be converted to generate higher harmonics and output laser light of a desired wavelength. Specifically, the above-mentioned laser optical system unit 47 has the same optical structure as that of the heating device 7 of the bonding device 1, and is due to the fact that other semi-mirrors in the light path toward the above-mentioned illumination light source may reflect visible light and allow ultraviolet rays to penetrate. There is a laser on the light path that is divided by the wavelength selective mirror. In addition, the light path toward the above-mentioned laser is provided with a slot for shaping the laser light according to the shape of the end face 8b of the LED 8, and a slot is arranged to cooperate with the objective lens 48 to make the slot image on the defective LED 8 the imaging lens. Since the focal position of the objective lens 48 is different depending on the wavelength of the used laser light, when switching to use the laser light of plural wavelengths, it is preferable to have a plurality of objective lenses 48 corresponding to the used wavelengths . FIG. 8 shows an example of an LED removal device that can be switched by mounting a first pair of objective lenses 48A for infrared and SHG, a second pair of objective lenses 48B for near-ultraviolet rays, and a third pair of objective lenses for far-ultraviolet rays 48C on a turntable 49 45. In addition, the reference numeral 50 in FIG. 8 is a blow-off/suction part that can blow off and suck the sublimated LED 8 for removal to suppress the generation of debris in the repaired region 20 , and an opening 51 is provided facing the objective lens 48 . Next, the restoration method performed using the restoration apparatus of the above-described first embodiment configured as described above will be described with reference to the flowcharts of FIGS. 9 and 10 . First, as shown in FIG. 9 , in step S1 , a spot check is performed on the plurality of LEDs 8 packaged in the display panel 9 to determine the quality of the LEDs 8 . In the above-mentioned first embodiment, the spot-on inspection of the LED 8 is implemented by a spot-on inspection device provided separately from the above-mentioned repair device. Specifically, after performing the alignment using the alignment device provided in the point-of-view inspection device to align the XY coordinate axis of the display panel 9 placed on the pedestal with the XY coordinate axis of the point-of-view inspection device, when power is applied to the display panel 9 to make all of the plurality of LED8 turn on or in the case of LED8 with three colors of red, green and blue, each color will be turned on and photographed by an image sensor such as CCD or CMOS to perform a light check. . In addition, the image sensor may be a linear sensor that can take pictures while moving from one end of the display panel 9 to the other end even if the camera is fixed. Next, in step S2, a good quality judgment is performed according to the photographed image of the image sensor. For example, when the point-on brightness of LED8 is above a specific reference value and the emission wavelength is within a specific wavelength band, it will be judged as a good product, and when the point-on brightness is lower than the above-mentioned reference value, when it is not turned on, or emits light When the wavelength shift exceeds the allowable range, it is judged as a defective product. Then, after the defective LED 8 is detected, the position coordinates of the defective LED 8 are obtained from the number of rows and columns relative to the preset reference position of the display panel 9 (for example, the center pixel of the panel), and the position coordinates Memories on removable media. Or, when the point-of-use inspection device is connected to the repair device and the LAN (Enthernet) in the factory, the information of the above-mentioned position coordinates can also be stored in the memory part of the control unit provided in each device or in the connected network. A data server, so that the information of the above-mentioned position coordinates can be shared among the devices. In addition, the following description is for the case where each device can share data through the data server connected to the network. In step S2, when the defective LED 8 is not detected (“NO” determination), the repairing process of the display panel 9 ends. On the other hand, when the defective LED 8 is detected (“YES” determination), the process proceeds to the repair process using the repair apparatus of the first embodiment, and step S3 is performed to remove the defective LED 8 from the display panel 9 . Specifically, in step S3 , first, the display panel 9 is adsorbed and held on the mounting surface 2 a of the pedestal 2 of the repairing device, and positioned at the position just below the LED removing device 45 . In the LED removing device 45 , an alignment device (not shown) is used to perform alignment so that the XY coordinate axis of the display panel 9 is aligned with the XY coordinate axis of the LED removing device 45 . In addition, the LED removing device 45 will read the position coordinates of the defective LEDs 8 detected in the point-and-click inspection device from the data server, and according to the position coordinates, remove the defective LEDs 8 (when there are a plurality of defective LEDs 8 among the defective LEDs 8 ). In this case, the selected one defective LED 8) is positioned at the irradiation position of the laser light of the LED removing device 45. Further, while observing the defective LED 8 through the observation optical system unit 46, the elevating and lowering of the pedestal 2 by the elevating mechanism 6 is controlled to focus on the end face 8b of the defective LED 8, and the pedestal 2 is slightly moved in the XY direction to fine-tune the relative position of the defective LED 8. in the position where the laser light is irradiated. Then, for example, ultraviolet rays (near ultraviolet rays or extreme ultraviolet rays) are emitted from the laser beam of the laser optical system unit 47, and the laser light of ultraviolet rays after being shaped into the shape of the end face 8b of the defective LED 8 by the slit is irradiated on the Defective LED8. In this way, the defective LEDs 8 are removed by ablation, and a repaired region 20 is formed on the display panel 9 . Moreover, infrared rays, a 2nd harmonic wave (SHG) etc. may be irradiated to defect LED8, or you may irradiate an ultraviolet-ray and infrared rays or SHG in combination. After the defective LED 8 is removed in this way, the position coordinates of the area (ie, the repaired area) 20 in the display panel 9 after the defective LED 8 has been removed are stored in the data server. Furthermore, when there are other second defective LEDs 8, the second defective LEDs 8 are positioned at the irradiation position of the laser light according to the position coordinates of the second defective LEDs 8 read from the data server. Then, in the same manner as described above, the second defective LED 8 is removed, and the position coordinates of the repaired area 20 are stored in the data server. Next, in step S4, the bonding device 1 is used to mount the LEDs 8 of good quality in the repaired area 20 of the display panel 9, and the bonding process is completed. In addition, after the above-mentioned bonding process using the bonding device 1 is completed, it is possible to return to step S1 as required, and perform the spot-on inspection of the display panel 9 again by using the spot-on inspection device. FIG. 10 is a flowchart showing the bonding process performed using the bonding apparatus 1, and shows the specific process of the above-mentioned step S4. First, move the pedestal 2 and set the restoration area 20 of the display panel 9 according to the position coordinates of the restoration area 20 read from the data server (if there are multiple restoration areas 20, it is the selected one The repair area 20) is positioned within the field of view of the observation optical system 22 of the bonding apparatus 1 to the objective lens 10 to start bonding. In this case, the second observation camera 27 is used to observe the surface of the display panel 9 , and the second imaging lens 26 is shifted in the optical axis direction to perform auto-focusing to make the image of the repaired area 20 clear. In step S11 of FIG. 10 , the flux 17 is sprayed from the flux coating device 4 to the LED 8A for repair, which is held on the mounting tape 11 (eg, an adhesive tape) and from which the protective film 16 has been peeled off. In order to apply the flux 17 to the electrode part 8a after the soldering process of the LED 8A for repairing. Next, in step S12 , as shown in FIG. 4 , the placing belt 11 is moved by a predetermined amount so that the treated repairing LED 8B coated with the flux 17 is positioned directly under the pressing member 21 . within the field of view of the objective lens 10 . In this case, as shown in FIG. 11 , the end surface 8b of the processed repair LED 8B is imaged on the first observation camera through the mounting belt 11, the pressing member 21, the objective lens 10, and the first imaging lens 24. 25 photographic faces. On the other hand, the restoration area 20 of the display panel 9 is imaged on the imaging surface of the second observation camera 27 through the mounting belt 11 , the pressing member 21 , the objective lens 10 , and the second imaging lens 26 . The control unit (not shown) of the bonding apparatus 1 compares and processes the image information of the end face 8b of the repaired LED 8B captured by the first observation camera 25 and the image information obtained by the second observation camera 27 The acquired image information of the repaired area 20 of the display panel 9 is taken to calculate the displacement amount and the displacement direction of the two images. Then, the pedestal 2 is slightly moved in the X and Y directions to perform alignment to align the two images. Next, in step S13 , after the alignment is completed, the pedestal 2 is raised to press the electrode portion 8 a of the treated repair LED 8B to the electrode pad of the repair area 20 of the display panel 9 . At this time, with the rise of the pedestal 2, the second imaging lens 26 is shifted to the direction of the arrow shown in FIG. state). Next, in step S14 , the infrared laser 37 of the heating device 7 is driven, and through the objective lens 10 , the pressing element 21 and the mounting belt 11 , the slit 40 is shaped to fit the end face 8 b of the LED 8 . The end face 8b of the LED 8B for restoration|repair after processing is irradiated with the laser light of infrared rays after shaping|molding. Thereby, the solder material 34 of the electrode part 8a of the processed LED 8B for repair is heated and melted to electrically bond the electrode part 8a of the LED 8 to the electrode pad of the repair area 20 of the display panel 9 . At this time, since the solder material 34 on the electrode portion 8a of the LED 8 is coated with the flux 17, the surface of the solder material 34 and the surface of the repair area 20 are cleaned to eliminate poor electrical connection. After the repair of the LED 8 in the repair area 20 is completed, the pedestal 2 is lowered. At this time, since the processed repair LEDs 8B joined to the repair area 20 of the display panel 9 will descend together with the pedestal 2, the strength of the bonding strength due to the welding material 34 and the adhesive strength of the adhesive tape will be poor. On the other hand, the treated repairing LED 8B is peeled off from the mounting tape 11 . Next, in step S15, it is determined whether further repair processing is required. That is, it is determined whether there are other repaired regions 20 . Then, if there is no other repaired region 20, step S15 will be judged as "NO", and the bonding process using the bonding apparatus 1 will be terminated. On the other hand, if there are plural repair areas 20, step S15 will be judged as "YES". At the same time, the pedestal 2 is moved in the XY directions according to the position coordinates of the second repair area 20 to position the second repair area 20 at the joining position of the joining device 1 . After that, returning to step S11, the flux 17 is sprayed from the flux coating device 4 toward the second repair LED 8A after the protective film 16 has been peeled off, and the flux 17 is applied to the second repair LED 8A. The electrode portion 8a after the welding process. After that, repair processing is performed on the second repair region 20 in the same manner as described above. Then, steps S11 to S15 are repeatedly performed until the repair processing for all the repaired regions 20 is completed, and it is determined that no other repaired region 20 exists, and step S15 is determined as "NO". Fig. 13 is a front view showing the schematic configuration of the second embodiment of the repair apparatus of the present invention. The point of difference from the above-described first embodiment is that the repair device includes a point-on-check device 52 . The spot inspection device 52 has the same structure as the spot inspection device described in the first embodiment, and can be powered on the display panel 9 to determine the goodness of a plurality of LEDs 8 and obtain the position coordinates of the defective LEDs 8 . Then, the LED removing device 45 and the bonding device 1 are integrally provided. According to this second embodiment, first, the pedestal 2 is moved to position the display panel 9 that is adsorbed and held on the pedestal 2 within the photographing area of the image sensor 53 of the point-on-check device 52 . At this time, an alignment device (not shown) is used to perform alignment so that the XY coordinate axis of the display panel 9 is aligned with the XY coordinate axis of the spot-on inspection device 52 . After that, the plurality of LEDs 8 of the display panel 9 are turned on and photographed by the image sensor 53 to check whether there are defective LEDs 8 that are not turned on or the like. As a result, when the display panel 9 has a defective LED 8, the position coordinates of the defective LED 8 are obtained, and the information of the position coordinates of the defective LED 8 is stored in the memory unit (not shown) of the repairing device. Next, the pedestal 2 is moved, and the display panel 9 is conveyed right below the LED removal device 45 . In the LED removal device 45, the information of the position coordinates of the defective LEDs 8 is read from the memory part of the repair device, and the defective LEDs 8 on the display panel 9 (if there are plural defective LEDs 8) are sorted according to the position coordinates. The selected one defective LED 8) is positioned at the irradiation position of the laser light of the LED removing device 45. Further, in the LED removal device 45, the stand 2 is raised and lowered to focus on the end face 8b of the defective LED 8 while observing the defective LED 8 by the observation camera of the observation optical system unit 46. Then, for example, ultraviolet rays are emitted from the laser beam of the laser optical system unit 47 , and the defect LEDs 8 are irradiated with ultraviolet rays shaped by the slits to fit the shape of the end faces 8 b of the defect LEDs 8 . In this way, the defective LEDs 8 are removed by ablation, and a repaired region 20 is formed on the display panel 9 . After the removal of the defective LEDs 8 by the LED removal device 45 is completed, the pedestal 2 is moved and the display panel 9 is conveyed to the position just below the bonding device 1 . In the bonding device 1, the pedestal 2 is moved according to the position coordinates of the defective LED 8 read from the memory part of the repairing device, so that the repairing area 20 of the display panel 9 (if there are plural repairing areas 20, it is The selected 1 repair area 20 ) is positioned within the field of view of the objective lens 10 of the bonding device 1 . Furthermore, in the bonding apparatus 1, the carrier tape 11 having a plurality of repairing electrodes including the electrode portions 8a after the welding process is arranged side by side in the long-axis direction is transferred in the long-axis direction. The LED 8A holds the end face 8b on the opposite side to the electrode portion 8a. Next, the electrode part 8a of LED8A for restoration|repair is apply|coated to the electrode part 8a of LED8A for restoration|repair after peeling off the protective film 16 with a flux. Next, the first and second observation cameras 25 and 27 are used to observe the treated repairing LED 8B coated with the flux 17 and the repaired area 20 of the display panel 9, and based on the image information of the two obtained images, the The pedestal 2 is slightly moved to perform alignment, so that the two images are aligned. Next, the pedestal 2 is raised, and the processed LED 8B for restoration|repair is press-contacted to the restoration area|region 20 of the display panel 9. Then, the solder material 34 of the electrode portion 8a of the treated repair LED 8B is heated and melted by the infrared laser light irradiated from the heating device 7, so that the treated repair LED 8B is electrically bonded to the display panel 9 Repair area 20. According to the present invention, since the flux 17 is applied to the electrode portion 8a of the repairing LED 8A after the soldering process, when the soldering material 34 is heated and melted to bond the repairing LED 8A to the repairing region 20 of the display panel 9, The surface of the solder material 34 and the debris in the repaired area 20 of the display panel 9 can be cleaned by the heated flux 17 to eliminate the occurrence of poor electrical connection. In addition, compared with the method of applying the flux 17 to the display panel 9, after the repairing LED 8A is connected to the display panel 9, it is not necessary to wash and remove the excess flux 17 on the display panel 9, so repairing Homework will become easier. In addition, although the above-mentioned embodiment has described the case where the electronic components are micro LEDs 8 , the present invention is not limited to this, and the electronic components may also be any electronic components such as sub-millimeter LEDs or semiconductor chips. Therefore, the circuit substrate is not limited to the display panel 9 . The above-described embodiments are schematically shown to the extent that the present invention can be understood and implemented, but the present invention is not limited thereto. In the present invention, various changes and corrections can be made without departing from the technical idea shown in the scope of the patent application.

1: Engagement device 2: Pedestal 2a: Mounting surface 3: Transfer mechanism 4: Flux coating device 5: Observation device 6: Lifting mechanism 7: Heating device 8: LED (electronic parts) 8a: Electrode part 8b: End face 8A: Repair LED 8B: LED for repair after treatment 9: Display panel (circuit substrate) 10: Object lens 11: Placing the belt 12: Send out the reel 13: Winding the reel 14: Separating the reels 15: Guide the reel 16: Protective film 17: Flux 19: Recycling Department 20: Repair area 21: Press the assembly 21a: Above 21b: Below 34: Welding consumables 37: Infrared Laser 38: Ionizer 45: LED removal device (electrical parts removal device) 52: Click on the inspection device

FIG. 1 is a front view showing a schematic configuration of an embodiment of the bonding apparatus of the present invention. FIG. 2 is a diagram showing a repairing LED used in the bonding device of the present invention, (a) is a plan view, and (b) is a front view. Fig. 3 is a schematic diagram showing a carrier tape body used in the bonding device of the present invention, (a) is a front view, and (b) is a top view after removing the protective film. Fig. 4 is an enlarged front view of the main part of the engaging device of the present invention. FIG. 5 is an explanatory view showing the shape of a pressing member used in the joint device of the present invention. Fig. 6 is an explanatory view of the top shape of the pressing member, (a) shows the case where the top has a curved surface shape having a curvature corresponding to the spherical wave of the reflected light, and (b) shows that the top has a flat shape Case. FIG. 7 is a diagram showing an observation optical system of an observation apparatus and a laser optical system of a heating apparatus used in the bonding apparatus of the present invention. Fig. 8 is a front view showing the schematic configuration of the first embodiment of the repair apparatus of the present invention. FIG. 9 is a flow chart showing the repairing method of the present invention. FIG. 10 is a flow chart showing the joining process in the above-mentioned repairing method. FIG. 11 is a first schematic diagram illustrating the simultaneous observation of observation surfaces with different focal positions by the observation optical system. FIG. 12 is a second schematic diagram illustrating simultaneous observation of observation surfaces with different focal positions by the observation optical system. Fig. 13 is a front view showing the schematic configuration of the second embodiment of the repair apparatus of the present invention.

1: Engagement device

2: Pedestal

2a: Mounting surface

3: Transfer mechanism

4: Flux coating device

5: Observation device

6: Lifting mechanism

7: Heating device

10: Object lens

11: Placing the belt

12: Send out the reel

13: Winding the reel

14: Separating the reels

15: Guide the reel

16: Protective film

21: Press the assembly

38: Ionizer

Claims (15)

A bonding device for electrically bonding repairing electronic components of a carrier tape body to a designated area on a circuit substrate encapsulating a plurality of electronic components, the carrier tape body holding a plurality of the electronic components having soldered electrode parts. The electrode portion of the repaired electronic component is the end face on the opposite side, and is transferred in the long axis direction; A flux application device for applying flux to the electrode portion of the repair electronic component is provided on the upstream side in the conveying direction of the mounting belt at the joint position where the repair electronic component is joined to the designated area. . According to the joint device of claim 1, the electronic component and the repairing electronic component are micro LEDs. A bonding device, which is used for bonding good electronic parts to the area after the defective electronic parts have been removed in a circuit substrate encapsulated with a plurality of electronic parts, that is, the repair area; The system consists of: a pedestal, which maintains the inner surface on the opposite side to the packaging surface of the circuit substrate; The transfer mechanism transfers the carrier belt body in the long axis direction, and the carrier belt system has a plurality of repaired electronic parts including the electrode parts after the welding process side by side in the long axis direction, and keeps the electrode parts with the electrode parts. is the end face on the opposite side; A flux coating device for coating the electrode parts of the plurality of electronic components for repair with flux on the delivery side of the mounting belt; An observation device for observing and aligning the electronic parts for repair after treatment coated with the flux and the repair area of the circuit substrate; an elevating mechanism for raising the pedestal to crimp the processed electronic component for repair on the repair area of the circuit substrate; and The heating device heats and melts the soldering material of the electrode portion of the processed electronic component for repair, so as to electrically bond the processed electronic component for repair to the repair area of the circuit substrate. According to the bonding device of claim 3, the flux coating device is provided with a flux recovery part. The joining device according to claim 3 or 4 of the scope of claim 3, wherein an ionizer for removing static electricity from the carrier belt is provided on the upstream side of the carrier belt in the flux coating device in the transfer direction. According to the bonding device of claim 3 of the scope of application, wherein a mounting surface is provided between the mounting surface of the pedestal and the objective lens opposite to the mounting surface and provided for the observation device through the mounting belt. The processed electronic component for repair is crimped to the pressing component of the repair area. The joint device of claim 6, wherein the pressing member has an upper surface on the side of the pair of objective lenses and a lower surface that slides the carrier belt, the upper surface is formed into a curved surface, and the curved surface is formed by the pair of objects. The focal position of the lens is represented as the radius of curvature of the center, and the lower surface is formed as a cylindrical surface, and the cylindrical surface has a central axis that intersects the transfer direction of the mounting tape. The bonding device of claim 3, wherein the heating device is an infrared laser integrated with the observation device. According to the joint device of claim 3 of the scope of application, wherein the electronic component and the electronic component for repair are micro LEDs. A repairing device is provided with an electronic parts removing device and a joining device; The electronic part removing device irradiates a laser light on a defective electronic part of a circuit substrate encapsulated with a plurality of electronic parts to remove the defective electronic part to form a repair area on the circuit substrate, and memorizes the position coordinates of the repair area; The joining device is configured to include: a pedestal, which maintains the inner surface on the opposite side to the packaging surface of the circuit substrate; The transfer mechanism transfers the carrier belt body in the long axis direction, the carrier belt system has a plurality of electronic parts for repair including the electrode parts after the welding process side by side in the long axis direction, and keeps the electrode part with the electrode part. is the end face on the opposite side; A flux coating device for coating the electrode parts of the plurality of electronic components for repair with flux on the delivery side of the mounting belt; An observation device, which is used to observe and align the repaired area of the electronic component for repair after treatment coated with the flux and the circuit substrate; a lifting mechanism for raising the pedestal to crimp the processed electronic component for repair on the repair area of the circuit substrate; and A heating device for heating and melting the soldering material of the electrode portion of the processed electronic component for repair, so as to electrically bond the processed electronic component for repair to the repair area of the circuit substrate; The pedestal is configured to move between the electronic part removal device and the bonding device, and the repaired region is positioned between the bonding device and the processed repaired electronic part according to the positional coordinates of the repaired region engagement position. For the repairing device of item 10 of the scope of the application, it is additionally provided with a point-and-click inspection device, which is energized on the circuit substrate to determine the quality of a plurality of electronic parts, and can memorize the position coordinates of the defective electronic parts; The pedestal is configured to move between the point-start inspection device, the electronic part removing device and the joining device, and the defective electronic part is positioned on the lightning bolt of the electronic part removing device according to the position coordinates of the defective electronic part The light position is irradiated, and the repaired region is positioned at the joint position between the joint device and the processed repaired electronic part according to the position coordinates of the repaired region. For the repairing device according to claim 10 or 11 of the scope of the application, the electronic component and the electronic component for repairing are micro LEDs. A repair method that takes the following steps: The first step is to hold the inner surface on the pedestal on the opposite side to the packaging surface of the circuit substrate encapsulating the plurality of electronic components; In the second step, the carrier belt is transferred in the long axis direction, and the carrier belt system has a plurality of electronic parts for repair including the electrode parts after the welding process side by side in the long axis direction, and keeps the electrodes with the electrodes. The part is the end face on the opposite side; The third step is to apply flux on the electrode parts of the plurality of repaired electronic parts; The fourth step is to observe the repaired electronic parts coated with the flux and the area of the circuit substrate after the defective electronic parts have been removed, that is, the repaired area and align it; The fifth step is to crimp the processed electronic component for repair on the repaired area of the circuit substrate; and In the sixth step, the soldering material of the electrode portion of the processed electronic component for repair is heated and melted to electrically bond the processed electronic component to the repaired area of the circuit board. According to the repair method of claim 13, before the first step is performed, the following steps are performed: energizing the circuit board to determine the goodness of a plurality of electronic components, and irradiating laser light on the defects that are determined to be defective electronic parts to remove the defective electronic parts to form the repaired area on the circuit substrate. According to the repairing method of claim 13 or 14 of the scope of application, wherein the electronic component and the electronic component for repair are micro LEDs.

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