JP2022044218A - Bonding apparatus, repair apparatus, and repair method - Google Patents

Abstract

To clean a solder material surface and a circuit board surface of an electrode part of a soldered electrical component, and to eliminate electrical connection defects.SOLUTION: A bonding apparatus 1 is used for electrically bonding a repair LED 8A on a carrier tape 11 which is conveyed in a longitudinal direction holding an end face 8b opposite to an electrode part 8a of a plurality of repair LEDs 8A whose electrode part 8a has been soldered, to a designated repair area 20 on a display panel 9 on which a plurality of LEDs 8 has been mounted. Upstream in a conveyance direction of the carrier tape 11 at a bonding position where the repair LED 8A is bonded to the repair area 20, a flux application device 4 is provided to apply flux 17 to the electrode part 8a of the repair LED 8A.SELECTED DRAWING: Figure 4

Description

The present invention relates to a bonding device for mounting an electronic component on a circuit board, and in particular, a bonding device capable of cleaning the surface of the solder material and the surface of the circuit board of the electrode portion of the soldered electronic component and eliminating electrical connection failure. It relates to a repair device and a repair method.

The bonding device used in the conventional repair device provides a new conductive bonding material in the defect generation region of the substrate from which the defective LED detected from a large number of LEDs arranged on the substrate has been removed, and the new conductive material is provided. A new LED is set on the sex bonding material, and the new conductive bonding material is heated to bond the new LED and the substrate (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2020-102626

However, in such a conventional bonding apparatus, when a solder material is used as a bonding material, an oxide film is formed on the surface of the solder material, and poor connection between the electrode portion of the new LED and the electrode portion of the substrate occurs. There was a problem.

To solve such a problem, it is conceivable to apply flux to the substrate to remove the oxide film on the surface of the solder material. However, in this case, after connecting the new LED to the substrate, it is necessary to clean and remove the excess flux on the substrate, which causes a problem that the repair process becomes complicated.

Therefore, the present invention addresses such problems, and can eliminate the cleaning and electrical connection failure of the solder material surface and the circuit board surface of the electrode portion of the soldered electronic component, and the bonding device, the repair device, and the repair. The purpose is to provide a method.

In order to achieve the above object, the bonding apparatus according to the present invention is a carrier tape in which the electrode portion is transferred in the long axis direction while holding the end face of a plurality of electronic components soldered on the opposite side to the electrode portion. A bonding device that electrically bonds the electronic components to a designated region on a circuit board on which a plurality of electronic components are mounted, and the carrier at a bonding position where the electronic components are bonded to the designated region. A flux applying device for applying flux to the electrode portion of the electronic component is provided on the upstream side in the transfer direction of the tape.

Specifically, the bonding device according to the present invention is a bonding device for joining a non-defective electronic component to a repair region in which defective electronic components are removed from a circuit board on which a plurality of electronic components are mounted, and the mounting of the circuit board. The carrier tape has a stage that holds the back surface on the opposite side to the front surface and a carrier tape that holds the end faces of the plurality of repair electronic components having the electrode portions soldered on the opposite side to the electrode portion and arranges them in the long axis direction. A transfer mechanism that transfers in the long axis direction, a flux coating device that applies flux to the electrodes of the plurality of repair electronic components on the transmission side of the carrier tape, and processed repair electrons coated with the flux. An observation device that observes and aligns the component and the repair area of the circuit board, an elevating mechanism that raises the stage to press the processed electronic component for repair to the repair area of the circuit board, and the processed device. It is configured to include a heating device that heats and melts the solder material of the electrode portion of the electronic component for repair and electrically joins the treated electronic component for repair to the repair region of the circuit board.

Further, in the repair device according to the present invention, a defective electronic component of a circuit board on which a plurality of electronic components are mounted is irradiated with a laser beam to remove the defective electronic component to form a repair region, and the position coordinates of the repair region are formed. The electronic component removing device that stores the electronic components, the stage that holds the back surface of the circuit board on the opposite side to the mounting surface, and the end faces of the plurality of repair electronic components whose electrodes are soldered on the opposite side of the electrode. A transfer mechanism that holds and transfers carrier tapes arranged side by side in the long axis direction, and a flux coating device that applies flux to the electrodes of the plurality of repair electronic components on the delivery side of the carrier tape. An observation device that observes and aligns the treated electronic component coated with the flux with the repair area of the circuit board, and raises the stage to move the treated electronic component of the circuit board to the repair area of the circuit board. It is provided with an elevating mechanism that press-contacts the electronic component for repair, and a heating device that heats and melts the solder material of the electrode portion of the electronic component for repair and electrically joins the electronic component for repair to the repair region of the circuit board. The stage moves between the electronic component removing device and the bonding device, and based on the position coordinates of the repair area, the repair area is set to the bonding device. It is configured to be positioned at the joint position with the processed electronic component for repair.

Preferably, the repair device further includes a lighting inspection device that energizes the circuit board to determine the quality of a plurality of electronic components and stores the position coordinates of defective electronic components, and the stage is the lighting inspection device. And move between the electronic component removing device and the bonding device to position the defective electronic component at the laser beam irradiation position of the electronic component removing device based on the position coordinates of the defective electronic component, and the repair area. The repair region may be configured to be positioned at the joining position of the bonding device with the processed repair electronic component based on the position coordinates of the above.

Further, the repair method according to the present invention includes a first step of holding the back surface of the circuit board on which a plurality of electronic components are mounted on the opposite side to the mounting surface on the stage, and a plurality of repair electronic components having soldered electrodes. The second step of transferring the carrier tape having the end faces on the opposite side to the electrode portion and arranging them side by side in the major axis direction in the major axis direction, and applying flux to the electrode portions of the plurality of repair electronic components. The third step of observing and aligning the treated electronic component coated with the flux and the repair region from which the defective electronic component has been removed from the circuit board, and the treated repair step. The fifth step of pressing the electronic component into the repair area of the circuit board and the solder material of the electrode portion of the processed repair electronic component are heated and melted to heat and melt the treated electronic component for repair in the repair area of the circuit board. The sixth step of electrically joining to the solder is performed.

Preferably, in the repair method, before the first step is carried out, the circuit board is energized to determine the quality of the plurality of electronic components, and the defective electronic components determined to be defective are irradiated with laser light. It is advisable to carry out the step of removing defective electronic components to form a repair region.

According to the present invention, since the flux is applied to the electrode portion of the soldered electronic component, it is heated when the solder material is heated and melted to join the electronic component to a predetermined region of the circuit board. Debris on the surface of the solder material and the above-mentioned predetermined region of the circuit board is cleaned by the flux, and the occurrence of electrical connection failure can be eliminated. Further, as compared with the method of applying flux to the circuit board, it is not necessary to clean and remove the excess flux of the circuit board after connecting the electronic component to the circuit board, and the bonding work becomes easy.

It is a front view which shows the schematic structure of one Embodiment of the bonding apparatus by this invention. It is a figure which shows the repair LED used for the bonding apparatus of this invention, (a) is a plan view, (b) is a front view. It is a figure which shows the carrier tape used for the bonding apparatus of this invention, (a) is a front view, (b) is a plan view which a protective film is removed. It is an enlarged front view of the main part of the bonding apparatus by this invention. It is explanatory drawing which shows the shape of the pressing member used in the bonding apparatus of this invention. It is explanatory drawing about the shape of the upper surface of a pressing member, (a) shows the case where the upper surface has a curved surface shape which has a curvature corresponding to the spherical wave of reflected light, (b) is the case where the upper surface has a planar shape. Shows the case. It is a figure which shows the observation optical system of the observation apparatus used for the bonding apparatus of this invention, and the laser optical system of a heating apparatus. It is a front view which shows the schematic structure of the 1st Embodiment of the repair device by this invention. It is a flowchart which shows the repair method by this invention. It is a flowchart which shows the bonding process in the said repair method. It is a 1st schematic diagram explaining simultaneous observation of observation surfaces with different focal positions by the observation optical system. It is a 2nd schematic diagram explaining simultaneous observation of observation surfaces with different focal positions by the observation optical system. It is a front view which shows the schematic structure of the 2nd Embodiment of the repair device by this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a front view showing a schematic configuration of an embodiment of a bonding apparatus according to the present invention. This bonding device 1 is used in a repair device, and is intended to attach a non-defective electronic component to a repair region from which defective electronic components of a circuit board have been removed. It is configured to include a flux coating device 4, an observation device 5, an elevating mechanism 6, and a heating device 7. Hereinafter, a case where the electronic component is a micro LED (Light Emitting Diode) (hereinafter, simply referred to as “LED”) will be described.

As shown in FIG. 4, the stage 2 attracts and holds the back surface of the display panel (circuit board) 9 on which a plurality of LEDs 8 are arranged in a matrix and mounted on the opposite side to the mounting surface 2a. It moves in the XY plane orthogonal to the optical axis of the objective lens 10 of the observation device 5 described later, moves up and down in the Z direction perpendicular to the XY plane, and rotates around the central axis of the mounting surface 2a ( θ).

The display panel 9 is provided with an LED 8 and a thin film transistor for driving the LED 8 in an intersecting region provided by intersecting a plurality of scanning lines and data lines, and even a hard substrate made of glass or the like may be provided. It may be a flexible substrate made of polyimide or the like.

A transfer mechanism 3 is provided above the stage 2. As shown in FIG. 2, the transfer mechanism 3 holds the end faces 8b on the opposite side of the electrode portions 8a of the plurality of repair LEDs 8A whose electrode portions 8a are soldered by the solder material 34 and arranges them in the long axis direction. A carrier tape 11 (see FIG. 3) such as a UV release tape, an adhesive tape, or a heat release tape, which has a carrier tape 11 (see FIG. 3), is transferred in the long axis direction, and includes a delivery reel 12, a take-up reel 13, and a separator reel 14. , A plurality of guide rollers 15 and the like.

As shown in FIG. 3A, a protective film 16 for protecting the electrode portion 8a of the repair LED 8A is attached to the carrier tape 11. Further, FIG. 3B shows a carrier tape 11 having repair LEDs 8A arranged in a row in the long axis direction, but the carrier tape 11 has a plurality of repair LEDs 8A in a plurality of rows in the long axis direction. It may be provided side by side.

Here, the transmission reel 12 simply transmits the carrier tape 11 wound up with the electrode portion 8a of the repair LED 8A as the outside. For example, the carrier tape 11 controls the drive of the transmission reel motor (not shown). It is possible to give a certain amount of back tension to the reel. Further, the take-up reel 13 winds the carrier tape 11 lifted off by the repair LED 8A by a fixed amount, and is driven by a take-up reel motor (not shown) to rotate in the take-up direction. There is. Further, the separator reel 14 is rotationally driven by a reel motor (not shown), and the protective film 16 peeled off from the repair LED 8A of the carrier tape 11 is wound up by a fixed amount according to the delivery amount of the carrier tape 11. It has become. The guide rollers 15 are for restricting both ends parallel to the long axis of the carrier tape 11 to keep the carrier tape 11 stable in transfer, and a plurality of guide rollers 15 are provided at appropriate positions as needed. ing.

A flux application device 4 is provided on the transmission side of the carrier tape 11. The flux application device 4 applies the flux 17 to the electrode portion 8a of the repair LED 8A from which the protective film 16 has been peeled off, and is provided with a nozzle 18 facing the carrier tape 11 as shown in FIG. The flux 17 can be sprayed from the nozzle 18 onto the electrode portion 8a of the repair LED 8A. Further, a recovery unit 19 for recovering the flux 17 is provided on the downstream side surface of the carrier tape 11 of the flux coating device 4 in the transfer direction in case the flux is excessively applied.

An observation device 5 is provided above the stage 2 on the downstream side of the carrier tape 11 of the flux coating device 4 in the transfer direction. As shown in FIG. 4, the observation device 5 observes and aligns the processed repair LED 8B coated with the flux 17 with the repair area 20 of the display panel 9, and as shown in FIG. From the mounting surface 2a side of the stage 2, the pressing member 21, the objective lens 10, and the observation optical system 22 (see FIG. 7) are provided.

The pressing member 21 is fixedly provided with a member made of a transparent glass member such as quartz, and the processed repair LED 8B combined with the rise of the stage 2 is attached to the display panel 9 via the carrier tape 11. It is designed to be in pressure contact with the repair area 20. Specifically, as shown in FIG. 5, the pressing member 21 has an upper surface 21a on the objective lens 10 side and a lower surface 21b on which the carrier tape 11 slides, and the upper surface 21a has a focal position C of the objective lens 10. It is formed on a curved surface represented by a radius of curvature at the center, and the lower surface 21b is formed on a cylindrical surface having a central axis intersecting the transfer direction of the carrier tape 11.

In this case, as shown in FIG. 5, the light (illumination light) transmitted through the objective lens 10 passes through the pressing member 21 and is focused on the focal position C of the objective lens 10 that matches the observation surface 23. Then, the reflected light reflected from the observation surface 23 forms a spherical wave SW, passes through the pressing member 21 again, and returns to the objective lens 10.

FIG. 6 is an explanatory diagram regarding the shape of the upper surface 21a of the pressing member 21. FIG. 6A illustrates a case where the upper surface 21a of the pressing member 21 has a curved surface shape having a curvature corresponding to the spherical wave SW of the reflected light. In this case, as described above with reference to FIG. 5, the wavefront of the spherical wave SW does not change on the upper surface 21a of the pressing member 21. That is, since light refraction does not occur on the upper surface 21a, aberration does not occur. FIG. 6B illustrates a pressing member 21'in which the upper surface 21a'has a planar shape, unlike the shape of the upper surface 21a of the pressing member 21. When the upper surface 21a'is a planar shape, light refraction occurs on the upper surface 21a', and aberration occurs. Therefore, the resolution of the optical system is lowered, which hinders high-precision positioning.

The shape of the lower surface 21b of the pressing member 21 is preferably a flat surface from an optical point of view. However, as long as the optical path difference in the field of view is within the range within the depth of focus of the objective lens 10, there is no problem even with a curved surface. In the present invention, as described above, the lower surface 21b is formed on a cylindrical surface having a central axis intersecting the transfer direction of the carrier tape 11.

An objective lens 10 is provided above the pressing member 21. The objective lens 10 concentrates the illumination light on the observation surface 23, and the end surface 8b (observation surface 23) of the processed repair LED 8B cooperates with the first imaging lens 24 of the observation optical system 22 described later. The image is formed on the imaging surface of the first observation camera 25, and the repair region 20 (observation surface 23) of the display panel 9 is combined with the second imaging lens 26 of the observation optical system 22 to form a second observation camera. The image is formed on the imaging surface of 27.

An observation optical system 22 is provided above the objective lens 10. The observation optical system 22 acquires an image of the end face 8b of the processed repair LED 8B and an image of the repair area 20 of the display panel 9, and controls the drive of the stage 2 in the XY direction so that both images match each other. As shown in FIG. 7, the first optical path 28 from the objective lens 10 to the first observation camera 25 and the second optical path from the objective lens 10 to the second observation camera 27 are used for alignment. 29, and an optical path 30 for illuminating the observation surface 23 via the objective lens 10.

Specifically, as shown in FIG. 7, the observation optical system 22 cooperates with the objective lens 10 on the first optical path 28 from the objective lens 10 to the first observation camera 25, and the processed repair LED 8B A first imaging lens 24 that forms an image on the image pickup surface of the first observation camera 25 is fixedly provided with the end surface 8b of the above. Further, the second optical path 29 in which the first optical path 28 from the objective lens 10 to the first observation camera 25 is branched between the objective lens 10 and the first imaging lens 24 by the first half mirror 31. Above, a second imaging lens 26 for forming a repair region 20 of the display panel 9 on the imaging surface of the second observation camera 27 in cooperation with the objective lens 10 is provided. In this case, the second imaging lens 26 can move in the optical axis direction as the stage 2 rises while maintaining the imaging (best focus) of the repair region 20 of the display panel 9. Further, an optical path (illumination system optical path 30) in which the first optical path 28 from the objective lens 10 to the first observation camera 25 is branched between the objective lens 10 and the first half mirror 31 by the second half mirror 32. ), An illumination light source 33 is provided, and the repair LED 8B and the repair area 20 of the display panel 9 that have been processed are irradiated with visible light via the objective lens 10, the pressing member 21, and the carrier tape 11, and the processing has been completed. The end face 8b of the repair LED 8B and the repair area 20 of the display panel 9 can be observed by the first and second observation cameras 25 and 27.

The stage 2 is provided with an elevating mechanism 6. The elevating mechanism 6 is for raising and lowering the stage 2 to press-contact and release the processed repair LED 8B to the repair area 20 of the display panel 9, and is an electric stage or an air cylinder that moves the stage 2 in the Z direction. And so on.

A heating device 7 is provided integrally with the observation device 5. The heating device 7 heats and melts the solder material 34 (see FIG. 2) of the electrode portion 8a of the treated repair LED 8B to electrically melt the treated repair LED 8B on the electrode pad of the repair region 20 of the display panel 9. It is to be joined, and the processed repair LED 8B can be irradiated with infrared rays via the objective lens 10, the pressing member 21, and the carrier tape 11. Specifically, as shown in FIG. 7, the heating device 7 has an infrared laser on an optical path 36 in which the illumination system optical path 30 from the objective lens 10 to the illumination light source 33 is branched by a prism 35 having a half mirror on the slope. It is equipped with 37.

In FIG. 1, reference numeral 38 indicates that ions are emitted toward the carrier tape 11 on the upstream side of the carrier tape 11 of the flux coating device 4 in the transfer direction to neutralize and remove the static electricity of the charged carrier tape 11. Ionizer. Further, in FIG. 7, reference numeral 39 is a collimating lens that collimates the laser beam emitted from the infrared laser 37 and has an enlarged diameter, and reference numeral 40 is an end face 8b of the repair LED 8B that has been processed with the collimated laser beam. It is a slit for shaping according to the shape of the above, and reference numeral 41 is an imaging lens for forming an image on the end face 8b of the processed repair LED 8B in cooperation with the objective lens 10. Further, reference numeral 42 is a guide illumination light source for adjusting the optical path 36 so that the laser beam emitted from the infrared laser 37 accurately irradiates the end face 8b of the processed repair LED 8B, and reference numeral 43 is a guide illumination light source. It is a half mirror prism for branching the optical path leading to the light source 42 from the optical path 36. Reference numeral 44 is a total reflection mirror for bending the optical path by 90 °.

FIG. 8 is a front view showing a schematic configuration of a first embodiment of a repair device using the bonding device 1 of the present invention.
In the first embodiment, the LED removing device 45 is provided side by side with the bonding device 1. The LED removing device 45 irradiates a defective LED 8 of a display panel 9 on which a plurality of LEDs 8 are mounted with a laser beam to remove the defective LED 8 to form a repair region 20, and forms an observation optical system unit 46 and a laser. It is configured to include an optical system unit 47.

The observation optical system unit 46 acquires an image of the defective LED 8 of the display panel 9 via the objective lens 48, controls the movement of the stage 2 based on the image data of the acquired image, and makes the defective LED 8 the objective lens. It is positioned at the center of the field of view of 48, and has the same optical configuration as the observation optical system 22 of the bonding device 1. Specifically, the observation optical system unit 46 includes an imaging lens that forms an image of the defective LED 8 on the imaging surface of the observation camera in cooperation with the objective lens 48 on the optical path from the objective lens 48 to the observation camera. The optical path from the objective lens 48 to the imaging lens is provided with an illumination light source on the optical path branched by the half mirror. In this case, the imaging lens may be fixedly provided or may be provided so as to be movable along the optical axis. When the imaging lens is provided so as to be movable, the autofocus function can be realized.

The laser optical system unit 47 irradiates the defective LED 8 with laser light via the objective lens 48 to sublimate and remove the defective LED 8, and removes the defective LED 8 by ultraviolet rays (near ultraviolet rays or far ultraviolet rays), infrared rays, or second harmonics. It is equipped with a laser that emits (SHG). In this case, lasers having a single wavelength may be individually provided and used by switching, or the fundamental wave may be wavelength-converted to generate high-order harmonics and laser light having a required wavelength may be output.

Specifically, the laser optical system unit 47 has the same optical configuration as the heating device 7 of the bonding device 1, and the optical path toward the illumination light source reflects another half mirror or visible light to emit ultraviolet rays. A laser is provided on an optical path branched by a transmitted wavelength selectivity mirror. Further, a slit for shaping the laser beam according to the shape of the end surface 8b of the LED 8 is provided on the optical path toward the laser, and the slit is formed in cooperation with the objective lens 48 to form an image on the defective LED 8. An image lens is provided.

Since the focal position of the objective lens 48 differs depending on the wavelength of the laser light to be used, it is desirable to provide a plurality of objective lenses 48 according to the wavelength to be used when switching and using laser light having a plurality of wavelengths. In FIG. 8, the first objective lens 48A for infrared rays and SHG, the second objective lens 48B for near ultraviolet rays, and the third objective lens 48C for far ultraviolet rays are attached to the revolver 49 and used by switching. The LED removing device 45 which can be used is illustrated. In FIG. 8, reference numeral 50 is a blow / suction unit that blows and sucks the sublimated LED 8 to remove it so as to suppress the generation of debris in the repair region 20, and faces the objective lens 48. The opening 51 is provided.

Next, a repair method performed by using the repair device according to the first embodiment configured in this way will be described with reference to the flowcharts of FIGS. 9 and 10.
First, as shown in FIG. 9, in step S1, a lighting inspection of a plurality of LEDs 8 mounted on the display panel 9 is performed, and the quality of the LEDs 8 is determined. In the first embodiment, the lighting inspection of the LED 8 is carried out by a lighting inspection device provided independently of the repair device. Specifically, using the alignment device provided in the lighting inspection device, alignment is performed so that the XY coordinate axes of the display panel 9 mounted on the stage and the XY coordinate axes of the lighting inspection device match, and then the display is displayed. Energize the panel 9 to turn on all of the plurality of LEDs 8, or if the panel 9 is equipped with three colors of red, green, and blue, turn on each color, and take a picture with an image sensor such as CCD or CMOS. A lighting inspection is carried out. The image sensor may be a fixed camera or a line sensor that shoots while moving from one end to the other end of the display panel 9.

Next, in step S2, a quality determination is made based on the captured image of the image sensor. For example, when the lighting brightness of the LED 8 is equal to or higher than a predetermined reference value and the emission wavelength is within the predetermined wavelength band, it is determined to be a good product, and when the lighting brightness is below the above reference value, when it is not lit, or when it emits light. When the wavelength deviation exceeds the permissible range, it is determined to be a defective product. Then, when the defective LED 8 is detected, the position coordinates of the defective LED 8 are obtained from the number of rows and columns with respect to the reference position (for example, the center pixel of the panel) preset in the display panel 9, and the position coordinates are the removable media. Is remembered in. Alternatively, when the lighting inspection device is connected to the repair device and the LAN (Enthernet) in the factory, it is stored in the storage unit of the control unit of each device or the data server connected to the network, and the data of the above position coordinates is stored. May be shared between devices. In the following description, a case where each device can share data via a data server connected to a network will be described.

When the defective LED 8 is not detected (“NO” determination) in step S2, the repair step of the display panel 9 is completed. On the other hand, when the defective LED 8 is detected (“YES” determination), the process proceeds to the repair step using the repair device of the first embodiment, step S3 is executed, and the defective LED 8 is removed from the display panel 9.

Specifically, in step S3, first, the display panel 9 is attracted and held by the mounting surface 2a of the stage 2 of the repair device, and is positioned directly below the LED removing device 45. In the LED removing device 45, alignment is performed by using an alignment device (not shown) so that the XY coordinate axes of the display panel 9 and the XY coordinate axes of the LED removing device 45 match. Further, the position coordinates of the defective LED 8 detected by the lighting inspection device are read from the data server, and the defective LED 8 (when a plurality of defective LEDs 8 are present, one selected defective LED 8) is read from the data server. Is positioned at the irradiation position of the laser beam of the LED removing device 45. Further, while observing the defective LED 8 by the observation optical system unit 46, the elevating mechanism 6 controls the elevating and lowering of the stage 2 to focus on the end face 8b of the defective LED 8, and the stage 2 is slightly moved in the XY direction to irradiate the laser beam. The position of the defective LED 8 with respect to the position is finely adjusted. Then, for example, ultraviolet rays (near ultraviolet rays or far ultraviolet rays) are emitted from the laser of the laser optical system unit 47, and the defective LED 8 is irradiated with the laser light of the ultraviolet rays shaped according to the shape of the end face 8b of the defective LED 8 by the slit. .. As a result, the defective LED 8 is ablated and removed, and the repair region 20 is formed. Alternatively, the defective LED 8 may be irradiated with infrared rays, second harmonic generation (SHG), or the like, or ultraviolet rays may be irradiated with infrared rays or SHG in combination. When the defective LED 8 is removed in this way, the position coordinates of the repair area 20 from which the defective LED 8 is removed are stored in the data server. Further, when the second defective LED 8 is present, the second defective LED 8 is positioned at the irradiation position of the laser beam based on the position coordinates of the second defective LED 8 read from the data server. Then, in the same manner as described above, the second defective LED 8 is removed, and the position coordinates of the repair area 20 are stored in the data server.

Subsequently, in step S4, the non-defective LED 8 is attached to the repair area 20 of the display panel 9 using the bonding device 1, and the bonding process is completed. When the bonding step using the bonding device 1 is completed, the lighting inspection of the display panel 9 may be performed again by the lighting inspection device by returning to step S1 as necessary.

FIG. 10 is a flowchart showing a bonding process performed by using the bonding device 1, and shows a specific process of step S4.
First, the repair area 20 of the display panel 9 in which the stage 2 is moved and the defective LED 8 is removed (in the case where a plurality of repair areas 20 exist, one selected repair area 20) is read from the data server. Based on the position coordinates of the repair region 20, the bonding device 1 is positioned in the field of view of the objective lens 10 of the observation optical system 22, and bonding is started. In this case, the surface of the display panel 9 is observed using the second observation camera 27, and the second imaging lens 26 is shifted in the optical axis direction so that the image in the repair region 20 becomes clear and autofocused. Is carried out.

In step S11 of FIG. 10, the flux 17 is sprayed from the flux coating device 4 toward the repair LED 8A held by the carrier tape 11 (for example, the adhesive tape) and the protective film 16 is peeled off, and the repair LED 8A is soldered. The flux 17 is applied to the treated electrode portion 8a.

Next, in step S12, as shown in FIG. 4, the carrier tape 11 is transferred by a predetermined amount, and the treated repair LED 8B coated with the flux 17 is placed in the field of view of the objective lens 10 directly under the pressing member 21. Positioned inside. In this case, as shown in FIG. 11, the end surface 8b of the processed repair LED 8B is the imaging surface of the first observation camera 25 via the carrier tape 11, the pressing member 21, the objective lens 10, and the first imaging lens 24. Is imaged in. On the other hand, the repair region 20 of the display panel 9 is imaged on the imaging surface of the second observation camera 27 via the carrier tape 11, the pressing member 21, the objective lens 10, and the second imaging lens 26.

In the control unit (not shown) of the bonding device 1, the image data of the end face 8b of the processed repair LED 8B photographed and acquired by the first observation camera 25 and the image data captured and acquired by the second observation camera 27. The image data of the repair area 20 of the display panel 9 is compared with the image data, and the misalignment amount and the misalignment direction of both images are calculated. Then, the stage 2 is finely moved in the X and Y directions so that both images match, and alignment is performed.

Next, in step S13, when the alignment is completed, the stage 2 is raised, and the electrode portion 8a of the processed repair LED 8B is pressed against the electrode pad of the repair region 20 of the display panel 9. At this time, as the stage 2 rises, the second imaging lens 26 is shifted in the direction of the arrow shown in FIG. 12, and the imaging state (best focus state) of the repair region 20 of the display panel 9 in the second observation camera 27 is achieved. ) Is maintained.

Next, in step S14, the infrared laser 37 of the heating device 7 is driven, and the infrared laser beam shaped by the slit 40 according to the shape of the end face 8b of the LED 8 presses the objective lens 10, the pressing member 21, and the carrier tape 11. The end face 8b of the processed repair LED 8B is irradiated through. As a result, the solder material 34 of the electrode portion 8a of the treated repair LED 8B is heated and melted, and the electrode portion 8a of the LED 8 is electrically bonded to the electrode pad of the repair region 20 of the display panel 9. At this time, since the flux 17 is applied to the solder material 34 on the electrode portion 8a of the LED 8, the surface of the solder material 34 and the surface of the repair region 20 are cleaned, and electrical connection failure is eliminated. Ru.

When the repair of the LED 8 to the repair area 20 is completed, the stage 2 is lowered. At this time, since the processed repair LED 8B joined to the repair area 20 of the display panel 9 descends together with the stage 2, the treated repair LED 8B is used for the treated repair due to the difference in strength between the bonding strength of the solder material 34 and the adhesive strength of the adhesive tape. The LED 8B is lifted off from the carrier tape 11.

Subsequently, in step S15, it is determined whether or not further repair processing is necessary. That is, it is determined whether or not there is another repair region 20. Then, when there is no other repair region 20, the step S15 is determined to be "NO", and the bonding step using the bonding device 1 is completed. On the other hand, when a plurality of repair areas 20 are present, step S15 is a “YES” determination. At the same time, the stage 2 is moved in the XY direction based on the position coordinates of the second repair area 20, and the second repair area 20 is positioned at the joining position of the bonding device 1. After that, returning to step S11, the flux 17 is sprayed from the flux coating device 4 toward the second repair LED 8A from which the protective film 16 has been peeled off, and the soldered electrode portion 8a of the second repair LED 8A is obtained. Flux 17 is applied to the solder. After that, the repair process for the second repair area 20 is performed in the same manner as described above. Then, steps S11 to S15 are repeatedly executed until the repair processing for all the repair areas 20 is completed, the repair areas 20 do not exist, and the determination in step S15 is "NO".

FIG. 13 is a front view showing a schematic configuration of a second embodiment of the repair device according to the present invention.
The difference from the first embodiment is that the repair device includes a lighting inspection device 52. The lighting inspection device 52 has the same configuration as the lighting inspection device described in the first embodiment, and energizes the display panel 9 to determine the quality of the plurality of LEDs 8 and the position coordinates of the defective LED 8. Can be obtained. And, it is provided integrally with the LED removing device 45 and the bonding device 1.

According to this second embodiment, first, the stage 2 is moved, and the display panel 9 attracted and held by the stage 2 is positioned in the photographing region of the image sensor 53 of the lighting inspection device 52. At this time, alignment is performed so that the XY coordinate axes of the display panel 9 and the XY coordinate axes of the lighting inspection device 52 match using an alignment device (not shown). After that, a plurality of LEDs 8 of the display panel 9 are turned on, and an image sensor 53 is used to take a picture to inspect whether or not a defective LED 8 such as non-lighting is present. As a result, when the defective LED 8 is present on the display panel 9, the position coordinates of the defective LED 8 are acquired, and the data of the position coordinates of the defective LED 8 is stored in a storage unit (not shown) of the repair device.

Next, the stage 2 moves and the display panel 9 is conveyed to just below the LED removing device 45. In the LED removing device 45, the data of the position coordinates of the defective LED 8 is read out from the storage unit of the repair device, and based on the position coordinates, the defective LED 8 on the display panel 9 (if a plurality of defective LEDs 8 are present, the defective LED 8 is selected. Only one defective LED 8) is positioned at the irradiation position of the laser beam of the LED removing device 45. Further, in the LED removing device 45, the stage 2 is moved up and down while observing the defective LED 8 by the observation camera of the observation optical system unit 46, and the end face 8b of the defective LED 8 is focused. Then, for example, ultraviolet rays are emitted from the laser of the laser optical system unit 47, and the defective LED 8 is irradiated with the laser light of the ultraviolet rays shaped according to the shape of the end face 8b of the defective LED 8 by the slit. As a result, the defective LED 8 is ablated and removed, and the repair region 20 is formed.

When the removal of the defective LED 8 by the LED removing device 45 is completed, the stage 2 moves and the display panel 9 is conveyed to just below the bonding device 1. In the bonding device 1, the stage 2 is moved based on the position coordinates of the defective LED 8 read from the storage unit of the repair device, and is selected in the repair area 20 of the display panel 9 (when a plurality of repair areas 20 exist, it is selected. Only one repair area 20) is positioned within the field of view of the objective lens 10 of the bonding device 1. Further, in the bonding device 1, the carrier tape 11 having the electrode portions 8a holding the end faces 8b on the opposite sides of the soldered plurality of repair LEDs 8A opposite to the electrode portions 8a and arranging them in the major axis direction is in the major axis direction. Will be transferred to. Next, the flak is applied to the electrode portion 8a of the repair LED 8A from which the protective film 16 has been peeled off. Next, the processed repair LED 8B coated with the flux 17 and the repair area 20 from which the defective LED 8 was removed from the display panel 9 were observed by the first and second observation cameras 25 and 27, and both of the acquired images were observed. Stage 2 is finely moved so that both images match based on the image data, and alignment is performed. Subsequently, the stage 2 rises and the processed repair LED 8B is pressed against the repair area 20 of the display panel 9. Then, the solder material 34 of the electrode portion 8a of the treated repair LED 8B is heated and melted by the infrared laser beam emitted from the heating device 7, and the treated repair LED 8B is electrically bonded to the repair region 20 of the display panel 9. To.

According to the present invention, since the flux 17 is applied to the electrode portion 8a of the soldered repair LED 8A, the solder material 34 is heated and melted to join the repair LED 8A to the repair region 20 of the display panel 9. At that time, the surface of the solder material 34 and the debris in the repair region 20 of the display panel 9 are cleaned by the heated flux 17, and the occurrence of electrical connection failure can be eliminated. Further, as compared with the method of applying the flux 17 to the display panel 9, it is not necessary to wash and remove the excess flux 17 on the display panel 9 after connecting the repair LED 8A to the display panel 9, and the repair work can be performed. It will be easier.

In the above embodiment, the case where the electronic component is the micro LED 8 has been described, but the present invention is not limited to this, and the electronic component may be any electronic component such as a mini LED or a semiconductor chip. Therefore, the circuit board is not limited to the display panel 9.

The above embodiments are schematically shown to the extent that the present invention can be understood and implemented, and the present invention is not limited thereto. The present invention can be variously modified and modified as long as it does not deviate from the scope of the technical idea shown in the claims.

1 ... Bonding device 2 ... Stage 3 ... Transfer mechanism 4 ... Flux coating device 5 ... Observation device 6 ... Elevating mechanism 7 ... Heating device 8 ... LED (electronic parts)
8a ... Electrode part 8b ... End face 8A ... LED for repair
8B ... Processed repair LED
9 ... Display panel (circuit board)
10 ... Objective lens 11 ... Carrier tape 17 ... Flux 19 ... Recovery unit 20 ... Repair area 21 ... Pressing member 21a ... Top surface 21b ... Bottom surface 34 ... Solder material 37 ... Infrared laser 38 ... Ionizer 45 ... LED removal device (electric component removal device) )
52 ... Lighting inspection device

Japanese Unexamined Patent Publication No. 2020-102616

Claims (15)

The electronic component of the carrier tape whose electrode portion is transferred in the long axis direction while holding the end face of the plurality of electronic components soldered on the opposite side to the electrode portion is mounted on the circuit board on which the plurality of electronic components are mounted. A bonding device that electrically bonds to a specified area of
A flux applying device for applying flux to the electrode portion of the electronic component is provided on the upstream side in the transfer direction of the carrier tape at the joining position where the electronic component is bonded to the designated region. Bonding device. The bonding apparatus according to claim 1, wherein the electronic component is a micro LED. It is a bonding device that joins non-defective electronic components to the repair area where defective electronic components are removed from the circuit board on which multiple electronic components are mounted.
A stage that holds the back surface opposite to the mounting surface of the circuit board,
A transfer mechanism for transferring carrier tapes having the electrode portions soldered to each other while holding the end faces of the plurality of repair electronic components opposite to the electrode portions and arranging them in the major axis direction in the major axis direction.
A flux coating device that applies flux to the electrodes of the plurality of repair electronic components on the transmission side of the carrier tape.
An observation device for observing and aligning the treated electronic component coated with the flux and the repair area of the circuit board.
An elevating mechanism that raises the stage and presses the processed electronic component for repair to the repair area of the circuit board.
A heating device that heats and melts the solder material of the electrode portion of the treated electronic component for repair and electrically joins the treated electronic component to the repair region of the circuit board.
A bonding device characterized by being configured with. The bonding device according to claim 3, wherein the flux coating device is provided with a flux recovery unit. The bonding device according to claim 3 or 4, wherein an ionizer for removing static electricity of the carrier tape is provided on the upstream side of the flux coating device in the transfer direction of the carrier tape. The processed electronic component for repair is pressed against the repair region via the carrier tape between the mounting surface of the stage and the objective lens provided in the observation device facing the mounting surface. The bonding apparatus according to any one of claims 3 to 5, wherein a pressing member is provided. The pressing member has an upper surface on the objective lens side and a lower surface on which the carrier tape slides, and the upper surface is formed on a curved surface represented by a radius of curvature centered on the focal position of the objective lens. The bonding apparatus according to claim 6, wherein the lower surface is formed on a cylindrical surface having a central axis intersecting the transfer direction of the carrier tape. The bonding device according to any one of claims 3 to 7, wherein the heating device is an infrared laser integrally provided with the observation device. The bonding apparatus according to any one of claims 3 to 8, wherein the electronic component is a micro LED. An electronic component removing device that irradiates a defective electronic component of a circuit board on which a plurality of electronic components are mounted with a laser beam to remove the defective electronic component to form a repair region and stores the position coordinates of the repair region.
A stage that holds the back surface on the opposite side of the mounting surface of the circuit board, and a plurality of repair electronic components whose electrodes are soldered hold the end faces on the opposite side of the electrode and are arranged side by side in the long axis direction. A transfer mechanism that transfers the carrier tape in the long axis direction, a flux coating device that applies flux to the electrodes of the plurality of repair electronic components on the delivery side of the carrier tape, and a processed repair to which the flux is applied. An observation device that observes and aligns the electronic component for repair and the repair area of the circuit board, an elevating mechanism that raises the stage to press the processed electronic component for repair to the repair area of the circuit board, and the processing. A bonding device provided with a heating device for heating and melting the solder material of the electrode portion of the completed repair electronic component and electrically joining the processed repair electronic component to the repair region of the circuit board.
Equipped with
The stage moves between the electronic component removing device and the bonding device, and the repair region is joined to the processed repair electronic component of the bonding device based on the position coordinates of the repair region. A repair device characterized by being configured to be positioned in. The circuit board is energized to determine the quality of a plurality of electronic components, and a lighting inspection device for storing the position coordinates of defective electronic components is further provided.
The stage moves between the lighting inspection device, the electronic component removing device, and the bonding device, and irradiates the defective electronic component with laser light of the electronic component removing device based on the position coordinates of the defective electronic component. The tenth aspect of the present invention is characterized in that the repair area is positioned at a position and the repair area is positioned at a joint position with the processed electronic component for repair of the bonding apparatus based on the position coordinates of the repair area. The repair device described. The repair device according to claim 10 or 11, wherein the electronic component is a micro LED. The first step of holding the back surface of the circuit board on which multiple electronic components are mounted on the opposite side of the mounting surface to the stage,
The second step of transferring the carrier tape having the electrode portions soldered to each other while holding the end faces of the plurality of repair electronic components opposite to the electrode portions and arranging them in the major axis direction in the major axis direction.
The third step of applying flux to the electrodes of the plurality of repair electronic components, and
The fourth step of observing and aligning the treated electronic component coated with the flux and the repair region from which the defective electronic component has been removed from the circuit board.
The fifth step of pressing the processed electronic component for repair into the repair area of the circuit board, and
The sixth step of heating and melting the solder material of the electrode portion of the treated electronic component for repair and electrically joining the treated electronic component for repair to the repair region of the circuit board.
A repair method characterized by performing. Before carrying out the first step, the circuit board is energized to determine the quality of a plurality of electronic components, and the defective electronic components determined to be defective are irradiated with laser light to remove the defective electronic components. 13. The repair method according to claim 13, wherein the step of forming the repair region is carried out. The repair method according to claim 13, wherein the electronic component is a micro LED.

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