WO2014207790A1 - Laser-processed component manufacturing method and laser processing method - Google Patents

Abstract

This laser-processed component manufacturing method is provided with: a protecting step for forming a protection layer on a surface of a component; and a processing step for processing the component by irradiating the protection layer with a laser beam. The protection layer is formed of an oxide glass containing P, and the method is also provided with a removing step wherein the protection layer is melted using a liquid after the processing step.

Description

Manufacturing method of laser processed component and laser processing method

The present invention relates to a method for manufacturing a laser processed component and a laser processing method.

In recent years, the use of laser processing has been advanced due to the increasing demand for higher efficiency of manufacturing processes, higher quality of manufactured parts, and higher accuracy. For example, it is used for drilling holes for interlayer connection of power generation turbine parts and printed wiring boards. However, when processing with a laser, there is a problem that spatter, dross, etc. generated during processing adhere to the surface.

Therefore, in recent years, a method of applying a masking agent to the surface of an object and performing laser drilling has been disclosed for the purpose of suppressing adhesion of the turbine part for power generation to the surface during drilling.

For example, Patent Document 1 discloses a method of removing a masking agent after applying a masking agent composed of a paste of metal powder and silica on a metal surface and performing hole processing with a laser. In this method, the surface is protected with a masking agent to obtain a clean surface of the processed part.

Further, Patent Document 2 discloses a method of performing processing while removing a decomposition product generated during laser processing in the vicinity of an irradiated portion. In this method, a clean surface of a processed part is obtained by sucking before decomposition products such as spatter and dross adhere to the surface.

Japanese Patent No. 4913297 JP 2012-121073 A

In the above-described conventional method, for example, the method of Patent Document 1, the masking agent is a ceramic coating, so that a treatment such as blasting is required for removal.

Further, in the method of Patent Document 2, there is a possibility that the apparatus becomes large or interference with the apparatus becomes a problem. Further, gas may be blown coaxially with the laser during laser hole machining, but in that case, the suction effect may be weakened and a clean processed part surface may not be obtained.

Therefore, an object of the present invention is to obtain a clean processed surface by simple laser processing.

In order to achieve the above object, the present invention provides a laser-machined component comprising a protection step of forming a protective layer on the surface of the component, and a processing step of processing the component by irradiating the protective layer with a laser. The method is characterized in that the protective layer is an oxide glass containing P, and includes a removing step of dissolving the protective layer with a liquid after the processing step.

Further, in the laser processing method comprising a protection step of forming a protective layer on the surface of the component, and a processing step of processing the component by irradiating the protective layer with a laser, the protective layer contains oxide glass containing P And a removal step of dissolving the protective layer with a liquid after the processing step.

According to the present invention, a clean processed part surface can be obtained by simple laser processing.

It is an example of the DTA curve obtained by the differential thermal analysis of oxide glass. Process diagram of drilling of Ni-base alloy with thermal barrier coating Process drawing of printed wiring board hole processing Stainless steel cutting process diagram Stainless steel welding process diagram

In the present invention, when surface processing of a component is performed using a laser, a protective layer of oxide glass containing P is provided on the surface of the component, and laser processing is performed thereon. After the laser processing, the protective layer is removed by liquid cleaning. The liquid is water or an aqueous solution containing water as a main solvent.

Examples of oxides that are soluble in water include P (phosphorus) and include P ₂ O ₅ and P ₂ O ₄ . These oxides are substantially free of Pb (lead) and Bi (bismuth). According to the RoHS directive (effective July 1, 2006), these substances are designated as prohibited substances. The fact that they do not contain substantially means that prohibited substances in the RoHS directive are not contained within the specified range. By adding V, Fe, Li, Na, K, Ba, Ca, B to the oxide containing P, water solubility and glass transition temperature can be adjusted.

In order to improve the water solubility of the oxide, V, alkali metals (Li, K, Na, etc.) and alkaline earth metals (Ba, Ca, etc.) may be added. However, when V is included in the oxide, excessive addition of alkali metal or alkaline earth metal will improve water resistance, so alkali metal is 10 mol% or less, alkaline earth metal is 5 mol%. It may be the following.

On the other hand, when water resistance is improved, it becomes difficult to absorb moisture, so workability is improved. Since Fe and B have an effect of improving water resistance, they are preferably added from the viewpoint of workability. Moreover, the laser absorptivity improves by adding Fe. When processing an object having a low laser absorption rate, it is effective because processing efficiency is improved.

In addition, since oxides containing V are excellent in laser absorptivity, when processing Cu (copper) or Al (aluminum) with low laser absorptance, the laser absorptance is increased by applying to the surface, and processing Efficiency can be improved. In addition, since these oxides are easily dissolved in water, they can be washed away together with the spatter and dross generated during processing after laser processing. Even an oxide that does not contain V can absorb a laser having a wavelength of about 10 μm. Therefore, by appropriately selecting the wavelength of the laser, good processing quality can be obtained.

The effective composition range (as oxide) of the oxide is preferably 40 to 70 mol% for P ₂ O _{5 and} 25 to 50 mol% for Na ₂ O when P is the main component. When B ₂ O ₃ is contained in an amount of 5 to 10 mol%, the glass transition point is lowered, and a protective layer can be easily formed. When not only P but also V contains V as the main component, P ₂ O ₅ is 5 to 50 mol%, V ₂ O ₅ is 50 to 95 mol%, and P ₂ O ₅ + V ₂ O ₅ ≧ 68 mol% Preferably there is. When P ₂ O ₅ + V ₂ O ₅ ≧ 90 mol%, the water solubility is further improved.

In addition, the heat resistance of the oxide can be improved by mixing metal or ceramic particles with the oxide described above. Since the powder particles are removed together with the oxide after processing, either metal or ceramic may be used, but considering the possibility of adhering and remaining, it is preferable to have the same composition as the processing object. For example, when processing a Ni-base superalloy, heat resistance can be imparted to the oxide by mixing metal particles having the same composition with the above oxide. In the case of processing Cu, heat resistance can be imparted to the oxide by mixing Cu particles with the oxide.

The oxide described above can be used as a paste using a solvent and a binder. An oxide glass layer adhered to the sample surface can be formed by applying the paste to the sample surface and drying. It is also possible to form an oxide glass layer on the surface by thermal spraying, cold spraying or the like. Regardless of the method used to form the oxide glass layer, water solubility and laser absorption are not affected.

In this example, oxide glasses having the compositions shown in Table 1 were prepared, and water solubility (cleanability) and glass transition temperature were evaluated. Preparation of the above oxides uses reagents of V ₂ O ₅ , P ₂ O ₅ , Na ₂ O, Fe ₂ O ₃ , Li ₂ O, K ₂ O, BaO, CaO, B ₂ O ₃ for a total of 200 g The mixture was mixed in a predetermined amount so as to be, put into a platinum crucible, heated to 900 to 950 ° C. at a heating rate of 5 to 10 ° C./min in an electric furnace, and melted. In order to make it uniform at this temperature, it was kept for 1 to 2 hours with stirring. Thereafter, the crucible was taken out and poured onto a stainless steel plate heated to about 150 ° C. in advance. The oxide poured on the stainless steel plate was pulverized until the average particle size (D ₅₀ ) was less than 20 μm. This oxide is subjected to differential thermal analysis (DTA) up to 550 ° C at a heating rate of 5 ° C / min, so that the transition point (T _g ), yield point (M _g ), softening point (T _s ), and crystallization temperature ( _Tcry ) was measured. Note that alumina (Al ₂ O ₃ ) powder was used as a standard sample.

FIG. 1 shows a typical DTA curve of an oxide glass. As shown in FIG. 1, T _g is the first endothermic peak start temperature, _Mg is the peak temperature, T _s is the second endothermic peak temperature, and T _cry is the start temperature of the marked exothermic peak due to crystallization. T _g of the oxide glass of the present example was 277 ° C..

The detergency of the oxide glass was evaluated by immersing in water for 2 hours. The evaluation sample is a paste for printing by pulverizing the oxide with a jet mill until the average particle size (D ₅₀ ) is 2 μm or less, and adding and mixing a solvent containing 4% resin binder into the oxide powder. Was made. Here, ethyl cellulose was used as the resin binder, and butyl carbitol acetate was used as the solvent. This paste was applied to a Ni-based alloy with a thermal barrier coating layer formed of ceramic, dried at 150 ° C., held at about 500 ° C. to 700 ° C. for 10 minutes and fired.

If the oxide glass was well melted and removed, “◎”, if it could be melted, “○”, if it did not melt much, “△”, if it could not be melted, “ “×”. Examples of oxide Nos. 1 to 38 were excellent in water solubility and could be easily removed from the test piece.

Using the oxide glass paste prepared in Example 1, drilling of a Ni-based alloy with a ceramic thermal barrier coating was performed. The oxide glass composition was 70 mol% for V ₂ O _{5 and} 30 mol% for P ₂ O ₅ (No. 4 in Examples). The oxide glass paste was applied to the ceramic thermal barrier coating and dried on a hot plate heated to 150 ° C. for 10 minutes. After drying, drilling was performed with a laser. The laser used is a fiber laser. The hole diameters were φ0.8 mm and φ1.4 mm, and the hole angles were 90 ° and 45 °. Ar gas was used as the gas, and the gas pressure was 0.5 MPa. FIG. 2 shows a process diagram of laser drilling. Reference numeral 1 denotes a Ni-based alloy, 2 denotes an underlayer, 3 denotes a thermal barrier coating (ceramic layer), 4 denotes an oxide glass layer, 5 denotes a laser, 6 denotes a processing residue (sputtering), and 7 denotes a hole processing portion.

The spatter that is presumed to be a Ni-based alloy metal component was adhered to the surface after processing. The processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was almost removed. Compared with the case where there was no oxide glass layer, there was no spatter or dross adhesion in appearance, and a hole processed part excellent in surface cleaning was obtained.

V was detected as a result of analyzing the vicinity of the laser machined part using a high frequency inductively coupled plasma optical emission spectrometer. Since the V component is not contained in the ceramic layer and the Ni-based alloy, it is considered to be a residue of oxide glass. Since the ceramic layer is attached to the Ni-based alloy by thermal spraying, there are fine irregularities on the surface, and it is considered that the oxide glass has penetrated into the irregularities. It was also confirmed that the thermal insulation performance did not change even if a slight V component remained on the surface of the ceramic thermal barrier coating.

In this embodiment, a fiber laser is used as the laser, but the present invention is not limited to this as long as the hole can be drilled. The gas type and gas pressure can be changed as appropriate, and the same applies to the following examples.

A test similar to the above was also performed in the comparative example. The oxide glass composition was 40 mol% for V ₂ O ₅ , 40 mol% for TeO ₂ , and 20 mol% for Ag ₂ O (No. 4 in the comparative example). Sputters and dross adhered to the surface after processing. The test piece was immersed in water for 2 hours, but the oxide glass did not dissolve in water, and the sputter, dross, and oxide glass remained attached to the thermal barrier coating.

In Example 2, the oxide glass layer was formed using the oxide glass paste, but in this example, the oxide glass layer was formed by spraying the oxide glass powder onto the thermal barrier coating by cold spraying. . The particle size of the powder used is 10-30 μm. Other experimental conditions are the same as in Example 2.

The spatter that is presumed to be a Ni-based alloy metal component was adhered to the surface after processing. The processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was almost removed. Compared with the case where there was no oxide glass layer, there was no spatter or dross adhesion in appearance, and a hole processed part excellent in surface cleaning was obtained.

V was detected as a result of analyzing the vicinity of the laser machined part using a high frequency inductively coupled plasma optical emission spectrometer. Since the V component is not contained in the ceramic layer and the Ni-based alloy, it is considered to be a residue of oxide glass.

When the cold spray method is used as in this embodiment, the oxide glass layer can be efficiently formed even in a large apparatus such as a power plant, so that the processing time can be shortened.

Ni alloy powder was added to the oxide glass paste produced in Example 1 to drill a Ni-based alloy with a ceramic thermal barrier coating. The particle size of the Ni-based alloy powder was 30-60 μm, and the content in the paste was 30% by volume. Other experimental conditions are the same as in Example 2.

The spatter that is presumed to be a Ni-based alloy metal component was adhered to the surface after processing. The processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was almost removed. Compared with the case where there was no oxide glass layer, there was no spatter or dross adhesion in appearance, and a hole processed part excellent in surface cleaning was obtained.

V was detected as a result of analyzing the vicinity of the laser machined part using a high frequency inductively coupled plasma optical emission spectrometer. Since the V component is not contained in the ceramic layer and the Ni-based alloy, it is considered to be a residue of oxide glass.

Using the oxide glass paste produced in Example 1, as shown in FIG. 3, hole processing was performed on a plate obtained by bonding a copper foil to a glass-containing epoxy resin for a printed wiring board. 8 is a glass epoxy and 9 is a copper foil.

The thickness of the copper foil is 18 μm. The oxide glass composition was 70 mol% for V ₂ O ₅ and 30 mol% for P ₂ O ₅ . The oxide glass paste was applied to a copper-clad plate by screen printing and dried on a hot plate heated to 150 ° C. for 10 minutes. After drying, the laser was drilled. The laser used was a CO ₂ laser. Hole processing was performed by irradiating a CO ₂ laser on the oxide glass layer. The hole diameter was φ0.1 mm and the hole angle was 90 °. Since the oxide glass layer absorbs the CO ₂ laser well, it was possible to drill holes in the copper foil. The processing residue presumed to be Cu adhered to the surface after processing. The processed test piece was immersed in water, and the processing residue was removed together with the oxide glass. In the test piece after water washing, the oxide glass could not be confirmed with the naked eye and was almost removed. As a result of analyzing the vicinity of the laser processing portion using a high-frequency inductively coupled plasma optical emission spectrometer, V was not detected. Since the surface of the copper foil is very smooth, it is considered that the oxide glass was completely removed by washing with water.

Compared with the case without the oxide glass layer, there was no adhesion of spatter and dross on the appearance, and a hole processed part excellent in surface cleaning was obtained.

In this embodiment, the oxide glass is applied by screen printing, but the same effect can be obtained by applying only to the hole processed portion by the dispenser method.

A test similar to the above was also performed in the comparative example. The oxide glass composition was 40 mol% for V ₂ O ₅ , 40 mol% for TeO ₂ , and 20 mol% for Ag ₂ O (No. 4 in the comparative example). Sputters and dross adhered to the surface after processing. Although this test piece was immersed in water for 2 hours, the oxide glass did not dissolve in water, and the sputter, dross, and oxide glass remained attached to the copper foil, and there was no effect.

Using the oxide glass paste prepared in Example 1, 316 stainless steel was cut as shown in FIG. 10 is 316 stainless steel, 11 is a cutting part.

The oxide glass composition was 70 mol% for V ₂ O ₅ and 30 mol% for P ₂ O ₅ . The oxide glass paste was applied to 316 stainless steel and dried for 10 minutes on a hot plate heated to 150 ° C. After drying, 316 stainless steel was cut with a laser. The laser used is a fiber laser. The plate thickness was 6 mm, and Ar gas was used as the cutting gas. The gas was 0.5 MPa. Spatter adhered to the surface after processing. The processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was removed. Compared with the case without the oxide glass layer, there was no spatter or dross adhesion on the appearance, and a cut processed part excellent in surface cleaning was obtained.

As shown in FIG. 5, welding was performed on 316 stainless steel using the oxide glass paste prepared in Example 1. The oxide glass composition was 70 mol% for V ₂ O ₅ and 30 mol% for P ₂ O ₅ . The oxide glass paste was applied to 316 stainless steel and dried for 10 minutes on a hot plate heated to 150 ° C. After drying, 316 stainless steel was butted and laser welding was performed. The laser used is a fiber laser. The plate thickness was 6 mm, and Ar gas was used as the shielding gas. The gas flow rate was 30 L / min. Spatter adhered to the surface after processing. The processed test piece was immersed in water, and the spatter was removed together with the oxide glass. In the test piece after washing with water, the oxide glass could not be confirmed with the naked eye and was removed. Compared to the case without the oxide glass layer, there was no spatter or dross adhesion in appearance, and a welded part excellent in surface cleaning was obtained.

As described above, by forming a protective layer on a ceramic or metal with a glass having excellent cleaning properties as shown in Table 1, even if a residue such as spatter is generated during laser processing, the entire glass can be cleaned. Thereby, laser processing is simpler than the prior art using a masking agent or the like, and a member having a clean surface can be obtained. Laser processing is not limited to the above hole processing, cutting, and welding, and may be processing that does not penetrate the base material.

DESCRIPTION OF SYMBOLS 1 Ni base alloy 2 Underlayer 3 Thermal barrier coating 4 Oxide glass layer 5 Laser 6 Processing residue 7 Hole processing part 8 Glass epoxy 9 Copper foil
10 316 stainless steel 11 Cutting part 12 Welded part

Claims (15)

1. An oxide containing P in the protective layer manufacturing method, comprising: a protective step of forming a protective layer on a surface of the component; and a processing step of processing the component by irradiating the protective layer with a laser. A method for manufacturing a laser-machined component, comprising glass, and a removal step of dissolving the protective layer with a liquid after the processing step.
2. 2. The method of manufacturing a laser-machined component according to claim 1, wherein the oxide glass further contains V.
3. 2. The oxide glass according to claim 1, wherein the oxide glass further contains V, P ₂ O ₅ is 5 to 50 mol% in terms of oxide, V ₂ O ₅ is 50 to 95 mol%, and P ₂ O ₅ + V ₂ O ₅ ≧ A method for producing a laser-machined component, characterized by being 68 mol%.
4. _{2. The} method of manufacturing a laser-machined part according to claim 1, wherein the oxide glass further contains Na, P ₂ O ₅ is 40 to 70 mol% and Na ₂ O is 25 to 50 mol% in terms of oxide. .
5. 2. The method of manufacturing a laser-machined part according to claim 1, wherein the oxide glass further contains any one of Fe, Li, Na, K, Ba, Ca, and B.
6. 2. The method of manufacturing a laser-machined component according to claim 1, wherein in the protection step, the protective layer is formed by spraying the oxide glass powder onto the component.
7. 2. The method of manufacturing a laser-machined component according to claim 1, wherein in the protection step, the protective layer is formed by applying a paste containing the oxide glass to the component and drying the paste.
8. 2. The method of manufacturing a laser-machined component according to claim 1, wherein the liquid is water.
9. In a laser processing method comprising a protective step of forming a protective layer on the surface of a component, and a processing step of processing the component by irradiating the protective layer with a laser, the protective layer is an oxide glass containing P A laser processing method comprising a removal step of dissolving the protective layer with a liquid after the processing step.
10. 10. The laser processing method according to claim 9, wherein the oxide glass further contains V.
11. 10. The oxide glass according to claim 9, further comprising V, P ₂ O ₅ in an oxide conversion of 5 to 50 mol%, V ₂ O ₅ of 50 to 95 mol%, and P ₂ O ₅ + V ₂ O ₅ ≧ The laser processing method characterized by being 68 mol%.
12. 10. The laser processing method according to claim 9, wherein the oxide glass further contains Na, P ₂ O ₅ is 40 to 70 mol% and Na ₂ O is 25 to 50 mol% in terms of oxide.
13. 10. The laser processing method according to claim 9, wherein in the protection step, the protective layer is formed by spraying the oxide glass powder onto the component.
14. 10. The laser processing method according to claim 9, wherein in the protection step, the protective layer is formed by applying a paste containing the oxide glass to the component and drying the paste.
15. 10. The laser processing method according to claim 9, wherein the liquid is water.

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