JP2009072827A - Method of manufacturing member to be formed with solder layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a member to be formed with a solder layer, in which sufficient soldering strength to an oxidized surface can be obtained by a method different from a conventional method. <P>SOLUTION: In the method of manufacturing the member to be formed with the solder layer, hydrogen peroxide solution is fed to a surface of the member having an oxidized surface, and a molten solder is fed to the feeding position of the hydrogen peroxide solution to form a solder layer on the surface. The concentration of hydrogen peroxide of the hydrogen peroxide solution is preferably 0.1-10 mass%. The molten solder is preferably an SnAgAl alloy. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a solder layer forming member in which a solder layer is formed on an oxidized surface made of an oxide such as glass.

  Conventionally, in the field of joining members having an oxidized surface such as glass, as disclosed in Patent Document 1, in order to join a pair of glass substrates, a solder layer is formed on each glass substrate in advance. Has been done. And the method of applying an ultrasonic wave to molten solder is disclosed for concrete solder layer formation.

  When ultrasonic waves are applied when trying to form a solder layer on a glass substrate or the like, bubbles and foreign substances existing on the surface are removed by ultrasonic waves, and the bondability at the bonding interface between the solder and the glass substrate is improved. There is.

Patent Document 2 discloses a technique for joining a wide area of two plate-like bodies with solder. Patent Document 2 forms a coating with molten solder on the entire area to be soldered on one side of each of two plate-like bodies, brings the edges of the coating into contact with each other, and slides the coatings together to bring them together. And a method of soldering the plate-like bodies by cooling and solidifying the solder.
According to this method, the oxide layer covering the surface of the coating is handled by the sliding and coalescing operation between the coatings made of the molten solder material, and the plate-like bodies made of clean solder that does not contain oxides. Since bonding can be realized, there is an advantage that a sound bonding interface can be obtained.

In addition, as a solder alloy for oxide bonding suitable for bonding members having an oxidized surface such as glass and ceramics, the present application includes an oxide bonding solder alloy mainly composed of Sn and added with Ag and Al. It has been proposed (Patent Document 3).
JP 2002-184313 A JP-A-6-114549 WO2007-007840

The method of applying ultrasonic waves to the solder disclosed in Patent Document 1 is effective, but sufficient bonding strength cannot be obtained between the oxidized surface and the formed solder layer simply by applying ultrasonic waves. Therefore, development of a more reliable method is desired.
Moreover, in the joining method disclosed in Patent Document 2, there is a problem that it is difficult to handle the solder when the plate-like bodies are rubbed together in terms of industrial productivity. In addition, there is a problem that the shape of the members to be joined is limited in order to be brought into contact and united, and a great number of man-hours are required for joining.

  The objective of this invention is providing the manufacturing method of the solder layer forming member which can obtain sufficient joining strength with respect to an oxidation surface by the method different from the past.

  The present inventors have found that the bonding strength can be drastically increased by supplying hydrogen peroxide solution to the oxidized surface in advance as a pretreatment for forming the solder layer, and have reached the present invention.

That is, the present invention provides a solder layer formation in which a hydrogen peroxide solution is supplied to the surface of a member having an oxidized surface, and then a molten solder is supplied to the supply position of the hydrogen peroxide solution to form a solder layer on the surface. It is a manufacturing method of a member.
The hydrogen peroxide concentration of the hydrogen peroxide solution is preferably 0.1% by mass to 10% by mass.
Moreover, it is preferable that the molten solder used by this invention is a SnAgAl type alloy.

  According to the present invention, it is possible to form a solder layer having a sufficient bonding strength with respect to an oxidized surface by a new method that has not been conventionally used, and therefore, the handling of molten solder and the reduction in the number of bonding processes in the joining of members having an oxidized surface have been dramatically improved. For example, it becomes an indispensable technique for joining members having an oxidized surface such as glass and ceramics.

  An important requirement of the present invention is that hydrogen peroxide solution is supplied in advance to the oxidized surface as a pretreatment for forming the solder layer. The reason will be described below.

In the solder bonding of the oxidized surface, it is expected that oxygen-mediated chemical bonding contributes to the solder and the oxidized surface as the bonding mechanism with the solder. Therefore, the presence of oxygen at the time of bonding is an important factor for good bonding. If hydrogen peroxide is decomposed by heating to generate oxygen, oxygen can be supplied to the molten solder and the oxidized surface.
In addition, the hydrogen peroxide solution becomes water and oxygen when decomposed by heating. Water evaporates and leaves no residue on the oxidized surface because the solder joints are heated above the boiling point. Oxygen that does not contribute to the solder joint becomes a gas and does not remain on the joint and the oxide surface. Furthermore, ozone generated during decomposition also reacts with organic components which are impurities on the oxide surface, and a cleaning effect can be expected.

The amount of oxygen generated by heating the hydrogen peroxide solution is proportional to the concentration of hydrogen peroxide. Therefore, if the concentration is less than 0.1% by mass, a sufficient oxygen generation amount cannot be obtained, and sufficient connection strength cannot be obtained. More preferably, it is 1.0 mass% or more.
However, since the hydrogen peroxide solution has strong corrosivity, a high concentration corrodes molten solder, a solder supply device, and the like. Therefore, if the concentration exceeds 10% by mass, the corrosive effect of hydrogen peroxide water is unavoidable, and it is preferably 10% by mass or less. More preferably, it is 5.0 mass% or less.

The layer of the hydrogen peroxide solution in the present invention plays a role of assisting the bonding between the oxidized surface and the solder. Therefore, it is desirable to use a solder alloy that can be easily joined to a member having an oxidized surface, such as a SnAgAl alloy, in terms of man-hours.
For example, when supplying a solder layer to the glass surface, if the melting point of the solder is too high, the glass may break due to heat shock. The solder applied to the present invention is preferably selected in accordance with the characteristics of the member having an oxidized surface.

In addition, since the boiling point of the hydrogen peroxide solution is 150 ° C. or lower, if a solder having a high melting point is used, the molten state may not be maintained in the hydrogen peroxide solution. Therefore, in the present invention, as a preferable solder, the melting temperature is at least 300 ° C. or less.
If it is a SnAgAl alloy (Ag: 2.0-15.0 mass%, Al: 0.1-6.0 mass%, remaining Sn and inevitable impurities), the solder melting temperature is 200-300 ° C. It is most suitable for the method for producing a solder layer forming member of the present invention.
Moreover, you may add Y: 0.50 mass% or less and Ge: 0.50 mass% or less to the said SnAgAl alloy as another additive element.

The present invention is a technical development from a viewpoint different from the conventional technique for forming a solder layer on an oxidized surface, and does not deny combining with a conventional method. For example, a method of applying ultrasonic waves or heating a member having an oxidized surface can be combined.
In addition, the present invention is an improvement in the bonding strength between the oxidized surface and the solder based on the principle of oxygen supply from hydrogen peroxide water. The member having the oxidized surface in the present invention includes not only various glasses and ceramics. Application to aluminum, stainless steel, etc. that form an oxide layer on the metal surface can also be expected.

As a member having an oxidized surface, a 50 mm square, 3 mm thick soda glass substrate was prepared which was degreased with ethanol, washed with pure water, and then dried. Moreover, SnAgAl solder alloy (8.5 mass% Ag, 0.35 mass% Al, remainder Sn and unavoidable impurities) which has a wire shape with a diameter of 1 mm was prepared as a solder to be used.
In this example, as an apparatus for producing a solder layer forming member, an ultrasonic soldering apparatus (Sunbonder, model USM-III, manufactured by Kuroda Techno Co., Ltd.) was used, and it was applied under the condition that ultrasonic waves were not applied.

First, a hydrogen peroxide solution having a hydrogen peroxide concentration of 3% by mass was applied to the surface of the soda glass substrate 2 at room temperature with a dropper so that droplets were continuous on the surface of the soda glass substrate 2.
Next, as shown in FIG. 1a, the solder wire 4 is melted at the tip of the heated soldering iron 3, and the tip of the molten solder and the soldering iron 3 contacts the surface of the soda glass substrate 2 as shown in FIG. 1b. As shown in FIG. 1 c, the solder was supplied while moving the solder wire 4 and the tip of the soldering iron 3 to form a solder layer 5.

In order to confirm whether the solder layer was reliably formed on the soda glass substrate, a cellophane tape manufactured by Nichiban Co., Ltd. was applied to the solder surface, and a peeling test was performed.
As a result of carrying out the peeling test of the solder layer forming member, the joint portion was firmly adhered, and the solder layer could not be peeled off. At this time, generation of oxide was suppressed on the solder surface, and metallic luster was observed.
According to the method for producing a solder layer forming member of the present invention, it has been confirmed that sufficient bonding is possible and the suppression of oxide generation on the solder surface is realized.

On the other hand, as a comparative example, soldering was performed on the soda glass substrate surface at room temperature without applying hydrogen peroxide solution, and cellophane tape made by Nichiban Co., Ltd. was applied to the solder surface in the same manner as the present invention example. A peel test was conducted.
As a result of performing the peeling test of the solder layer forming member, the solder layer could be easily peeled off.

  Using SnAgAlYGe solder alloy (8.5 mass% Ag, 0.35 mass% Al, 0.075 mass% Y, 0.03 mass% Ge, the balance Sn and inevitable impurities) having a wire shape of 1 mm in diameter A solder layer was formed on a member having an oxidized surface under the same conditions as in Example 1. As a member having an oxidized surface, a soda glass substrate having the same 30 mm square and 5 mm thickness as in Example 1 was used.

  As a result of the same peeling test as in Example 1, in the example of the present invention, the joint portion was firmly adhered, and the solder layer could not be peeled off. At this time, generation of oxide was suppressed on the solder surface, and metallic luster was observed.

  Furthermore, in order to confirm the degree of joining of the solder layer on the glass substrate, the peeling test was conducted using tweezers. As a result, the solder layer could be peeled off, but the solder remained on the soda glass substrate surface. It was confirmed that it was firmly bonded to the soda glass substrate. Thereby, according to the manufacturing method of the solder layer formation member of the present invention, it was confirmed that sufficient joining was possible even if the solder composition was changed, and that the oxide generation suppression on the solder surface was realized.

It is a figure which shows an example of the manufacturing method of the solder layer forming member of this invention.

Explanation of symbols

  1. 1. Hydrogen peroxide solution, 2. glass substrate; 3. Soldering iron 4. solder wire, Solder layer

Claims (3)

Forming a solder layer on the surface by supplying hydrogen peroxide water to the surface of the member having an oxidized surface and then supplying molten solder to the supply position of the hydrogen peroxide water; Manufacturing method of member. The method for manufacturing a solder layer forming member according to claim 1, wherein the hydrogen peroxide concentration of the hydrogen peroxide solution is 0.1 mass% to 10 mass%. The method for manufacturing a solder layer forming member according to claim 1, wherein the solder is a SnAgAl-based alloy.