TWI465308B - Aluminum alloy welding method - Google Patents
Aluminum alloy welding method Download PDFInfo
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- TWI465308B TWI465308B TW100134094A TW100134094A TWI465308B TW I465308 B TWI465308 B TW I465308B TW 100134094 A TW100134094 A TW 100134094A TW 100134094 A TW100134094 A TW 100134094A TW I465308 B TWI465308 B TW I465308B
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- solder
- aluminum alloy
- soft soldering
- alloy
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- 229910000838 Al alloy Inorganic materials 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 31
- 238000003466 welding Methods 0.000 title description 6
- 229910000679 solder Inorganic materials 0.000 claims description 76
- 239000000956 alloy Substances 0.000 claims description 38
- 229910045601 alloy Inorganic materials 0.000 claims description 37
- 238000005476 soldering Methods 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229910052684 Cerium Inorganic materials 0.000 claims description 8
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052746 lanthanum Inorganic materials 0.000 claims description 8
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 8
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 2
- 150000002602 lanthanoids Chemical group 0.000 claims description 2
- 239000000463 material Substances 0.000 description 17
- 230000004907 flux Effects 0.000 description 10
- 238000009736 wetting Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001257 Nb alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- KODMFZHGYSZSHL-UHFFFAOYSA-N aluminum bismuth Chemical compound [Al].[Bi] KODMFZHGYSZSHL-UHFFFAOYSA-N 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
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Description
本發明係一種鋁合金軟銲接合方法，尤為一種可直接將鋁與其它材料接合，而不需要助銲劑或先在表面鍍覆潤濕層處理之鋁合金軟銲接合方法。 The invention relates to a method for soft soldering of aluminum alloy, in particular to a method for soft soldering of aluminum alloy which can directly join aluminum with other materials without the need of flux or firstly coating the surface with a wetting layer.
鋁及其合金因密度低、比強度高、導熱性佳，同時具有良好的成型性，因此廣泛應用於電子設備、運輸工具、通訊、化工等產業上。基於結構或散熱需求，鋁合金常須與其它材料接合，如具有高散熱效能的鋁-銅複合散熱器在通訊電子產品殼件與其扣件的接合，或是於運輸器具與高壓容器須兼具高強度與輕量化的組合。 Aluminum and its alloys are widely used in electronic equipment, transportation, communications, chemical and other industries due to their low density, high specific strength, good thermal conductivity and good formability. Aluminum alloys must be joined to other materials based on structural or thermal requirements. For example, aluminum-copper composite heat sinks with high heat dissipation must be bonded to the components of the communication electronics and their fasteners, or both transport and high pressure vessels. A combination of high strength and light weight.
然而，鋁合金與鋁合金或對其它材料接合時，會因鋁合金的低熔點、高導熱性而在熔焊過程必須採用能量集中功率較大的熱源，這會造成材料在熱影響區發生變形或材質劣化的問題。由於鋁與氧的親和性高，極易與氧結合形成緻密的氧化層，因此若以熔焊接合，易形成氣孔與銲縫脆化，而若採用硬銲或軟銲接合則會因氧化層的阻礙使得硬銲或軟銲銲料無法與鋁產生潤溼，而無法達成接合。其它固態接合方式，如擴散接合，亦會受到氧化層影響而必須使用大的壓力使氧化層破裂，以促使擴散的進行，又因固態擴散接合必須使用大的應力使接面緊密接觸，而且接合操作時間長，於是對形狀複雜之接合件有操作上的困難。至於摩擦 接合則會因接合區大量的塑性變形，而使得接合件局部區域材質組織的變化，其亦會受到接合母材形狀的限制，且對於電子產品外殼件的薄板接合會影響外觀及其平整性。 However, when aluminum alloy is combined with aluminum alloy or other materials, the heat source with high energy concentration must be used in the welding process due to the low melting point and high thermal conductivity of the aluminum alloy, which may cause the material to deform in the heat affected zone or The problem of material deterioration. Because of the high affinity between aluminum and oxygen, it is easy to combine with oxygen to form a dense oxide layer. Therefore, if it is welded and welded, it will easily form pores and weld embrittlement, and if it is welded or soft welded, it will be due to oxide layer. The impediment prevents the brazed or soldered solder from wetting with the aluminum and does not achieve bonding. Other solid-state bonding methods, such as diffusion bonding, are also affected by the oxide layer and must use large pressures to break the oxide layer to promote diffusion, and solid-state diffusion bonding must use large stresses to make the junctions in close contact, and the bonding The operation time is long, so that it is difficult to operate the joint member having a complicated shape. As for friction The joint causes a change in the material structure of the joint region due to a large amount of plastic deformation of the joint region, which is also limited by the shape of the joint base material, and the sheet joint of the electronic product outer shell member affects the appearance and flatness.
許多鋁合金，特別是非熱處理型鋁合金，在接合過程中受到高溫將會造成材料明顯的劣化。傳統商用之鋁合金硬銲銲料是以鋁-矽系合金為主，然而，此類銲料的液相線高達575℃以上，同時接合操作溫度通常已經超過600℃，這溫度不僅會造成鋁合金材質的劣化，對大多數的鋁合金而言已經超過熔點，可能造成母材熔化。為了去除接合過程中鋁合金表面的氧化膜，必須搭配使用含有氟或氯之有機助銲劑，如所謂的Nocolok法，或如專利申請號WO2005092563的無腐蝕性助銲劑。這類助銲劑的使用除了可能造成接合處的腐蝕外，其所含有的鹵素元素對環境會造成極大的傷害。 Many aluminum alloys, especially non-heat treated aluminum alloys, undergo high temperatures during the joining process, which can cause significant degradation of the material. Traditionally used aluminum alloy brazing solders are mainly aluminum-bismuth alloys. However, the liquidus of such solders is as high as 575 ° C or higher, and the bonding operation temperature has usually exceeded 600 ° C, which not only causes aluminum alloy materials. The deterioration of the aluminum alloy has exceeded the melting point of most aluminum alloys, which may cause the base material to melt. In order to remove the oxide film on the surface of the aluminum alloy during the bonding process, an organic flux containing fluorine or chlorine, such as the so-called Nocolok method, or a non-corrosive flux such as the patent application No. WO2005092563, must be used in combination. In addition to the corrosion of the joints, the use of such fluxes can cause extreme damage to the environment.
在台灣發明專利公開號200524696中，其揭示一種以錫-鋅合金，鋅之重量比例為5~30%、可直接接合鋁合金之銲錫合金，其提供了不用先在鋁合金表面進行鍍鎳的處理過程，即可直接軟銲接合鋁合金，但是在該案技術特徵中並無法克服鋁合金易在大氣中自然形成氧化膜阻礙銲錫的潤濕。是以，有鑑於過去技術的缺失，本發明提供一種不使用助銲劑，並具有高接合強度的鋁合金低溫活性軟銲接合方法。 In Taiwan Patent Publication No. 200524696, it discloses a solder alloy which can directly bond aluminum alloy with a weight ratio of tin-zinc alloy and zinc of 5 to 30%, which provides nickel plating without first coating on the surface of the aluminum alloy. In the process, the aluminum alloy can be directly soft welded, but in the technical features of the case, it is impossible to overcome the natural formation of an oxide film in the atmosphere, which hinders the wetting of the solder. Therefore, in view of the absence of the prior art, the present invention provides a low temperature active soft soldering method for an aluminum alloy which does not use a flux and has high joint strength.
本發明之主要目的，係提供一種鋁合金軟銲接合方法，其不需使用助焊劑，因此不會對環境造成污染，也不會殘留有機銲劑造成腐蝕。 The main object of the present invention is to provide a method for soft soldering of aluminum alloys, which does not require the use of flux, so that it does not pollute the environment and does not cause corrosion of the organic flux.
本發明之次要目的，係提供一種鋁合金軟銲接合方法，其接合溫度低，可避免高溫造成材質劣化或變形。 A secondary object of the present invention is to provide a method for soft soldering of aluminum alloys, which has a low bonding temperature and can avoid deterioration or deformation of the material caused by high temperature.
本發明之另一目的，係提供一種鋁合金軟銲接合方法，其具有高接合強度，確保銲接的可靠度。 Another object of the present invention is to provide a method of soft welding of an aluminum alloy which has high joint strength and ensures the reliability of welding.
本發明之再一目的，係提供一種鋁合金軟銲接合方法，其利用超音波震盪，使錫銲表面及接合母材表面的氧化膜碎裂，提升接合效果。 A further object of the present invention is to provide a method for soft soldering of an aluminum alloy, which utilizes ultrasonic vibration to break the oxide film on the surface of the soldered surface and the surface of the bonded base material to improve the bonding effect.
本發明之又一目的，係提供一種鋁合金軟銲接合方法，其利用超音波處理氧化膜，因此可免除先在接合表面做鍍覆潤濕層處理的步驟，增加方便性。 Still another object of the present invention is to provide a method for soft soldering of an aluminum alloy which utilizes ultrasonic treatment of an oxide film, thereby eliminating the step of first performing a plating wetting layer treatment on the joint surface, thereby increasing convenience.
為了達到上述之目的，本發明係揭示一種鋁合金軟銲接合方法，其接合方法係先清洗鋁合金與另一接合金屬之一接合區域之表面；接著於接合區域置放一片狀銲錫合金銲料後，以一熱源加熱該銲錫合金銲料至該銲錫合金銲料固相線溫度以上；再於該接合區域施以超音波振盪以碎裂接合表面所形成的氧化膜；最後移除該熱源，使該接合區域中該銲錫合金銲料冷卻凝固，完成接合。其中，該銲錫合金銲料，其成分可包含錫、鋅、銅、銀、鎂、鈦及稀土元素。 In order to achieve the above object, the present invention discloses a method for soft soldering aluminum alloy, which is to first clean the surface of a joint region of one of the aluminum alloy and another joint metal; and then place a piece of solder alloy solder in the joint region. Thereafter, heating the solder alloy solder to a temperature above the solder alloy solder solidus temperature by a heat source; applying ultrasonic vibration to the bonding region to break the oxide film formed by the bonding surface; and finally removing the heat source to make the The solder alloy solder is cooled and solidified in the joint region to complete the bonding. The solder alloy solder may contain tin, zinc, copper, silver, magnesium, titanium and rare earth elements.
第一圖：其係為本發明之一較佳實施例之步驟流程圖。 First Figure: It is a flow chart of the steps of a preferred embodiment of the present invention.
為使 貴審查委員對本發明之特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明，說明如後： 於先前技術之該些鋁合金軟銲接合方法，其需使用助銲劑造成汙染或腐蝕，或是無法克服鋁合金易在大氣中自然形成氧化膜阻礙銲錫的潤濕，故本發明針對該些缺失，設計此一鋁合金軟銲接合方法，以達成環保及可靠耐用的目標。 In order to provide a better understanding and understanding of the features and the efficacies of the present invention, the preferred embodiment and the detailed description are as follows: In the prior art, the aluminum alloy soft soldering method needs to use the flux to cause pollution or corrosion, or can not overcome the natural formation of an oxide film in the atmosphere, which hinders the wetting of the solder, so the present invention addresses the defects. Design this aluminum alloy soft welding method to achieve environmental protection and reliability and durability.
首先，請參考第一圖，其係為本發明之一較佳實施例之步驟流程圖；如圖所示，本發明之鋁合金軟銲接合方法，其步驟包含：步驟S10：清洗鋁合金與另一接合金屬之一接合區域之表面；步驟S20：置放一銲錫合金銲料於該接合區域，以一熱源加熱該銲錫合金銲料至該銲錫合金銲料固相線溫度以上；步驟S30：於該接合區域施以超音波振盪；及步驟S40：移除該熱源，使該接合區域中該銲錫合金銲料冷卻凝固。 First, please refer to the first figure, which is a flow chart of the steps of a preferred embodiment of the present invention; as shown in the figure, the aluminum alloy soft soldering method of the present invention comprises the following steps: Step S10: cleaning the aluminum alloy and The other surface of the bonding region of the bonding metal; step S20: placing a solder alloy solder in the bonding region, heating the solder alloy solder to a temperature above the solder alloy solder solidus temperature by a heat source; and step S30: bonding The region is subjected to ultrasonic oscillation; and step S40: removing the heat source to cool and solidify the solder alloy solder in the joint region.
於上述實施例中，另一接合金屬可為鋁合金或非鋁合金之異種材料，於步驟S10中，先將鋁合金及接合金屬之間的接合區域清洗，除去表面汙漬後，方才進行後續的銲接，以避免表面雜質的存在使銲接的品質降低。 In the above embodiment, the other bonding metal may be a dissimilar material of an aluminum alloy or a non-aluminum alloy. In step S10, the bonding area between the aluminum alloy and the bonding metal is first cleaned to remove the surface stain before the subsequent bonding is performed. Welding to avoid the presence of surface impurities reduces the quality of the weld.
接著將銲錫合金銲料製放於接合區域，此銲錫合金銲料為已經過輥軋加工處理，形成厚約100微米的箔片。將此銲錫合金銲料以夾治具固定後，再以加溫爐或熱板加熱。而此銲錫合金銲料的材質包含一金屬基材及一活性元素添加物，其中，金屬基材係包含錫、銀、鋅、銅及上述任意組合之其中之一者。活性元素添加物則可以為鈦、鎂或是稀土元素。透過添加此些微量的高活性元素輔助，可促成良好的冶金鍵結，使本鋁合金軟銲接合方法能提供高強度的接合品質。 Next, a solder alloy solder is placed on the bonding region, and the solder alloy solder has been subjected to a rolling process to form a foil having a thickness of about 100 μm. After soldering the solder alloy solder to the fixture, it is heated by a heating furnace or a hot plate. The material of the solder alloy solder comprises a metal substrate and an active element additive, wherein the metal substrate comprises one of tin, silver, zinc, copper and any combination thereof. The active element additive may be titanium, magnesium or a rare earth element. By adding such a small amount of high-activity element assistance, good metallurgical bonding can be promoted, and the aluminum alloy soft soldering method can provide high-strength bonding quality.
前述所指之稀土元素，是指本發明所採用的鑭、鈰、鐠、釹、鉕、釤、銪、釓、鋱、鏑、鈥、鉺、銩、鐿、鎦等15個鑭系元素，加上3B族的另外兩個元素釔、鈧，一共17個元素；本發明將此17個元素選取其中之一，或是選取兩種以上未經分離純化之混合稀土元素，與金屬基材及活性元素添加物中其他元素調合組成為銲錫合金銲料。 The above-mentioned rare earth elements refer to 15 lanthanides, such as lanthanum, cerium, lanthanum, cerium, lanthanum, cerium, lanthanum, cerium, lanthanum, cerium, lanthanum, cerium, lanthanum, cerium, etc., which are used in the present invention. In addition, the other two elements of the 3B group are 钇, 钪, a total of 17 elements; the present invention selects one of the 17 elements, or selects two or more kinds of mixed rare earth elements which are not separated and purified, and the metal substrate and The other elements in the active element additive are blended into a solder alloy solder.
本發明之銲錫合金銲料之組成請進一步參考表一，表一為實施例銲錫合金銲料成分表；如圖所示，本發明所使用之銲錫合金銲料之組成具有下表一之其中之一組合：
據表一所揭露，銲錫合金銲料成分包含：少於40總重量%之鋅；少於5總重量%之銅；少於5總重量%之銀；少於5總重量%之鎂；少於10總重量%之鈦；少於2總重量%之稀土元素；及上述元素成分確定後，剩餘未滿100總重量%之成分為錫。 According to Table 1, the solder alloy solder composition comprises: less than 40% by weight of zinc; less than 5% by weight of copper; less than 5% by weight of silver; less than 5% by weight of magnesium; 10% by weight of titanium; less than 2% by weight of rare earth elements; and after the above elemental composition is determined, the remaining less than 100% by weight of the component is tin.
表一中之銲錫合金銲料，其固相線溫度約為198℃，經加溫爐或熱板加熱後，接合區域的溫度提升至200℃~400℃，此時銲錫合金銲料係為部分融化，開始進行接合。這時以超音波震盪該處於固相線溫度與液相線溫度間的半熔融狀態銲錫合金銲料，使銲錫合金銲料表面及接合母材表面的氧化膜碎裂，促使銲錫合金銲料與接合母材反應而能於很短的接合時間內獲致優異的接合效果，且不需使用助銲劑即可去除表面之氧化膜，避免可能產生的腐蝕或是鹵素汙染，同時也藉此免去於接合表面先做鍍覆潤濕層處理的步驟。經超音波震盪後，再移除熱源，使接合區域中的銲錫合金銲料冷卻凝固，完成接合。 The solder alloy solder in Table 1 has a solidus temperature of about 198 ° C. After heating by a heating furnace or a hot plate, the temperature of the joint region is raised to 200 ° C to 400 ° C. At this time, the solder alloy solder is partially melted. Start bonding. At this time, the semi-molten solder alloy solder between the solidus temperature and the liquidus temperature is oscillated by ultrasonic waves, and the solder alloy solder surface and the oxide film on the surface of the bonding base material are broken, thereby causing the solder alloy solder to react with the bonding base material. It can achieve excellent bonding effect in a short bonding time, and can remove the oxide film on the surface without using flux, avoiding possible corrosion or halogen pollution, and avoiding the bonding surface first. The step of plating the wetting layer treatment. After the ultrasonic wave is oscillated, the heat source is removed, and the solder alloy solder in the joint region is cooled and solidified to complete the bonding.
由於本發明所使用之銲錫合金銲料其固相線溫度約為198℃，經加溫爐或熱板加熱後，接合區域的溫度提升至200℃~400℃，與先前技術相較，傳統鋁-矽合金之操作溫度通常超過600℃，本發明的操作溫度可避免鋁合金劣化或是接合母材熔化。 Since the solder alloy solder used in the present invention has a solidus temperature of about 198 ° C, the temperature of the joint region is raised to 200 ° C to 400 ° C after heating by a heating furnace or a hot plate, compared with the prior art, the conventional aluminum - The operating temperature of the niobium alloy generally exceeds 600 ° C, and the operating temperature of the present invention can prevent deterioration of the aluminum alloy or melting of the bonding base material.
透過此鋁合金軟銲接合方法，軟銲接合的溫度係處於約200℃~400℃的相對低溫，加上超音波震盪的輔助，在維持接合強度及材質品質的條件下排除了助銲劑的使用或是於接合表面先做鍍覆潤濕層處理，達到環保及耐用的目的。 Through the soft soldering method of the aluminum alloy, the temperature of the soft soldering is at a relatively low temperature of about 200 ° C to 400 ° C. With the aid of ultrasonic vibration, the use of flux is eliminated under the condition of maintaining joint strength and material quality. Or the plating surface is first coated with a wetting layer to achieve environmental protection and durability.
惟以上所述者，僅為本發明之較佳實施例而已，並非用來限定本發明實施之範圍，舉凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包含於本發明之申請專利範圍內。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.
本發明係實為一具有新穎性、進步性及可供產業利用者，應符合我國專利法所規定之專利申請要件無疑，爰依法提出發明專利申請，祈 鈞局早日賜准專利，至感為禱。 The invention is a novelty, progressive and available for industrial use, and should meet the requirements of the patent application stipulated in the Patent Law of China, and the invention patent application is filed according to law, and the prayer bureau will grant the patent as soon as possible. prayer.
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